JP2006203472A - Imaging apparatus - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide an imaging apparatus which prevents an increase in cost and restriction of design and can be shielded so that an unnecessary radio wave is not radiated to the outside. <P>SOLUTION: The imaging apparatus 200 has an LCD frame 231, an operation substrate 229, a main substrate 228, and a main chassis 227. The LCD frame 231 and operation substrate 229 are arranged nearly in parallel to the main substrate 228 so as to cover one surface of the main substrate 228, the main chassis 227 is arranged nearly in parallel to the main substrate 228 so as to cover the other surface of the main substrate 228 and also electrically connected to ground patterns included in the LCD frame 231 and operation substrate 229 and a ground pattern included in the main substrate 228. <P>COPYRIGHT: (C)2006,JPO&NCIPI

Description

  The present invention relates to an imaging apparatus, and more particularly to an imaging apparatus having a shield structure that shields unnecessary radio waves emitted to the outside.

  A conventional electronic imaging apparatus converts a subject image acquired through a photographing optical system into a signal by an imaging element such as a CCD, performs a plurality of analog processes on the converted signal, performs A / D conversion, and performs this processing. The signal is converted to digitized data, the data is appropriately processed by an image processing circuit, the data processed data is compressed, and this compression is performed on a recording medium built in or attached to the electronic imaging device Saved data.

  In recent years, it has been desired to increase the number of pixels of an image sensor and shorten the processing time, and accordingly, the processing speed of the image processing circuit is required to be increased. However, when the processing speed of the image processing circuit is increased, Unnecessary radio waves emitted from the periphery of the image processing circuit and from the image processing circuit itself increase, and the radio waves affect the electronic imaging device itself and peripheral devices of the electronic imaging device.

  Therefore, in order to shield unnecessary radio waves (hereinafter referred to as “shield”), a dedicated metal shield case connected to the ground pattern of the electric circuit board emits a circuit on the electric circuit board, particularly unnecessary radio waves. An imaging device arranged so as to cover the vicinity of the circuit, an imaging device arranged so that a dedicated sheet-like metal shield plate connected to the ground pattern of the electric circuit board covers the entire imaging device, and an electric circuit board An imaging apparatus having an exterior cover made of a conductive material electrically connected to a ground pattern has been proposed.

  In addition, an imaging device has been proposed that realizes shielding of unnecessary radio waves based on the positional relationship among a digital circuit board, an analog circuit board, a power supply board, a memory card connector, and a liquid crystal display device (see, for example, Patent Document 1).

Furthermore, an image pickup device is proposed in which the memory card connector and the holding member that supports the liquid crystal display device are integrated and connected to the ground pattern of the main board to strengthen the ground and improve the shielding effect of unnecessary radio waves. (For example, refer to Patent Document 2).
JP-A-11-225282 (5th page, FIG. 1, FIG. 1) JP-A-11-331667 (page 7, FIG. 3)

  However, an image pickup apparatus using the dedicated metal shield case or sheet-shaped metal shield plate leads to a reduction in space efficiency and an increase in cost due to an increase in the unit cost of components and the number of assembly steps. An imaging device that uses a conductive material for the exterior cover described above, when applying a conductive coating to a plastic exterior cover, using an exterior cover made of a special conductive material, or using a metal exterior cover In some cases, this leads to cost increase and the design of the exterior cover is restricted.

  Further, in the imaging device of Patent Document 1, since the position where the memory card connector is arranged is regulated, the design of the imaging device is regulated, and a plurality of substrates such as an analog circuit board and a digital circuit board are used. Leads to.

  Further, in the imaging device of Patent Document 2, since the memory card connector is arranged on substantially the same plane as the liquid crystal display device, operation buttons and the like cannot be arranged on the left and right sides of the liquid crystal display device on the back of the imaging device. The design of the imaging device is regulated.

  An object of the present invention is to provide an image pickup apparatus that can prevent an increase in cost and regulation of the design and shield the emission of unnecessary radio waves to the outside.

