JP2006156922A - Resin burying container and manufacturing method for sample used for observing internal structure of electronic component using it - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a resin burying container capable of sufficiently improving manufacturing efficiency of a sample used for observing the internal structure of an electronic component, and a manufacturing method for the sample used for observing the internal structure of the electronic component using it. <P>SOLUTION: The resin burying container 30 is a resin burying container 1 used for burying the electronic component 7 having internal electrode layers 7a, 7b made of a ferromagnetic body into the resin 8. The resin burying container 30 is provided with a bottom 2 having a placing face 2a for placing the electronic component 7 thereon and a side wall 3 provided to the bottom 2 and extended in the parting direction from the peripheral edge of the placing face 2a. The bottom 2 has a magnet 4. When the magnet is located so that a magnetic field H penetrates the placing face 2a of the bottom 2 and if the electronic component 7 having the internal electrode layers 7a, 7b composed of the ferromagnetic body is placed on the placing face 2a, the electronic component 7 can be easily arranged to a position where the internal electrode layers 7a, 7b are parallel to the magnetic field H by the interaction between the magnetic field H generated by the magnet 4 and the internal electrode layers 7a, 7b made of the ferromagnetic body by using the resin burying container 30. <P>COPYRIGHT: (C)2006,JPO&NCIPI

Description

  The present invention relates to a resin embedding container used for resin embedding of an electronic component having an internal electrode layer made of a ferromagnetic material, and a method for manufacturing a sample for observing the internal structure of an electronic component using the same.

  As electronic parts, electronic parts having internal electrode layers made of a ferromagnetic material, such as chip capacitors and varistors, are known. As a method for inspecting the internal structure of the electronic component, a cross section in a direction perpendicular to the internal electrode layer, that is, a cross section in which the state of the internal electrode layer and the ceramic layer adjacent to the internal electrode layer can be observed simultaneously is exposed. A method is generally used in which a sample for observing the internal structure is prepared and the exposed surface of the sample for observation is observed using a microscope or the like. In order to expose a cross section in a direction orthogonal to the internal electrode layer in this way, it is necessary to identify in advance whether the cross section to be exposed is a direction orthogonal to the internal electrode layer or a parallel direction.

  However, depending on the shape of the electronic component, it is difficult to distinguish the arrangement of the internal electrode layers in the electronic component from the appearance. For example, when an electronic component having an internal electrode layer made of a ferromagnetic material has a substantially regular quadrangular prism shape, it is difficult to distinguish the arrangement of the internal electrode layer from the appearance, and the electronic component is intended to be exposed. In some cases, the cross section to be parallel to the internal electrode layer. For this reason, it becomes impossible to produce an observation sample efficiently.

As a method for discriminating the arrangement of the internal electrode layers in the electronic component as described above without depending on the appearance, for example, a method described in Patent Document 1 is known. In Patent Document 1, an electronic component is placed in a magnetic field generated by an electromagnet in a vibrating sample magnetometer, and the internal electrode layer is in a direction orthogonal to the magnetic field by measuring the magnetization of the electronic component. , A method for identifying whether they are in a parallel direction is disclosed.
JP 7-115033 A

  However, when the arrangement of the internal electrode layer in the electronic component is identified using the identification method described in Patent Document 1 described above, it is necessary to prepare a measuring device such as a vibrating sample magnetometer. It takes time to identify. Then, after identifying the arrangement of the internal electrode layers in the electronic component, it is necessary to perform an operation for making it possible to grasp the arrangement of the internal electrode layers by marking the electronic component. Moreover, even if the arrangement of the internal electrode layers in the electronic component can be grasped, when the cross section of the electronic component is exposed, the electronic component is extremely small, and therefore, such operations as polishing on the electronic component are extremely difficult. . The above work becomes extremely troublesome especially when the number of electronic components that require identification of the arrangement of the internal electrode layers increases. As described above, the preparation of the observation samples so far still has room for improvement in terms of work efficiency.

  The present invention has been made in view of the above circumstances, and a resin embedding container capable of sufficiently improving the production efficiency of a sample for observing the internal structure of an electronic component, and for observing the internal structure of an electronic component using the same. It aims at providing the manufacturing method of a sample.

  In order to solve the above-described problems, a resin embedding container according to the present invention is a resin embedding container used for embedding an electronic component having an internal electrode layer made of a ferromagnetic material in a resin, and places the electronic component thereon. A bottom portion having a surface and a side wall portion provided on the bottom portion and extending in a direction away from the peripheral portion of the mounting surface are provided, and the bottom portion includes a magnet.

