JP2006210832A - Method and device for connecting display panel, and flexible circuit board - Google Patents

Method and device for connecting display panel, and flexible circuit board Download PDF

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JP2006210832A
JP2006210832A JP2005023995A JP2005023995A JP2006210832A JP 2006210832 A JP2006210832 A JP 2006210832A JP 2005023995 A JP2005023995 A JP 2005023995A JP 2005023995 A JP2005023995 A JP 2005023995A JP 2006210832 A JP2006210832 A JP 2006210832A
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circuit board
flexible circuit
terminal portion
display panel
terminal
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Masayoshi Hayakawa
正義 早川
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Kyocera Display Corp
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Kyocera Display Corp
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Abstract

<P>PROBLEM TO BE SOLVED: To prevent the generation of the floating of the base film of a flexible circuit board, when connected display panel and flexible circuit board are left at a high temperature and high-moisture atmosphere, without subjecting the board to aging process after connection, at electrical connection of the terminal section of the display panel and the terminal section of the flexible circuit board, by using connecting materials constituted by mixing conductive particles in ultraviolet-curing resin. <P>SOLUTION: A pressurizing bar 24 butted to the surface of a terminal 32 of a flexible circuit board 30 for applying pressure to the terminal of a flexible circuit board and connecting materials 34, and a terminal 28 of a display panel 26 is provided with a heating means 50. Then, the terminal of the flexible circuit board and the connecting materials are heated by the heating means, when the connecting materials are irradiated with ultraviolet rays. It is desired that the terminal of the flexible circuit board and the connecting materials be heated by the heating means, after the lapse of a predetermined time since the start of the irradiation of the ultraviolet rays. <P>COPYRIGHT: (C)2006,JPO&NCIPI

Description

本発明は、表示パネルの端子部とフレキシブル回路基板の端子部とを紫外線硬化樹脂に導電性粒子を混合してなる接続材を用いて電気的に接続するための表示パネルと回路基板との接続方法および接続装置に関する。   The present invention relates to a connection between a display panel and a circuit board for electrically connecting the terminal part of the display panel and the terminal part of the flexible circuit board using a connecting material obtained by mixing conductive particles in an ultraviolet curable resin. The present invention relates to a method and a connection device.

従来、表示パネルの1つである液晶パネルの端子部とフレキシブル回路基板の端子部とを紫外線硬化樹脂に導電性粒子を混合してなる接続材を用いて電気的に接続する際に用いられる接続装置として、図3に示すものが知られている(例えば、特許文献1参照)。   Conventionally, a connection used when electrically connecting a terminal portion of a liquid crystal panel, which is one of display panels, and a terminal portion of a flexible circuit board using a connecting material obtained by mixing conductive particles in an ultraviolet curable resin. A device shown in FIG. 3 is known as an apparatus (see, for example, Patent Document 1).

図3の接続装置において、10は液晶パネル支持台、12は液晶パネル支持台10の側方に該液晶パネル支持台10と離間して配置されたフレキシブル回路基板支持台、14は液晶パネル支持台10とフレキシブル回路基板支持台12との間に配置された紫外線透過性材料からなる端子部支持台、18は端子部支持台14の下方に設置された紫外線照射手段、24は端子部支持台14の上方に設置された昇降可能な加圧バーを示す。上記紫外線照射手段18は、紫外線ランプ20と紫外線反射板22とからなる。   In the connecting device of FIG. 3, 10 is a liquid crystal panel support, 12 is a flexible circuit board support placed on the side of the liquid crystal panel support 10 and spaced apart from the liquid crystal panel support 10, and 14 is a liquid crystal panel support. 10 is a terminal support base made of an ultraviolet light transmissive material disposed between the flexible circuit board support base 12, 18 is an ultraviolet irradiation means disposed below the terminal support base 14, and 24 is a terminal support base 14. The pressure bar which can be moved up and down installed above is shown. The ultraviolet irradiation means 18 includes an ultraviolet lamp 20 and an ultraviolet reflector 22.

