JP2006219687A5 - - Google Patents
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- JP2006219687A5 JP2006219687A5 JP2005031229A JP2005031229A JP2006219687A5 JP 2006219687 A5 JP2006219687 A5 JP 2006219687A5 JP 2005031229 A JP2005031229 A JP 2005031229A JP 2005031229 A JP2005031229 A JP 2005031229A JP 2006219687 A5 JP2006219687 A5 JP 2006219687A5
- Authority
- JP
- Japan
- Prior art keywords
- target
- sputtering
- forming apparatus
- film forming
- drive source
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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- 238000004544 sputter deposition Methods 0.000 claims description 19
- 230000000875 corresponding Effects 0.000 claims description 3
- 241000405965 Scomberomorus brasiliensis Species 0.000 claims description 2
- 239000002245 particle Substances 0.000 claims description 2
- 238000001816 cooling Methods 0.000 claims 6
- 239000000463 material Substances 0.000 claims 2
- 102000010637 Aquaporins Human genes 0.000 claims 1
- 108010063290 Aquaporins Proteins 0.000 claims 1
- 230000015572 biosynthetic process Effects 0.000 claims 1
- 239000002826 coolant Substances 0.000 claims 1
- 239000000498 cooling water Substances 0.000 claims 1
- 238000000151 deposition Methods 0.000 claims 1
- 238000005755 formation reaction Methods 0.000 claims 1
- 238000010438 heat treatment Methods 0.000 claims 1
- 238000000926 separation method Methods 0.000 claims 1
- 238000007789 sealing Methods 0.000 description 2
Description
上記目的を達成するため、本発明の成膜装置は、ターゲットからスパッタリングされた粒子をワークに成膜する成膜装置において、内部に前記ターゲットが配置され、前記ワークに向かって開口する開口部を備えた真空室と、前記真空室内において、前記ターゲットを逐次前記開口部に対応するスパッタ位置に移動させるターゲット移動手段と、前記スパッタ位置における前記ターゲットの裏面に対向するように配設されたスパッタ駆動源と、前記スパッタ駆動源を前記スパッタ位置において前記ターゲットの裏面側に押圧するスパッタ駆動源移動手段と、前記ターゲット移動手段によって前記スパッタ位置に移動させられ、前記スパッタ位置において前記開口部を閉じるように構成された蓋と、を有することを特徴とする。 In order to achieve the above object, a film forming apparatus according to the present invention is a film forming apparatus that forms particles sputtered from a target on a workpiece, and the opening is disposed toward the workpiece with the target disposed therein. a vacuum chamber having, in the vacuum chamber, a target moving means for moving the sputtering position corresponding to the successive said opening said target, sputtering driving said disposed so as to face the back surface of the target in the sputtering position source and said a sputter drive source moving means for the sputter driving source have you to the sputtering position to press on the back side of the target, which Serra moved to the sputtering position by prior Symbol target moving means, before at the sputtering position SL And a lid configured to close the opening.
図1に示すように、真空室1の開口部にワーク室2内のワークWを搬送する搬送手段と、それぞれターゲットTを保持した1つまたは複数のターゲット支持板3と、真空室1の開口部を密封するためのシール手段4を有する圧力分離用の蓋5と、ターゲット支持板3および蓋5を周方向に等間隔でそれぞれ揺動自在に支持するターゲット移動手段である回転テーブル6と、回転テーブル6の回転軸6aを回転駆動する図示しないモータと、ベローズ7を介して大気側に配設されたスパッタ駆動源移動手段である直動アクチュエータによって矢印Rで示す方向に往復駆動されるスパッタ駆動源8を有し、スパッタ駆動源8は、ターゲット支持板3または蓋5の裏面側から前記揺動方向に押圧し、真空室1の前記開口部に当接する。 As shown in FIG. 1, transport means for transporting the workpiece W in the work chamber 2 to the opening of the vacuum chamber 1, one or more target support plates 3 each holding a target T, and the opening of the vacuum chamber 1. A pressure-separating lid 5 having a sealing means 4 for sealing the part , a rotary table 6 which is a target moving means for supporting the target support plate 3 and the lid 5 oscillatingly at equal intervals in the circumferential direction, a motor, not shown FIG rotates the rotation shaft 6a of the rotary table 6, and is reciprocally driven in the direction indicated by the arrow R by the linear actuator is a sputter drive source moving means disposed on the atmosphere side via the bellows 7 The sputter drive source 8 has a sputter drive source 8 that presses in the swing direction from the back side of the target support plate 3 or the lid 5 and abuts against the opening of the vacuum chamber 1.
