JP2006179443A - Illumination led mounting board with excellent heat radiation property and case - Google Patents

Illumination led mounting board with excellent heat radiation property and case Download PDF

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JP2006179443A
JP2006179443A JP2004382698A JP2004382698A JP2006179443A JP 2006179443 A JP2006179443 A JP 2006179443A JP 2004382698 A JP2004382698 A JP 2004382698A JP 2004382698 A JP2004382698 A JP 2004382698A JP 2006179443 A JP2006179443 A JP 2006179443A
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led
housing
board
mounting
leds
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Gen Terao
玄 寺尾
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Abstract

<P>PROBLEM TO BE SOLVED: To provide an LED device for illumination restraining an effect of heat between a plurality of LEDs arranged, eanabling to reduce a total heat volume by promoting convection of air, operate the LEDs with a higher output, and to densely arrange the LEDs. <P>SOLUTION: The case for the LEDs for illumination is composed of a mounting board on which notches and holes preventing heat transfer between the distribution of the plurality of LEDs are arranged; a case on which an LED unit integrated with the mounting board is mounted; and vent holes communicated with the notches and holes. <P>COPYRIGHT: (C)2006,JPO&NCIPI

Description

本発明は、LEDの実装基盤形状及び、基盤一体型LEDを実装する筐体面の形状、また、それらを内包する照明器具の筐体の形状に関するものである。  The present invention relates to an LED mounting substrate shape, a shape of a housing surface on which a substrate-integrated LED is mounted, and a shape of a housing of a lighting fixture that includes them.

従来の照明用LEDの実装形態は通常の例えば四角形の基盤などに配置し、それを筐体に取り付けるものであったが、近年のLEDの高出力化によって、その方法ではLEDの発熱に対して、基盤、及び筐体の放熱性能が追い付かず、LEDの照度の低下、寿命の短時間化、故障を招いていた。また、高出力LEDを近距離で複数実装した場合、個々のLEDが発した熱が相互に影響し合い、適切な間隔を開けて実装した場合に比べて、温度上昇の合計値が高まってしまう状態を招いていた。従来はこれらを避けるため、LEDに流す電流自体を少なくするなどしていたが、結果、照度の低下につながっていた。また、複数のLEDの相互の熱的影響を避けるため、LEDを適切な距離を離して配置した場合、照明の配光が集中しないという問題があった。  The conventional mounting form of the LED for illumination has been usually arranged on a square base, for example, and attached to the housing. However, due to the recent increase in the output of the LED, this method prevents the heat generated by the LED. However, the heat dissipation performance of the base and the casing could not catch up, leading to a decrease in the illuminance of the LED, a shortened lifetime, and a failure. In addition, when a plurality of high-power LEDs are mounted at a short distance, the heat generated by each LED affects each other, and the total value of the temperature rise is higher than when mounted at an appropriate interval. Invited the state. Conventionally, in order to avoid these problems, the current flowing through the LED itself has been reduced, but as a result, the illuminance has been reduced. Moreover, in order to avoid the mutual thermal influence of several LED, there existed a problem that the light distribution of illumination did not concentrate, when LED was arrange | positioned at appropriate distance.

本発明は、上記背景技術で指摘した点に鑑みてなされたもので、上記問題点を除去し、複数のLEDを近距離で配置しながらその温度上昇を抑え、より高出力で駆動させる事を目的とする。  The present invention has been made in view of the points pointed out in the background art described above, eliminates the above-mentioned problems, suppresses temperature rise while arranging a plurality of LEDs at a short distance, and drives at higher output. Objective.

上に記載の問題を解決するため、請求項1に記載したように、LEDを複数実装する基盤、及び基盤一体型LEDユニットを取り付ける筐体実装面に、個々のLED(または基盤一体型LEDユニット)間の熱伝達を部分的に遮断する切り欠き、または穴を設ける。また、請求項2に記載したように、照明器具外郭筐体に、請求項1の切り欠きに連通する吸気口、及び排気口を設ける。  In order to solve the above-described problem, as described in claim 1, each LED (or board-integrated LED unit) is mounted on a board on which a plurality of LEDs are mounted and a housing mounting surface on which the board-integrated LED unit is mounted. ) Provide a notch or hole to partially block the heat transfer between. In addition, as described in claim 2, the luminaire outer casing is provided with an intake port and an exhaust port communicating with the cutout of claim 1.