図3の接続装置を用いて液晶パネル26の端子部28とフレキシブル回路基板30の端子部32とを接続する場合、液晶パネル26の端子部28の表面(電極端子の形成されている面)に、紫外線硬化樹脂に導電性粒子を混合してなる接続材34を塗布、印刷などによって積層する。また、液晶パネル26を液晶パネル支持台10上に載置し、液晶パネル26の端子部28を端子部支持台14上に配置するとともに、液晶パネル26の端子部28にフレキシブル回路基板支持台12上に載置したフレキシブル回路基板30の端子部32を重ね合わせる。なお、液晶パネル26において、27、27はそれぞれ透明基板、29、29はそれぞれ偏光板を示す。   When connecting the terminal portion 28 of the liquid crystal panel 26 and the terminal portion 32 of the flexible circuit board 30 using the connection device of FIG. 3, the surface of the terminal portion 28 of the liquid crystal panel 26 (the surface on which the electrode terminals are formed). Then, a connecting material 34 obtained by mixing conductive particles in an ultraviolet curable resin is laminated by coating, printing, or the like. Further, the liquid crystal panel 26 is placed on the liquid crystal panel support 10, the terminal portion 28 of the liquid crystal panel 26 is disposed on the terminal portion support 14, and the flexible circuit board support 12 is placed on the terminal portion 28 of the liquid crystal panel 26. The terminal portions 32 of the flexible circuit board 30 placed thereon are overlaid. In the liquid crystal panel 26, 27 and 27 are transparent substrates, and 29 and 29 are polarizing plates.

その後、図4に示すように、加圧バー24を下降させ、その先端押圧面25でフレキシブル回路基板30の表面(電極端子の形成されていない面)の液晶パネル26に重ね合わせた部分を押圧し、フレキシブル回路基板30の端子部32、接続材34および液晶パネル26の端子部28に圧力を加えて、これらを圧着させる。さらに、この状態で紫外線照射手段18によって接続材34に紫外線21を照射することにより、接続材34中の紫外線硬化樹脂を硬化させて両端子部28、32を電気的に接続するものである。なお、図中36は加圧バー24の先端押圧面25とフレキシブル回路基板30の表面との間に配置されるクッション材を示す。   Thereafter, as shown in FIG. 4, the pressure bar 24 is lowered and the tip pressing surface 25 presses the portion of the surface of the flexible circuit board 30 (the surface on which the electrode terminals are not formed) superimposed on the liquid crystal panel 26. Then, pressure is applied to the terminal portions 32 of the flexible circuit board 30, the connecting material 34, and the terminal portions 28 of the liquid crystal panel 26, and these are crimped. Further, in this state, the ultraviolet ray irradiating means 18 irradiates the connection material 34 with ultraviolet rays 21, thereby curing the ultraviolet curable resin in the connection material 34 and electrically connecting both terminal portions 28 and 32. In the figure, reference numeral 36 denotes a cushion material disposed between the front end pressing surface 25 of the pressure bar 24 and the surface of the flexible circuit board 30.

特開2003−168858号公報JP 2003-168858 A

しかし、前述のようにして液晶パネルの端子部とフレキシブル回路基板の端子部とを紫外線硬化樹脂に導電性粒子を混合してなる接続材を用いて接続し、接続後の液晶パネルおよびフレキシブル回路基板を高温高湿雰囲気中に放置した場合(例えば80℃、90%RHの雰囲気中に放置する信頼性試験を行った場合)、図5に示すように、液晶パネルの端子部とフレキシブル回路基板の端子部との接続部分において、フレキシブル回路基板30の電極端子40の両端でフレキシブル回路基板30のポリイミドなどからなるベースフィルム42の浮き(剥離)44が発生するという問題があった。   However, as described above, the terminal portion of the liquid crystal panel and the terminal portion of the flexible circuit board are connected using a connecting material obtained by mixing conductive particles in an ultraviolet curable resin, and the liquid crystal panel and the flexible circuit board after connection are connected. Is left in a high-temperature and high-humidity atmosphere (for example, when a reliability test is performed in an atmosphere of 80 ° C. and 90% RH), as shown in FIG. 5, the terminals of the liquid crystal panel and the flexible circuit board There is a problem that the base film 42 made of polyimide or the like of the flexible circuit board 30 is floated (peeled) 44 at both ends of the electrode terminal 40 of the flexible circuit board 30 at the connection portion with the terminal portion.

