JP2006167824A - Polishing device and polishing method - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a polishing device, achieving short processing time and small processing space, and dispensing with a solution hard to handle. <P>SOLUTION: This polishing device 1 includes: an electrolytic grinding vessel 2 storing an electrolyte 6; a first electrode 3; and a second electrode 4, wherein voltage is applied between the first electrode 3 and the second electrode 4, an electric current is applied between a part 101 to be polished of a material to be polished 100 where the first electrode 3 comes into contact and the second electrode 4 through the electrolyte 6, thereby polishing the part 101 to be polished. In this polishing device 1, the part 11 of the first electrode 3, which comes into contact with the part 101 to be polished is disposed in the electrolyte at least during the application of voltage. <P>COPYRIGHT: (C)2006,JPO&NCIPI

Description

  The present invention relates to a polishing apparatus and a polishing method, and more particularly, to an electrolytic polishing apparatus and an electrolytic polishing method.

A chemical polishing method is known as one method for polishing a metal surface. In the chemical polishing method, the portion to be polished is immersed in a chemical polishing solution such as hydrogen peroxide, and the surface of the portion to be polished is dissolved (Patent Document 1).
JP-A-1-272785

However, in the chemical polishing method, since the surface of the object to be polished is chemically dissolved, it takes time for the polishing process. In addition, the chemical polishing liquid must be completely washed away after the polishing process, and the cleaning process also takes time.
In addition, non-pharmaceutical deleterious substances such as hydrogen peroxide are often used as the chemical polishing liquid, which is dangerous to handle and the treatment of the waste liquid is troublesome.

  An object of the present invention is to provide a polishing apparatus and a polishing method in which the polishing time is short, the handling is dangerous, and there is no need to use an external medicinal product for waste liquid, which is troublesome to process. And

  In order to solve the above problems, a polishing apparatus according to the present invention described in claim 1 includes an electrolytic polishing tank that stores an electrolytic solution, a first electrode, and a second electrode, and the first electrode, A voltage is applied between the second electrode and a current is allowed to flow between the portion to be polished and the second electrode in contact with the first electrode via the electrolytic solution. A polishing apparatus for polishing the portion to be polished, wherein the first electrode has a configuration in which a contact portion that is in contact with the portion to be polished is disposed in the electrolytic solution at least when the voltage is applied. .

A polishing apparatus according to a second aspect of the present invention is the polishing apparatus according to the first aspect, wherein the first electrode is attached to the electrolytic polishing tank so that the contact portion is accommodated in a storage part of the electrolytic polishing tank. It has the structure which is made.
A polishing apparatus according to a third aspect of the present invention is the polishing apparatus according to the first or second aspect, wherein the first electrode includes an elastic portion that elastically biases the contact portion toward the polished portion. It has the composition which is.

A polishing apparatus according to a fourth aspect of the present invention is the polishing apparatus according to the third aspect, wherein the elastic portion has a structure having a leaf spring structure.
A polishing apparatus according to a fifth aspect of the present invention is the polishing apparatus according to the second aspect, wherein the gripping means for gripping the workpiece and the gripping member are moved up and down so that the gripping member grips the gripping target. A configuration including a moving object moving means including a moving means for bringing a portion to be polished of the polishing object into contact with the first electrode, and an elastic member for elastically biasing the gripping member toward the first electrode. Have.

A polishing apparatus according to a sixth aspect of the present invention is the polishing apparatus according to any one of the first to fifth aspects, wherein at least a portion immersed in the electrolytic solution is formed of tungsten in the first electrode. It has the composition which is.
The polishing method according to the seventh aspect of the present invention is the polishing method of the first electrode, the second electrode, and the object to be polished, wherein the first electrode and the object to be polished are in contact with each other, and An arrangement step of disposing at least a part of the first electrode, at least a part of the second electrode, and the portion to be polished in an electrolytic solution; and the first electrode and the second electrode A polishing step of polishing the portion to be polished by applying a voltage between the second electrode and the portion to be polished to pass a current through the electrolytic solution.