本発明のLED実装基盤、及び基盤一体型LEDユニットを取り付ける筐体実装面には、隣り合ったLED同士の間に熱伝達を遮断、低下させる切り欠き、及び穴が設けられているので、複数のLEDの発熱が相互に影響し合う熱伝達の距離を実際の配置の距離よりも長くする事ができ、総温度上昇値を低下させる事ができる。また、これらの切り欠き、及び穴に連通する吸気口、排気口が外郭筐体に設けられているので、吸気口から入った空気が、LED、実装基盤(またはLEDユニットを取り付ける筐体面)の周辺で暖められ、排気口から出て行く事で、空気の対流が生まれやすい。さらに、この対流は熱源のLEDに距離的に近い、実装基盤、及び実装筐体の切り欠き(または穴)を通過するため、より効率良くLEDの温度上昇を抑える事ができる。これらの事から、LEDを近距離で配置しながら、総温度上昇値を抑え、LEDをより高出力で駆動させる事ができる。  Since the housing mounting surface to which the LED mounting substrate of the present invention and the substrate-integrated LED unit are mounted is provided with notches and holes for interrupting and reducing heat transfer between adjacent LEDs. The heat transfer distance at which the heat generation of the LEDs affects each other can be made longer than the actual arrangement distance, and the total temperature rise value can be reduced. In addition, since the notch and the intake and exhaust ports communicating with the holes are provided in the outer casing, the air that has entered from the intake vents of the LED, the mounting base (or the casing surface to which the LED unit is attached) Air convection is easily born by being warmed around and going out from the exhaust port. Furthermore, since this convection passes through the mounting base and the notch (or hole) of the mounting housing close to the LED of the heat source, the temperature rise of the LED can be suppressed more efficiently. From these things, it is possible to suppress the total temperature rise value and drive the LED with higher output while arranging the LEDs at a short distance.

以下、本発明を実施するための最良の形態を図面に基づいて説明する。図1はLED実装基盤を使用した場合で、LED、本発明を適用した実装基盤、外郭筐体の左下からの斜視図である。図2は基盤一体型LEDユニットを使用した場合で、LEDユニット、本発明を適用した筐体実装面、外郭筐体の左下からの斜視図である。  Hereinafter, the best mode for carrying out the present invention will be described with reference to the drawings. FIG. 1 is a perspective view from the lower left of an LED, a mounting base to which the present invention is applied, and an outer case, when an LED mounting base is used. FIG. 2 is a perspective view from the lower left of the LED unit, the housing mounting surface to which the present invention is applied, and the outer housing in the case where the board-integrated LED unit is used.

本発明は図示するように、例えばアルミダイキャストで筐体1と筐体2を制作し、それぞれ、通気孔3と通気孔4を設けるものとする。そして熱伝達防止用切り欠き10を設けた基盤5にLED6、LED7、LED8、LED9を実装し、筐体1に取り付ける。なお、その取り付けには基板取り付け用ネジ11、12、13、14と筐体1に設ける基板取り付け用タップ穴15、16、17、18を使用するものとする。また、LEDへの電力供給は電線31によって行われ、電線31は筐体1に設けられた電線用切り欠き32を通るものとする。なお、筐体1と筐体2は筐体取り付け用ネジ19、20、21、22と筐体取り付け用タップ穴23、24、25、26にて結合され、LEDの光は筐体2に設けられたLED光用窓27、28、29、30を通って外部に照射されるものとする。さらに、筐体全体を支持する部品を支持部品取り付け部33に取り付けるものとする。本発明は上記のよう構成するので、各個のLED、またはLEDユニットの熱が切り欠き10によって相互に影響しにくく、総発熱量を抑える事が出来る。さらにこれらの切り欠きの中を通気孔3、4から出入りする空気が通るので、対流によって放熱を促進し、さらに総発熱量を抑える事ができる。  As shown in the figure, the housing 1 and the housing 2 are produced by, for example, aluminum die casting, and the vent hole 3 and the vent hole 4 are provided, respectively. Then, the LED 6, the LED 7, the LED 8, and the LED 9 are mounted on the substrate 5 provided with the heat transfer preventing cutout 10 and attached to the housing 1. It is assumed that board mounting screws 11, 12, 13, and 14 and board mounting tap holes 15, 16, 17, and 18 provided in the housing 1 are used for the mounting. In addition, power supply to the LED is performed by an electric wire 31, and the electric wire 31 passes through an electric wire notch 32 provided in the housing 1. The housing 1 and the housing 2 are coupled by housing mounting screws 19, 20, 21, 22 and housing mounting tap holes 23, 24, 25, 26, and LED light is provided in the housing 2. The LED light windows 27, 28, 29, and 30 are irradiated outside. Furthermore, it is assumed that a component that supports the entire housing is attached to the support component attachment portion 33. Since the present invention is configured as described above, the heat of each LED or LED unit is hardly affected by the notch 10 and the total heat generation amount can be suppressed. Further, since air entering and exiting from the air holes 3 and 4 passes through these notches, heat dissipation can be promoted by convection, and the total heat generation can be suppressed.

