JP2006202506A - Rotary electronic component - Google Patents

Rotary electronic component Download PDF

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JP2006202506A
JP2006202506A JP2005009846A JP2005009846A JP2006202506A JP 2006202506 A JP2006202506 A JP 2006202506A JP 2005009846 A JP2005009846 A JP 2005009846A JP 2005009846 A JP2005009846 A JP 2005009846A JP 2006202506 A JP2006202506 A JP 2006202506A
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case
contact
electronic component
contact body
wiring board
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JP4496965B2 (en
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Takahiro Nishimura
貴裕 西村
Koji Ono
耕治 尾野
Jun Sato
順 佐藤
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Panasonic Holdings Corp
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Matsushita Electric Industrial Co Ltd
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Abstract

<P>PROBLEM TO BE SOLVED: To provide a rotary electronic component for use as, for example, operation parts of various electronic devices that stabilizes soldered states of terminals after reflow soldering. <P>SOLUTION: A case 21 is constituted by combining a main part 31 and a contact fixing part 32 with a slight clearance between. The clearance can absorb differences in thermal expansion/shrinkage between members including a wiring board 10 caused when the terminals 43 are reflow-soldered, to deter an influence on soldered portions of the terminals 43 and stabilize the soldered states of the terminals 43. <P>COPYRIGHT: (C)2006,JPO&NCIPI

Description

本発明は、各種電子機器の操作部分等に用いられる回転型電子部品に関するものである。   The present invention relates to a rotary electronic component used in an operation part of various electronic devices.

近年、電子機器の小型・軽量化が進むと共に、その機器内に配される配線基板に対して各種電子部品をリフロー半田付けして実装することが多くなってきた。   In recent years, as electronic devices have become smaller and lighter, various electronic components are often mounted by reflow soldering on a wiring board disposed in the device.

このリフロー半田付けに応じた電子部品の端子形状としては、所謂ガルウィング形状のものやJベント形状のものが知られており、以下に、ガルウィングタイプの端子を備えた従来の回転型電子部品について図面を用いて説明する。   As the terminal shape of the electronic component in accordance with the reflow soldering, a so-called gull wing shape or a J bent shape is known, and a drawing of a conventional rotary electronic component having a gull wing type terminal is shown below. Will be described.

図5は従来の回転型電子部品の実装状態の断面図、図6は同分解斜視図、図7は同要部である回転接点板と弾性固定接点との係合状態を示す図である。   FIG. 5 is a cross-sectional view of a conventional rotary electronic component mounted, FIG. 6 is an exploded perspective view thereof, and FIG. 7 is a diagram showing an engagement state of a rotary contact plate and an elastic fixed contact, which are the main parts.

同図において、1は、上面視略方形の箱型形状で、上方開口の凹部を備えた絶縁樹脂製のケースであり、その凹部の内底面には、複数の接点体2が、互いに電気的独立状態で埋設固定されている。   In the figure, reference numeral 1 denotes a case made of an insulating resin having a substantially rectangular box shape when viewed from above and having a concave portion with an upper opening. A plurality of contact bodies 2 are electrically connected to each other on the inner bottom surface of the concave portion. It is buried and fixed in an independent state.

その各接点体2の一端側は、ケース1内において上方に傾斜状態で突出して弾性固定接点3に構成されている。また、各接点体2の他端側は、ケース1の側面部から外方に導出されて端子4として構成されている。   One end side of each contact body 2 protrudes upward in the case 1 in an inclined state and is configured as an elastic fixed contact 3. Further, the other end side of each contact body 2 is led out from the side surface portion of the case 1 to be configured as a terminal 4.

そして、一般的に、上記ケース1は、直線状の接点体2を成形樹脂でインサート成形して形成され、その後、接点体2の各端部部分を、弾性固定接点3および端子4の各形状に加工形成して構成される。その弾性固定接点3への形状加工時には、ケース1の底部に貫通して配した孔部1Aを介して上記加工形成を行うようにしていると共に、その加工形成後のケース1内における防塵性向上のため、ケース1底部の下方には樹脂製の板状体5が位置決めして重ね合わされている。   In general, the case 1 is formed by insert-molding a linear contact body 2 with a molding resin, and thereafter, each end portion of the contact body 2 is formed into each shape of the elastic fixed contact 3 and the terminal 4. It is formed by processing. At the time of shape processing to the elastic fixed contact 3, the above-described processing formation is performed through a hole 1 </ b> A that is arranged to penetrate the bottom of the case 1, and the dustproof property in the case 1 after the processing formation is improved. Therefore, a resin plate 5 is positioned and overlapped below the bottom of the case 1.

一方、端子4は、上記板状体5の厚みを含めた高さ位置から引き出されるようになるため、ガルウィング形状のもので形成されている。   On the other hand, since the terminal 4 comes to be pulled out from a height position including the thickness of the plate-like body 5, it is formed in a gull wing shape.