The polishing method according to an eighth aspect of the present invention is the polishing method according to the seventh aspect, wherein in the placing step, at least a part of the first electrode is immersed in the electrolytic solution in advance. The portion to be polished is brought into contact with the immersed portion of the electrode.
A polishing method according to a ninth aspect of the present invention is the polishing method according to the seventh or eighth aspect, wherein the contact portion of the first electrode with the portion to be polished is elastically biased toward the portion to be polished. It is characterized by making it.

  A polishing method according to a tenth aspect of the present invention is the polishing method according to any one of the seventh to ninth aspects, wherein the object to be polished is a cold cathode fluorescent lamp, and the portion to be polished is a lead wire. It is characterized by being.

According to the first aspect of the present invention, since the portion to be polished is polished by anodic dissolution contributed by electric energy, the polishing time is remarkably shorter than that of the chemical polishing method of polishing by chemical dissolution. Further, it is not necessary to use a deleterious substance for medical use that is dangerous in handling and has a troublesome treatment of the waste liquid.
According to invention of Claim 2, since the contact part of the 1st electrode is stored in the storage part of an electropolishing tank, only to move the to-be-polished part in electrolyte solution, the to-be-polished part and the above-mentioned The contact portion can be brought into contact, and means for moving the first electrode is unnecessary.

  According to the third aspect of the present invention, the impact when the part to be polished is brought into contact with the first electrode can be reduced by the elastic part, and the object to be polished and the part to be polished have physical properties that are weak against the shock. However, the object to be polished and the part to be polished are not easily damaged. Furthermore, since the contact portion is elastically biased toward the portion to be polished by the elastic portion, the contact state between the first electrode and the portion to be polished can be stably maintained.

According to the invention described in claim 4, since the first electrode can have a simple structure, the cost can be reduced and the maintenance is also simple.
According to the invention of claim 5, the impact when the part to be polished is brought into contact with the first electrode can be reduced by the elastic member, and the object to be polished and the part to be polished have physical properties that are weak against the impact. However, the object to be polished and the part to be polished are not easily damaged. Furthermore, since the contact portion is elastically biased toward the portion to be polished by the elastic member, the contact state between the first electrode and the portion to be polished can be stably maintained.

According to the sixth aspect of the present invention, the first electrode is hardly polished, and the cost can be reduced and the maintenance can be simplified by reducing the number of parts replacement.
According to the seventh aspect of the invention, since the polishing is performed by anodic dissolution contributed by electric energy, the processing time is remarkably shorter than the chemical polishing method in which polishing is performed by chemical dissolution. Further, it is not necessary to use a non-medicinal deleterious substance that is dangerous to handle and has a troublesome treatment of the waste liquid.

According to the eighth aspect of the present invention, the polished portion and the contact portion can be easily brought into contact only by moving the polished portion.
According to the ninth aspect of the invention, the impact when the part to be polished is brought into contact with the first electrode can be reduced by the elastic member, and the object to be polished and the part to be polished are not easily damaged. Furthermore, the contact state between the first electrode and the portion to be polished can be stably maintained.

  According to the invention of the tenth aspect, problems peculiar to the polishing of the lead wire of the cold cathode fluorescent lamp can be solved. Details of this will be described later.

Hereinafter, a polishing apparatus and a polishing method according to embodiments of the present invention will be described with reference to the drawings.
In the polishing apparatus and the polishing method according to the first to fourth embodiments, the object to be polished is on the anode side, an electric current is passed between the cathode and the cathode, and the surface of the object to be polished is anodized and polished. This is a so-called electropolishing apparatus and electropolishing method that achieve an effect.

<First Embodiment>
(Description of electropolishing equipment)
FIG. 1 is a schematic view showing an electropolishing apparatus according to the first embodiment. The electropolishing apparatus 1 includes an electropolishing tank 2, a first electrode 3, and a second electrode 4.
The electrolytic polishing tank 2 has a box shape having an opening on the upper surface, and the material thereof is vinyl chloride. The electrolytic polishing tank 2 has a storage part 5 inside, and the storage part 5 stores an aqueous phosphoric acid solution containing 40% by weight of phosphoric acid as the electrolytic solution 6.

