JP2006215985A - Heat sensor - Google Patents

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JP2006215985A
JP2006215985A JP2005030982A JP2005030982A JP2006215985A JP 2006215985 A JP2006215985 A JP 2006215985A JP 2005030982 A JP2005030982 A JP 2005030982A JP 2005030982 A JP2005030982 A JP 2005030982A JP 2006215985 A JP2006215985 A JP 2006215985A
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heat
housing
sensor
heat sensitive
stress absorbing
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JP4585877B2 (en
Inventor
Manabu Doi
学 土肥
Tetsuya Nagashima
哲也 長島
Yoshimi Kawabata
芳美 川端
Yasuo Omori
靖男 大森
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DOTSUDOUERU B M S KK
Hochiki Corp
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DOTSUDOUERU B M S KK
Hochiki Corp
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Priority to JP2005030982A priority Critical patent/JP4585877B2/en
Application filed by DOTSUDOUERU B M S KK, Hochiki Corp filed Critical DOTSUDOUERU B M S KK
Priority to DE112006000369T priority patent/DE112006000369T5/en
Priority to GB0714989A priority patent/GB2437871B/en
Priority to PCT/JP2006/301881 priority patent/WO2006082931A1/en
Priority to KR1020077019293A priority patent/KR20070112455A/en
Priority to CN2006800042614A priority patent/CN101116117B/en
Priority to US11/815,649 priority patent/US7802918B2/en
Priority to AU2006211402A priority patent/AU2006211402B2/en
Priority to TW095104070A priority patent/TWI385365B/en
Publication of JP2006215985A publication Critical patent/JP2006215985A/en
Priority to HK08103125.4A priority patent/HK1109235A1/en
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Abstract

<P>PROBLEM TO BE SOLVED: To provide a heat sensor with improved sensing accuracy of a heat sensing part, improved connection reliability of the heat sensing part and a casing, and improved reliability of the heat sensing part. <P>SOLUTION: In the heat sensor 1 provided with the heat sensing part 11 sensing heat in a surveillance area, a control part issuing an alarm in response to a sensing state by the heat sensing part 11, and the casing 81 protecting a control means, the heat sensing part 11 and the casing 81 are fixed via a stress absorbing means for absorbing strain of the heat sensing part 11. For example, the stress absorbing means is provided so as to cover the heat sensing part 11, it is composed as a sheet like member connected to the casing 81, and the heat sensing part 11 is held between the sheet like member and an adhesive film. <P>COPYRIGHT: (C)2006,JPO&NCIPI

Description

本発明は、監視領域における熱を感知して、感知状態に応じて警報を行う熱感知器に関する。   The present invention relates to a heat detector that senses heat in a monitoring area and issues an alarm according to a sensed state.

従来から、火災の発生を、火災により発生する熱で感知する熱感知器が提案されている。この熱感知器は、その感知原理に基づいて、差動式熱感知器と定温式熱感知器とに大別されている。このような熱感知器は、一般的に、監視領域における熱を感知する感熱部と、感熱部による感知状態に応じて警報を行う感知器本体とを備えて構成されている。   Conventionally, heat detectors that detect the occurrence of a fire with the heat generated by the fire have been proposed. This heat sensor is roughly classified into a differential heat sensor and a constant temperature heat sensor based on the sensing principle. Such a heat sensor is generally configured to include a heat-sensitive part that senses heat in a monitoring region, and a sensor body that issues an alarm according to the sensing state of the heat-sensitive part.

このうち、感熱部は、監視領域における熱を感知し、その感知状態を他の状態変化へ変換するセンサ部を備えて構成されている。このセンサ部には、温度上昇による空気の膨張により変形するダイヤフラム、温度に応じて抵抗値が変化するサーミスタ、又は、温度に応じて所定方向に変形するバイメタル等が使用されている。   Among these, the heat sensitive unit is configured to include a sensor unit that senses heat in the monitoring region and converts the sensed state into another state change. A diaphragm that deforms due to expansion of air due to a temperature rise, a thermistor that changes its resistance value according to temperature, or a bimetal that deforms in a predetermined direction according to temperature is used for this sensor unit.

図１２は、従来の、熱感知器の縦断面図である。この熱感知器は、天井Ｃ等の取付け面に設置される。ここで、熱感知器は感熱部１０と本体部２０を備えて構成されている。感熱部１０は、本体部２０の筐体８０の内側に、図示されていない接着剤により接続される（例えば特許文献１参照）。   FIG. 12 is a longitudinal sectional view of a conventional heat sensor. This heat sensor is installed on a mounting surface such as the ceiling C. Here, the heat detector is configured to include a heat sensitive portion 10 and a main body portion 20. The thermosensitive part 10 is connected to the inside of the housing 80 of the main body part 20 by an adhesive not shown (see, for example, Patent Document 1).

特開２００３−１９６７６０号公報JP 2003-196760 A

ここで、本願発明者等により、温度が変化すると焦電効果によって焦電電流を出力する強誘電性物質であるセラミック素子を、熱感知素子として利用することが検討されている。このセラミック素子は薄膜状に成型できるため、これを熱感知素子として利用することで、熱感知器全体を小型化することが可能になる。   Here, the inventors of the present application have examined the use of a ceramic element, which is a ferroelectric substance that outputs a pyroelectric current due to the pyroelectric effect when the temperature changes, as a heat sensing element. Since this ceramic element can be formed into a thin film, the entire heat sensor can be miniaturized by using this ceramic element as a heat sensing element.

しかしながら、上記従来の熱感知器では、感熱部と筐体とは接着剤で全面的に固定されていたため、このような構造を上記セラミック素子を感知部として利用した熱感知器にそのまま適用した場合には、筐体の歪みや、周囲温度が変化した場合、気圧が変化した場合においては、感熱部と筐体との熱膨張率の違い等による歪みによって、感熱部と筐体との接着剤を介した接続面に応力が加わってしまうことがあった。このように感熱部に応力が加わった場合には、圧電効果によって感熱部からの出力に影響が出るため、感熱部が正確に熱を感知できなくなる恐れがあった。さらには、感熱部と筐体とが剥がれたり、感熱部と筐体とのどちらかが破損したりする恐れがあった。   However, in the above conventional heat sensor, the heat sensitive part and the casing are entirely fixed with an adhesive, and thus when such a structure is applied as it is to a heat sensor using the ceramic element as a sensor part. When the ambient temperature changes or the atmospheric pressure changes, the adhesive between the heat-sensitive part and the case is affected by the distortion due to the difference in the thermal expansion coefficient between the heat-sensitive part and the case. In some cases, stress is applied to the connection surface through the contact. When stress is applied to the heat-sensitive part in this way, the output from the heat-sensitive part is affected by the piezoelectric effect, so that the heat-sensitive part may not be able to accurately detect heat. Furthermore, there is a possibility that the heat sensitive part and the housing are peeled off or either the heat sensitive part or the housing is damaged.

また、熱を感知する感熱部から熱容量の大きい筐体に熱が伝熱してしまい、この感熱部の熱応答性が悪くなるという問題があった。即ち、感熱部から筐体へ熱が逃げてしまい、感熱部の熱応答性を低減させる一因になっていた。   Further, there is a problem that heat is transferred from the heat-sensitive part that senses heat to the housing having a large heat capacity, and the heat responsiveness of the heat-sensitive part is deteriorated. That is, heat escapes from the heat sensitive part to the housing, which is a cause of reducing the thermal responsiveness of the heat sensitive part.

本発明は、上記に鑑みてなされたものであって、感熱部と筐体との熱膨張率の違い等により生じる感熱部の歪みを緩和させることにより、感熱部の感知精度と、感熱部と筐体との接続信頼性とを向上させ、さらに、感熱部の熱応答性を改善させることにより、感熱部の信頼性を向上させることができる、熱感知器を得ることを目的とする。   The present invention has been made in view of the above, and by reducing the distortion of the heat sensitive part caused by the difference in the coefficient of thermal expansion between the heat sensitive part and the housing, the detection accuracy of the heat sensitive part, the heat sensitive part, It is an object of the present invention to obtain a heat detector that can improve the reliability of the heat sensitive part by improving the connection reliability with the casing and further improving the thermal response of the heat sensitive part.

上述した課題を解決し、目的を達成するために、請求項１に記載の熱感知器は、監視領域における熱を感知する感熱手段と、感熱手段による感知状態に応じて警報を行う制御手段と、制御手段を保護する筐体とを備えた熱感知器において、感熱部と筐体とを、感熱部に歪みを生じさせないための応力吸収部を介して固定したことを特徴とする。   In order to solve the above-described problems and achieve the object, the heat sensor according to claim 1 is a heat-sensitive means for sensing heat in a monitoring region, and a control means for giving an alarm according to a detection state by the heat-sensitive means. In the heat detector including a housing that protects the control means, the heat sensitive portion and the housing are fixed via a stress absorbing portion for preventing the heat sensitive portion from being distorted.

また、請求項２に記載の熱感知器は、請求項１に記載の熱感知器において、応力吸収部は、感熱部を覆うように設けられたものであって、筐体と接続された薄板状部材であることを特徴とする。   Further, the heat sensor according to claim 2 is the heat sensor according to claim 1, wherein the stress absorbing portion is provided so as to cover the heat sensitive portion, and is a thin plate connected to the housing. It is a shape member, It is characterized by the above-mentioned.

また、請求項３に記載の熱感知器は、請求項２に記載の熱感知器において、感熱部は、薄板状部材と、粘着性フィルムとにより、挟持されることを特徴とする。   According to a third aspect of the present invention, in the heat sensor of the second aspect, the heat sensitive part is sandwiched between the thin plate member and the adhesive film.

また、請求項４に記載の熱感知器は、請求項２又は３に記載の熱感知器において、筐体に、薄板状部材を溶着接続したことを特徴とする。   According to a fourth aspect of the present invention, there is provided the heat sensor according to the second or third aspect, wherein a thin plate member is welded to the housing.

また、請求項５に記載の熱感知器は、請求項１に記載の熱感知器において、応力吸収部は、筐体に一体に成型された応力吸収部であることを特徴とする。   According to a fifth aspect of the present invention, in the heat sensor according to the first aspect, the stress absorbing portion is a stress absorbing portion formed integrally with the housing.

また、請求項６に記載の熱感知器は、請求項５に記載の熱感知器において、応力吸収部に、感熱部を溶着接続したことを特徴とする。   According to a sixth aspect of the present invention, there is provided the heat sensor according to the fifth aspect, wherein a heat sensitive part is welded to the stress absorbing part.