  According to the resin embedding container of the present invention, when a magnet is present so that the magnetic field penetrates the bottom mounting surface, when an electronic component having an internal electrode layer made of a ferromagnetic material is mounted on the mounting surface, The electronic component is easily arranged at a position where the internal electrode layer is parallel to the magnetic field by the interaction between the magnetic field generated by the magnet and the internal electrode layer made of a ferromagnetic material. In addition, since the magnet exists so that the magnetic field penetrates the mounting surface at the bottom, and this electronic component is fixed to the mounting surface by the attractive force of the magnet, the arrangement state of the electronic component is maintained as it is even if resin is poured into the side wall. It becomes possible.

  Furthermore, according to this container, since it becomes possible to embed an electronic component in resin, a structure larger than the electronic component can be obtained. For this reason, compared with the case where the electronic component itself is polished and the cross section is exposed, the cross section is exposed easily.

  Furthermore, if the bottom of the resin-embedded container has a magnet, an electronic component is arranged so that the internal electrode layer is parallel to the magnetic field of the magnet of the bottom. This saves you time and effort.

  Furthermore, in the resin embedding container of the present invention, it is preferable that the placement surface is a flat surface, and the magnetization direction of the magnet and the placement surface are orthogonal to each other.

  In this case, in the structure in which the electronic component is embedded in the resin, the facing surface facing the mounting surface and the internal electrode layer included in the electronic component are perpendicular to each other. For this reason, in order to take out such a structure from the resin embedding container and make the internal electrode layer of the electronic component perpendicular to the opposing surface, it is not necessary to consider the angle between the internal electrode layer and the opposing surface. Therefore, when exposing the inside of an electronic component, the exposure operation can be performed efficiently.

  In particular, when a plurality of electronic components are placed on the placement surface, the internal electrode layers of all the electronic components can be easily arranged in a direction perpendicular to the placement surface. For this reason, the internal electrode layer in all the electronic components can be arranged in a direction perpendicular to the facing surface facing the mounting surface. For this reason, when the said opposing surface is grind | polished etc., the internal structure of all the electronic components can be exposed easily. For this reason, it is possible to obtain a structure that requires a small amount of polishing work for a structure in which a plurality of electronic components are embedded and that can be easily polished. Therefore, the manufacturing efficiency of the sample for observing the internal structure of the electronic component can be further improved.

  Furthermore, the resin-embedded container of the present invention preferably has a plurality of magnets at the bottom. When the bottom portion has a plurality of magnets, it is possible to save the trouble of preparing the magnets when the electronic component is placed on the placement surface. In addition, a plurality of electronic components can be arranged at positions corresponding to the plurality of magnets. For this reason, arrangement | positioning of an electronic component can be made according to the positional relationship of a some magnet.

  In addition, the method for producing a sample for observing the internal structure of an electronic component according to the present invention is a method for producing a sample for observing the internal structure of an electronic component having an internal electrode layer made of a ferromagnetic material, and the electronic component is placed thereon. A magnetic field penetrates the placement surface with respect to the bottom portion of the resin-embedded container having a bottom portion having a placement surface and a side wall portion provided on the bottom portion and extending in a direction away from a peripheral portion of the placement surface. A first step of placing a magnet; a second step of placing the electronic component on the placement surface; a third step of pouring resin into the resin-embedded container; and curing the resin to provide the electronic component Includes a fourth step of obtaining a structure embedded in the resin and a fifth step of exposing an internal electrode layer of the electronic component.

  According to the method for manufacturing a sample for observing the internal structure of an electronic component according to the present invention, an electron having an internal electrode layer made of a ferromagnetic material on a mounting surface on which a magnet is disposed so that a magnetic field penetrates the mounting surface at the bottom. When the component is placed, the electronic component can be easily placed at a position where the internal electrode layer is parallel to the magnetic field due to the interaction between the magnetic field generated by the magnet and the internal electrode layer made of a ferromagnetic material. Moreover, if the magnet is left so that the magnetic field penetrates the mounting surface at the bottom, the electronic component is fixed to the mounting surface by the attractive force of the magnet. The state can be maintained as it is. Then, by curing the poured resin, a structure in which an electronic component is embedded in the resin can be easily obtained.

  Since the structure obtained in this way is larger than the electronic component, the cross-section can be exposed more easily than when the electronic component itself is polished to expose the cross-section, and the internal structure of the electronic component is observed. The production efficiency of the sample for use can be sufficiently improved.

  In addition, the method for producing a sample for observing the internal structure of an electronic component according to the present invention is a method for producing a sample for observing the internal structure of an electronic component having an internal electrode layer made of a ferromagnetic material, and the electronic component is placed thereon. A bottom portion having a mounting surface and a side wall portion provided on the bottom portion and extending in a direction away from the peripheral edge portion of the mounting surface, and the bottom portion of the resin-embedded container in which the bottom portion and the side wall portion are separable On the other hand, a first step of arranging a magnet so that a magnetic field penetrates the mounting surface, a second step of mounting the electronic component on the mounting surface, and attaching the side wall portion to the bottom portion A third step of configuring the resin embedding container, a fourth step of pouring resin into the resin embedding container, a fifth step of curing the resin and obtaining a structure in which the electronic component is embedded, Expose internal electrode layers of electronic components Characterized in that it comprises a sixth step of.