上述した接続後の液晶パネルおよびフレキシブル回路基板を高温高湿雰囲気中に放置した場合におけるフレキシブル回路基板のベースフィルムの浮きの発生原因の主なものとして、フレキシブル回路基板のベースフィルムのスプリングバックが考えられる。これは、図6に示すように、接続後の液晶パネル26およびフレキシブル回路基板30を高温高湿雰囲気中に放置することにより、接続材34中の紫外線硬化樹脂と液晶パネル26あるいはフレキシブル回路基板30との界面の接着力が弱くなる。そのときフレキシブル回路基板30の隣り合う電極端子40同士の間に沈み込んだフレキシブル回路基板30のベースフィルム42が持っているスプリングバックをしようとする応力が開放され、浮きが発生するものである。すなわち、液晶パネル26とフレキシブル回路基板30との接続時には、フレキシブル回路基板30の隣り合う電極端子40同士の間にフレキシブル回路基板30のベースフィルム42を押し込んだ状態で紫外線硬化樹脂を硬化させるので、フレキシブル回路基板30のベースフィルム42にスプリングバックをしようとする応力が残留し、この残留応力が上述した理由により開放される。なお、図6において43は液晶パネル26の電極端子を示す。   The main cause of the floating of the base film of the flexible circuit board when the liquid crystal panel and the flexible circuit board after connection are left in a high-temperature and high-humidity atmosphere is considered to be springback of the base film of the flexible circuit board. It is done. As shown in FIG. 6, by leaving the connected liquid crystal panel 26 and flexible circuit board 30 in a high temperature and high humidity atmosphere, the ultraviolet curable resin in the connecting material 34 and the liquid crystal panel 26 or flexible circuit board 30 are left. Adhesive strength at the interface becomes weaker. At that time, the stress which tries to perform the springback of the base film 42 of the flexible circuit board 30 sunk between the adjacent electrode terminals 40 of the flexible circuit board 30 is released, and the floating occurs. That is, when the liquid crystal panel 26 and the flexible circuit board 30 are connected, the ultraviolet curable resin is cured in a state in which the base film 42 of the flexible circuit board 30 is pushed between the adjacent electrode terminals 40 of the flexible circuit board 30. A stress for springback remains on the base film 42 of the flexible circuit board 30, and this residual stress is released for the reason described above. In FIG. 6, reference numeral 43 denotes an electrode terminal of the liquid crystal panel 26.

したがって、フレキシブル回路基板のベースフィルムの浮きが発生する理由は、紫外線硬化樹脂と液晶パネル26あるいは紫外線硬化樹脂と液晶パネル30との接着力がスプリングバックをしようとする力より小さいからである。   Therefore, the reason why the base film of the flexible circuit board is lifted is that the adhesive force between the ultraviolet curable resin and the liquid crystal panel 26 or the ultraviolet curable resin and the liquid crystal panel 30 is smaller than the force for springback.

そのため、紫外線硬化樹脂と液晶パネルあるいはフレキシブル回路基板との接着力を強めるために、従来、接続後の表示パネルおよびフレキシブル回路基板を95℃の温度で90分間保持するエージング工程を行っている。このエージング工程を行うことにより、エージング工程後に表示パネルおよびフレキシブル回路基板を高温高湿雰囲気中に放置しても、すでに紫外線硬化樹脂と液晶パネルあるいはフレキシブル回路基板との接着力が強められているため、フレキシブル回路基板のベースフィルムの浮きは発生しない。   Therefore, in order to strengthen the adhesive force between the ultraviolet curable resin and the liquid crystal panel or the flexible circuit board, conventionally, an aging process for holding the connected display panel and flexible circuit board at a temperature of 95 ° C. for 90 minutes is performed. By performing this aging process, even if the display panel and flexible circuit board are left in a high-temperature and high-humidity atmosphere after the aging process, the adhesive force between the UV curable resin and the liquid crystal panel or flexible circuit board has already been strengthened. No floating of the base film of the flexible circuit board occurs.

しかしながら、前述した従来の表示パネルとフレキシブル回路基板との接続工程では、前記エージング工程を行っているために、接続工程の負荷が増大し、その結果液晶表示装置の製造コストが高くなるものであった。   However, in the connection process between the conventional display panel and the flexible circuit board described above, since the aging process is performed, the load of the connection process increases, and as a result, the manufacturing cost of the liquid crystal display device increases. It was.

本発明は、前述した事情に鑑みてなされたもので、表示パネルの端子部とフレキシブル回路基板の端子部とを紫外線硬化樹脂に導電性粒子を混合してなる接続材を用いて電気的に接続するに当たり、接続後のエージング工程を行うことなく、接続後の表示パネルおよびフレキシブル回路基板を高温高湿雰囲気中に放置したときのフレキシブル回路基板のベースフィルムの浮きの発生を防止することができる表示パネルとフレキシブル回路基板との接続方法および接続装置を提供することを目的とする。   The present invention has been made in view of the above-described circumstances, and electrically connects the terminal portion of the display panel and the terminal portion of the flexible circuit board using a connecting material obtained by mixing conductive particles in an ultraviolet curable resin. In doing so, it is possible to prevent the occurrence of floating of the base film of the flexible circuit board when the display panel and the flexible circuit board after connection are left in a high-temperature and high-humidity atmosphere without performing an aging process after connection. It is an object of the present invention to provide a connection method and a connection device between a panel and a flexible circuit board.