そして、6は、略円板状のフランジ部6Aと、その下面中央位置に突出形成された円形突起6Bと、同じくその上面中央に突出形成された軸部6Cを有する絶縁樹脂製の回転体であり、上記円形突起6Bが、ケース1の底部に配された円形の保持孔1Bに回転可能に挿通保持され、フランジ部6Aをケース1の凹部内に収容するようにして配されている。なお、当該保持孔1B部分も、上記孔部1Aの場合と同じで下方から板状体5で塞がれている。   Reference numeral 6 denotes a rotating body made of an insulating resin having a substantially disc-shaped flange portion 6A, a circular protrusion 6B formed to project at the center of the lower surface, and a shaft portion 6C formed to project at the center of the upper surface. The circular protrusion 6B is rotatably inserted into and held in a circular holding hole 1B arranged at the bottom of the case 1 so that the flange portion 6A is accommodated in the concave portion of the case 1. Note that the holding hole 1B is also covered with the plate-like body 5 from below as in the case of the hole 1A.

そして、回転体6のフランジ部6A下面には、金属板に打ち抜き加工などを施して所定パターン形状に形成してある回転接点板7が固定され、上記回転体6の配置状態で、回転接点板7に対し、図7に示すように、上記弾性固定接点3のそれぞれは弾接状態で係合している。   A rotating contact plate 7 formed in a predetermined pattern by punching a metal plate or the like is fixed to the lower surface of the flange portion 6 </ b> A of the rotating body 6. 7, each of the elastic fixed contacts 3 is engaged in an elastic contact state as shown in FIG. 7.

また、8は、ケース1の開口部分を覆う金属カバーであり、その形状は、ケース1の開口部分を覆う平坦な矩形状の板状部8A、その板状部8Aの中央位置に設けられた中央孔8B、上記板状部8Aの一方の対向端部位置にそれぞれ下方に折り曲げ形成された側板部8Cを有し、さらに、その各側板部8Cの下端位置には、カシメ用脚部8Dおよび実装時の位置決め用として配された角柱状の位置決め突起8Eが設けられている。   Reference numeral 8 denotes a metal cover that covers the opening portion of the case 1, and the shape thereof is provided at a flat rectangular plate-like portion 8A that covers the opening portion of the case 1, and at the center position of the plate-like portion 8A. The central hole 8B has side plate portions 8C that are bent downward at one opposing end portion of the plate-like portion 8A. Further, at the lower end position of each side plate portion 8C, a caulking leg portion 8D and A prismatic positioning projection 8E arranged for positioning at the time of mounting is provided.

この金属カバー8は、中央孔8Bに回転体6の軸部6Cを挿通させるようにしてケース1上方から載せられ、ケース1の一方側の外側面に沿って配される各側板部8C下端のカシメ用脚部8Dが板状体5の下面側に抱きカシメされてケース1および板状体5に取り付けられている。その取り付け状態では、位置決め突起8Eは、板状体5よりも下方に突出している。なお、ケース1と板状体5とは、互いの対向面に設けられている凹凸部が係合することにより、位置ずれなく結合状態となっている。   The metal cover 8 is placed from above the case 1 so that the shaft portion 6C of the rotating body 6 is inserted into the central hole 8B, and is arranged at the lower end of each side plate portion 8C arranged along the outer surface on one side of the case 1. The caulking leg portion 8D is attached to the case 1 and the plate-like body 5 by being caulked on the lower surface side of the plate-like body 5. In the attached state, the positioning protrusion 8E protrudes below the plate-like body 5. In addition, the case 1 and the plate-like body 5 are in a coupled state without positional displacement by engaging the concave and convex portions provided on the opposing surfaces.

また、金属カバー8の板状部8Aの下面にはクリックばね9が固着されており、上記クリックばね9のダボ部9Aは、上記回転体6の凹凸面に構成されているフランジ部6A上面部に弾接している。当該構成部分がクリック生成機構としてなり、操作時に節度感を発する部位となる。   Further, a click spring 9 is fixed to the lower surface of the plate-like portion 8A of the metal cover 8, and the dowel portion 9A of the click spring 9 is an upper surface portion of the flange portion 6A formed on the uneven surface of the rotating body 6. It is elastically touching. This constituent part becomes a click generation mechanism, and becomes a part that gives a sense of moderation during operation.

従来の回転型電子部品は、以上のように構成されるものである。   The conventional rotary electronic component is configured as described above.

そして、使用機器には、図8に示すように、上記機器内に配設される配線基板10上に各端子4をリフロー半田付け固定して搭載される。なお、その実装時に、金属カバー8の位置決め突起8Eを、その装着位置に応じて配された配線基板10の貫通孔(図示せず)に挿通させることにより位置決めした状態でリフロー半田付け固定がなされるようになっている。   Then, as shown in FIG. 8, each terminal 4 is mounted on the used device by reflow soldering and fixing on the wiring board 10 disposed in the device. At the time of mounting, reflow soldering is fixed in a state where the positioning protrusion 8E of the metal cover 8 is positioned by being inserted through a through hole (not shown) of the wiring board 10 arranged according to the mounting position. It has become so.