また、請求項７に記載の熱感知器は、請求項５又は６に記載の熱感知器において、筐体は、筐体に対して、別体成型された取付け部を有し、取付け部に応力吸収部を一体成型したことを特徴とする。   The heat sensor according to claim 7 is the heat sensor according to claim 5 or 6, wherein the housing has a mounting portion formed separately from the housing. The stress absorbing portion is integrally molded.

また、請求項８に記載の熱感知器は、請求項１から７のいずれか一つに記載の熱感知器において、感熱部を、監視領域へ、直接的に、又は、応力吸収部を介して、露出させたことを特徴とする。   The heat sensor according to claim 8 is the heat sensor according to any one of claims 1 to 7, wherein the heat sensitive part is directly connected to the monitoring region or via the stress absorbing part. And exposed.

また、請求項９に記載の熱感知器は、請求項１から８のいずれか一つに記載の熱感知器において、感熱部と筐体との間に、監視領域から筐体内部への異物の侵入を防止するための保護部を設けたことを特徴とする。   Further, the heat detector according to claim 9 is the heat detector according to any one of claims 1 to 8, wherein a foreign matter from the monitoring region to the inside of the housing is between the heat sensitive part and the housing. It is characterized by providing a protection part for preventing the intrusion of the.

この発明によれば、熱感知器は、筐体の歪みや、周囲温度や気圧が変化した場合の感熱部と筐体との熱膨張率の違い等による歪みが感熱部に生じるのを防止することができるので、感熱部の誤動作を防ぎ、さらには、感熱部と筐体との剥がれや、感熱部又は筐体の破損を防止するという効果を奏する。   According to the present invention, the heat sensor prevents the heat sensitive part from being distorted due to a difference in thermal expansion coefficient between the heat sensitive part and the case when the ambient temperature or atmospheric pressure changes. Therefore, the malfunction of the heat sensitive part can be prevented, and further, the heat sensitive part and the casing can be prevented from being peeled off, and the heat sensitive part or the casing can be prevented from being damaged.

この発明によれば、熱感知器は、感熱部から筐体への熱の逃げを最小限に抑えることができるので、感熱部の熱応答性を向上するという効果を奏する。   According to the present invention, since the heat detector can minimize the escape of heat from the heat sensitive part to the housing, the heat responsiveness of the heat sensitive part is improved.

この発明によれば、熱感知器は、感熱部と筐体とを密閉できるので、監視領域から筐体内部、さらには、センサ部への、異物の侵入を防ぐという効果を奏する。   According to the present invention, since the heat detector can seal the heat sensitive part and the housing, it has an effect of preventing foreign matter from entering the inside of the housing and further to the sensor part from the monitoring region.

この発明によれば、熱感知器は、応力吸収部を別途成型後、筐体に取付けすることができるので、筐体を容易に製作でき、筐体の歩留まりと生産性を向上するという効果を奏する。   According to this invention, since the heat detector can be attached to the housing after the stress absorbing portion is separately molded, the housing can be easily manufactured, and the yield and productivity of the housing can be improved. Play.

以下に添付図面を参照して、この発明に係る熱感知器の各実施の形態を詳細に説明する。まず、〔Ｉ〕本発明の基本的構成を説明した後、〔ＩＩ〕本発明の各実施の形態について説明し、〔ＩＩＩ〕最後に、本発明の各実施の形態に対する変形例について説明する。   Embodiments of a heat sensor according to the present invention will be described below in detail with reference to the accompanying drawings. [I] First, the basic configuration of the present invention will be described, then [II] each embodiment of the present invention will be described, and [III] Finally, modifications to each embodiment of the present invention will be described.

〔Ｉ〕本発明の基本的構成
まず、本発明の基本的構成について説明する。熱感知器は、天井等の取付け面へ設置される。この熱感知器は、感熱部と感知器本体とを備えて構成されている。ここで、感熱部は、監視領域における熱を感知する感熱手段である。また、感知器本体は、感熱部の出力に基づいて火災の発生の有無を判断し、火災が発生したと判断した場合には警報や移報出力等を行う。さらに感知器本体は、制御部と筐体とを備えて構成されている。制御部は、火災発生の有無の判断結果に応じて警報を行う制御手段であり、筐体は、熱感知器の構造体であり、制御部を保護する保護手段である。 [I] Basic Configuration of the Present Invention First, the basic configuration of the present invention will be described. The heat sensor is installed on a mounting surface such as a ceiling. This heat sensor includes a heat sensitive part and a sensor main body. Here, the heat sensitive part is a heat sensitive means for sensing heat in the monitoring region. Also, the sensor body determines whether or not a fire has occurred based on the output of the heat sensitive part, and if it determines that a fire has occurred, it performs an alarm or a message output. Furthermore, the sensor main body is configured to include a control unit and a housing. The control unit is a control unit that issues an alarm according to the determination result of whether or not a fire has occurred, and the housing is a structure of a heat sensor, and is a protection unit that protects the control unit.

本発明は、温度上昇にともなう感熱部と筐体との間に生じる歪みを吸収するために、感熱部と筐体との間に肉厚の薄い構造部分を設け、感熱部と筐体のそれぞれの熱膨張率の違いにより発生する熱応力を吸収することを特徴とする。また、当該応力吸収部材は、感熱部から筐体への熱伝導も最小限に抑える効果を有する特徴がある。また、気圧や気温の変化により、密封されている感熱器内部の空気が膨張もしくは収縮し、感熱部に歪みが生じた場合において、その歪みを吸収することができる。   The present invention provides a thin structural portion between the heat sensitive part and the housing in order to absorb the distortion generated between the heat sensitive part and the case due to the temperature rise. It absorbs thermal stress generated by the difference in thermal expansion coefficient. In addition, the stress absorbing member has a feature of minimizing heat conduction from the heat sensitive portion to the housing. In addition, when the air inside the sealed heat detector expands or contracts due to changes in atmospheric pressure or air temperature, and distortion occurs in the heat sensitive part, the distortion can be absorbed.

また、本発明は、感熱部と筐体との接続作業を容易にするために、接着剤による接続ではなく、溶着による接続にしたことを主たる特徴の一つとする。例えば、感熱部の薄板状部材と筐体とを溶着する。   In addition, the present invention has one of the main features that connection by welding rather than connection by an adhesive is used in order to facilitate the connection work between the heat sensitive part and the housing. For example, the thin plate member of the heat sensitive part and the housing are welded.

〔ＩＩ〕本発明の実施の形態
次に、本発明に係る熱感知器の各実施の形態について説明する。ただし、これら各実施の形態によって本発明が限定されるものではない。 [II] Embodiments of the Present Invention Next, embodiments of the heat detector according to the present invention will be described. However, the present invention is not limited by these embodiments.

（実施の形態１）
まず、最初に、実施の形態１について説明する。本実施の形態１に係る熱感知器は、概略的に、感熱部を薄板状部材に、粘着性フィルムを用いて固定し、感熱部を、薄板状部材を介して筐体に接続したこと、及び、感熱部を、薄板状部材を介して監視領域に露出させたことを主たる特徴とする。 (Embodiment 1)
First, the first embodiment will be described. In the heat detector according to the first embodiment, the heat sensitive part is roughly fixed to the thin plate member using an adhesive film, and the heat sensitive part is connected to the housing via the thin plate member. The main feature is that the heat sensitive part is exposed to the monitoring region through the thin plate member.

（全体構成について）
図１は、感熱部１１と筐体８１とを接続した状態における熱感知器１の縦断面図、図２は、感熱部１１と筐体８１とを接続する前の状態における熱感知器１の縦断面図である。これら図１、２に示すように、熱感知器１は、感熱部１１と感知器本体２１とを備えて構成されている。 (About overall structure)
FIG. 1 is a longitudinal cross-sectional view of the heat detector 1 in a state in which the heat sensitive unit 11 and the housing 81 are connected, and FIG. 2 is a view of the heat sensor 1 in a state before the heat sensitive unit 11 and the housing 81 are connected. It is a longitudinal cross-sectional view. As shown in FIGS. 1 and 2, the heat sensor 1 includes a heat sensing unit 11 and a sensor main body 21.

（感熱部の構成について）
このうち、感熱部１１の構成を説明する。図３は、ラミネート部６０に挟持されている状態における感熱部１１の平面図及び縦断面図を関連させて示した図、図４は、感熱部１１の平面図及び縦断面図を関連させて示した図である。感熱部１１は、監視領域における熱を感知する感熱手段であり、センサ部３０と、電極金属部４０と、金属板５０とを備えて構成されている。センサ部３０は、その感知状態を他の状態変化へ変換するセンサ手段であり、例えば、監視領域の温度が変化すると焦電効果によって焦電電流を出力する強誘電性物質を薄膜化した薄板状感熱センサとして構成されている。電極金属部４０及び金属板５０は、センサ部３０から出力された焦電電流を筐体２１へ電線等を介して出力するための電極手段である。 (Regarding the structure of the heat sensitive part)
Among these, the structure of the heat sensitive part 11 is demonstrated. FIG. 3 is a diagram showing a plan view and a longitudinal cross-sectional view of the heat-sensitive part 11 in a state of being sandwiched by the laminate part 60, and FIG. 4 is a diagram showing a plan view and a vertical cross-sectional view of the heat-sensitive part 11. FIG. The heat sensitive unit 11 is a heat sensitive unit that senses heat in the monitoring region, and includes a sensor unit 30, an electrode metal unit 40, and a metal plate 50. The sensor unit 30 is sensor means for converting the sensed state into another state change. For example, a thin plate-like thinned ferroelectric substance that outputs a pyroelectric current due to the pyroelectric effect when the temperature of the monitoring region changes. It is configured as a thermal sensor. The electrode metal part 40 and the metal plate 50 are electrode means for outputting the pyroelectric current output from the sensor part 30 to the housing 21 via an electric wire or the like.

これらセンサ部３０、電極金属部４０、及び、金属板５０は、３層の積層構造となっており、センサ部３０の外側（監視領域に面する側。以下同じ）に金属板５０が、センサ部３０の内側（監視領域と反対側。以下同じ）に電極金属部４０がそれぞれ配置されている。これらセンサ部３０、電極金属部４０、及び、金属板５０は、それぞれ略薄厚円盤形に形成されており、略同心円盤状に積層されている。ここで、各部の直径は、電極金属部４０、センサ部３０、金属板５０に至るにつれ順次大きくなっている。また、そして、センサ部３０と金属板５０とは、接着剤により接着されており、電極金属部４０は、センサ部３０上に蒸着されている。   The sensor unit 30, the electrode metal unit 40, and the metal plate 50 have a three-layer laminated structure, and the metal plate 50 is attached to the outside of the sensor unit 30 (the side facing the monitoring area; the same applies hereinafter). Electrode metal portions 40 are respectively arranged inside the portion 30 (on the opposite side to the monitoring region; the same applies hereinafter). The sensor unit 30, the electrode metal unit 40, and the metal plate 50 are each formed in a substantially thin disk shape and are stacked in a substantially concentric disk shape. Here, the diameter of each part is gradually increased as it reaches the electrode metal part 40, the sensor part 30, and the metal plate 50. The sensor unit 30 and the metal plate 50 are bonded with an adhesive, and the electrode metal unit 40 is deposited on the sensor unit 30.

