JP2006175654A - Manufacturing method of liquid jet head, and liquid jet head - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To prevent an adhesive agent from existing in corners between wall portions and a diaphragm by securing a clearance in the corner of the diaphragm. <P>SOLUTION: The manufacturing method comprises the process of sticking a nozzle plate 20 after a TiW thin film 62 is formed at least on the inside surfaces of pressure generation chambers 12 of an elastic film 50, and the process of removing the TiW thin film 62 by passing hydrogen peroxide water to etch off the TiW thin film 62, prevents the adhesive agent from existing in the corners where the wall portions 11 and the elastic film 50 butt against each other, and prevents the displacement of the elastic film 50 from decreasing or varying. <P>COPYRIGHT: (C)2006,JPO&NCIPI

Description

  The present invention relates to a method of manufacturing a liquid ejecting head for ejecting liquid droplets and a liquid ejecting head, and in particular, by pressurizing ink supplied to a pressure generating chamber communicating with a nozzle opening for ejecting ink droplets by a pressure generating element. It is suitable as an ink jet recording head manufacturing method for ejecting ink droplets from nozzle openings and an ink jet recording head.

  A part of the pressure generating chamber that communicates with the nozzle opening that ejects ink droplets is composed of a diaphragm, and this diaphragm is deformed by a piezoelectric element that is a kind of pressure generating element to pressurize the ink in the pressure generating chamber and nozzle There are two types of inkjet recording heads that eject ink droplets from openings: one that uses a piezoelectric actuator in longitudinal vibration mode that expands and contracts in the axial direction of the piezoelectric element, and one that uses a piezoelectric actuator in flexural vibration mode. It has become. As an example of using an actuator in a flexural vibration mode, for example, a uniform piezoelectric material layer is formed over the entire surface of the diaphragm by a film forming technique, and this piezoelectric material layer is formed into a pressure generating chamber by a lithography method. A device in which a piezoelectric element is formed so as to be cut into a corresponding shape and independent for each pressure generating chamber is known. In such an ink jet recording head, generally, a nozzle plate having a plurality of nozzle openings for ejecting ink droplets is bonded to a flow path forming substrate in which a pressure generating chamber is formed by an adhesive. It has a structure. For this reason, when the pressure generating chambers (piezoelectric elements) are arranged at a high density as described above, the bonding area between the nozzle plate and the flow path forming substrate is reduced, and the adhesive is applied to the diaphragm of the pressure generating chamber by capillary action. There was a risk that it would flow out. If the adhesive adheres to the diaphragm, it is conceivable that free displacement of the diaphragm is hindered and the amount of displacement is reduced. Moreover, since the flow amount of the adhesive varies depending on the nozzle, the displacement amount varies.

  In order to solve such a problem, after adhering the nozzle plate, the liquid adjusted to be alkaline is passed through to reduce the adhesive force between the surplus adhesive, the vibration plate and the flow path forming substrate, and the surplus adhesive. A method of peeling and removing (the protruding adhesive) is considered (for example, see Patent Document 1).

  However, in such a method of passing a liquid adjusted to alkalinity, there is a possibility that the adhesive force of the adhesive portion of the nozzle plate is also reduced, and the nozzle plate is easily peeled off.

JP 2004-114556 A

  In view of such circumstances, the present invention provides a method of manufacturing a liquid ejecting head and a liquid ejecting head that can prevent the adhesive from protruding without reducing the adhesive force of the adhesive portion of the nozzle forming member. Let it be an issue.

A first aspect of the present invention that solves the above problems is a flow path forming member formed in a state in which a wall portion and a diaphragm for constituting a pressure generating chamber communicating with a nozzle opening for discharging a droplet are connected. And a nozzle forming member having a nozzle opening perforated with an adhesive, wherein the nozzle is formed after forming a removal thin film on at least the pressure generating chamber inner surface of the diaphragm A method of manufacturing a liquid jet head comprising: a step of bonding a member and a flow path forming member; and a step of removing a removal thin film after bonding the nozzle forming member and the flow path forming member.
In the first aspect, the removal thin film prevents the adhesive from protruding to the diaphragm, and the liquid ejecting head can prevent the adhesive from protruding without reducing the adhesive force of the adhesive portion of the nozzle forming member. It is possible to prevent a decrease or variation in the amount of displacement of the diaphragm.

