JP2006159690A - Resin molding mold and resin molding device - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a resin molding mold which prevents the occurrence of voids by air remaining in the mold including a cavity during resin molding and enables high quality resin molding and a resin molding device. <P>SOLUTION: In the resin molding mold in which a section bar 15 supporting the base end part of an outer lead 13 is set to connect rail parts 14 and 16 to each other and to cross a lead frame 10 in the width direction, and the lead frame 10 set in the section bar 15 with a slit 11 opened in the longitudinal direction of the section bar 15 is resin-molded as a molded article, vent parts 20 and 22 making the cavity and the slit 11 communicate with each other are set in the rail part 16 on the opposite side to the side where a gate 14a for injecting a resin into the cavity is arranged. <P>COPYRIGHT: (C)2006,JPO&NCIPI

Description

  The present invention relates to a resin mold and a resin mold device, and more specifically, a resin mold that eliminates the influence of a resin residue at a vent portion on a subsequent process and enables resin molding without generating voids. The present invention relates to a mold and a resin molding apparatus.

  A semiconductor device formed by a resin mold using a lead frame as a molded product is manufactured by filling a cavity with a resin in a state where the lead frame is clamped by a resin mold and thermally curing the resin in the cavity. Air remaining in the cavity during resin molding causes voids to be generated when the resin is injected into the cavity, for example, by being entrained in the resin, so the air remaining in the mold such as the cavity is discharged. Thus, a resin molding method has been conventionally performed.

FIG. 12 shows an example of a lead frame 10 resin-molded using a resin mold die provided with an air vent for discharging air remaining in a die such as a cavity. This molded product has a package portion 12 arranged vertically and horizontally. In the resin mold, a gate is disposed corresponding to one rail portion 14 of the lead frame 10, and the other rail portion 16 has a gate. Correspondingly, an air vent portion V is provided. 14a is a gate resin cured in the gate. The air vent portion V (shown by a broken line) is provided so as to communicate with the cavity and cross the rail portion 16 in the width direction.
Japanese Patent Laid-Open No. 04-79234 JP-A-10-217286

  The air vent portion V is a passage for releasing air in the cavity by providing a gap between the lead frame 10 and the clamping surface of the mold. When the air vent portion V is provided, as shown in FIG. Are communicated with the cavity, and the other end side is provided so as to reach the edge of the rail portion 16. However, if the air vent portion V is provided so as to cross the rail portion 16, when resin molding is performed using a resin having high fluidity such as a transparent resin, the resin leaks from the air vent portion V, and the lead frame 10 Resin beams may adhere to the side edges and remain. The resin beam adhering to the lead frame 10 may be peeled off from the lead frame 10 and dropped, or the processing apparatus may be damaged in the subsequent trimming and forming processes, and the product transport operation cannot be performed accurately. Cause problems.

  For this reason, when the lead frame 10 is resin-molded, it is necessary to resin-mold so as not to cause resin flash. However, if the resin mold without the air vent portion is provided, air in the mold is not discharged. Resin molding becomes difficult. Also, as a method of discharging resin remaining in the cavity or resin path and resin molding, there is a method of resin molding by reducing the pressure of the resin mold region. When resin molding is performed using a resin that has high properties and is easy to entrain voids, air that has been mixed in the resin cannot be eliminated by simply molding under reduced pressure, and voids are generated.

  The present invention has been made to solve these problems, and prevents voids from being generated by air remaining in a mold such as a cavity at the time of resin molding, and eliminates the resin residue in the vent portion to provide high quality. An object of the present invention is to provide a resin mold and a resin mold apparatus that enable resin molding.

The present invention has the following configuration in order to achieve the above object.
That is, a section bar that supports the base end portion of the outer lead is provided to connect between the rail portions so as to cross the lead frame in the width direction, and a slit is formed in the section bar in parallel to the longitudinal direction of the section bar. In a resin mold for resin molding using a lead frame provided in an opening as a molded product, the cavity and the slit are communicated with a rail portion opposite to a side where a gate for injecting resin into the cavity is disposed. A vent portion is provided.

The cavities are arranged vertically and horizontally, a communication gate is provided between cavities arranged adjacent to each other in the width direction of the lead frame, and a dummy cavity is provided between the cavity at the column end and the vent portion. It is characterized by being connected.
Moreover, the said vent part is provided in the arrangement | positioning straddling the connection part which crosses the said slit in the width direction, It is characterized by the above-mentioned.
Further, the dummy cavities are arranged at a predetermined interval in the longitudinal direction of the rail portion, and a vent portion is provided between adjacent dummy cavities.