そして、上記機器への搭載状態で、軸部6Cが回転操作されると回転体6が回転してクリック生成機構により所定の角度位置でクリック感触が得られると共に、回転接点板7が各弾性固定接点3に対して相対的に回転することにより、所定の電気信号が生成され、その信号が各端子4を介して取り出せるものであった。   When the shaft portion 6C is rotated in the state of being mounted on the device, the rotating body 6 rotates and a click feeling is obtained at a predetermined angular position by the click generation mechanism, and the rotary contact plate 7 is elastically fixed. By rotating relative to the contact 3, a predetermined electrical signal is generated, and the signal can be taken out via each terminal 4.

なお、この出願の発明に関連する先行技術文献情報としては、例えば、特許文献1が知られている。
特開2002−373553号公報
As prior art document information related to the invention of this application, for example, Patent Document 1 is known.
JP 2002-373553 A

上記従来の回転型電子部品においては、配線基板10への搭載時に、リフロー半田付け条件である高温雰囲気中に通され、その際に、配線基板10やケース1などは各々所定量膨張し、その後常温に戻る際に収縮する。   In the above conventional rotary electronic component, when mounted on the wiring board 10, it is passed through a high temperature atmosphere which is a reflow soldering condition. At that time, the wiring board 10, the case 1, etc. each expand by a predetermined amount. Shrink when returning to normal temperature.

上記熱膨張収縮量は、配線基板10を含んで個々の部材ごとに異なり、その差分は端子4の半田付け固定部分にも影響を及ぼすため、通常は、その半田付け固定状態を安定させるために、端子4端部の配線基板10からの高さ位置などを厳しく管理しなければならず、製品単価を押し上げる要因となっていた。   The amount of thermal expansion / shrinkage is different for each member including the wiring board 10, and the difference affects the soldering / fixing portion of the terminal 4. Therefore, normally, in order to stabilize the soldering / fixing state, The height position of the terminal 4 end portion from the wiring board 10 must be strictly controlled, which has been a factor in raising the product unit price.

本発明は、このような従来の課題を解決するものであり、端子をリフロー半田付け固定した際、その半田付け固定部分に対し、配線基板を含む各部材の熱膨張収縮差に起因する影響が軽減できる構成の回転型電子部品を提供することを目的とする。   The present invention solves such a conventional problem, and when a terminal is reflow soldered and fixed, there is an influence caused by a difference in thermal expansion and contraction of each member including a wiring board on the soldered and fixed portion. An object of the present invention is to provide a rotary electronic component having a configuration that can be reduced.

前記目的を達成するために本発明は、以下の構成を有するものである。   In order to achieve the above object, the present invention has the following configuration.

本発明の請求項1に記載の発明は、樹脂製のケースに回転可能に保持された回転体と、その回転体に固定された金属製の回転接点板と、上記ケースに固定され、一端側が上記回転接点板に係合する固定接点になされ、他端側が上記ケース外方に導出されて表面実装型の端子になされた接点体とを備えた回転型電子部品であって、上記ケースは、上記接点体を固定している接点体固定部と主要部とが、異なるピースで分割形成されていると共に、その両者が、機器の配線基板へのリフロー半田付け時に発生する上記配線基板を含む個々の部材の熱膨張収縮差が吸収できる微少隙間を空けた状態で組み合わせて構成されていることを特徴とする回転型電子部品としたものである。   According to the first aspect of the present invention, there is provided a rotating body rotatably held in a resin case, a metal rotating contact plate fixed to the rotating body, and the one end side fixed to the case. A rotary electronic component including a contact body that is a fixed contact that engages with the rotary contact plate, the other end of which is led out of the case and formed as a surface-mount type terminal, and the case includes: The contact body fixing portion for fixing the contact body and the main portion are divided and formed in different pieces, and each of them includes the wiring board generated when reflow soldering to the wiring board of the device is performed. The rotary electronic component is characterized by being combined in a state where a minute gap that can absorb the difference in thermal expansion and contraction of the member is opened.

当該構成のものは、リフロー半田付け時に発生する配線基板やケースなどの熱膨張収縮量の差分を上記ケースの微少隙間で吸収させる構成のものであるため、その影響が端子の半田付け固定部分に、及び難くできる。このため、端子の半田付け固定状態が安定化したものにでき、端子の半田付け接合面積の低減化や端子形成時における管理の簡素化なども図れるようになるという作用を有する。   This configuration is designed to absorb the difference in thermal expansion / contraction amount of the wiring board and case generated during reflow soldering through the small gap in the case, so that the influence is applied to the soldering fixing part of the terminal. , And can be difficult. For this reason, it is possible to stabilize the soldering state of the terminals, and it is possible to reduce the soldering joint area of the terminals and simplify the management when forming the terminals.

本発明の請求項2に記載の発明は、請求項1記載の発明において、接点体固定部が主要部の側方から水平スライド移動により組み合わせ可能なように、上記接点体固定部と上記主要部のいずれか一方側に直線状のガイド溝を、また他方側に上記ガイド溝で案内される水平突起を付設しているものであり、水平突起をガイド溝に沿わせつつ接点体固定部と主要部とを容易に組み合わせることができるという作用を有する。   The invention according to claim 2 of the present invention is the invention according to claim 1, wherein the contact body fixing portion and the main portion are arranged so that the contact body fixing portion can be combined by horizontal sliding movement from the side of the main portion. A linear guide groove is provided on either side of the guide, and a horizontal protrusion guided by the guide groove is provided on the other side. It has the effect | action that a part can be combined easily.

