JP2006216582A - Structure of heat sink - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a heat sink which can enhance the heat dissipation effects. <P>SOLUTION: The heat sink comprises a base board 41 provided with several heat dissipating fins 411 and at least one thermally conductive member 42. The thermally conductive member 42 is bonded to the base board 41 and the several heat dissipating fins 411 and arranged partially thereon. The base board 41 and the several heat dissipating fins 411 are made of metallic materials that are different from that of the thermally conductive member 42. With such a structure, thermal conductivity and heat dissipation effects can be enhanced. <P>COPYRIGHT: (C)2006,JPO&NCIPI

Description

  The present invention relates to a structure of a radiator, and particularly relates to a structure of a radiator made of different metals.

With the development of science and technology, the volume of electronic elements (for example, CPUs) is miniaturized, the density on the unit area is also increasing, and the function is further improved. Along with this, the heat generation of electronic devices has also increased, and if the heat generated by the electronic devices is not removed by a good heat dissipation method, the high temperature of the electronic devices causes thermal runaway, thermal stress, etc. As a result, the overall stability is lowered, and the life of the electronic device is reduced. Therefore, how to remove these high temperatures generated by the electronic device using an external cooling device and system is a problem that cannot be ignored.

There are four common cooling methods: 1 forced air cooling, 2 natural cooling, 3 phase change cooling, 4 direct or indirect cooling using liquid, and currently the most frequently used Air cooling is to achieve a cooling effect by installing a radiator, and to enhance the heat dissipation effect by the radiation fins of the radiator. The mechanism is to increase the heat dissipation area of the electronic element by using heat dissipation fins, and since the heat sink using air-cooling heat dissipation fins uses air as the working medium, it is easy to handle and stable. The electronic device is not damaged. Furthermore, the material of the radiator is mainly aluminum or copper, so it is low cost, has high thermal conductivity, and is easy to process. For example, it can be designed in various shapes and designs, solving the heat dissipation problem of electronic devices. It is even more advantageous.

The heat sink that is commonly seen is a press-molded aluminum, but since aluminum heats quickly, it is inferior in thermal conductivity, so the heat generated by an electronic element can be conducted quickly with an aluminum radiator. The heat dissipation effect is limited. Another type of copper material heatsink can improve the heat conductivity problem of aluminum heatsink, but the heat dissipation effect of copper material is not as good as aluminum material, and the manufacturing cost is high, so the overall cost and selling price is It becomes higher than the heatsink made of aluminum.

Therefore, a heatsink that uses the property of heat dissipation of aluminum material and the property of heat conduction of copper material was manufactured. 1 has an aluminum material portion 11 and a copper material portion 12, and the aluminum material portion 11 is joined to the copper material portion 12. Several copper fins 13 are provided, and the copper material portion 12 is bonded to an electronic element 14 that generates heat, and the heat of the electronic element 14 is quickly conducted to dissipate heat from the aluminum material portion 11. Heat is radiated through the fins 13.

Alternatively, the radiator having the known structure in FIG. 2 has an aluminum material portion 21 and a copper material portion 22, and a concave groove is provided in the middle of the aluminum material portion 21. The copper material portion 22 having the same shape and volume of the concave groove 211 is inserted, the aluminum material portion 21 is provided with heat radiation fins 23, and the copper material portion 22 is bonded to the electronic element 24. Therefore, the heat of the electronic element 24 is quickly conducted, and the heat is radiated through the aluminum material portion 21 and the radiation fins 23.

3 and 4, the radiator having the known structure has an aluminum material portion 31, which has a hollow cylindrical shape, and a through hole 311 is formed therein. A plurality of heat radiation fins 33 extending to the outside are provided on the outer periphery, and a copper material portion 32 is closely fitted in the through hole 311. The bottom end surface of the copper material portion 32 is an electronic element. 34, the heat of the electronic element 34 is quickly conducted, and the heat is radiated through the aluminum material portion 31 and the radiation fins 33.

However, the above-mentioned three types of known heat radiators have a common problem in implementation. The copper material portions 12, 22, and 32 are concentrated only at predetermined positions. When the copper material portions 12, 22, and 32 conduct the heat of the electronic elements 14, 24, and 34, the heat is transferred to the copper material portions 12, 22, 32 and the aluminum material portions 11, 21, 31 adjacent to the copper material portions 12, 22, 32 are concentrated only on one part, and heat cannot be effectively conducted to the radiation fins 13, 23, 33. In other words, heat cannot be spread on the entire radiator on average, and the heat dissipation effect is not excellent. Furthermore, since the aluminum material parts 11, 21, 31 and the copper material parts 12, 22, 32 are different in weight, the aluminum material parts 11, 21, 31 and the copper material parts 12, 22, Both of them are separated, resulting in a problem that the service life is shortened.

The main object of the present invention is that at least one heat conducting member is installed on the base plate and some of the heat dissipating fins, and the heat conducting member is partially installed. The constituent material of the heat conducting member is different from the constituent material of the base plate and the heat dissipating fin, preferably made of a metal material, the metal material constituting the heat conducting member, the base plate and the heat dissipating fin The metal material which comprises is different, and is providing the heat radiator which can improve the heat dissipation effect.