上述した構成において、光源に基板一体型LEDユニットを使用する場合を図2に図示する。この場合は、筐体1を通気孔を兼ねた熱伝達防止用切り欠き55を設けた筐体54に代替し、LEDユニット34、35、36、37を筐体54の実装面に取り付ける。その際の結合はLEDユニット取り付け用ネジ38、39、40、41、42、43、44、45と、筐体54に設けられたLED取り付け用タップ穴46、47、48、49、50、51、52、53によって行う。FIG. 2 shows a case where the substrate-integrated LED unit is used as the light source in the configuration described above. In this case, the housing 1 is replaced with the housing 54 provided with the heat transfer-preventing cutout 55 that also serves as a vent hole, and the LED units 34, 35, 36, and 37 are attached to the mounting surface of the housing 54. In this case, the LED unit mounting screws 38, 39, 40, 41, 42, 43, 44, 45 and LED mounting tap holes 46, 47, 48, 49, 50, 51 provided in the housing 54 are used. , 52, 53.

上述した構成において、熱伝達防止用切り欠き10、及び55は図の形状でなくとも、複数のLED間にあり、その熱伝達を防止するものであれば他の形状でも代替する事が出来る。また、連続した切り欠き形状の他に複数の穴を開ける事でも代替が可能である。In the configuration described above, the heat transfer preventing cutouts 10 and 55 are not in the shape shown in the figure, but can be replaced with other shapes as long as they are located between the plurality of LEDs and prevent the heat transfer. Alternatively, a plurality of holes can be made in addition to the continuous cutout shape.

上述した構成において、通気孔3、通気孔4は、筐体外部と基板切り欠き部10(基板実装型LEDユニットの場合は筐体実装面切り欠き部55)に連通しているものであれば、その他の形状でも代替が可能である。また、連続した切り欠き形状でなくとも、複数の穴をあける事によって代替が可能である。In the above-described configuration, the vent hole 3 and the vent hole 4 are provided so long as they communicate with the outside of the housing and the substrate cutout portion 10 (in the case of a board-mounted LED unit, the housing mounting surface cutout portion 55). Other shapes are possible. Moreover, even if it is not a continuous notch shape, an alternative is possible by making a plurality of holes.

上述した構成において、通気孔3、通気孔4は、筐体外部と基板切り欠き部10に連通していれば、図以外の位置に設けたものでも代替が可能である。In the configuration described above, the vent hole 3 and the vent hole 4 can be substituted even if they are provided at positions other than those shown in the figure as long as they communicate with the outside of the housing and the substrate cutout portion 10.

上述した構成において、筐体1、筐体2、筐体54は、アルミダイキャスト以外にも、その他の金属、樹脂などを同様の形状に加工したものによって、代替が可能である。In the above-described configuration, the casing 1, the casing 2, and the casing 54 can be replaced by other metal, resin, or the like processed in the same shape other than aluminum die casting.

上述した構成において、筐体2は透明な樹脂を加工したもので代替が可能であり、この場合はLED光用窓27、28、29、30を設けなくともよい。In the configuration described above, the casing 2 can be replaced with a processed transparent resin. In this case, the LED light windows 27, 28, 29, and 30 may not be provided.

上述した構成において、部品の固定方法は、はめ合い、レバー、バネを使用したもの等、その他の固定方法でも代替が可能である。In the above-described configuration, the component fixing method can be replaced by other fixing methods such as fitting, lever, and spring.