本発明の請求項3に記載の発明は、請求項2記載の発明において、ケースの凹部上を覆うカバーで、接点体固定部の主要部からの抜け止めを図るものであり、専用部材を追加せずにケースの組み合わせ状態が維持でき、部品点数の増加を抑えることができるという作用を有する。   The invention according to claim 3 of the present invention is the cover according to claim 2, which covers the concave portion of the case and is intended to prevent the contact body fixing part from coming off from the main part, and an additional member is added. Without having to do so, the combined state of the cases can be maintained, and an increase in the number of parts can be suppressed.

以上のように本発明によれば、ケースを主要部と接点体固定部とに分割形成すると共に微少隙間を設けるようにして組み合わせ、上記隙間でリフロー半田付け時の配線基板を含む熱膨張収縮量の差分が吸収できる構成としたため、配線基板を含む各部材の熱膨張収縮差に起因する影響が軽減できてリフロー半田付け後の端子の半田付け固定状態がより安定化したものにでき、端子の半田付け接合面積の低減化や端子形成時における管理の簡素化なども図れる回転型電子部品を提供することができるという有利な効果が得られる。   As described above, according to the present invention, the case is divided into the main part and the contact body fixing part and combined so as to provide a minute gap, and the thermal expansion and contraction amount including the wiring board at the time of reflow soldering in the gap is provided. Since the difference between these components can be absorbed, the influence caused by the difference in thermal expansion and contraction of each member including the wiring board can be reduced, and the soldering and fixing state of the terminal after reflow soldering can be made more stable. There is an advantageous effect that a rotary electronic component that can reduce the soldering joint area and simplify the management at the time of terminal formation can be provided.

以下、本発明の実施の形態について、図1〜図4を用いて説明する。   Hereinafter, embodiments of the present invention will be described with reference to FIGS.

なお、従来と同一構成の部分には、同一符号を付して詳細な説明は省略する。   In addition, the same code | symbol is attached | subjected to the part of the same structure as the past, and detailed description is abbreviate | omitted.

(実施の形態)
図1は本発明の一実施の形態による回転型電子部品の断面図、図2は同分解斜視図、図3は同要部である回転接点板と弾性固定接点との係合状態を示す図である。
(Embodiment)
1 is a cross-sectional view of a rotary electronic component according to an embodiment of the present invention, FIG. 2 is an exploded perspective view thereof, and FIG. 3 is a diagram showing an engagement state between a rotary contact plate and an elastic fixed contact, which are the main parts It is.

同図において、21は、上面視略方形の箱型形状で、上方開口の凹部を備えた絶縁樹脂からなるケースであり、このケース21は、各々分割形成された主要部31と接点体固定部32とが組み合わされて構成され、その凹部も主要部31と接点体固定部32の各上面側の窪み部分が繋がって上面視略円形のものに構成されている。なお、主要部31と接点体固定部32とは、同じ絶縁樹脂材料で形成されている。   In the figure, reference numeral 21 denotes a case made of an insulating resin having a substantially rectangular box shape when viewed from above and having a concave portion with an upper opening. The case 21 includes a main part 31 and a contact body fixing part formed separately. 32, and the concave portion is configured to have a substantially circular shape when viewed from above by connecting the concave portions on the upper surface sides of the main portion 31 and the contact body fixing portion 32. In addition, the main part 31 and the contact body fixing | fixed part 32 are formed with the same insulating resin material.

そして、上記ケース21の凹部をなす部分に相当する主要部31の窪み部分の底部には、円形の底付き保持穴31Aが配設されている。なお、この底付き保持穴31Aは、ケース21の中央位置に相当する位置で配設されている。   A circular bottomed holding hole 31 </ b> A is disposed at the bottom of the hollow portion of the main portion 31 corresponding to the concave portion of the case 21. The bottomed holding hole 31 </ b> A is disposed at a position corresponding to the center position of the case 21.

また、主要部31は、半田接続用の端子を備えていない構成としている。   Moreover, the main part 31 is configured not to include a solder connection terminal.

一方、接点体固定部32には、一端側が弾性固定接点42、他端側が端子43としてなる接点体41がインサート成形されて固定されている。その接点体41は、複数本が、互いに電気的独立状態で、接点体固定部32の底部に埋設されており、各弾性固定接点42は、従来の場合と同じく、上記凹部内で上方に傾斜状態で突出し、各端子43は、ケース21の外方側に導出されている。   On the other hand, a contact body 41 having one end side serving as an elastic fixed contact 42 and the other end side serving as a terminal 43 is insert-molded and fixed to the contact body fixing portion 32. A plurality of the contact bodies 41 are embedded in the bottom of the contact body fixing portion 32 in an electrically independent state, and each elastic fixed contact 42 is inclined upward in the recess as in the conventional case. Each terminal 43 is led out to the outer side of the case 21.

