JP2006206912A - 高キャパシタンスシート接着剤及びその製法 - Google Patents
高キャパシタンスシート接着剤及びその製法 Download PDFInfo
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- JP2006206912A JP2006206912A JP2006027690A JP2006027690A JP2006206912A JP 2006206912 A JP2006206912 A JP 2006206912A JP 2006027690 A JP2006027690 A JP 2006027690A JP 2006027690 A JP2006027690 A JP 2006027690A JP 2006206912 A JP2006206912 A JP 2006206912A
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Abstract
【解決手段】このフィルムAは、接着剤Eを吸収しており、且つ当該フィルムAに高い誘電率をもたらすためポリマーの少なくとも基礎構造内に充填剤Dを含有しているフルオロポリマーから作られる。本発明のフィルムはコンデンサーで使用するのに、あるいは高いキャパシタンス特性を必要とする用途において使用するのに、特に適している。
【選択図】図1
Description
エポキシ/ガラスプリプレグは、寸法安定性をもたらすために織成されたガラス強化材を使用する。現在、織成ガラス材料を製造するのには制限があって、それは結局はプリプレグの厚さを制限する。ガラスは2枚の金属平面の間での積層中に圧縮せず、そのため厚さは織成ガラスの厚さに制限される。更に、誘電率は材料によって約4.5の大きさに制限される。
下記に記載される本発明は、これらの必要性を満たし、そして従来技術の不都合を回避する。
本発明のなおもう一つの側面は、融解温度あるいは追加の接着剤を使用することなく金属導電性層に直接結合するPTFE「シート」接着性層を提供することである。
観測された密度(ρobs ) は、グラムで表した観測重量を立方センチメートル(cm3 )で表した計算体積で割って計算した。試料の体積は、平均の厚さ、長さ及び幅を掛け算して計算した。各平均値は、少なくとも五つの別々の測定値から得られたものであった。これらの測定値につきまとう不確定性は計算を通じて持ち越された。
ρcalc=Σ(Vi )*(ρi )
この式のVi はi番目の成分の体積分率であり、ρi はi番目の成分の密度である。
8リットルのイソプロパノール中に25.2ポンド(11.4kg)のBaTiO3 /SrTiO3 (フジチタン N−5550、初めに0.5%(w/w)のジフェニルメチルシラン、Huls #P189で処理した)の入ったスラリーを、325メッシュのスクリーンを通して40リットルの容器に入れた。スラリーを約300rpmで攪拌しながら、21.5%の固形分の分散液の形態の9.2ポンド(4.2kg)のPTFEを混合容器へ素早く注ぎ入れた。このPTFE分散液はDu Pont社から入手した水系分散液であった。この混合物は自己凝固性で、5分以内に共凝固が完了した。凝塊を多孔質のチーズクロスの上へ静かに注いで風乾させた。この処理からのろ液は透明であった。
8リットルのイソプロパノール中に25.2ポンド(11.4kg)のBaTiO3 /SrTiO3 (フジチタン N−5550、初めに0.5%(w/w)のジフェニルメチルシラン、Huls #P189で処理した)の入ったスラリーを、325メッシュのスクリーンを通して40リットルの容器に入れた。スラリーを約300rpmで攪拌しながら、21.5%の固形分の分散液の形態の9.2ポンド(4.2kg)のPTFEを混合容器へ素早く注ぎ入れた。このPTFE分散液はDu Pont社から入手した水系分散液であった。この混合物は自己凝固性で、5分以内に共凝固が完了した。凝塊を多孔質のチーズクロスの上へ静かに注いで風乾させた。この処理からのろ液は透明であった。
17.4リットルの水中に8,874gのTiO2 (#203−1A、Ferroの一部門のTranselco)のスラリーを、かき混ぜながら40リットルの容器に入れた。スラリーを約300rpmで攪拌しながら、29.9%の固形分の分散液の形態の11,083gのPTFEと、カチオン系ポリアクリルアミド(Sedipur 802、BASF)の0.4%溶液4450gを混合容器へ素早く注ぎ入れた。このPTFE分散液はDu Pont社から入手した水系分散液であった。この混合物は自己凝固性であり、5分以内に共凝固が完了した。凝塊を多孔質のチーズクロスの上へ静かに注いで風乾させた。
83.5gのTiO2 粉末(TIPure R−900、DuPont社)を、90.2gのMEK中にジシアナミド/2−メチルイミダゾール触媒入りの難燃化したビスフェノール−Aをベースとしたポリグリシジルエーテル(N−4002、Nelco Corp.)が22.5g入った触媒入り溶液に混ぜ入れて、微細分散液を調製した。この分散液は均一性を保証するよう絶えず攪拌した。次に、この樹脂混合物に5.0μmの厚さの延伸膨張PTFEの小片を浸漬し、取り出し、次いで165℃で1分間張力下で乾燥させて柔軟性の複合材料を得た。このプリプレグの単一層を銅箔の間に積み重ね、真空に支援される油圧プレスでもって149℃の温度にて90分間34psi(230KPa)でプレスし、その後加圧下で冷却した。この結果得られた誘電体は、銅に対して良好な付着力を示し、誘電率(1MHzでの)が8.7、そしてキャパシタンスが9,744pF/in2 (1510pF/cm2 )であった。
Claims (22)
- キャパシタンスの高い接着性フィルムを製造する方法であって、初期の空隙容積が少なくとも50%である延伸膨張した多孔質のポリマー基材層を少なくとも一つ供給し、この基材層中にある誘電性充填剤を供給し、当該基材の空隙内に当該フィルムの50体積%未満を構成する接着剤を吸収することを含み、当該フィルムは二つの伝導性平面の間に装着してコンデンサーを製造するのに適合する、接着性フィルムの製造方法。
- 前記基材層として延伸膨張されたフルオロポリマーを供給することを更に含む、請求項1記載の方法。
- 前記誘電性充填剤として、チタン酸カルシウム、チタン酸バリウム、チタン酸ストロンチウムからなる群より選ばれた材料、又はそれらのチタン酸塩の混合物を供給することを更に含む、請求項1記載の方法。