  According to the method for manufacturing a sample for observing the internal structure of an electronic component according to the present invention, an electron having an internal electrode layer made of a ferromagnetic material on a mounting surface on which a magnet is disposed so that a magnetic field penetrates the mounting surface at the bottom. When the component is placed, the electronic component can be easily placed at a position where the internal electrode layer is parallel to the magnetic field due to the interaction between the magnetic field generated by the magnet and the internal electrode layer made of a ferromagnetic material. Moreover, if the magnet is left so that the magnetic field penetrates the mounting surface at the bottom, the electronic component is fixed to the mounting surface by the attractive force of the magnet. The state can be maintained as it is. Then, by curing the poured resin, a structure in which an electronic component is embedded in the resin can be easily obtained. Furthermore, in the second step of placing the electronic component on the placement surface, the position and orientation of the electronic component may be adjusted as necessary. In such a case, when the work is performed without attaching the side wall part, the side wall part does not interfere with the work, as compared with the case where the resin embedded container in which the bottom part and the side wall part are integrated is used. , Work can be done more efficiently.

  Since the structure obtained in this way is larger than the electronic component, the cross-section can be exposed more easily than when the electronic component itself is polished to expose the cross-section, and the internal structure of the electronic component is observed. The production efficiency of the sample for use can be sufficiently improved.

  In the method for producing a sample for observing the internal structure of an electronic component according to the present invention, it is preferable that the magnet is arranged so that the placement surface and the magnetic field direction are orthogonal to each other in the first step.

  In this case, in the structure in which the electronic component is embedded in the resin, the facing surface facing the mounting surface and the internal electrode layer included in the electronic component are perpendicular to each other. For this reason, in order to take out such a structure from the resin embedding container and make the internal electrode layer of the electronic component perpendicular to the opposing surface, it is not necessary to consider the angle between the internal electrode layer and the opposing surface. Therefore, when exposing the inside of an electronic component, the exposure operation can be performed efficiently.

  In addition, the method for producing a sample for observing the internal structure of an electronic component according to the present invention is a method for producing a sample for observing the internal structure of an electronic component having an internal electrode layer made of a ferromagnetic material, and the electronic component is placed thereon. The electronic component on the mounting surface with respect to the bottom portion of the resin-embedded container comprising a mounting surface and a bottom portion having a magnet and a side wall portion provided on the bottom portion and extending in a direction away from a peripheral edge portion of the mounting surface. A second step of pouring a resin into the resin embedding container, a third step of curing the resin and obtaining a structure in which the electronic component is embedded in the resin, And a fourth step of exposing the internal electrode layer of the electronic component.

  According to the method for manufacturing a sample for observing the internal structure of an electronic component of the present invention, since the bottom of the resin-embedded container has a magnet, an electronic component having an internal electrode layer made of a ferromagnetic material on the mounting surface is provided. When placed, the electronic component can be easily arranged at a position where the internal electrode layer is parallel to the magnetic field due to the interaction between the magnetic field generated by the magnet and the internal electrode layer made of a ferromagnetic material. Moreover, since the electronic component is fixed to the mounting surface by the magnetic attraction of the magnet, the arrangement state of the electronic component can be maintained as it is even if resin is poured into the side wall portion. Then, by curing the poured resin, a structure in which an electronic component is embedded in the resin can be easily obtained. If a resin-embedded container having a magnet at the bottom is used, the electronic parts are arranged at a position where the internal electrode layer is parallel to the magnetic field of the magnet at the bottom. Can be omitted.

  Since the structure obtained in this way is larger than the electronic component, the cross-section can be exposed more easily than when the electronic component itself is polished to expose the cross-section, and the internal structure of the electronic component is observed. The production efficiency of the sample for use can be sufficiently improved.

  Further, the method for producing a sample for observing the internal structure of an electronic component according to the present invention is a method for producing a sample for observing the internal structure of an electronic component having an internal electrode layer made of a ferromagnetic material,

  A front surface for placing the electronic component, a bottom portion having a magnet, and a side wall portion provided on the bottom portion and extending in a direction away from a peripheral edge portion of the placement surface, with respect to the bottom portion of the resin-embedded container, A first step of placing the electronic component on the mounting surface; a second step of configuring the resin embedding container by attaching the side wall portion to the bottom; and a third step of pouring resin into the resin embedding container And a fourth step of curing the resin to obtain a structure in which the electronic component is embedded in the resin, and a fifth step of exposing an internal electrode layer of the electronic component.

