JP2006213789A - Curable organopolysiloxane composition and semiconductor device - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a curable organopolysiloxane composition having high transparency, and a semiconductor device whose semiconductor element is sealed with the cured product of the composition. <P>SOLUTION: This curable organopolysiloxane composition comprises (A) an organopolysiloxane having at least 0.2 piece per one molecule on average of alkenyl group bound to a silicon atom, (B) a three-dimensionally network-structured organopolysiloxane having 400-5,000 ppm hydroxy group content each bound to a silicon atom, (C) an organohydrogenpolysiloxane having at least two hydrogen atoms each bound to a silicon atom in one molecule, and (D) a catalyst for hydrosilylation reaction. The semiconductor device in which semiconductor elements are coated with the cured product of the curable organopolysiloxane composition is provided. <P>COPYRIGHT: (C)2006,JPO&NCIPI

Description

  The present invention relates to a curable organopolysiloxane composition and a semiconductor device in which a semiconductor element is coated with the cured product.

  2. Description of the Related Art Conventionally, in a semiconductor device, a semiconductor element is sealed with a resin in order to protect the semiconductor element from an outside air atmosphere or mechanical shock.

For example, Patent Document 1 describes a semiconductor device as shown below. In this semiconductor device, a semiconductor element is die-bonded on a lead frame, and the semiconductor element and the lead frame are wire-bonded with a bonding wire. This semiconductor element is covered with a cured product of a curable organopolysiloxane composition. Furthermore, the semiconductor element covered with the cured product is resin-sealed with a mold resin such as an epoxy resin.
JP 2004-143361 A

  However, when the semiconductor device described in Patent Document 1 is operated at a high voltage, the adhesion between the mold resin and the cured product of the curable organopolysiloxane composition is remarkably reduced, and the mold resin peels off from the interface. There has been a problem that characteristics as a semiconductor device are impaired due to leakage.

  Furthermore, in recent years, sealing properties for semiconductor elements such as curable organopolysiloxane compositions have been required to improve insulation characteristics, and inorganic fillers have been added. When a semiconductor element such as a light emitting diode is used which adversely affects the transparency, there is a problem that the light transmittance is lowered.

  The present invention has been made to cope with such problems, and is a curable organopolysiloxane composition having excellent adhesion between a cured product of a curable organopolysiloxane composition and a mold resin and having high transparency. An object of the present invention is to provide a semiconductor device in which a semiconductor element is sealed with an object and this cured product and has excellent reliability.

The curable organopolysiloxane composition of the present invention comprises
(A) an organopolysiloxane having an average of 0.2 or more silicon-bonded alkenyl groups in one molecule;
(B) Average unit formula:
(R ₃ SiO _1/2 ) _a (SiO _4/2 ) _b
(Wherein R is the same or different substituted or unsubstituted monovalent hydrocarbon group, a and b are each a positive number, and a / b is a number of 0.2 to 3. ) And an organopolysiloxane having a three-dimensional network structure in which the amount of hydroxyl groups bonded to silicon atoms is 400 to 5000 ppm {10 to 80 weights based on the total amount of the components (A) and (B) %},
(C) Organohydrogenpolysiloxane having at least two silicon atom-bonded hydrogen atoms in one molecule {Silicon atom-bonded alkenyl group in component (A) and silicon atom-bonded alkenyl group in component (B) In an amount of 0.2 to 5 mol of silicon-bonded hydrogen atoms in this component}
And (D) a catalyst for hydrosilylation reaction (catalytic amount).

  The semiconductor device of the present invention is characterized in that a semiconductor element is sealed with a cured product of the above curable organopolysiloxane composition.

  According to the curable organopolysiloxane composition of the present invention, it is possible to improve adhesion with a mold resin to prevent peeling and to obtain a cured product having high transparency.

  Further, according to the semiconductor device of the present invention, since the semiconductor element is sealed with the cured product, there is an effect that the reliability is excellent.

  Hereinafter, embodiments of the curable organopolysiloxane composition of the present invention will be described.

[(A) component]
The component (A) is a main component of the present composition and has an average of 0.2 or more silicon-bonded alkenyl groups in one molecule, preferably 0.5 or more on average in one molecule. Preferably, it has an alkenyl group bonded to an average of 2 or more silicon atoms in one molecule. This is because if the average value of alkenyl groups in one molecule is less than the lower limit of the above range, the resulting composition may not be sufficiently cured.

