JP2006210378A - Substrate-retaining apparatus - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a compact substrate-gripping section that surely retains a substrate, when the substrate is transferred at a speedily and readily releasing the retention of the substrate at a prescribed position. <P>SOLUTION: A substrate-carrying apparatus, for carrying a substrate W retained by a chucking member 22 at the tip of a turning arm to a prescribed transfer position, comprises a rocking support shaft 16 supported by a bearing flange 14 that is provided so that an opening 13 formed at one portion of a chucking member 22 is blocked; a press member retaining frame 17, that is turns with the rocking support shaft 16 as support shaft, when the substrate W is placed at its one portion; a thrust bearing 18 supported in parallel with the axis of the chucking member 22 at one portion of the press member retaining frame 17; and a press pin 12 for pressing the edge of the substrate W, placed in a horizontal state by a tip member 19 via a compression spring 30, while a pin body is stored in the thrust bearing 18 and is slid along the axial direction of the bearing, according to the inclination of the thrust bearing 18. <P>COPYRIGHT: (C)2006,JPO&NCIPI

Description

  The present invention relates to a substrate holding apparatus, and more particularly to a substrate holding apparatus having a substrate holding portion that can hold a substrate reliably during high-speed conveyance of the substrate by a simple holding mechanism and can easily release the substrate holding at a predetermined position.

  Currently, vacuum atmospheres and high-temperature processes occupy an important position in the manufacturing process of semiconductor and liquid crystal substrate products. Among them, high-speed transfer of workpieces such as substrates in a vacuum atmosphere is extremely important in equipment configuration. ing. For this reason, various gripping mechanisms have been developed that reliably hold the substrate at the end effector position at the tip of the transfer arm and quickly release the substrate at the processing position or the like at the processing position. Since this type of gripping mechanism has a structure in which there are many member contact points, problems such as generation of dust and wear of members occur. For this reason, as one means for solving these problems, there has been proposed a substrate holding apparatus having a gripping mechanism that utilizes a non-contact member operation such as magnetic force of an electromagnet or a permanent magnet (Patent Document 1, Patent Document 2). reference).

  The substrate holding device of Patent Document 1 is provided with a fixed guide on the distal end side and a movement guide on the proximal end side in order to hold the substrate on the transfer arm. A permanent magnet is embedded in the end surface on the base end side in the movement guide, and the electromagnet is fixed on the transport arm at a position facing the base end side of the permanent magnet with a slight separation. Because of this structure, when receiving the substrate on the arm, the electromagnet is energized so that the polarity of the permanent magnet at the opposite position and the polarity of the electromagnet are different (reverse polarity), and the moving guide is retracted. In order to mount the board on the arm and then grip the board, the electromagnet is energized so that the electromagnet has the same polarity (same polarity) as the opposing permanent magnet. The substrate is moved to the substrate side, and the substrate is securely held by the holding portion of the moving guide and the fixed guide.

 In the substrate holding device of Patent Document 2, as a prior art, a substrate pressing and holding member 911 supported swingably at a fulcrum 912a is disclosed in FIG. The substrate pressing and holding member 911 is magnetized so that both ends sandwiching the fulcrum become different polarities of the permanent magnet, and the fulcrum is caused by the repulsive action of different polarities with other permanent magnets 920 provided in a part of the cup member 918. As a result, the edge of the substrate W is pressed and urged by the tip of the substrate pressing and holding member 911, and the substrate is held.

  Patent Document 3 discloses tweezers 57 and 58 including support members 124 to 127 that support a block-shaped substrate (wafer W) that can swing around a shaft stopper 130. The wafer W is supported by a part of the substantially Z-shaped cross section, and is rotated around the shaft stopper 130 by the operation of a built-in wire, so that the wafer W is formed in a V-shape formed on a part of the support member. As shown in FIGS. 7 to 11, the groove 135 is slid down and locked, and finally remounted to the support pins 142 on the cooling plate 141.

JP-A-10-279068 JP 2003-142554 A JP 2000-277600 A

  By the way, in the board | substrate holding apparatus disclosed by patent document 1, in order to provide an electromagnet on the conveyance arm which is a movable part, you have to wire an electricity supply code along the arm which repeats turning and expansion | extension operation | movement continuously. In addition, it is necessary to accurately control the energization switching timing according to the time when the substrate is placed or held. For this reason, the cost increases due to the complexity of the apparatus, and periodic maintenance such as the movable core of the electromagnet, the control unit, and the wiring in the arm is indispensable.