本発明は、前記目的を達成するため、表示パネルの端子部とフレキシブル回路基板の端子部との間に紫外線硬化樹脂に導電性粒子を混合してなる接続材を配置し、前記フレキシブル回路基板の端子部、前記接続材および前記表示パネルの端子部に加圧部材によって圧力を加えた状態で前記接続材に紫外線を照射して該接続材中の紫外線硬化樹脂を硬化させることにより、前記表示パネルの端子部と前記フレキシブル回路基板の端子部とを前記接続材により接続するに当たり、前記加圧部材に加熱手段を設けるとともに、前記接続材への紫外線照射時に前記加熱手段により前記フレキシブル回路基板の端子部および前記接続材を加熱することを特徴とする表示パネルとフレキシブル回路基板との接続方法を提供する。   In order to achieve the above object, the present invention provides a connecting material obtained by mixing conductive particles in an ultraviolet curable resin between a terminal portion of a display panel and a terminal portion of a flexible circuit board. The display panel is formed by irradiating the connection material with ultraviolet rays in a state where pressure is applied to the terminal portion, the connection material and the terminal portion of the display panel by a pressure member to cure the ultraviolet curable resin in the connection material. In connecting the terminal portion of the flexible circuit board and the terminal portion of the flexible circuit board by the connecting material, the pressure member is provided with heating means, and the terminal of the flexible circuit board is provided by the heating means when the connecting material is irradiated with ultraviolet rays. And a connecting method between the display panel and the flexible circuit board, wherein the connecting member and the connecting material are heated.

また、本発明は、加圧部材と、紫外線照射手段とを具備し、表示パネルの端子部とフレキシブル回路基板の端子部との間に紫外線硬化樹脂に導電性粒子を混合してなる接続材を配置し、前記フレキシブル回路基板の端子部、前記接続材および前記表示パネルの端子部に前記加圧部材によって圧力を加えた状態で前記紫外線照射手段によって前記接続材に紫外線を照射して該接続材中の紫外線硬化樹脂を硬化させることにより、前記表示パネルの端子部と前記フレキシブル回路基板の端子部とを前記接続材により接続する装置であって、前記加圧部材に、前記接続材への紫外線照射時に前記フレキシブル回路基板の端子部および前記接続材を加熱する加熱手段が設けられていることを特徴とする表示パネルとフレキシブル回路基板との接続装置を提供する。   Further, the present invention provides a connecting material comprising a pressure member and an ultraviolet irradiation means, wherein a conductive particle is mixed with an ultraviolet curable resin between a terminal portion of a display panel and a terminal portion of a flexible circuit board. The connecting material is disposed by irradiating the connecting material with ultraviolet rays by the ultraviolet irradiating means in a state where pressure is applied to the terminal portion of the flexible circuit board, the connecting material and the terminal portion of the display panel by the pressing member. A device for connecting the terminal portion of the display panel and the terminal portion of the flexible circuit board by the connecting material by curing the ultraviolet curable resin therein, and the ultraviolet light applied to the connecting material on the pressure member A device for connecting a display panel and a flexible circuit board, characterized in that a heating means for heating the terminal part of the flexible circuit board and the connecting material at the time of irradiation is provided. To provide.

本発明においては、紫外線照射時に加圧部材に設けた加熱手段で接続部を加熱することにより、接続部の反応効率を上げ、これによって紫外線硬化樹脂の接着力を向上させ、接続後のフレキシブル回路基板のベースフィルムに残留するスプリングバックをしようとする応力に負けないようにすることができる。したがって、本発明によれば、紫外線硬化樹脂と液晶パネル、フレキシブル回路基板との界面接着力を向上させ、高温高湿雰囲気中に放置したときのフレキシブル回路基板のベースフィルムの浮きの発生を防止することができる。   In the present invention, the connecting portion is heated by heating means provided on the pressure member during ultraviolet irradiation, thereby increasing the reaction efficiency of the connecting portion, thereby improving the adhesive force of the ultraviolet curable resin, and the flexible circuit after connection. It is possible to avoid losing the stress of the spring back remaining on the base film of the substrate. Therefore, according to the present invention, the interfacial adhesive force between the ultraviolet curable resin, the liquid crystal panel, and the flexible circuit board is improved, and the occurrence of the floating of the base film of the flexible circuit board when left in a high temperature and high humidity atmosphere is prevented. be able to.

