JP2006219687A5 - - Google Patents

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JP2006219687A5
JP2006219687A5 JP2005031229A JP2005031229A JP2006219687A5 JP 2006219687 A5 JP2006219687 A5 JP 2006219687A5 JP 2005031229 A JP2005031229 A JP 2005031229A JP 2005031229 A JP2005031229 A JP 2005031229A JP 2006219687 A5 JP2006219687 A5 JP 2006219687A5
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target
sputtering
forming apparatus
film forming
drive source
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JP4667057B2 (en
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上記目的を達成するため、本発明の成膜装置は、ターゲットからスパッタリングされた粒子をワークに成膜する成膜装置において、内部に前記ターゲットが配置され、前記ワークに向かって開口する開口部を備えた真空室と、前記真空室内において、前記ターゲットを逐次前記開口部に対応するスパッタ位置に移動させるターゲット移動手段と、前記スパッタ位置における前記ターゲットの裏面に対向するように配設されたスパッタ駆動源と、前記スパッタ駆動源を前記スパッタ位置において前記ターゲットの裏面側に押圧するスパッタ駆動源移動手段と、記ターゲット移動手段によって前記スパッタ位置に移動せられ、前記スパッタ位置において記開口部を閉じるように構成され蓋と、を有することを特徴とする。 In order to achieve the above object, a film forming apparatus according to the present invention is a film forming apparatus that forms particles sputtered from a target on a workpiece, and the opening is disposed toward the workpiece with the target disposed therein. a vacuum chamber having, in the vacuum chamber, a target moving means for moving the sputtering position corresponding to the successive said opening said target, sputtering driving said disposed so as to face the back surface of the target in the sputtering position source and said a sputter drive source moving means for the sputter driving source have you to the sputtering position to press on the back side of the target, which Serra moved to the sputtering position by prior Symbol target moving means, before at the sputtering position SL And a lid configured to close the opening.

図1に示すように、真空室1の開口部にワーク室2内のワークWを搬送する搬送手段と、それぞれターゲットTを保持した1つまたは複数のターゲット支持板3と、真空室1の開口部を密封するためのシール手段4を有する圧力分離用の蓋5と、ターゲット支持板3および蓋5を周方向に等間隔でそれぞれ揺動自在に支持するターゲット移動手段である回転テーブル6と、回転テーブル6の回転軸6aを回転駆動する示しないモータと、ベローズ7を介して大気側に配設されたスパッタ駆動源移動手段である直動アクチュエータによって矢印Rで示す方向に往復駆動されるスパッタ駆動源8を有し、スパッタ駆動源8は、ターゲット支持板3または蓋5の裏面側から前記揺動方向に押圧し、真空室1の前記開口部に当接する。 As shown in FIG. 1, transport means for transporting the workpiece W in the work chamber 2 to the opening of the vacuum chamber 1, one or more target support plates 3 each holding a target T, and the opening of the vacuum chamber 1. A pressure-separating lid 5 having a sealing means 4 for sealing the part , a rotary table 6 which is a target moving means for supporting the target support plate 3 and the lid 5 oscillatingly at equal intervals in the circumferential direction, a motor, not shown FIG rotates the rotation shaft 6a of the rotary table 6, and is reciprocally driven in the direction indicated by the arrow R by the linear actuator is a sputter drive source moving means disposed on the atmosphere side via the bellows 7 The sputter drive source 8 has a sputter drive source 8 that presses in the swing direction from the back side of the target support plate 3 or the lid 5 and abuts against the opening of the vacuum chamber 1.

Claims (8)