  According to the method for manufacturing a sample for observing the internal structure of an electronic component of the present invention, since the bottom of the resin-embedded container has a magnet, an electronic component having an internal electrode layer made of a ferromagnetic material on the mounting surface is provided. When placed, the electronic component can be easily arranged at a position where the internal electrode layer is parallel to the magnetic field due to the interaction between the magnetic field generated by the magnet and the internal electrode layer made of a ferromagnetic material. Moreover, since the electronic component is fixed to the mounting surface by the magnetic attraction of the magnet, the arrangement state of the electronic component can be maintained as it is even if resin is poured into the side wall portion. Then, by curing the poured resin, a structure in which an electronic component is embedded in the resin can be easily obtained. If a resin-embedded container having a magnet at the bottom is used, the electronic parts are arranged at a position where the internal electrode layer is parallel to the magnetic field of the magnet at the bottom. Can be omitted. Further, in the first step of placing the electronic component on the placement surface, the position and orientation of the electronic component may be adjusted as necessary. In such a case, when the work is performed without attaching the side wall part, the side wall part does not interfere with the work, as compared with the case where the resin embedded container in which the bottom part and the side wall part are integrated is used. , Work can be done more efficiently.

  In the method for manufacturing a sample for observing the internal structure of an electronic component according to the present invention, it is preferable that a plurality of the magnets are arranged in the first step. In this case, a plurality of electronic components can be arranged at positions corresponding to the plurality of magnets. Therefore, the arrangement of the electronic components can be freely determined by changing the positional relationship between the plurality of magnets.

  According to the resin embedding container and the method for producing the internal structure observation sample of the electronic component using the same according to the present invention, the production efficiency of the internal structure observation sample of the electronic component can be sufficiently improved.

  Hereinafter, preferred embodiments of the present invention will be described in detail with reference to the drawings. In the following description, the same or corresponding parts are denoted by the same reference numerals, and redundant description is omitted.

(First embodiment)
First, a first embodiment of a method for manufacturing a sample for observing the internal structure of an electronic component according to the present invention will be described.

  First, prior to the description of the method for manufacturing the internal structure observation sample, the resin-embedded container used in the method for manufacturing the internal structure observation sample will be described with reference to FIG. FIG. 1 is a cross-sectional view showing an example of a resin-embedded container used in the first embodiment of the method for manufacturing a sample for observing the internal structure of an electronic component according to the present invention. As shown in FIG. 1, the resin embedding container 1 includes a bottom portion 2 and a side wall portion 3 provided integrally with the bottom portion 2. The bottom 2 has a mounting surface 2a for mounting electronic components, and the side wall 3 extends in a direction away from the peripheral edge of the mounting surface 2a of the bottom 2. In other words, the side wall portion 3 has a substantially cylindrical shape, and is provided on the bottom portion 2 so as to surround the placement surface 2a. Further, the bottom 2 has a flat bottom surface 2b on the side opposite to the mounting surface 2a, and the mounting surface 2a is also a flat surface. The placement surface 2a and the bottom surface 2b are parallel to each other.

  Further, the inner wall surface 3a of the side wall portion 3 is tapered, that is, the inner diameter of the side wall portion 3 increases as the distance from the peripheral portion of the mounting surface 2a increases. The reason why the inner wall surface 3a of the side wall portion 3 is tapered as described above is that the structure in which the electronic component is embedded in the resin can be easily taken out from the resin embedding container 1 after the resin is cured. .

  The material constituting the resin embedding container 1 is not particularly limited as long as it is a material capable of penetrating a magnetic field. As such a material, for example, polytetrafluoroethylene, polyethylene, silicone resin or the like can be used. Among these, from the viewpoint of easily taking out a structure including an electronic component and a resin described later from the resin embedding container 1, polytetrafluoroethylene and silicone resin are preferable. Among these, a silicone resin is more preferable. In this case, by deforming the container 1, the structure including the electronic component and the resin can be easily taken out from the resin embedding container 1.

  Next, an electronic component that is an object for observing the internal structure will be described. Here, a case where the electronic component is a chip capacitor having a substantially regular quadrangular prism shape will be described as an example.

  As shown in FIG. 2, the electronic component 7 includes a regular quadrangular columnar main body 100 and terminal electrode portions 101 a and 101 b provided at both ends of the main body 100, respectively. The main body 100 includes a plurality of internal electrode layers 7a and 7b and a dielectric 7c that surrounds the internal electrode layers 7a and 7b. In the main body 100, the plurality of internal electrode layers 7a and 7b include They are arranged in parallel and alternately. The internal electrode layer 7a is electrically connected to the terminal electrode portion 101a, and the internal electrode layer 7b is electrically connected to the terminal electrode portion 101b. As shown in FIG. 3, the main body 100 includes an electrode vertical surface 100a perpendicular to the internal electrode layers 7a and 7b and an electrode parallel surface 100b parallel to the internal electrode layers 7a and 7b.