ラミネート部６０は、感熱部１１を挟持するラミネート手段であり、ラミネート外材６１とラミネート内材６２とを備えて構成されている。このうち、ラミネート外材６１は、特許請求の範囲における薄板状部材、ラミネート内材６２は、特許請求の範囲における粘着性フィルムに対応する。ラミネート外材６１は、金属板５０の外側に配置されており、ラミネート内材６２は、電極金属部４０の内側に配置されている。   The laminating unit 60 is a laminating unit that sandwiches the heat-sensitive unit 11, and includes a laminate outer material 61 and a laminate inner material 62. Among these, the laminate outer material 61 corresponds to the thin plate member in the claims, and the laminate inner material 62 corresponds to the adhesive film in the claims. The laminate outer material 61 is disposed outside the metal plate 50, and the laminate inner material 62 is disposed inside the electrode metal part 40.

これらラミネート外材６１とラミネート内材６２とは、センサ部３０、電極金属部４０、及び、金属板５０をそれらの間に挟めるように、金属部５０よりも充分に大きい直径の略薄厚円盤形に形成されている。また、ラミネート外材６１の外周部がラミネート内材６２よりも外側に露出するように、ラミネート外材６１の直径はラミネート内材６２よりも大きい。また、ラミネート内材６２は、ラミネート外材６１側の全面に粘着材が塗布されている。よって、ラミネート外材６１とラミネート内材６２とを、感熱部１１を挟んで貼り合わせることにより、感熱部１１は、ラミネート部６０に挟持される。   The laminate outer material 61 and the laminate inner material 62 are formed into a substantially thin disk shape having a diameter sufficiently larger than the metal portion 50 so that the sensor portion 30, the electrode metal portion 40, and the metal plate 50 can be sandwiched therebetween. Is formed. Further, the diameter of the laminated outer material 61 is larger than that of the laminated inner material 62 so that the outer peripheral portion of the laminated outer material 61 is exposed to the outside of the laminated inner material 62. The laminate inner material 62 is coated with an adhesive material on the entire surface on the laminate outer material 61 side. Therefore, the heat sensitive part 11 is sandwiched between the laminate part 60 by bonding the laminate outer material 61 and the laminate inner material 62 with the heat sensitive part 11 interposed therebetween.

これらラミネート外材６１及びラミネート内材の具体的な材質や寸法は任意であるが、例えば、ラミネート外材６１は、樹脂から成り、その厚さは、強度、応力吸収特性、形成容易性、及び、熱応答性を考慮して、０．２ｍｍ以下となっている。ラミネート内材６２は、樹脂から成り、例えば、その厚さは、０．０５ｍｍ以下となっている。ラミネート外材６１とラミネート内材６２の耐熱温度は、熱感知器の作動温度と樹脂の溶融温度とを考慮して、８５℃以上であることが好ましい。   Specific materials and dimensions of the laminate outer material 61 and the laminate inner material are arbitrary. For example, the laminate outer material 61 is made of resin, and the thickness thereof is strength, stress absorption characteristics, ease of formation, and heat. In consideration of responsiveness, it is 0.2 mm or less. The laminate inner material 62 is made of resin, and has a thickness of 0.05 mm or less, for example. The heat resistance temperature of the laminate outer material 61 and the laminate inner material 62 is preferably 85 ° C. or higher in consideration of the operating temperature of the heat sensor and the melting temperature of the resin.

さらに、ラミネート内材６２は、図３に示すように、切欠き部６２ａを備えている。具体的には、切欠き部６２ａは、ラミネート内材６２の外周から中心部に向けて設けられた、略Ｕ溝の切欠きとして形成されている。ここで、制御部（図示せず）と電気的に接続された電線等を、切欠き部６２ａから一部露出した電極金属部４０と金属板５０とに直接半田付けすることにより、感熱部１１と制御部（図示せず）とを電気的に接続することができる。   Further, as shown in FIG. 3, the laminate inner member 62 includes a notch 62a. Specifically, the notch 62a is formed as a substantially U-groove notch provided from the outer periphery of the laminate inner member 62 toward the center. Here, by directly soldering an electric wire or the like electrically connected to a control unit (not shown) to the electrode metal unit 40 and the metal plate 50 partially exposed from the notch 62a, the heat sensitive unit 11 is provided. And a control unit (not shown) can be electrically connected.

（感知器本体の構成について）
次に、感知器本体２１の構成を説明する。感知器本体２１は、制御部（図示せず）と筐体８１とを備えて構成されている。制御部は、感熱部１１から出力された焦電電流を受け取り、この焦電電流の大きさを所定の閾値と比較等することによって、火災の発生の有無を判断し、この判断結果に応じて警報を行う制御手段である。この制御部は、例えば、ＩＣ（Integrated Circuit）及びこのＩＣ上で実行されるプログラムとして構成され、所定の制御を実行する。 (Regarding the structure of the sensor body)
Next, the configuration of the sensor body 21 will be described. The sensor main body 21 includes a control unit (not shown) and a housing 81. The control unit receives the pyroelectric current output from the heat-sensitive unit 11 and determines whether or not a fire has occurred by comparing the magnitude of this pyroelectric current with a predetermined threshold, and according to the determination result. It is a control means which performs an alarm. For example, the control unit is configured as an IC (Integrated Circuit) and a program executed on the IC, and executes predetermined control.

この筐体８１は、熱感知器１の構造体であり、制御部（図示せず）を保護する保護手段である。図１、２に示すように、筐体８１の下端部近傍の内側に、略円盤形の接続面部８１ａが形成されており、この接続面部８１ａに、上述したラミネート部６０に挟持された感熱部１１が固定されている。なお、筐体８１の具体的材質や製造方法は任意であるが、例えば、筐体８１は樹脂成型にて形成されている。   The casing 81 is a structure of the heat sensor 1 and is a protection unit that protects a control unit (not shown). As shown in FIGS. 1 and 2, a substantially disc-shaped connection surface portion 81 a is formed inside the vicinity of the lower end portion of the casing 81, and the heat sensitive portion sandwiched between the above-described laminate portions 60 on the connection surface portion 81 a. 11 is fixed. In addition, although the specific material and manufacturing method of the housing | casing 81 are arbitrary, the housing | casing 81 is formed by resin molding, for example.

（感熱部と筐体との接続構造について）
次に、感熱部１１と筐体８１との接続構造について、より詳細に説明する。筐体８１の接続面部８１ａは、開口部８１ｃと接続部８１ｄから成る。ここで、開口部８１ｃは、接続面部８１ａと略同心の平面略円形の開口部であり、その外径は、ラミネート外材６１より小さく、かつ、金属板５１より大きくなるように決定されている。従って、感熱部１１を接続面部８１ａに対して外側から押付けると、感熱部１１のラミネート外材６１以外の部分が開口部８１ｃを介して筐体８１の内側に配置されるので、この筐体８１によって感熱部１１が保護されると共に、感熱部１１のラミネート外材６１が接続面部８１ａに押し当てられた状態で接触するので、感熱部１１を、接続面部８１ａを介して筐体８１に固定できる。 (About the connection structure between the heat sensitive part and the chassis)
Next, the connection structure between the heat sensitive unit 11 and the housing 81 will be described in more detail. The connection surface portion 81a of the housing 81 includes an opening 81c and a connection portion 81d. Here, the opening 81 c is a plane substantially circular opening substantially concentric with the connection surface 81 a, and the outer diameter thereof is determined to be smaller than the laminate outer material 61 and larger than the metal plate 51. Therefore, when the heat sensitive part 11 is pressed against the connection surface part 81a from the outside, the part other than the laminate outer material 61 of the heat sensitive part 11 is disposed inside the case 81 through the opening 81c. As a result, the heat sensitive part 11 is protected and the laminate outer material 61 of the heat sensitive part 11 is in contact with the connection surface part 81a while being in contact with the connection surface part 81a.

また、筐体８１の外端部８１ｅは、接続面部８１ａよりもさらに外側に延出しており、さらに外端部８１ｅの内径はラミネート外材６１とほぼ同径、又は、若干大きな口径に決定されていることから、この外端部８１ｅの内面と接続面部８１ａとの間に、ラミネート外材６１を配置した際に、筐体８１とラミネート外材６１とがずれることなく、ラミネート外材６１を固定することができる。   Further, the outer end portion 81e of the housing 81 extends further outward than the connection surface portion 81a, and the inner diameter of the outer end portion 81e is determined to be substantially the same as or slightly larger than the laminate outer material 61. Therefore, when the laminate outer material 61 is disposed between the inner surface of the outer end portion 81e and the connection surface portion 81a, the laminate outer material 61 can be fixed without the casing 81 and the laminate outer material 61 being displaced. it can.

ここで、図２に示すように、接続面部８１ａの外側面には、接続部８１ｄが形成されている。この接続部８１ｄは、感熱部１１を筐体８１に溶着するための被溶着部であり、接続面部８１ａと略同心円状の環状突起として形成されている。従って、図１に示すように、ラミネート外材６１の内側面と接続面部８１ａの外側面を当接させた状態で、接続部８１ｄを超音波や熱によって溶かすと、接続部８１ｄと、この接続部８１ｄに対応するラミネート外材６１の接続部６１ａとが溶着し、感熱部１１と筐体８１とが溶着される。すなわち、接続部６１ａと接続部８１ｄとは、感熱部１１と筐体８１との相互の接続を行う接続手段を構成する。   Here, as shown in FIG. 2, a connection portion 81d is formed on the outer surface of the connection surface portion 81a. The connection portion 81d is a welded portion for welding the heat-sensitive portion 11 to the housing 81, and is formed as an annular protrusion that is substantially concentric with the connection surface portion 81a. Therefore, as shown in FIG. 1, when the connecting portion 81d is melted by ultrasonic waves or heat while the inner surface of the laminate outer member 61 and the outer surface of the connecting surface portion 81a are in contact with each other, the connecting portion 81d and the connecting portion are connected. The connection part 61a of the laminate outer material 61 corresponding to 81d is welded, and the heat sensitive part 11 and the casing 81 are welded. That is, the connecting part 61a and the connecting part 81d constitute connecting means for connecting the thermosensitive part 11 and the casing 81 to each other.