  In order to achieve the above object, an image pickup apparatus according to claim 1 includes a display unit, a metal frame that holds the display unit, a first wiring pattern including two or more wiring layers and including one or more ground patterns. An electric circuit board, a second electric circuit board including an image processing circuit element for performing image processing and a ground pattern, and a metal chassis which is a main structure, and the metal frame and the first electric circuit board include: The metal chassis is disposed substantially parallel to the second electric circuit board so as to cover one surface of the second electric circuit board, and the metal chassis is disposed on the other surface of the second electric circuit board. So as to cover the metal frame, the ground pattern included in the first electric circuit board, and the second electric circuit board. Included ground Characterized in that it is electrically conductive to turn.

  According to the present invention, the metal frame and the first electric circuit board are disposed substantially parallel to the second electric circuit board so as to cover one surface of the second electric circuit board, and the metal chassis. Is disposed substantially parallel to the second electric circuit board so as to cover the other surface of the second electric circuit board, and a metal frame, a ground pattern included in the first electric circuit board, In addition, since it is electrically connected to the ground pattern included in the second electric circuit board, it is possible to prevent cost increase and design restriction, and to shield the emission of unnecessary radio waves to the outside.

  Hereinafter, embodiments of the present invention will be described in detail with reference to the drawings.

  FIG. 1 is a front perspective view schematically showing a configuration of an imaging apparatus according to an embodiment of the present invention.

  In FIG. 1, the imaging apparatus 200 includes a lens barrel unit 201 provided with a photographing optical system, a lens barrier, an imaging element such as a CCD or CMSO, a feeding mechanism, a zoom mechanism, and a shutter on the front surface portion thereof. The imaging optical system disposed inside the barrel unit 201 forms a subject image on the imaging element.

  A grip unit 202 is provided on the right side of the imaging apparatus 200 so that the user can easily hold the imaging apparatus 200 with the right hand.

  The imaging apparatus 200 has a strobe light emission window 203 that emits light as necessary when the amount of light is insufficient at the time of shooting, a microphone 204 for voice input, and a front cover 205 that covers the front part of the imaging apparatus 200. And an objective lens 206a and a bayonet cup 207.

  The front cover 205 is formed with an opening 205a for exposing the strobe light emission window 203 and an opening 205b for exposing the objective lens 206a of the finder optical system. The bayonet cup 207 serves to conceal an accessory lens mounting seat (not shown) formed on the front cover 205 when an accessory lens (not shown) is not used.

  FIG. 2 is a front perspective view schematically showing the configuration of the imaging apparatus 200 of FIG.

  This figure shows a state where the power of the imaging apparatus 200 is turned on and the lens barrel unit 201 is extended.

  In FIG. 2, the imaging apparatus 200 includes a power button 208 and a zoom dial 209 on the top surface thereof.

  When the imaging apparatus 200 is turned on by the power button 208, the lens barrel unit 201 is extended to a predetermined position as shown in FIG.

  The zoom dial 209 is an input interface to the imaging apparatus 200, and can be rotated clockwise and counterclockwise to a predetermined position. The zoom dial 209 changes the positional relationship of the lens groups of the photographing optical system provided in the lens barrel unit 201, and zooms from wide angle to telephoto.

  FIG. 3 is a rear perspective view schematically showing the configuration of the imaging apparatus 200 of FIG.

  In FIG. 3, the imaging apparatus 200 has a rear cover 210 that covers the rear part of the imaging apparatus 200, a liquid crystal display device 211 that is a display unit that displays characters, images, and the like, and an eyepiece lens of a finder optical system. 206b, and a shutter button 212 and a sound reproduction speaker 213 on the upper surface.

  The liquid crystal display device 211 is used for displaying a subject image to be captured, reproducing and displaying the captured image, and displaying a selection menu and icons for changing settings of the imaging device 200. The rear cover 210 is formed with an opening or a see-through window for exposing the liquid crystal display device 211.

  The user can view the subject by looking into the eyepiece lens 206b. The subject is imaged by operating the shutter button 212, and the image data of the captured subject image is recorded on a recording medium built in the imaging apparatus 200. At this time, audio data from the microphone 204 (FIG. 1) is also recorded together with the image data. Audio stored in the recording medium, operation sounds recorded in the recording medium in advance, and the like are reproduced by the audio reproducing speaker 213.