  Next, a method for manufacturing the internal structure observation sample 10 using the resin embedding container 1 and the electronic component 7 will be described in detail.

  First, a disk-shaped magnet 4 is prepared and fixed on a fixed base (not shown). Here, the magnet 4 has a flat N-pole surface 4a on which the resin-embedded container 1 is placed, and generates a magnetic field H outward of the magnet so as to penetrate the N-pole surface 4a.

  Next, as shown in FIG. 4, the resin embedding container 1 is placed on the magnet 4 and the magnet 4 is arranged on the bottom 2 of the resin embedding container 1 (first step). Specifically, the resin embedding container 1 is placed on the magnet 4 so that the bottom surface 2b of the bottom portion 2 faces the N-pole surface 4a. Thereby, the magnetic field H by the magnet 4 will penetrate the mounting surface 2a. Note that the S pole surface of the magnet 4 may face the bottom 2b.

  Next, the above-described electronic component 7 is placed on the placement surface 2a (second step). The electronic component 7 can be placed, for example, with a finger or tweezers.

  Subsequently, the resin 8 is poured into the side wall 3 of the resin embedding container 1 (third step). At this time, when the resin 8 is poured, the resin 8 is poured in a state where the viscosity is lowered, or a low viscosity resin 8 is poured. When the viscosity of the resin 8 is decreased, the resin 8 may be heated as necessary. As the resin 8 to be poured at this time, for example, an epoxy resin, an acrylic resin, a phenol resin, a polyester resin, a diallyl phthalate resin, or the like can be used. Among these, it is preferable to use an acrylic resin or an epoxy resin because it is excellent in transparency, has a small shrinkage at the time of curing, and facilitates a polishing operation described later.

  After pouring the resin 8 into the side wall 3 of the resin embedding container 1 in this way, the resin 8 is cured by drying or heating. Thus, a structure 9 in which the electronic component 7 is embedded in the resin 8 is obtained (fourth step).

  After the resin 8 is cured, the structure 9 is taken out from the resin embedding container 1. In order to prevent bubbles from entering the structure 9, it is preferable that the resin-embedded container 1 is placed in the vacuum container after the resin is poured into the side wall portion 3 and the resin is vacuum deaerated.

  Next, the first planned polishing surface 9a of the obtained structure 9 (see FIG. 5) is polished. The first polishing planned surface 9a is a surface having the electronic component 7 directly below. Thus, the cross section including the internal electrode layers 7a and 7b in the electronic component 7 is exposed (fifth step). At this time, the cross section of the electronic component 7 is a cross section in which a dielectric (for example, a ceramic layer) including the internal electrode layers 7a and 7b and the internal electrode layers 7a and 7b can be observed simultaneously. Hereinafter, a surface including a cross section of the electronic component 7 is referred to as an “observed surface”.

  Further, the second polishing scheduled surface 9b opposite to the surface to be observed 8a is also polished. At this time, the second scheduled polishing surface 9b is polished so that the surface exposed by polishing becomes a surface 8b parallel to the surface 8a to be observed.

  Further, according to the method for manufacturing the sample for observing the internal structure of the electronic component of the present embodiment, in the step of mounting the electronic component 7 on the mounting surface 2 a of the resin embedding container 1, the magnetic field H is the mounting surface of the bottom 2. Since it penetrates 2a, the electronic component 7 can be fixed to the mounting surface 2a by the attractive force of the magnet 4. For this reason, even if resin is poured into the side wall part 3, the arrangement state of the electronic component 7 can be maintained as it is.

  Furthermore, according to the manufacturing method of the sample for observing the internal structure of the electronic component of the present embodiment, the electronic component 7 can be embedded in the resin, so that a structure 9 larger than the electronic component 7 can be obtained. For this reason, when the structure 9 is polished, it is easier to expose the cross section than when the electronic component 7 itself is polished to expose the cross section.

  Furthermore, when the surface to be observed 8a and the surface 8b are made parallel, when the sample 10 is observed with a microscope, even if the sample 10 is moved under the microscope, the focus can be readjusted, and the work efficiency can be improved. To do. In this way, the sample 10 for observing the internal structure of the electronic component is obtained.

(Second Embodiment)
Next, a second embodiment of the method for manufacturing a sample for observing the internal structure of an electronic component according to the present invention will be described with reference to FIG.

  FIG. 7 is a cross-sectional view showing a second embodiment of a resin-embedded container used in the method for manufacturing a sample for observing the internal structure of an electronic component according to the present invention. As shown in FIG. 7, the resin embedding container 15 of the present embodiment is a first embodiment in which the bottom 2 and the side wall 4 are integrated in that the bottom 2 and the side wall 3 are separable. It differs from the resin embedding container 1 of the form.