  Examples of the alkenyl group in component (A) include a vinyl group, an allyl group, a butenyl group, a petenyl group, and a hexenyl group, with a vinyl group being particularly preferred.

  The content of the silicon atom-bonded alkenyl group in the silicon atom-bonded all organic group of the component (A) is preferably 0.0003 mol% or more, particularly preferably 0.001 mol% or more. The alkenyl group may be bonded to the silicon atom at the end of the molecular chain, may be bonded to the silicon atom in the middle of the molecular chain, or may be bonded to the both, but the curing rate of the resulting composition, From the viewpoint of physical properties of the cured product, it is preferable that it is bonded to at least silicon atoms at the molecular chain terminals, particularly silicon atoms at both molecular chain terminals.

  Examples of the silicon-bonded organic group other than the alkenyl group of the component (A) include, for example, alkyl groups such as methyl group, ethyl group and propyl group, cycloalkyl groups such as cyclopentyl group and cyclohexyl group, benzyl group and phenethyl group Usually an aralkyl group such as phenyl group, tolyl group, xylyl group, etc., or a halogenated hydrocarbon group in which these hydrogen atoms are partially substituted by chlorine atoms, fluorine atoms, etc. Examples thereof include those having 12 carbon atoms, preferably about 1 to 8 carbon atoms, preferably alkyl groups and aryl groups, and more preferably methyl groups and phenyl groups.

  The molecular structure of the component (A) is not particularly limited, and examples thereof include linear, cyclic, and branched chains. Preferably, the linear structure is used in view of physical properties such as mechanical strength of the cured product. Preferably there is.

  The viscosity at 25 ° C. of such component (A) is 5 to 100,000 mPa · s, and preferably 100 to 50,000 mPa · s. This is because if the viscosity at 25 ° C. is less than the lower limit of the above range, the mechanical strength tends to decrease, whereas if it exceeds the upper limit of the above range, the handling workability tends to decrease. It is.

  Examples of the component (A) include compounds represented by the following general formula.

In the general formula below, R ¹ is the same or different substituted or unsubstituted monovalent hydrocarbon group not containing an aliphatic unsaturated bond, specifically, the alkyl group, the aralkyl group, the aryl group, Examples of the halogenated hydrocarbon group include a methyl group and a phenyl group. X is an alkenyl group, preferably a vinyl group. In the formula, m and n are integers of m ≧ 1 and n ≧ 0. Preferably, m is an integer of 1 to 100 and n is an integer of 5 to 3000.

[Component (B)]
(B) A component is a component which provides the characteristic of this composition from which adhesiveness with mold resin becomes favorable. Average unit formula:
(R ₃ SiO _1/2 ) _a (SiO _4/2 ) _b
In the above formula, R represents the same or different substituted or unsubstituted monovalent hydrocarbon groups, and a and b each represent a positive number.

  Although the molecular weight of such (B) component is not limited, Usually, it is preferable that the weight average molecular weight (Mw) by standard polystyrene conversion exists in the range of 200-20000, especially 500-10000.

  R is, for example, an alkyl group such as methyl, ethyl, propyl, isopropyl, butyl, isobutyl, tert-butyl, hexyl, cyclohexyl, octyl; vinyl, allyl, butenyl An alkenyl group such as a group, a petenyl group or a hexenyl group; an aryl group such as a phenyl group or a tolyl group; an aralkyl group such as a benzyl group or a phenylethyl group; and some or all of the hydrogen atoms of these groups are fluorine. And those substituted with a halogen atom such as chlorine or bromine or a cyano group, such as a chloromethyl group, a bromoethyl group, a trifluoropropyl group, and a cyanoethyl group. This R is preferably the alkyl group, the aryl group, or the alkenyl group, and particularly preferably a methyl group, a phenyl group, or a vinyl group. This is because having a phenyl group makes it possible to obtain a cured product having a large refractive index and a high light transmittance, and by having a vinyl group, curing having high mechanical strength such as peel strength is achieved. This is because things can be obtained. In the above formula, a and b are each a positive number, and a / b is preferably 0.2 to 3, particularly 0.3 to 2.