上述した構成において、電線31は、直列、並列などのLEDの接続回路によって、複数本に変動する。In the configuration described above, the number of the electric wires 31 varies into a plurality depending on the LED connection circuit such as series or parallel.

上述した構成において、LEDの個数は4つに限らず、照度、電力などから適切な数を選択し、4以外の複数個にて代替が可能である。また、その配置も、図の通りでなくとも代替が可能である。In the configuration described above, the number of LEDs is not limited to four, and an appropriate number can be selected from illuminance, power, and the like, and a plurality other than four can be substituted. Further, the arrangement can be replaced even if it is not as illustrated.

上述した構成において、電線用切り欠き32は図の形状、位置でなくとも、電線が通る形状、断面積を確保したもので代替が可能である。また、筐体外部に連通する穴などでも代替が可能である。In the configuration described above, the notch 32 for the electric wire can be replaced by a shape that secures the shape and cross-sectional area through which the electric wire passes, even if it is not the shape and position of the drawing. Also, a hole that communicates with the outside of the housing can be substituted.

上述した構成において、接合、加工、組み立て、美観等の理由から、必要部品を追加しても筐体部通気孔と熱伝達防止切り欠きが連通したものであれば、代替が可能である。In the above-described configuration, for the reasons of joining, processing, assembly, aesthetics, and the like, even if necessary parts are added, as long as the casing portion vent hole and the heat transfer prevention cutout communicate with each other, an alternative is possible.

上述した構成において、筐体形状、筐体個数は、接合、加工、組み立て、美観等の理由から図以外の形状、個数でも筐体部通気孔と熱伝達防止切り欠きが連通したものであれば代替が可能である。In the configuration described above, the housing shape and the number of housings may be any shape and number other than those shown in the figure for reasons of joining, processing, assembly, aesthetics, etc. Alternatives are possible.

上述した構成において、LED光用窓27、28、29、30は外部に連通したものでなくとも、この部分に透明の樹脂部品、ガラス部品など取りつけたものでも代替が可能である。In the above-described configuration, the LED light windows 27, 28, 29, and 30 can be replaced with those that are not connected to the outside, but that are provided with transparent resin parts, glass parts, or the like.

上記の構成において、支持部品取り付け用部は図のようでなくとも、使用する支持部品に合わせたもので代替が可能である。In the above-described configuration, the support component mounting portion is not shown in the figure, but can be replaced with one that matches the support component used.

高さ軸に間隔をあけて配置した、本発明を適用した実装基盤、外郭筐体、LED、その他の部品の左下からの斜視図である。It is a perspective view from the lower left of the mounting base | substrate, outer case, LED, and other components to which this invention was arrange | positioned spaced apart from the height axis. 高さ軸に間隔をあけて配置した、本発明を適用した外郭筐体、基板一体型LEDユニット、その他の部品の左下からの斜視図である。It is a perspective view from the lower left of the outer housing | casing which applied this invention, the board | substrate integrated LED unit, and other components arrange | positioned at intervals in the height axis.