A second aspect of the present invention that solves the above problem is a flow path forming member formed in a state in which a wall portion and a diaphragm for constituting a pressure generating chamber communicating with a nozzle opening for discharging droplets are connected. And a nozzle forming member having a nozzle opening perforated with an adhesive, and a method of forming a removal thin film on the surface of the diaphragm and the wall on the pressure generating chamber side And a step of forming a resist on the surface side of the removed thin film, and exposing and removing the resist other than the resist on the surface inside the pressure generating chamber of the diaphragm to expose the removed thin film other than the surface inside the pressure generating chamber of the diaphragm. And a step of removing the exposed removal thin film, and then a step of bonding the nozzle forming member and the flow path forming member in a state where the removal film exists on the surface of the diaphragm on the pressure generation chamber side. Of a liquid jet head characterized by Located in.
In the second aspect, the liquid ejecting head that prevents the adhesive from protruding to the vibration plate by the removal thin film and prevents the adhesive from protruding without reducing the adhesive force of the adhesive portion of the nozzle forming member; It is possible to prevent a decrease or variation in the amount of displacement of the diaphragm.

According to a third aspect of the present invention, in the first or second aspect, the nozzle forming member is made of SUS material, the removal thin film is TiW, and the removal liquid used for removing the removal film is hydrogen peroxide. In another aspect of the invention, there is provided a method of manufacturing a liquid jet head.
In the third aspect, since the TiW thin film prevents the adhesive from protruding to the vibration plate, and the TiW thin film is easily removed by the hydrogen peroxide solution, the adhesive is formed at the boundary between the vibration plate and the pressure generating chamber. Therefore, it is possible to prevent a decrease or variation in the amount of displacement of the diaphragm.

According to a fourth aspect of the present invention, in the first or second aspect, the nozzle forming member is made of a Si single crystal material, the removal thin film is Al, and the removal liquid used for removing the removal film is a second chloride. The present invention resides in a method for manufacturing a liquid jet head, which is an aqueous iron solution.
In the fourth aspect, the Al thin film prevents the adhesive from protruding to the diaphragm, and the Al thin film is easily removed by the ferric chloride aqueous solution, so that it adheres to the boundary between the diaphragm and the pressure generating chamber. Since the agent does not remain, it is possible to prevent a decrease or variation in the displacement amount of the diaphragm.

A fifth aspect of the present invention that solves the above problem is a flow path forming substrate formed in a state in which a wall portion and a diaphragm for constituting a pressure generating chamber communicating with a nozzle opening for discharging droplets are connected. And a nozzle forming member having a nozzle opening formed therein, a liquid ejecting head formed by adhering with an adhesive, which is manufactured by the manufacturing method according to any one of the first to fifth aspects, and is an adhesive on a wall portion The liquid ejecting head is characterized in that there is a gap between the diaphragm and the diaphragm.
In the fifth aspect, it is possible to provide a liquid ejecting head that is free from a decrease or variation in the amount of displacement of the diaphragm.

The present invention will be described below in detail with reference to the drawings.
FIG. 1 is an exploded perspective view showing an outline of an ink jet recording head according to an embodiment of the present invention, and FIG. 2 shows a plan view of FIG. 1 and an AA ′ cross section.

  As shown in the drawing, the flow path forming substrate 10 is made of a silicon single crystal substrate having a plane orientation (110) in this embodiment, and one surface thereof is made of silicon dioxide previously formed by thermal oxidation. An elastic film 50 of 5 to 2 μm is formed. In the flow path forming substrate 10, a plurality of pressure generating chambers 12 partitioned by a wall portion 11 are arranged in the width direction. Further, a communication portion 13 is formed in a region outside the longitudinal direction of the pressure generation chamber 12 of the flow path forming substrate 10, and the communication portion 13 and each pressure generation chamber 12 are provided for each pressure generation chamber 12. Communication is made via a path 14. The communication unit 13 constitutes a part of the reservoir 100 that communicates with a reservoir unit 32 of the bonding substrate 30 to be described later and serves as a common ink chamber for the pressure generation chambers 12. The ink supply path 14 is formed with a narrower width than the pressure generation chamber 12, and maintains a constant flow path resistance of ink flowing into the pressure generation chamber 12 from the communication portion 13.