（歪みの吸収について）
このように接続された状態において、感熱部１１と筐体８１とは、ラミネート外材６１という薄板状部材のみを介して接続されている。より詳細には、図１に示すように、筐体８１の接続面部８１ａの端部とラミネート内材６２との間には、間隔Ｗが形成されている。従って、このラミネート外材６１によって、筐体８１の歪みや、周囲温度が変化した場合の感熱部１１と筐体８１との熱膨張率の違いによる歪みを吸収することができる。このため、センサ部３０が歪みによる圧電効果により電界を発生することによる感熱部１１の誤動作を防ぎ、さらには、感熱部１１と筐体８１との剥がれや、感熱部１１又は筐体８１の破損を防止することができる。 (About strain absorption)
In such a connected state, the heat sensitive part 11 and the casing 81 are connected only through a thin plate-like member called the laminate outer material 61. More specifically, as shown in FIG. 1, a gap W is formed between the end of the connection surface portion 81 a of the housing 81 and the laminated inner material 62. Therefore, the laminate outer material 61 can absorb the distortion of the casing 81 and the distortion due to the difference in thermal expansion coefficient between the heat-sensitive part 11 and the casing 81 when the ambient temperature changes. For this reason, the malfunction of the heat-sensitive part 11 due to the sensor part 30 generating an electric field due to the piezoelectric effect due to distortion is prevented, and further, the heat-sensitive part 11 and the casing 81 are peeled off, or the heat-sensitive part 11 or the casing 81 is damaged. Can be prevented.

さらに、感熱部１１とラミネート外材６１との接着には、伸縮性のある粘着フィルムであるラミネート内材６２を用いており、感熱部１１とラミネート外材６１とは、お互いに固着されておらず、横方向等には若干互いにずれることもでき、歪みがここでも吸収されることとなる。   Furthermore, the adhesion between the heat sensitive part 11 and the laminate outer material 61 uses a laminate inner material 62 that is a stretchable adhesive film, and the heat sensitive part 11 and the laminate outer material 61 are not fixed to each other, In the lateral direction or the like, they may be slightly shifted from each other, and the distortion is absorbed here.

（熱容量について）
このように接続された状態において、感熱部１１のセンサ部３０と、監視領域との間には、金属板５０とラミネート外材６１のみが介在することになる。従って、これら金属板５０とラミネート外材６１との厚みは、従来の筐体と接着剤とを合わせた厚さより、大幅に薄くすることができる。このため、監視領域からの熱が感熱部１１に伝わりやすくなり、又、感熱部１１から筐体８１への熱伝導は、ラミネート外材６１に熱伝導率が小さい樹脂材を使用しており、熱を逃げるのを抑えられるため、その結果、感熱部１１の熱応答性が向上する。 (About heat capacity)
In this connected state, only the metal plate 50 and the laminate outer material 61 are interposed between the sensor unit 30 of the heat sensitive unit 11 and the monitoring region. Therefore, the thickness of the metal plate 50 and the laminate outer material 61 can be made much thinner than the combined thickness of the conventional casing and adhesive. For this reason, the heat from the monitoring region is easily transmitted to the heat sensitive part 11, and the heat conduction from the heat sensitive part 11 to the housing 81 uses a resin material having a low heat conductivity for the laminate outer material 61. As a result, the thermal response of the heat sensitive part 11 is improved.

（保護手段について）
また、上記の接続構造において、接続部８１ｄが上述のように環状突起として形成されているので、この接続部８１ｄの溶着部分も、接続面部８１ａと略同心状の円環状になり、感熱部１１と筐体８１との間の隙間が平面略全周に渡って塞がれる。すなわち、感熱部１１と筐体８１とが、接続部６１ａと接続部８１ｄとの溶着によって密閉されるため、監視領域から開口部８１ｃを介して筐体８１の内部へ塵や水分等の異物が侵入することを防ぐことができる。すなわち、接続部６１ａと接続部８１ｄとは、特許請求の範囲における保護手段に対応する。 (Protection measures)
Further, in the above connection structure, since the connection portion 81d is formed as an annular protrusion as described above, the welded portion of the connection portion 81d also has an annular shape substantially concentric with the connection surface portion 81a. The gap between the casing 81 and the casing 81 is closed over substantially the entire plane. That is, since the heat-sensitive part 11 and the casing 81 are sealed by welding the connecting part 61a and the connecting part 81d, foreign matters such as dust and moisture are introduced from the monitoring region into the casing 81 through the opening 81c. Intrusion can be prevented. That is, the connection part 61a and the connection part 81d correspond to the protection means in the claims.

（生産性について）
さらに、感熱部１１と筐体８１との接続は、上述のように、ラミネート外材６１の接続部６１ａと接続面部８１ａの接続部８１ｄとの溶着である。この溶着作業は、従来の接着作業に比べて短時間で終わるため、従来のように接着剤が固まるまで感熱部と筐体とを仮固定する必要がなく接続作業が容易になるとともに、接着剤自体の保存や取り扱い等の管理も不要となり、熱感知器１の生産効率を向上させることができる。 (About productivity)
Furthermore, the connection between the heat-sensitive part 11 and the housing 81 is welding of the connection part 61a of the laminate outer material 61 and the connection part 81d of the connection surface part 81a as described above. Since this welding operation is completed in a shorter time than the conventional bonding operation, it is not necessary to temporarily fix the heat-sensitive part and the housing until the adhesive is hardened as in the conventional case, and the connection operation is facilitated. It is not necessary to manage the storage and handling of the device itself, and the production efficiency of the heat detector 1 can be improved.

（実施の形態２）
次に、実施の形態２について説明する。本実施の形態２に係る熱感知器は、概略的に、実施の形態１と略同様の特徴を有するが、感熱部を、筐体に設けられた応力吸収部を介して筐体に接続したこと、及び、感熱部を、監視領域に直接露出させたことを主たる特徴とする。 (Embodiment 2)
Next, a second embodiment will be described. The heat detector according to the second embodiment generally has substantially the same features as those of the first embodiment, but the heat sensitive part is connected to the case via a stress absorbing part provided in the case. The main feature is that the heat sensitive part is directly exposed to the monitoring area.

（全体構成について）
図５は、感熱部１２と筐体８２とを接続した状態における熱感知器２の縦断面図、図６は、感熱部１２と筐体８２とを接続する前の状態における熱感知器２の縦断面図である。なお、特に説明なき構造については、上述した実施の形態１と同様であり、同一の構成を同一の符号を付して説明する。この熱感知器２は、感熱部１２、感知器本体２２、及び、パッキン９０を備えており、ラミネート部６０が省略されている。ここで、パッキン９０は、監視領域から筐体８２内部への塵、水分等の異物の侵入を防止するための特許請求の範囲における保護手段に対応する。 (About overall structure)
FIG. 5 is a longitudinal sectional view of the heat detector 2 in a state in which the heat sensitive unit 12 and the housing 82 are connected, and FIG. 6 is a view of the heat sensor 2 in a state before the heat sensitive unit 12 and the housing 82 are connected. It is a longitudinal cross-sectional view. Note that a structure that is not particularly described is the same as that of the first embodiment described above, and the same configuration is described with the same reference numeral. The heat sensor 2 includes a heat sensitive part 12, a sensor main body 22, and a packing 90, and the laminate part 60 is omitted. Here, the packing 90 corresponds to protection means in claims for preventing foreign matter such as dust and moisture from entering the housing 82 from the monitoring region.

（感熱部の構成について）
まず、本実施の形態２に係る感熱部１２の構成を説明する。図７は、感熱部１２の平面図及び縦断面図を関連させて示した図である。この感熱部１２は、実施の形態１の金属板５０に代えて、金属板５１を備えて構成されている。ここで、金属板５１は、孔部５１ａを備えている。図７では６個の孔部５１ａを設けているが、これに限定されるものではない。これらの孔部５１ａは、金属板５１の端部のうち、センサ部３０よりも外周側に延出している部分において、金属板５１の中心点を中心とした円周上に、略等間隔で配置されている。この孔部５１ａの機能については後述する。 (Regarding the structure of the heat sensitive part)
First, the structure of the thermal part 12 according to the second embodiment will be described. FIG. 7 is a diagram showing a plan view and a longitudinal sectional view of the heat sensitive part 12 in association with each other. This heat-sensitive part 12 is configured to include a metal plate 51 instead of the metal plate 50 of the first embodiment. Here, the metal plate 51 includes a hole 51a. Although six holes 51a are provided in FIG. 7, the present invention is not limited to this. These hole portions 51a are arranged at substantially equal intervals on the circumference centered on the center point of the metal plate 51 in the portion extending to the outer peripheral side from the sensor portion 30 in the end portion of the metal plate 51. Has been placed. The function of the hole 51a will be described later.

（保護手段について）
次に、本実施の形態２に係るパッキン９０の構成を説明する。図８は、パッキン９０の平面図及び縦断面図を関連させて示した図である。このパッキン９０は、略薄厚円環形をしており、この円周上の金属板５１に設けられた孔部５１ａに対応する位置に、孔部９０ａが、略等間隔で配置されている。パッキン９０は、例えば、ゴム等から成る。このパッキン９０ａの機能については後述する。 (Protection measures)
Next, the configuration of the packing 90 according to the second embodiment will be described. FIG. 8 is a diagram showing a plan view and a longitudinal sectional view of the packing 90 in association with each other. The packing 90 has a substantially thin annular shape, and the holes 90a are arranged at substantially equal intervals at positions corresponding to the holes 51a provided on the metal plate 51 on the circumference. The packing 90 is made of, for example, rubber. The function of this packing 90a will be described later.

（感知器本体の構成について）
次に、感知器本体２２の構成を説明する。感知器本体２２は、実施の形態１の筐体８１に代えて、筐体８２を備えて構成されている。図５、６に示すように、筐体８２は、実施の形態１の接続面部８１ａに代えて、接続面部８２ａを備えて構成されている。ここで、接続面部８２ａは、筐体８２の下端部近傍の内側に形成された、略薄厚円盤形である。 (Regarding the structure of the sensor body)
Next, the configuration of the sensor body 22 will be described. The sensor body 22 includes a housing 82 instead of the housing 81 of the first embodiment. As shown in FIGS. 5 and 6, the casing 82 includes a connection surface portion 82 a instead of the connection surface portion 81 a of the first embodiment. Here, the connection surface portion 82 a has a substantially thin disk shape formed inside the vicinity of the lower end portion of the housing 82.