本発明では、紫外線照射を開始してから所定時間が経過した後に、加熱手段によりフレキシブル回路基板の端子部および接続材を加熱することが適当である。すなわち、紫外線照射の途中で加熱を行うことにより、紫外線硬化樹脂の初期の反応を緩やかにして、硬化時の紫外線硬化樹脂の収縮を減少させることができる。これに対し、紫外線照射の開始と同時に加熱を開始すると、紫外線硬化樹脂が紫外線と加熱によって急激に反応・硬化して大きく収縮し、その結果高温高湿雰囲気中に放置したときのフレキシブル回路基板のベースフィルムの浮きが発生しやすくなる。   In the present invention, it is appropriate to heat the terminal portion and the connecting material of the flexible circuit board by the heating means after a predetermined time has elapsed since the start of the ultraviolet irradiation. That is, by performing heating in the middle of ultraviolet irradiation, the initial reaction of the ultraviolet curable resin can be moderated and shrinkage of the ultraviolet curable resin during curing can be reduced. On the other hand, if heating is started at the same time as the start of UV irradiation, the UV curable resin reacts and cures rapidly due to UV light and heating, causing large shrinkage. As a result, the flexible circuit board when left in a high temperature and high humidity atmosphere The base film tends to float.

本発明において、加熱手段によるフレキシブル回路基板の端子部の加熱温度、あるいはフレキシブル回路基板の端子部および接続材の加熱温度に特に限定はないが、通常は50〜100℃に加熱することが好適である。   In the present invention, the heating temperature of the terminal part of the flexible circuit board by the heating means or the heating temperature of the terminal part of the flexible circuit board and the connecting material is not particularly limited, but it is usually preferable to heat to 50 to 100 ° C. is there.

本発明において、加熱手段の種類は適宜選択することができるが、高速昇温、高速冷却が可能である点でパルスヒータが特に好ましい。   In the present invention, the type of the heating means can be selected as appropriate, but a pulse heater is particularly preferable in that high-speed temperature rise and high-speed cooling are possible.

本発明によれば、エージング工程を行うことなく、接続後の表示パネルおよびフレキシブル回路基板を高温高湿雰囲気中に放置したときのフレキシブル回路基板のベースフィルムの浮きの発生を防止することができる。   According to the present invention, it is possible to prevent the base film of the flexible circuit board from being lifted when the connected display panel and flexible circuit board are left in a high-temperature and high-humidity atmosphere without performing an aging process.

以下、本発明の実施の形態を図面を参照して説明するが、本発明は下記例に限定されるものではない。例えば、表示パネルとしての液晶パネルのほかに、有機ELパネル、プラズマディスプレイパネル等を例示することができる。図1および図2は本発明に係る液晶パネルとフレキシブル回路基板との接続装置の一実施形態を示すもので、図1は加圧バーを上昇させた状態を示す概略図、図2は加圧バーを下降させた状態を示す概略図である。なお、図1、図2において、図3、図4と同一構成の部分には同一の参照符号を付してその説明を省略する。   Hereinafter, embodiments of the present invention will be described with reference to the drawings. However, the present invention is not limited to the following examples. For example, in addition to a liquid crystal panel as a display panel, an organic EL panel, a plasma display panel, and the like can be exemplified. FIG. 1 and FIG. 2 show an embodiment of a connection device between a liquid crystal panel and a flexible circuit board according to the present invention. FIG. 1 is a schematic view showing a state where a pressure bar is raised, and FIG. It is the schematic which shows the state which lowered | hung the bar. 1 and FIG. 2, the same reference numerals are given to the same components as those in FIG. 3 and FIG.

本例の接続装置は、加圧バー(加圧部材)24の先端に加熱手段としてパルスヒータ50が取り付けられており、このパルスヒータ50によって紫外線照射手段18による接続材34への紫外線照射時にフレキシブル回路基板30の端子部32および接続材34を加熱するようになっている。   In the connection device of this example, a pulse heater 50 is attached to the tip of a pressure bar (pressure member) 24 as a heating means, and the pulse heater 50 is flexible when the ultraviolet irradiation means 18 irradiates the connection material 34 with ultraviolet rays. The terminal portion 32 and the connecting member 34 of the circuit board 30 are heated.

