JP2006156873A - Resin film and method of manufacturing semiconductor module using the same - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a resin film for sealing a thinned solar cell, without breaking or the like of the same, and to provide a method of manufacturing a semiconductor module that uses the same. <P>SOLUTION: A light receiving side sheet 4 made of EVA resin is placed on a front cover 2. A spacer 12 of a given dimension is placed on a light-receiving side sheet 2. Then, solar cells 6 which are electrically connected with each other via an interconnector 7 are placed on the light-receiving side sheet 2. Then, a backside sheet 8 made of EVA resin is placed to cover the solar cells 6. Then, a back cover 10 is placed on the backside sheet 8. Then, a laminate device 14 applies pressure and heat to and dissolves the light-receiving side sheet 4 and backside sheet 8, which sandwich the solar cells 6 therebetween, thus sealing the solar cells 6 in an EVA resin 9. <P>COPYRIGHT: (C)2006,JPO&NCIPI

Description

  The present invention relates to a resin film and a method for manufacturing a semiconductor module using the same, and more particularly to a resin film for sealing solar cells and a method for manufacturing a semiconductor module using the resin film.

  In the solar cell module, a super straight type module that uses glass that has a high transmittance for sunlight as a transparent cover and that is relatively excellent in mechanical strength, and a substrate type that uses a resin film instead of glass. Modules are mainstream. In recent years, with the expansion of the solar cell market, thinning of crystalline silicon solar cells as solar cells has been promoted from the viewpoint of cost reduction and reduction of raw materials. The solar battery module is manufactured by sandwiching the solar battery cell in a predetermined adhesive resin sheet, and applying a pressure treatment to seal the solar battery module.

  A specific method for manufacturing such a conventional solar cell module will be described. First, as shown in FIG. 11, a light receiving surface side sheet 104 made of EVA (Etylene Vinyl Acetate) resin is placed on the front cover 102. The solar battery cell 106 is placed on the light receiving surface side sheet 104. The solar cells 106 are electrically connected to each other by an interconnector (not shown). A back surface side sheet 108 made of EVA resin is placed on the light receiving surface side sheet 104 so as to cover the solar battery cell 106. A back cover 110 is placed on the back sheet 108.

Next, as shown in FIG. 12, the solar cell is sandwiched between the light-receiving surface side sheet 104 and the back surface side sheet 108, and a predetermined laminating apparatus (not shown) is used above the back cover 110. Then, a pressure treatment is applied to perform a heating process (lamination process). As a result, as shown in FIG. 13, the EVA resin is dissolved between the front cover 102 and the back cover 110, and the solar battery cells 106 are sealed with the EVA resin 109. In this way, the solar cell module 101 is manufactured. Note that Patent Document 1 is an example of a document disclosing such a manufacturing method.
Japanese Utility Model Publication No. 63-51471

  However, the conventional manufacturing method has the following problems. In order to increase the yield of the solar cell module, it is required that the solar cell is not damaged during processing. However, as described above, since the solar cell 106 is being made thinner, the pressure is directly applied to the solar cell 106 particularly in the laminating step of sealing the solar cell 106 by applying pressure. The solar battery cell 106 may break due to the action. Therefore, it became one of the factors that hindered the yield improvement of the solar cell module.

  The present invention has been made to solve the above problems, and one object is to provide a resin film for sealing a thinned solar battery cell without damaging it. An object of the present invention is to provide a method for manufacturing a semiconductor module using such a resin film.

  A resin film according to the present invention is a resin film disposed between a light-transmitting first insulating substrate and a second insulating substrate for sealing a plurality of predetermined semiconductor elements, the first film A member, a second film member, and a spacer are provided. The first film member and the second film member sandwich the semiconductor element from one side and the other side, respectively. The spacer is disposed between the first film member and the second film member, and is positioned between the semiconductor element and the semiconductor element.

