JP2006198800A - Antistatic resin sheet with protective film - Google Patents
Antistatic resin sheet with protective film Download PDFInfo
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- JP2006198800A JP2006198800A JP2005010431A JP2005010431A JP2006198800A JP 2006198800 A JP2006198800 A JP 2006198800A JP 2005010431 A JP2005010431 A JP 2005010431A JP 2005010431 A JP2005010431 A JP 2005010431A JP 2006198800 A JP2006198800 A JP 2006198800A
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- 230000001681 protective effect Effects 0.000 title claims abstract description 38
- 229920005989 resin Polymers 0.000 title claims abstract description 29
- 239000011347 resin Substances 0.000 title claims abstract description 29
- 239000010410 layer Substances 0.000 claims abstract description 50
- 239000002585 base Substances 0.000 claims abstract description 25
- 239000000463 material Substances 0.000 claims abstract description 24
- 229920005992 thermoplastic resin Polymers 0.000 claims abstract description 16
- 239000002131 composite material Substances 0.000 claims abstract description 13
- 229910052783 alkali metal Inorganic materials 0.000 claims abstract description 8
- 150000001340 alkali metals Chemical class 0.000 claims abstract description 8
- 229920000554 ionomer Polymers 0.000 claims abstract description 8
- 239000004820 Pressure-sensitive adhesive Substances 0.000 claims abstract description 5
- 229920001038 ethylene copolymer Polymers 0.000 claims abstract description 3
- 238000000034 method Methods 0.000 claims description 23
- PPBRXRYQALVLMV-UHFFFAOYSA-N Styrene Chemical compound C=CC1=CC=CC=C1 PPBRXRYQALVLMV-UHFFFAOYSA-N 0.000 claims description 16
- 239000000113 methacrylic resin Substances 0.000 claims description 14
- 229920005668 polycarbonate resin Polymers 0.000 claims description 5
- 239000004431 polycarbonate resin Substances 0.000 claims description 5
- 229920001169 thermoplastic Polymers 0.000 claims description 5
- 239000004416 thermosoftening plastic Substances 0.000 claims description 5
- 229920005672 polyolefin resin Polymers 0.000 claims description 4
- 239000011342 resin composition Substances 0.000 abstract description 6
- 238000010030 laminating Methods 0.000 abstract 1
- 239000000843 powder Substances 0.000 abstract 1
- 239000000428 dust Substances 0.000 description 12
- 238000011156 evaluation Methods 0.000 description 8
- 239000012790 adhesive layer Substances 0.000 description 7
- 239000002216 antistatic agent Substances 0.000 description 7
- 229920000642 polymer Polymers 0.000 description 7
- 230000000052 comparative effect Effects 0.000 description 6
- 229920001577 copolymer Polymers 0.000 description 6
- 229920001684 low density polyethylene Polymers 0.000 description 6
- 239000004702 low-density polyethylene Substances 0.000 description 6
- 238000004519 manufacturing process Methods 0.000 description 6
- 230000005611 electricity Effects 0.000 description 5
- 230000003068 static effect Effects 0.000 description 5
- XTXRWKRVRITETP-UHFFFAOYSA-N Vinyl acetate Chemical compound CC(=O)OC=C XTXRWKRVRITETP-UHFFFAOYSA-N 0.000 description 4
- 229920006026 co-polymeric resin Polymers 0.000 description 4
- 229920001903 high density polyethylene Polymers 0.000 description 4
- 239000004700 high-density polyethylene Substances 0.000 description 4
- 230000000694 effects Effects 0.000 description 3
- 229920001971 elastomer Polymers 0.000 description 3
- 125000005395 methacrylic acid group Chemical group 0.000 description 3
- 239000000203 mixture Substances 0.000 description 3
- 239000005060 rubber Substances 0.000 description 3
- 239000000758 substrate Substances 0.000 description 3
