JP2006192195A - Game machine - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To mount an electronic component in the shape of a curved surface in a game machine. <P>SOLUTION: A printed circuit board for mounting electronic components has a laminating structure of a flexible layer 21 and a reinforcing layer 25. Both the layers are made from materials other than flexible boards such as CEM, FR materials and the like. The reinforcing layer 25 is a thicker layer than the flexible layer and placed on the rear side of the flexible layer with a given interval. On the front side of the flexible layer, a circuit pattern is formed and an LED 30 is surface-mounted. On the reinforcing layer 25, a connector 28 is attached. The printed circuit board is fixed on the main body of a game machine in a form of a curved condition. In this condition, the reinforcing layer absorbs a stress generated in the flexible layer and plays a role of preventing an excess stress from being applied onto the LED 30. <P>COPYRIGHT: (C)2006,JPO&NCIPI

Description

  The present invention relates to a technique for mounting electronic components in a gaming machine.

  Various electronic parts such as control parts such as CPU, RAM, and ROM and display parts such as LEDs are used in pachinko machines and other gaming machines, and most of them are mounted on a printed circuit board. In the gaming machine, not only the function but also the appearance is an important element, and the decorative lamp provided on the frame has an elegant appearance. These shapes in the decorative lamp are realized by arranging LEDs or the like on a flat printed board and attaching lenses of various shapes on the surface (see Patent Document 1).

JP 2004-194997 A

  In the conventional mounting method, since the display components are arranged on a flat printed board, the distance between the lens outer surface and the display components is not uniform due to the irregularities in the normal direction of the game board surface. . For this reason, when the unevenness is increased, the brightness may become non-uniform. As a result, in the conventional mounting method using a lens, there is a restriction on the external shape.

  As a method for solving such a problem, firstly, there is a method in which a substrate on which a display component is mounted is subdivided and arranged so as not to vary the distance from the lens outer surface according to the unevenness. However, in this method, the increase in the number of parts and the increase in the number of mounting steps cause another problem such as a complicated apparatus configuration and an increase in manufacturing cost.

  As a second method, a method of mounting a display component in accordance with the unevenness using a flexible substrate using polyester, polyimide, or the like can be considered. However, since the flexible substrate has insufficient rigidity, a holding member for holding the substrate in accordance with the unevenness is separately required. In addition, the flexible substrate is generally more expensive than the non-flexible substrate, and there is a disadvantage that it is difficult to surface-mount components. Due to these disadvantages, even when a flexible substrate is used, another problem such as an increase in the number of parts, an increase in the number of mounting steps, and the like, complicating the device configuration and increasing the manufacturing cost.

  As a third method, a method of bending a thin non-flexible substrate according to the unevenness is conceivable. However, in this method, since stress is applied to the mounted electronic component, it is likely to be affected by thermal distortion during use, and the durability of the electronic component may be impaired.

  The problem described above lies in the point of realizing mounting of electronic components on a printed circuit board in a curved state, and this problem is common to various printed circuit boards used in game machines. In view of such problems, an object of the present invention is to provide a technique for mounting electronic components in a curved shape while avoiding complicated device configuration and an increase in manufacturing cost in a gaming machine.

  A gaming machine of the present invention includes a printed circuit board on which predetermined electronic components are mounted, and a fixing unit that curves and fixes the printed circuit board. The printed circuit board of the present invention has a multilayer structure including a flexible layer and a reinforcing layer. The flexible layer is formed of a substrate material for a non-flexible substrate having a predetermined thickness that can be bent, such as a CEM material or an FR material. The reinforcing layer is formed of a thick plate that is equal to or larger than the flexible layer, and is laminated on the back surface of the flexible layer in a state where the reinforcing layer is arranged at a predetermined interval along the distortion direction due to the curvature.

  In the present invention, unlike the flexible substrate, since the printed circuit board itself has a certain rigidity, the fixing portion has a relatively simple structure, and the printed circuit board can be curved and held. Further, since the reinforcing layer has an effect of absorbing the stress of the flexible layer, it is possible to adjust the stress distribution in the flexible layer, and it is possible to suppress excessive stress on the electronic component. Since a material that is not a flexible substrate is used, it is relatively inexpensive and mounting of electronic components is easy.