なお、加圧バー24の材質に限定はないが、耐熱性を有する材料、例えば金属、セラミックス等によって形成することが好ましい。また、フレキシブル回路基板30としては、可撓性のフィルム基板に配線パターンを形成したフレキシブルプリント配線基板(FPC)、可撓性の絶縁フィルムにプリント配線を施しその上にLSIを搭載したCOF(Chip On Film)、駆動用回路をテープ上に実装したTPC(Tape Carrier Package)などが挙げられる。   The material of the pressure bar 24 is not limited, but is preferably formed of a heat resistant material such as metal or ceramics. The flexible circuit board 30 includes a flexible printed circuit board (FPC) in which a wiring pattern is formed on a flexible film substrate, and a COF (Chip) in which a printed wiring is applied to a flexible insulating film and an LSI is mounted thereon. On Film), and TPC (Tape Carrier Package) in which a driving circuit is mounted on a tape.

本例の接続装置を用いて液晶パネル26の端子部28とフレキシブル回路基板30の端子部32とを接続する場合、液晶パネル26の端子部28の表面に、紫外線硬化樹脂に導電性粒子を混合してなる接続材34を塗布、印刷などによって積層する。また、液晶パネル26を液晶パネル支持台10上に載置し、液晶パネル26の端子部28を端子部支持台14上に配置するとともに、液晶パネル26の端子部28にフレキシブル回路基板支持台12上に載置したフレキシブル回路基板30の端子部32を重ね合わせる。なお、上記接続材34の積層は、液晶パネル26を液晶パネル支持台10上に載置する前に行ってもよく、載置した後に行ってもよい。また、接続材34により仮接続した液晶パネル26およびフレキシブル回路基板30を液晶パネル支持台10、フレキシブル回路基板支持台12および端子部支持台14の上に載置してもよい。   When the terminal unit 28 of the liquid crystal panel 26 and the terminal unit 32 of the flexible circuit board 30 are connected using the connection device of this example, conductive particles are mixed with ultraviolet curable resin on the surface of the terminal unit 28 of the liquid crystal panel 26. The connecting member 34 is laminated by coating, printing, or the like. Further, the liquid crystal panel 26 is placed on the liquid crystal panel support 10, the terminal portion 28 of the liquid crystal panel 26 is disposed on the terminal portion support 14, and the flexible circuit board support 12 is placed on the terminal portion 28 of the liquid crystal panel 26. The terminal portions 32 of the flexible circuit board 30 placed thereon are overlaid. The connection material 34 may be laminated before or after the liquid crystal panel 26 is placed on the liquid crystal panel support 10. Further, the liquid crystal panel 26 and the flexible circuit board 30 temporarily connected by the connecting material 34 may be placed on the liquid crystal panel support base 10, the flexible circuit board support base 12, and the terminal portion support base 14.

その後、図2に示すように、加圧バー24を下降させ、その先端押圧面25でフレキシブル回路基板30の表面(電極端子の形成されていない面)の液晶パネル26に重ね合わせた部分を押圧し、フレキシブル回路基板30の端子部32、接続材34および液晶パネル26の端子部28に圧力を加えて、これらを圧着させる。さらに、この状態で紫外線照射手段18によって接続材34に紫外線21を照射する。   Thereafter, as shown in FIG. 2, the pressure bar 24 is lowered, and the front surface pressing surface 25 presses the portion of the surface of the flexible circuit board 30 (the surface on which the electrode terminals are not formed) superimposed on the liquid crystal panel 26. Then, pressure is applied to the terminal portions 32 of the flexible circuit board 30, the connecting material 34, and the terminal portions 28 of the liquid crystal panel 26, and these are crimped. Further, in this state, the ultraviolet light 21 is irradiated to the connecting material 34 by the ultraviolet irradiation means 18.

次いで、紫外線照射手段18による紫外線照射を開始してから所定時間、例えば10秒が経過した後に、パルスヒータ50をオンにして、該パルスヒータ50によってフレキシブル回路基板30の端子部32および接続材34を例えば20秒加熱する。このように紫外線照射を開始してから所定時間が経過した後に紫外線照射と加熱を同時に行い、液晶パネル26との接続時にフレキシブル回路基板30のベースフィルムに加わる応力を減少させるとともに、接続材34中の紫外線硬化樹脂の接着力を向上させた状態で、接続材34によって両端子部28、32を電気的に接続することにより、接続後の液晶パネル26およびフレキシブル回路基板30を高温高湿雰囲気中に放置したときのフレキシブル回路基板30のベースフィルムの浮きの発生を防止する。   Next, after a predetermined time, for example, 10 seconds elapses after the ultraviolet irradiation by the ultraviolet irradiation means 18 is started, the pulse heater 50 is turned on, and the terminal portion 32 and the connecting member 34 of the flexible circuit board 30 are turned on by the pulse heater 50. Is heated for 20 seconds, for example. In this way, after a predetermined time has elapsed from the start of the ultraviolet irradiation, the ultraviolet irradiation and the heating are simultaneously performed to reduce the stress applied to the base film of the flexible circuit board 30 when connected to the liquid crystal panel 26, and in the connecting material 34 In a state in which the adhesive strength of the ultraviolet curable resin is improved, both terminal portions 28 and 32 are electrically connected by the connecting material 34, whereby the liquid crystal panel 26 and the flexible circuit board 30 after the connection are placed in a high-temperature and high-humidity atmosphere. This prevents the base film of the flexible circuit board 30 from being lifted when left unattended.