- SMZOUWXMTYCWNB-UHFFFAOYSA-N 2-(2-methoxy-5-methylphenyl)ethanamine Chemical compound COC1=CC=C(C)C=C1CCN SMZOUWXMTYCWNB-UHFFFAOYSA-N 0.000 description 2
- NIXOWILDQLNWCW-UHFFFAOYSA-N 2-Propenoic acid Natural products OC(=O)C=C NIXOWILDQLNWCW-UHFFFAOYSA-N 0.000 description 2
- SOGAXMICEFXMKE-UHFFFAOYSA-N Butylmethacrylate Chemical compound CCCCOC(=O)C(C)=C SOGAXMICEFXMKE-UHFFFAOYSA-N 0.000 description 2
- VGGSQFUCUMXWEO-UHFFFAOYSA-N Ethene Chemical compound C=C VGGSQFUCUMXWEO-UHFFFAOYSA-N 0.000 description 2
- 239000005977 Ethylene Substances 0.000 description 2
- VVQNEPGJFQJSBK-UHFFFAOYSA-N Methyl methacrylate Chemical compound COC(=O)C(C)=C VVQNEPGJFQJSBK-UHFFFAOYSA-N 0.000 description 2
- 239000004793 Polystyrene Substances 0.000 description 2
- IISBACLAFKSPIT-UHFFFAOYSA-N bisphenol A Chemical compound C=1C=C(O)C=CC=1C(C)(C)C1=CC=C(O)C=C1 IISBACLAFKSPIT-UHFFFAOYSA-N 0.000 description 2
- SUPCQIBBMFXVTL-UHFFFAOYSA-N ethyl 2-methylprop-2-enoate Chemical compound CCOC(=O)C(C)=C SUPCQIBBMFXVTL-UHFFFAOYSA-N 0.000 description 2
- 239000005038 ethylene vinyl acetate Substances 0.000 description 2
- 238000004898 kneading Methods 0.000 description 2
- 230000000873 masking effect Effects 0.000 description 2
- 238000005259 measurement Methods 0.000 description 2
- 239000000178 monomer Substances 0.000 description 2
- 230000003287 optical effect Effects 0.000 description 2
- -1 phenol compound Chemical class 0.000 description 2
- 229920001200 poly(ethylene-vinyl acetate) Polymers 0.000 description 2
- 229920002223 polystyrene Polymers 0.000 description 2
- 230000002265 prevention Effects 0.000 description 2
- 238000012360 testing method Methods 0.000 description 2
- GOXQRTZXKQZDDN-UHFFFAOYSA-N 2-Ethylhexyl acrylate Chemical compound CCCCC(CC)COC(=O)C=C GOXQRTZXKQZDDN-UHFFFAOYSA-N 0.000 description 1
- WDQMWEYDKDCEHT-UHFFFAOYSA-N 2-ethylhexyl 2-methylprop-2-enoate Chemical compound CCCCC(CC)COC(=O)C(C)=C WDQMWEYDKDCEHT-UHFFFAOYSA-N 0.000 description 1
- NLHHRLWOUZZQLW-UHFFFAOYSA-N Acrylonitrile Chemical compound C=CC#N NLHHRLWOUZZQLW-UHFFFAOYSA-N 0.000 description 1
- JIGUQPWFLRLWPJ-UHFFFAOYSA-N Ethyl acrylate Chemical compound CCOC(=O)C=C JIGUQPWFLRLWPJ-UHFFFAOYSA-N 0.000 description 1
- CERQOIWHTDAKMF-UHFFFAOYSA-N Methacrylic acid Chemical compound CC(=C)C(O)=O CERQOIWHTDAKMF-UHFFFAOYSA-N 0.000 description 1
- 229920001890 Novodur Polymers 0.000 description 1
- YGYAWVDWMABLBF-UHFFFAOYSA-N Phosgene Chemical compound ClC(Cl)=O YGYAWVDWMABLBF-UHFFFAOYSA-N 0.000 description 1
- 239000002253 acid Substances 0.000 description 1
- 150000007513 acids Chemical class 0.000 description 1
- 125000005396 acrylic acid ester group Chemical group 0.000 description 1
- 239000000853 adhesive Substances 0.000 description 1
- 230000001070 adhesive effect Effects 0.000 description 1
- 239000012298 atmosphere Substances 0.000 description 1
- 230000015572 biosynthetic process Effects 0.000 description 1
- 230000000740 bleeding effect Effects 0.000 description 1
- CQEYYJKEWSMYFG-UHFFFAOYSA-N butyl acrylate Chemical compound CCCCOC(=O)C=C CQEYYJKEWSMYFG-UHFFFAOYSA-N 0.000 description 1
- 238000000576 coating method Methods 0.000 description 1
- 150000001875 compounds Chemical class 0.000 description 1
- OIWOHHBRDFKZNC-UHFFFAOYSA-N cyclohexyl 2-methylprop-2-enoate Chemical compound CC(=C)C(=O)OC1CCCCC1 OIWOHHBRDFKZNC-UHFFFAOYSA-N 0.000 description 1
- KBLWLMPSVYBVDK-UHFFFAOYSA-N cyclohexyl prop-2-enoate Chemical compound C=CC(=O)OC1CCCCC1 KBLWLMPSVYBVDK-UHFFFAOYSA-N 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 230000006866 deterioration Effects 0.000 description 1
- 239000006185 dispersion Substances 0.000 description 1
- 239000010408 film Substances 0.000 description 1