  The concentration of the phosphoric acid aqueous solution is not limited to 40% by weight, but the concentration of the phosphoric acid aqueous solution is preferably 30 to 50% by weight in order to shorten the polishing time. Moreover, the electrolyte solution 6 is not limited to phosphoric acid aqueous solution, The well-known electrolyte solution used by electropolishing can be selected suitably, and can be used. For example, sulfuric acid aqueous solution, nitric acid aqueous solution, etc. are mentioned. However, since the phosphoric acid aqueous solution uses phosphoric acid that is not applicable to non-medicinal deleterious substances, it can be handled safely and the treatment of the waste liquid is simple. Further, since the phosphoric acid aqueous solution is colored when it becomes dirty, it is easy to determine the replacement time.

The material of the electrolytic polishing tank 2 is not limited to vinyl chloride, and a material that is not easily eroded by the electrolytic solution 6 can be appropriately selected according to the type of the electrolytic solution 6. Note that when the electrolytic solution 6 is a phosphoric acid aqueous solution, the electrolytic polishing tank 2 is not easily eroded because the phosphoric acid aqueous solution has poor erodibility.
The first electrode 3 is attached to the electrolytic polishing tank 2. The first electrode 3 includes a support member 7 fixed to a side plate of the electrolytic polishing tank 2 and an electrode body 8 supported by the support member 7.

  The electrode body 8 is formed by bending a tungsten plate material into a substantially L shape, and includes a vertical portion 10 fixed to one end portion of the support member 7 with a screw 9 and a lead wire 101 of the cold cathode fluorescent lamp 100. And a horizontal portion 11 as a contact portion for contacting the. The electrode body 8 is supported at a predetermined height position by the support member 7 so that the horizontal part 11 is accommodated in the storage part 5 of the electrolytic polishing tank 2.

Since the electrode body 8 is made of tungsten, it is difficult to be electropolished even if it is immersed in the electrolytic solution 6 when a voltage is applied. The material of the electrode body 8 is not limited to tungsten, and may be any material having a property that is difficult to be electropolished.
Since the electrode body 8 is a plate material bent into a substantially L shape as described above, the electrode body 8 itself is an elastic portion having a leaf spring structure. Therefore, when a load is applied to the horizontal portion 11, the horizontal portion 11 rotates around the connection portion with the vertical portion 10. For example, when the lead wire 101 is pressed against the upper surface of the horizontal portion 11 from above and brought into contact, a downward load is applied to the horizontal portion 11, and the horizontal portion 11 is downward (in the direction indicated by the arrow 12 in FIG. 1). To turn.

  As described above, when a load is applied to the horizontal portion 11, the horizontal portion 11 rotates. Therefore, when the lead wire 101 is brought into contact with the horizontal portion 11, the load applied to the lead wire 101 can be reduced. . Therefore, even if the lead wire 101 is strongly pressed against the horizontal portion 11, the lead wire 101 is not easily bent, and the cold cathode fluorescent lamp 100 is not easily broken and damaged.

  The spring pressure of the leaf spring structure of the electrode body 8 depends on the size of the cold cathode fluorescent lamp 100, the diameter of the lead wire 101 and the length of the protruding portion, the speed of moving below the chuck head 110 described later, etc. It is preferable to adjust appropriately. When the spring pressure is too strong, the cold cathode fluorescent lamp 100 and the lead wire 101 are bent, and when the spring pressure is too weak, the horizontal portion 11 does not return to a predetermined position.

In addition, since the electrode body 8 has a leaf spring structure, when the lead wire 101 is brought into contact with the horizontal portion 11, the horizontal portion 11 is elastically biased toward the lead wire 101, so that the horizontal portion 11 and the lead wire 101 can be stably maintained. Therefore, a current can be stably supplied to the lead wire 101, and the polishing process can be reliably performed.
The second electrode 4 is a lead bar bent in a substantially L shape, and one end of the second electrode 4 is placed on the side plate of the electrolytic polishing tank 2 such that the end of the second electrode 4 is accommodated in the storage section 6 of the electrolytic polishing tank 2. It is fixed.

  The first electrode 3 is connected to the anode side of a power source (not shown) via an electric wiring 13, and the second electrode 4 is connected to the cathode side of the power source via an electric wiring 14. ing. Since the support member 7 and the electrode body 8 are conductive, the first electrode 3 is electrically connected to the power source. Moreover, since the 2nd electrode 4 also has electroconductivity, it is electrically connected with the said power supply.