  Such a pressure generation chamber 12 and the like are formed by anisotropically etching the flow path forming substrate 10 from the surface opposite to the elastic film 50. Anisotropic etching is performed using the difference in etching rate of the silicon single crystal substrate. For example, in this embodiment, since the flow path forming substrate 10 is made of a silicon single crystal substrate having a plane orientation (110), the etching rate of the (111) plane is compared with the etching rate of the (110) plane of the silicon single crystal substrate. Is performed using the property that is 1/180. That is, when a silicon single crystal substrate is immersed in an alkaline solution such as KOH, the first (111) plane perpendicular to the (110) plane is gradually eroded, and the first (111) plane is about 70 degrees. A second (111) plane appears that forms an angle and forms an angle of about 35 degrees with the (110) plane. By this anisotropic etching, precision processing can be performed based on the parallelogram depth processing formed by two first (111) surfaces and two oblique second (111) surfaces. The pressure generating chambers 12 can be arranged with high density.

  In the present embodiment, the long side of each pressure generating chamber 12 is formed by the first (111) plane and the short side is formed by the second (111) plane. The pressure generation chamber 12 is formed by etching until it substantially passes through the flow path forming substrate 10 and reaches the elastic film 50. Note that the elastic film 50 is extremely small in the amount of being attacked by the alkaline solution for etching the silicon single crystal substrate.

  As the thickness of the flow path forming substrate 10 on which such a pressure generation chamber 12 and the like are formed, it is preferable to select an optimum thickness in accordance with the density at which the pressure generation chamber 12 is disposed. For example, when the pressure generating chambers 12 are arranged at about 180 (180 dpi) per inch, the thickness of the flow path forming substrate 10 is preferably about 180 to 280 μm, more preferably about 220 μm. is there. For example, when the pressure generating chambers 12 are arranged at a relatively high density of about 360 dpi, the thickness of the flow path forming substrate 10 is preferably 100 μm or less. This is because the arrangement density can be increased while maintaining the rigidity of the wall portion 11 between the adjacent pressure generation chambers 12.

In addition, the nozzle forming member is a kind of nozzle forming member in which a nozzle opening 21 communicating with the vicinity of the end of each pressure generating chamber 12 on the side opposite to the ink supply path 14 is formed on the opening surface side of the flow path forming substrate 10. The nozzle plate 20 is fixed with an adhesive. The nozzle plate 20 has a thickness of, for example, 0.1 to 1 mm, a linear expansion coefficient of 300 ° C. or less, for example, 2.5 to 4.5 [× 10 ⁻⁶ / ° C.], glass ceramics, silicon It consists of a single crystal substrate or non-rust steel. Here, the size of the pressure generation chamber 12 that applies ink droplet discharge pressure to the ink and the size of the nozzle opening 21 that discharges the ink droplet are optimized according to the amount of ink droplet to be discharged, the discharge speed, and the discharge frequency. The For example, when recording 360 ink droplets per inch, the nozzle opening 21 needs to be accurately formed with a diameter of several tens of μm.

  On the other hand, as described above, the elastic film 50 having a thickness of, for example, about 1.0 μm is formed on the side opposite to the opening surface of the flow path forming substrate 10. For example, an insulator film 55 having a thickness of about 0.4 μm is formed. Further, on the insulator film 55, a lower electrode film 60 (for example, Ti / Ir / Pt) having a thickness of, for example, about 0.2 μm and a piezoelectric layer 70 having a thickness of, for example, about 1.0 μm. The upper electrode film 80 having a thickness of, for example, about 0.05 μm is laminated by a predetermined process to constitute the piezoelectric element 300. For example, the lower electrode film 60 is formed by sputtering, and a large number of piezoelectric layers 70 are formed. After the first piezoelectric layer 70 is formed, the electrode is patterned by ion milling, and then the resist is removed.