  In the method for manufacturing the sample for observing the internal structure of the electronic component 7 according to the present embodiment, when the electronic component 7 is placed on the placement surface 2a, the electronic component 7 is integrated with the bottom 2 and the side wall 3 integrated. Is different from the manufacturing method of the first embodiment in that the bottom portion 2 is separated from the resin embedding container 15 and the electronic component 7 is placed using the bottom portion 2. And in this embodiment, after placing the electronic component 7 on the placement surface 2a of the bottom portion 2 and before pouring the resin, the side wall portion 3 is attached to the bottom portion to form the resin embedding container 15. This is different from the manufacturing method of one embodiment.

  When the electronic component 7 is placed on the placement surface 2a, the position and orientation of the electronic component 7 may be adjusted as necessary. In such a case, according to the manufacturing method of the present embodiment, when the electronic component 7 is placed on the placement surface 2a of the bottom portion 2, the operation is performed without the side wall portion 3 being attached. Therefore, the work can be performed more efficiently without hindering the work. Further, since the bottom portion 2 and the side wall portion 3 can be separated in the resin embedding container 15, if the bottom portion 2 is separated after the resin is cured, the structure 9 in which the electronic component 7 is embedded in the resin from the side wall portion 3 can be obtained. It becomes easy to take out.

(Third embodiment)
Next, a third embodiment of the method for manufacturing a sample for observing the internal structure of an electronic component according to the present invention will be described with reference to FIG.

  FIG. 8 is a cross-sectional view showing an example of a resin embedding container used in the method for producing a sample for observing the internal structure of an electronic component according to the present invention.

  As shown in FIG. 8, the resin embedding container 20 of the present embodiment is different from the resin embedding container 1 of the first embodiment in that the center part of the bottom 2 is a magnet 4. Such a resin embedding container 20 can be obtained by fitting the magnet 4 into the opening of the substantially cylindrical side wall 3.

  The manufacturing method of the present embodiment is different from the manufacturing method of the first embodiment in that the resin embedding container 20 is used as the resin embedding container. According to the manufacturing method of the present embodiment, since the resin-embedded container 20 is used, it is not necessary to separately prepare a magnet when manufacturing a sample for observing the internal structure of an electronic component. Therefore, the operation of placing the electronic component on the placement surface 2a of the resin embedding container 20 can be performed efficiently.

  Moreover, in the resin embedding container 20, the mounting surface 2a is a flat surface, and the direction of magnetization by the magnet 4 is orthogonal to the mounting surface 2a. Therefore, in the structure 9 in which the electronic component 7 is embedded in the resin, the first polishing planned surface 9a and the internal electrode layers 7a and 7b included in the electronic component 7 are perpendicular to each other. Therefore, in order to take out the structure 9 from the resin embedding container 20 so that the internal electrode layers 7a and 7b of the electronic component 7 are perpendicular to the first scheduled polishing surface 9a, the internal electrode layers 7a and 7b It is not necessary to consider the angle with the surface 1a to be polished. Therefore, when the inside of the electronic component 7 is exposed, the exposure work can be performed efficiently.

  In particular, when a plurality of electronic components are placed on the placement surface 2a, the internal electrode layers 7a and 7b of all the electronic components 7 can be easily placed in a direction perpendicular to the placement surface 2a. For this reason, the internal electrode layers 7a and 7b in all the electronic components 7 can be arranged in a direction perpendicular to the first polishing planned surface 9a. For this reason, when the 1st grinding | polishing scheduled surface 9a is grind | polished, the internal structure of all the electronic components 7 can be exposed easily. Therefore, it is possible to obtain the structure 9 in which the amount of work for polishing the structure 9 in which the plurality of electronic components 7 are embedded is small and the polishing work is easy. Therefore, the manufacturing efficiency of the sample 10 for observing the internal structure of the electronic component can be further improved.

(Fourth embodiment)
Next, a fourth embodiment of a method for manufacturing a sample for observing the internal structure of an electronic component according to the present invention will be described with reference to FIG.
FIG. 9 is a cross-sectional view showing an example of a resin embedding container used in the method for producing a sample for observing the internal structure of an electronic component according to the present invention. As shown in FIG. 9, the resin-embedded container 30 of the present embodiment has an accommodation recess 31 in which the bottom portion 2 accommodates the magnet 4, and the magnet 4 is fitted in the accommodation recess 31. It is different from the resin embedding container 1.

  The manufacturing method of the present embodiment is different from the manufacturing method of the first embodiment in that the resin embedding container 30 is used as the resin embedding container. According to the manufacturing method of the present embodiment, since the resin-embedded container 30 is used, it is not necessary to separately prepare a magnet when manufacturing the internal structure observation sample of the electronic component 7. Therefore, the work of placing the electronic component on the placement surface 2a of the resin embedding container 30 can be performed efficiently.