(Description of the object to be polished)
The electropolishing apparatus 1 according to the present embodiment is particularly useful when the object to be polished is the cold cathode fluorescent lamp 100 and the portion to be polished is the lead wire 101 of the cold cathode fluorescent lamp 100.
FIG. 2 is a longitudinal sectional view showing a cold cathode fluorescent lamp. In FIG. 2, the scales between the constituent members are not unified. As shown in FIG. 2, the cold cathode fluorescent lamp 100 includes a glass bulb 104 in which electrodes 102 are hermetically sealed at both ends, a phosphor film 103 is formed on an inner surface, and mercury and a rare gas are sealed inside. .

The glass bulb 104 has a total length of 280 to 1000 mm, an outer diameter of 1.8 to 4.0 mm, and an inner diameter of 1.4 to 3.0 mm.
Each electrode 102 includes a bottomed cylindrical electrode body 105 and a lead wire 101 connected to the bottom of the electrode body 105 by laser welding or the like. In the electrode 102, the electrode body 105 and the end portion of the lead wire 101 on the electrode body 105 side are accommodated in the glass bulb 104, and the end portion of the lead wire 101 on the side opposite to the electrode body 105 is The glass bulb 104 is disposed so as to protrude outward.

  The lead wire 101 is made of, for example, niobium nickel and has a wire diameter of 0.8 to 0.9 mm. In addition, the length of the portion of the lead wire 101 that protrudes outward from the glass bulb 104 (hereinafter simply “protruding portion”) is 2 to 11 mm. Instead of the lead wire 101, for example, an iron / nickel alloy wire core material covered with a copper layer (jumet wire) may be used.

FIG. 3 is a diagram for explaining an electrode sealing process in manufacturing a cold cathode fluorescent lamp. As shown in FIG. 3, in the electrode sealing step, the electrode 102 in which the glass beads 107 are externally fitted to the lead wire 101 is inserted into the end of the glass tube 106 that is a precursor of the glass bulb 104, and the end The electrode 102 is sealed by heating and softening the part with a gas burner 108.
The heating temperature of the gas burner 108 is about 1300 ° C. By this heating, an oxide film having a film thickness of 0.2 to 1.0 μm is formed on the protruding portion of the lead wire 101. In particular, an oxide film is easily formed in the vicinity of the base of the protruding portion close to the flame of the gas burner 108 (range indicated by reference numeral 109 in FIG. 3). The film thickness of the oxide film was measured by Auger electron spectroscopy.

  In general, the cold cathode fluorescent lamp 100 is shipped with the surface of the protruding portion coated with solder in order to prevent oxidation of the protruding portion of the lead wire 101. The solder is used for the coating. When the cold cathode fluorescent lamp 100 is attached to a lamp (not shown) such as a backlight unit, the coated solder can be used for soldering, and a separate solder is prepared. This is because it saves time and effort.

  However, if an oxide film is formed on the surface of the lead wire 101, the wettability of the solder on the surface of the lead wire 101 is deteriorated, and the solder coating process is not successful. Thereby, the manufacturing yield of the cold cathode fluorescent lamp 100 is lowered. Therefore, the lead wire 101 must be polished to remove the oxide film. A portion that is particularly desired to be polished is a root portion 109 of the lead wire 101.

In the electropolishing apparatus 1, the horizontal portion 11 of the first electrode 3 is disposed in the electrolytic solution 6, so that the entire protruding portion of the lead wire 101 can be immersed in the electrolytic solution 6 when a voltage is applied. . Therefore, it is possible to immerse the base portion 109 of the lead wire 101 where an oxide film is easily formed in the electrolytic solution 6, and the base portion 109 can be polished.
In general, in the electrolytic polishing method, a portion in contact with the first electrode 3 is difficult to be polished. However, in the case of the electropolishing apparatus 1 according to the first embodiment, it is the lower end portion of the lead wire 101 where the oxide film is difficult to be formed that is in contact with the horizontal portion 11 of the first electrode 3. The vicinity 109 of the root where it is easy to form is immersed in the electrolytic solution 6 without being in contact with the first electrode 3. Therefore, the root vicinity 109 can be efficiently polished.