  Here, the piezoelectric element 300 refers to a portion including the lower electrode film 60, the piezoelectric layer 70, and the upper electrode film 80. In general, one electrode of the piezoelectric element 300 is used as a common electrode, and the other electrode and the piezoelectric layer 70 are patterned for each pressure generating chamber 12. In addition, here, a portion that is configured by any one of the patterned electrodes and the piezoelectric layer 70 and in which piezoelectric distortion is generated by applying a voltage to both electrodes is referred to as a piezoelectric active portion. In this embodiment, the lower electrode film 60 is a common electrode of the piezoelectric element 300, and the upper electrode film 80 is an individual electrode of the piezoelectric element 300. However, there is no problem even if this is reversed for the convenience of the drive circuit and wiring. In either case, a piezoelectric active part is formed for each pressure generating chamber. Further, here, the piezoelectric element 300 and the vibration plate that is displaced by driving the piezoelectric element 300 are collectively referred to as a piezoelectric actuator.

  Here, the lower electrode film 60 constituting the piezoelectric element 300 is patterned in the vicinity of both end portions of the pressure generating chamber 12 and continuously provided along the direction in which the pressure generating chambers 12 are arranged side by side. In the present embodiment, the end surface of the lower electrode film 60 in the region facing each pressure generation chamber 12 is an inclined surface that is inclined with respect to the insulator film 55 at a predetermined angle.

  The piezoelectric layer 70 is provided independently for each pressure generating chamber 12 and is made of a ferroelectric material such as lead zirconate titanate (PZT), for example.

  The upper electrode film 80 is provided independently for each pressure generation chamber 12 as in the piezoelectric layer 70. Each upper electrode film 80 is connected to a lead electrode 90 extending to the insulator film 55 made of, for example, gold (Au) or the like.

  In addition, on the flow path forming substrate 10 on which such a piezoelectric element 300 is formed, a piezoelectric element holding portion 31 that secures a space that does not hinder the movement of the piezoelectric element 300 in a region facing the piezoelectric element 300 is provided. The joining board | substrate 30 which has is joined. In addition, the bonding substrate 30 is provided with a reservoir portion 32 that constitutes at least a part of the reservoir 100 serving as an ink chamber common to the pressure generating chambers 12. Further, a compliance substrate 40 including a sealing film 41 formed of a material having low rigidity and flexibility and a fixing plate 42 formed of a hard material such as metal is bonded onto the bonding substrate 30. Yes. A region of the fixing plate 42 facing the reservoir 100 is an opening 43 that is completely removed in the thickness direction, and one surface of the reservoir 100 is sealed only by the sealing film 41.

  Such an ink jet recording head of this embodiment takes in ink from an external ink supply means (not shown), fills the interior from the reservoir 100 to the nozzle opening 21, and then follows a recording signal from a drive circuit (not shown). A voltage is applied between the lower electrode film 60 and the upper electrode film 80 corresponding to the pressure generation chamber 12 via the external wiring, and the elastic film 50, the insulator film 55, the lower electrode film 60, and the piezoelectric layer. By bending and deforming 70, the pressure in each pressure generating chamber 12 is increased, and ink droplets are ejected from the nozzle openings 21.

In this embodiment, a lead zirconate titanate-based material is used as the material of the piezoelectric layer 70 described above. However, as a material used for the ink jet recording head, zircon titanate can be used as long as good displacement characteristics can be obtained. It is not limited to lead acid materials. For example, a relaxor ferroelectric obtained by adding a metal such as niobium, nickel, magnesium, bismuth, or ytterbium to a ferroelectric piezoelectric material such as lead zirconate titanate (PZT) may be used. The composition may be appropriately selected in consideration of the characteristics, application, etc. of the piezoelectric element 300. For example, PbTiO ₃ (PT), PbZrO ₃ (PZ), Pb (Zr _x Ti _1-x ) O ₃ (PZT) ), Pb (Mg _1/3 Nb _2/3 ) O ₃ -PbTiO ₃ (PMN-PT), Pb (Zn _1/3 Nb _2/3 ) O ₃ -PbTiO ₃ (PZN-PT), Pb (Ni ₁ ) _{/ 3 Nb 2/3) O 3 -PbTiO} 3 (PNN-PT), Pb (In 1/2 Nb 1/2) O 3 -PbTiO 3 (PIN-PT), Pb (Sc 1/3 Ta 1/2 _{) O 3 -PbTiO 3 (PST-} PT), Pb (Sc 1/3 Nb 1/2) O 3 -PbTiO 3 (PSN-PT), BiScO 3 -PbTiO 3 (BS-PT), BiYbO 3 -PbTiO 3 (BY PT), and the like.