そして、ケース21凹部の底付き保持穴31Aに円形突起6Bが保持されて回転体6が回転可能に配されている。そのフランジ部6Aは、上記凹部内に収容状態となっていると共に、フランジ部6A下面に固定された回転接点板7には、図3に示すように上記各弾性固定接点42が弾接状態で係合している。   The circular protrusion 6B is held in the holding hole 31A with the bottom of the concave portion of the case 21, and the rotating body 6 is rotatably arranged. The flange portion 6A is housed in the recess, and the elastic contact point 42 is elastically contacted with the rotary contact plate 7 fixed to the lower surface of the flange portion 6A as shown in FIG. Is engaged.

また、ケース21上方には金属カバー51が配され、ケース21の凹部は、矩形状の板状部51Aで覆われていると共に、回転体6の上面中央に突出形成された軸部6Cは、板状部51Aに設けられた中央孔51Bを介して上方に突出している。さらに、回転体6のフランジ部6A上面部に設けられた凹凸面には、金属カバー51の板状部51A下面に固着されたクリックばね9のダボ部9Aが弾接しており、当該部分でクリック生成機構が構成されている。   In addition, a metal cover 51 is disposed above the case 21, and the concave portion of the case 21 is covered with a rectangular plate-shaped portion 51 </ b> A, and a shaft portion 6 </ b> C formed to protrude from the center of the upper surface of the rotating body 6 It protrudes upward via a central hole 51B provided in the plate-like portion 51A. Further, a dowel portion 9A of the click spring 9 fixed to the lower surface of the plate-like portion 51A of the metal cover 51 is elastically contacted with the uneven surface provided on the upper surface portion of the flange portion 6A of the rotating body 6, and the click is made at that portion. A generation mechanism is configured.

そして、上記金属カバー51は、従来同様に、板状部51Aの一方の対向端部位置にそれぞれ下方に向けて折り曲げて延出形成された側板部51Cを有すると共に、その各側板部51Cの下端位置には、カシメ用脚部51Dおよび実装時の位置決め用として配された角柱状の位置決め突起51Eが設けられている。   And the said metal cover 51 has the side plate part 51C bent and extended toward the downward direction in one opposing edge part position of the plate-shaped part 51A like the past, and the lower end of each side plate part 51C At the position, a caulking leg 51D and a prismatic positioning projection 51E arranged for positioning at the time of mounting are provided.

ここで、本発明の特徴となる主要部31と接点体固定部32とを組み合わせて構成したケース21の組み合わせ状態について説明する。   Here, a combination state of the case 21 configured by combining the main portion 31 and the contact body fixing portion 32, which is a feature of the present invention, will be described.

その組み合わせ状態としては、図2に示すように、主要部31の側方から接点体固定部32を水平スライド移動させて組み合わせる構成としている。   As the combination state, as shown in FIG. 2, the contact body fixing part 32 is horizontally slid from the side of the main part 31 and combined.

主要部31における接点体固定部32の被装着部分は、対向する側壁部31Bが突出した上面視コの字形状になされ、その各々の側壁部31Bの内壁面には、ケース21の底面と平行関係で構成された直線状のガイド溝31Cを有している。   A portion of the main portion 31 to which the contact body fixing portion 32 is attached has a U-shape as viewed from above, in which the opposing side wall portion 31B protrudes, and the inner wall surface of each side wall portion 31B is parallel to the bottom surface of the case 21. It has the linear guide groove 31C comprised by the relationship.

一方、接点体固定部32は、上記主要部31の上面視コの字の中に挿入可能な寸法で形成され、かつ上記側壁部31B内壁面に対応する接点体固定部32の側面部には、上記コの字の開口側から上記ガイド溝31C内に挿入されて案内される水平突起32Aが配設されている。   On the other hand, the contact body fixing part 32 is formed to have a size that can be inserted into the U-shape of the main part 31 when viewed from above, and on the side surface part of the contact body fixing part 32 corresponding to the inner wall surface of the side wall part 31B. A horizontal protrusion 32A is provided which is inserted and guided into the guide groove 31C from the U-shaped opening side.

そして、主要部31と接点体固定部32とは、水平突起32Aをガイド溝31Cに沿わせつつ、その挿入方向での対向端面どうしが当接するまで水平スライド移動させて挿入されて組み合わせられ、当該構成であれば、簡素な構成で組み合わせ作業も容易にできて好ましい。   And the main part 31 and the contact body fixing | fixed part 32 are inserted and combined by carrying out a horizontal slide movement until the opposing end surfaces in the insertion direction contact | abut along horizontal guide 32A along the guide groove 31C, the said If it is a structure, it can be easily combined with a simple structure, which is preferable.