- 238000012812 general test Methods 0.000 description 1
- 229920001519 homopolymer Polymers 0.000 description 1
- 230000001771 impaired effect Effects 0.000 description 1
- 239000003112 inhibitor Substances 0.000 description 1
- 229920000092 linear low density polyethylene Polymers 0.000 description 1
- 239000004707 linear low-density polyethylene Substances 0.000 description 1
- 229920001179 medium density polyethylene Polymers 0.000 description 1
- 239000004701 medium-density polyethylene Substances 0.000 description 1
- 150000002734 metacrylic acid derivatives Chemical class 0.000 description 1
- 125000005397 methacrylic acid ester group Chemical group 0.000 description 1
- 125000002496 methyl group Chemical group [H]C([H])([H])* 0.000 description 1
- 238000002156 mixing Methods 0.000 description 1
- PNJWIWWMYCMZRO-UHFFFAOYSA-N pent‐4‐en‐2‐one Natural products CC(=O)CC=C PNJWIWWMYCMZRO-UHFFFAOYSA-N 0.000 description 1
- 239000012071 phase Substances 0.000 description 1
- QIWKUEJZZCOPFV-UHFFFAOYSA-N phenyl 2-methylprop-2-enoate Chemical compound CC(=C)C(=O)OC1=CC=CC=C1 QIWKUEJZZCOPFV-UHFFFAOYSA-N 0.000 description 1
- WRAQQYDMVSCOTE-UHFFFAOYSA-N phenyl prop-2-enoate Chemical compound C=CC(=O)OC1=CC=CC=C1 WRAQQYDMVSCOTE-UHFFFAOYSA-N 0.000 description 1
- 238000005498 polishing Methods 0.000 description 1
- 229920006122 polyamide resin Polymers 0.000 description 1
- 239000005020 polyethylene terephthalate Substances 0.000 description 1
- 229920000139 polyethylene terephthalate Polymers 0.000 description 1
- 229920002959 polymer blend Polymers 0.000 description 1
- 238000006116 polymerization reaction Methods 0.000 description 1
- NHARPDSAXCBDDR-UHFFFAOYSA-N propyl 2-methylprop-2-enoate Chemical compound CCCOC(=O)C(C)=C NHARPDSAXCBDDR-UHFFFAOYSA-N 0.000 description 1
- 239000007790 solid phase Substances 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
- 239000004094 surface-active agent Substances 0.000 description 1
- 229920001187 thermosetting polymer Polymers 0.000 description 1
- 238000005809 transesterification reaction Methods 0.000 description 1
Abstract
Description
熱可塑性樹脂透明シート表面に帯電防止機能を有する保護フィルムを貼り付けることより、シート切断時のフィルム表面への切粉付着防止、フィルム剥離時に発生する静電気を防止しシート表面へのゴミ付着及びシート切断時の保護フィルムのカット性改良付与に関する。 By sticking a protective film with antistatic function on the surface of the thermoplastic resin transparent sheet, it prevents chip adhesion to the film surface when cutting the sheet, prevents static electricity generated when the film is peeled off, and prevents dust from adhering to the sheet surface. The present invention relates to an improvement in the cutting property of a protective film during cutting.
熱可塑性樹脂シートに帯電防止性を持たせる方法としては、メタクリル系樹脂等に吸水性の化合物や帯電防止剤などを練りこむ方法及び界面活性剤などを表面に塗布する方法などが開示されている（例えば、特許文献１参照。）。しかし上記練りこむ方法では相溶性の不足、分散の不良や帯電防止剤のブリードアウト等による外観特性低下等の問題を生じ、塗布する方法では効果の持続性の問題及びシートと保護フィルムの密着強度の低下により保護フィルムとしての機能が低下するという問題がある。又、帯電防止樹脂を粘着層と基材層との間に添加或いは、粘着層に添加する方法が開示されている（例えば、特許文献２参照。）。しかし、この方法では帯防性能が十分に発現せず又、粘着層に添加した組成ではシート表面に保護フィルムを貼り付けた際に接着性が低下し実用上、問題が認められた。
本発明は熱可塑性樹脂透明シートに貼り付けた保護フィルム表面への切断時の切粉付着防止、輸送時のシート間の滑りによる荷崩れ防止及び保護フィルムを剥離する際の静電気発生を防止し、シート表面への埃、ゴミ付着を防止する保護フィルム付き熱可塑性樹脂透明シートを安価に製造が出来、提供することを目的とする。 The present invention prevents chip adhesion at the time of cutting on the surface of the protective film affixed to the thermoplastic resin transparent sheet, prevents load collapse due to slippage between sheets during transportation, and prevents static electricity generation when peeling the protective film, An object of the present invention is to be able to manufacture and provide a thermoplastic resin transparent sheet with a protective film that prevents dust and dust from adhering to the sheet surface at low cost.