  Furthermore, (B) component has a hydroxyl group couple | bonded with a silicon atom, and it is preferable that the amount of hydroxyl groups is 400-5000 ppm, especially 500-4000 ppm. If the amount is less than 400 ppm, the effect of improving the adhesion cannot be sufficiently obtained. On the other hand, if the amount exceeds 5000 ppm, the curing rate is lowered or the cured product is foamed. By introducing such a specific small amount of hydroxyl groups, the adhesion of the present composition to the mold resin can be enhanced. As a method for quantifying the amount of such a hydroxyl group, for example, the KF method (Karl Fischer method) is preferable.

Examples of such a component (B) include an average unit formula:
[(CH ₃ ) ₃ SiO _1/2 ] _x [SiO _4/2 ] _y
(Wherein x and y are positive numbers, and x / y is a number of 0.2 to 3, respectively), an average unit formula:
[C ₆ H ₅ (CH ₃ ) ₂ SiO _1/2 ] _p [(CH ₃ ) ₃ SiO _1/2 ] _q [SiO _4/2 ] _r
(In the formula, p, q and r are each a positive number, and p + q / r is a number of 0.2 to 3,
And p / q is a number of 0.005-10. ) Organopolysiloxane represented by the average unit formula:
[CH ₂ = CH (CH ₃ ) ₂ SiO _1/2 ] _s [(CH ₃ ) ₃ SiO _1/2 ] _t [SiO _4/2 ] _u
(In the formula, s, t, and u are positive numbers, and s + t / u is a number from 0.2 to 3,
And s / t is a number of 0.005-10. ) And the like.

Such an organopolysiloxane having a three-dimensional network structure is obtained by _combining an organosiloxane having SiO _4/2 units and an organosiloxane having R ₃ SiO _1/2 (R is a monovalent hydrocarbon group) unit with R ₃ SiO _{1. / 2} units / SiO _4/2 units = combined in a molar ratio of 0.2 to 3, and can be easily obtained by cohydrolyzing in the presence of an acid, an alkali or the like.

  (B) Content of a component is 10 to 80 weight% with respect to the total amount (100 weight%) of (A) component and (B) component, Preferably it is 20 to 70 weight%. This is because if the content of the component (B) is less than the lower limit of the above range, the adhesion between the cured product and the mold resin tends to decrease, whereas if the upper limit of the above range is exceeded, handling workability is increased. This is because it tends to decrease.

  (B) A component can be used individually by 1 type or in combination of 2 or more types.

[Component (C)]
The component (C) acts as a crosslinking agent for curing the composition by a hydrosilylation reaction with the components (A) and (B). It is necessary to have an average of 2 or more hydrogen atoms (SiH groups) bonded to silicon atoms in one molecule, and preferably 3 or more SiH groups. The hydrogen atom bonded to the silicon atom may be bonded to the silicon atom at the end of the molecular chain, may be bonded to one of the silicon atoms in the middle of the molecular chain, or may be bonded to both. .

As the component (C), an average composition formula:
R ² _d H _e SiO _{[4- (d + e)] / 2}
What is shown by is used. In the above formula, R ² is a substituted or unsubstituted monovalent hydrocarbon group excluding an aliphatic unsaturated hydrocarbon group.

R ² includes, for example, an alkyl group such as a methyl group, an ethyl group, a propyl group, an isopropyl group, a butyl group, an isobutyl group, a tert-butyl group, a hexyl group, a cyclohexyl group, and an octyl group; Aryl groups such as; aralkyl groups such as benzyl and phenylethyl groups; and those in which some or all of the hydrogen atoms in these groups are substituted with halogen atoms such as fluorine, chlorine, bromine or cyano groups, A chloromethyl group, a bromoethyl group, a trifluoropropyl group, a cyanoethyl group, etc. can be mentioned. Of these, those having 1 to 4 carbon atoms are suitable, and an alkyl group is preferred from the viewpoint of ease of synthesis and cost. A methyl group, an ethyl group, a propyl group, an isopropyl group, a butyl group, an isobutyl group, and a tert-butyl group are preferable, and a methyl group is particularly preferable.