  The space | interval which arrange | positions a reinforcement layer can be arbitrarily set according to the curvature to curve. This interval may be uniform or non-uniform. The shape of each reinforcing layer to be arranged can be arbitrarily set, and can be, for example, a rectangle or a trapezoid. The shape of each reinforcing layer may be uniform or non-uniform.

  The reinforcing layer is preferably formed of a substrate material for a non-flexible substrate, and more preferably the same substrate material as the flexible layer. By using a material for a non-flexible substrate, it is possible to form a printed circuit board according to the present invention by applying a manufacturing facility and a manufacturing method for a multilayer substrate. In addition, when the same material is used, since the bending strain and thermal strain characteristics are the same, it is possible to suppress the occurrence of shear stress on the laminated surface of the flexible layer and the reinforcing layer and the peeling of the adhesive surface. There are advantages you can do.

  In the printed circuit board of the present invention, the electronic component can be mounted on the outer surface side of the flexible layer. In this case, the reinforcing layer is preferably arranged in accordance with the mounting position of the electronic component. By doing so, the electronic component can be mounted on the portion where the plate thickness is thick, so that the positioning accuracy can be improved. Moreover, the stress to an electronic component can be suppressed by the stress absorption effect of the reinforcing layer.

  The wiring pattern of the printed board is preferably formed on the outer surface side of the flexible layer when applying surface mounting. The outer surface refers to the surface on the side where the reinforcing layer is not laminated. The pattern may have a uniform width, or the width may be changed according to the stress distribution on the surface of the flexible layer. For example, a portion where the reinforcing layer is not stacked may be made thicker than other portions.

  In the present invention, it is desirable that the connector for connecting the signal line to the printed circuit board is provided on the portion of the flexible layer that is lined with the reinforcing layer. In this way, the flat surface is maintained by the reinforcing layer, so that the connector can be securely attached. The connector may be surface-mounted on the outer surface of the flexible layer, that is, the surface facing the surface bonded to the reinforcing layer. According to this method, the connector can be mounted in the same process as the mounting of the electronic component on the printed board.

  As another aspect, the connector may be a so-called dip type, that is, a type in which pins provided in the connector are soldered by penetrating through a through hole in a printed board. In this case, since the pattern of the printed circuit board is provided on the outer surface side, it is preferable that the connector is attached in a direction in which the pins pass through from the back surface side to the outer surface side. In this aspect, since the pins penetrate the reinforcing layer, there is an advantage that the connector can be attached relatively firmly. Further, since the connector is located on the back side, there is an advantage that it is easy to avoid interference between the connector and the gaming machine when the printed circuit board is attached to the gaming machine.

  The connector may be either a top type that connects signal lines from the normal direction of the printed circuit board, or a side type that can connect signal lines from the direction along the surface of the printed circuit board. However, the side type has an advantage that the signal line can be easily connected even in a curved state.

  The printed circuit board described above can be used for mounting various electronic components, but is particularly preferably used for mounting display components. In order to realize the appearance with the unevenness, there is a demand for arranging display parts in accordance with the unevenness, and the printed circuit board of the present invention is suitable for realizing such a demand. In addition, the printed circuit board of the present invention may be curved and attached so that the reinforcing layer is inside the curved surface, or may be attached so that the reinforcing layer is outside the curved surface.

  The printed circuit board described above can be manufactured, for example, by the following manufacturing method. First, a flexible layer having a width equal to that of a printed circuit board is formed using a substrate material for a non-flexible substrate having a predetermined thickness that can be bent. Next, a reinforcing plate is formed by laminating a thick plate having a thickness equal to or greater than that of the flexible layer on the back surface of the flexible layer. This reinforcing layer is wider than the printed circuit board, and has a ladder shape provided with holes of a predetermined shape along the direction of distortion due to bending. A wiring pattern is formed on the flexible layer, and electronic components are mounted as necessary. Then, both sides of the flexible layer and the reinforcing layer are cut to the width of the printed board. According to this manufacturing method, the rigidity of the substrate can be ensured through the manufacturing process by the ladder-shaped reinforcing layer. Accordingly, it is possible to easily execute processes such as formation of wiring patterns and mounting of electronic components, and to improve the accuracy thereof.