本発明者らは前記課題を解決する為、熱可塑性樹脂透明シート上に貼り付ける表面保護フィルム基材に帯電防止剤を含有させることで、シート切断時の保護フィルム表面の切粉付着防止及び毛羽立ち発生防止、更には保護フィルム剥離時の静電気発生を防止出来る事を見出し、本発明に至った。すなわち、本発明は、
１．基材層、基材層と異なる樹脂組成からなる中間層および粘着層の３層構成からなる表面保護フィルムと熱可塑性樹脂透明シートとを貼りあわせてなる複合シートであって、該基材層が熱可塑性樹種１００重量部に対してアルカリ金属をイオン源とする非帯電性エチレン共重合体アイオノマー樹脂１５〜２５重量％を含有することを特徴とする複合シート、
２．該基材層がポリオレフィン系樹脂および該中間層が基材層と異なるポリオレフィン樹脂からなることを特徴とする上記１に記載の複合シート、
３．該表面保護フィルムの基材層及び中間層の密度が、それぞれ０．９１５〜０．９２５および０．９３０〜０．９６０であることを特徴とする上記２に記載の複合シート、
４．該熱可塑性樹脂透明シートが、メタクリル系樹脂、ポリカーボネート系樹脂及びスチレン系樹脂から選ばれる１種である事を特徴とする上記１〜３のいずれかに記載の樹脂シート、
５．該熱可塑性樹脂透明シートの片面あるいは両面に、表面保護フィルムを貼りあわせて複合シートを得た後、複合シートを切断し、その後表面保護フィルムを剥離することを特徴とする熱可塑性透明シートの製造方法、
である。
In order to solve the above-mentioned problems, the present inventors include an antistatic agent in the surface protective film base material to be pasted on the thermoplastic resin transparent sheet, thereby preventing chip adhesion and fluffing on the surface of the protective film during sheet cutting. The inventors have found that it is possible to prevent the occurrence of static electricity and further prevent the generation of static electricity when the protective film is peeled off. That is, the present invention
1. A composite sheet comprising a base material layer, a surface protection film comprising a three-layer structure of an intermediate layer and a pressure-sensitive adhesive layer different from the base material layer, and a thermoplastic resin transparent sheet, the base material layer comprising: A composite sheet comprising 15 to 25% by weight of an unchargeable ethylene copolymer ionomer resin containing an alkali metal as an ion source with respect to 100 parts by weight of a thermoplastic tree species,
2. 2. The composite sheet according to 1 above, wherein the base material layer is made of a polyolefin resin and the intermediate layer is made of a polyolefin resin different from the base material layer,
3. The composite sheet according to 2 above, wherein the density of the base material layer and the intermediate layer of the surface protective film is 0.915 to 0.925 and 0.930 to 0.960, respectively.
4). The resin sheet according to any one of 1 to 3, wherein the thermoplastic resin transparent sheet is one selected from a methacrylic resin, a polycarbonate resin, and a styrene resin,
5. A thermoplastic transparent sheet produced by bonding a surface protective film to one or both sides of the thermoplastic resin transparent sheet to obtain a composite sheet, then cutting the composite sheet, and then peeling the surface protective film Method,
It is.
本発明の製造方法は、従来技術の保護フィルムの問題点であったシート切断時の切粉付着防止及びフィルムの毛羽立ち発生防止を抑制する効果がある。更には、輸送時の荷崩れと簡便に保護フィルム剥離時のゴミ付着を防止する効果がある。 The production method of the present invention has the effect of suppressing the prevention of chip adhesion during sheet cutting and the prevention of fluffing of the film, which were problems of the protective film of the prior art. Furthermore, there is an effect of preventing the collapse of cargo during transportation and the adhesion of dust when the protective film is peeled off.
本発明について、以下に具体的に説明する。
本発明で適用可能な熱可塑性透明樹脂はメタクリル樹脂シートがあり、製法としては押出シート及びキャストシートのいずれについても適用できる。又、本発明に適用される樹脂透明シートはすべての熱可塑性樹脂に適用可能であるが、好ましくはポリカーボネート樹脂、スチレン系樹脂等の光学材料が挙げられる樹脂透明シートである。最も好ましくは、メタクリル樹脂シートである。
メタクリル樹脂とは、メタクリル酸メチルあるいはメタクリル酸エチルを７０重量％以上と、これらと共重合性を有する単量体とを共重合することにより得る事ができる。これらと共重合性を有する単量体としてはメタクリル酸ブチル、メタクリル酸エチル、メタクリル酸メチル、メタクリル酸プロピル、メタクリル酸シクロヘキシル、メタクリル酸フェニル、メタクリル酸２−エチルヘキシルなどのメタクリル酸エステル類、アクリル酸メチル、アクリル酸エチル、アクリル酸ブチル、アクリル酸シクロヘキシル、アクリル酸フェニル、アクリル酸２−エチルヘキシル等のアクリル酸エステル類、メタクリル酸、アクリル酸等の不飽和酸類等があげられるが、これらに限定されるものではなく、また製造方法についても何ら限定されるものではない。また、耐熱性メタクリル樹脂、低吸湿性メタクリル樹脂、耐衝撃性メタクリル樹脂等が含まれる。耐衝撃性メタクリル樹脂とは、例えば、メタクリル樹脂にゴム弾性体をブレンドしたものであり、そのゴム弾性体は、特開昭５３−５８５５４号公報、同５５−９４９１７号公報、同６１−３２３４６号公報等に開示されている。
The present invention will be specifically described below.
The thermoplastic transparent resin applicable in the present invention is a methacrylic resin sheet, and any of an extruded sheet and a cast sheet can be applied as a manufacturing method. The resin transparent sheet applied to the present invention can be applied to all thermoplastic resins, and is preferably a resin transparent sheet including optical materials such as polycarbonate resin and styrene resin. Most preferred is a methacrylic resin sheet.