  The imaging device 200 includes a battery lid (not shown) and a memory card lid 215 on the bottom surface thereof. By opening the battery cover, a main battery (not shown) serving as a power source can be inserted into and removed from the imaging apparatus 200. Further, by opening the memory card lid 215, a recording medium (not shown) can be inserted into and removed from the imaging apparatus 200.

  The imaging apparatus 200 includes a mode lever 214, display operation buttons 216 and 217, an enter button 218, and a cross button 219 on the back side thereof. The mode lever 214 is used to select one of the shooting mode and the playback mode. The display operation button 216 is used for setting the imaging apparatus 200 and switching menus. The display operation button 217 is used to switch the liquid crystal display device on / off, change the brightness of the liquid crystal display device, and the like. The cross button 219 is used for inputting the vertical and horizontal directions.

  The user operates the operation buttons 216 to 219 while looking at the menus and icons displayed on the liquid crystal display device 211. Therefore, by arranging the operation buttons 216 to 219 in the vicinity of the liquid crystal display device 211, the convenience of the user is improved. Can be improved.

  By disposing the liquid crystal display device 211 and the lens barrel unit 201a so that the center of the display area of the liquid crystal display device 211 coincides with the optical axis of the photographing optical system of the lens barrel unit 201a, the liquid crystal display device can be used without causing the user to feel uncomfortable. In 211, the subject can be confirmed.

  FIG. 4 is a developed perspective view showing the internal configuration of the imaging apparatus 200 of FIG.

  In FIG. 4, the imaging apparatus 200 includes a front cover 205, a rear cover 210, a battery chamber unit 220, a battery lid unit 221, a side cover unit 222, a top base unit 223, a strobe finder unit 224, a memory A card 225 and a main unit 226 are provided.

  The front cover 205 is formed with a zoom dial 209, a shutter button 212, a power button 208, and the like. The rear cover 210 is formed with operation buttons 216 to 219, a mode lever 214, a memory card cover 215, and the like. The memory card 225 records image data, audio data, and the like, and can be inserted into and removed from a memory card slot described later.

  The rear cover 210 is formed with a protrusion 210 a corresponding to the operation buttons 216 to 219 and a hooking portion 210 b corresponding to the mode lever 214.

  FIG. 5 is a front perspective view showing the configuration of the main unit 226 in FIG.

  In FIG. 5, a main unit 226 includes a lens barrel unit 201, a metal main chassis 227 (metal chassis) which is a main structure, and a main board 228 (second electric circuit board) made of an electric circuit board. Screws 230a to 230d.

  The lens barrel unit 201 is provided with flange portions 201c and 201d. Further, holes are provided in the flange portions 201c and 201d, and screws 230a and 230b are attached to the main chassis 227 through the holes. , 230c. A part of the plastic member having conductivity is used as a constituent member of the lens barrel unit 201.

  The main board 228 includes an AV output connector 228a, a USB connector 228b, and an external power connector 228c that are external interfaces of the imaging apparatus 200. The main board 228 also acquires a CPU that controls the entire imaging apparatus 200, an A / D conversion circuit that converts an analog signal output from a CCD included in the lens barrel unit 201 into a digital signal, and a converted digital signal. And an image processing circuit for performing appropriate calculations, a flash memory, a memory card slot, and a power supply circuit for appropriately converting the power received from the main battery into a voltage (not shown).

  In the present embodiment, since various connectors are arranged on the main board 228, compared to the case where various connectors are arranged on another board and the various connectors are connected to the main board 228 using a flat cable or the like. The signal wiring section is shortened. Thereby, the unnecessary radio wave emitted from the electric signal wiring portion can be reduced.

  The metal top chassis 223a is a constituent member of the top base unit 223 (FIG. 4) and is not included in the main unit 226, but is described here for the sake of clarity. The top chassis 223a is fastened to the main chassis 227 with screws 230d.

  FIG. 6 is a rear perspective view showing the configuration of the main unit 226 of FIG.

  In FIG. 6, the main unit 226 includes an LCD 232 (display means) (FIG. 6) that is a component of the liquid crystal display device 211, an LCD frame 231 (metal frame) that holds the LCD 232, and an operation board 229 including an electric circuit board. (First electric circuit board) and screws 230e to 230i, 230n.

