JP2006156835A - Bonding apparatus, and displaying method for bonded component - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a bonding apparatus and a displaying method for components to be bonded whereby an operator easily identifies a bonding starting chip and easily grasps the bonding situations of the whole of semiconductor wafers. <P>SOLUTION: In the displaying method, there are displayed such bonding situations on the whole of bonded components and individual components constituting components to be bonded which are displayed graphically on a displaying device, as the mapping information obtained from mapping-information acquiring means, the display of an unbonded chip or a bonded-off chip, the display of a chip having errors generated when bonding it, and the display of a bonding starting chip. <P>COPYRIGHT: (C)2006,JPO&NCIPI

Description

  The present invention relates to a bonding apparatus such as a bump bonder for forming a protruding electrode on a semiconductor wafer as a part to be bonded, and a method for displaying the part to be bonded, and in particular, displays mapping information of a semiconductor wafer, bonding results, and the like on a display apparatus. The present invention relates to a bonding apparatus and a method for displaying parts to be bonded.

  In order to form bumps on a semiconductor wafer composed of a large number of chips, bump bonders, which are bonding apparatuses using wires such as gold and copper, are used.

  A bump bonder as a bonding apparatus includes a bonding head unit placed on an XY table that can be controlled in a two-dimensional direction, a semiconductor wafer XY table on which a semiconductor wafer can be placed and moved in a two-dimensional direction, and a semiconductor wafer A transfer arm for transferring the wafer onto the semiconductor wafer XY table, a drive unit for driving the bonding head, the XY table, the semiconductor wafer XY table, a control unit for controlling the drive unit and the bump bonder, a CRT monitor, and the like. It has a display device. The bump bonder is disclosed in Patent Document 1.

  The conventional bump bonder first moves the XY table mounted with the camera to the first chip on the semiconductor wafer, detects the position of the chip in the bonding area, and then bonds the ball onto the chip by the bonding head unit. Form bumps. In the conventional bump bonder, an image obtained by imaging a chip of a semiconductor wafer with a camera and a chip number in the X and Y directions of the semiconductor wafer indicating the position of the chip to be bonded are displayed on a display device. The operator confirms the chip numbers in the X and Y directions of the semiconductor wafer displayed on the display device, and moves the XY table to the chip to be bonded.

  FIG. 7A is a diagram illustrating an example of a camera image of a semiconductor wafer displayed on a conventional bump bonder display device, and FIG. 7B is a diagram illustrating an appearance of the semiconductor wafer. As shown in FIG. 7A, the image of the chip 31 of the semiconductor wafer 30 captured by the camera is displayed on the display device, and the position of the chip 31 to start bonding or the chip 31 during bonding on the semiconductor wafer 30 is displayed. The chip numbers in the Y direction and the X direction are displayed at the lower left of the display device. The positions of the chips 31 on the semiconductor wafer 30 are managed by the chip numbers in the Y-axis and X-axis directions shown in FIG. 7B, and the chip numbers in the Y-direction are in order from the chip column in the top row of the semiconductor wafer 30. It has been decided. Further, the chip numbers in the X direction are determined in order from the chip 31 from the right end of the row in the Y direction of the semiconductor wafer 30. A chip 31 designated by a chip number 3 in the Y direction and a chip number 3 in the X direction shown in FIG. 7A is indicated by a black circle on the semiconductor wafer 30 shown in FIG. 7B.

JP-A-10-163214

  In the conventional bump bonder, the Y direction and X direction chip numbers indicating the positions of the chips on the semiconductor wafer are displayed on the display device. However, when the operator performs bonding, bonding is performed from the Y direction and X direction chip numbers. It was necessary to look for the chip to start. For this reason, the operation took time, and the work efficiency was reduced. In addition, the chip for bonding may be mistaken. If a wrong chip is used for starting bonding, a defective product may be generated, an error may occur during bonding, and the yield may decrease. Further, it is difficult to grasp the bonding state of the entire semiconductor wafer only with the camera image and the chip numbers in the Y and X directions.

  Therefore, the present invention provides the mapping information from the mapping information acquisition means, the display of whether the chip is unbonded or bonded, and the bonding at the time of bonding, on the entire bonded component displayed graphically on the display device and on the individual components forming the bonded component. By displaying the chip where the error occurred and the chip where bonding is started, it is possible to easily check the chip where bonding is started, and to easily grasp the bonding status of the entire semiconductor wafer. An object of the present invention is to provide an apparatus and a method for displaying a part to be bonded.