Further, according to the resin mold apparatus, wherein the resin mold die is attached to the press apparatus, the section bar that supports the base end portion of the outer lead connects the rail portions to connect the lead frame. A resin frame suitable for a product to be molded can be formed by providing a lead frame provided so as to cross the width direction and having a slit opened in the section bar in parallel to the longitudinal direction of the section bar.
Further, when a resin mold is provided, a reduced pressure mold mechanism for discharging air remaining in a mold such as a cavity or a resin path is provided, so that a higher quality resin mold can be realized.
Further, the pressure reducing mold mechanism is formed in a frame shape surrounding the outer surface of the upper mold, and a seal ring that slidably contacts the outer surface of the upper mold on the inner peripheral side surface and air-seals between the outer surface of the upper mold. A movable frame provided with a seal ring which is provided around the lower end surface and abuts against the lower clamp surface and air-seals between the lower mold clamp surface, and a seal ring mounted on the lower end surface of the movable frame Is in contact with the clamp surface of the lower mold, and the seal ring mounted on the inner peripheral side surface of the movable frame is in contact with the outer surface of the upper mold so that the clamp surface of the upper mold and the lower mold are separated from each other. And an upper die, a lower die, and a suction device for depressurizing the space enclosed by air sealing from the outside by the movable frame.

  According to the resin mold and the resin mold apparatus according to the present invention, a dummy cavity is provided in the rail portion of the lead frame, and a vent portion is provided to communicate the dummy cavity and the slit provided in the lead frame. As a result, the air remaining in the mold such as the cavity during resin molding can be guided to the dummy cavity and the slit, so that no void is formed in the cavity and the resin residue is eliminated from the lead frame. This makes it possible to perform a high-quality resin mold.

(Resin mold)
FIG. 1 is a plan view of a molded product obtained by resin molding a lead frame 10 using a resin molding apparatus according to the present invention. The lead frame 10 is formed by forming a lead pattern as a unit constituting one semiconductor device in the same vertical pattern in the vertical and horizontal directions, and the resin is molded in a layout in which the package portions 12 are aligned in the vertical and horizontal directions.
In the width direction of the lead frame 10, a section bar 15 to which the base end portion of the outer lead 13 is connected so as to connect the rail portions 14 and 16 is provided. A slit 11 is provided parallel to the direction.

The lead frame 10 is clamped by a resin mold, and resin is molded by filling the cavity from the gate disposed on one rail portion 14 of the lead frame 10 with resin. The cavities adjacent to each other in the width direction of the lead frame 10 are communicated by a communication gate, and the resin is sequentially filled from the cavities arranged on the side close to the pot.
In FIG. 1, the gate resin 14 a cured in the gate disposed on one side edge of the lead frame 10 and the gate resin 14 b cured in the communication gate provided between adjacent cavities are formed on the surface of the lead frame 10. The state of adhering is shown.

The configurations of these gates and communication gates are the same as those in a conventional resin mold. A characteristic configuration of the resin mold of this embodiment is that a dummy cavity is provided in communication with the cavity in the region of the other rail portion 16 of the lead frame 10, and the lead frame 10 is connected to the dummy cavity. A vent portion that communicates with the slit 11 provided in FIG.
In FIG. 1, the dummy resin 18 hardened in the dummy cavity is attached to the rail portion 16, the bent resin 20 cured at the vent portion connected to the dummy resin 18 and the vent portion connecting between the slits. The state where the vent resin 22 is attached to the lead frame 10 is shown.

FIG. 2 is an enlarged view showing a state where the lead frame 10 is resin-molded. The dummy cavities are arranged in the longitudinal direction of the rail portion 16 for each row of the package portions 12, and the dummy resin 18 is attached to the longitudinal direction of the rail portion 16 at a predetermined interval.
The vent resin 20 is provided in an arrangement for connecting the adjacent dummy resins 18 and extends to a position overlapping the slit 11 provided in the lead frame 10. A plurality of connecting portions 15 a are provided in the longitudinal direction of the section bar 15 so as to cross the slit 11. The vent resin 22 is a resin that has been cured in a vent portion that is provided to communicate between adjacent slits 11 across the connecting portion 15a.