Another object of the present invention is that the heat conducting member is installed inside the base plate and the heat dissipating fins at intervals in the form of a rod or plate, or a mesh that intersects, increasing the heat dissipating area and conducting heat. The heat conducting member is averaged and can provide a quick heat dissipation, and the heat conducting member is granular, honeycomb, dot matrix, radial, spiral, concentric, spider web or irregular It can be a geometric distribution.

In order to solve the above problems, a structure of a radiator according to the present invention includes a base plate, and the base plate is provided with several radiating fins, and the base plate and the radiating fins include at least one heat. A conductive member is installed, the heat conductive member is partially installed on the base plate and the heat radiating fin, the base plate and the heat radiating fin are made of a first metal material, and the heat conductive member is a second material. The first metal material of the base plate and the radiating fin is different from the second metal material of the heat conducting member, and the thermal conductivity of the second metal material is the first metal material. Higher than.

Preferably, the heat conducting member is installed inside and / or on the surface of the base plate and the radiation fin, and is partially installed, and is fitted or embedded in the base plate and the radiation fin and / or the surface. The heat conducting member is installed on the entire base plate and the heat radiating fin, and in a preferred embodiment, the partial installation is an installation form arranged at intervals, and has the intervals. The array is a parallel, non-parallel or interlaced array.

According to the present invention, most of the heat generated by the electronic device is quickly conducted by the heat conducting member, and part of the heat is conducted to the base plate and the heat radiating fin, and the heat conducted to the heat conducting member is transferred to the base plate and the heat radiating fin. Conducted and conducted to the entire radiator on average, quickly dissipated heat by the base plate and radiator fin of the radiator, and forced convection generated by an external fan, etc. Heat exchange with the conductive member is performed, and since the heat conductive member is installed inside and / or on the surface of the base plate and the heat radiating fin, the heat conduction of the base plate and the heat radiating fin can be increased, and the heat radiating area, That is, it is possible to increase the contact area with air, thereby greatly increasing the heat dissipation rate, and the heat in the known structure is concentrated on the copper material portion, and the heat is reduced. I was able to solve the disadvantage of not conducted to the heat radiating fins of aluminum material.

The object of the present invention and its structural and functional characteristics will be described in detail with reference to the drawings.

The present invention provides a structure of a radiator, and includes a base plate 41 as shown in FIGS. 5 and 6, and the base plate 41 is provided with several radiating fins 411 and at least one heat conducting member 42. The heat conductive member 42 is joined to the base plate and the heat radiating fins 411. In this embodiment, the heat conductive member 42 is disposed inside the base plate 41 and the heat radiating fins 411 and / or. Installed on the surface, partially installed, fitted or embedded in and / or on the surface of the base plate 41 and the radiating fins 411, and the heat conducting member 42 includes the base plate 41 and The heat dissipating fins 411 are installed on the entire surface. In a preferred embodiment, the partial installation is an installation form arranged with an interval. Column may be parallel and non-parallel or intersecting sequences. The material constituting the heat conducting member 42 is different from the material constituting the base plate 41 and the radiation fins 411. The base plate 41 and the radiation fins 411 are made of a first metal material, and the heat conduction member 42 is the first material. It consists of a 2nd metal material different from 1 metal material.

The heat conducting member 42 has a plate shape (FIG. 7), a rod shape (FIG. 8), a net shape (FIG. 9), a granular shape (FIGS. 10 and 11), a honeycomb shape (FIG. 12), and a dot matrix shape (FIGS. 13 and 14). , Radial (FIG. 15), spiral (FIGS. 16, 17), concentric (FIG. 18), spider web (FIG. 19), or irregular geometry (not shown). As an example 1, when the first metal material is an aluminum material, the second metal material can be gold, silver or copper material, or a conductive material having better thermal conductivity than the first metal material. . As Example 2, when the first metal material is a copper material, the second metal material can be a gold material or a silver material. The first metal material and the second metal material are not limited to those described above, and other metal materials can also be used.

When the base plate 41 is bonded onto the electronic element 43, most of the heat generated by the electronic element 43 is quickly conducted by the heat conducting member 42, and part of the heat is conducted to the base plate 41 and the radiating fins 411. The heat conducted to the heat conducting member 42 is conducted to the base plate 41 and the heat radiating fins 411 and is conducted to the whole heat sink on average, and quickly radiated by the base plate 41 and the heat radiating fins 411 of the heat radiating member. Further, heat is exchanged between the air and the heat radiation fins 411 and the heat conducting member 42 by forced convection generated by a fan (not shown) provided outside. Further, since the heat conducting member 42 is installed inside and / or on the surface of the base plate 41 and the heat radiating fins 411, the heat conduction of the base plate 41 and the heat radiating fins 411 can be increased, and the heat radiating area, that is, air and The heat dissipation rate can be greatly increased, and the heat in the known structure can be concentrated on the copper material portion, and the disadvantage that the heat cannot be conducted to the heat dissipation fins of the aluminum material can be solved.