  The main board 228, the main chassis 227, the operation board 229, and the LCD frame 231 are disposed substantially parallel to each other and orthogonal to the optical axis of the photographing optical system of the barrel unit 201.

  The LCD 232 is locked by the hook portions 231a and 231b of the LCD frame 231 so as to be urged in the center direction. The hook portions 231a and 231b are similarly arranged at substantially symmetrical positions around the LCD 232, and electrically connect the LCD 232 and the LCD frame 231. The LCD frame 231 is fastened to the main chassis 227 by screws 230n, fastened to the top chassis 223a by screws 230e, and fastened to the main board 228 and the main chassis 227 by screws 230g. The LCD frame 231 is made of metal (for example, a stainless steel plate having a thickness of about 0.2 mm).

  The main board 228 is provided with a memory card slot 228d into which a memory card is inserted.

  The operation board 229 is a double-sided wiring printed hard board, and has a thickness and sufficient strength so as not to be deformed when the operation buttons 216 to 219 disposed on the rear cover 210 are pressed. The operation board 229 may be configured by a hard board, and two or more layers of a flexible printed circuit board (FPC) in which a ground pattern is wired in one or more layers and its holding means (a metal plate or plastic resin having sufficient strength) Plate).

  The operation substrate 229 has two pattern wiring layers. A tact switch 229a and a slide switch 229b are arranged on one surface 229c of the operation board 229, and these switches are operated by a protrusion 210a and a hook 210b formed on the rear cover 210, respectively. It is configured.

  On the other surface 229d of the operation board 229, a ground pattern (for example, made of a copper foil having a thickness of about 20 μm) is wired solidly, and is configured to serve as a radio wave shield. The operation board 229 is fastened to the top chassis 223a by screws 203f, and fastened to the bottom chassis 233 of FIG. 7 described later by screws 230h.

  The LCD frame 231 and the operation board 229 are arranged side by side on substantially the same plane (the support part of the LCD frame 231 may partially overlap the operation board 229), and these are formed on the main board 228. Electrically connected.

  FIG. 7 is an exploded perspective view showing the configuration of the main unit 226 of FIG.

  In FIG. 7, the main unit 226 includes a bottom chassis 233, a backlight member 234 that illuminates the LCD 232 from behind, and screws 230j to 230m.

  The main board 228 is fastened to the main chassis 227 with screws 230j and 230m.

  The metal bottom chassis 223 is fastened to the main chassis 227 with screws 230k and 230l.

  Thus, the main board 228, the operation board 229, and the LCD frame 231 are directly fastened to the main chassis 227, or fastened to the main chassis 227 through the top chassis 223a and the bottom chassis 233.

  The main board 228 includes a flexible connector 228i for connecting the CCD 201a arranged in the lens barrel unit 201 to the main board 228 by a flexible printed circuit board (FPC) (not shown), and image processing arranged inside the LCD frame 231. A circuit 228e and a connector 228j that is an I / F of the LCD 232 are provided.

  The bottom chassis 233 and the top chassis 223a are auxiliary metal members of the main chassis 227, which is the main structure, and further enhance the electrical connection between the main chassis 227, the main board 228, the operation board 229, and the LCD frame 231. . Further, the top chassis 223a has an effect of shielding unnecessary radio waves from being emitted on the upper side of the imaging device 200 and the bottom chassis 233 is shielded on the lower side of the imaging device 200.

  5-7, each board | substrate and each metal member are fastened with the screws 230a-230n, and are electrically connected as shown to Fig.8 (a) and FIG.8 (b).

  In FIG. 8A, the board 301 (the main board 228 or the operation board 229) is made of the metal member 302 (the main chassis 227, the bottom chassis 233, the top chassis) by a metal screw 303 (any one of the screws 230a to 230n). 223a or the LCD frame 231). The substrate 301 is provided with a ground pattern exposing portion 301a for electrical connection with the screw 303 around a hole through which the screw 303 is passed. FIG. 8B shows a cross section along A-A in FIG.