FIG. 3 shows a cross-sectional view of a molded product obtained by resin molding the lead frame 10 of FIG.
3A is a cross-sectional view (a cross-sectional view taken along the line AA in FIG. 2 on the right side of the molded product) at the position of the package portion, and the package portion 12 extends in the width direction of the lead frame 10. Are connected to each other, the dummy resin 18 cured in the dummy cavity adheres to the rail portion 16 of the lead frame 10, and the gate resin 14b cured in the communication gate communicating between the cavities is attached to the lead frame 10. Indicates the state of adhesion.

  FIG. 3B is a cross-sectional view (cross-sectional view taken along line BB in FIG. 2) at a position passing through the slit 11 provided in the lead frame 10 in the longitudinal direction. A state in which the resin 11a flows into the slit 11 provided in the lead frame 10 and the bent resin 22 cured in the vent portion adheres to the connection portion 15a that connects the adjacent slits 11 is shown. In the rail portion 16, the vent resin 20 cured in the vent portion communicates with and adheres to the slit 11. The resin 11 a filled in the slit 11 is formed to the same thickness as the lead frame 10.

  FIG. 3C is a cross-sectional view (a cross-sectional view taken along the line CC in FIG. 2) at a position passing along the rail portion 16 of the lead frame 10. The dummy resin 18 cured in the dummy cavity is arranged at the same pitch as the lead pattern repeat pitch and spaced apart in the longitudinal direction of the rail portion 16, and the vent resin 20 is attached to the arrangement connecting the adjacent dummy resins 18. Yes.

  In the resin mold according to the present embodiment, when the lead frame 10 is resin-molded, the resin is discharged into a dummy cavity provided in communication with the cavity, and the slit provided in the lead frame 10 through the vent portion. The resin is molded so that the resin is discharged into the resin. Since the dummy cavity, the vent portion, and the slit 11 are all disposed in the plane region of the lead frame 10, when the lead frame 10 is resin-molded using the resin mold of the present embodiment, The discharged resin or the like does not leak out from the planar area of the lead frame 10.

  4A and 5 are plan views (clamp surfaces) of the upper die 30 and the lower die 40 used when the lead frame 10 described above is resin-molded. The resin mold of this embodiment is a device that resin molds two lead frames 10 formed in a strip shape by a single resin molding operation. The upper mold 30 sandwiches a center block 31 between chase blocks. The lower die 40 is configured by arranging a pair of cavity inserts 42, 42 with a center block 41 sandwiched between chase blocks.

The cavity insert 32 attached to the upper mold 30 includes a cavity 33 arranged in accordance with the arrangement of the package portion 12 of the lead frame 10, a dummy cavity 34 provided in communication with the cavity 33 at each row end, and a vent Portions 35 and 36 are provided. The vent portion 35 communicates between the adjacent dummy cavities 34 and is provided according to the arrangement of the slits 11, and the vent portion 36 is provided at a plurality of locations according to the arrangement of the adjacent slits 11. Further, as shown in FIG. 4B, the vent portion 35 may not be provided so as to connect the adjacent dummy cavities 34.
A communication gate 38 is provided between the cavities 33 adjacent to each other in the width direction of the lead frame 10. The center block is provided with a cull 37.

  The vent portions 35 and 36 allow the air to pass between the surface of the lead frame 10 and the clamp surface when the lead frame 10 is clamped by a mold, and clamp the mold so as to prevent the resin from passing. The surface is slightly polished. The dummy cavity 34 allows a certain amount of resin to flow out of the cavity 33 and accumulates the resin that has flown out. The dummy cavity 34 and the cavity 33 at the end of the column allow the resin flow to flow as in the case of the communication gate 38. It is provided so as to be connected through a gate 38b formed in a shape to be squeezed.

On the other hand, the cavity insert 42 attached to the lower mold 40 is provided with a cavity 43 in accordance with the arrangement of the package portion 12 of the lead frame 10, and a dummy cavity 44 is provided in communication with the cavity 43 at the row end. . A gate 47 b is also provided between the dummy cavity 44 and the cavity 43. A gate may be provided between the adjacent dummy cavities 44.
Further, one pot 49 is arranged in the center block 41 for every two rows of the cavities 43, and a gate 47 communicating with the pot 49 is arranged at the edge of the cavity insert 42 facing the center block 41. In addition, a communication gate 48 is provided in an arrangement for communicating adjacent cavities 43.