  Further, in the above-described substrate holding device described in Patent Document 2, the substrate pressing and holding member 911 is swung by raising and lowering the permanent magnet 920. Therefore, a cup member that supports the permanent magnet 920 is provided. Equipment to raise and lower will be necessary. For this reason, since the member group provided with the additional movable mechanism is required, there exists a problem of the cost increase of a product, etc.

  Further, in Patent Document 3, the horizontal position of the support member is held by the leaf spring 131, and the whole is rotated around the shaft stopper 130 by the operation of the wire inserted into the frame so that the wafer W slides down. Are fitted and held in the groove 135. For this reason, the wafer W may fall from the frame unless the timing for rotating each support member is adjusted. In addition, the timing adjustment mechanism using the wire is complicated, and trouble is likely to occur. Therefore, the object of the present invention is to solve the above-mentioned problems of the prior art, and with a simple structure, the substrate can be securely held during turning and stretching, and the substrate can be easily released during processing. An object of the present invention is to provide a substrate holding apparatus.

  In order to achieve the above object, the present invention is incorporated in the chuck member of a substrate transport apparatus for transporting a substrate held on a chuck member at the tip of the swing arm to a predetermined delivery position by a swing operation of the transport arm. A substrate holding apparatus configured as described above, wherein the swinging shaft is supported by a bearing flange provided so as to close an opening formed in a part of the chuck member, and the substrate is placed on a part thereof. A pressing member holding frame that rotates about the pivot shaft as a fulcrum shaft, a thrust bearing supported on a part of the pressing member holding frame in parallel with the axis of the chuck member, A pin main body is accommodated in a thrust bearing, and the pin main body slides with rotation along the bearing axial direction in accordance with the inclination of the thrust bearing, and the edge of the substrate placed in a horizontal state, Characterized in that a pressing pin for pressing through the energizing member.

  In the pressing member holding frame, a trigger portion is formed on the side on which the substrate is placed, and a part of the substrate is placed on the trigger portion and rotates. It is preferable that the trigger portion is positioned higher than the counterweight side by a counterweight located at a position opposite to the trigger portion.

  The biasing member preferably uses a compression spring fitted to a pin body located between the tip of the pressing pin and the thrust bearing.

  Further, it is preferable that the urging member includes a compression spring and a leaf spring fitted to a pin body located between the tip of the pressing pin and the thrust bearing.

  As described above, according to the present invention, there is an effect that the substrate holding unit provided at the tip position of the transfer arm can be realized as a compact and cost-effective mechanism.

  Hereinafter, as a best mode for carrying out a substrate holding apparatus of the invention having a common main configuration, a plurality of embodiments described below will be described with reference to the accompanying drawings.

  Hereinafter, an embodiment of a substrate holding device 10 of the present invention will be described with reference to the accompanying drawings. FIG. 1 shows a state in which the first arm 2 and the second arm 3 of the single arm type substrate transfer apparatus 1 of the present invention extend in a straight line. As shown in the figure, a root portion of a fork-shaped chuck 20 capable of holding the substrate on the entire surface is rotatably connected to the tip of the second arm 3 via a third joint portion 6. Yes. FIG. 1 exemplarily shows a state in which the chuck is perpendicular to the second arm 3, and the substrate W placed on the chuck is indicated by a virtual line.

  The first arm 2 is formed of a hollow arm having a flat shape around the first joint portion 4 coaxial with the central axis of the main body of the transport device 1 and capable of a predetermined turning operation by a drive motor (not shown). A second joint 5 is provided between the distal end of the first arm 2 with a reduced width and the second arm 3. Further, the arm rotational driving force from the first arm 2 is supplied to the support shaft of the third joint portion 6 at the tip of the second arm 3 via a transmission mechanism such as a driving belt (not shown) incorporated in the second arm 3. The chuck 20 is controlled in its direction and extension position in the direction corresponding to the turning angle of the first arm 2 and the second arm 3 by the rotational force transmitted to the support shaft (not shown). It is like that.

  In this embodiment, the chuck 20 is formed integrally with the chuck base 21 made of a substantially trapezoidal plate, and has a length suitable for the size (diameter) of the substrate W to be placed. The holding claw 23 for holding the substrate W is formed at the tip of the chuck 20. A portion of the holding claw 23 that is in contact with the edge of the substrate W is formed with a groove-like portion that can be slightly locked to the edge of the substrate W that is in contact and can hold the substrate W. Or you may provide the nail | claw-shaped small member which consists of a resin molded product etc. which the surface is dented when it contact | abuts to the board | substrate W and elastically deforms to such an extent that the mounted board | substrate W can be hold | maintained.