  In FIG. 8B, the diameter of the ground pattern exposing portion 301 a is configured to be sufficiently larger than the diameter of the head portion of the screw 303. As a result, the screw 303 is reliably electrically connected to the ground pattern exposing portion 301a.

  As shown in FIGS. 5 to 7, the imaging device 200 includes a first layer of the main chassis 227, a second layer of the main board 228, an LCD frame 231 and an operation board 229 that are arranged on substantially the same plane. And a third layer. The first, second, and third layers are disposed substantially parallel to each other, and the second layer is disposed so as to be sandwiched between the first and third layers. The first and third layers are electrically connected to the ground pattern of the main substrate 228 that is the second layer.

  In particular, the image processing circuit 228e serving as a source of unnecessary radio waves is disposed inside the LCD frame 231 having a high radio wave shielding effect of the third layer.

  FIG. 9 is a block diagram showing an internal configuration of the imaging apparatus 200 of FIG.

  In FIG. 9, an imaging apparatus 200 includes an imaging optical system 201b and a CCD 201a disposed in a lens barrel unit 201, an analog circuit 228f that performs various processes on analog signals, and an A / D that converts analog signals into digital signals. It includes a converter 228g, an image processing circuit 228e that performs various processes on digital signals, a central processing unit (CPU) 228h that controls the entire imaging apparatus 200, a display device (LCD) 232, and a memory card 225.

  The imaging optical system 201b is composed of, for example, a zoom lens including a plurality of lenses, and zooming driving in the tele or wide direction is performed by a driving force from a lens driving unit (not shown) including a motor. The photographing optical system 201b includes a focus lens system that can be moved by an autofocus function controlled by the CPU 228h.

  The subject image formed on the light receiving surface of the CCD 201a via the imaging optical system 201b is photoelectrically converted in the CCD 201a and sequentially read out as a video signal. The video signal read from the CCD 201a is sampled and held for each pixel by a CDS circuit section (not shown) of the analog processing circuit 228f, amplified by a gain control amplifier (not shown) of the analog processing circuit 228f, and then A The digital signal is converted into R, G, B dot-sequential digital signals by the / D converter 228g and input to the image processing circuit 228e.

  The CCD 201a, the CDS circuit, and the image processing circuit 228e are synchronized by a timing signal acquired from a timing generator (not shown) controlled by the CPU 228h.

  The signal processing unit of the image processing circuit 228e includes digital processing circuits (not shown) such as a luminance signal generation circuit, a color difference signal generation circuit, a photometric value calculation circuit, and a compression / decompression circuit. The video signal output from the A / D converter 228g is appropriately processed in the image processing circuit 228e and input to the LCD 232 as a monitor output signal.

  If the LCD 232 supports analog signal input, a D / A converter is provided at the subsequent stage of the image processing circuit 228e to convert the image data into an analog signal, and then input the analog signal to the LCD 232 To do.

  Thereby, the video acquired from the CCD 201a is displayed on the LCD 232. The LCD 232 can display not only a still image shot in response to pressing of the shutter button 212 (release operation) but also a video (moving image or intermittent image) before the release operation. The image data output from the image processing circuit 228e is compressed in a predetermined format such as JPEG, and is recorded on a recording medium such as a memory card 225 in response to an input of a shooting start signal.

  In the present embodiment, the memory card 225 is used as a recording medium. However, the present invention is not limited to this, and the flash memory incorporated in the imaging device 200, a magneto-optical disk that can be attached to and detached from the imaging device 200, or an IC. A card or the like may be used.

  Further, in this imaging apparatus 200, a shooting start signal is issued in response to pressing of the shutter button 212, but the shooting start signal may be input from an external device through communication with the external device or the like.

  The CPU 228h controls and controls each circuit of the imaging device 200. For example, the CPU 228h performs driving control of the CCD 201a such as focusing for performing shooting and control of the analog signal processing circuit 228g and the image processing circuit 228e in response to pressing of the shutter button 212.

  The CPU 228h also performs various calculations such as an exposure value and a focus position in accordance with a predetermined algorithm, and controls automatic exposure control, auto focus, auto strobe, auto white balance, and the like. For example, the CPU 228h sets the exposure value by controlling the electronic shutter value of the CCD 201a based on the exposure value calculated based on the image signal, or controls the gain control amplifier based on the calculated RB gain value to adjust the white balance. Set.