- 前記接着剤として熱硬化性又は熱可塑性樹脂を供給することを更に含む、請求項1記載の方法。
- 基材と樹脂とを、当該基材が当該フィルムの約4〜約85体積%を構成するような比率でもって組み合わせることを更に含む、請求項1記載の方法。
- 基材、充填剤及び樹脂を、当該基材が当該フィルムの約10〜約40体積%を構成するような比率でもって組み合わせることを更に含む、請求項1記載の方法。
- 基材、充填剤及び樹脂を、当該フィルムが約15〜約55体積%の誘電性充填剤を含有するような比率でもって組み合わせることを更に含む、請求項1記載の方法。
- 基材、充填剤及び樹脂を、当該フィルムが15〜40体積%の接着剤を含有するような比率でもって組み合わせることを更に含む、請求項1記載の方法。
- エポキシ樹脂、シアネートエステル樹脂又はポリブタジエン樹脂からなる群より選ばれた接着剤を供給することを更に含む、請求項8記載の方法。
- 下記のものを含む、高誘電性の接着性複合材料。
ポリマーのノード及びフィブリルとそれらの間の空隙との構造体を有する少なくとも一つの多孔質延伸膨張基材層。
当該複合材料中にあって誘電率が少なくとも4.5の複合材料を製造するのに十分な誘電性充填剤。
上記多孔質延伸膨張基材層の空隙内に吸収されており、当該複合材料の50体積%未満を構成している接着剤。 - 少なくとも700pF/in2(109pF/cm2)のキャパシタンスと500V/ミル(20V/μm)より高い絶縁破壊電圧とを有する、請求項10記載の複合材料。
- 前記基材層が延伸膨張ポリテトラフルオロエチレンである、請求項10記載の複合材料。
- 前記基材層がテトラフルオロエチレンコポリマーを含有している延伸膨張ポリテトラフルオロエチレンである、請求項10記載の複合材料。
- 前記誘電性充填剤がチタン酸カルシウム、チタン酸バリウム、チタン酸ストロンチウムからなる群、又はそれらのチタン酸塩の混合物から選ばれる、請求項10記載の複合材料。
- 前記接着剤が熱硬化性又は熱可塑性樹脂である、請求項10記載の複合材料。
- 前記接着剤がエポキシ樹脂、シアネートエステル樹脂又はポリブタジエン樹脂からなる群より選ばれる、請求項10記載の複合材料。
- 請求項12記載の複合材料に付着した金属層を含む積層体。
- 前記金属層が銅箔の層である、請求項17記載の積層体。
- 前記基材が当該複合材料の約10〜40体積%を構成している、請求項10記載の複合材料。
- 前記誘電性充填剤が当該複合材料の約15〜55体積%を構成している、請求項10記載の複合材料。
- 前記樹脂が当該複合材料の約15〜40体積%を構成している、請求項10記載の複合材料。
- 下記のものを含むコンデンサー。
ノード−フィブリル構造を有する少なくとも一つの多孔質フルオロポリマー基材層から作られた複合材料の少なくとも片側に積層された金属箔層。
少なくとも上記ノード内にある誘電性充填剤。
上記フルオロポリマー基材中に、当該ノードとフィブリルの間の空隙内に吸収されていて、上記複合材料の50体積%未満を構成している接着剤。
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US08/311,634 US5538756A (en) | 1994-09-23 | 1994-09-23 | High capacitance sheet adhesives and process for making the same |
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JP8510847A Division JPH09506476A (ja) | 1994-09-23 | 1994-12-02 | 高キャパシタンスシート接着剤及びその製法 |
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JP4520416B2 JP4520416B2 (ja) | 2010-08-04 |
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JP8510847A Withdrawn JPH09506476A (ja) | 1994-09-23 | 1994-12-02 | 高キャパシタンスシート接着剤及びその製法 |
JP2006027690A Expired - Lifetime JP4520416B2 (ja) | 1994-09-23 | 2006-02-03 | 高キャパシタンスシート接着剤及びその製法 |
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US (2) | US5538756A (ja) |
EP (1) | EP0730815B1 (ja) |
JP (2) | JPH09506476A (ja) |
AU (1) | AU1263795A (ja) |
DE (1) | DE69430254T2 (ja) |
WO (1) | WO1996009747A1 (ja) |
Cited By (1)
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JP2010530018A (ja) * | 2007-06-13 | 2010-09-02 | ビーエーエスエフ ソシエタス・ヨーロピア | エポキシドの硬化のための触媒 |
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WO1998020713A1 (en) * | 1996-11-08 | 1998-05-14 | W.L. Gore & Associates, Inc. | Dimensionally stable solder mask material and method of application |
JPH10219013A (ja) * | 1997-02-03 | 1998-08-18 | Japan Gore Tex Inc | 制電性材料 |
US6537703B2 (en) | 1998-11-12 | 2003-03-25 | Valence Technology, Inc. | Polymeric mesoporous separator elements for laminated lithium-ion rechargeable batteries |