Embodiments of the present invention will be described in the following order. In the present embodiment, a configuration as a pachinko machine is illustrated, but the present invention is not limited to this and can be applied to various gaming machines such as a spinning-type gaming machine.
A. overall structure:
B. Printed circuit board structure:
C. Printed circuit board manufacturing process:
D. Variations:

A. Hardware configuration:
FIG. 1 is a perspective view showing an appearance of a gaming machine 10 as an embodiment. The gaming machine 10 is provided with a frame 13 so as to cover the periphery of the gaming board surface 12, and a decorative lamp 11 is provided above the frame 13. The frame 13 is provided with a hinge on the right side in the figure and can be opened and closed. On the back side of the game board, various control boards such as a main control board, a payout control board, a sub control board, and a display control board are provided to control the operation during the game. These control boards are equipped with a one-chip microcomputer having a CPU, a RAM, a ROM, etc. therein, and various control processes are realized by distributed processes in accordance with programs recorded in the ROM.

  Based on the control of the main control board 100, the gaming machine, when a ball enters the winning opening provided on the gaming board surface 12, pays out the ball, makes a hit / loss determination based on a random number, and is determined to be a win. In such a case, the game is operated so as to release the special winning opening provided on the game board surface 12 for a predetermined period.

  Control of each operation during other games is performed via the payout control board and the sub control board. The payout control board controls the launch and payout of the ball being played. The sub-control board controls effects such as voice, display, and lamp lighting during the game. These effects vary according to the status during the game, such as during normal times, when winning a prize, or when winning a big hit. When an effect command corresponding to each status is transmitted from the main control board, the sub control board activates a program corresponding to each command to realize the effect instructed from the main control board. The decorative lamp 11 is one of the objects whose lighting is controlled by the sub-control board.

  The internal structure from which the lens of the decorative lamp 11 is removed is shown in the upper part of the figure. Inside, there is provided a printed circuit board 20 on which LEDs 30 as lighting parts of the decorative lamp 11 are arranged. In this embodiment, the decorative lamp 11 has an arcuate outer shape that is convex in the front direction, and the printed circuit board 20 is curved and installed in the front direction so as to follow this outer shape. By installing the printed circuit board 20 in such a curved manner, variations in the distance between the LEDs 30 and the lenses can be suppressed, and unevenness in the brightness of the decorative lamp 11 can be suppressed.

B. Printed circuit board structure:
FIG. 2 is an explanatory view showing the structure of the end portion of the printed circuit board 20. The upper diagram shows a state (hereinafter referred to as a front view) of the printed circuit board 20 installed in the gaming machine as viewed from the front. In the lower figure, a view of the printed circuit board 20 viewed from below (hereinafter referred to as a bottom view) is shown. For convenience of explanation, the bottom view is shown in a state where the front view is doubled.

  As shown in the bottom view, the printed circuit board 20 has a laminated structure of a flexible layer 21 made of a thin substrate that can be bent and a reinforcing layer 25 made of a thick substrate that can hold a flat surface. The flexible layer 21 and the reinforcing layer 25 are each formed of a non-flexible substrate material. In this embodiment, the CEM is used, but various other materials such as an FR material can be used. The reinforcing layer 25 is not provided over the entire area of the flexible layer 21, but is provided with a constant interval as shown in the front view.

  The LED 30 is disposed on the outer surface of the flexible layer 21, that is, the surface opposite to the reinforcing layer 25. Further, connectors 28 and 29 for connecting signal lines for transmitting signals from the control board to these LEDs 30 are surface-mounted on the portion backed by the reinforcing layer 25 at the end. Since the portion lined with the reinforcing layer 25 has a flat surface, the connector can be reliably mounted by providing it in such a portion. Each LED 30 and the connectors 28 and 29 are connected by a wiring pattern provided on the outer surface of the flexible layer 21.

