JP2006156697A - Semiconductor manufacturing device and semiconductor inspection system - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To enable positioning to the carrying head of a work without requiring a positioning jig regardless of the shape and the size of the work. <P>SOLUTION: The semiconductor device has a carrying head 100 having a suction part for sucking a semiconductor device 30 by a negative pressure. The carrying head has first and second positioning members 101a, 102a disposed in both sides of a suction 105 in a first direction (X) and third and fourth positioning members 103a, 104a disposed in both sides of the suction in a second direction (Y) approximately orthogonal to the first direction. The first and second positioning members are driven by a first driving mechanism, and the third and fourth positioning members are driven by a second driving mechanism in a mutually approaching direction and retreating direction, respectively. The driving sources of the first and second driving mechanisms are controlled independently. Positioning to the carrying head of the semiconductor device is carried out by bringing each positioning member into contact with the semiconductor device, respectively. <P>COPYRIGHT: (C)2006,JPO&NCIPI

Description

The present invention relates to a semiconductor manufacturing apparatus, and more particularly, to an apparatus for adsorbing a semiconductor device to a test apparatus or the like by negative pressure adsorption.

  A handler, which is an example of a semiconductor manufacturing device, is used in an inspection process that is performed after the assembly process (post-process) in the semiconductor manufacturing process, and automatically controls the operation and electrical characteristics of a semiconductor device (for example, Chip Size Package) that has been assembled. It is a device that is transported to a test device, further automatically classified based on test results, and stored in a tray.

  In such a handler, the semiconductor head is sucked by using a negative air pressure in the transport head, and the sucked semiconductor device is transported onto a socket provided in the test apparatus. Then, the semiconductor device is pressed so that the terminal of the semiconductor device is brought into contact with the contact pin in the socket.

  At this time, it is necessary to accurately contact the terminals of the semiconductor device with the contact pins of the test device. For this reason, conventionally, before the semiconductor device is attracted, the semiconductor device is aligned with the transport head, and then the semiconductor device is attracted and transported onto the test apparatus.

  Specifically, as shown in FIG. 10, a taper formed around the opening of the hole 202 using the jig 200 in which the hole 202 having a size corresponding to the semiconductor device is formed. The semiconductor device 203 is aligned by dropping it into the hole 202 using the surface 201 (hereinafter referred to as the dropping method), or the abutting surface 205 corresponding to the semiconductor device 203 as shown in FIG. The semiconductor device 203 is aligned by abutting one side of the semiconductor device 203 against the abutting surface 205 from the e and f directions (hereinafter, this is referred to as a one-side abutting method). .

  However, the dropping method and the one-sided butting method have the following problems. First, as shown in FIG. 12, the semiconductor device is cut from the wafer 210 by a dicing saw 220, but the cutting width on the wafer 210 changes due to wear of the dicing saw 220. Thereby, the size of the semiconductor device 203 to be cut out also varies. On the other hand, the same alignment jig is used regardless of the size variation of the semiconductor device 203. Therefore, as shown in FIGS. 11 and 13, even if the semiconductor device 203 is aligned with a jig, the center of the semiconductor device 203 is displaced by an amount indicated by x or y in the drawing due to the size variation of the semiconductor device 203. Therefore, even if the semiconductor device 203 is sucked and conveyed as it is, the terminal 204 of the semiconductor device 203 cannot be brought into contact with the contact pin of the test device accurately.

  Further, in the dropping method or the one-sided abutting method, every time the size (type) of the semiconductor device to be tested is different, it must be replaced with a jig having a corresponding hole or abutting surface.

On the other hand, Patent Document 1 discloses an apparatus for aligning a semiconductor device with respect to a transport head by using a negative pressure for adsorbing the semiconductor device to bring the alignment member into contact with the semiconductor device from four directions. Proposed. According to this, the jig | tool corresponding to a semiconductor device becomes unnecessary.
JP-A-11-333775 (paragraphs 0018 to 0021 etc.)

  However, in the apparatus proposed in Patent Document 1, the alignment member can be driven only almost simultaneously with the suction of the semiconductor device because of its structure, so that the semiconductor device needs to be aligned before and after the suction. I can't respond.

  Further, all the alignment members arranged on the four sides of the semiconductor device have the same shape and the same size, and are collectively driven by the movable shaft. Therefore, there are restrictions on the shape and size of the semiconductor device that can be naturally handled. For example, it is difficult to cope with semiconductor devices having different vertical and horizontal sizes. In other words, in order to deal with semiconductor devices having different sizes, it is necessary to exchange the dedicated alignment member every time the size of the semiconductor device is changed.