(Description of electropolishing method)
Below, the electrolytic polishing method performed using the electrolytic polishing apparatus 1 is demonstrated.
First, the electrolytic solution 6 is injected into the storage unit 5 of the electrolytic polishing tank 2 to such an extent that at least the horizontal part 11 of the first electrode 3 and one end of the second electrode are immersed.
Next, the cold cathode fluorescent lamp 100 is moved, the lead wire 101 of the cold cathode fluorescent lamp 100 is pressed against the upper surface of the horizontal portion 11 of the third electrode 3, and the lead wire 101 and the horizontal portion 11 are brought together. Make contact.

The cold cathode fluorescent lamp 100 is moved by a chuck head 110 including a holding member 111 that holds the cold cathode fluorescent lamp 100 and a moving unit 112 that moves the holding member 111 up and down.
Specifically, the cold cathode fluorescent lamp 100 is moved directly above the electrolytic polishing tank 2 by the chuck head 110, and the cold cathode fluorescent lamp 100 is further lowered. As a result, the lead wire 101 of the cold cathode fluorescent lamp 100 is immersed in the electrolytic solution 6 in the electrolytic solution storage portion 5, and the lower end portion of the lead wire 101 comes into contact with the upper surface of the horizontal portion 11 in the electrolytic solution 6. .

  Next, a voltage is applied between the first electrode 3 and the second electrode 4, and the electrolytic solution 6 is interposed between the lead wire 101 brought into contact with the first electrode 3 and the second electrode 4. Then, a current of 0.8 to 5.0 A is supplied for 3 seconds or more. Thereby, the oxide film of the lead wire 101 is dissolved in the electrolytic solution 6 by an electrochemical reaction, and the surface of the lead wire 101 is polished. Note that when voltage is applied, the lead wire 101 functions as an anode, and the second electrode 4 functions as a cathode.

Second Embodiment
The electropolishing apparatus according to the second embodiment is the first in that the first electrode has an elastic part that elastically biases the contact part toward the part to be polished instead of having a leaf spring structure. This is different from the embodiment. Other configurations are basically the same as those of the electropolishing apparatus 1 according to the first embodiment. Therefore, common constituent parts are denoted by the same reference numerals as those in the first embodiment, and the description thereof will be omitted or simplified, and differences will be mainly described.

(Description of electropolishing equipment)
FIG. 4 is a schematic view showing an electropolishing apparatus according to the second embodiment. The electropolishing apparatus 200 includes an electropolishing tank 2, a first electrode 201, a second electrode 4, and an elastic member 202.
The first electrode 201 is made of tungsten, and is slidably attached to the side plate of the electrolytic polishing tank 2 by the first horizontal portion 203 that contacts the lead wire 101 of the cold cathode fluorescent lamp 100 and the attachment member 204. And a second horizontal portion 206 to which the electrical wiring 13 is connected.

The first electrode 201 is supported by the elastic member 202 disposed below the first horizontal portion 203 in the storage portion 5 of the electropolishing tank 2 so that the horizontal portion 203 is at a predetermined height position. ing.
The elastic member 202 is a rubber bag body filled with air. When a load is applied to the first horizontal portion 203, the elastic member 202 is compressed by the first horizontal portion 203 and flattened. In other words, the elastic member 202 elastically biases the first horizontal portion 203 of the first electrode 201 toward the lead wire 101 side. For example, when the lead wire 101 is brought into contact with the upper surface of the first horizontal portion 203 from above, a downward load is applied to the first horizontal portion 203, the elastic member 202 is flattened horizontally, and the first horizontal portion 203 is The horizontal portion 203 moves downward (in the direction indicated by the arrow 207 in FIG. 4).

  Thus, when a load is applied to the first horizontal portion 203 from above, the first horizontal portion 203 moves downward, so that the load applied to the lead wire 101 can be reduced. In addition, since the first horizontal portion 203 is elastically biased toward the lead wire 101 by the elastic force of the elastic member 202, the contact state between the first horizontal portion 203 and the lead wire 101 is stably maintained. be able to.

The first electrode 201 is connected to the anode side of a power source (not shown) through the electric wiring 13. Since the first horizontal portion 203, the vertical portion 205, and the second horizontal portion 205 have conductivity, the first electrode 201 is electrically connected to the power source.
(Description of electropolishing method)
Hereinafter, an electrolytic polishing method performed using the electrolytic polishing apparatus 200 will be described.