本例において、紫外線照射量、紫外線照射のタイミング、加熱温度、加熱のタイミングは適宜設定することができるが、例えば、加圧バー24を下降させてフレキシブル回路基板30、接続材34および液晶パネル26を圧着させた後、紫外線照射量2000mj/cmで紫外線照射を開始し、さらに紫外線照射を開始してから10秒後にパルスヒータ50をオンにしてフレキシブル回路基板30の端子部32および接続材34を70℃で20秒間加熱し、紫外線照射開始30秒後に紫外線照射および加熱を同時に停止する例を挙げることができる。この場合、紫外線照射開始10秒後に加熱を開始したのは、紫外線照射開始10秒後には紫外線硬化樹脂の初期反応が進んで液晶パネルとフレキシブル回路基板との最低限の接着力が得られるので、この状態になったときに加熱を開始するものである。 In this example, the UV irradiation amount, the UV irradiation timing, the heating temperature, and the heating timing can be set as appropriate. For example, the pressure bar 24 is lowered and the flexible circuit board 30, the connecting material 34, and the liquid crystal panel 26. Then, ultraviolet irradiation is started at an ultraviolet irradiation amount of 2000 mj / cm 2 , and the pulse heater 50 is turned on 10 seconds after the ultraviolet irradiation is started, and the terminal portion 32 and the connecting material 34 of the flexible circuit board 30 are turned on. Can be heated at 70 ° C. for 20 seconds, and ultraviolet irradiation and heating are simultaneously stopped 30 seconds after the start of ultraviolet irradiation. In this case, the heating was started 10 seconds after the start of UV irradiation because the initial reaction of the UV curable resin progressed 10 seconds after the start of UV irradiation and the minimum adhesion between the liquid crystal panel and the flexible circuit board was obtained. Heating is started when this state is reached.

上述のようにして接続した液晶パネルおよびフレキシブル回路基板を80℃、90%RHの高温高湿雰囲気中に放置したところ、フレキシブル回路基板のベースフィルムの浮きは発生しなかった。   When the liquid crystal panel and the flexible circuit board connected as described above were left in a high-temperature and high-humidity atmosphere at 80 ° C. and 90% RH, the base film of the flexible circuit board did not float.

本発明に係る表示パネルとフレキシブル回路基板との接続装置の一実施形態を示すもので、加圧バーを上昇させた状態を示す概略図である。1 is a schematic view showing a state where a pressure bar is raised, showing an embodiment of a connection device between a display panel and a flexible circuit board according to the present invention. 図1の接続装置の加圧バーを下降させた状態を示す概略図である。It is the schematic which shows the state which lowered | hung the pressure bar of the connection apparatus of FIG. 従来の表示パネルとフレキシブル回路基板との接続装置の一例を示すもので、加圧バーを上昇させた状態を示す概略図である。It is the schematic which shows an example of the connection apparatus of the conventional display panel and a flexible circuit board, and shows the state which raised the pressurization bar. 図1の接続装置の加圧バーを下降させた状態を示す概略図である。It is the schematic which shows the state which lowered | hung the pressure bar of the connection apparatus of FIG. フレキシブル回路基板のベースフィルムに浮きが生じた状態を示す説明図である。It is explanatory drawing which shows the state which the float produced in the base film of the flexible circuit board. フレキシブル回路基板のベースフィルムに浮きが生じる原因を示す説明図である。It is explanatory drawing which shows the cause which a float arises in the base film of a flexible circuit board.