  Furthermore, since the alignment member is driven using negative pressure, it is difficult to control the driving speed of the alignment member, and when the alignment member collides with the workpiece, the semiconductor device is not attracted to the semiconductor device. May cause damage.

  An object of the present invention is to provide a semiconductor manufacturing apparatus that does not require an alignment jig and can align the semiconductor device with respect to the transport head regardless of the shape and size of the semiconductor device.

  In order to achieve the above object, a semiconductor manufacturing apparatus according to one aspect of the present invention includes a transport head including a suction unit that sucks a semiconductor device with a negative pressure. The transport head is disposed on both sides of the suction portion in the first direction and is movable in the first direction, and a second direction substantially orthogonal to the first direction. The third and fourth alignment members that are disposed on both sides of the suction portion and are movable in the second direction are driven by the first drive source, and the first and second alignment members approach each other. The second drive that is driven by the first drive mechanism that drives in the moving direction and the retracting direction and the second drive source and that drives the third and fourth alignment members in the approaching direction and the retracting direction. Mechanism. A control unit that independently controls each of the first and second drive sources is further provided, and each alignment member is brought into contact with the semiconductor device to align the semiconductor device with the transport head.

  According to the present invention, an alignment member and a mechanism for driving the alignment member are provided on the transport head including the suction portion, and the driving mechanism is independently controlled for each alignment direction. Without using the semiconductor device, it is possible to accurately align semiconductor devices of various shapes and sizes with respect to the transport head. Further, the semiconductor device can be adsorbed in a state of being positioned by the contact of the alignment member and can be pressed against the socket (contact pin) of the test device, thereby preventing the displacement due to some external force. In addition, since the alignment control can be performed independently of the suction of the semiconductor device, the alignment can be performed at a desired timing, such as before and after the suction or after being set in the test device. Furthermore, it is easy to control the driving speed of the alignment member, and soft contact with the semiconductor device is possible.

  Further, when a plurality of suction portions are provided, the first drive mechanism and the second drive mechanism may be configured to drive the first to fourth alignment members corresponding to all the suction portions. Thus, the alignment of the plurality of semiconductor devices can be performed in a lump, and the plurality of semiconductor devices can be transferred to the test apparatus and accurately set in a short time.

  In addition, if the transport head is provided with an engaging portion that engages the test device and positions the transport head with respect to the test device, the transported semiconductor device can be easily and accurately aligned with the socket of the test device. In addition, accurate inspection data of the semiconductor device can be obtained.

  Hereinafter, preferred embodiments of the present invention will be described with reference to the drawings.

  FIG. 1 shows the overall configuration of a handler as a semiconductor manufacturing apparatus according to an embodiment of the present invention. In FIG. 1, 1 is a handler and 2 is a base serving as a reference plane for the handler. On the base 2, first to fourth transfer units 4 to 7 described later are mounted.

  The first transport unit 4 transports the trays 3 stacked on the left side in the figure on the base 2 one by one to the right side (X direction) in the figure by belt driving. On the tray 3, CSP (Chip Size Package), WL (Wafer-Level) -CSP, BGA (Ball Grid Array) as semiconductor devices whose operation and electrical characteristics are inspected (tested) by the test apparatus 20 described later. ), SIP (Single in-line Package), DIP (Dual in-line Package), SOJ (Small Out line J-lead Package), SOP (Small out-line Package), QFP (Quad Flat Package), PLCC (Plastic A predetermined number of semiconductor packages such as “leaded chip carriers” are arranged and mounted.

  The second transport unit 5 sucks the semiconductor packages four by four from the tray 3 transported to the right end by the first transport unit 4 and supplies the semiconductor packages onto the tray of the third transport unit 6 by driving the belt. To do. The third transport unit 6 transports the tray on which the four semiconductor packages are mounted in a direction (Y direction) perpendicular to the paper surface of the drawing by driving a belt. A fourth transport unit 7 is provided above the transport destination.

  As shown in FIG. 2, the fourth transport unit 7 includes two arms 8 that can move in the XY plane, move up and down in the Z-axis direction, and rotate around the Z-axis. The transport head 10 is provided at the lower end of the head.