The above detailed description shows preferred embodiments of the present invention, and all changes, modifications, etc. using the method, shape, structure, and apparatus of the present invention are within the scope of the present invention.

It is sectional drawing which shows the structure of the heat radiator by a well-known structure. It is sectional drawing which shows the structure of the heat radiator by a well-known structure. It is sectional drawing which shows the structure of the heat radiator by a well-known structure. FIG. 4 is a top view in FIG. 3. It is a front view which shows suitable embodiment of the heat radiator by this invention. It is a side view which shows suitable embodiment of the heat radiator by this invention. It is a perspective view which shows the 1st form of the heat conductive member of the heat radiator by this invention. It is a perspective view which shows the 2nd form of the heat conductive member of the heat radiator by this invention. It is a perspective view which shows the 3rd form of the heat conductive member of the heat radiator by this invention. It is a perspective view which shows the 4th form of the heat conductive member of the heat radiator by this invention. It is a perspective view which shows the 5th form of the heat conductive member of the heat radiator by this invention. It is a perspective view which shows the 6th form of the heat conductive member of the heat radiator by this invention. It is a perspective view which shows the 7th form of the heat conductive member of the heat radiator by this invention. It is a perspective view which shows the 8th form of the heat conductive member of the heat radiator by this invention. It is a perspective view which shows the 9th form of the heat conductive member of the heat radiator by this invention. It is a perspective view which shows the 10th form of the heat conductive member of the heat radiator by this invention. It is a perspective view which shows the 11th form of the heat conductive member of the heat radiator by this invention. It is a perspective view which shows the 12th form of the heat conductive member of the heat radiator by this invention. It is a perspective view which shows the 13th form of the heat conductive member of the heat radiator by this invention.

Explanation of symbols

41 Base plate 411 Radiation fin 42 Thermal conduction member 43 Electronic element

Claims (23)

A structure of a radiator including a base plate provided with several radiating fins,
At least one heat conducting member is installed on the base plate and the heat dissipating fin, the heat conducting member is partially installed on the base plate and the heat dissipating fin, and the base plate and the heat dissipating fin are the first member. A heatsink structure, wherein the heat conducting member is made of a second metal material different from the first metal material.   2. The radiator structure according to claim 1, wherein the heat conducting member is installed inside the base plate and the heat radiating fin.   The structure of a radiator according to claim 1, wherein the heat conducting member is installed on surfaces of the base plate and the radiation fin.   2. A part of the heat conducting member is installed inside the base plate and the radiating fin, and another part is installed on the surface of the base plate and the radiating fin. The structure of the described radiator.   The structure of a radiator according to claim 1, wherein the second metal material is a metal having higher thermal conductivity than the first metal material.   2. The radiator structure according to claim 1, wherein the partial installation of the heat conducting member is an installation having an interval.   2. The radiator structure according to claim 1, wherein the partial installation of the heat conducting member is a net installation.   6. The radiator structure according to claim 5, wherein the first metal material is aluminum, and the second metal material is gold, silver, and copper.   6. The radiator structure according to claim 5, wherein the first metal material is copper, and the second metal material is gold and silver.   The structure of a heat radiator according to claim 1, 6 or 7, wherein the heat conducting member has a plate shape.   The structure of a radiator according to claim 1, 6 or 7, wherein the heat conducting member has a rod shape. A structure of a radiator including a base plate provided with several radiating fins,
At least one heat conducting member is installed on the base plate and the heat dissipating fin, the heat conducting member is partially installed on the base plate and the heat dissipating fin, and a material constituting the heat conducting member; The structure of the heat radiator characterized by the material which comprises the said base plate and a radiation fin differing.   The structure of a heat radiator according to claim 12, wherein the heat conducting member is installed inside the base plate and the heat radiating fins.   The structure of a radiator according to claim 12, wherein the heat conducting member is installed on surfaces of the base plate and the heat radiating fins.   13. A part of the heat conducting member is installed inside the base plate and the radiating fin, and another part is installed on the surface of the base plate and the radiating fin. The structure of the described radiator.   The structure of a radiator according to claim 12, wherein the base plate and the radiation fin are made of a first metal material, and the heat conducting member is made of a second metal material.   The structure of the heat radiator according to claim 12, wherein the partial installation of the heat conducting member is an installation having an interval.   The structure of a radiator according to claim 12, wherein the partial installation of the heat conducting member is a net installation. The structure of a radiator according to claim 16, wherein the second metal material is a metal having a higher thermal conductivity than the first metal material.   The structure of a radiator according to claim 12, 17 or 18, wherein the heat conducting member has a plate shape.   The structure of a heat radiator according to claim 12, 17 or 18, wherein the heat conducting member has a rod shape.   The structure of a radiator according to claim 19, wherein the first metal material is aluminum, and the second metal material is gold, silver, and copper. The heat sink structure according to claim 19, wherein the first metal material is copper, and the second metal material is gold and silver.

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