  The signal lines are connected from the direction along the printed circuit board 20 (the direction of arrow C in the figure). Although it is possible to use a top-type connector that connects signal lines from the normal direction of the printed circuit board 20, the printed circuit board 20 is curved by using the side-type connectors 28 and 29 as illustrated. However, since the connection direction of the signal line is not significantly affected, there is an advantage that the connection is easy.

  The connectors 28 and 29 are provided at the right end of the printed circuit board 20. As described above with reference to FIG. 1, since the frame 13 to which the printed circuit board 20 is attached can be opened and closed by a hinge provided on the right side of the drawing, the connectors 28 and 29 have end portions on the side close to the hinge. Will be provided. Such a position is convenient for connection of a signal line to the gaming machine main body.

  FIG. 3 is an explanatory view showing the structure of the printed circuit board 20. The state which looked at the printed circuit board 20 installed in the game machine from upper direction was shown. As described above, the printed circuit board 20 is installed so as to be convexly convex toward the front surface. Hereinafter, for convenience of explanation, the terms “front” and “rear” of the gaming machine are also used for the printed circuit board itself.

  As described above, the printed circuit board 20 has a laminated structure of the flexible layer 21 made of a thin board and the reinforcing layer 25 made of a thick board. In the present embodiment, the reinforcing layer 25 is made of five rectangular members, and is arranged on the back surface of the flexible layer 21 with a predetermined interval. The reinforcing layer 25 has an effect of absorbing stress when the printed circuit board 20 is bent. As a result, the strain and stress generated in the flexible layer 21 at the time of bending mainly occur in the gap portion where the reinforcing layer 25 is not provided. In the present embodiment, the reinforcing layer 25 is disposed at a position corresponding to the LED 30 in order to utilize such a stress absorption effect. By carrying out like this, the stress to LED30 can be suppressed and durability fall can be suppressed. As described above, the shape and the arrangement interval of the reinforcing layer 25 can be arbitrarily set in accordance with the curvature of bending the flexible layer 21 and the arrangement of the electronic components to be surface-mounted in consideration of the stress absorption effect.

  FIG. 4 is a cross-sectional view of the printed circuit board 20 taken along the line AA. As described above, the printed circuit board 20 has a laminated structure of the flexible layer 21 and the reinforcing layer 25. In the present embodiment, the reinforcing layer 25 is provided over the entire width of the flexible layer 21 in the vertical direction.

The printed circuit board 20 is attached to the gaming machine 10 by a fixing member 23. The fixing member 23 is a metal fitting having an L-shaped cross section as shown in the figure, and fastens the printed circuit board 20 and the gaming machine 10 with screws 23s. Although not shown in FIG. 3, the fixing member 23 is provided corresponding to the five members constituting the reinforcing layer 25, and the printed circuit board 20 is arranged as shown in FIG. It can be held curved.
FIG.

  Although the flexible layer 21 of the printed circuit board 20 of this embodiment is thin, the flexible layer 21 has a certain rigidity unlike the flexible circuit board. Therefore, as shown in FIG. The substrate 20 can be upright. Since the reinforcing layer 25 is provided over the entire width of the printed circuit board 20, the printed circuit board 20 can be uniformly curved by being held at the lower part. By these actions, according to the present embodiment, there is an advantage that the structure of the fixing member 23 for fixing the printed circuit board 20 can be made relatively simple.

  The fixing member 23 is not limited to that shown in FIG. 4 and can take various shapes. For example, instead of providing the individual fixing members 23 corresponding to the respective reinforcing layers 25, the whole may be connected to form an integrated fixing member. Instead of the L-shaped cross section shown in FIG. 4, a U-shaped cross section that holds the front surface, the lower surface, and the back surface of the printed circuit board may be employed. Further, the fixing member 23 may be provided not only at the lower part of the printed board 20 but also at the upper part.