  In the above-described ink jet recording head (liquid ejecting head), the nozzle plate 20 having the nozzle openings 21 is fixed to the opening surface side of the flow path forming substrate 10 having the elastic film 50 via an adhesive. It is manufactured.

A method for manufacturing the liquid jet head will be described with reference to FIGS.
FIG. 3 is a cross-sectional view showing a state in which the adhesive protrudes from the diaphragm, and FIGS. 4 to 6 illustrate a process of the method for manufacturing the liquid jet head according to the embodiment of the present invention.

  As shown in FIG. 3, an elastic film 50 as a vibration plate that vibrates by the piezoelectric element 300 is formed on the flow path forming substrate 10, and a nozzle opening is formed on the opening surface side of the flow path forming substrate 10 having the elastic film 50. The nozzle plate 20 having the holes 21 formed therein is manufactured by being fixed via an epoxy adhesive 61.

  Since the bonding area between the nozzle plate 20 and the flow path forming substrate 10 is small, the adhesive 61 flows along the corners of the pressure generation chamber 12 by capillary action and flows out onto the elastic film 50 of the pressure generation chamber 12 to form the wall portion 11. There is a possibility that the adhering portion 61a where the adhesive stagnates is formed at the corner where the elastic film 50 contacts. If the adhesion part 61a is formed in the elastic film 50, the free displacement of the elastic film 50 is prevented, and it is considered that the amount of displacement is reduced. Moreover, since the flow-out amount of the adhesive 61 varies depending on the nozzles, the displacement amount varies.

  For this reason, the liquid jet head is manufactured so that the adhering portion 61 a is not formed on the elastic film 50. That is, a TiW thin film is formed on the inner surface of the pressure generating chamber 12 of the elastic film 50 and the wall 11 by sputtering, a resist is applied to the surface side of the TiW thin film, and parallel light beams are incident obliquely from the wall 11 side. The resist other than the resist on the inner surface of the pressure generation chamber 12 of the elastic film 50 is exposed and removed to expose the TiW thin film other than the inner surface of the pressure generation chamber 12 of the elastic film 50, and the excess TiW thin film for removing the exposed TiW thin film is exposed. The exposed TiW thin film is removed by passing hydrogen oxide water, and then the resist on the inner surface of the pressure generating chamber 12 of the elastic film 50 is removed by ashing, and TiW is removed from the inner surface of the elastic film 50 on the inner surface of the pressure generating chamber 12. The nozzle plate 20 is adhered in the presence of the thin film, and the TiW thin film inside the pressure generating chamber 12 of the elastic film 50 is removed by passing hydrogen peroxide water for removing the TiW thin film, thereby the elastic film. The absence of adhesive 61 to the corner between wall portion 11 and the elastic membrane 50 to secure the gap at the corners of 0 is the (attachment portion 61a is not formed) as.

  A method for manufacturing the liquid jet head will be specifically described with reference to FIGS. The TiW thin film 62 is formed once at the boundary between the pressure generating chamber 12 and the elastic film 50, and is removed by etching or the like after the nozzle plate 20 and the flow path forming substrate 10 are bonded with an adhesive. In order to prevent the adhesive that has flowed onto the elastic film 50 of the pressure generating chamber 12 from being transmitted through the corners of the pressure generating chamber 12 by capillary action, does not remain at the boundary between the pressure generating chamber 12 and the elastic film 50. It becomes a thin film.