  The bonding apparatus according to the present invention is a bonding apparatus having a display device for displaying a component to be bonded and individual components forming the component to be bonded, and mapping information for acquiring mapping information of the component to be bonded from a communication means or a recording medium An acquisition means; a first display means for displaying the whole of the parts to be bonded and the individual parts forming the parts to be bonded on the display device in graphic form; and a mapping information acquisition means superimposed on the first display means. Second display means for displaying mapping information on the display device, and third display means for displaying on the display device whether or not each individual component is unbonded or bonded to the second display means. The individual part where an error has occurred during the bonding over the third display means And a fourth display means for displaying on the display device an individual component for starting the bonding superimposed on the fourth display means. .

  In the bonding apparatus according to the present invention, the component to be bonded is a semiconductor wafer or a substrate.

  The individual component of the bonding apparatus according to the present invention is a chip formed on a semiconductor wafer or a conductive pattern group formed on a substrate for bonding with the chip.

  The bonding apparatus according to the present invention is a bump bonder for forming a protruding electrode on the individual component.

  The bonding apparatus according to the present invention is characterized in that the part to be bonded is divided into bonding areas and displayed on the display device.

  The bonding apparatus according to the present invention is characterized in that a camera image obtained by imaging the individual component and a bonding position of the individual component during bonding are displayed on the display device.

  The bonding apparatus according to the present invention is characterized in that the first display means to the fifth display means are displayed on the display device by at least one of a color and a mark.

  The bonding apparatus according to the present invention is a bonding apparatus for bonding a part to be bonded and an individual part that forms the part to be bonded, and a mapping information acquisition unit that acquires mapping information of the part to be bonded from a communication unit or a recording medium; And mapping information output means for storing individual parts in which an error has occurred during bonding in mapping information and outputting mapping information of the parts to be bonded to a communication means or a recording medium after the bonding of the parts to be bonded is completed. Features.

  The bonding apparatus according to the present invention is a bonding apparatus having a display device for displaying a part to be bonded and an individual part for forming the part to be bonded, the entire part to be bonded and an individual part for forming the part to be bonded. First display means for graphically displaying on the display device, orientation flat area setting means for setting an orientation flat (orientation flat) area of the part to be bonded on the first display means, and individual parts of the part to be bonded And defective product setting means for setting the defective product, and mapping information of the parts to be bonded is created from the orientation flat region setting means or the defective product setting means.

  A method for displaying a bonded part according to the present invention is a method for displaying a bonded part in a bonding apparatus and an individual part formed on the bonded part on a display apparatus, from a communication means or a recording medium. Mapping information acquisition means for acquiring mapping information of the parts to be bonded, first display means for graphically displaying the whole parts to be bonded and individual parts forming the parts to be bonded on the display device, and the first display A second display means for displaying the mapping information from the mapping information acquisition means on the display device overlaid on the means, and the display as to whether each individual component is unbonded or bonded over the second display means Third display means for displaying on the apparatus, and superimposed on the third display means A fourth display means for displaying on the display device the individual parts in which an error has occurred during bonding; and a fifth display means for displaying on the display apparatus the individual parts that are to be bonded on the fourth display means. It is provided with.

  In the bonding part display method according to the present invention, the bonded part is a semiconductor wafer or a substrate.

  The individual component of the method for displaying a component to be bonded according to the present invention is a chip formed on a semiconductor wafer or a conductive pattern group formed on a substrate for bonding with the chip. .

  According to another aspect of the present invention, there is provided a method for displaying a component to be bonded, wherein the component to be bonded is divided into bonding areas and displayed on the display device.

  Also, the display method of a bonded part according to the present invention is characterized in that a camera image obtained by imaging the individual part and a bonding position of the individual part during bonding are displayed on the display device.

  According to another aspect of the present invention, there is provided a method for displaying a bonded part, wherein the first display unit to the fifth display unit are displayed on the display device by at least one of a color and a mark. .

  According to the bonding apparatus and the method for displaying a part to be bonded according to the present invention, the entire semiconductor wafer is displayed on the display device, and the position of the chip to start bonding is displayed in a graphic. Since it can be confirmed, work efficiency is improved.

  Further, since the entire semiconductor wafer is displayed on the display device and the bonding status of each chip is displayed by color and mark, the progress of bonding can be easily grasped.