符号の説明Explanation of symbols

18 紫外線照射手段
24 加圧バー
26 表示パネル
28 端子部
30 フレキシブル回路基板
32 端子部
34 接続材
50 加熱手段(パルスヒータ)
18 UV irradiation means 24 Pressurization bar 26 Display panel 28 Terminal part 30 Flexible circuit board 32 Terminal part 34 Connection material 50 Heating means (pulse heater)

Claims (4)

表示パネルの端子部とフレキシブル回路基板の端子部との間に紫外線硬化樹脂に導電性粒子を混合してなる接続材を配置し、前記フレキシブル回路基板の端子部、前記接続材および前記表示パネルの端子部に加圧部材によって圧力を加えた状態で前記接続材に紫外線を照射して該接続材中の紫外線硬化樹脂を硬化させることにより、前記表示パネルの端子部と前記フレキシブル回路基板の端子部とを前記接続材により接続するに当たり、前記加圧部材に加熱手段を設けるとともに、前記接続材への紫外線照射時に前記加熱手段により前記フレキシブル回路基板の端子部および前記接続材を加熱することを特徴とする表示パネルとフレキシブル回路基板との接続方法。   A connecting material obtained by mixing conductive particles in an ultraviolet curable resin is disposed between the terminal portion of the display panel and the terminal portion of the flexible circuit board, and the terminal portion of the flexible circuit board, the connecting material, and the display panel The terminal portion of the display panel and the terminal portion of the flexible circuit board are formed by irradiating the connecting material with ultraviolet rays while applying pressure to the terminal portion with a pressure member to cure the ultraviolet curable resin in the connecting material. When the connecting member is connected with the connecting member, the pressure member is provided with a heating unit, and the terminal unit of the flexible circuit board and the connecting member are heated by the heating unit when the connecting member is irradiated with ultraviolet rays. A method of connecting the display panel and the flexible circuit board. 前記紫外線照射を開始してから所定時間が経過した後に前記加熱手段により前記フレキシブル回路基板の端子部を加熱する請求項1に記載の表示パネルとフレキシブル回路基板との接続方法。   The method for connecting the display panel and the flexible circuit board according to claim 1, wherein the terminal portion of the flexible circuit board is heated by the heating means after a predetermined time has elapsed since the start of the ultraviolet irradiation. 加圧部材と、紫外線照射手段とを具備し、表示パネルの端子部とフレキシブル回路基板の端子部との間に紫外線硬化樹脂に導電性粒子を混合してなる接続材を配置し、前記フレキシブル回路基板の端子部、前記接続材および前記表示パネルの端子部に前記加圧部材によって圧力を加えた状態で前記紫外線照射手段によって前記接続材に紫外線を照射して該接続材中の紫外線硬化樹脂を硬化させることにより、前記表示パネルの端子部と前記フレキシブル回路基板の端子部とを前記接続材により接続する装置であって、前記加圧部材に、前記接続材への紫外線照射時に前記フレキシブル回路基板の端子部および前記接続材を加熱する加熱手段が設けられていることを特徴とする表示パネルとフレキシブル回路基板との接続装置。   The flexible circuit includes a pressing member and an ultraviolet irradiation means, and a connecting material obtained by mixing conductive particles in an ultraviolet curable resin is disposed between the terminal portion of the display panel and the terminal portion of the flexible circuit board. An ultraviolet curable resin in the connection material is obtained by irradiating the connection material with ultraviolet rays by the ultraviolet irradiation means in a state where pressure is applied to the terminal portion of the substrate, the connection material and the terminal portion of the display panel by the pressure member. A device for connecting the terminal portion of the display panel and the terminal portion of the flexible circuit board by the connecting material by curing, wherein the flexible circuit board is applied to the pressure member when the connecting material is irradiated with ultraviolet rays. A connecting device between a display panel and a flexible circuit board, wherein a heating means for heating the terminal portion and the connecting material is provided. 前記紫外線照射を開始してから所定時間が経過した後に前記加熱手段により前記フレキシブル回路基板の端子部を加熱する請求項3に記載の表示パネルとフレキシブル回路基板との接続装置。
The connection device between the display panel and the flexible circuit board according to claim 3, wherein a terminal portion of the flexible circuit board is heated by the heating means after a predetermined time has elapsed since the start of the ultraviolet irradiation.
JP2005023995A 2005-01-31 2005-01-31 Method and device for connecting display panel, and flexible circuit board Pending JP2006210832A (en)

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Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2020124833A1 (en) * 2018-12-19 2020-06-25 武汉华星光电半导体显示技术有限公司 Bonding apparatus for display panel and method for bonding display panel

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2020124833A1 (en) * 2018-12-19 2020-06-25 武汉华星光电半导体显示技术有限公司 Bonding apparatus for display panel and method for bonding display panel

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