そして、上記主要部31と接点体固定部32との抜け止めは、専用部品を付加して部品点数を増加させることなく、ケース21の凹部上面を覆う金属カバー51の板状部51Aに設けた折り曲げ規制部51Fで行う構成としている。つまり、この折り曲げ規制部51Fは、側板部51Cとは直交する板状部51Aの端部を下方に曲げて形成したものとしている。   The main part 31 and the contact body fixing part 32 are prevented from coming off by providing the plate-like part 51A of the metal cover 51 that covers the upper surface of the concave part of the case 21 without adding dedicated parts and increasing the number of parts. The configuration is performed by the bending restricting portion 51F. That is, the bending restricting portion 51F is formed by bending the end portion of the plate-like portion 51A perpendicular to the side plate portion 51C downward.

そして、金属カバー51は、上記のように主要部31と接点体固定部32を水平スライド挿入して組み合わせた後で、折り曲げ規制部51Fが接点体固定部32の主要部31からの抜けが規制できる外方側に位置するようにケース21に組み合わせられる。このとき、金属カバー51の側板部51Cは、主要部31の側壁部31B側の各外側面に沿って配され、各側板部51C下端のカシメ用脚部51Dがケース21の主要部31の底面側に抱きカシメされて金属カバー51はケース21に装着されている。なお、上記各側板部51C下端に設けられた位置決め突起51Eはケース21より下方に突出している。   In the metal cover 51, after the main portion 31 and the contact body fixing portion 32 are combined by horizontal slide insertion as described above, the bending restricting portion 51F restricts the removal of the contact body fixing portion 32 from the main portion 31. It is combined with the case 21 so as to be located on the outer side. At this time, the side plate portion 51C of the metal cover 51 is arranged along each outer surface on the side wall portion 31B side of the main portion 31, and the caulking leg portion 51D at the lower end of each side plate portion 51C is the bottom surface of the main portion 31 of the case 21. The metal cover 51 is attached to the case 21 by being swaged to the side. The positioning projections 51E provided at the lower ends of the side plate portions 51C protrude downward from the case 21.

そして、そのカシメ固定状態で、折り曲げ規制部51Fでの接点体固定部32の規制状態としては、接点体固定部32と主要部31とが完全に密着せず、微少な隙間を持つようにしている。   In the crimped state, the contact body fixing part 32 is restricted by the bending restricting part 51F so that the contact body fixing part 32 and the main part 31 are not completely in close contact with each other and have a slight gap. Yes.

なお、図2にも示したように、接点体固定部32から弾性固定接点42の先端を突出させた構成とし、その突出部分に相当するケース21の底部を主要部31側に構成したものとすると、弾性固定接点42の形状加工も容易で、ケース21に従来の弾性固定接点加工用の孔部1Aを設けずとも済むので、板状体5も不要となる。この板状体5がなくせると、端子43の形状としても、管理が容易で半田付け強度の大きいJベント形状のものにすることができると共に、製品の薄型化も可能となる。   In addition, as shown also in FIG. 2, it is set as the structure which made the front-end | tip of the elastic fixed contact 42 protrude from the contact body fixing | fixed part 32, and comprised the bottom part of the case 21 corresponding to the protrusion part to the main part 31 side. Then, the shape processing of the elastic fixed contact 42 is easy, and since it is not necessary to provide the conventional hole portion 1A for elastic fixed contact processing in the case 21, the plate-like body 5 is also unnecessary. If this plate-like body 5 is eliminated, the shape of the terminal 43 can be made into a J-bent shape that is easy to manage and has a high soldering strength, and the product can be made thinner.

なお、上記構成とする際には、突出した弾性固定接点42が位置する主要部31の底部位置を、一段下がった段部31Dで構成しておけば、弾性固定接点42が主要部31の内底面に当接し難くでき、組み合わせ作業性に優れるものにできると共に、弾性固定接点42の不用意な変形などの防止が図れて好ましい。   In addition, when setting it as the said structure, if the bottom part position of the main part 31 in which the protruding elastic fixed contact 42 is located is comprised by the step part 31D lowered | hung one step, the elastic fixed contact 42 will be in the inside of the main part 31. It is possible to make it difficult to come into contact with the bottom surface, to improve the workability of combination, and to prevent inadvertent deformation of the elastic fixed contact 42 and the like.

また、各端子43を、接点体固定部32のスライド挿入方向とは逆方向に平行関係で導出した構成であれば、後述するリフロー半田付け実装時などに発生する配線基板10を含む各部材の熱膨張収縮差の影響が主に上記接点体固定部32のスライド挿入方向またはその逆方向に沿うようになり、その緩和度合いは大きくなる。なお、当該構成においては、各弾性固定接点42を、上記スライド方向に直交する線分上で回転接点板7に弾接させておくことが好ましい。   Further, if each terminal 43 has a configuration derived in a parallel relationship in a direction opposite to the slide insertion direction of the contact body fixing portion 32, each member including the wiring board 10 generated during reflow soldering mounting described later is used. The influence of the thermal expansion / contraction difference mainly follows the sliding insertion direction of the contact body fixing portion 32 or the opposite direction, and the degree of relaxation increases. In this configuration, it is preferable that each elastic fixed contact 42 is elastically contacted with the rotary contact plate 7 on a line segment orthogonal to the sliding direction.

本発明による回転型電子部品は、以上のように構成されるものであり、次にその実装状態について説明する。   The rotating electronic component according to the present invention is configured as described above. Next, the mounting state will be described.