（感熱部と筐体との接続構造について）
ここで、感熱部１２と筐体８２との接続構造について、より詳細に説明する。筐体８２の接続面部８２ａは、応力吸収部８２ｂ、開口部８２ｃ、及び、ボス部８２ｆを備えて構成されている。図６では、ボス部８２ｆは２個しか図示されていないが、実際には、さらに多くのボス部８２ｆ、例えば、全部で６個のボス部８２ｆが存在している。 (About the connection structure between the heat sensitive part and the chassis)
Here, the connection structure between the heat sensitive unit 12 and the housing 82 will be described in more detail. The connection surface portion 82a of the housing 82 includes a stress absorbing portion 82b, an opening portion 82c, and a boss portion 82f. In FIG. 6, only two boss portions 82f are shown, but actually, there are more boss portions 82f, for example, a total of six boss portions 82f.

応力吸収部８２ｂは、接続面部８２ａと略同心の略円盤形をしており、その肉厚は、接続面部８２ａに対して薄くなっている。その厚さは、任意であるが、強度、応力吸収特性、形成容易性、及び、熱応答性を考慮して、０．２ｍｍ以下となっている。また、応力吸収部８２ｂの外径は、金属板５１及びパッキン９０の外径より若干大きく、応力吸収部８２ｂと接続面部８２ａとの境界における段差部分の長さは、金属部５１とパッキン９０とを合わせた厚さ方向の長さよりも若干大きくすることが好ましい。このため、金属部５１とパッキン９０とを、応力吸収部８２ｂに対して内側から押付けると、金属部５１とパッキン９０とが、接続面部８２ａと応力吸収部８２ｂとで形成された空間に収容されることができ、センサ部３０の位置がほぼ決定される。ここで、応力吸収部８２ｂは、特許請求の範囲における応力吸収部に対応する。また、開口部８２ｃは、応力吸収部８２ｂと略同心の平面略円形の開口部である。   The stress absorbing portion 82b has a substantially disk shape that is substantially concentric with the connection surface portion 82a, and the thickness thereof is thinner than the connection surface portion 82a. The thickness is arbitrary, but is 0.2 mm or less in consideration of strength, stress absorption characteristics, ease of formation, and thermal response. Further, the outer diameter of the stress absorbing portion 82b is slightly larger than the outer diameter of the metal plate 51 and the packing 90, and the length of the step portion at the boundary between the stress absorbing portion 82b and the connecting surface portion 82a is the same as that of the metal portion 51 and the packing 90. It is preferable that the length is slightly larger than the total length in the thickness direction. For this reason, when the metal part 51 and the packing 90 are pressed against the stress absorbing part 82b from the inside, the metal part 51 and the packing 90 are accommodated in the space formed by the connection surface part 82a and the stress absorbing part 82b. The position of the sensor unit 30 is almost determined. Here, the stress absorbing portion 82b corresponds to the stress absorbing portion in the claims. The opening 82c is a plane substantially circular opening that is substantially concentric with the stress absorbing portion 82b.

また、ボス部８２ｆは、応力吸収部８２ｂの内側面にあり、より詳細には、応力吸収部８２ｂの中心点を中心とした円周上に、略等間隔で配置されている。ここで、ボス部８２ｆの各中心位置は、金属板５１の孔部５１ａの各中心位置と、パッキン９０の孔部９０ａの各中心位置と、一致している。さらに、ボス部８２ｆは、孔部５１ａの直径より若干小さく、孔部５１ａと孔部９０ａとは略同径である。   Further, the boss portions 82f are on the inner surface of the stress absorbing portion 82b, and more specifically, are arranged at substantially equal intervals on the circumference centered on the central point of the stress absorbing portion 82b. Here, the respective center positions of the boss portion 82 f coincide with the respective center positions of the hole portions 51 a of the metal plate 51 and the respective center positions of the hole portions 90 a of the packing 90. Further, the boss portion 82f is slightly smaller than the diameter of the hole portion 51a, and the hole portion 51a and the hole portion 90a have substantially the same diameter.

従って、パッキン９０の孔部９０ａをボス部８２ｆに挿入させることにより筐体８２に当接させることができ、さらに、金属板５１の孔部５１ａをボス部８２ｆに挿入させることによりパッキン９０に当接させることができる。これらのボス部８２ｆは、感熱部１２を筐体８２に溶着するための被溶着部であり、従って、図５に示すように、筐体８２、パッキン９０、及び、感熱部１２が密着した状態で、ボス部８２ｆを超音波や熱によって溶かすと、ボス部８２ｆが孔部５１ａに溶着し、感熱部１２と筐体８２とが、パッキン９０を介して接続される。すなわち、ボス部８２ｆと孔部５１ａとは、感熱部１２と筐体８２との相互の接続を行う接続手段を構成する。   Therefore, the hole 90a of the packing 90 can be brought into contact with the casing 82 by inserting it into the boss 82f, and the hole 90a of the metal plate 51 can be brought into contact with the packing 90 by inserting into the boss 82f. Can be touched. These boss portions 82f are welded portions for welding the heat sensitive portion 12 to the housing 82, and therefore the housing 82, the packing 90, and the heat sensitive portion 12 are in close contact with each other as shown in FIG. When the boss portion 82f is melted by ultrasonic waves or heat, the boss portion 82f is welded to the hole 51a, and the heat sensitive portion 12 and the casing 82 are connected via the packing 90. That is, the boss portion 82f and the hole portion 51a constitute connection means for connecting the heat sensitive portion 12 and the casing 82 to each other.

（歪みの吸収について）
このように接続された状態において、感熱部１２と筐体８２とは、応力吸収部８２ｂのみを介して接続されている。より詳細には、図５に示すように、感熱部１２は、筐体８２のボス部８２ｆの部分でのみ接続されており、これらのボス部８２ｆは、応力吸収部８２ｂ上に形成されている。この応力吸収部８２ｂの厚さは薄いため、筐体８２の歪みや、周囲温度が変化した場合の感熱部１２と筐体８２との熱膨張率の違いによる歪みを吸収することができる。このため、センサ部３０が歪みに起因する圧電効果により電界を発生することによる感熱部１２の誤動作を防ぎ、さらには、感熱部１２と筐体８２との剥がれや、感熱部１２又は筐体８２の破損を防止することができる。 (About strain absorption)
In such a connected state, the heat sensitive part 12 and the casing 82 are connected only through the stress absorbing part 82b. More specifically, as shown in FIG. 5, the heat sensitive part 12 is connected only at the boss part 82 f of the casing 82, and these boss parts 82 f are formed on the stress absorbing part 82 b. . Since the thickness of the stress absorbing portion 82b is thin, it is possible to absorb the distortion of the casing 82 and the distortion due to the difference in thermal expansion coefficient between the heat sensitive section 12 and the casing 82 when the ambient temperature changes. For this reason, the malfunction of the heat-sensitive part 12 due to the sensor unit 30 generating an electric field due to the piezoelectric effect caused by the distortion is prevented, and further, the heat-sensitive part 12 and the casing 82 are peeled off, the heat-sensitive part 12 or the case 82. Can be prevented from being damaged.

（熱容量について）
ここで、パッキン９０は、略薄厚円環形をしており、その内径は、センサ部３０の外径と略同じか、又は、センサ部３０の外径より若干大きい。従って、パッキン９０を感熱部１２に当接した状態において、センサ部３０と監視領域との間にパッキン９０が介在しないので、監視領域からセンサ部３０への熱伝達がパッキン９０によって阻害されることがなく、センサ部３０の熱応答性を高めることができる。また、開口部８２ｃの外径は、センサ部３０の外径と略同じか、又は、センサ部３０の外径より若干大きく、パッキン９０の内径と略同径である。従って、感熱部１２と、パッキン９０と、筐体８２とがお互いに接触した状態において、センサ部３０と監視領域との間に応力吸収部８２ｂが介在しないので、監視領域からセンサ部３０への熱伝達が応力吸収部８２ｂによって阻害されることがなく、センサ部３０の熱応答性を高めることができる。 (About heat capacity)
Here, the packing 90 has a substantially thin annular shape, and the inner diameter thereof is substantially the same as the outer diameter of the sensor unit 30 or slightly larger than the outer diameter of the sensor unit 30. Accordingly, since the packing 90 is not interposed between the sensor unit 30 and the monitoring region in a state where the packing 90 is in contact with the heat sensitive unit 12, heat transfer from the monitoring region to the sensor unit 30 is hindered by the packing 90. The thermal response of the sensor unit 30 can be improved. Further, the outer diameter of the opening 82 c is substantially the same as the outer diameter of the sensor part 30 or slightly larger than the outer diameter of the sensor part 30 and is substantially the same as the inner diameter of the packing 90. Therefore, in the state in which the heat sensitive part 12, the packing 90, and the casing 82 are in contact with each other, the stress absorbing part 82b is not interposed between the sensor part 30 and the monitoring area, so Heat transfer is not hindered by the stress absorbing part 82b, and the thermal responsiveness of the sensor part 30 can be enhanced.

この結果、上記の接続構造において、監視領域からの熱を直接、金属板５１が受け取ることになる。ここで、金属板５１の厚みは、従来の筐体と接着剤とを合わせた厚さより、大幅に薄くすることができ、センサ部３０は、実施の形態１と比較しても、ラミネート部６０が省略されているのでその熱容量がさらに小さくなり、監視領域からの熱が感熱部１２に伝わりやすくなり、感熱部１２の熱応答性が向上する。   As a result, in the above connection structure, the metal plate 51 directly receives heat from the monitoring region. Here, the thickness of the metal plate 51 can be made significantly thinner than the combined thickness of the conventional casing and the adhesive. Is omitted, the heat capacity is further reduced, heat from the monitoring region is easily transmitted to the heat sensitive part 12, and the thermal responsiveness of the heat sensitive part 12 is improved.

（保護手段について）
また、パッキン９０の外径は、金属板５１の外径と略同径か、又は、金属板５１の外径より若干大きい。従って、パッキン９０を感熱部１２に当接して筐体８２に固定した状態において、少なくともパッキン９０の外周縁が筐体８２に当接し、パッキン９０が感熱部１２と筐体８２との間の隙間を塞ぐことができる。 (Protection measures)
Further, the outer diameter of the packing 90 is substantially the same as the outer diameter of the metal plate 51 or slightly larger than the outer diameter of the metal plate 51. Therefore, in a state where the packing 90 is in contact with the heat-sensitive portion 12 and fixed to the housing 82, at least the outer peripheral edge of the packing 90 contacts the housing 82, and the packing 90 is a gap between the heat-sensitive portion 12 and the housing 82. Can be blocked.