A methacrylic resin can be obtained by copolymerizing 70% by weight or more of methyl methacrylate or ethyl methacrylate and a monomer having copolymerizability with these. As monomers having copolymerizability with these, methacrylates such as butyl methacrylate, ethyl methacrylate, methyl methacrylate, propyl methacrylate, cyclohexyl methacrylate, phenyl methacrylate, 2-ethylhexyl methacrylate, and acrylic acid Examples include, but are not limited to, acrylic acid esters such as methyl, ethyl acrylate, butyl acrylate, cyclohexyl acrylate, phenyl acrylate, and 2-ethylhexyl acrylate, and unsaturated acids such as methacrylic acid and acrylic acid. The manufacturing method is not limited at all. Also included are heat resistant methacrylic resins, low hygroscopic methacrylic resins, impact resistant methacrylic resins and the like. The impact-resistant methacrylic resin is, for example, a methacrylic resin blended with a rubber elastic body, and the rubber elastic body is disclosed in JP-A-53-58554, JP-A-55-94917, and JP-A-61-32346. It is disclosed in the gazette.
ポリカーボネート樹脂とは、ビスフェノールＡに代表される二価フェノール系化合物から誘導される重合体が用いられる。ポリカーボネート樹脂の製造方法は、特に限定されるものではなく、ホスゲン法、エステル交換法あるいは固相重合法等、周知慣用の方法で製造されたものを使用することができる。
スチレン系樹脂とは、スチレンを必須成分とするホモポリマー、コポリマー、またはこれらのポリマーと他の樹脂とから得られるポリマーブレンドなどである。特にポリスチレン、アクリロニトリルとスチレンの共重合体樹脂であるＡＳ樹脂、メタクリル酸エステルとスチレンの共重合体樹脂であるＭＳ樹脂であることが好ましい。更に、スチレン系樹脂相中にゴムが分布した透明強化ポリスチレンも好ましく使用できる。スチレン系樹脂の製造方法は、特に限定されるものではなく、周知慣用の方法で製造されたものを使用することができる。
As the polycarbonate resin, a polymer derived from a dihydric phenol compound typified by bisphenol A is used. The method for producing the polycarbonate resin is not particularly limited, and those produced by a well-known and commonly used method such as a phosgene method, a transesterification method or a solid phase polymerization method can be used.
Styrenic resins include homopolymers, copolymers, or polymer blends obtained from these polymers and other resins, which contain styrene as an essential component. In particular, an AS resin which is a copolymer resin of polystyrene, acrylonitrile and styrene, and an MS resin which is a copolymer resin of methacrylic acid ester and styrene are preferable. Furthermore, transparent reinforced polystyrene in which rubber is distributed in the styrene resin phase can also be preferably used. The method for producing the styrene-based resin is not particularly limited, and those produced by a well-known and commonly used method can be used.
次に表面保護フィルムの材質は低密度ポリエチレン、直鎖状低密度ポリエチレン、高密度ポリエチレン、エチレン―酢酸ビニル共重合体、ポリエチレンテレフタレート及びポリアミド樹脂等を問題なく使用できる。好ましくは基材層には低密度ポリエチレン、中間層は中密度及び高密度ポリエチレンおよび粘着層はエチレン―酢酸ビニル共重合体が最も適した樹脂組成である。又、保護フィルムの使用可能なフィルム厚さは３０〜１２０μｍ、好ましくは４０〜１００μｍの厚さの保護フィルムを問題なく使用できる。また、基材層の厚さは５〜３０μｍ、好ましくは、表面抵抗率及びコストより判断し、１０〜２０μｍである。 Next, as the material for the surface protective film, low density polyethylene, linear low density polyethylene, high density polyethylene, ethylene-vinyl acetate copolymer, polyethylene terephthalate, polyamide resin, and the like can be used without problems. Preferably, low density polyethylene for the base layer, medium density and high density polyethylene for the intermediate layer, and ethylene-vinyl acetate copolymer for the adhesive layer are the most suitable resin compositions. Moreover, the film thickness which can use a protective film is 30-120 micrometers, Preferably the protective film of the thickness of 40-100 micrometers can be used without a problem. Moreover, the thickness of a base material layer is 5-30 micrometers, Preferably, it judges from surface resistivity and cost, and is 10-20 micrometers.