  In the above formula, d and e are positive numbers satisfying 0.5 ≦ d ≦ 2, 0 <e ≦ 2, and 0.5 <d + e ≦ 3, respectively, preferably 0.6 ≦ d It is a positive number satisfying ≦ 1.9, 0.01 ≦ e ≦ 1.0, and 0.6 ≦ d + e ≦ 2.8.

  The molecular structure of component (C) may be any of linear, branched, cyclic or three-dimensional network structure.

  Examples of the component (C) include 1,1,3,3-tetramethyldisiloxane, methylhydrogencyclopolysiloxane, methylhydrogensiloxane / dimethylsiloxane cyclic copolymer, and trimethylsiloxy group-blocked methylhydrogen at both ends. Examples thereof include polysiloxane, a trimethylsiloxy group-capped dimethylsiloxane / methylhydrogensiloxane copolymer, and a both-end dimethylhydrogensiloxy group-capped dimethylpolysiloxane.

  The viscosity of component (C) at 25 ° C. is preferably 1 to 1000 mPa · s, and particularly preferably 10 to 500 mPa · s.

  The blending amount of the component (C) is such that the Si—H group of the component (C) is 0.2 to 5 moles with respect to a total of 1 mole of the alkenyl groups in the component (A) and the component (B). It is preferable that the amount be 0.3 to 4 mol. When the amount is less than 0.2 mol, sufficient crosslinking cannot be obtained, and when the amount exceeds 5 mol, unreacted Si-H bonds remain and the physical properties become unstable.

[(D) component]
The component (D) is a curing catalyst for obtaining a cured product by reacting the alkenyl group in the components (A) and (B) with the hydrogen group in the component (C).

  Examples of the component (D) include platinum black, secondary platinum chloride, chloroplatinic acid, a reaction product of chloroplatinic acid and a monohydric alcohol, a complex of chloroplatinic acid with olefins and vinyl siloxane, and platinum bisacetoacetate. And platinum group metal catalysts such as platinum-based catalysts, palladium-based catalysts and rhodium-based catalysts.

The blending amount of the component (D) is not particularly limited as long as it is an amount necessary for curing, and can be appropriately adjusted according to the types of the components (A) and (C), a desired curing rate, and the like. Usually, it may be in the range of 0.1 to 1000 ppm, particularly in the range of 0.5 to 500 ppm, based on the total weight of the composition obtained in terms of metal atoms.
The curable organopolysiloxane composition of the present invention is composed of the above components (A) to (D).

  The composition thus obtained is preferably in a liquid state, and preferably has a viscosity at 25 ° C. of 100 to 1,000,000 mPa · s, particularly 500 to 1,000,000 mPa · s.

  In addition, this composition contains 2-methyl-3-butyn-2-ol, 3,5-dimethyl-1-hexyn-3-ol, 2-phenyl-3-butyn-2-ol as other optional components. Alkyne alcohols such as all; Enyne compounds such as 3-methyl-3-penten-1-yne and 3,5-dimethyl-3-hexen-1-yne; 1,3,5,7-tetramethyl-1,3 , 5,7-tetravinylcyclotetrasiloxane, 1,3,5,7-tetramethyl-1,3,5,7-tetrahexenylcyclotetrasiloxane, benzotriazole, or other reaction inhibitors may be contained. The amount is usually 10 parts by weight or less per 100 parts by weight of the total amount of the components (A) to (D).

  As other optional components, various commonly used additives may be blended in amounts that do not adversely affect the transparency of the cured product of the present composition. Examples of the additive include reinforcing inorganic fillers such as fumed silica and fumed titanium dioxide; non-reinforcing inorganic fillers such as calcium silicate, titanium dioxide, ferric oxide, and carbon black.

  In addition, a silane coupling agent may be added to the composition in order to impart adhesiveness. Examples of the silane coupling agent include epoxy group-containing alkoxysilanes, Si—H-containing alkoxysilanes, vinyl group-containing alkoxysilanes, and the like.

  The composition is cured at room temperature or by heating, but is preferably heated for rapid curing. The heating temperature is preferably in the range of 50 to 200 ° C. Thus, the hardened | cured material obtained by hardening | curing this composition is rubber-like and a gel form, or it is the resin form which has flexibility, and has high transparency.

  Such a cured product of the present composition is a protective agent for light emitting elements that require high transparency, such as LEDs (light emitting diodes), photocouplers, laser elements, optical coupling elements, and semiconductor elements that require high voltage, It is suitable as a sealant for a base or exterior.