  According to this configuration, when the semiconductor element is sealed with the resin, pressure is applied in a state where the spacer is interposed between the first film member and the second film member. As a result, the pressure acting on the first film member or the second film member is first received by the spacer, and it is reduced that this pressure acts directly on the semiconductor element. As a result, the semiconductor element can be sealed while suppressing cracking or breakage of the semiconductor element as compared with the case where there is no such spacer and pressure acts directly on the semiconductor element.

  In order to prevent the pressure acting on the first film member or the second film member from directly acting on the semiconductor element, the spacer preferably has a thickness corresponding to at least the thickness of the semiconductor element.

  The spacer is preferably made of the same material as either the first film member or the second film member.

  Further, in order to simplify the manufacturing process, the spacer is bonded to either the first film member or the second film member, or is integrated with either the first film member or the second film member. It is preferable that

  And it is preferable that a solar cell is sealed as a semiconductor element, and in this case, a semiconductor module is manufactured without breaking or damaging the thinned solar cell in order to reduce the weight. can do.

  Further, in the case of a solar battery cell, in order to prevent the interconnector that electrically connects the solar battery cells from coming into contact with the spacer, a notch is provided at a portion of the spacer that intersects the interconnector. It is preferable.

  A manufacturing method of a semiconductor module according to the present invention is a manufacturing method of a semiconductor module in which a predetermined plurality of semiconductor elements are sealed between a light-transmitting first insulating substrate and a second insulating substrate, and the following steps are performed. I have. A first film member is placed on the first insulating substrate. A plurality of semiconductor elements are respectively disposed at predetermined positions on the first film member. A spacer is disposed at a position corresponding to between adjacent semiconductor elements. A second film member is placed on the first film member so as to cover the semiconductor element. A second insulating substrate is placed on the second film member. The first film member and the second film member are dissolved by pressurizing and heating in a state where the first film member, the spacer and the second film member are sandwiched between the first insulating substrate and the second insulating substrate. And sealing the semiconductor element.

  According to this manufacturing method, when the semiconductor element is sealed between the first film member and the second film member, the pressure is applied with the spacer interposed between the first film member and the second film member. Is applied, the pressure acting on the first film member or the second film member is first received by the spacer, and the pressure acting on the semiconductor element is reduced. As a result, the semiconductor element can be prevented from being broken or damaged.

  The step of disposing the spacer is performed by adhering the spacer in advance to either the first film member or the second film member in order to simplify the process, or the first film member and the second film member. Preferably, the film member is formed by applying a member in which a spacer is integrally formed in advance to either the first fill member or the second film member.

  In the case where a solar cell is sealed as a semiconductor element, a semiconductor module can be manufactured without breaking or damaging the thinned solar cell in order to reduce the weight.

  The manufacturing method of the solar cell module which concerns on embodiment of this invention is demonstrated. First, as shown in FIG. 1, a light receiving surface side sheet 4 made of EVA resin is placed on a translucent front cover 2. For example, in this case, the surface of the light receiving surface side sheet 4 on the side where the solar cells are placed, as described later, is a grid or a “field” having a predetermined dimension based on the size of the solar cells. The spacers 12 are arranged in a shape. In the spacer 12, a recess 12 a as a cut portion is formed at a portion intersecting with the interconnector that electrically connects the solar cells to prevent interference with the interconnector.

  Next, as shown in FIG. 2, the solar cells 6 electrically connected to each other by the interconnector 7 are placed on the light receiving surface side sheet 2 partitioned by the spacers 12. The dimension of one side of one solar battery cell 6 is, for example, 125 mm, and the thickness is about 200 μm. Moreover, the space | interval of the adjacent photovoltaic cell 6 shall be about 10 mm, for example. Based on the dimensional relationship of the solar battery cell 6, the width of the spacer 12 is, for example, about 7 mm. Moreover, the thickness of the spacer 12 is larger than the thickness of the solar battery cell 6, for example, about 0.4 mm.