  As shown in FIG. 4A, the wall portion 11 is formed by anisotropic etching of Si on the flow path forming substrate 10 to form the pressure generating chamber 12 including the elastic film 50. Next, as shown in FIG. 4B, a TiW thin film 62 is deposited on the inner surface of the pressure generation chamber 12 of the elastic film 50 and the wall 11 by sputtering. Thereafter, as shown in FIG. 4C, a resist 63 is applied to the surface side of the TiW thin film 62 in order to etch the TiW thin film 62.

  After the resist 63 is applied, as shown in FIG. 5A, a parallel light beam 64 is obliquely incident from the side of the wall 11 to expose the portions other than the bottom of the resist 63. As shown in FIG. 5B, the resist 63 in the unexposed portion is removed with a developing solution to leave the resist 63a on the inner surface of the pressure generating chamber 12. Next, as shown in FIG. 5 (c), only the TiW thin film 62 on the wall 11 exposed by passing hydrogen peroxide water is removed by etching, and at the inside of the pressure generating chamber 12 on the elastic film 50. The TiW thin film 62a on the surface is left together with the resist 63a.

  Next, as shown in FIG. 6A, the resist 63a on the inner surface of the pressure generating chamber 12 on the elastic film 50 is removed by ashing, and the pressure on the elastic film 50 is shown in FIG. 6B. The nozzle plate 20 is bonded by the adhesive 61 in a state where the TiW thin film 62a exists on the inner surface of the generation chamber 12. At this time, since the adhesion area between the nozzle plate 20 and the flow path forming substrate 10 is small, the adhesive 61 travels along the corners of the pressure generation chamber 12 by capillary action, and the adhesive 61 is on the TiW thin film 62a of the elastic film 50 of the pressure generation chamber 12. May flow out to form the adhering portion 61a. As shown in FIG. 6 (c), hydrogen peroxide water is passed through to remove the TiW thin film 62a inside the pressure generating chamber 12 of the elastic film 50 by etching to remove a gap 65 between the elastic film 50 and the adhering portion 61a. Secure. As a result, a gap 65 is secured at the corner of the elastic film 50, and the adhering portion 61 a of the adhesive 61 does not exist at the corner of the wall 11 and the elastic film 50. That is, a gap for sufficiently displacing the elastic film 50 is formed between the adhesive 61 remaining on the wall 11 and the elastic film 50.

  As a result, the adhesive 61 does not adhere to the elastic film 50, and a liquid ejecting head that can prevent the adhesive 61 from protruding without reducing the adhesive force of the adhesive portion of the nozzle plate 20 can be obtained. In addition, it is possible to prevent a decrease or variation in the amount of displacement of the elastic film 50.

  Based on FIG. 7, another embodiment of a method for manufacturing a liquid jet head will be described. FIG. 7 shows a process description of a method of manufacturing a liquid jet head according to another embodiment of the present invention. 7 (a) and 7 (b) correspond to the steps of FIGS. 6 (b) and 6 (c) described above, the steps corresponding to FIG. 6 (a) are the same, and the same reference numerals are used for the same members. Detailed description is omitted.

  As shown in FIG. 7A, the resist is removed so that the TiW thin film 62a is left on the inner surface of the pressure generating chamber 12 of the elastic film 50, and the TiW thin film 62c is left below the wall portion 11. Etching with water is performed, and the nozzle plate 20 is bonded with the adhesive 61 in a state where the TiW thin films 62 a and 62 c are exposed. The adhesive 61 may flow out on the TiW thin films 62a and 62c of the elastic film 50 in the pressure generating chamber 12 to form the adhering portion 61a. As shown in FIG. 7B, the elastic film 50 and the wall are formed by passing hydrogen peroxide water and etching away the TiW thin films 62a and 62c inside the pressure generating chamber 12 of the elastic film 50 together with the adhering portion 61a. The adhering portion 61 a of the adhesive 61 does not exist at the corner portion of the portion 11. The removed adhesive or the like is discharged from the nozzle opening 21 of the nozzle plate 20.

  Thereby, the adhesive 61 on the elastic film 50 side in the pressure generating chamber 12 is completely removed, and the liquid jet capable of preventing the adhesive 61 from protruding without reducing the adhesive force of the adhesive portion of the nozzle plate 20. A head can be formed, and a decrease or variation in the amount of displacement of the elastic film 50 can be prevented. This embodiment is effective because the adhesive 61 on the elastic film 50 side can be completely removed when the adhesive removed from the nozzle openings 21 of the nozzle plate 20 can be discharged.