  As another aspect, the printed circuit board 20 may be attached to the gaming machine 10 without using a fixing member. For example, on the inner side of the frame 13, planar attachment portions are provided at several positions similar to the fixing member 23, and the reinforcement layer 25 and the flexible layer 21 are provided at portions where the reinforcement layer 25 of the printed circuit board 20 is provided. Alternatively, a method may be employed in which a through-hole penetrating through the frame 13 is provided and the printed board 20 is screwed to the frame 13 through the through-hole. The printed circuit board 20 can be curved with an arbitrary curvature depending on the position of the mounting portion. In the present embodiment, since the portion of the reinforcing layer 25 is substantially flat, there is an advantage that it can be fixed relatively easily by such a method. Of course, the part to be fixed is not limited to the frame 13, and any part of the gaming machine 10 can be selected.

C. Printed circuit board manufacturing process:
FIG. 5 is a process diagram showing the manufacturing process of the printed circuit board 20. First, the flexible layer 21 is formed from a substrate material such as CEM or FR (step S10). The top view of the flexible layer 21 was shown in the figure. The shape of the flexible layer 21 is a rectangle having a width W of the printed circuit board 20. The thickness of the flexible layer 21 can be arbitrarily set, but is set to 0.3 mm in this embodiment.

  Next, a reinforcing layer is formed on the back surface of the flexible layer (step S12). A plan view and a BB cross-sectional view are shown in the figure. The reinforcing layer has a ladder shape (shape with hatching in a plan view) obtained by removing portions of the distances d1 to d4 from a rectangle having a width W1 wider than the width W of the flexible layer 21. In the following, d1 to d4 may be used as symbols indicating this “unplugged” portion. In addition, originally, the inside of the width W, that is, the portion that becomes the back surface of the flexible layer 21 should be indicated by a broken line, but here, the whole is intentionally shown by a solid line for the purpose of clarifying the shape of the reinforcing layer. .

  As shown in the BB cross-sectional view, five reinforcing layers 25 a to 25 e are formed on the back surface of the flexible layer 21. The reinforcing layers 25a to 25e are arranged so that the distances d1 to d4 of the punched portions are equal to the position where the LED 30 is mounted. The reinforcing layers 25a and 25e at both ends are slightly wider than the other reinforcing layers 25b to 25d, but all the reinforcing layers 25a to 25e can be formed in a unified shape.

  The thickness t2 of the reinforcing layers 25a to 25e is thicker than the thickness t1 of the flexible layer 21, and is 1 mm in this embodiment. Although the thickness t2 can be arbitrarily set, the thickness is preferably equal to or greater than the thickness t1, and more preferably three times or more. On the other hand, if the reinforcing layer is too thick, the stress absorption effect becomes too strong, making it difficult to bend the printed circuit board 20, and there is a risk that distortion and stress generated in the flexible layer 21 at the time of bending d1-d4 will be excessive. . Strictly speaking, this adverse effect differs depending on the curvature at the time of bending and the distances d1 to d4 of the reinforcing layer. However, the thickness t2 of the reinforcing layer is approximately equal to the thickness t1 of the flexible layer as a dimension capable of suppressing such an adverse effect. It is preferable to set it to 4 times or less.

  In this example, the reinforcing layer was formed of the same material as the flexible layer 21. By doing so, since the characteristics of bending strain and thermal strain are the same, there is an advantage that generation of shear stress on the laminated surface of the flexible layer 21 and the reinforcing layer and peeling of the adhesive surface can be suppressed. However, a material different from the flexible layer 21 may be used for the reinforcing layer, or a material other than the substrate material such as metal may be used. However, when a material other than the substrate material is used, step S12 is realized as an adhesion process using equipment matched to the material. However, if a substrate material is used for the reinforcing layer, the conventional lamination is performed. There is an advantage that a part of the substrate manufacturing equipment can be used as it is.