  Also in the resin embedding container 30, the placement surface 2a is a flat surface, and the direction of magnetization by the magnet 4 is orthogonal to the placement surface 2a. Therefore, in the structure 9 in which the electronic component 7 is embedded in the resin, the first polishing planned surface 9a and the internal electrode layers 7a and 7b included in the electronic component 7 are perpendicular to each other. Therefore, in order to take out the structure 9 from the resin embedding container 30 so that the internal electrode layers 7a and 7b of the electronic component 7 are perpendicular to the first scheduled polishing surface 9a, the internal electrode layers 7a and 7b It is not necessary to consider the angle with the surface 1a to be polished. Therefore, when the inside of the electronic component 7 is exposed, the exposure work can be performed efficiently.

  In particular, when a plurality of electronic components are placed on the placement surface 2a, the internal electrode layers 7a and 7b of all the electronic components 7 can be easily placed in a direction perpendicular to the placement surface 2a. For this reason, the internal electrode layers 7a and 7b in all the electronic components 7 can be arranged in a direction perpendicular to the first polishing planned surface 9a. For this reason, when the 1st grinding | polishing scheduled surface 9a is grind | polished, the internal structure of all the electronic components 7 can be exposed easily. Therefore, it is possible to obtain the structure 9 in which the amount of work for polishing the structure 9 in which the plurality of electronic components 7 are embedded is small and the polishing work is easy. Therefore, the manufacturing efficiency of the sample 10 for observing the internal structure of the electronic component can be further improved.

  The manufacturing method of the sample for observing the internal structure of the electronic component according to the present invention is not limited to the first to fourth embodiments. For example, in the resin embedding container used in the first to fourth embodiments, the side wall portion 3 has a substantially cylindrical shape, but is not necessarily limited to a substantially cylindrical shape, and has, for example, an elliptical cylindrical shape or a substantially rectangular cylindrical shape. Also good. Moreover, although the resin embedding container used in the above embodiment has the inner wall surface 3a of the side wall portion 3 tapered, if the structure can be easily taken out from the resin embedding container, it is not necessarily tapered. There is no need.

  In addition, the shape of the electronic component embedded in the resin using the resin embedding container of the present invention may be other than a substantially square prism shape, and may be a cylindrical shape, an elliptic sphere shape, a substantially spherical shape, or the like. .

  Furthermore, in the first to fourth embodiments, the chip capacitor is used as the electronic component. However, the resin embedding container of the present invention can be applied to resin embedding of an electronic component having an internal electrode layer made of a ferromagnetic material. It is. Therefore, the present invention is also applicable to electronic parts such as varistors and PTC thermistors.

  Furthermore, in the first embodiment, as shown in FIG. 4, the resin embedding container 1 is placed on one magnet 4 before placing the electronic component 7, but in the manufacturing method of the present invention, As shown in FIG. 10, one resin embedding container 1 may be disposed on the plurality of magnets 4. In this case, a plurality of electronic components 7 can be arranged at positions corresponding to each of the plurality of magnets 4. Therefore, the arrangement of the electronic components 7 can be freely determined by changing the positional relationship between the plurality of magnets 4.

  Furthermore, in the said 4th Embodiment, as shown in FIG. 9, although the one magnet 4 is accommodated in the accommodation recessed part 31 in the resin embedding container 30, the number of the magnets 4 is not limited to one. . For example, a plurality of housing recesses 31 may be provided in the bottom portion 2 so that the magnets 4 are housed in the housing recesses 31. That is, the bottom 2 may have a plurality of magnets 4. Also in this case, the trouble of preparing the magnet 4 when the electronic component 7 is placed on the placement surface 2a can be saved. In addition, since the plurality of electronic components 7 can be arranged at positions corresponding to the plurality of magnets 4, the arrangement of the electronic components 7 can be made according to the positional relationship of the plurality of magnets 4. .

  In the first to fourth embodiments, the structure is polished after the structure is taken out from the resin embedding container or the side wall, but the structure is not taken out from the resin embedding container or the side wall. You may grind | polish in the state which accommodated the structure in the container.

It is sectional drawing which shows an example of the resin embedding container used for 1st Embodiment of the manufacturing method of the sample for internal structure observation of the electronic component which concerns on this invention. It is a top view of the electronic component used for 1st Embodiment of the manufacturing method of the sample for internal structure observation of the electronic component which concerns on this invention. It is sectional drawing along the III-III line of FIG. It is sectional drawing which shows the state which mounted the electronic component used for 1st Embodiment of the manufacturing method of the sample for internal structure observation of the electronic component which concerns on this invention in the resin embedding container of FIG. It is sectional drawing which shows the structure obtained using the resin embedding container of FIG. It is a perspective view of the sample for internal structure observation produced with the manufacturing method of the sample for internal structure observation of the electronic component which concerns on this invention. It is sectional drawing which shows an example of the resin embedding container used for 2nd Embodiment of the manufacturing method of the sample for internal structure observation of the electronic component which concerns on this invention. It is sectional drawing which shows an example of the resin embedding container used for 3rd Embodiment of the manufacturing method of the sample for internal structure observation of the electronic component which concerns on this invention. It is sectional drawing which shows an example of the resin embedding container used for 4th Embodiment of the manufacturing method of the sample for internal structure observation of the electronic component which concerns on this invention. It is sectional drawing which shows the deformation | transformation aspect of the 1st process in 1st Embodiment of the manufacturing method of the sample for internal structure observation of the electronic component which concerns on this invention.