  In the embodiment described above, an example in which a SUS product is applied as the nozzle plate 20, the TiW thin film 62 is applied as the removal thin film, and hydrogen peroxide water is applied as the removal liquid has been described. It is also possible to apply a Si plate as the nozzle plate 20, apply an Al thin film as the removal thin film, and apply a ferric chloride aqueous solution as the removal liquid.

  The present invention relates to a method of manufacturing a liquid ejecting head that ejects liquid droplets, and more particularly to pressurizing ink supplied to a pressure generating chamber communicating with a nozzle opening that ejects ink droplets with a pressure generating element, thereby The present invention can be used in the field of manufacturing methods of ink jet recording heads that eject droplets.

FIG. 3 is an exploded perspective view of a liquid ejecting head according to an embodiment of the invention. 2A and 2B are a plan view and a cross-sectional view of a liquid jet head according to an embodiment of the invention. It is sectional drawing of the state where the adhesive protruded into the diaphragm. It is process explanatory drawing of the manufacturing method of the liquid jet head which concerns on the example of 1 embodiment of this invention. It is process explanatory drawing of the manufacturing method of the liquid jet head which concerns on the example of 1 embodiment of this invention. It is process explanatory drawing of the manufacturing method of the liquid jet head which concerns on the example of 1 embodiment of this invention. It is process explanatory drawing of the manufacturing method of the liquid jet head which concerns on the other embodiment of this invention.

Explanation of symbols

  10 flow path forming substrate, 12 pressure generating chamber, 20 nozzle plate, 21 nozzle opening, 30 bonding substrate, 40 compliance substrate, 50 elastic film, 60 lower electrode film, 61 adhesive, 62 TiW thin film, 65 gap, 70 piezoelectric body Layer, 71 ferroelectric film, 80 upper electrode film, 90 lead electrode, 300 piezoelectric element

Claims (5)

A flow path forming member formed in a state where a wall and a diaphragm for constituting a pressure generating chamber communicating with a nozzle opening for discharging droplets are connected, and a nozzle forming member provided with a nozzle opening. A method of manufacturing a liquid jet head formed by bonding with an adhesive,
Adhering the nozzle forming member and the flow path forming member after forming the removal thin film on at least the pressure generating chamber side surface of the diaphragm;
And a step of removing the removal thin film after adhering the nozzle forming member and the flow path forming member. A flow path forming member formed in a state where a wall and a diaphragm for constituting a pressure generating chamber communicating with a nozzle opening for discharging droplets are connected, and a nozzle forming member provided with a nozzle opening. A method of manufacturing a liquid jet head formed by bonding with an adhesive,
Forming a removal thin film on the surface of the diaphragm and the wall on the pressure generating chamber side;
Forming a resist on the surface side of the removed thin film;
A step of exposing and removing a resist other than the resist on the surface on the pressure generating chamber side of the diaphragm to expose a removed thin film other than the surface on the pressure generating chamber side of the diaphragm;
Removing the exposed removal thin film;
And a step of adhering the nozzle forming member and the flow path forming member in a state in which the removal film is present on the pressure generating chamber side surface of the diaphragm. In claim 1 or 2,
The nozzle forming member is made of SUS material, the removal thin film is TiW, and the removal liquid used for removing the removal film is hydrogen peroxide water. In claim 1 or 2,
A method of manufacturing a liquid jet head, wherein the nozzle forming member is made of a Si single crystal material, the removal thin film is Al, and the removal liquid used for removing the removal film is a ferric chloride aqueous solution. A flow path forming substrate formed in a state in which a wall and a diaphragm for constituting a pressure generating chamber communicating with a nozzle opening for discharging droplets are connected, and a nozzle forming member having a nozzle opening formed therein A liquid ejecting head bonded with an adhesive,
A liquid jet head manufactured by the manufacturing method according to claim 1, wherein there is a gap between the adhesive on the wall and the diaphragm.

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