当該回転型電子部品は、図4に示すように、使用機器における配線基板10に対し、端子43をリフロー半田付けして搭載される。   As shown in FIG. 4, the rotary electronic component is mounted by reflow soldering the terminals 43 on the wiring board 10 in the used device.

その搭載時には、従来のものと同様で、金属カバー51の位置決め突起51Eを、その装着位置に応じて配された配線基板10の貫通孔(図示せず)に挿通させることにより、配線基板10上に位置決め配置し、その後リフロー炉を通して半田付け実装する。   At the time of mounting, the positioning protrusion 51E of the metal cover 51 is inserted into a through-hole (not shown) of the wiring board 10 arranged according to the mounting position in the same manner as the conventional one. And then soldered and mounted through a reflow oven.

このとき、リフロー半田付け条件である高温雰囲気中に通された配線基板10やケース21などは各々所定量膨張し、その後常温に戻る際に収縮するが、主要部31を抱きカシメした金属カバー51で接点体固定部32の抜け方向への位置規制を行い、かつ主要部31と接点体固定部32とが微少隙間を持った状態で組み合わせられて一つのケース21としてある当該構成のものでは、基板面の水平方向に対して主要部31と接点体固定部32とは相対的に微少移動が可能となるため、配線基板10を含む上記熱膨張収縮量の差分が発生してもその影響が端子43の半田付け接合部分に及び難くなって応力の緩和が図れる。なお、端子43を配設している接点体固定部32側を軽量化すると、さらに端子43の半田付け接合部分への影響が軽減されるようになる。   At this time, each of the wiring board 10 and the case 21 passed through the high-temperature atmosphere, which is a reflow soldering condition, expands by a predetermined amount and then contracts when returning to room temperature. In this configuration, the position of the contact body fixing portion 32 is regulated in the removal direction, and the main portion 31 and the contact body fixing portion 32 are combined in a state having a slight gap as one case 21. Since the main part 31 and the contact body fixing part 32 can be relatively moved with respect to the horizontal direction of the board surface, even if a difference in the thermal expansion / contraction amount including the wiring board 10 occurs, the influence is exerted. It becomes difficult to reach the soldered joint portion of the terminal 43 and stress can be relaxed. In addition, if the contact body fixing | fixed part 32 side which has arrange | positioned the terminal 43 is reduced in weight, the influence on the soldering junction part of the terminal 43 will come to be reduced.

そして、上記配線基板10に搭載された当該回転型電子部品の動作としては、従来同様に、軸部6Cが回転操作されると、回転体6が回転してクリック生成機構により所定角度位置でクリック感触が得られると共に、回転体6に固定された回転接点板7が各弾性固定接点42に対し相対的に回転していくことにより、所定の電気信号が生成され、その信号が各端子43を介して取り出すことができる。   Then, as the operation of the rotary electronic component mounted on the wiring board 10, as in the conventional case, when the shaft portion 6C is rotated, the rotary body 6 rotates and clicks at a predetermined angular position by the click generation mechanism. A feeling can be obtained, and the rotating contact plate 7 fixed to the rotating body 6 rotates relative to each elastic fixed contact 42 to generate a predetermined electrical signal. Can be taken out through.

以上のように、本発明による回転型電子部品は、リフロー半田付け時の各部材における熱膨張収縮量の差分の影響が、端子43の半田付け固定部分に及び難くできるものであるため、端子43の半田付け固定状態が従来のものよりさらに安定化し応力緩和が図れたものにできる。また、機器搭載後に使用環境により発生する配線基板10を含む各部材の熱膨張収縮量の差分が発生した場合にも、同様にその影響の緩和が図れるため、長期に亘って半田付け固定状態が安定したものとなる。   As described above, in the rotary electronic component according to the present invention, the influence of the difference in thermal expansion / contraction amount in each member during reflow soldering can hardly reach the soldering fixing portion of the terminal 43. The soldering and fixing state can be made more stable than the conventional one and the stress can be relaxed. In addition, even when a difference in thermal expansion / contraction amount of each member including the wiring board 10 generated due to the usage environment occurs after mounting the device, the influence can be mitigated in the same manner, so that the soldering fixed state can be maintained over a long period of time. It will be stable.

なお、上記には、Jベント形状に加工した端子43のものを事例として説明したが、本発明による思想は、他の表面実装タイプの形状に加工された端子のものにも適用でき、場合によっては、当該構成を適用して端子の半田付け接合面積の低減化や端子形成時における管理などの簡素化などを図ることもできる。   In the above description, the case of the terminal 43 processed into a J bent shape has been described as an example, but the idea according to the present invention can be applied to a terminal processed into a shape of other surface mounting type, depending on circumstances. In this case, the configuration can be applied to reduce the soldering joint area of the terminals and simplify the management at the time of forming the terminals.