  The CPU 228h further calculates a focus evaluation value indicating the sharpness of the subject image based on the image signal, calculates a focus position based on the focus evaluation value, and the focus system of the photographing lens 34 based on the calculated focus position. To set the focus position. The autofocus is not limited to the above method, and may be performed using a known distance measuring unit such as an AF sensor.

  The CPU 228h further controls the zoom optical system via the lens driving unit based on the focal length of the photographing optical system set by the user with the zoom dial 209, and sets the focal length of the photographing optical system 201b.

  The main board 228 includes an analog processing circuit 228f, an A / D converter 228g, an image processing circuit 228e, a CPU 228h, and a flexible connector 228i for connecting to an analog signal line from the CCD 201a.

  The main board 228 also includes a memory card slot 228d that is an interface of the memory card, various connectors 228a to 228c that are external I / F units, a power supply circuit (not shown) that appropriately converts power received from the main battery, A connector 228j that is an I / F with the LCD 232 may be included.

  FIG. 10 is a front view schematically showing the configuration of the imaging apparatus 200 of FIG.

  In FIG. 10, the imaging apparatus 200 includes a front cover 205, a rear cover 210, a lens barrel unit 201, a main chassis 227, a main substrate 228, an operation substrate 229, and an LCD frame 231.

  The main chassis 227 is formed with a notch 227a for disposing the lens barrel unit 201.

  FIG. 11 is a side view schematically showing the configuration of the imaging apparatus 200 of FIG.

  In FIG. 11, the imaging apparatus 200 includes a first layer of a metal main chassis 227 and a second layer of a main board 228 on which circuits and components are arranged. The LCD frame 231 and the third layer of the operation board 229 are included. The first, second, and third layers are disposed substantially parallel to each other, and the second layer is disposed so as to be sandwiched between the first and third layers.

  FIG. 12 is a rear view schematically showing the configuration of the imaging apparatus 200 of FIG.

  In FIG. 12, the operation substrate 229 has two pattern wiring layers. A tact switch 229a and a slide switch 229b are arranged on one surface 229c of the operation board 229, and a ground pattern is wired on almost the entire other surface 229d of the operation board 229.

  The other surface 229d and the LCD frame 231 are electrically connected, and a radio wave shield layer (B shield layer) is formed in the third layer portion by two members of the operation board 229 and the LCD frame 231.

  The metal main chassis 227 has a radio wave shield layer (A shield layer) in the first layer portion.

  The A shield layer and the B shield layer are electrically connected to the ground pattern of the main board 228 by a metal screw or the like. The main substrate 228 is provided with an image processing circuit 228e and elements constituting the image processing circuit 228e, and the image processing circuit 228e is a high-frequency circuit, and thus is an unnecessary radio wave emission source. Since the A shield layer and the B shield layer shield this unnecessary radio wave, it is possible to prevent the unnecessary radio wave from being emitted to the outside of the imaging apparatus 200.

  In the B shield layer, the LCD frame 231 is made of metal (for example, a stainless steel plate having a thickness of about 0.2 mm), and the operation substrate 229 is made of a ground pattern of 229c (for example, a copper foil having a thickness of about 20 μm). The frame 231 provides a higher radio wave shielding effect than the operation board 229. Therefore, at least a part of the elements constituting the image processing circuit 228e and the image processing circuit 228e, which are main emission sources of unnecessary radio waves, are positions on the main substrate 228 covered by the LCD frame 231 as shown in FIG. It is preferable to be provided. Thereby, a high radio wave shielding effect can be obtained.

  A flexible connector 228i, an analog circuit 228f, an A / D conversion circuit 228g, and a CPU 228h, which are entrances of weak signals from the CCD 201a, are provided in the vicinity of the image processing circuit 228e and covered with the LCD frame 231 in order to shorten the wiring. It is preferable to be provided at a position. Thereby, a high radio wave shielding effect can be obtained.