  The substrate holding device 10 is provided at the chuck base portion 21 of the chuck 20 and functions to press the substrate W placed so as to cover almost the entire surface of the chuck 20 to the holding claw 23 side. The substrate holding apparatus 10 has a pressing pin 12 as a movable member that presses the substrate W, and the edge member 19 attached to the tip of the pressing pin 12 presses the edge of the substrate W toward the holding claw 23. Thus, the substrate W is held at a fixed position on the chuck 20.

  Hereinafter, the configuration and operation of the substrate holding apparatus 10 will be described with reference to FIGS. 2, 3, and 4. As shown in FIGS. 2 and 3, the substrate holding device 10 is provided so as to be held in the opening 13 formed near the neck where the width of the chuck base 21 is narrowed. Specifically, the entire apparatus 10 is swingably incorporated in a swing support shaft 16 that is fixed to the lower surface of the chuck base portion 21 and is provided between the side surfaces of a substantially U-shaped bearing flange 14 that is open at the top. It is.

  The substrate holding device 10 includes a swing support shaft 16 that is pivotally supported by a ball bearing 15 fixed to both side surfaces of the bearing flange 14, and a press that swings smoothly within a predetermined angle range using the swing support shaft 16 as a fulcrum shaft. A thrust bearing 18 provided at the upper position of the swing supporting shaft 16 of the member holding frame 17 and the pressing member holding frame 17 in parallel with the axis of the chuck and at a symmetrical position across the axis, and within the thrust bearing 18 A pin body is accommodated, and the thrust pin 18 that slides smoothly in the axial direction of the thrust bearing 18 in accordance with the inclination of the thrust bearing 18 and can press the edge of the substrate W in a horizontal state, and the end of the thrust bearing 18 And a compression spring 30 interposed in the pin between the pin 12 and the tip member 19 of the pressing pin 12 and a central position in the width direction of the pressing member holding frame 17 extending from the vicinity of the swinging support shaft 16 in the direction opposite to the substrate W. The And a counterweight pin 31..

  Among the members described above, the pressing member holding frame 17 is supported so as to be able to swing smoothly around the swing support shaft 16 as described above. The timing of swinging of the pressing member holding frame 17 will be described with reference to FIGS. 3 and 4. As shown in FIG. 3, the pressing member holding frame 17 is formed with an elongated rod-like trigger at the center in the width direction on the front end side. As shown in FIGS. By placing the end portion of the substrate W on the trigger 17a, the entire pressing member holding frame 17 is rotated about the swing support shaft 16 to the horizontal position shown in FIG.

  On the other hand, as shown in FIG. 4A, the initial state of the pressing member holding frame 17 is such that the tip of the trigger 17a slightly protrudes from the chuck upper surface, and the initial inclination is the tip of the trigger 17a in this embodiment. Is set to be inclined about 10 ° above the horizontal plane. This inclination angle can be easily adjusted by adjusting the balance of moment depending on the position of the nut 32 screwed to the counterweight pin 31 extending on the opposite side to the trigger 17a. Further, the pressing pin 12 supported by the thrust bearing 18 is tilted, and the compression spring 30 is contracted by the acting force of the own weight component in the pin axis direction according to the inclination of the own weight, and slides into the thrust bearing 18 to be pressed. The length of the tip side of the pin 12 is slightly shortened.

  The operation from the initial state until the substrate W is gripped will be described with reference to FIGS. When the end portion of the substrate W is placed on the trigger 17a of the pressing member holding frame 17 in the initial state, the trigger 17a rotates in the arrow A direction toward the horizontal position due to its own weight. As the pressing member holding frame 17 rotates, the inclination of the pressing pin 12 supported by the thrust bearing 18 approaches horizontal, and the component force in the pin axis direction of its own weight decreases, so that the compression spring 30 extends by that amount. Thus, the pressing pins 12 slightly protrude toward the substrate W side. Finally, when the substrate W is completely placed on the chuck upper surface, the thrust bearing 18 holding the pressing pin 12 is also in a horizontal state, and the component force of the pressing pin 12 acting on the compression spring 30 is zero at that time. Become. Then, the pressing pin 12 tries to extend to the maximum (natural length) by the action of the compression spring 30, but in the meantime, it contacts the edge of the substrate W, so that the substrate W is pressed to the holding claw side. Pressed and held on the chuck. The compression spring 30 used in this example has a natural length of 5 mm. In the initial state (standby state) shown in FIG. 4A, the compression spring 30 is 0.2 mm due to the component force in the thrust bearing 18 direction of its own weight. It is compressed to a certain extent and enters the thrust bearing 18. After that, when the substrate W is placed on the upper surface of the chuck and the substrate W is pressed in a horizontal state, the protruding portion expands again by the action of the compression spring 30, but the total length slightly shortened from the natural length (in this embodiment) The substrate W is pressed against the edge of the substrate W in a state of about 4.3 mm).