  Further, since an error in bonding is displayed for each chip on the display device, the abnormality can be easily known, and the cause of the error due to bonding can be pursued and a countermeasure can be quickly implemented.

  Embodiments of a bonding apparatus and a method for displaying parts to be bonded according to the present invention will be described below with reference to the drawings. The bonding apparatus and the bonding part display method according to the present invention include the mapping information from the mapping information acquisition means, the chip information, and the entire bonding parts graphically displayed on the display apparatus and the individual parts forming the bonding parts. An unbonded or bonded display, a chip in which an error has occurred during bonding, a bonding status of a bonding start chip, and the like are displayed.

  FIG. 1 is a plan view showing a main part of a bump bonder as a bonding apparatus. As shown in FIG. 1, a bump bonder 1 as a bonding apparatus 1 has a bonding head 4 mounted under an XY table 2 that can be controlled in a two-dimensional direction, and a semiconductor wafer 30 placed in a two-dimensional direction. A movable semiconductor wafer XY table 9, a transfer arm 10 for transferring the semiconductor wafer 30 onto the semiconductor wafer XY table 9, a bonding head 4, an XY table 2, a drive unit 11 for driving the semiconductor wafer XY table 9 and the like. And a control unit 12 that controls the drive unit 11 and the bump bonder 1, and a display device 25 including a liquid crystal display, a CRT monitor, and the like.

  The bonding arm of the bonding head 4 is configured to be rotatable about a rotation axis, and a horn having a capillary as a bonding tool attached to one end of the rotation axis and ultrasonic vibration to the other via the horn. And a vibrator to be applied to the capillary.

  A camera 43 that captures an image of the semiconductor wafer 30 is mounted on the bonding head 4 and is moved in a two-dimensional direction by the XY table 2.

  As shown in FIG. 1, the XY table 2 on which the bonding head 4 is mounted has a structure that can be moved in a two-dimensional direction by an X and Y axis motor 3.

  The semiconductor wafer XY table 9 has a structure that can be moved in a two-dimensional direction by the X and Y axis motors 3. The semiconductor wafer 30 mounted and transferred on the transfer arm 10 is lifted from the transfer arm 10 by lifting the semiconductor wafer 30 by the wafer up-and-down mechanism of the semiconductor wafer XY table 9, and the transfer arm 10 is moved to the original position. The semiconductor wafer 30 is lowered onto the table and fixed by vacuum suction. When the semiconductor wafer 30 is bonded, the semiconductor wafer XY table 9 is moved to the wafer discharge position, the semiconductor wafer 30 is lifted by the wafer lifting mechanism, and the discharge arm (not shown) is moved below the semiconductor wafer 30. The semiconductor wafer 30 is lowered by the wafer up-and-down mechanism, mounted on the discharge arm, and stored in the semiconductor wafer cassette 13. The semiconductor wafer XY table 9 moves so that the bonding area of the semiconductor wafer 30 described later is positioned within the bonding range of the bonding head 4. The semiconductor wafer 30 is divided into a plurality of bonding areas. After the bonding in the bonding area is completed, the semiconductor wafer 30 moves to the next bonding area.

  FIG. 2 is a block diagram of the display control unit 15 for displaying the semiconductor wafer 30 as the bonded component 30 on the display device 25. As shown in FIG. 2, a microcomputer 17 that performs overall control of the bonding apparatus 1 and graphic control of the graphic circuit 19, etc., and a graphic for displaying graphics, characters, etc. in color based on drawing data from the microcomputer 17. A graphic circuit 19 having a built-in memory, an image synthesis circuit 20 that synthesizes an image of the camera 43 output from the position detection device 44 and a video signal from the graphic circuit 19, an input device 45, and an input signal from a storage medium driver. An input / output circuit 21 for inputting to the microcomputer 17 and a communication circuit 22 for transmitting and receiving data by the microcomputer 17 communicating with an external computer are provided.

  The microcomputer 17 has a memory 18 that stores a program for executing control of the entire bonding apparatus 1, graphic control, and the like. The CPU of the microcomputer 17 performs a bonding operation, graphic control, and the like by executing a program stored in the memory 18. Further, the memory 18 has an area for storing various data for displaying on the display device 25.