Next, the semiconductor device of the present invention will be described.
The semiconductor device of the present invention is characterized in that a semiconductor element is sealed with a cured product of the curable organopolysiloxane composition described above.

  FIG. 1 is a cross-sectional view showing a schematic configuration of a semiconductor device of the present invention. That is, in the semiconductor device (photocoupler) shown in the figure, the semiconductor element 1 is die-bonded on the lead frame 2 and further wire-bonded to another lead frame 2 not shown by the bonding wire 3. Further, the semiconductor element 4 for light reception is die-bonded on the lead frame 5 so as to face the semiconductor element 1 and further wire-bonded to another lead frame 5 (not shown) by a bonding wire 6. These semiconductor elements are covered with a cured product 7 of the curable organopolysiloxane composition of the present invention. Furthermore, the semiconductor element covered with the cured product 7 is resin-sealed with a mold resin 8 such as an epoxy resin.

  As a sealing method, the semiconductor element 1 is die-bonded to the lead frame 2, and then another lead frame 2 (not shown) is wire-bonded with a bonding wire 3 (Au wire). Similarly, a semiconductor element 4 for light reception is die-bonded on a lead frame 5 at a position facing the semiconductor element 1, and then another lead frame 5 (not shown) is bonded to the bonding element 6 (Au wire). ) To wire bond. Subsequently, the curable organopolysiloxane composition of the present invention is filled between these semiconductor elements, and then cured by heating to 50 to 200 ° C. Thereafter, the semiconductor element covered with the cured product 7 of the curable organopolysiloxane composition is resin-sealed with a mold resin 8 such as an epoxy resin.

  Examples of semiconductor elements include diodes, transistors, thyristors, solid-state imaging elements, monolithic ICs, and semiconductor elements in hybrid ICs.

  Examples of the semiconductor device include a diode, a light emitting diode (LED), a transistor, a thyristor, a photocoupler, a charge coupled device (CCD), a monolithic IC, a hybrid IC, an LSI, and a VLSI, and preferably a light emitting diode (LED). And photocouplers.

Examples of the present invention and comparative examples are shown below. In each example, parts are parts by weight, and the viscosity in the examples is a value measured at 25 ° C.
The properties of the cured product of the curable organopolysiloxane composition were measured as follows.

[Peel strength of cured product]
The curable organopolysiloxane composition was poured into a 150 × 150 × 1 mm mold and heated at 100 ° C. for 1 hour to prepare a sheet-like cured product. After cooling this to room temperature, it was stuck to a polyethylene sheet of 150 × 500 × 0.1 mm and adhered. This polyethylene sheet and the cured product were set in an autograph (manufactured by Shimadzu Corporation) and measured under the conditions of a measurement temperature of 23 ° C., a peeling rate of 100 mm / min, and a peeling angle of 180 degrees.

  Further, the reliability of the semiconductor device was evaluated as follows.

[Method for evaluating reliability of semiconductor device]
The photocoupler shown in FIG. 1 was prepared as follows. That is, the Ga—Al—As compound semiconductor element 1 was die-bonded to the lead frame 2 with a conductive paste, and then the semiconductor element 1 and the lead frame 2 were wire-bonded with a bonding wire (Au wire) 3. The light receiving semiconductor element 4 is die-bonded on the lead frame 5 using a conductive paste at a position facing the semiconductor element 1, and then the semiconductor element 4 and another lead frame 5 are bonded by a bonding wire 6 (Au wire). Wire-bonded. The space between these semiconductor elements was filled with a curable organopolysiloxane composition, and then cured by heating for 1 hour in a dryer at 150 ° C. Next, these semiconductor elements covered with the cured product 7 of the curable organopolysiloxane composition were resin-sealed with a mold resin 8 (epoxy resin).

  In this way, 10 photocouplers were produced. These photocouplers were subjected to 1000 cycles of a cooling / heating cycle test (1 cycle: −50 ° C. × 30 minutes + 150 ° C. × 1 hour). Cracks of the cured product 7 after the test and peeling of the interface between the cured product 7 and the mold resin 8 were observed using a 100 × microscope. The cracked and peeled photocoupler was regarded as defective, and the number of defects was examined.