下記の実施例１〜５及び比較例１〜３の表面保護フィルム及びシートについて、次に示す特性試験を実施した。特性試験としては、カール発生の有無、表面抵抗率、切粉付着の有無、フィルム切断面の状態、シート表面のゴミ付着の有無及びシート表面との接着強さについて測定した。
（１）カール発生の有無
インフレーション法三層共押出機にてフィルム作成時、カールが発生せず成膜が良好で問題が認められない場合を○とし、カールは発生するものの、実用には問題がないものを△、フィルムがカールしたものを×とした。
（２）表面抵抗率
ＪＩＳ Ｋ ６９１１「熱硬化性プラスチック一般試験方法」の規定方法に準じ、温度２３℃、湿度５０％ＲＨの雰囲気下にて表面保護フィルムの基材面に電圧５００Ｖを印加、１分後に測定した。
（３）切粉付着の有無
シート押出機工程内のマスキング貼付装置にて保護フィルムを貼付け後、同工程内で切断し得られたシート表面を目視観察し、切粉の付着が殆ど無い場合には○とし、切粉の付着がやや見られるものを△、切粉の付着が多量にある場合は×とした。
The following characteristic test was implemented about the surface protection film and sheet | seat of the following Examples 1-5 and Comparative Examples 1-3. As a characteristic test, the presence / absence of curling, surface resistivity, presence / absence of chip adhesion, state of the cut surface of the film, presence / absence of dust adhesion on the sheet surface and adhesion strength to the sheet surface were measured.
(1) Presence / absence of curling When a film was created with an inflation method three-layer coextrusion machine, curl did not occur and film formation was good and no problem was observed. The case where there is no film is indicated by Δ, and the case where the film is curled is indicated by ×.
(2) Surface resistivity In accordance with the method defined in JIS K 6911 “General Test Method for Thermosetting Plastics”, a voltage of 500 V is applied to the substrate surface of the surface protective film in an atmosphere at a temperature of 23 ° C. and a humidity of 50% RH. Measurements were taken after 1 minute.
(3) Presence of chip adhesion After sticking a protective film with the masking application device in the sheet extruder process, the sheet surface obtained by cutting in the same process is visually observed, and when there is almost no chip adhesion. Was marked with ◯, when a little chipping was observed, Δ, and when there was a large amount of chipping, it was marked with ×.
（４）フィルム切断面の状態
シート押出機工程内のマスキング貼付装置にて保護フィルムを貼付け後、同工程内で切断し得られたシート切断面を目視観察し、保護フィルムの切断面がカット良好で毛羽立ちが無い場合には○とし、毛羽がやや認められる場合は△、毛羽が多量に認められる場合は×とした。
（５）ゴミ付着の有無
シート表面に貼り付けられた保護フィルムを剥離後、シート表面にゴミの付着が殆ど無い場合を○とし、ゴミの付着がやや見られるものを△、ゴミが多量に付着が認められる場合は×とした。
（６）シート表面との接着強さ
メタクリル樹脂透明シートに貼付けた保護フィルムを５０ｍｍ幅にカットし、引張試験機を用いて、剥離速度３００ｍｍ／分、剥離角度１８０゜の条件下で測定した。
(4) State of the film cut surface After applying the protective film with a masking application device in the sheet extruder process, the sheet cut surface obtained by cutting in the same process is visually observed, and the cut surface of the protective film is cut well. When there was no fluff, it was marked as ◯, when fluff was slightly recognized, Δ was marked, and when a lot of fluff was recognized, it was marked as x.
(5) Presence / absence of dust After peeling off the protective film affixed to the surface of the sheet, the case where there is almost no dust adhering to the surface of the sheet is marked as ◯. X was marked when X was recognized.
(6) Adhesive strength with sheet surface The protective film affixed to the methacrylic resin transparent sheet was cut into a width of 50 mm and measured using a tensile tester under conditions of a peeling speed of 300 mm / min and a peeling angle of 180 °.
［実施例１］
基材層は、ＭＦＲ２．０、密度０．９２０ｇ／ｃｍ３の低密度ポリエチレン１００重量部とＭＦＲ５．５、密度０．９９ｇ／ｃｍ３のアルカリ金属をイオン源とする非帯電性共重合体アイオノマー樹脂（三井・デュポンポリケミカル（株）高分子型帯電防止剤「ＳＤ１００」、以下同様）２０重量部を添加しドライブレンドした混合物を得た。中間層はＭＦＲ４．０、密度０．９４５ｇ／ｃｍ３の高密度ポリエチレン、また粘着層樹脂組成としては、ＭＦＲ２．５、エチレン・酢酸ビニル共重合体樹脂(酢酸ビニルの含有率１０重量％)を用いた。
インフレーション法三層共押出機（ダイス：４００ｍｍφ）を使用し樹脂温度１９０℃に設定し、保護フィルム（全体厚み６０μｍ、基材層２０μｍ、中間層２０μｍ、粘着層２０μｍ）を作製した。
次に、旭化成ケミカルズ（株）製メタクリル樹脂デルペットＬＰ−１を１２０ｍｍφ、Ｌ／Ｄ＝３２の押出機を用いて厚さ３ｍｍ、巾１０００ｍｍのシートを押出した。押出機とダイの温度は２５０℃、ポリシングロールの温度は８０℃であった。上記で得られた保護フィルムをインライン工程内にてシートの両面に貼り付け（圧力：０．３ＭＰａ）後、工程内で切断した。保護フィルムを貼り付けて得られたメタクリル樹脂透明シートのフィルム両面には、切断時の切粉付着は皆無であった。保護フィルム貼り付け後のシートを丸鋸にて各測定用のサンプルサイズに切り出し、評価用サンプルを得た。
[Example 1]
Substrate layer, MFR2.0, density 0.920 g / cm 3 low-density polyethylene 100 parts by weight MFR5.5, uncharged copolymer ionomer alkali metal density 0.99 g / cm 3 and an ion source 20 parts by weight of resin (Mitsui / DuPont Polychemical Co., Ltd., polymer type antistatic agent “SD100”, the same applies hereinafter) was added to obtain a dry blended mixture. The intermediate layer is MFR 4.0, high density polyethylene with a density of 0.945 g / cm 3 , and the adhesive layer resin composition is MFR 2.5, ethylene / vinyl acetate copolymer resin (vinyl acetate content 10 wt%). Using.