  After the reinforcing layer is thus formed, next, a wiring pattern is formed on the surface of the flexible layer 21, and the LED 30 is surface-mounted (step S14). The wiring pattern can be designed according to the arrangement of the LEDs 30. The width of the wiring pattern may be uniform, but it is preferable to make it thicker at the portions corresponding to the cutouts d1 to d4. By doing so, it is possible to suppress the tearing of the wiring pattern due to the distortion generated in the flexible layer 21 by the extractions d1 to d4 during bending. The LED 30 is arranged so that the direction in which the strength against distortion is strong is along the longitudinal direction, that is, the direction in which distortion occurs when bending (the deflection direction). In this embodiment, the electrodes of the LED 30 are arranged so as to face the width direction.

  After the mounting of the electronic components is completed, both sides of the reinforcing layer are cut so as to have the width W (step S16), and the printed circuit board manufacturing process is completed. Thereafter, a through hole is opened, a connector is attached, and the game machine 10 is fixed using a fixing member.

  In this embodiment, since the wide reinforcing layer is formed as shown in step S12, the rigidity of the substrate can be ensured through the manufacturing process. Therefore, the accuracy of pattern formation and surface mounting can be ensured relatively easily. However, it is not essential to use such a reinforcing layer, and in step S12, five reinforcing layers 25a to 25e divided in the longitudinal direction may be provided. In this case, it is preferable to use a jig for holding the substrate flat during pattern formation and surface mounting.

  According to the printed circuit board and the manufacturing method thereof according to the present embodiment described above, the electronic component can be mounted in a curved surface shape. If display components such as the LED 30 are arranged in this manner as in the embodiment, it is possible to improve the uniformity of the brightness of the decorative lamp 11 (see FIG. 1) formed in a curved surface.

  In the embodiment, the mounting of display components has been described as an example, but this technique can also be applied to a control board or the like. When applied to a control board or the like, there are advantages such as being able to efficiently arrange components in a limited space inside the gaming machine.

  In the embodiment, the case where the front surface side, that is, the surface side on which the electronic component is mounted is curved in a convex state is illustrated. In contrast, the present embodiment is also applicable to a printed circuit board that is attached in a curved state in a concave state on the front side. Moreover, it is also possible to apply to the printed circuit board attached to the wave shape which the unevenness | corrugation combined. The reinforcing layer may be provided only on the back surface of the flexible layer, or may be alternately provided on the back surface and the front surface in accordance with the uneven shape at the time of attachment.

D. Variations:
The planar shape of the reinforcing layer is not limited to the example shown in the embodiment (see FIG. 5), and various shapes can be adopted. Hereinafter, the modification about the planar shape of a reinforcement layer is illustrated.

  FIG. 6 is an explanatory view showing the structure of a printed circuit board 20A as a first modification. The hatched part is a reinforcing layer. The reinforcing layers 26a to 26e of the modified example have a trapezoidal shape with a narrow lower width and a wide upper width. The space between the reinforcing layers is such that the lower d12 is wider than the upper d11. The printed circuit board 20A is fixed on the lower side.

  When a fixing member is provided on the lower side and the printed circuit board is curved, the elastic force of the flexible layer 21 acts in a direction to keep a flat plate shape on the upper side, so that the curvature of the printed circuit board 20 may be different between the upper and lower sides. is there. According to the modified printed circuit board 20A, the reinforcing layer absorbs stress at the upper side and also absorbs the elastic force of the flexible layer 21, so that there is an advantage that it is easy to maintain a uniform curvature. Thus, you may change the width | variety of a reinforcement layer in the up-down direction of a printed circuit board.

  FIG. 7 is an explanatory view showing the structure of a printed circuit board 20B as a second modification. In the second modification, the reinforcing layers 27a to 27e are each rectangular. However, the distance between the reinforcing layers is wide at both ends d21 and narrow at the internal d22. By changing the interval between the reinforcing layers in this way, the printed circuit board 20B can be bent in an elliptical shape. In contrast to FIG. 7, the interval between the reinforcing layers may be wide at the inside and may be narrow at both ends, and is not necessarily symmetrical.

  Various shapes can be selected for the reinforcing layer. For example, the combination of the first modified example and the second modified example, that is, the width of the reinforcing layer itself is changed in the vertical direction, and the arrangement interval is also set in the longitudinal direction. It may be changed.

