JP2006175032A5 - - Google Patents

Download PDF

Info

Publication number
JP2006175032A5
JP2006175032A5 JP2004371555A JP2004371555A JP2006175032A5 JP 2006175032 A5 JP2006175032 A5 JP 2006175032A5 JP 2004371555 A JP2004371555 A JP 2004371555A JP 2004371555 A JP2004371555 A JP 2004371555A JP 2006175032 A5 JP2006175032 A5 JP 2006175032A5
Authority
JP
Japan
Prior art keywords
pachinko machine
control board
display control
reused
soldered
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2004371555A
Other languages
English (en)
Japanese (ja)
Other versions
JP2006175032A (ja
Filing date
Publication date
Application filed filed Critical
Priority to JP2004371555A priority Critical patent/JP2006175032A/ja
Priority claimed from JP2004371555A external-priority patent/JP2006175032A/ja
Publication of JP2006175032A publication Critical patent/JP2006175032A/ja
Publication of JP2006175032A5 publication Critical patent/JP2006175032A5/ja
Pending legal-status Critical Current

Links

JP2004371555A 2004-12-22 2004-12-22 パチンコ機 Pending JP2006175032A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2004371555A JP2006175032A (ja) 2004-12-22 2004-12-22 パチンコ機

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2004371555A JP2006175032A (ja) 2004-12-22 2004-12-22 パチンコ機

Publications (2)

Publication Number Publication Date
JP2006175032A JP2006175032A (ja) 2006-07-06
JP2006175032A5 true JP2006175032A5 (enrdf_load_stackoverflow) 2009-11-05

Family

ID=36729671

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2004371555A Pending JP2006175032A (ja) 2004-12-22 2004-12-22 パチンコ機

Country Status (1)

Country Link
JP (1) JP2006175032A (enrdf_load_stackoverflow)

Families Citing this family (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5123411B2 (ja) * 2011-04-25 2013-01-23 富士通デバイス株式会社 遊技機用電子素子の管理システム、遊技機用電子素子、遊技機、情報処理装置、並びに遊技機用電子素子の管理方法及びリサイクル方法
JP5909253B2 (ja) * 2014-04-18 2016-04-26 株式会社藤商事 遊技機
JP2018102990A (ja) * 2018-04-02 2018-07-05 株式会社藤商事 遊技機
JP2025021342A (ja) * 2023-07-31 2025-02-13 株式会社大一商会 遊技機
JP2025021350A (ja) * 2023-07-31 2025-02-13 株式会社大一商会 遊技機
JP2025021348A (ja) * 2023-07-31 2025-02-13 株式会社大一商会 遊技機
JP2025021349A (ja) * 2023-07-31 2025-02-13 株式会社大一商会 遊技機
JP2025021347A (ja) * 2023-07-31 2025-02-13 株式会社大一商会 遊技機
JP2025021351A (ja) * 2023-07-31 2025-02-13 株式会社大一商会 遊技機
JP2025021344A (ja) * 2023-07-31 2025-02-13 株式会社大一商会 遊技機
JP7725085B2 (ja) * 2023-07-31 2025-08-19 株式会社大一商会 遊技機
JP7725086B2 (ja) * 2023-07-31 2025-08-19 株式会社大一商会 遊技機
JP2025021346A (ja) * 2023-07-31 2025-02-13 株式会社大一商会 遊技機

Similar Documents

Publication Publication Date Title
JP2006175032A5 (enrdf_load_stackoverflow)
JP2019180621A5 (enrdf_load_stackoverflow)
CN202524655U (zh) 一种回流焊治具
WO2008140019A1 (ja) はんだボールの搭載方法及び搭載装置
JP2015153935A5 (enrdf_load_stackoverflow)
TW200702951A (en) Photomask, manufacturing method thereof, and manufacturing method of electronic device
JP4421171B2 (ja) 遊技制御基板
JP2006295019A5 (enrdf_load_stackoverflow)
NO20072929L (no) Fremgangsmate og sproytetarn for kontakering av gasser og vaeskedraper for stoff- og/eller varmeveksling
JP2006175032A (ja) パチンコ機
EP1744605A3 (en) Electronic board and manufacturing method thereof, electro-optical device, and electronic apparatus
JP2007261070A5 (enrdf_load_stackoverflow)
JP2005129758A (ja) 遊技機用制御基板
JP2005175186A5 (enrdf_load_stackoverflow)
JP2008010615A5 (enrdf_load_stackoverflow)
JP2019022719A5 (enrdf_load_stackoverflow)
CN100479634C (zh) 一种改善电路板焊接质量的方法及用于该方法中的风刀装置
CN204291629U (zh) 一种单元板返工喷锡治具
WO2005115571A8 (en) Games and methods of playing games with collectable game components
JP2010279873A (ja) 貴金属カード印刷用治具
CN205566850U (zh) 一种用于bga返修的加热优化机构
JP5201277B2 (ja) 実装基板の製造方法及び基板支持治具の製造方法
JP2019122827A5 (enrdf_load_stackoverflow)
JP2019115800A5 (enrdf_load_stackoverflow)
WO2008156170A1 (ja) 半田接合装置