First, the electrolytic solution 6 is injected into the storage unit 5 of the electrolytic polishing tank 2 so that at least the first horizontal portion 203 of the first electrode 201 and one end of the second electrode are immersed.
Next, the cold cathode fluorescent lamp 100 is moved by the chuck head 110 having the gripping member 111 and the moving means 112 so that the base portion 109 of the lead wire 101 is immersed in the electrolytic solution 6 and the lower end portion of the lead wire 101 is moved. Is brought into contact with the upper surface of the first horizontal portion 203 of the third electrode 3.

Further, a voltage is applied between the first electrode 201 and the second electrode 4, and the electrolytic solution 6 is placed between the lead wire 101 brought into contact with the first electrode 201 and the second electrode 4. Current is passed through. As a result, the oxide film on the surface of the lead wire 101 is dissolved in the electrolytic solution 6 by an electrochemical reaction, and the surface of the lead wire 101 is polished.
<Third Embodiment>
The electropolishing apparatus according to the third embodiment is different from the first embodiment in that it includes a workpiece moving means, but the other configurations are basically electrolysis according to the first embodiment. The configuration is the same as that of the polishing apparatus 1. Therefore, common components are denoted by the same reference numerals as those in the first embodiment, and the description thereof will be omitted or simplified, and differences will be mainly described.

(Description of electropolishing equipment)
FIG. 5 is a schematic view showing a polishing apparatus according to the third embodiment. The electropolishing apparatus 300 includes an electropolishing tank 2, a first electrode 301, a second electrode 4, and a chuck head 310 as an example of an object moving means.
The first electrode 301 is made of tungsten, and one end side of the first electrode 301 passes through the opening 302 provided in the side plate of the electrolytic polishing tank 2 and is accommodated in the storage unit 5 of the electrolytic polishing tank 2. A seal member 303 is filled between the first electrode 301 and the inner surface of the opening 302 so that the electrolytic solution 6 in the electrolytic polishing tank 2 does not leak.

As for the 1st electrode 301, the edge part by the side of the electrolyte storage part 5 is a contact part for making the lead wire 101 of the cold cathode fluorescent lamp 100 contact.
6 is a view of the chuck head holding the cold cathode fluorescent lamp as viewed from the arrow A side in FIG. As shown in FIGS. 5 and 6, the chuck head 310 includes a pair of gripping members 311 for gripping the cold cathode fluorescent lamp 100 and a pair of moving means 312 for moving the gripping members up and down.

  The gripping member 311 is supported so as to be slidable up and down along a shaft body 313 that penetrates the gripping member 311, and the gripping member 311 and the shaft body 313 are attached in the vicinity of the lower end of the moving means 312. Housed in the housing 314. Further, a spring 315 as an example of an elastic member is attached above the gripping member 311 so as to be fitted on the shaft body 313, and the gripping member 311 is attached to the first electrode 301 by the spring 315. The bullet is energized to the side.

  The strength with which the gripping member 311 grips the cold cathode fluorescent lamp 100 is such that the cold cathode fluorescent lamp 100 does not move when the lead wire 101 of the cold cathode fluorescent lamp 100 is brought into contact with the first electrode 301. Strong is preferred. In order to prevent the cold cathode fluorescent lamp 100 from being damaged due to the gripping member 311 being too tightly sandwiched by the cold cathode fluorescent lamp 100, the gripping member 311 is not directly in contact with the cold cathode fluorescent lamp 100. A buffer material 316 is attached.

The cold cathode fluorescent lamp 100 is moved directly above the electropolishing tank 2 by the chuck head 310 and then lowered downward. Thereby, the lower lead wire 101 of the cold cathode fluorescent lamp 100 is immersed in the electrolytic solution 6 in the electrolytic solution storage portion 5, and the lower end portion of the lead wire 101 is the upper surface of the horizontal portion 11 in the electrolytic solution 6. To touch.
When a load is applied to the gripping member 311 from below when the lead wire 101 is brought into contact with the first electrode 301, the gripping member 311 moves upward, so that the load applied to the lead wire 101 can be reduced. Moreover, since the holding member 311 is elastically biased toward the first electrode 3 by the elastic force of the spring 314, the contact state between the first electrode 301 and the lead wire 101 is stably maintained.