ターゲットからスパッタリングされた粒子をワークに成膜する成膜装置において、内部に前記ターゲットが配置され、前記ワークに向かって開口する開口部を備えた真空室と、前記真空室内において、前記ターゲットを逐次前記開口部に対応するスパッタ位置に移動させるターゲット移動手段と、前記スパッタ位置における前記ターゲットの裏面に対向するように配設されたスパッタ駆動源と、前記スパッタ駆動源を前記スパッタ位置において前記ターゲットの裏面側に押圧するスパッタ駆動源移動手段と、記ターゲット移動手段によって前記スパッタ位置に移動せられ、前記スパッタ位置において記開口部を閉じるように構成され蓋と、を有することを特徴とする成膜装置。 A film forming apparatus for forming the sputtered particles from the target to the workpiece, the target is placed inside a vacuum chamber having an opening which opens toward the workpiece, in the vacuum chamber, the target sequential a target moving means for moving the sputtering position corresponding to the opening portion, and the sputtering drive source which is disposed so as to face the back surface of the target in the sputtering position, said have you said sputter driving source to the sputtering position and the sputtering drive source moving means for pressing on the back side of the target, which Serra moved to the sputtering position by prior Symbol target moving means, having a lid configured to close the front SL openings at the sputtering position A film forming apparatus characterized by the above. 前記スパッタ駆動源の移動により、前記蓋は前記開口部に対して押圧させられて前記開口部を閉じることを特徴とする請求項1記載の成膜装置。The film forming apparatus according to claim 1, wherein the lid is pressed against the opening by the movement of the sputtering drive source to close the opening. 前記ターゲット移動手段が、複数のターゲットと記蓋とを同一平面内において円周方向に所定の間隔で支持していることを特徴とする請求項1記載の成膜装置。 The target moving means, a plurality of targets before Symbol lid and a film forming apparatus according to claim 1, wherein the supporting at predetermined intervals in the circumferential direction in the same plane. 前記複数のターゲットと蓋は、板ばねを介して前記ターゲット移動手段に支持されていることを特徴とする請求項3記載の成膜装置 4. The film forming apparatus according to claim 3, wherein the plurality of targets and the lid are supported by the target moving means via a leaf spring . 前記スパッタ駆動源が、冷却水を流動させるための冷却水流路を備え、前記ターゲットの裏面側に均一に当接するためのティルト機構を備えていることを特徴とする請求項1ないしいずれか1項記載の成膜装置。 The sputter drive source, a cooling water channel for flowing a coolant, any one of claims 1 to 4, characterized in that it comprises a tilt mechanism for uniformly abut the back side of the target 1 The film-forming apparatus of description. 前記スパッタ駆動源が、真空室と大気の圧力差によって変形自在である冷却板を有し、前記冷却板を介してターゲットの裏面側に押圧されるように構成されていることを特徴とする請求項4または5記載の成膜装置。   The sputter drive source has a cooling plate that can be deformed by a pressure difference between a vacuum chamber and the atmosphere, and is configured to be pressed against the back side of the target through the cooling plate. Item 6. The film forming apparatus according to Item 4 or 5. 前記冷却板の厚みt(m)が以下の式で表わされる関係を満たすように設定されていることを特徴とする請求項6記載の成膜装置。
Figure 2006219687
ここで、p[Pa]:冷却板に作用する圧力差
r[m] :圧力差が作用する円の半径
v[non]:冷却板材料のポアソン比
E[Pa]:冷却板材料のヤング率
δ[m]:加熱側平面の変形量
7. The film forming apparatus according to claim 6, wherein a thickness t (m) of the cooling plate is set so as to satisfy a relationship represented by the following formula.
Figure 2006219687
Where p [Pa]: pressure difference acting on the cooling plate
r [m]: Radius of the circle on which the pressure difference acts
v [non]: Poisson's ratio of the cooling plate material
E [Pa]: Young's modulus of the cooling plate material
δ [m]: Deformation amount of heating side plane
請求項1ないしいずれか1項記載の成膜装置によってワークにスパッタリング成膜を行う成膜方法であって、
真空室の開口部に対応するスパッタ位置にターゲットを逐次移動させてスパッタ駆動源を押圧し、スパッタリングを行う工程と、
スパッタ位置に圧力分離用の蓋を移動させて真空室の開口部を閉じた状態でワークの交換を行う工程と、を有することを特徴とする成膜方法。
A deposition method of performing sputtering film formation on the workpiece by the claims 1 to 7 deposition apparatus according to any one,
A step of sequentially moving the target to a sputtering position corresponding to the opening of the vacuum chamber and pressing the sputtering drive source to perform sputtering;
And a step of exchanging the work in a state where the opening of the vacuum chamber is closed by moving the pressure separation lid to the sputtering position.
JP2005031229A 2005-02-08 2005-02-08 Film forming apparatus and film forming method Expired - Fee Related JP4667057B2 (en)

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JP2006219687A5 true JP2006219687A5 (en) 2008-03-27
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Publication number Priority date Publication date Assignee Title
KR100909333B1 (en) 2007-11-21 2009-07-24 김재홍 Sputtering device
WO2010016484A1 (en) * 2008-08-05 2010-02-11 株式会社アルバック Vacuum treatment apparatus and vacuum treatment method
EP2267179B1 (en) * 2009-06-25 2012-12-26 Solmates B.V. Target cooling device
JP5452178B2 (en) * 2009-11-12 2014-03-26 株式会社日立ハイテクノロジーズ Vacuum deposition apparatus, vacuum deposition method, and organic EL display device manufacturing method
JP5443181B2 (en) * 2010-01-16 2014-03-19 独立行政法人国立高等専門学校機構 Multi target sputtering system
CN201648509U (en) * 2010-04-21 2010-11-24 北京京东方光电科技有限公司 Magnetron sputtering equipment
JP6155796B2 (en) * 2013-04-23 2017-07-05 株式会社島津製作所 Arc plasma deposition system
KR101419429B1 (en) * 2013-12-26 2014-07-14 주식회사 프로트 SPUTTER DEPOSITION USE MOVING DEVICEdevice
CN110218976A (en) * 2019-07-17 2019-09-10 南通职业大学 A kind of components automatic film coating device
KR20220044122A (en) * 2020-09-30 2022-04-06 시바우라 메카트로닉스 가부시끼가이샤 Film formation apparatus

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JPS6415368A (en) * 1987-07-07 1989-01-19 Tokki Kk Sputtering device
JP4036928B2 (en) * 1996-09-18 2008-01-23 松下電器産業株式会社 Deposition system and target replacement method

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