An inflation method three-layer coextrusion machine (die: 400 mmφ) was used to set the resin temperature to 190 ° C., and a protective film (total thickness 60 μm, base material layer 20 μm, intermediate layer 20 μm, adhesive layer 20 μm) was produced.
Next, a sheet having a thickness of 3 mm and a width of 1000 mm was extruded from a methacrylic resin Delpet LP-1 manufactured by Asahi Kasei Chemicals Corporation using an extruder having a diameter of 120 mmφ and L / D = 32. The temperature of the extruder and die was 250 ° C., and the temperature of the polishing roll was 80 ° C. The protective film obtained above was applied to both sides of the sheet in an in-line process (pressure: 0.3 MPa), and then cut in the process. On both surfaces of the methacrylic resin transparent sheet obtained by pasting the protective film, there was no chip adhesion at the time of cutting. The sheet | seat after sticking a protective film was cut out to the sample size for each measurement with the circular saw, and the sample for evaluation was obtained.
［実施例２］
基材層のアルカリ金属をイオン源とする非帯電性共重合体アイオノマー樹脂（三井・デュポンポリケミカル（株）高分子型帯電防止剤「ＳＤ１００」、以下同様）１５重量部を添加した以外は、実施例１と同一方法にて実施例２の評価用サンプルを得た。
[Example 2]
Except for adding 15 parts by weight of non-chargeable copolymer ionomer resin (Mitsui / Dupont Polychemical Co., Ltd., polymer type antistatic agent “SD100”, the same applies hereinafter) using an alkali metal of the base material layer as an ion source, A sample for evaluation of Example 2 was obtained in the same manner as Example 1.
［実施例３］
基材層のアルカリ金属をイオン源とする非帯電性共重合体アイオノマー樹脂（三井・デュポンポリケミカル（株）高分子型帯電防止剤「ＳＤ１００」、以下同様）２５重量部を添加した以外は、実施例１と同一方法にて実施例３の評価用サンプルを得た。
[Example 3]
Except for adding 25 parts by weight of non-chargeable copolymer ionomer resin (Mitsui / Dupont Polychemical Co., Ltd., polymer type antistatic agent “SD100”, the same applies hereinafter) using an alkali metal of the base material layer as an ion source, A sample for evaluation of Example 3 was obtained by the same method as Example 1.
［実施例４］
中間層にＭＦＲ２．０、密度０．９２０ｇ／ｃｍ３の低密度ポリエチレンを使用した以外は、実施例１と同一方法にて実施例４の評価用サンプルを得た。
[Example 4]
An evaluation sample of Example 4 was obtained in the same manner as in Example 1 except that low-density polyethylene having an MFR of 2.0 and a density of 0.920 g / cm 3 was used for the intermediate layer.
［実施例５］
基材層にＭＦＲ４．０、密度０．９４５ｇ／ｃｍ３の高密度ポリエチレンを使用した以外は、実施例１と同一方法にて実施例５の評価用サンプルを得た。
[Example 5]
A sample for evaluation of Example 5 was obtained in the same manner as in Example 1 except that MFR 4.0 and high density polyethylene having a density of 0.945 g / cm 3 were used for the base material layer.
［比較例１］
基材層、中間層の樹脂組成に、ＭＦＲ２．０、密度０．９２０ｇ／ｃｍ３の低密度ポリエチレンを使用し、粘着層の樹脂組成としては、ＭＦＲ２．５、エチレン・酢酸ビニル共重合体樹脂(酢酸ビニルの含有率１０重量％)を使用した以外は、実施例１と同一方法にて比較例１の評価用サンプルを得た。得られた保護フィルム付きメタクリル樹脂板の表面抵抗率は、＞１０１６Ω／□を示し切粉及びゴミ付着する帯電量で、実施例１と顕著な差が認められた。
[Comparative Example 1]
The resin composition of the base layer and the intermediate layer is MFR 2.0 and low density polyethylene having a density of 0.920 g / cm 3. The resin composition of the adhesive layer is MFR 2.5, ethylene / vinyl acetate copolymer resin. A sample for evaluation of Comparative Example 1 was obtained in the same manner as in Example 1 except that (vinyl acetate content 10% by weight) was used. The surface resistivity of the obtained methacrylic resin plate with a protective film was> 10 16 Ω / □, indicating a significant difference from Example 1 in the amount of charge to which chips and dust adhered.