  An input device 45 including a touch panel, a keyboard, a mouse, and the like is for inputting data such as the size of the semiconductor wafer 30 and the size of the chip 31 to the microcomputer 17. The recording medium driver 24 is for reading data on a recording medium such as a floppy (registered trademark) disk or a memory card that stores mapping data of non-defective / defective products of the semiconductor wafer 30 from the previous process. In addition, the non-defective / defective product data of the semiconductor wafer 30 from the previous process can be read out from the communication circuit 22 by accessing the server storing the mapping data through the communication line 23. Note that mapping data such as a recording medium is stored corresponding to chip position information indicating the positions of the chips 31 on the semiconductor wafer 30 in the X direction and the Y direction.

  The graphic circuit 19 writes in a graphic memory for displaying graphics, characters, etc. in color on the display device 25 based on the drawing data from the microcomputer 17 and synchronizes the data in the graphic memory with the horizontal and vertical synchronization signals. Are output to the image composition circuit 20 as image signals. Further, the image composition circuit 20 combines the image signal obtained by imaging the chip 31 on the semiconductor wafer 30 by the camera 43 with the image signal from the graphic circuit 19 and displays the synthesized image at a predetermined position of the display device 25. belongs to.

  FIG. 3 is a diagram showing an example in which a map image information 40 of the semiconductor wafer 30, a camera image 41, and a chip image 42 indicating the bonding position of the chip 31 are displayed on the display device 25. As shown in FIG. 3, an image 40 of mapping information of the semiconductor wafer 30, a camera image 41 obtained by imaging the chip 31, and a chip image 42 indicating the bonding position of the chip 31 are displayed in the display area 26 of the display device 25. Is done.

  The image 40 of the mapping information of the semiconductor wafer 30 was read from the server via the communication line 23 or from the recording medium to the image of the entire semiconductor wafer 30 and the image of the chip 31 forming the semiconductor wafer 30. The mapping information is displayed superimposed on the corresponding chip 31. The mapping information that is the determination information of the non-defective / defective product of the chip 31 is indicated by a cross mark 36 on the chip 31 shown in FIG. 3, and the chip 31 with the cross mark 36 is a defective product and has no cross mark 36. Is a non-defective chip 31. Further, the mapping information image 40 of the semiconductor wafer 30 displays on the display device 25 whether the chip 31 in the semiconductor wafer 30 is unbonded or bonded. Bonded chips 31 are displayed with diagonal lines, and unbonded chips 31 are displayed without diagonal lines. The chip 31 in which an error has occurred during bonding is displayed in red (error mark 37) on the front surface of the chip 31.

  The chip 31 to start bonding or the chip 31 in bonding is indicated by a circle on the chip 31. A square shown on the semiconductor wafer 30 indicates a bonding area 35 and indicates a range of the semiconductor wafer 30 in which the bonding head 4 can perform bonding without moving the semiconductor wafer XY table 9. The bonding area 35 is assigned an area number from the upper right of the semiconductor wafer 30 and increases in the X direction. The bonding area 35 decreases from the upper left of the semiconductor wafer 30 in the Y direction and moves to the right in the X direction to increase the number. The numbers 1 to 16 are assigned to the bonding areas 35 shown in FIG. In the semiconductor wafer XY table 9, the number of the bonding area 35 is moved from 1 to 2, 3, and so on up to 16.

  A camera image 41 obtained by imaging the chip 31 shown in FIG. 3 is displayed at a predetermined position on the upper right side of the display area 26 of the display device 25. The camera image 41 is used by the operator to confirm the position of the chip 31 and confirm the bonding state. The cross line of the camera image 41 shown in FIG. 3 is used for alignment of the chip 31, and the window is for designating the range of the reference pattern used for position detection.

  A chip image 42 showing the bonding position of the chip 31 shown in FIG. 3 is displayed at a predetermined position on the lower right of the display area 26 of the display device 25. The chip image 42 shows the chip 31 that starts bonding or the chip 31 that is being bonded, and the pad 32 that has been bonded is indicated by hatching. The position of the pad 32 where the bonding is interrupted and the bonding is resumed is indicated by a circle. The chip image 42 is created by graphic processing from the size of the chip 31 and the position data of the pad 32.

  Next, the mapping display and bonding operation of the semiconductor wafer 30 in the bump bonder 1 will be described using the flowchart shown in FIG. Data such as the size of the semiconductor wafer 30 and the size of the chip 31 is input to the microcomputer 17 in advance.