符号の説明Explanation of symbols

1 基板を取り付ける筐体
2 筐体
3 通気孔
4 通気孔
5 基板
6 LED
7 LED
8 LED
9 LED
10 熱伝達防止切り欠き
11 基板取り付け用ネジ
12 基板取り付け用ネジ
13 基板取り付け用ネジ
14 基板取り付け用ネジ
15 基板取り付け用タップ穴
16 基板取り付け用タップ穴
17 基板取り付け用タップ穴
18 基板取り付け用タップ穴
19 筐体取り付け用ネジ
20 筐体取り付け用ネジ
21 筐体取り付け用ネジ
22 筐体取り付け用ネジ
23 筐体取り付け用タップ穴
24 筐体取り付け用タップ穴
25 筐体取り付け用タップ穴
26 筐体取り付け用タップ穴
27 LED光用窓
28 LED光用窓
29 LED光用窓
30 LED光用窓
31 電線
32 電線用切り欠き
33 支持部品取り付け部
34 基板一体型LEDユニット
35 基板一体型LEDユニット
36 基板一体型LEDユニット
37 基板一体型LEDユニット
38 基板一体型LEDユニット取り付け用ネジ
39 基板一体型LEDユニット取り付け用ネジ
40 基板一体型LEDユニット取り付け用ネジ
41 基板一体型LEDユニット取り付け用ネジ
42 基板一体型LEDユニット取り付け用ネジ
43 基板一体型LEDユニット取り付け用ネジ
44 基板一体型LEDユニット取り付け用ネジ
45 基板一体型LEDユニット取り付け用ネジ
46 基板一体型LEDユニット取り付け用タップ穴
47 基板一体型LEDユニット取り付け用タップ穴
48 基板一体型LEDユニット取り付け用タップ穴
49 基板一体型LEDユニット取り付け用タップ穴
50 基板一体型LEDユニット取り付け用タップ穴
51 基板一体型LEDユニット取り付け用タップ穴
52 基板一体型LEDユニット取り付け用タップ穴
53 基板一体型LEDユニット取り付け用タップ穴
54 基板一体型LEDユニット使用時の筐体
55 熱伝達防止切り欠き
DESCRIPTION OF SYMBOLS 1 Case to which a board is mounted 2 Case 3 Vent hole 4 Vent hole 5 Substrate 6 LED
7 LED
8 LED
9 LED
10 heat transfer prevention notch 11 board mounting screw 12 board mounting screw 13 board mounting screw 14 board mounting screw 15 board mounting tap hole 16 board mounting tap hole 17 board mounting tap hole 18 board mounting tap hole 19 Housing Mounting Screw 20 Housing Mounting Screw 21 Housing Mounting Screw 22 Housing Mounting Screw 23 Housing Mounting Tap Hole 24 Housing Mounting Tap Hole 25 Housing Mounting Tap Hole 26 Housing Mounting Tap hole 27 LED light window 28 LED light window 29 LED light window 30 LED light window 31 Electric wire 32 Electric wire notch 33 Support component mounting portion 34 Integrated board LED unit 35 Integrated board LED unit 36 Integrated board type LED unit 37 Substrate integrated LED unit 38 Substrate integrated L D unit mounting screw 39 Board integrated LED unit mounting screw 40 Board integrated LED unit mounting screw 41 Board integrated LED unit mounting screw 42 Board integrated LED unit mounting screw 43 Board integrated LED unit mounting screw 44 Board-integrated LED unit mounting screw 45 Board-integrated LED unit mounting screw 46 Board-integrated LED unit mounting tap hole 47 Board-integrated LED unit mounting tap hole 48 Board-integrated LED unit mounting tap hole 49 Board Integrated LED unit mounting tap hole 50 Substrate integrated LED unit mounting tap hole 51 Substrate integrated LED unit mounting tap hole 52 Substrate integrated LED unit mounting tap hole 53 Substrate integrated L ED unit mounting tap hole 54 Housing 55 when using board-integrated LED unit Notch to prevent heat transfer

Claims (3)

複数のLEDの配置の間に相互間の熱伝達を防止、または低下させる切り欠き、及び穴を設けた事を特徴とするLEDを実装する基板、及び基盤一体型LEDユニットを実装する筐体。      A substrate on which an LED is mounted, and a housing on which a board-integrated LED unit is mounted, wherein a notch and a hole for preventing or reducing heat transfer between the plurality of LEDs are provided. 請求項1の切り欠き、及び穴に連通する通気孔を設けたLED照明用筐体。      An LED lighting housing provided with the cutout and the vent hole communicating with the hole according to claim 1. 請求項1と請求項2の組み合わせによるLED照明用装置。      A device for LED lighting according to the combination of claim 1 and claim 2.
JP2004382698A 2004-12-20 2004-12-20 Illumination led mounting board with excellent heat radiation property and case Pending JP2006179443A (en)

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JP2011097047A (en) * 2009-10-29 2011-05-12 Foxsemicon Integrated Technology Inc Illumination device
US8283842B2 (en) 2008-06-10 2012-10-09 Swan-Lite Manufacturing Co., Ltd. LED lighting apparatus

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US9410685B2 (en) 2008-05-30 2016-08-09 Toshiba Lighting & Technology Corporation Light emitting module having heat conductive substrate
US8283842B2 (en) 2008-06-10 2012-10-09 Swan-Lite Manufacturing Co., Ltd. LED lighting apparatus
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