  Each transport head 10 is configured by mounting a suction nozzle (suction part) 105 on a head main body 100 shown in FIG. An air negative pressure is introduced into the suction nozzle 105 from a negative pressure generator (not shown) to suck the upper surface of the semiconductor package 30. In the present embodiment, four suction nozzles 105 are mounted on one head body 100, and each transport head 10 can suck four semiconductor packages 30 at a time. When one arm 8 is driven in this state, the four semiconductor packages 30 are transferred onto the four sockets 22 provided in the test head 21 of the test apparatus 20, and each semiconductor package 30 is transferred to each socket 22. Press against.

  At this time, if the center of the semiconductor package 30 pressed against the socket 22 substantially coincides with the center of the socket 22, a plurality of terminals 31 formed on the bottom surface of the semiconductor package 30 are provided in the socket 22. The plurality of contact pins 23 are correctly brought into contact with each other, and an appropriate inspection is performed by the test apparatus 20.

  When the inspection of the semiconductor package 30 is completed, the arm 8 operates again while maintaining the suction state of the semiconductor package 30, and the semiconductor package 30 is transported onto different sorting trays (not shown) according to the inspection result. . The inspected semiconductor package 30 mounted on the classification tray is transported to a predetermined storage position and stored by a fifth transport unit (not shown).

  Thus, the handler 1 of this embodiment supplies the semiconductor package 30 to be inspected to the fourth transport unit 7, sets the semiconductor package 30 on the test head 21 by the fourth transport unit 7, and further The apparatus has a function of classifying and storing the inspected semiconductor package 30 according to the inspection result, and performs an operation relating to the function in a fully automatic manner. The operation of each transport unit is program-controlled by a controller 160 configured by a computer or the like mounted below the base 2 of the handler 1. The handler 1 and the test apparatus 20 constitute a semiconductor package test system.

  As described above, in order for the semiconductor package 30 set on the test head 21 to be properly inspected, each terminal 31 of the semiconductor package 30 needs to be brought into contact with each contact pin 23 of the socket 22 accurately. For this reason, in the handler 1 of the present embodiment, a clamp mechanism described below is mounted on the transport head 10 (head main body 100).

  Regarding the clamp mechanism, FIG. 3 shows a schematic view thereof, FIG. 4A shows a schematic view thereof, and FIGS. 5A and 5B show specific configurations thereof. In the following description, “substantially (substantially)” used for substantially the same or substantially coincides with each other includes an error within an allowable range.

  As shown in FIG. 3, in the head main body 100, the first and second alignment claws (alignment members) 101a to 101d and 102a to 102d move in the X direction on both sides of each suction nozzle 105 in the X direction. Arranged to be possible. Further, on both sides of each suction nozzle 105 in the Y direction, third and fourth alignment claws (alignment members) 103a to 103d and 104a to 104d are arranged to be movable in the Y direction.

  The first and second alignment claws 101a to 101d and 102a to 102d all have substantially the same shape and size, and the third and fourth alignment claws 103a to 103d and 104a to 104d Also have substantially the same shape and size. However, the width in the Y direction of the first and second alignment claws 101a to 101d and 102a to 102d is larger than the width in the X direction of the third and fourth alignment claws 103a to 103d and 104a to 104. .

  The reason for this will be described. 9A and 9B, the first and second alignment claws 101a and 102a having a large width, the third and fourth alignment claws 103a and 104a having a small width, and the size of the semiconductor package 30 are shown. Shows the relationship. As shown in FIG. 9A, when the length of each side portion of the semiconductor package 30 (here, a square in the bottom view) 30 is larger than the width of the first and second alignment claws 101a, 102a Even if the widths of the third and fourth alignment claws 103a and 104a are the same as the widths of the first and second alignment claws 101a and 102a, each alignment claw can be used without any problem in each of the semiconductor packages 30. It can be brought into contact with the side.

  However, as shown in FIG. 9B, when the length of each side portion of the semiconductor package 30 is smaller than the width of the first and second alignment claws 101a and 102a, it is indicated by a one-dot chain line in the drawing. As described above, when the widths of the third and fourth alignment claws 103a and 104a are the same as the widths of the first and second alignment claws 101a and 102a, the third and fourth alignment claws 103a and 104a. Hits the first and second alignment claws 101a and 102a, and the third and fourth alignment claws 103a and 104a cannot be brought into contact with the semiconductor package 30.

  Further, if the widths of all the first to fourth alignment claws are reduced, it can be applied to a small semiconductor package as shown in FIG. 9B, but it is shown in FIG. 9A. For such a large semiconductor package, even if all the first to fourth alignment claws are in contact with each other, the semiconductor package is likely to be unstable, and alignment with respect to the rotation direction in the XY plane is difficult. Inconveniences such as become.