  Next, as shown in FIG. 3, a back side sheet 8 made of EVA resin is placed on the light receiving side sheet 4 so as to cover the placed solar cells 6, and as shown in FIG. 4, The solar battery cell 6 is sandwiched in a gap (space) formed by interposing the spacer 12 between the light receiving surface side sheet 2 and the back surface side sheet 8. Next, as shown in FIG. 5, the insulating back cover 10 is placed on the back surface side sheet 8. Next, in order to dissolve the EVA resin and seal the solar battery cell 6, as shown in FIG. 6, the light-receiving surface side sheet 4 and the back surface side sheet 8 sandwiching the solar battery cell 6 are provided in a predetermined laminating apparatus. 14 and placed on the stage 14a.

  Next, the press part 14b provided in the upper part of the laminating apparatus 14 descend | falls, for example, pressure is applied to the light-receiving surface side sheet | seat 4 and the back surface side sheet | seat 8 which pinched | interposed the photovoltaic cell 6 under the temperature of about 120 degreeC. . By being heated and applied with pressure, the light-receiving surface side sheet 4 and the back surface side sheet 8 are melted, and the solar cells 6 are sealed with the EVA resin 9 as shown in FIG. In this way, the solar cell module 1 is manufactured.

  In the solar cell module manufacturing method described above, when the solar cells 6 are sealed with EVA resin, pressure is applied in a state where the spacer 12 is interposed between the light receiving surface side sheet 2 and the back surface side sheet 8. . Thereby, the pressure which acts on the back surface side sheet | seat 8 will first be received directly by the spacer 12, and it will reduce that this pressure acts on the photovoltaic cell 6 directly. As a result, as compared with the case where there is no such spacer and the pressure directly acts on the solar battery cell, the solar battery cell 6 is prevented from being cracked or damaged, and the yield reduction of the solar battery module is prevented. Can do.

  In the above-described embodiment, the case where the spacer 12 is disposed on the light receiving surface side sheet 2 is described as an example of the spacer interposed between the light receiving surface side sheet 2 and the back surface side sheet 8. . The spacer 12 may have a form in which the spacer 12 is bonded in advance to the surface of the light receiving surface side sheet 2, or may have a form in which the spacer 12 is integrally formed on the light receiving surface side sheet 2. Alternatively, the spacer 12 may be provided not on the light receiving surface side sheet 2 but on the back surface side sheet 8. In this way, work efficiency can be improved.

  Further, as the pattern shape of the spacer 12, in addition to the lattice-shaped pattern shape shown in FIG. 1, for example, as shown in FIG. 8, a pattern shape excluding a portion where the spacer intersects in the lattice-shaped pattern shape. There may be a pattern that does not directly act on the solar battery cell 6 when the pressure is applied.

  Furthermore, in the part where the interconnector 7 and the spacer 12 intersect, in addition to the aspect in which the recess 12a is provided in the spacer 12, for example, as shown in FIG. It is good. In this case, as shown in FIG. 10, even when the solar battery cell 6 is sandwiched between the light receiving surface side sheet 4 and the back surface side sheet 8, the interconnector 7 can reliably contact the spacer 12. It disappears and it can contribute to suppression of the crack of the photovoltaic cell 6, etc.

  Further, in the above-described manufacturing method, the light receiving surface side sheet 4, the spacer 12, and the back surface side sheet 8 made of EVA resin are described as examples of the resin. However, the present invention is not limited to EVA resin, and solar cells are used. A resin that can be sealed can be used. Furthermore, although the solar cell was cited as an example of the semiconductor element, in addition to the solar cell, for example, a semiconductor memory formed on a relatively thin substrate, such as a diode, a memory capable of non-contact writing and reading, or Even when a semiconductor element such as a capacitor is sealed with resin, a series of resin films including the sheet and the spacer can be applied.

  The embodiment disclosed this time is merely an example, and the present invention is not limited to this. The present invention is defined by the terms of the claims, rather than the scope described above, and is intended to include any modifications within the scope and meaning equivalent to the terms of the claims.