[Synthesis Example 1]
100% by weight of 16% hydrochloric acid, 143 parts by weight of water, 100 parts by weight of 26% SiO ₂ -containing organosiloxane (sodium silicate) serving as a SiO _4/2 unit source, and 100 parts of IPA are charged, and (CH ₃ ) ₃ SiO _1/2 50 parts by weight of xylene was added dropwise to 50 parts by weight of trimethylchlorosilane serving as a unit source, followed by heating under reflux for 2 hours. Thereafter, liquid separation was performed to remove water in the lower layer, and further desolubilization was performed by heating to obtain a 60% organopolysiloxane xylene solution.

  The vinyl group-containing organopolysiloxane (A) component was added to the organopolysiloxane (B-1) thus obtained, and the mixture was sufficiently dehydrated and desolubilized to obtain a mixture with the component (A). The component (A) used with this mixture was measured for the amount of each hydroxyl group by the Karl Fischer method (KF method), and the amount of hydroxyl group of the component (A) was subtracted from the amount of hydroxyl group in the mixture to obtain the organopolysiloxane ( The hydroxyl amount of B-1) was measured. The amount of this hydroxyl group was 1400 ppm.

  In addition, the measurement of the amount of hydroxyl groups is a Karl Fischer method automatic moisture measuring device (KF-06 type, manufactured by Mitsubishi Kasei Co., Ltd.) using a KF reagent (Karl Fischer reagent SS, manufactured by API Corporation), The amount of water was measured using a dehydrating solvent (CM 50 ml and ML 10 ml, manufactured by API Corporation), and the hydroxyl amount was calculated from the amount of water.

[Synthesis Example 2]
(CH ₃ ) ₃ SiO _1/2 unit source 35 parts trimethylchlorosilane 35 parts C ₆ H ₅ (CH ₃ ) ₂ SiO _1/2 unit source dimethylphenylchlorosilane 5 parts by weight, SiO _4/2 unit source A hydroxyl group-containing polyorganosiloxane was obtained in the same manner as in Synthesis Example 1 except that 100 parts by weight of sodium silicate was used. About this polyorganosiloxane (B-2), the amount of hydroxyl groups measured by KF method was 3300 ppm.

[Synthesis Example 3]
55 parts of trimethylchlorosilane as a source of (CH ₃ ) ₃ SiO _1/2 unit, ₂ parts of vinyldimethylchlorosilane as a source of CH ₂ ═CH (CH ₃ ) ₂ SiO _1/2, and silicon as a source of SiO _4/2 unit A hydroxyl-containing polyorganosiloxane was obtained in the same manner as in Synthesis Example 1 except that 100 parts of acid soda was used. About this polyorganosiloxane (B-3), the amount of hydroxyl groups measured by KF method was 700 ppm.

[Example 1]
50 parts by weight of a linear vinyl group-containing organopolysiloxane (A-1) having a viscosity of 500 cP and having both molecular chain ends blocked with vinyldimethylsiloxy groups, the formula:
[(CH ₃ ) ₃ SiO _1/2 ] _1.07 [SiO _4/2 ]
And 50 parts by weight of an organopolysiloxane (B-1) (weight average molecular weight 1900 in terms of standard polystyrene) obtained in Synthesis Example 1, and a viscosity of 30 mPa · s, the formula:
(CH ₃ ) _1.64 H _0.45 SiO _{(1.91 / 2)}
2.4 parts by weight of an organohydrogenpolysiloxane represented by (content of silicon atom-bonded hydrogen atoms in all silicon atom-bonded groups: 50 mol%) and platinum catalyst (10 ppm as platinum atoms) are mixed and stirred. A curable organopolysiloxane composition was prepared.

  The properties of the cured product of this curable organopolysiloxane composition were measured and the results are shown in Table 1. Further, a photocoupler was prepared using this curable organopolysiloxane composition, and the reliability evaluation results of this semiconductor device are shown in Table 1.