  For this reason, in the present embodiment, the first and second alignment claws 101a and 102a are widened, and the third and fourth alignment claws 103a and 104a are narrowed, whereby various sizes of semiconductors are obtained. This enables stable package alignment.

  Here, as shown in FIGS. 4A and 5A, all of the four first alignment claws 101a to 101d are integrally provided on the same first base member 101. Further, all of the four second alignment claws 102a to 102d are integrally provided on the same second base member 102. Therefore, by driving both base members 101 and 102 in the X direction, the four first alignment claws 101a to 101d and the four second alignment claws 102a to 102d are driven together in the X direction. Can do.

  A plurality of slide bearings 101f and 102f are attached to both sides of the first base member 101 and the second base member 102 in the Y direction. These slide bearings 101f and 102f are engaged with guide rails 111 formed on both sides of the head body 100 in the Y direction so as to extend in the X direction. For this reason, the movement of the first base member 101 and the second base member 102 is accurately guided in the X direction.

  In the present embodiment, the drive mechanisms of the base members 101 and 102, that is, the first and second alignment claws 101a to 101d and 102a to 102d are configured as follows. First, a first motor 131 as a first drive source is fixed to the head main body 100, and a first lever 120 that is rotatable about an output shaft 131a of the motor 131 in the XY plane is provided. The first motor 131 may be a stepping motor (pulse motor) or a servo motor.

  A follower 121 is provided at both ends of the first lever 120, and one follower 121 is engaged with an end surface in the X direction of a follower engagement hole 101e formed in the first base member 101, and the other follower is engaged. Reference numeral 121 is engaged with an end surface in the X direction of a follower engagement hole 102 e formed in the second base member 102.

  In the present embodiment, in FIG. 5A, the first lever 120 rotates counterclockwise, so that the interval between the first alignment claw and the second alignment claw is narrowed (that is, , Approach each other) and rotate in the clockwise direction to increase the distance between the first alignment claw and the second alignment claw (that is, retreat from each other).

  Here, the length from the rotation center of the first lever 120 (the center of the motor output shaft 131a) to the follower 121 at both ends thereof is substantially equal. Further, the center positions of the four suction areas where the suction nozzles 105 are provided in the transport head 10 are set at substantially equidistant positions in the X direction when viewed from the rotation center of the first lever 120. The center position of the suction area is a position corresponding to the center of the socket 22 of the test apparatus 20 in the transport head 10 and is a reference position for alignment of the semiconductor package. In many cases, the center of the suction nozzle 10 and the center of the suction area are set to substantially coincide with each other, but they may be shifted from each other.

  The first and second base members 101 and 102 including the alignment claws are opposite in direction, but have substantially the same shape and dimensional relationship. Therefore, the first and second base members 101 and 102 are opposite to each other (that is, the direction in which the first and second alignment claws approach each other or the direction in which they are retracted) by the rotation of the first lever 120. Are driven by substantially the same amount. Moreover, the center of the X-direction interval between the first alignment claw and the second alignment claw provided for each suction area substantially coincides with the center of the suction area.

  Further, as shown in FIGS. 4A and 5B, the four third alignment claws 103 a to 103 d are all provided on the same third base member 103. The four fourth alignment claws 104 a to 104 d are all provided on the same fourth base member 104. Therefore, by driving both base members 103 and 104 in the Y direction, the four third alignment claws 103a to 103d and the four fourth alignment claws 104a to 104d are driven together in the Y direction. Can do.

  As shown in FIG. 4A, the third and fourth base members 103 and 104 are arranged below the first and fourth base members 101 and 102 described above, and can move without interfering with each other. It has become.

  A plurality of slide bearings 103f and 104f are attached to both sides of the third base member 103 and the fourth base member 104 in the Y direction. These slide bearings 103f and 104f are engaged with guide rails 112 formed on both sides in the X direction of the head main body 100 so as to extend in the Y direction. For this reason, the movement of the third base member 103 and the fourth base member 104 is accurately guided in the Y direction.

  In the present embodiment, the drive mechanisms of the base members 103 and 104, that is, the third and fourth alignment claws 103a to 103d and 104a to 104d are configured as follows. First, a second motor 132 that is a second drive source is fixed to the head main body 100, and a second lever 125 that is rotatable in the XY plane about the output shaft 132a of the motor 132 is provided. As with the first motor 131, the second motor 132 may be a stepping motor (pulse motor) or a servo motor.