  FIG. 8 is an explanatory view showing the structure of a printed circuit board 20C as a third modification. The state corresponding to the bottom view of FIG. 2 is shown. In the embodiment, a surface mount connector is used, whereas in the third modification, a dip type connector is used. In the third modified example, through holes are provided in the reinforcing layer 25 and the flexible layer 21, the pins of the connector 29A are penetrated from the back side, and soldered to the wiring pattern provided on the outer surface to mount the connector 29A. . The signal lines are connected from the direction along the printed circuit board 20 (arrow C direction).

  According to the method of the third modification, the connector can be firmly fixed by using the dip type. In addition, since the connector is mounted on the back side, there is an advantage that it is easy to avoid interference between the connector and the mounting portion when the printed circuit board 20C is attached to the gaming machine.

  As mentioned above, although the various Example of this invention was described, it cannot be overemphasized that this invention is not limited to these Examples, and can take a various structure in the range which does not deviate from the meaning. For example, the connector may be a top type that connects signal lines from the normal direction of the printed circuit board.

It is a perspective view which shows the external appearance of the game machine 10 as an Example. 3 is an explanatory diagram illustrating a structure of an end portion of a printed circuit board 20. FIG. 3 is an explanatory diagram showing a structure of a printed circuit board 20. FIG. 2 is a cross-sectional view of the printed circuit board 20 taken along the line AA. FIG. FIG. 6 is a process diagram illustrating a manufacturing process of the printed circuit board 20. It is explanatory drawing which shows the structure of 20 A of printed circuit boards as a 1st modification. It is explanatory drawing which shows the structure of the printed circuit board 20B as a 2nd modification. It is explanatory drawing which shows the structure of 20 C of printed circuit boards as a 3rd modification.

Explanation of symbols

DESCRIPTION OF SYMBOLS 10 ... Game machine 11 ... Decoration lamp 12 ... Game board surface 13 ... Frame 20, 20A, 20B, 20C ... Printed circuit board 21 ... Flexible layer 23 ... Fixing member 23s ... Screw 25, 25a-25e, 26a-26e, 27a-27e ... Reinforcing layer 28, 29, 29A ... Connector 30 ... LED

Claims (7)

A gaming machine,
A printed circuit board on which predetermined electronic components are mounted;
A fixing portion for bending and fixing the printed circuit board;
The printed circuit board is
A flexible layer made of a substrate material for a non-flexible substrate having a predetermined thickness capable of bending;
A gaming machine comprising a reinforcing layer formed on a thick plate equal to or larger than the flexible layer and stacked on the back surface of the flexible layer in a state of being arranged at a predetermined interval along a distortion direction due to the curvature. A gaming machine according to claim 1,
The reinforcing layer is a gaming machine formed of a substrate material for a non-flexible substrate. A gaming machine according to claim 1 or 2,
An electronic component mounted on the outer surface side of the flexible layer;
A gaming machine in which the reinforcing layer is arranged in accordance with a mounting position of the electronic component. A gaming machine according to any one of claims 1 to 3,
A gaming machine in which a wiring pattern is formed on the outer surface side of the flexible layer. A gaming machine according to any one of claims 1 to 4,
A gaming machine provided with a connector for connecting a signal line to the printed circuit board provided in a portion of the flexible layer backed by the reinforcing layer. A gaming machine according to any one of claims 1 to 5,
The electronic component is a gaming machine that is a display component. A manufacturing method for manufacturing a printed circuit board for mounting a predetermined electronic component, which is attached to a gaming machine in a curved manner,
Forming a flexible layer having a width equivalent to that of the printed circuit board by a substrate material for a non-flexible substrate having a predetermined thickness capable of bending;
A reinforcing layer having a ladder shape in which a hole having a predetermined shape is provided in a thick plate having a thickness equal to or greater than that of the flexible layer and wider than the printed board along the distortion direction due to the curve, and the back surface of the flexible layer Laminating and forming,
Forming a wiring pattern on the flexible layer;
A step of cutting both sides of the flexible layer and the reinforcing layer into a width of the printed circuit board.