  As shown in FIG. 4, the bump bonder 1 transports the semiconductor wafer 30 from the semiconductor wafer supply unit onto the semiconductor wafer XY table 9 by the transfer arm 10 and places it on the semiconductor wafer XY table 9 (shown in FIG. 4). Step S1). The mapping data from the server or the mapping data stored in the recording medium is stored in the memory area of the memory 17 of the microcomputer 17 through the communication line (step S2). Next, based on mapping information in the memory 18 of the microcomputer 17 and setting data such as the size of the semiconductor wafer 30 and the size of the chip 31, the appearance of the semiconductor wafer 30 is displayed on the display device 25, and each chip 31 in the semiconductor wafer 30. Then, the bonding area 35 on the semiconductor wafer 30 is displayed, and the non-defective / defective products of the chip 31 in the bonding area 35 are displayed (step S3).

  The bump bonder 1 determines from the mapping data whether the chip 31 to be bonded in the bonding area 35 on the semiconductor wafer 30 is a good product or a defective product (step S4). If the chip 31 to be bonded is defective, it is not necessary to perform bonding, and the process proceeds to step S8. When the chip 31 to be bonded is a non-defective product, the position detection device 44 detects the amount of deviation in the X and Y directions at the two reference positions in the bonding area 35, and the X and Y with respect to the reference coordinates of the bonding area 35 are detected. The direction shift (offset) amount and inclination are calculated (step S5).

  The XY table 2 moves to the first pad 32 of the chip 31 and performs bump bonding (step S6). After the bonding of the chip 31 is completed, the bonding result is stored in the memory 18. For example, when the bonding of the chip 31 is normally performed, data indicating a normal state is stored in the memory 18, and when an abnormality such as non-bonding occurs in the bonding, the data indicating the abnormal state is stored in the memory 18 (step S1). S7). Based on the data stored in the memory 18, the microcomputer 17 displays a normal bonded or error display on the display device 25 in a color at a position on the chip 31.

  Next, it is checked whether the bonding of the chip 31 in the bonding area 35 is completed (step S8). When bonding in the bonding area 35 is not completed, the process moves to the next chip 31 in the bonding area 35 (step S9), and proceeds to step S5. When bonding in the bonding area 35 is completed, it is checked whether bonding of all bonding areas 35, that is, the semiconductor wafer 30, is completed (step S10). If bonding of all bonding areas 35 is not completed. Then, the semiconductor wafer XY table 9 is moved to the next bonding area 35 (step S11), and the process proceeds to step S9. When the bonding of the semiconductor wafer 30 is completed, the bonding result of the chip 31 is stored in a recording medium or output to the host computer through a communication line (step S12). Further, the bonded semiconductor wafer 30 is stored in the semiconductor wafer cassette 13 from the semiconductor wafer XY table 9.

  As described above, according to the bonding apparatus 1 and the display method of the parts to be bonded according to the present invention, the entire semiconductor wafer 30 is displayed on the display apparatus 25 and the position of the chip 31 to start bonding is displayed. Since the target chip 31 can be easily confirmed, the working efficiency is improved.

  Further, since the entire semiconductor wafer 30 is displayed on the display device 25 and the bonding status of each chip 31 is displayed by color and mark, the progress of bonding can be easily grasped.

  Further, since an error in bonding is displayed for each chip 31 on the display device 25, the abnormality can be easily known, and the cause of the error due to bonding can be pursued and measures can be quickly implemented.

  In the description of the embodiment of the bonding apparatus 1 and the method for displaying a bonded component according to the present invention, the semiconductor wafer 30 is described as the bonded component 30. However, the present invention can also be applied to a substrate made of ceramic or epoxy. it can. Moreover, the form which accommodated and arrange | positioned the chip | tip 31 to be bonded in a tray may be sufficient. Further, not only the chip 31 formed on the semiconductor wafer 30 as the individual component 31 but also a conductive pattern group formed on the substrate for bonding with the chip 31 may be used.

  The bonding apparatus 1 according to the present invention has a function of creating and setting the mapping information of the semiconductor wafer 30 by the bonding apparatus itself. The above-described bonding apparatus uses mapping information from a recording medium storing mapping data of non-defective / defective products of the semiconductor wafer 30 from the previous process or a server storing mapping data from the communication circuit 22 through a communication line. Is.

  The setting of semiconductor wafer mapping information will be described below with reference to FIGS. FIG. 5 is a flowchart for explaining the setting operation of the mapping information of the semiconductor wafer. FIG. 6A is a diagram showing an orientation flat region of a semiconductor wafer, and FIG. 6B is a diagram showing detection results of defective chips on the semiconductor wafer by white cross marks.