Explanation of symbols

DESCRIPTION OF SYMBOLS 1 ... Resin embedding container, 2 ... Bottom part, 2a ... Mounting surface, 3 ... Side wall part, 4 ... Magnet, 7 ... Electronic component, 7a ... Internal electrode layer, 8 ... Resin, 9 ... Structure, 10 ... Electronic component Sample for internal structure observation, H: Magnetic field.

Claims (9)

A resin embedding container used for embedding an electronic component having an internal electrode layer made of a ferromagnetic material in a resin,
A bottom portion having a mounting surface for mounting the electronic component;
A resin-embedded container, comprising: a side wall provided on the bottom and extending in a direction away from the peripheral edge of the placement surface, the bottom having a magnet.   The resin embedding container according to claim 1, wherein the placement surface is a flat surface, and the magnetization direction of the magnet and the placement surface are orthogonal to each other.   The resin embedding container according to claim 1, wherein the bottom portion includes a plurality of magnets. A method of manufacturing a sample for observing the internal structure of an electronic component having an internal electrode layer made of a ferromagnetic material,
A magnetic field is applied to the bottom portion of the resin-embedded container including a bottom portion having a placement surface on which the electronic component is placed and a side wall portion provided on the bottom portion and extending in a direction away from the peripheral portion of the placement surface. A first step of arranging a magnet so as to penetrate the mounting surface;
A second step of placing the electronic component on the placement surface;
A third step of pouring the resin into the resin embedding container;
A fourth step of curing the resin to obtain a structure in which the electronic component is embedded in the resin;
And a fifth step of exposing the internal electrode layer of the electronic component. A method for producing a sample for observing the internal structure of an electronic component. A method of manufacturing a sample for observing the internal structure of an electronic component having an internal electrode layer made of a ferromagnetic material,
A bottom portion having a placement surface on which the electronic component is placed and a side wall portion provided in the bottom portion and extending in a direction away from the peripheral edge portion of the placement surface, the bottom portion and the side wall portion being separable. A first step of arranging a magnet so that a magnetic field penetrates the mounting surface, with respect to the bottom portion separated from the resin embedding container;
A second step of placing the electronic component on the placement surface;
A third step of configuring the resin embedding container by attaching the side wall portion to the bottom portion;
A fourth step of pouring the resin into the resin embedding container;
A fifth step of curing the resin and obtaining a structure in which the electronic component is embedded;
And a sixth step of exposing the internal electrode layer of the electronic component. A method for producing a sample for observing the internal structure of an electronic component. In the first step,
6. The method for manufacturing a sample for observing an internal structure of an electronic component according to claim 4, wherein the magnet is arranged so that the placement surface and the direction of the magnetic field are orthogonal to each other. A method of manufacturing a sample for observing the internal structure of an electronic component having an internal electrode layer made of a ferromagnetic material,
With respect to the bottom portion of the resin-embedded container provided with a placement surface on which the electronic component is placed, a bottom portion having a magnet, and a side wall portion provided on the bottom portion and extending in a direction away from a peripheral portion of the placement surface. A first step of placing the electronic component on a placement surface;
A second step of pouring the resin into the resin embedding container;
A third step of curing the resin to obtain a structure in which the electronic component is embedded in the resin;
And a fourth step of exposing the internal electrode layer of the electronic component. A method for producing a sample for observing the internal structure of an electronic component. A method of manufacturing a sample for observing the internal structure of an electronic component having an internal electrode layer made of a ferromagnetic material,
A front surface for placing the electronic component, a bottom portion having a magnet, and a side wall portion provided on the bottom portion and extending in a direction away from a peripheral edge portion of the placement surface, with respect to the bottom portion of the resin-embedded container, A first step of placing the electronic component on a placement surface;
A second step of configuring the resin embedding container by attaching the side wall to the bottom;
A third step of pouring the resin into the resin embedding container;
A fourth step of curing the resin to obtain a structure in which the electronic component is embedded in the resin;
And a fifth step of exposing the internal electrode layer of the electronic component. A method for producing a sample for observing the internal structure of an electronic component. In the first step,
The method for producing a sample for observing the internal structure of an electronic component according to any one of claims 4 to 6, wherein a plurality of the magnets are arranged.

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