［比較例２］
中間層にＭＦＲ２．０、密度０．９２０ｇ／ｃｍ３の低密度ポリエチレン、また基材層にＭＦＲ５．５、密度０．９９ｇ／ｃｍ３のアルカリ金属をイオン源とする非帯電性共重合体アイオノマー樹脂（三井・デュポンポリケミカル（株）高分子型帯電防止剤「ＳＤ１００」、以下同様）２０重量部を添加しドライブレンドした混合物を使用した以外は、実施例１と同一方法にて評価用サンプルを得た。得られた保護フィルム付きメタクリル樹脂板の表面抵抗率は、１×１０１4Ω／□を示し切粉及びゴミ付着する帯電量である。また、シート切断面のフィルムは毛羽立ちが認められ、フィルム剥離時の剥離帯電によるシート表面に多くゴミ付着が認められた。
[Comparative Example 2]
MFR2.0 the intermediate layer, density 0.920 g / cm 3 low-density polyethylene, also the substrate layer MFR5.5, antistatic copolymer ionomer alkali metal density 0.99 g / cm 3 and an ion source Sample for evaluation in the same manner as in Example 1 except that a mixture obtained by adding 20 parts by weight of resin (Mitsui / DuPont Polychemical Co., Ltd., polymer type antistatic agent “SD100”, the same applies below) and dry blending was used. Got. The surface resistivity of the obtained methacrylic resin plate with a protective film is 1 × 10 14 Ω / □, and is a charge amount to which chips and dust adhere. Further, the film on the cut surface of the sheet was found to be fuzzy, and a large amount of dust was observed on the surface of the sheet due to peeling charging during film peeling.
［比較例３］
実施例１の樹脂組成を用い、基材層、中間層及び接着層の３層にアルカリ金属をイオン源とする非帯電性共重合体アイオノマー樹脂（三井・デュポンポリケミカル（株）高分子型帯電防止剤「ＳＤ１００」、以下同様）を各１０重量部を添加した以外は、実施例１と同一方法にて比較例３の評価用サンプルを得た。保護フィルム付きメタクリル樹脂板の表面抵抗率は３×１０８Ω／□を示し、粘着層に添加することによりシート表面との接着性が低下し、密着不具合が認められた。
[Comparative Example 3]
Using the resin composition of Example 1, non-chargeable copolymer ionomer resin (Mitsui / DuPont Polychemical Co., Ltd., polymer type charging) using an alkali metal as an ion source for the base layer, the intermediate layer and the adhesive layer. A sample for evaluation of Comparative Example 3 was obtained in the same manner as in Example 1 except that 10 parts by weight of each of the inhibitor “SD100” and the same below were added. The surface resistivity of the methacrylic resin plate with a protective film was 3 × 10 8 Ω / □, and when added to the pressure-sensitive adhesive layer, the adhesion with the sheet surface was lowered, and adhesion defects were observed.
本発明の表面保護フィルムは、熱可塑性樹脂シート表面に貼り付けた用途分野に適用可能である。すなわち、シート表面を剥離する際に発生する静電気が発生し、その結果、ゴミ及び埃が発生し製品の美観を損なう分野である。印刷用途、ＯＡフィルター、プロジェクションＴＶ前面パネル及び導光板等の光学製品用途等の分野に適用可能である。 The surface protective film of the present invention can be applied to a field of use attached to the surface of a thermoplastic resin sheet. In other words, static electricity is generated when the sheet surface is peeled off. As a result, dust and dust are generated, and the appearance of the product is impaired. The present invention is applicable to fields such as printing applications, optical product applications such as OA filters, projection TV front panels, and light guide plates.
Claims (5)
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| JP2005010431A JP2006198800A (en) | 2005-01-18 | 2005-01-18 | Antistatic resin sheet with protective film |
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Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2009262423A (en) * | 2008-04-25 | 2009-11-12 | Mitsui Chemicals Inc | Surface protection film |
| JP2011517430A (en) * | 2008-05-30 | 2011-06-09 | ヨウル チョン ケミカル カンパニー， リミテッド | Protective film and method for producing the same |
| WO2014129608A1 (en) * | 2013-02-20 | 2014-08-28 | 住友化学株式会社 | Method for manufacturing optical sheet and device for manufacturing optical sheet |
-
2005
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Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2009262423A (en) * | 2008-04-25 | 2009-11-12 | Mitsui Chemicals Inc | Surface protection film |
| JP2011517430A (en) * | 2008-05-30 | 2011-06-09 | ヨウル チョン ケミカル カンパニー， リミテッド | Protective film and method for producing the same |
| WO2014129608A1 (en) * | 2013-02-20 | 2014-08-28 | 住友化学株式会社 | Method for manufacturing optical sheet and device for manufacturing optical sheet |
| JP2014160201A (en) * | 2013-02-20 | 2014-09-04 | Sumitomo Chemical Co Ltd | Method for manufacturing optical sheet |
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