本発明による回転型電子部品は、ケースの微少隙間でリフロー半田付け時の配線基板を含む熱膨張収縮量の差分が吸収できる構成としたため、リフロー半田付け後の端子の半田付け固定状態がより安定化したものにできるという特徴を有し、各種電子機器の操作部分等を構成する際等に有用である。   The rotary electronic component according to the present invention is configured to absorb the difference in thermal expansion and contraction amount including the wiring board during reflow soldering with a small gap in the case, so that the terminal soldering and fixing state after reflow soldering is more stable This is useful when, for example, configuring an operation part of various electronic devices.

本発明の一実施の形態による回転型電子部品の断面図Sectional drawing of the rotation type electronic component by one embodiment of this invention 同分解斜視図Exploded perspective view 同要部である回転接点板と弾性固定接点との係合状態を示す図The figure which shows the engagement state of the rotating contact plate which is the principal part, and an elastic fixed contact 同配線基板への実装状態を示す断面図Sectional view showing the mounting state on the same wiring board 従来の回転型電子部品の断面図Cross-sectional view of a conventional rotary electronic component 同分解斜視図Exploded perspective view 同要部である回転接点板と弾性固定接点との係合状態を示す図The figure which shows the engagement state of the rotating contact plate which is the principal part, and an elastic fixed contact 同配線基板への実装状態を示す断面図Sectional view showing the mounting state on the same wiring board

符号の説明Explanation of symbols

6 回転体
6A フランジ部
6B 円形突起
6C 軸部
7 回転接点板
9 クリックばね
9A ダボ部
10 配線基板
21 ケース
31 主要部
31A 底付き保持穴
31B 側壁部
31C ガイド溝
31D 段部
32 接点体固定部
32A 水平突起
41 接点体
42 弾性固定接点
43 端子
51 金属カバー
51A 板状部
51B 中央孔
51C 側板部
51D カシメ用脚部
51E 位置決め突起
51F 折り曲げ規制部
6 Rotating body 6A Flange portion 6B Circular protrusion 6C Shaft portion 7 Rotating contact plate 9 Click spring 9A Dowel portion 10 Wiring board 21 Case 31 Main portion 31A Bottomed holding hole 31B Side wall portion 31C Guide groove 31D Step portion 32 Contact body fixing portion 32A Horizontal projection 41 Contact body 42 Elastic fixed contact 43 Terminal 51 Metal cover 51A Plate-like portion 51B Central hole 51C Side plate portion 51D Caulking leg portion 51E Positioning projection 51F Bending restriction portion

Claims (3)

樹脂製のケースに回転可能に保持された回転体と、その回転体に固定された金属製の回転接点板と、上記ケースに固定され、一端側が上記回転接点板に係合する固定接点になされ、他端側が上記ケース外方に導出されて表面実装型の端子になされた接点体とを備えた回転型電子部品であって、上記ケースは、上記接点体を固定している接点体固定部と主要部とが、異なるピースで分割形成されていると共に、その両者が、機器の配線基板へのリフロー半田付け時に発生する上記配線基板を含む個々の部材の熱膨張収縮差が吸収できる微少隙間を空けた状態で組み合わせて構成されていることを特徴とする回転型電子部品。 A rotating body rotatably held in a resin case, a metal rotating contact plate fixed to the rotating body, a fixed contact fixed to the case and having one end engaged with the rotating contact plate. A rotary electronic component having a contact body whose other end is led out of the case and formed as a surface mount type terminal, wherein the case fixes the contact body And the main part are divided into different pieces, and both of them can absorb a difference in thermal expansion and contraction of individual members including the wiring board generated during reflow soldering to the wiring board of the device. A rotating electronic component characterized in that it is configured by being combined with a space between them. 接点体固定部が主要部の側方から水平スライド移動により組み合わせ可能なように、上記接点体固定部と上記主要部のいずれか一方側に直線状のガイド溝を、また他方側に上記ガイド溝で案内される水平突起を付設している請求項1記載の回転型電子部品。 A linear guide groove on one side of the contact body fixing part and the main part and a guide groove on the other side so that the contact body fixing part can be combined by horizontal slide movement from the side of the main part. The rotary electronic component according to claim 1, further comprising a horizontal protrusion guided by the step. ケースの凹部上を覆うカバーで、接点体固定部の主要部からの抜け止めを図る請求項2記載の回転型電子部品。 The rotary electronic component according to claim 2, wherein a cover covering the concave portion of the case is used to prevent the contact body fixing portion from coming off from the main portion.
JP2005009846A 2005-01-18 2005-01-18 Rotating electronic components Expired - Fee Related JP4496965B2 (en)

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JPS6296829U (en) * 1985-12-05 1987-06-20
JPS63159239U (en) * 1987-04-07 1988-10-18
JPH09204150A (en) * 1995-09-22 1997-08-05 Rohm Co Ltd Surface mount type light emission display device, and its manufacture and mount structure
JPH09129085A (en) * 1995-11-01 1997-05-16 Matsushita Electric Ind Co Ltd Electronic part for installing printed wiring board
JPH10125177A (en) * 1996-10-23 1998-05-15 Matsushita Electric Ind Co Ltd Rotary operation type electronic part, and its manufacture
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JP2002093280A (en) * 2000-09-14 2002-03-29 Alps Electric Co Ltd Rotary electric component

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