  In the present embodiment, the main chassis 227 is provided with a notch 227a for disposing the lens barrel unit 201. However, the plastic member constituting the lens barrel unit 201 is electrically conductive as necessary. A high carbon shielding effect can be obtained by applying a conductive carbon-containing member or a coating such as applying a conductive layer and electrically connecting to the main chassis 227.

  The display means is not limited to the LCD, but may be another display device such as an EL. The type and number of switches provided on the operation board 229 are merely examples, and are not limited thereto. The operation substrate 229 may be a substrate composed of three or more layers. In this case, by providing a plurality of layers of ground patterns on the operation substrate 229, a higher radio wave shielding effect can be obtained.

  In the present embodiment, the imaging apparatus with an optical zoom mechanism has been described as an example, but a single-focus imaging apparatus may be used.

  In the present embodiment, the LCD frame 231 and the operation board 229 are arranged on substantially the same plane, but they are not limited to being arranged on the substantially same plane.

  For example, if the LCD frame 231 and the operation board 229 are arranged so that part or all of them overlap, and the ground pattern layer of the operation board 229 and the LCD frame 231 are electrically connected to the main board 228, The B shield layer has a two-layer structure, and an even higher radio wave shielding effect can be obtained.

  In addition, for example, by arranging the LCD frame 231 on the operation board 229, the B shield layer has a two-layer structure, so that a higher radio wave shielding effect can be obtained and the imaging device 200 can be further reduced in thickness. can do.

  A part or all of the covers such as the front cover 205 and the rear cover 210 may be made of metal. In this case, by electrically connecting the metal constituting the cover to the ground pattern of the main board 228, further A high radio wave shielding effect can be obtained.

  Further, a part or all of the cover may be made of a plastic resin subjected to conductive coating, or a plastic resin containing a conductive component material such as carbon. In this case, the plastic resin constituting the cover is attached to the main substrate 228. By electrically connecting to the ground pattern, a higher radio wave shielding effect can be obtained.

1 is a front perspective view schematically showing a configuration of an imaging apparatus according to an embodiment of the present invention. FIG. 2 is a front perspective view schematically showing a configuration of the imaging apparatus in FIG. 1. FIG. 2 is a rear perspective view schematically showing a configuration of the imaging apparatus in FIG. 1. FIG. 2 is a developed perspective view illustrating an internal configuration of the imaging apparatus in FIG. 1. It is a front perspective view which shows the structure of the main unit in FIG. FIG. 6 is a rear perspective view showing the configuration of the main unit in FIG. 5. FIG. 6 is an exploded perspective view showing the configuration of the main unit in FIG. 5. It is a figure which shows the screw fastening part of the main unit of FIG. 5, (a) is a front view, (b) is sectional drawing. It is a block diagram which shows the internal structure of the imaging device of FIG. It is a front view which shows typically the structure of the imaging device of FIG. It is a side view which shows typically the structure of the imaging device of FIG. It is a rear view which shows typically the structure of the imaging device of FIG.

Explanation of symbols

200 Imaging Device 201 Barrel Unit 226 Main Unit 227 Main Chassis 228 Main Substrate 228e Image Processing Circuit 228h CPU
229 Operation board 231 LCD frame 232 LCD

Claims (5)

  A display unit; a metal frame that holds the display unit; a first electric circuit board that includes two or more wiring layers and includes one or more ground patterns; an image processing circuit element that performs image processing; and a ground pattern A metal chassis that is a main structure, and the metal frame and the first electric circuit board cover one surface of the second electric circuit board, The metal chassis is arranged substantially parallel to the second electric circuit board, and the metal chassis is substantially parallel to the second electric circuit board so as to cover the other surface of the second electric circuit board. And is electrically connected to the ground pattern included in the metal frame, the ground pattern included in the first electric circuit board, and the ground pattern included in the second electric circuit board. apparatus   The imaging apparatus according to claim 1, wherein at least a part of the image processing circuit element is disposed at a position covered with the metal frame on the second electric circuit board.   The imaging apparatus according to claim 1, wherein the second electric circuit board includes a power supply circuit.   The imaging apparatus according to claim 1, wherein the second electric circuit board includes an external connection terminal.   5. The image pickup apparatus according to claim 1, wherein the second electric circuit board includes a storage medium connection portion into which a recording medium is inserted and removed.

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