FIG. 6 shows a state in which the lead frame 10 which is a molded product is clamped between the upper mold 30 and the lower mold 40 and resin molding is performed. By clamping the lead frame 10 with the upper die 30 and the lower die 40, spaces by the cavities 33 and 43 are formed on both surfaces of the lead frame 10, and the dummy cavity 34 is formed at the position of the rail portion 16 farthest from the pot 49. 44 is formed.
The lead frame 10 is resin-molded by filling the cavity melted with the resin melted in the pot 49 while the lead frame 10 is clamped by the upper mold 30 and the lower mold 40. When resin molding is performed using the resin mold of the present embodiment, the resin extruded from the pot 49 fills the cavity in order from the cavity closer to the pot 49, and air remaining in the cavity or resin path Are sequentially sent to adjacent cavities by the resin filling pressure, and resin molding is performed.

When the resin reaches the cavity at the column end, the air remaining in the mold is sent together with the resin to the dummy cavities 34 and 44, and the dummy cavities 34 and 44 are filled with the resin.
When the fluidity of the resin is not so high, the dummy cavity is filled with the resin and the resin pressure is applied to the dummy cavity, so that the air remaining in the cavity or the resin path is discharged to the slit 11 through the vent portion 35. Resin molded. At this time, the resin does not reach the vent portion 36. However, when the fluidity of the resin is high like a transparent resin, the resin enters the slit 11 from the dummy cavity via the vent portions 35 and 36, and air is sent out to the dummy cavity and the slit 11 together with the resin.

  The resin injected from the pot 49 into the cavities 33 and 43 fills the cavities 33 and 43 by pushing out the air remaining in the cavities toward the dummy cavities 34 and 44. The remaining air is pushed out into the dummy cavities 34 and 44. Further, since the slit 11 communicates with the dummy cavities 34 and 44 through the vent portions 35 and 36, the air and resin pushed out from the dummy cavities 34 and 44 are pushed out into the slit 11.

  Thus, when the lead frame 10 is resin-molded using the resin mold of this embodiment, the air remaining in the cavities 33 and 43 is discharged to the dummy cavities 34 and 44 and the slit 11 and resin-molded. Then, it is possible to perform resin molding by discharging the air remaining in the cavities 33 and 43 from the cavities. In the present embodiment, in addition to the dummy cavities 34 and 44 being used as the air discharge area, the slit 11 portion provided in the lead frame 10 is also used as the air discharge area, so that the air can be effectively used. The resin mold without voids can be discharged from the cavity.

In the case of using a resin having extremely high fluidity, the resin enters the slit 11 through the vent portion as shown in FIG. 3, but the planar area of the slit 11 is thus set as the resin discharge area. By doing so, it becomes possible to discharge air together with the resin, and the generation of voids in the cavities 33 and 43 can be prevented, and a high-quality resin mold can be realized.
When the lead frame 10 is resin-molded using the resin mold of the present embodiment, the dummy cavities and the slits 11 are in the plane area of the lead frame 10, so the dummy cavities and the slits 11 are filled with resin. However, the resin flash only occurs in the plane area of the lead frame 10, and it can be prevented that the resin flash adheres to the side edge of the lead frame 10, and the resin flash prevents the molded product from being conveyed, It is possible to prevent a problem that the processing apparatus is damaged when the resin beam is peeled off from the molded product and dropped. In addition, since the dummy cavity is not necessarily required for the suppression of the vent flash, a form in which air is discharged from the cavity directly to the slit through the vent portion is also possible.

(Resin molding equipment)
The resin mold mold of the above embodiment has a structure in which a dummy cavity and a vent portion are provided in the planar region of the lead frame 10 and the dummy cavity and the slit 11 are filled with resin, so that the mold is placed in the mold during resin molding. Residual air is discharged to the dummy cavity and the slit 11 to enable resin molding without voids, etc., but it is extremely fluid like a transparent resin and is used as an optical component. When manufacturing products that require high resin mold quality without voids, etc., use the above-mentioned resin mold mold and force the air remaining in the mold using the reduced pressure mold method. It is effective to use a method of discharging and resin molding.