この結果、上記の接続構造において、感熱部１２と筐体８２とが、パッキン９０を挟んで接続されることにより、密閉されるため、監視領域から開口部８２ｃを介して筐体８２の内部へ塵や水分等の異物が侵入することを防ぐことができる。すなわち、上述したように、パッキン９０は、特許請求の範囲における保護手段に対応する。   As a result, in the above connection structure, the heat-sensitive part 12 and the casing 82 are sealed by being connected with the packing 90 interposed therebetween, so that they are sealed from the monitoring region to the inside of the casing 82 through the opening 82c. Intrusion of foreign matter such as dust and moisture can be prevented. That is, as described above, the packing 90 corresponds to the protection means in the claims.

（生産性について）
さらに、感熱部１２と筐体２２との接続は、上述のように、ボス部８２ｆの溶融による、孔部５１ａとの溶着である。この溶着作業は、従来の接着作業に比べて短時間で終わるため、従来のように接着剤が固まるまで感熱部と筐体とを仮固定する必要がなく接続作業が容易になるとともに、接着剤自体の保存や取り扱い等の管理も不要となり、熱感知器２の生産効率を向上させることができる。 (About productivity)
Furthermore, the connection between the heat sensitive part 12 and the housing 22 is welding with the hole 51a by melting the boss part 82f as described above. Since this welding operation is completed in a shorter time than the conventional bonding operation, it is not necessary to temporarily fix the heat-sensitive part and the housing until the adhesive is hardened as in the conventional case, and the connection operation is facilitated. It is not necessary to manage the storage and handling of the device itself, and the production efficiency of the heat sensor 2 can be improved.

（実施の形態３）
次に、実施の形態３について説明する。本実施の形態３に係る熱感知器は、概略的に、実施の形態１と略同様の特徴を有するが、感熱部を、筐体に設けられた応力吸収部を介して、監視領域に露出させたことを主たる特徴とする。 (Embodiment 3)
Next, Embodiment 3 will be described. The heat detector according to the third embodiment generally has substantially the same characteristics as those in the first embodiment, but the heat sensitive part is exposed to the monitoring region via the stress absorbing part provided in the housing. The main feature is that

（全体構成について）
図９は、感熱部１２と筐体８３とを接続した状態における熱感知器３の縦断面図、図１０は、感熱部１２と筐体８３とを接続する前の状態における熱感知器３の縦断面図である。なお、特に説明なき構造については、上述した実施の形態１と同様であり、同一の構成を同一の符号を付して説明する。この熱感知器３は、感熱部１２と感知器本体２３とを備えて構成されている。 (About overall structure)
FIG. 9 is a longitudinal sectional view of the heat detector 3 in a state in which the heat sensitive unit 12 and the housing 83 are connected, and FIG. 10 is a view of the heat sensor 3 in a state before the heat sensitive unit 12 and the housing 83 are connected. It is a longitudinal cross-sectional view. Note that a structure that is not particularly described is the same as that of the first embodiment described above, and the same configuration is described with the same reference numeral. The heat sensor 3 includes a heat sensitive part 12 and a sensor main body 23.

（感知器本体の構成について）
次に、感知器本体２３の構成を説明する。感知器本体２３は、実施の形態１の筐体８１に代えて、筐体８３を備えて構成されている。図１１は、筐体本体８４と感熱部材取付け部８５とを接続する前の状態における筐体８３の縦断面図である。図１１に示すように、筐体８３は、筐体本体８４と、感熱部１２を取付ける感熱部材取付け部８５とを備えて構成されている。ここで、筐体本体８４は、取付け部８４ａを備えている。さらに、感熱部材取付け部８５は、取付け部８５ａと接続面部８３ａとを備えている。ここで、取付け部８４ａと取付け部８５ａとは、筐体本体８４に感熱部材取付け部８５を接続する接続手段である。 (Regarding the structure of the sensor body)
Next, the configuration of the sensor body 23 will be described. The sensor body 23 includes a housing 83 instead of the housing 81 of the first embodiment. FIG. 11 is a longitudinal sectional view of the housing 83 in a state before the housing body 84 and the heat sensitive member attaching portion 85 are connected. As shown in FIG. 11, the housing 83 includes a housing body 84 and a heat sensitive member attaching portion 85 to which the heat sensitive portion 12 is attached. Here, the housing main body 84 includes an attachment portion 84a. Furthermore, the heat sensitive member attachment portion 85 includes an attachment portion 85a and a connection surface portion 83a. Here, the attachment portion 84 a and the attachment portion 85 a are connection means for connecting the heat sensitive member attachment portion 85 to the housing body 84.

ここで、筐体本体８４と感熱部材取付け部８５とは、別々に樹脂成型された後に、筐体本体８４に感熱部材取付け部８５をインサート成型することにより、接続部８４ａと取付け部８５ａの部分でお互いに接続される。これは以下の理由による。すなわち、熱感知器３の熱応答性を向上させるためには、感熱部１２と監視領域の間にある接続面部８３ａを薄くして、接続面部８３ａの熱容量を小さくすればよい。しかしながら、薄膜部を有する構造を一括で成型することは難しいため、薄膜部を有する感熱部材取付け部８５を樹脂成型後、別途樹脂成型された筐体本体８４にインサート成型することにより、本問題を解決している。この結果、筐体８３を容易に製作することができ、筐体８３の歩留まりを向上させることができる。ここで、感熱部材取付け部８５は、特許請求の範囲における取付け手段に対応する。なお、筐体本体８４と感熱部材取付け部８５とは、インサート成型でなく、溶着や接着にて一体化してもよい。   Here, after the housing body 84 and the heat sensitive member attaching portion 85 are separately resin-molded, the heat sensitive member attaching portion 85 is insert-molded into the housing main body 84, thereby connecting the connecting portion 84a and the attaching portion 85a. Connected to each other. This is due to the following reason. That is, in order to improve the thermal responsiveness of the heat detector 3, the connection surface portion 83a between the heat sensitive portion 12 and the monitoring region may be thinned to reduce the heat capacity of the connection surface portion 83a. However, since it is difficult to mold the structure having the thin film portion at once, this problem can be solved by insert-molding the thermosensitive member mounting portion 85 having the thin film portion into the case body 84 separately molded after resin molding. It has been solved. As a result, the housing 83 can be easily manufactured, and the yield of the housing 83 can be improved. Here, the heat sensitive member attaching portion 85 corresponds to the attaching means in the claims. The housing body 84 and the heat sensitive member attaching portion 85 may be integrated by welding or bonding instead of insert molding.

（感熱部と筐体との接続構造について）
さらに、感熱部１２と筐体８３との接続構造について、より詳細に説明する。接続面部８３ａは、感熱部材取付け部８５において、取付け部８５ａと反対側の下端部近傍の内側に形成された、略円盤形である。接続面部８３ａは、応力吸収部８３ｂとボス部８３ｆとを備えて構成されている。また、応力吸収部８３ｂは、接続面部８３ａと略同心の略薄厚円盤形をしており、その内側面が、接続面部８３ａに対して薄くなっている。その厚さは、任意であるが、強度、応力吸収特性、形成容易性、及び、熱応答性を考慮して、０．２ｍｍ以下となっている。また、その外径は、金属板５１の外径より若干大きい。 (About the connection structure between the heat sensitive part and the chassis)
Further, the connection structure between the heat sensitive part 12 and the housing 83 will be described in more detail. The connection surface portion 83a has a substantially disk shape formed inside the vicinity of the lower end on the opposite side of the attachment portion 85a in the heat sensitive member attachment portion 85. The connection surface portion 83a includes a stress absorbing portion 83b and a boss portion 83f. The stress absorbing portion 83b has a substantially thin disk shape that is substantially concentric with the connection surface portion 83a, and has an inner surface that is thinner than the connection surface portion 83a. The thickness is arbitrary, but is 0.2 mm or less in consideration of strength, stress absorption characteristics, ease of formation, and thermal response. Further, the outer diameter is slightly larger than the outer diameter of the metal plate 51.

ここで、応力吸収部８３ｂと接続面部８３ａとの境界における段差部分の長さは、金属部５１とセンサ部３０とを合わせた厚さ方向の長さよりも若干大きい。このため、金属部５１とセンサ部３０とを、応力吸収部８３ｂに対して内側から押付けると、金属部５１とセンサ部３０とが、接続面部８３ａと応力吸収部８３ｂとで形成された空間に収容されることができ、センサ部３０の位置がほぼ決定される。ここで、応力吸収部８３ｂは、特許請求の範囲における応力吸収部に対応する。また、ボス部８３ｆは、実施の形態２におけるボス部８２ｆと同じである。図１０と図１１では、ボス部８３ｆは２個しか図示されていないが、実際には、さらに多くのボス部８３ｆ、例えば、全部で６個のボス部８３ｆが存在している。   Here, the length of the step portion at the boundary between the stress absorbing portion 83 b and the connection surface portion 83 a is slightly larger than the length in the thickness direction of the metal portion 51 and the sensor portion 30 combined. For this reason, when the metal part 51 and the sensor part 30 are pressed against the stress absorbing part 83b from the inner side, the metal part 51 and the sensor part 30 are formed by the connection surface part 83a and the stress absorbing part 83b. The position of the sensor unit 30 is almost determined. Here, the stress absorbing portion 83b corresponds to the stress absorbing portion in the claims. The boss portion 83f is the same as the boss portion 82f in the second embodiment. 10 and 11, only two boss portions 83f are shown, but actually, there are more boss portions 83f, for example, a total of six boss portions 83f.

ここで、筐体８３に金属板５１の外側面を、孔部５１ａにボス部８３ｆを挿入させることにより当接させることができる。これらのボス部８３ｆは、感熱部１２を筐体８３に溶着するための被溶着部であり、従って、図１０に示すように、筐体８３と感熱部１２が密着した状態で、ボス部８３ｆを超音波や熱によって溶かすと、ボス部８３ｆが孔部５１ａに溶着し、感熱部１２と筐体８３とが接続される。すなわち、ボス部８３ｆと孔部５１ａとは、感熱部１２と筐体８３との相互の接続を行う接続手段を構成する。   Here, the outer surface of the metal plate 51 can be brought into contact with the housing 83 by inserting the boss 83f into the hole 51a. These boss portions 83f are welded portions for welding the heat-sensitive portion 12 to the housing 83. Therefore, as shown in FIG. 10, the boss portion 83f is in a state where the housing 83 and the heat-sensitive portion 12 are in close contact with each other. Is melted by ultrasonic waves or heat, the boss portion 83f is welded to the hole portion 51a, and the heat sensitive portion 12 and the housing 83 are connected. That is, the boss portion 83f and the hole portion 51a constitute connection means for connecting the heat sensitive portion 12 and the housing 83 to each other.