Claims (8)
r[m] :圧力差が作用する円の半径
v[non]:冷却板材料のポアソン比
E[Pa]:冷却板材料のヤング率
δ[m]:加熱側平面の変形量 7. The film forming apparatus according to claim 6, wherein a thickness t (m) of the cooling plate is set so as to satisfy a relationship represented by the following formula.
r [m]: Radius of the circle on which the pressure difference acts
v [non]: Poisson's ratio of the cooling plate material
E [Pa]: Young's modulus of the cooling plate material
δ [m]: Deformation amount of heating side plane
真空室の開口部に対応するスパッタ位置にターゲットを逐次移動させてスパッタ駆動源を押圧し、スパッタリングを行う工程と、
スパッタ位置に圧力分離用の蓋を移動させて真空室の開口部を閉じた状態でワークの交換を行う工程と、を有することを特徴とする成膜方法。 A deposition method of performing sputtering film formation on the workpiece by the claims 1 to 7 deposition apparatus according to any one,
A step of sequentially moving the target to a sputtering position corresponding to the opening of the vacuum chamber and pressing the sputtering drive source to perform sputtering;
And a step of exchanging the work in a state where the opening of the vacuum chamber is closed by moving the pressure separation lid to the sputtering position.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2005031229A JP4667057B2 (en) | 2005-02-08 | 2005-02-08 | Film forming apparatus and film forming method |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2005031229A JP4667057B2 (en) | 2005-02-08 | 2005-02-08 | Film forming apparatus and film forming method |
Publications (3)
Publication Number | Publication Date |
---|---|
JP2006219687A JP2006219687A (en) | 2006-08-24 |
JP2006219687A5 true JP2006219687A5 (en) | 2008-03-27 |
JP4667057B2 JP4667057B2 (en) | 2011-04-06 |
Family
ID=36982201
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2005031229A Expired - Fee Related JP4667057B2 (en) | 2005-02-08 | 2005-02-08 | Film forming apparatus and film forming method |
Country Status (1)
Country | Link |
---|---|
JP (1) | JP4667057B2 (en) |
Families Citing this family (10)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR100909333B1 (en) | 2007-11-21 | 2009-07-24 | 김재홍 | Sputtering device |
WO2010016484A1 (en) * | 2008-08-05 | 2010-02-11 | 株式会社アルバック | Vacuum treatment apparatus and vacuum treatment method |
EP2267179B1 (en) * | 2009-06-25 | 2012-12-26 | Solmates B.V. | Target cooling device |
JP5452178B2 (en) * | 2009-11-12 | 2014-03-26 | 株式会社日立ハイテクノロジーズ | Vacuum deposition apparatus, vacuum deposition method, and organic EL display device manufacturing method |
JP5443181B2 (en) * | 2010-01-16 | 2014-03-19 | 独立行政法人国立高等専門学校機構 | Multi target sputtering system |
CN201648509U (en) * | 2010-04-21 | 2010-11-24 | 北京京东方光电科技有限公司 | Magnetron sputtering equipment |
JP6155796B2 (en) * | 2013-04-23 | 2017-07-05 | 株式会社島津製作所 | Arc plasma deposition system |
KR101419429B1 (en) * | 2013-12-26 | 2014-07-14 | 주식회사 프로트 | SPUTTER DEPOSITION USE MOVING DEVICEdevice |
CN110218976A (en) * | 2019-07-17 | 2019-09-10 | 南通职业大学 | A kind of components automatic film coating device |
KR20220044122A (en) * | 2020-09-30 | 2022-04-06 | 시바우라 메카트로닉스 가부시끼가이샤 | Film formation apparatus |
Family Cites Families (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS6415368A (en) * | 1987-07-07 | 1989-01-19 | Tokki Kk | Sputtering device |
JP4036928B2 (en) * | 1996-09-18 | 2008-01-23 | 松下電器産業株式会社 | Deposition system and target replacement method |
-
2005
- 2005-02-08 JP JP2005031229A patent/JP4667057B2/en not_active Expired - Fee Related
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