FIG. 7 shows an example of the configuration of a resin molding apparatus provided with a reduced pressure molding mechanism. This resin molding apparatus is provided with an upper mold 30 fixed to a movable platen 50 provided in a press apparatus via an upper base 52, and a lower mold 40 fixed to a fixed platen 54 via a lower base 56. A movable frame 58 is movably mounted in the mold opening / closing direction along the outer surface of the mold 30, and a suction device 60 is connected to the movable frame 58 via a suction hose 59. A seal ring 62 is provided on the inner peripheral side surface of the movable frame 58 so as to make a round around the outer surface of the upper mold 30 and slide in contact with the outer peripheral side surface of the upper mold 30. A seal ring 64 is provided so as to go around once.
FIG. 8 shows a planar arrangement of the movable frame 58 and the upper mold 30. The seal ring 62 is provided so as to go around the outer peripheral side surface of the upper mold 30 and contact the outer peripheral side surface of the upper mold 30.

9 to 11 show a resin molding method by the resin molding apparatus of this embodiment.
FIG. 9 shows that the movable platen 50 moves to the upper position, the upper mold 30 supported by the upper base 52 moves to the upper position, and the clamping surfaces of the upper mold 30 and the lower mold 40 are separated from each other. It shows the state. In this state, an operation of setting the lead frame 10 to be molded on the lower mold 40 or taking out the molded product after molding from the lower mold 40 is performed. The movable frame 58 is in the upper position together with the upper mold 30.
The position of the outer peripheral side surface of the movable frame 58 substantially coincides with the position of the outer peripheral side surface of the lower mold 40, and the seal ring 64 attached to the lower end surface of the movable frame 58 can come into contact with the parting surface of the lower mold 40. Yes.

  In the state shown in FIG. 9, after setting the lead frame 10 which is a molded product on the lower die 40, the upper die 30 is lowered toward the lower die 40, and the seal ring 64 provided on the lower end surface of the movable frame 58 is lowered. When the parting surface of the upper die 30 is in contact with the parting surface of the die 40 and the parting surface of the lower die 40 is spaced apart, the lowering of the upper die 30 is stopped. FIG. 10 shows a state where the seal ring 64 provided on the lower end surface of the movable frame 58 is in contact with the parting surface of the lower die 40 and the parting surfaces of the upper die 30 and the lower die 40 are separated from each other.

  The seal ring 62 attached to the inner peripheral side surface of the movable frame 58 air-seals the outer peripheral side surface of the upper mold 30 and the inner peripheral side surface of the movable frame 58, and the seal ring 64 in contact with the parting surface of the lower mold 40 is the lower mold. The space between the upper die 30, the lower die 40 and the movable frame 58 (shaded portion D in the figure) is air-sealed from the outside. In this state, the suction device 60 is operated, and the space D surrounded by the upper mold 30, the lower mold 40, and the movable frame 58 is decompressed from the suction hose 59.

FIG. 11 shows a position where the upper mold 30 clamps the product to be molded (clamping position) while the lower surface (seal ring 64) of the movable frame 58 is in contact with the parting surface of the lower mold 40 after the decompression operation is completed. ). Since the seal ring 62 is in sliding contact with the outer peripheral side surface of the upper mold 30, the upper mold 30 is lowered to the mold clamping position while maintaining the air seal state. When the upper mold 30 is lowered to the mold clamping position, the pressure reducing operation by the suction device 60 is stopped.
After the upper mold 30 is lowered to the mold clamping position, the cavity is filled with resin from the pot 49 and resin molding is performed. The resin mold is a mold having a vent portion communicating with the above-described dummy cavity and the slit 11 of the lead frame 10, and the cavity is filled with resin by injecting resin from the pot into the cavity. The resin is also poured into the resin 11 and molded. After the resin molding, the mold is opened and the molded product is taken out from the lower mold 40.