（歪みの吸収について）
このように接続された状態において、感熱部１２と筐体８３とは、応力吸収部８３ｂのみを介して接続されている。より詳細には、図１０に示すように、感熱部１２は、筐体８３のボス部８３ｆの部分でのみ接続されており、これらのボス部８３ｆは、応力吸収部８３ｂ上に形成されている。この応力吸収部８３ｂの厚さは薄いため、筐体８３の歪みや、周囲温度が変化した場合の感熱部１２と筐体８３との熱膨張率の違いによる歪みを吸収することができる。このため、センサ部３０が歪みに起因する圧電効果により電界を発生することによる感熱部１２の誤動作を防ぎ、さらには、感熱部１２と筐体８３との剥がれや、感熱部１２又は筐体８３の破損を防止することができる。 (About strain absorption)
In such a connected state, the heat sensitive part 12 and the housing 83 are connected only via the stress absorbing part 83b. More specifically, as shown in FIG. 10, the heat sensitive part 12 is connected only at the boss part 83f of the housing 83, and these boss parts 83f are formed on the stress absorbing part 83b. . Since the stress absorbing portion 83b is thin, it is possible to absorb the distortion of the casing 83 and the distortion due to the difference in thermal expansion coefficient between the heat sensitive section 12 and the casing 83 when the ambient temperature changes. For this reason, the malfunction of the heat-sensitive part 12 due to the sensor unit 30 generating an electric field due to the piezoelectric effect due to distortion is prevented, and further, the heat-sensitive part 12 and the casing 83 are peeled off, the heat-sensitive part 12 or the case 83 Can be prevented from being damaged.

（熱容量について）
このように接続された状態において、感熱部１２のセンサ部３０と、監視領域との間には、金属板５１と応力吸収部８３ｂのみが介在することになる。従って、これら金属板５１と応力吸収部８３ｂとの厚みは、従来の筐体と接着剤とを合わせた厚さより、大幅に薄くすることができる。このため、センサ部３０と監視領域との間の熱容量が小さくなり、監視領域からの熱が感熱部１２に伝わりやすくなり、その結果、感熱部１２の熱応答性が向上する。 (About heat capacity)
In such a connected state, only the metal plate 51 and the stress absorbing portion 83b are interposed between the sensor unit 30 of the heat sensitive unit 12 and the monitoring region. Accordingly, the thickness of the metal plate 51 and the stress absorbing portion 83b can be made significantly thinner than the combined thickness of the conventional casing and the adhesive. For this reason, the heat capacity between the sensor unit 30 and the monitoring region is reduced, and the heat from the monitoring region is easily transmitted to the heat sensitive unit 12, and as a result, the thermal responsiveness of the heat sensitive unit 12 is improved.

（生産性について）
さらに、感熱部１２と筐体８３との接続は、上述のように、ボス部８３ｆの溶融による、孔部５１ａとの溶着である。この溶着作業は、従来の接着作業に比べて短時間で終わるため、従来のように接着剤が固まるまで感熱部と筐体とを仮固定する必要がなく接続作業が容易になるとともに、接着剤自体の保存や取り扱い等の管理も不要となり、熱感知器３の生産効率を向上させることができる。 (About productivity)
Furthermore, the connection between the heat-sensitive part 12 and the housing 83 is welding with the hole 51a by melting the boss part 83f as described above. Since this welding operation is completed in a shorter time than the conventional bonding operation, it is not necessary to temporarily fix the heat-sensitive part and the housing until the adhesive is hardened as in the conventional case, and the connection operation is facilitated. It is not necessary to manage the storage and handling of the device itself, and the production efficiency of the heat sensor 3 can be improved.

（筐体の歩留まりについて）
さらに、上述したように、筐体８３は、筐体本体８４に、応力吸収部８３ｂを有する感熱部材取付け部８５をインサート成型することにより、形成されている。応力吸収部８３ｂを有する感熱部材取付け部８５の成型は、応力吸収部８３ｂを有する筐体８３を一括して成型することに比べて容易であるため、筐体８３の歩留まりを向上させることができ、ひいては、熱感知器３の生産性を向上させることができる。 (About housing yield)
Further, as described above, the housing 83 is formed by insert-molding the heat-sensitive member attaching portion 85 having the stress absorbing portion 83b in the housing main body 84. Since the molding of the heat sensitive member attaching portion 85 having the stress absorbing portion 83b is easier than molding the housing 83 having the stress absorbing portion 83b in a lump, the yield of the housing 83 can be improved. As a result, the productivity of the heat sensor 3 can be improved.

〔ＩＩＩ〕実施の形態に対する変形例
以上、本発明の各実施の形態について説明したが、本発明の具体的な構成及び手段は、特許請求の範囲に記載した各発明の技術的思想の範囲内において、任意に改変及び改良することができる。以下、このような変形例について説明する。 [III] Modifications to Embodiments Although the embodiments of the present invention have been described above, the specific configuration and means of the present invention are within the scope of the technical idea of each invention described in the claims. Can be arbitrarily modified and improved. Hereinafter, such a modification will be described.

（本発明の適用分野について）
本発明の適用対象は、上述したような熱感知器１には限られず、監視領域における熱を感知する全ての機器、例えば、熱検出器や熱線センサにも適用できる。 (Regarding the field of application of the present invention)
The application target of the present invention is not limited to the heat sensor 1 as described above, and can be applied to all devices that sense heat in the monitoring region, for example, a heat detector or a heat ray sensor.

（解決しようとする課題や発明の効果について）
まず、発明が解決しようとする課題や発明の効果は、前記した内容に限定されるものではなく、本発明によって、前記に記載されていない課題を解決したり、前記に記載されていない効果を奏することもでき、また、記載されている課題の一部のみを解決したり、記載されている効果の一部のみを奏することがある。例えば、応力吸収手段は、感熱部の歪みを完全に吸収できなくても、ある程度吸収できれば、本発明の課題が達成されている。 (About problems to be solved and effects of the invention)
First, the problems to be solved by the invention and the effects of the invention are not limited to the above-described contents, and the present invention solves the problems not described above or has the effects not described above. There are also cases where only some of the described problems are solved or only some of the described effects are achieved. For example, even if the stress absorbing means cannot absorb the distortion of the heat sensitive part completely, the object of the present invention can be achieved as long as it can absorb to some extent.

（感熱部）
感熱部は、監視領域における熱を感知できれば、どの様な構成でもよい。例えば、センサ部と電極金属部と金属部以外に、他の構成部があってもよい。また、電極金属部や金属部は、他の金属や導電性物質でもよく、センサ部の強誘電性物質は、薄膜状でなくてもよい。 (Thermosensitive part)
The heat sensitive part may have any configuration as long as it can sense heat in the monitoring region. For example, in addition to the sensor unit, the electrode metal unit, and the metal unit, there may be other components. Further, the electrode metal part or the metal part may be another metal or a conductive substance, and the ferroelectric substance of the sensor part may not be a thin film.

（応力吸収手段）
また、応力吸収手段は、筐体等の歪みを吸収できれば、どの様な方法でもよい。例えば、ラミネート部において、ラミネート内材をなくして、ラミネート外材と金属部とを直接接着剤で接着してもよい。 (Stress absorption means)
Further, the stress absorbing means may be any method as long as it can absorb the distortion of the housing or the like. For example, in the laminate portion, the laminate inner material may be eliminated, and the laminate outer material and the metal portion may be directly bonded with an adhesive.

（保護手段）
また、保護手段は、筐体内部への異物侵入が防げれば、接着剤、パテ、その他どの様な方法でもよい。例えば、感熱部と筐体との接続後、感熱部と筐体との隙間をパテで埋めることにより、異物の侵入を防ぐことができる。 (Protection measures)
Further, the protective means may be any method such as adhesive, putty, etc. as long as foreign matter can be prevented from entering the inside of the housing. For example, after connecting the heat-sensitive part and the housing, the gap between the heat-sensitive part and the housing is filled with a putty, thereby preventing foreign matter from entering.

（感熱部と応力吸収部との接続）
また、感熱部と応力吸収部との接続は、感熱部と応力吸収部とが接続できれば、どの様な方法でもよい。例えば、応力吸収部に設けられたボスと金属板に設けられた孔の数は何個でもよく、ボスと孔の配置が対応していれば、どのように配置されていてもよい。また、ボスの形状は、円柱、その他どのような形状でもよく、対応する感熱部の接続手段は、孔ではなく、金属板に設けられたＵ溝、その他どのような形状でもよい。 (Connection between heat sensitive part and stress absorbing part)
Further, the heat sensitive part and the stress absorbing part may be connected by any method as long as the heat sensitive part and the stress absorbing part can be connected. For example, the number of the bosses provided in the stress absorbing portion and the number of holes provided in the metal plate may be any number, and the bosses and the holes may be arranged in any manner as long as they correspond to each other. The shape of the boss may be a cylinder or any other shape, and the corresponding connecting portion of the heat sensitive part may be a U groove provided in a metal plate, not a hole, or any other shape.

（筐体本体と感熱部材取付け部との接続）
また、筐体本体と感熱部材取付け部との接続は、筐体本体と感熱部材取付け部とが接続できれば、接着剤、溶着、粘着テープ、金具その他どの様な方法でもよい。例えば、筐体本体の取付け部と感熱部材取付け部の取付け部とを接着剤を使って接続することができる。 (Connection between the chassis body and the heat sensitive member mounting part)
Further, the connection between the casing main body and the heat sensitive member attaching portion may be any method such as adhesive, welding, adhesive tape, metal fitting, etc. as long as the casing main body and the heat sensitive member attaching portion can be connected. For example, the attachment portion of the housing body and the attachment portion of the heat sensitive member attachment portion can be connected using an adhesive.

この発明は、熱感知器や火災報知器等の、熱を感知して、感知状態に応じて警報を行う様々な機器に適用でき、熱感知器や火災報知器の感知精度と、信頼性と、生産効率とを向上させることに有用である。   The present invention can be applied to various devices such as a heat detector and a fire alarm that detect heat and give an alarm according to the detection state. The detection accuracy and reliability of the heat detector and the fire alarm Useful for improving production efficiency.