[Example 2]
The viscosity is 1000 cP and the following formula:

50 parts by weight of a linear vinyl group-containing organopolysiloxane (A-2) (silicon atom-bonded phenyl group content 5 mol%) represented by the formula:
[C ₆ H ₅ (CH ₃ ) ₂ SiO _1/2 ] _0.02 [(CH ₃ ) ₃ SiO _1/2 ] _1.05 [SiO _4/2 ]
And 50 parts by weight of the organopolysiloxane (B-2) (weight average molecular weight 4100 in terms of standard polystyrene) obtained in Synthesis Example 2, and a viscosity of 25 mPa · s.
(CH ₃ ) _1.64 H _0.45 SiO _{(1.91 / 2)}
And 2.4 parts by weight of an organohydrogenpolysiloxane (content of silicon atom-bonded hydrogen atoms 50 mol%) and a platinum catalyst (10 ppm as platinum atoms) are mixed and stirred to obtain a curable organopolysiloxane composition. Adjusted.

  The properties of the cured product of this curable organopolysiloxane composition were measured and the results are shown in Table 1. Further, a photocoupler was prepared using this curable organopolysiloxane composition, and the reliability evaluation results of this semiconductor device are shown in Table 1.

[Example 3]
50 parts by weight of a linear vinyl group-containing organopolysiloxane (A-1) having a viscosity of 500 cP and having both molecular chain ends blocked with vinyldimethylsiloxy groups, the formula:
[(CH ₂ = CH) (CH ₃ ) ₂ SiO _1/2 ] _0.04 [(CH ₃ ) ₃ SiO _1/2 ] _1.17 [SiO _4/2 ]
50 parts by weight of the organopolysiloxane (B-3) (weight average molecular weight 1200 in terms of standard polystyrene) obtained in Synthesis Example 3 and the formula:
(CH ₃ ) _1.64 H _0.45 SiO _{(1.91 / 2)}
A curable organopolysiloxane composition comprising 3.0 parts by weight of an organohydrogenpolysiloxane (content of silicon atom-bonded hydrogen atoms 50 mol%) and a platinum catalyst (10 ppm as platinum atoms) mixed and stirred. Adjusted.

  The properties of the cured product of this curable organopolysiloxane composition were measured and the results are shown in Table 1. Further, a photocoupler was prepared using this curable organopolysiloxane composition, and the reliability evaluation results of this semiconductor device are shown in Table 1.

[Example 4]
A linear vinyl group-containing organopolysiloxane (A-4) 50 having a viscosity of 500 cP, an average of 0.5 silicon atom-bonded vinyl groups in one molecule, and a vinyldimethylsiloxy group at the molecular chain terminal. Parts by weight, formula:
[(CH ₃ ) ₃ SiO _1/2 ] _1.07 [SiO _4/2 ]
And 50 parts by weight of an organopolysiloxane (B-1) (weight average molecular weight 1900 in terms of standard polystyrene) obtained in Synthesis Example 1, and a viscosity of 30 mPa · s, the formula:
(CH ₃ ) _1.64 H _0.45 SiO _{(1.91 / 2)}
1.2 parts by weight of an organohydrogenpolysiloxane represented by (content of silicon atom-bonded hydrogen atoms in all silicon atom-bonded groups: 50 mol%) and platinum catalyst (10 ppm as platinum atoms) are mixed and stirred. A curable organopolysiloxane composition was prepared.

  The properties of the cured product of this curable organopolysiloxane composition were measured and the results are shown in Table 1. Further, a photocoupler was prepared using this curable organopolysiloxane composition, and the reliability evaluation results of this semiconductor device are shown in Table 1.

[Comparative Example 1]
50 parts by weight of a linear vinyl group-containing organopolysiloxane (A-1) having a viscosity of 500 cP and both ends of the molecular chain blocked with vinyldimethylsiloxy groups, a viscosity of 10000 cP, and both ends of the molecular chain are vinyldimethylsiloxy The linear vinyl group-containing organopolysiloxane (A-3) blocked with a group is 50 parts by weight, and the viscosity is 30 mPa · s.
(CH ₃ ) _1.64 H _0.45 SiO _{(1.91 / 2)}
2.6 parts by weight of an organohydrogenpolysiloxane (content of silicon-bonded hydrogen atoms 50 mol%) and a platinum catalyst (10 ppm as platinum atoms) were mixed and stirred to prepare a composition.

  The properties of the cured product of this curable organopolysiloxane composition were measured and the results are shown in Table 1. Further, a photocoupler was prepared using this curable organopolysiloxane composition, and the reliability evaluation results of this semiconductor device are shown in Table 1.