When resin molding is performed using a resin molding apparatus provided with a decompression molding mechanism, such as the resin molding apparatus of the present embodiment, the product remains in a cavity or a resin path while being clamped by a resin molding die. Since air does not exist, if a void is generated, it is considered to be due to a gas component contained in the resin. As described above, in the resin mold according to the present invention, a dummy cavity is provided in communication with the cavity, and the slit 11 is connected to the dummy cavity through the vent portion. After filling the cavity, it is discharged to the dummy cavity and the slit 11, and the void is discharged to the dummy cavity and the slit 11, thereby preventing the void from remaining in the resin-sealed portion of the cavity. Molding can be performed. Further, since the dummy cavities and the slits 11 are in the plane area of the lead frame 10, even if the dummy cavities and the slits 11 are filled with resin, the resin flash only occurs in the plane area of the lead frame 10. Further, it is possible to prevent the resin beam from adhering to the side edges of the lead frame 10, and the resin beam hinders the conveyance of the molded product, or the resin beam peels off from the molded product and falls to damage the processing apparatus. Can be solved.
The above-described resin molding apparatus provided with the reduced pressure molding mechanism can be suitably used particularly for the production of resin molded products for optical parts using transparent resin.

It is a top view which shows the state which resin-molded the lead frame. It is a top view which expands and shows the state which resin-molded the lead frame. FIG. 3 is a cross-sectional view taken along line AA (a), line BB (b), and line CC (c) in FIG. 2. It is a top view which shows the structure of the upper mold | type of a resin mold metal mold | die. It is a top view which shows the structure of the lower mold | type of a resin mold metal mold | die. It is sectional drawing which shows the state which clamped the lead frame with the upper mold | type and the lower mold | type. It is explanatory drawing which shows the structure of the resin mold apparatus provided with the pressure reduction mold mechanism. It is a top view which shows the structure of a movable frame. It is explanatory drawing which shows the resin molding method by pressure reduction molding. It is explanatory drawing which shows the resin molding method by pressure reduction molding. It is explanatory drawing which shows the resin molding method by pressure reduction molding. It is explanatory drawing which shows the resin molding method using the conventional resin mold metal mold | die.

Explanation of symbols

10 Lead frame 11 Slit 11a Resin 12 Package part 13 Outer lead 14, 16 Rail part 14a, 14b Gate resin 15 Section bar 15a Connecting part 18 Dummy resin 20, 22 Vent resin 30 Upper mold 33, 43 Cavity 34, 44 Dummy cavity 35 , 36 Vent part 37 Cal 38, 48 Communication gate 38b Gate 40 Lower mold 47, 47b Gate 49 Pot 50 Movable platen 54 Fixed platen 58 Movable frame 60 Suction device 62, 64 Seal ring

Claims (7)

A section bar that supports the base end portion of the outer lead is provided so as to cross between the rail portions and cross the lead frame in the width direction, and a slit is opened in the section bar in parallel to the longitudinal direction of the section bar. In the resin mold mold that resin molds the lead frame provided as a molded product,
2. A resin mold according to claim 1, wherein a vent portion is provided on a rail portion opposite to a side where a gate for injecting resin into the cavity is disposed, and the cavity and the slit are communicated with each other. The cavities are arranged vertically and horizontally, and a communication gate is provided between the cavities arranged adjacent to each other in the width direction of the lead frame,
2. The resin mold according to claim 1, wherein a dummy cavity is provided in connection with a cavity at a row end and the vent portion.   3. The resin mold according to claim 1, wherein the vent portion is provided so as to straddle a connecting portion that crosses the slit in the width direction. 4.   The resin mold according to any one of claims 1 to 3, wherein the dummy cavities are arranged at predetermined intervals in the longitudinal direction of the rail portion, and a vent portion is provided between adjacent dummy cavities. Mold.   A resin mold apparatus, wherein the resin mold die according to any one of claims 1 to 4 is mounted on a press apparatus.   6. The resin molding apparatus according to claim 5, further comprising a pressure reduction molding mechanism that discharges air remaining in a mold such as a cavity or a resin path during resin molding. The decompression mold mechanism is formed in a frame shape surrounding the outer surface of the upper mold, and a seal ring is provided on the inner peripheral side surface so as to be in sliding contact with the outer surface of the upper mold and to air-seal between the outer surface of the upper mold. A movable frame provided with a seal ring that abuts the lower mold clamping surface at the lower end surface and air-seals the lower mold clamping surface;
A seal sing attached to the lower end surface of the movable frame contacts the clamp surface of the lower mold, and a seal ring mounted to the inner peripheral side surface of the movable frame contacts the outer surface of the upper mold, A suction device that decompresses the space enclosed by the upper mold, the lower mold, and the movable frame by air-sealing from the outside in a state where the mold and the lower mold clamping surface are separated from each other. Item 6. A resin molding apparatus according to Item 5.

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