感熱部と筐体とを接続した状態における熱感知器の縦断面図である。It is a longitudinal cross-sectional view of the heat sensor in the state which connected the heat sensitive part and the housing | casing. 感熱部と筐体とを接続する前の状態における熱感知器の縦断面図である。It is a longitudinal cross-sectional view of the heat sensor in the state before connecting a heat sensitive part and a housing | casing. ラミネート部に挟持されている状態における感熱部の平面図及び縦断面図を関連させて示した図である。It is the figure which linked and showed the top view and longitudinal cross-sectional view of the heat sensitive part in the state clamped by the laminate part. 感熱部の平面図と縦断面図を関連させて示した図である。It is the figure which linked and showed the top view and longitudinal cross-sectional view of a thermal part. 感熱部と筐体とを接続した状態における熱感知器の縦断面図である。It is a longitudinal cross-sectional view of the heat sensor in the state which connected the heat sensitive part and the housing | casing. 感熱部と筐体とを接続する前の状態における熱感知器の縦断面図である。It is a longitudinal cross-sectional view of the heat sensor in the state before connecting a heat sensitive part and a housing | casing. 感熱部の平面図及び縦断面図を関連させて示した図である。It is the figure which linked and showed the top view and longitudinal cross-sectional view of a heat sensitive part. パッキンの平面図及び縦断面図を関連させて示した図である。It is the figure which linked and showed the top view and longitudinal cross-sectional view of packing. 感熱部と筐体とを接続した状態における熱感知器の縦断面図である。It is a longitudinal cross-sectional view of the heat sensor in the state which connected the heat sensitive part and the housing | casing. 感熱部と筐体とを接続する前の状態における熱感知器の縦断面図である。It is a longitudinal cross-sectional view of the heat sensor in the state before connecting a heat sensitive part and a housing | casing. 筐体本体と感熱部材取付け部とを接続する前の状態における筐体の縦断面図である。It is a longitudinal cross-sectional view of the housing | casing in the state before connecting a housing body and a thermal member attachment part. 従来の、熱感知器の縦断面図である。It is a longitudinal cross-sectional view of the conventional heat sensor.

符号の説明Explanation of symbols

Ｃ 天井
Ｗ 間隔
１、２、３ 熱感知器
１０、１１、１２ 感熱部
２０ 本体部
２１、２２、２３ 感熱器本体
３０ センサ部
４０ 電極金属部
５０、５１ 金属板
５１ａ 孔部
６０ ラミネート部
６１ ラミネート外材
６１ａ、８１ｄ 接続部
６２ ラミネート内材
６２ａ 切欠き部
８０、８１、８２、８３ 筐体
８１ａ、８２ａ、８３ａ 接続面部
８１ｃ、８２ｃ 開口部
８１ｅ 外端部
８２ｂ、８３ｂ 応力吸収部
８２ｆ、８３ｆ ボス部
８４ 制御取付け部
８５ 感熱取付け部
８４ａ、８５ａ 取付け部
９０ パッキン
９０ａ 孔部

C Ceiling W Interval 1, 2, 3 Heat detector 10, 11, 12 Heat sensitive part 20 Main part 21, 22, 23 Heat sensitive element main body 30 Sensor part 40 Electrode metal part 50, 51 Metal plate 51a Hole part 60 Laminating part 61 Laminating Outer member 61a, 81d Connection part 62 Laminate inner member 62a Notch part 80, 81, 82, 83 Housing 81a, 82a, 83a Connection surface part 81c, 82c Opening part 81e Outer end part 82b, 83b Stress absorption part 82f, 83f Boss part 84 Control mounting portion 85 Heat-sensitive mounting portion 84a, 85a Mounting portion 90 Packing 90a Hole

Claims (9)

監視領域における熱を感知する感熱手段と、当該感熱手段による感知状態に応じて警報を行う制御手段と、当該制御手段を保護する筐体とを備えた熱感知器において、
前記感熱手段と前記筐体とを、当該感熱手段の歪みを吸収するための応力吸収手段を介して固定したこと、
を特徴とする熱感知器。 In a heat sensor comprising a heat sensing means for sensing heat in the monitoring region, a control means for giving an alarm according to a sensing state by the heat sensing means, and a housing for protecting the control means,
Fixing the heat sensitive means and the housing via a stress absorbing means for absorbing distortion of the heat sensitive means;
A heat sensor characterized by 前記応力吸収手段は、前記感熱手段を覆うように設けられたものであって、前記筐体と接続された薄板状部材であることを特徴とする請求項１に記載の熱感知器。   2. The heat sensor according to claim 1, wherein the stress absorbing means is a thin plate-like member provided so as to cover the heat sensitive means and connected to the housing. 前記感熱手段は、前記薄板状部材と、粘着性フィルムとにより、挟持されることを特徴とする請求項２に記載の熱感知器。   The heat sensor according to claim 2, wherein the heat sensitive means is sandwiched between the thin plate member and the adhesive film. 前記筐体に、前記薄板状部材を溶着接続したこと、
を特徴とする請求項２又は３に記載の熱感知器。 The thin plate member is welded and connected to the housing;
The heat sensor according to claim 2 or 3, characterized by the above-mentioned. 前記応力吸収手段は、前記筐体に一体に成型された応力吸収部であること、
を特徴とする請求項１に記載の熱感知器。 The stress absorbing means is a stress absorbing portion formed integrally with the casing;
The heat sensor according to claim 1. 前記応力吸収部に、前記感熱手段を溶着接続したこと、
を特徴とする請求項５に記載の熱感知器。 The heat-sensitive means is welded and connected to the stress absorbing portion,
The heat sensor according to claim 5. 前記筐体は、当該筐体に対して、別体成型された取付け手段を有し、
前記取付け手段に前記応力吸収部を一体成型したこと、
を特徴とする請求項５又は６に記載の熱感知器。 The case has attachment means molded separately from the case,
The stress absorbing part is integrally molded with the attachment means;
The heat sensor according to claim 5 or 6. 前記感熱手段を、前記監視領域へ、直接的に、又は、前記応力吸収手段を介して、露出させたこと、
を特徴とする請求項１から７のいずれか一つに記載の熱感知器。 Exposing the heat-sensitive means to the monitoring area directly or via the stress absorbing means;
The heat sensor according to claim 1, wherein 前記感熱手段と前記筐体との間に、前記監視領域から前記筐体内部への異物の侵入を防止するための保護手段を設けたこと、
を特徴とする請求項１から８のいずれか一つに記載の熱感知器。
Provided between the heat sensitive means and the housing, a protective means for preventing foreign matter from entering the housing from the monitoring area,
The heat sensor according to any one of claims 1 to 8, wherein:
JP2005030982A 2005-02-07 2005-02-07 Heat sensor Expired - Fee Related JP4585877B2 (en)

Priority Applications (10)

Application Number Priority Date Filing Date Title
JP2005030982A JP4585877B2 (en) 2005-02-07 2005-02-07 Heat sensor
AU2006211402A AU2006211402B2 (en) 2005-02-07 2006-02-03 Heat detector
PCT/JP2006/301881 WO2006082931A1 (en) 2005-02-07 2006-02-03 Thermal sensor
KR1020077019293A KR20070112455A (en) 2005-02-07 2006-02-03 Thermal sensor
CN2006800042614A CN101116117B (en) 2005-02-07 2006-02-03 Thermal sensor
US11/815,649 US7802918B2 (en) 2005-02-07 2006-02-03 Heat detector
DE112006000369T DE112006000369T5 (en) 2005-02-07 2006-02-03 heat detector
GB0714989A GB2437871B (en) 2005-02-07 2006-02-03 Heat detector with heat detecting unit connected to casing via stress absorber for absorbing distortion
TW095104070A TWI385365B (en) 2005-02-07 2006-02-07 Thermal detector
HK08103125.4A HK1109235A1 (en) 2005-02-07 2008-03-18 Thermal detector

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Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2007200111A (en) * 2006-01-27 2007-08-09 Hochiki Corp Thermal sensor

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN114259671A (en) * 2021-12-31 2022-04-01 苏州久港消防设备有限公司 Temperature and electricity double-control fire extinguisher

Citations (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS59924U (en) * 1982-06-24 1984-01-06 ティーディーケイ株式会社 temperature sensor
JPH0224800A (en) * 1988-07-14 1990-01-26 Nohmi Bosai Ltd Constant temperature type spot sensor
JPH02253128A (en) * 1989-03-27 1990-10-11 Matsushita Electric Ind Co Ltd Pyroelectric type steam sensor and high-frequency heater with pyroelectric type sensor
JPH06160423A (en) * 1992-11-20 1994-06-07 Hitachi Ltd Capacitive acceleration detector
JPH09159546A (en) * 1995-12-12 1997-06-20 Matsushita Electric Ind Co Ltd Temperature sensor
JPH09159545A (en) * 1995-12-11 1997-06-20 Matsushita Electric Ind Co Ltd Temperature sensor
JPH10103235A (en) * 1996-09-26 1998-04-21 Sanyo Electric Co Ltd Temperature sensor and cryopump with the temperature sensor
JP2000298061A (en) * 1999-04-14 2000-10-24 Murata Mfg Co Ltd Infrared ray sensor
JP2003196760A (en) * 2001-12-27 2003-07-11 Hochiki Corp Fire detector
JP2004272702A (en) * 2003-03-10 2004-09-30 Hochiki Corp Fire sensor
JP2004310473A (en) * 2003-04-08 2004-11-04 Nohmi Bosai Ltd Fire sensor

Family Cites Families (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB2215513B (en) * 1988-03-02 1991-02-06 Philips Electronic Associated Pyroelectric infra-red detectors and their method of manufacture
CN2075339U (en) * 1990-03-07 1991-04-17 中国科学院物理研究所 New structure for lastr radiation detector

Patent Citations (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS59924U (en) * 1982-06-24 1984-01-06 ティーディーケイ株式会社 temperature sensor
JPH0224800A (en) * 1988-07-14 1990-01-26 Nohmi Bosai Ltd Constant temperature type spot sensor
JPH02253128A (en) * 1989-03-27 1990-10-11 Matsushita Electric Ind Co Ltd Pyroelectric type steam sensor and high-frequency heater with pyroelectric type sensor
JPH06160423A (en) * 1992-11-20 1994-06-07 Hitachi Ltd Capacitive acceleration detector
JPH09159545A (en) * 1995-12-11 1997-06-20 Matsushita Electric Ind Co Ltd Temperature sensor
JPH09159546A (en) * 1995-12-12 1997-06-20 Matsushita Electric Ind Co Ltd Temperature sensor
JPH10103235A (en) * 1996-09-26 1998-04-21 Sanyo Electric Co Ltd Temperature sensor and cryopump with the temperature sensor
JP2000298061A (en) * 1999-04-14 2000-10-24 Murata Mfg Co Ltd Infrared ray sensor
JP2003196760A (en) * 2001-12-27 2003-07-11 Hochiki Corp Fire detector
JP2004272702A (en) * 2003-03-10 2004-09-30 Hochiki Corp Fire sensor
JP2004310473A (en) * 2003-04-08 2004-11-04 Nohmi Bosai Ltd Fire sensor

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2007200111A (en) * 2006-01-27 2007-08-09 Hochiki Corp Thermal sensor
JP4592603B2 (en) * 2006-01-27 2010-12-01 ホーチキ株式会社 Heat sensor

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