(Description of electropolishing method)
Hereinafter, an electrolytic polishing method performed using the electrolytic polishing apparatus 300 will be described.
First, the electrolytic solution 6 is injected into the storage unit 5 of the electrolytic polishing tank 2 to such an extent that at least the end of the first electrode 301 on the storage unit 5 side and the one end of the second electrode are immersed.
Next, the cold cathode fluorescent lamp 100 is moved by the chuck head 310 so that the base portion 109 of the lead wire 101 is immersed in the electrolytic solution 6 and the lower end portion of the lead wire 101 is brought into contact with the upper surface of the third electrode 301. Let

Further, a voltage is applied between the first electrode 301 and the second electrode 4, and the electrolytic solution 6 is interposed between the lead wire 101 brought into contact with the first electrode 301 and the second electrode 4. Current is passed through. As a result, the oxide film on the surface of the lead wire 101 is dissolved in the electrolytic solution 6 by an electrochemical reaction, and the surface of the lead wire 101 is polished.
<Fourth embodiment>
The electropolishing apparatus according to the fourth embodiment is different from the first embodiment in that it includes a workpiece moving means, but the other configuration is basically the electropolishing apparatus according to the first embodiment. 1 has the same configuration. Therefore, common components are denoted by the same reference numerals as those in the first embodiment, and the description thereof will be omitted or simplified, and differences will be mainly described.

(Description of electropolishing equipment)
FIG. 7 is a schematic view showing a polishing apparatus according to the fourth embodiment. The electropolishing apparatus 400 includes an electropolishing tank 2, a first electrode 401, a second electrode 4, and an electrolysis head 410 as an example of an object moving means.
The configuration of the first electrode 401 is the same as that of the first electrode 301 according to the third embodiment. That is, the first electrode 401 is made of tungsten, and one end side of the first electrode 401 that passes through the opening 402 and is stored in the storage unit 5 of the electrolytic polishing tank 2 contacts the lead wire 101 of the cold cathode fluorescent lamp 100. It is a contact part to make it. A seal member 403 is filled between the first electrode 401 and the inner surface of the opening 402.

  In the case of the electropolishing apparatus 400 according to the fourth embodiment, the cold cathode fluorescent lamp 100 is moved directly above the electropolishing tank 2 by the chuck head 110 similar to the chuck head 110 used in the first embodiment. It is done. Further, the cold cathode fluorescent lamp 100 moved right above the electropolishing tank 2 is transferred from the chuck head 110 to the electrolysis head 410 and lowered by the electrolysis head 410.

The electrolysis head 410 includes a gripping member 411 that grips the cold cathode fluorescent lamp 100 and a pair of moving means 412 for moving the gripping member 411 up and down.
The grip member 411 is supported so as to be slidable up and down along a shaft body 413 penetrating the grip member 411, and the grip member 411 and the shaft body 413 are in a housing 414 attached to a moving means 412. It is stored in. Further, a spring 415 as an elastic member is attached above the gripping member 411 so as to be fitted on the shaft body 413, and the gripping member 411 is moved downward with respect to the moving means 412 by the spring 415. The bullet is energized.

The moving means 412 is supported so as to be slidable up and down along a shaft body 416 penetrating the moving means 412.
When the cold cathode fluorescent lamp 100 is lowered by the electrolysis head 410, the lower lead wire 101 of the cold cathode fluorescent lamp 100 is immersed in the electrolyte solution 6 in the electrolyte solution storage unit 5, and the lower end of the lead wire 101. The part contacts the upper surface of the horizontal part 11 in the electrolytic solution 6.

  When the lead wire 101 is brought into contact with the first electrode 401, if a load is applied to the grip member 411 from below, the grip member 411 moves upward, so that the load applied to the lead wire 101 can be reduced. In addition, the gripping member 411 is elastically biased toward the first electrode 401 by the elastic force of the spring 414, so that the contact state between the first electrode 401 and the lead wire 101 is stably maintained.