It is a cross-sectional perspective view which shows 1 process of the manufacturing method of the solar cell module which concerns on embodiment of this invention. FIG. 2 is a cross-sectional perspective view showing a process performed after the process shown in FIG. 1 in the same embodiment. FIG. 3 is a cross-sectional perspective view showing a process performed after the process shown in FIG. 2 in the same embodiment. FIG. 4 is a cross-sectional perspective view showing a process performed after the process shown in FIG. 3 in the same embodiment. FIG. 5 is a cross-sectional perspective view showing a process performed after the process shown in FIG. 4 in the same embodiment. FIG. 6 is a cross-sectional view showing a step performed after the step shown in FIG. 5 in the same embodiment. FIG. 7 is a cross-sectional view showing a step performed after the step shown in FIG. 6 in the same embodiment. In the same embodiment, it is a section perspective view showing a modification of a spacer. In the embodiment, it is a cross-sectional perspective view showing another modified example of the spacer. FIG. 10 is a cross-sectional perspective view showing a state where solar cells are placed on the spacer shown in FIG. 9 in the same embodiment. It is a cross-sectional perspective view which shows 1 process of the manufacturing method of the conventional solar cell module. It is sectional drawing which shows the process performed after the process shown in FIG. It is sectional drawing which shows the process performed after the process shown in FIG.

Explanation of symbols

  DESCRIPTION OF SYMBOLS 1 Solar cell module, 2 Front cover, 4 Light-receiving surface side sheet, 6 Solar cell, 7 Interconnector, 8 Back surface sheet, 9 EVA resin, 10 Back cover, 12 Spacer, 12a Recessed part, 14 Laminating apparatus, 14a Stage part 14b Press part.

Claims (11)

A resin film disposed between a light-transmitting first insulating substrate and a second insulating substrate for sealing a plurality of predetermined semiconductor elements,
A first film member and a second film member for sandwiching the semiconductor element from one side and the other side,
A resin film comprising a spacer disposed between the first film member and the second film member and positioned between the semiconductor element and the semiconductor element.   The resin film according to claim 1, wherein the spacer has a thickness corresponding to at least a thickness of the semiconductor element.   The said spacer is a resin film of Claim 1 or 2 which consists of the same material as either of the said 1st film member and the said 2nd film member.   The resin film according to any one of claims 1 to 3, wherein the spacer is bonded to either the first film member or the second film member.   The resin film according to claim 1, wherein the spacer is integrated with either the first film member or the second film member.   The resin film in any one of Claims 1-5 by which a photovoltaic cell is sealed as the said semiconductor element.   The resin film according to claim 6, wherein a cut portion is provided at a portion of the spacer that intersects an interconnector that electrically connects the solar cells to each other. A method for manufacturing a semiconductor module in which a plurality of semiconductor elements are sealed between a translucent first insulating substrate and a second insulating substrate,
Placing the first film member on the translucent first insulating substrate;
Disposing a plurality of semiconductor elements at predetermined positions on the first film member;
Disposing a spacer at a corresponding position between the adjacent semiconductor element and the semiconductor element;
Placing a second film member on the first film member so as to cover the semiconductor element;
Placing a second insulating substrate on the second film member;
By pressurizing and heating the first film member, the spacer, and the second film member between the first insulating substrate and the second insulating substrate, the first film member and the second insulating substrate And a step of dissolving the second film member to seal the semiconductor element.   The method of manufacturing a semiconductor module according to claim 8, wherein the step of disposing the spacer is performed by adhering a spacer in advance to one of the first film member and the second film member.   In the step of arranging the spacer, as the first film member and the second film member, one in which a spacer is integrally formed in advance on either the first film member or the second film member is applied. The manufacturing method of the semiconductor module of Claim 9 performed by this.   The manufacturing method of the semiconductor module in any one of Claims 8-10 with which a photovoltaic cell is sealed as the said semiconductor element.

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