[Comparative Example 2]
95 parts by weight of a linear vinyl group-containing organopolysiloxane (A-1) having a viscosity of 500 cP and having both ends of the molecular chain blocked with vinyldimethylsiloxy groups, the formula:
[(CH ₃ ) ₃ SiO _1/2 ] _1.07 [SiO _4/2 ]
5 parts by weight of the organopolysiloxane (B-1) (weight average molecular weight 1900 in terms of standard polystyrene) obtained in Synthesis Example 1 and a viscosity of 30 mPa · s, the formula:
(CH ₃ ) _1.64 H _0.45 SiO _{(1.91 / 2)}
And 4.6 parts by weight of an organohydrogenpolysiloxane (content of silicon atom-bonded hydrogen atoms 50 mol%) and a platinum catalyst (10 ppm as platinum atoms) were mixed and stirred to prepare a composition.

The properties of the cured product of this curable organopolysiloxane composition were measured and the results are shown in Table 1. Further, a photocoupler was prepared using this curable organopolysiloxane composition, and the reliability evaluation results of this semiconductor device are shown in Table 1.

It is sectional drawing which shows an example of the semiconductor device of this invention.

Explanation of symbols

  DESCRIPTION OF SYMBOLS 1 ... Semiconductor element, 2 ... Lead frame, 3 ... Bonding wire, 4 ... Semiconductor element, 5 ... Lead frame, 6 ... Bonding wire, 7 ... Hardened | cured material, 8 ... Mold resin

Claims (5)

(A) an organopolysiloxane having an average of 0.2 or more silicon-bonded alkenyl groups in one molecule;
(B) Average unit formula:
(R ₃ SiO _1/2 ) _a (SiO _4/2 ) _b
(Wherein R is the same or different substituted or unsubstituted monovalent hydrocarbon group, a and b are each a positive number, and a / b is a number of 0.2 to 3. ) And an organopolysiloxane having a three-dimensional network structure in which the amount of hydroxyl groups bonded to silicon atoms is 400 to 5000 ppm {10 to 80 weights based on the total amount of the components (A) and (B) %},
(C) Organohydrogenpolysiloxane having at least two silicon atom-bonded hydrogen atoms in one molecule {Silicon atom-bonded alkenyl group in component (A) and silicon atom-bonded alkenyl group in component (B) In an amount of 0.2 to 5 mol of silicon-bonded hydrogen atoms in this component}
And (D) catalyst for hydrosilylation reaction (catalytic amount)
A curable organopolysiloxane composition characterized by comprising: The component (A) has the general formula:

Wherein R ¹ is the same or different unsubstituted or substituted monovalent hydrocarbon group not containing an aliphatic unsaturated bond, X is an alkenyl group, and n is an integer of 5 to 3000. The curable organopolysiloxane composition according to claim 1, which is an organopolysiloxane represented by the formula: The component (B) is an average unit formula:
[C ₆ H ₅ (CH ₃ ) ₂ SiO _1/2 ] _p [(CH ₃ ) ₃ SiO _1/2 ] _q [SiO _4/2 ] _r
(In the formula, p, q and r are each a positive number, and p + q / r is a number of 0.2 to 3,
And p / q is a number of 0.005-10. The curable organopolysiloxane composition according to claim 1, wherein the curable organopolysiloxane composition is a three-dimensional network organopolysiloxane having a hydroxyl group content of 400 to 5000 ppm. . The component (C) is an average composition formula:
R ² _d H _e SiO _{[4- (d + e)] / 2}
(Wherein R ² is a substituted or unsubstituted monovalent hydrocarbon group excluding an aliphatic unsaturated hydrocarbon group, and d and e are 0.5 ≦ d ≦ 2, 0 <e ≦, respectively. 2, 0.5 <d + e ≦ 3, preferably 0.6 ≦ d ≦ 1.9, 0.01 ≦ e ≦ 1.0, 0.6 ≦ d + e ≦ 2.8. 4. An organohydrogenpolysiloxane represented by the formula (1) and having at least two silicon-bonded hydrogen atoms in one molecule. The curable organopolysiloxane composition described in 1.   A semiconductor device, wherein a semiconductor element is sealed with a cured product of the curable organopolysiloxane composition according to claim 1.

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