(Description of electropolishing method)
Hereinafter, an electropolishing method performed using the electropolishing apparatus 400 will be described.
First, the electrolytic solution 6 is injected into the storage unit 5 of the electrolytic polishing tank 2 so that at least the end of the first electrode 401 on the storage unit 5 side and the one end of the second electrode are immersed.
Next, the cold cathode fluorescent lamp 100 is moved directly above the electropolishing tank 2 by the chuck head 110 having the gripping member 111 and the moving means 112, and further lowered by the electrolysis head 410, so that the lead wire 101 is moved down. The bottom portion 109 of the lead wire 101 is immersed in the electrolytic solution 6 and the lower end portion of the lead wire 101 is brought into contact with the upper surface of the third electrode 401.

  Further, a voltage is applied between the first electrode 401 and the second electrode 4, and the electrolytic solution 6 is interposed between the lead wire 101 brought into contact with the first electrode 401 and the second electrode 4. Current is passed through. As a result, the oxide film on the surface of the lead wire 101 is dissolved in the electrolytic solution 6 by an electrochemical reaction, and the surface of the lead wire 101 is polished.

  The polishing apparatus and the polishing method according to the present invention can be used when polishing the surface of an article having conductivity.

It is the schematic which shows the electropolishing apparatus which concerns on 1st Embodiment. It is a longitudinal cross-sectional view which shows a cold cathode fluorescent lamp. It is a figure explaining the electrode sealing process in manufacture of a cold cathode fluorescent lamp. It is the schematic which shows the electropolishing apparatus which concerns on 2nd Embodiment. It is the schematic which shows the electropolishing apparatus which concerns on 3rd Embodiment. It is the figure which looked at the chuck head which hold | gripped the cold cathode fluorescent lamp from the arrow A side in FIG. It is the schematic which shows the electropolishing apparatus which concerns on 4th Embodiment.

Explanation of symbols

DESCRIPTION OF SYMBOLS 1,200,300,400 Polishing apparatus 2 Electrolytic polishing tank 3,201,301,401 1st electrode 4 2nd electrode 5 Storage part 6 Electrolytic solution 8 Elastic part 11 Contact part 100 To-be-polished object 101 To-be-polished part 310 , 410 Workpiece moving means 311, 411 Holding means 312, 412 Moving means 315, 415 Elastic member

Claims (10)

An electrolytic polishing tank for storing an electrolytic solution, a first electrode, and a second electrode;
A voltage is applied between the first electrode and the second electrode, and the electrolyte solution is between the second electrode and the portion to be polished of the object to be polished that is in contact with the first electrode. A polishing apparatus for polishing the portion to be polished by passing an electric current through
The polishing apparatus according to claim 1, wherein a contact portion of the first electrode that contacts the portion to be polished is disposed in the electrolytic solution at least when the voltage is applied.   The polishing apparatus according to claim 1, wherein the first electrode is attached to the electrolytic polishing tank so that the contact portion is accommodated in a storage portion of the electrolytic polishing tank.   The polishing apparatus according to claim 1, wherein the first electrode includes an elastic portion that elastically urges the contact portion toward the polished portion.   The polishing apparatus according to claim 3, wherein the elastic portion has a leaf spring structure. Gripping means for gripping the object to be polished;
Moving means for moving the gripping member up and down to bring the polished portion of the object to be polished gripped by the gripping member into contact with the first electrode;
The polishing apparatus according to claim 2, further comprising an object moving means including an elastic member that elastically biases the gripping member toward the first electrode.   The polishing apparatus according to claim 1, wherein at least a portion of the first electrode immersed in the electrolytic solution is formed of tungsten. The first electrode, the second electrode, and the portion to be polished of the object to be polished are in contact with the first electrode and the portion to be polished, and at least a part of the first electrode, the second electrode Arrangement step for disposing at least a part of the electrode and the portion to be polished in an electrolyte solution; and
A voltage is applied between the first electrode and the second electrode, a current is passed between the second electrode and the portion to be polished via the electrolytic solution, and the portion to be polished is polished. And a polishing step.   In the arrangement step, at least a part of the first electrode is previously immersed in the electrolytic solution, and the portion to be polished is brought into contact with the immersion portion of the first electrode. The polishing method described.   The polishing method according to claim 7 or 8, wherein a portion of the first electrode that contacts the portion to be polished is elastically biased toward the portion to be polished.   The polishing method according to claim 7, wherein the object to be polished is a cold cathode fluorescent lamp, and the portion to be polished is a lead wire.

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