JP2006156938A5 - - Google Patents

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Publication number
JP2006156938A5
JP2006156938A5 JP2005151025A JP2005151025A JP2006156938A5 JP 2006156938 A5 JP2006156938 A5 JP 2006156938A5 JP 2005151025 A JP2005151025 A JP 2005151025A JP 2005151025 A JP2005151025 A JP 2005151025A JP 2006156938 A5 JP2006156938 A5 JP 2006156938A5
Authority
JP
Japan
Prior art keywords
heat transfer
transfer gas
introducing
further provided
mounting table
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP2005151025A
Other languages
English (en)
Japanese (ja)
Other versions
JP4642550B2 (ja
JP2006156938A (ja
Filing date
Publication date
Application filed filed Critical
Priority to JP2005151025A priority Critical patent/JP4642550B2/ja
Priority claimed from JP2005151025A external-priority patent/JP4642550B2/ja
Priority to US11/259,037 priority patent/US20060090855A1/en
Publication of JP2006156938A publication Critical patent/JP2006156938A/ja
Publication of JP2006156938A5 publication Critical patent/JP2006156938A5/ja
Application granted granted Critical
Publication of JP4642550B2 publication Critical patent/JP4642550B2/ja
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

JP2005151025A 2004-10-29 2005-05-24 基板載置台、基板処理装置、および基板の温度制御方法 Expired - Fee Related JP4642550B2 (ja)

Priority Applications (2)

Application Number Priority Date Filing Date Title
JP2005151025A JP4642550B2 (ja) 2004-10-29 2005-05-24 基板載置台、基板処理装置、および基板の温度制御方法
US11/259,037 US20060090855A1 (en) 2004-10-29 2005-10-27 Substrate mounting table, substrate processing apparatus and substrate temperature control method

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2004316604 2004-10-29
JP2005151025A JP4642550B2 (ja) 2004-10-29 2005-05-24 基板載置台、基板処理装置、および基板の温度制御方法

Publications (3)

Publication Number Publication Date
JP2006156938A JP2006156938A (ja) 2006-06-15
JP2006156938A5 true JP2006156938A5 (enrdf_load_stackoverflow) 2008-06-26
JP4642550B2 JP4642550B2 (ja) 2011-03-02

Family

ID=36634790

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2005151025A Expired - Fee Related JP4642550B2 (ja) 2004-10-29 2005-05-24 基板載置台、基板処理装置、および基板の温度制御方法

Country Status (1)

Country Link
JP (1) JP4642550B2 (enrdf_load_stackoverflow)

Families Citing this family (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5003102B2 (ja) * 2006-10-27 2012-08-15 東京エレクトロン株式会社 静電チャックの診断方法、真空処理装置及び記憶媒体
JP2008198800A (ja) * 2007-02-13 2008-08-28 Bridgestone Corp 熱処理用治具
JP5269335B2 (ja) * 2007-03-30 2013-08-21 東京エレクトロン株式会社 プラズマ処理装置
JP2009060011A (ja) * 2007-09-03 2009-03-19 Tokyo Electron Ltd 基板載置台、基板処理装置、及び温度制御方法
JP5644256B2 (ja) * 2010-08-20 2014-12-24 豊田合成株式会社 化合物半導体の製造装置及び化合物半導体の製造方法
US8520360B2 (en) * 2011-07-19 2013-08-27 Lam Research Corporation Electrostatic chuck with wafer backside plasma assisted dechuck
JP6010433B2 (ja) * 2012-11-15 2016-10-19 東京エレクトロン株式会社 基板載置台および基板処理装置
US11139194B2 (en) * 2016-07-25 2021-10-05 Kyocera Corporation Sample holder
JP2024125376A (ja) * 2018-12-21 2024-09-18 Toto株式会社 静電チャック
JP7458156B2 (ja) * 2019-08-22 2024-03-29 東京エレクトロン株式会社 載置台及びプラズマ処理装置
US12322633B2 (en) 2020-07-06 2025-06-03 Applied Materials, Inc. Electrostatic chuck with improved temperature control
CN114975178B (zh) * 2022-05-18 2024-04-05 江苏微导纳米科技股份有限公司 温度控制组件、半导体处理腔室及半导体处理设备

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH07335630A (ja) * 1994-06-13 1995-12-22 Hitachi Ltd 真空処理装置
JPH10107134A (ja) * 1996-10-01 1998-04-24 Ricoh Co Ltd 静電吸着装置
JP2000317761A (ja) * 1999-03-01 2000-11-21 Toto Ltd 静電チャックおよび吸着方法

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