  Data such as the size of the semiconductor wafer 30 and the size of the chip 31 are input to the microcomputer 17 in advance. The microcomputer 17 displays the appearance of the semiconductor wafer 30, each chip 31 in the semiconductor wafer 30, and the bonding area 35 on the display device 25 based on the setting data such as the size related to the semiconductor wafer 30 and the size of the chip 31 ( Step S20). Next, an orientation flat (orientation flat) region of the semiconductor wafer 30 is set in the display device 25 (step S21). This operation is for deleting the chip 31 from the semiconductor wafer 30 on the display device 25 because the chip 31 does not exist in the orientation flat region. A chip 31 that exists in the orientation flat region and contacts the semiconductor wafer 30 is selected. The microcomputer 17 determines the orientation flat area based on the selected chip 31 and deletes the chip 31 from the orientation flat area of the semiconductor wafer 30. The orientation flat area is determined by determining whether the position of the selected chip 31 is the upper, lower, left or right part of the semiconductor wafer 30 and determining the chip 31 from the orientation flat area of the semiconductor wafer 30. delete. In the example shown in FIG. 6A, since the position of the selected chip 31 is located on the upper part of the semiconductor wafer 30, the orientation flat whose upper part is hatched from the chip 31 existing in the X direction of the selected chip 31 is shown. This is an area.

  Next, the alignment chip 31 formed on the semiconductor wafer 30 is masked. Since the alignment chip 31 is not formed with a circuit, a pattern, or the like, it is excluded from the bonding target. In the masking operation of the alignment chip 31, the bonding area 35 displayed on the display device 25 is moved, and the chip 31 to be masked in the bonding area 35 is designated (step S22).

  Next, chips 31 that exist on the outer periphery of the semiconductor wafer 30 and whose circuits and patterns on the chip 31 are not normally formed are set. Since this chip 31 is a defective product, it is excluded from the bonding target (step S23). The exclusion of defective chips 31 is automatically performed by the microcomputer 17 detecting the chips 31 located on the outer periphery of the semiconductor wafer 30. FIG. 6B shows a detection result of defective chips on the semiconductor wafer by white cross marks. Alternatively, the bonding area 35 may be designated, and the outer peripheral chip 31 may be designated manually. Further, the camera 43 is moved with respect to all the chips 31 existing on the semiconductor wafer 30 so that the image on the chip 31 is detected by the position detecting device 44, and the chip 31 in error is excluded from the bonding target. You may do it.

  The orientation flat area obtained by the above operation, the mask for the alignment chip 31 and the data for excluding the defective chip 31 are stored as mapping information in a recording medium or the like corresponding to the position information of the chip 31 (step S24). .

  As described above, when mapping information cannot be obtained from the previous process, it can be used as mapping information, and the operating rate of the bonding apparatus can be improved as compared with the case where bonding is performed without mapping information. .

  In addition, although the bonding apparatus and the display method of the parts to be bonded according to the present invention have been described with respect to the bump bonder as the bonding apparatus, the bonding apparatus and the bonding method according to the present invention can also be applied to flip chip bonders and die bonders that perform bonding of diced wafers. Can do.

It is a top view which shows the principal part of the bump bonder as a bonding apparatus. It is a block diagram of a display control unit for displaying a semiconductor wafer as a part to be bonded on a display device. It is a figure which shows an example which displayed the chip image which shows the image of the semiconductor wafer mapping information, the camera image, and the bonding position of a chip | tip on the display apparatus. It is a flowchart explaining the mapping display operation | movement and bonding operation | movement of a semiconductor wafer in a bump bonder. It is a flowchart explaining the setting operation | movement of the mapping information of a semiconductor wafer. (A) is a figure which shows the orientation flat area | region of a semiconductor wafer, (b) is the figure which showed the detection result of the defective product of the chip | tip on a semiconductor wafer with the white cross mark. (A) is a figure which shows an example of the camera image of the semiconductor wafer displayed on the display apparatus of the conventional bump bonder, (b) is a figure which shows the external appearance of a semiconductor wafer.