US6225939B1 (en) | 1999-01-22 | 2001-05-01 | Mcdonnell Douglas Corporation | Impedance sheet device |
JP3638889B2 (ja) * | 2000-07-27 | 2005-04-13 | 大塚化学ホールディングス株式会社 | 誘電性樹脂発泡体及びそれを用いた電波レンズ |
US6500529B1 (en) * | 2001-09-14 | 2002-12-31 | Tonoga, Ltd. | Low signal loss bonding ply for multilayer circuit boards |
US6783841B2 (en) | 2001-09-14 | 2004-08-31 | Tonoga, Inc. | Low signal loss bonding ply for multilayer circuit boards |
US6737158B1 (en) * | 2002-10-30 | 2004-05-18 | Gore Enterprise Holdings, Inc. | Porous polymeric membrane toughened composites |
US20050121226A1 (en) * | 2003-10-21 | 2005-06-09 | Park Electrochemical Corporation | Laminates having a low dielectric constant, low disapation factor bond core and method of making same |
US20110102966A1 (en) * | 2008-07-10 | 2011-05-05 | Hiroki Takeoka | Molded capacitor and method for manufacturing the same |
US20100092759A1 (en) * | 2008-10-13 | 2010-04-15 | Hua Fan | Fluoropolymer/particulate filled protective sheet |
US8223472B1 (en) | 2008-11-14 | 2012-07-17 | Sandia Corporation | Norbornylene-based polymer systems for dielectric applications |
WO2011046769A1 (en) * | 2009-10-14 | 2011-04-21 | Lockheed Martin Corporation | Protective circuit board cover |
WO2011123263A1 (en) | 2010-03-31 | 2011-10-06 | 3M Innovative Properties Company | Electronic articles for displays and methods of making same |
US8947889B2 (en) | 2010-10-14 | 2015-02-03 | Lockheed Martin Corporation | Conformal electromagnetic (EM) detector |
CN102260378B (zh) | 2011-05-06 | 2013-03-20 | 广东生益科技股份有限公司 | 复合材料、用其制作的高频电路基板及其制作方法 |
CN111303788A (zh) * | 2020-02-25 | 2020-06-19 | 深圳赛兰仕科创有限公司 | 高频复合材料及其制备方法 |
CN111218072B (zh) * | 2020-02-29 | 2022-04-01 | 杭州电子科技大学 | 一种高介电高储能的二维片状钛酸锶复合材料及制备方法 |
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- 1994-12-02 WO PCT/US1994/013789 patent/WO1996009747A1/en active IP Right Grant
- 1994-12-02 EP EP95903654A patent/EP0730815B1/en not_active Expired - Lifetime
- 1994-12-02 AU AU12637/95A patent/AU1263795A/en not_active Abandoned
- 1994-12-02 DE DE69430254T patent/DE69430254T2/de not_active Expired - Lifetime
- 1994-12-02 JP JP8510847A patent/JPH09506476A/ja not_active Withdrawn
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1996
- 1996-02-16 US US08/609,760 patent/US5635293A/en not_active Expired - Lifetime
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JPH09506476A (ja) | 1997-06-24 |
EP0730815A1 (en) | 1996-09-11 |
US5635293A (en) | 1997-06-03 |
JP4520416B2 (ja) | 2010-08-04 |
DE69430254T2 (de) | 2002-11-14 |
AU1263795A (en) | 1996-04-09 |
EP0730815B1 (en) | 2002-03-27 |
US5538756A (en) | 1996-07-23 |
WO1996009747A1 (en) | 1996-03-28 |
DE69430254D1 (de) | 2002-05-02 |
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