  Hereinafter, other embodiments and modifications of the pressing pin 12 provided in the substrate holding apparatus 10 will be described with reference to FIGS. 5 and 6. FIG. 5 is a plan view showing an embodiment in which the thrust bearing 18 holding the pressing pin 12 is arranged on the axis of the chuck using one pressing pin 12. As shown in the figure, in the present embodiment, a flat resin molded product that can hold the edge of the substrate W within a certain range of width is employed for the tip member 19 of the pressing pin 12. In this embodiment, it is preferable to reduce the weight of the substrate pressing member and to appropriately adjust the inclination of the pressing member holding frame 17 in the initial state by moving the nut 32 of the counter weight pin 31. .

  Each drawing in FIG. 6 shows a modification in which a leaf spring 33 is further attached to the tip of the pressing pin 12 of the substrate holding device 10 shown in FIG. In this embodiment, a thin spring steel product is used as the plate spring 33, and the edge of the substrate W is pressed by the tip member 19 attached to the tip of the plate spring 33. As shown in FIG. 6A, the leaf spring 33 is processed so as to form an opening angle of about 120 ° fixed to the distal end surface of the pressing pin 12 in the initial state, and at the distal end of each leaf spring 19. A resin cap as the tip member 19 is attached. FIG. 6B shows a state in which the substrate holding device 10 presses and holds the substrate W. As shown in FIG. 6B, in this state, the compression spring 30 is shortened and the plate spring 33 is bent. Cooperate with each other to become the pressing force of the pressing pin 12 and the edge of the substrate W is pressed, but the substrate W to be placed is properly balanced so that the amount of compression spring 30 contracted and the amount of bending of plate spring 33 are balanced appropriately. It is preferable to set the spring constant of the compression spring 30 and the bending rigidity of the leaf spring 33 in consideration of the mass, size (curvature), and the like.

  In order to increase the versatility of the substrate holding device 10, it is preferable to be able to cope with the difference in dimension (diameter) of the substrate W to be handled. For this purpose, the opening 13 of the chuck base 21 is formed into a rectangular long hole extending in the axial direction, and the mounting position of the substrate holding device 10 attached to the opening 13 is set to the dimension (diameter of the substrate W to be placed. ), It is possible to cope with changes in dimensions.

The schematic perspective view which showed the whole structure of the board | substrate holding | maintenance apparatus of this invention. The partial top view which expanded and showed the board | substrate holding | maintenance apparatus shown in FIG. The partial enlarged plan view which expanded and showed the board | substrate holding | maintenance apparatus. The operation state figure which showed the operation state of the substrate holding device from the side. The partial enlarged plan view which expanded and showed other examples of the substrate holding device. The partial enlarged plan view which expanded and showed the modification of the board | substrate holding | maintenance apparatus shown in FIG.

Explanation of symbols

DESCRIPTION OF SYMBOLS 1 Board | substrate conveyance apparatus 10 Board | substrate holding apparatus 12 Press pin 13 Opening part 14 Bearing flange 16 Oscillation support shaft 17 Press member holding frame 17a Trigger 18 Thrust bearing 19 Tip member 20 Chuck 21 Chuck root part 22 Fork 30 Compression spring 31 Counter weight pin 33 leaf spring

Claims (4)

A substrate holding device configured to be incorporated in the chuck member of a substrate transport device that transports a substrate held on a chuck member at a tip of the swing arm to a predetermined delivery position by a swing operation of the transport arm,
The swing support shaft supported by a bearing flange provided so as to close an opening formed in a part of the chuck member, and the swing support shaft when the substrate is placed on a part of the support shaft. A pressing member holding frame that rotates as a fulcrum shaft, a thrust bearing supported in parallel with the axis of the chuck member on a part of the pressing member holding frame, and a pin body is accommodated in the thrust bearing, In accordance with the inclination of the thrust bearing, the pin main body includes a pressing pin that slides along a bearing axial direction and presses the edge of the substrate placed in a horizontal state via a biasing member. A substrate holding device.   In the pressing member holding frame, a trigger portion is formed on the side on which the substrate is placed, and a part of the substrate is placed on the trigger portion and rotates. The substrate holding apparatus according to claim 1, wherein the trigger portion is positioned higher than the counterweight side by a counterweight located at a position opposite to the trigger portion.   2. The substrate holding apparatus according to claim 1, wherein the urging member is a compression spring fitted to a pin body located between the tip of the pressing pin and the thrust bearing.   2. The substrate holding apparatus according to claim 1, wherein the urging member includes a compression spring and a plate spring fitted to a pin body located between the tip of the pressing pin and the thrust bearing.

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