Explanation of symbols

1 Bonding equipment (bump bonder)
2 XY table 3 Motor 4 Bonding head 5 Bonding arm 9 Semiconductor wafer XY table 10 Transfer arm 11 Drive unit 12 Control unit 13 Semiconductor wafer cassette 15 Display control unit 17 Microcomputer 18 Memory 19 Graphic circuit 20 Image composition circuit 21 Input / output circuit 22 Communication circuit 23 Communication line 24 Recording medium driver 25 Display device 26 Display region 30 of display device Semiconductor wafer (part to be bonded)
31 chips (individual parts)
32 Pad 35 Bonding area 36 Cross mark (defective product mark)
37 Error mark 40 Image of semiconductor wafer mapping information 41 Camera image 42 Chip image 43 Camera 44 Position detection device 45 Input device

Claims (15)

A bonding apparatus having a display device for displaying a part to be bonded and an individual part forming the part to be bonded, a mapping information acquisition unit for acquiring mapping information of the part to be bonded from a communication unit or a recording medium, and the bonding target First display means for graphically displaying the whole part and individual parts forming the part to be bonded on the display device, and mapping information from mapping information acquisition means superimposed on the first display means on the display device Second display means for displaying, third display means for displaying on the display device whether each individual component is unbonded or bonded over the second display means, and the third display means A fourth part is displayed on the display device for the individual parts that are overlapped with each other and have an error during bonding. And shows means, bonding apparatus characterized by discrete components to initiate bonding superimposed on the fourth display means and a fifth display means for displaying on said display device. 2. The bonding apparatus according to claim 1, wherein the part to be bonded is a semiconductor wafer or a substrate. 2. The bonding apparatus according to claim 1, wherein the individual component is a chip formed on a semiconductor wafer or a conductive pattern group formed on a substrate for bonding with the chip. The bonding apparatus according to claim 1, wherein the bonding apparatus is a bump bonder that forms protruding electrodes on the individual components. The bonding apparatus according to claim 1, wherein the component to be bonded is divided into bonding areas and displayed on the display device. The bonding apparatus according to claim 1, wherein a camera image obtained by imaging the individual component and a bonding position of the individual component during bonding are displayed on the display device. 2. The bonding apparatus according to claim 1, wherein the first to fifth display means are displayed on the display device by at least one of a color and a mark. A bonding apparatus for bonding a part to be bonded and an individual part forming the part to be bonded, a mapping information acquisition unit for acquiring mapping information of the part to be bonded from a communication unit or a recording medium, and an individual in which an error has occurred during bonding A bonding apparatus comprising: mapping information output means for storing parts in mapping information and outputting mapping information of the parts to be bonded to a communication means or a recording medium after the bonding of the parts to be bonded is completed. A bonding apparatus having a display device for displaying a part to be bonded and an individual part for forming the part to be bonded, wherein the whole part to be bonded and an individual part for forming the part to be bonded are displayed on the display device in a graphic form. A first display means, an orientation flat area setting means for setting an orientation flat (orientation flat) area of the part to be bonded on the first display means, and a defect for setting a defective product of the individual part of the part to be bonded. A bonding apparatus comprising: a non-defective product setting unit, wherein mapping information of a part to be bonded is created from the orientation flat region setting unit or the defective product setting unit. A bonding component display method for displaying a bonding component in a bonding apparatus and an individual component formed on the bonding component on a display device, and mapping information for acquiring mapping information of the bonding component from a communication unit or a recording medium An acquisition means; a first display means for displaying the whole of the parts to be bonded and the individual parts forming the parts to be bonded on the display device; and a mapping from the mapping information acquisition means superimposed on the first display means Second display means for displaying information on the display device, and third display means for displaying on the display device whether each individual component is unbonded or bonded to the second display means; An individual part that has an error during bonding is superimposed on the third display means. And a fourth display means for displaying on the display device; and a fifth display means for displaying on the display device an individual part for starting bonding over the fourth display means. How to display bonding parts. 11. The method for displaying a bonded part according to claim 10, wherein the bonded part is a semiconductor wafer or a substrate. 11. The display method of a part to be bonded according to claim 10, wherein the individual part is a chip formed on a semiconductor wafer or a conductive pattern group formed on a substrate for bonding with the chip. 11. The method for displaying a bonded part according to claim 10, wherein the bonded part is divided into bonding areas and displayed on the display device. 11. The method for displaying a bonded part according to claim 10, wherein a camera image obtained by imaging the individual part and a bonding position of the individual part during bonding are displayed on the display device. 11. The method for displaying a bonded part according to claim 10, wherein the display unit displays the first display unit to the fifth display unit by at least one of a color and a mark.

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