  A follower 126 is provided at both ends of the second lever 125, and one follower 126 engages with the end surface in the Y direction of the follower engagement hole 103e formed in the third base member 103, and the other follower. 126 is engaged with the end surface in the Y direction of the follower engagement hole 104 e formed in the fourth base member 104.

  In the present embodiment, in FIG. 5B, the second lever 125 rotates counterclockwise, so that the distance between the third alignment claw and the fourth alignment claw is narrowed (that is, , Approach each other) and rotate in the clockwise direction to increase the distance between the third alignment claw and the fourth alignment claw (that is, retreat from each other).

  Here, the length from the rotation center of the second lever 125 (the center of the motor output shaft 132a) to the follower 126 at both ends thereof is substantially equal. Further, the center positions of the four suction areas are set at substantially equal distances in the Y direction when viewed from the rotation center of the second lever 125. The third and fourth base members 103 and 104 including the alignment claws are opposite in direction, but have substantially the same shape and dimensional relationship. Therefore, the third and fourth base members 103 and 104 are opposite to each other (that is, the direction in which the third and fourth alignment claws approach or retract) by the rotation of the second lever 125. Are driven by substantially the same amount. Moreover, the center of the Y-direction interval between the third alignment claw and the fourth alignment claw provided for each suction area substantially coincides with the center of the suction area.

  As described above, the first alignment claws 101a to 101d and the second alignment claws 102a to 102d are driven in substantially the same amount in the X direction around the center of the suction area, and the third alignment claws 103a to 103d are driven. And the fourth alignment claws 104a to 104d are driven by substantially the same amount in the Y direction around the center of the suction area. Therefore, as shown in FIG. 6, these four alignment claws are brought into contact with the semiconductor package 30 disposed so as to oppose the suction area from its four sides h, k, j, g, so that the semiconductor The center of the package 30 can be made substantially coincident with the center C of the suction area. Therefore, in the conventional dropping method or one-side abutting method, a jig or abutting surface that is necessary for positioning the semiconductor package with respect to the transport head is not required. In other words, it is possible to eliminate the need to replace the jig or the abutting surface every time the semiconductor package has a different size.

  Here, in this embodiment, this effect can be obtained regardless of the shape and size of the semiconductor package 30. By devising the drive mechanism, it is possible to drive the above-described four alignment claws (base members 101 to 104) with one motor. However, when the four alignment claws are driven by a single motor and drive mechanism, it is extremely difficult to vary the drive amount of the alignment claws between the X direction and the Y direction. For this reason, in such a case, only a semiconductor package having substantially the same dimensions in the X direction and the Y direction, that is, a square semiconductor package as viewed from above, can be accommodated, and the position is changed every time the shape or size of the semiconductor package is changed. Replacement of the alignment member and the drive mechanism is necessary.

  In contrast, in this embodiment, the alignment claws are driven by separate motors and drive mechanisms in the X direction and the Y direction so that the drive amount of each motor can be controlled independently. Accordingly, the center of the semiconductor package having completely different dimensions in the X direction and the Y direction can be easily set to the center of the suction area, as well as the above-described square semiconductor package, without requiring replacement of the alignment member and the driving mechanism. Can be matched.

  In addition, even when there is a dimensional variation of the semiconductor package due to a change in the cutting width due to wear of the timing saw when cutting the semiconductor package from the wafer, it is possible to ensure that the center of the semiconductor package substantially coincides with the center of the suction area. it can.

  In addition, by controlling the driving speed of each motor, the contact speed of each alignment member with respect to the semiconductor package can be controlled so that the semiconductor package is not damaged or is not attracted. It can also be done in software.

  Furthermore, in the handler 1 of the present embodiment, a total of 16 positioning claws provided in the X direction and the Y direction for each suction area are driven by the two stepping motors and the driving mechanism, and four pieces are provided. The semiconductor packages 30 are aligned at the same time. As a result, the index time for simultaneously inspecting four semiconductor packages can be shortened.

  In this embodiment, the suction operation of the semiconductor package 30 by the suction nozzle 105 and the positioning operation of the semiconductor package by the positioning claw can be performed almost simultaneously, but can be performed at different timings. As a result, the process before and after the semiconductor package 30 is sucked or after the semiconductor package 30 is pressed against the socket 22 of the test apparatus 20, the center of the semiconductor package 30 is aligned with the center of the suction area (socket 22) or finely adjusted. The semiconductor package 30 can be aligned at an arbitrary timing.

  As described above, the transport head 10 is moved onto the test head 21 of the test apparatus 20 by driving the arm 8 in a state where the center of the semiconductor package 30 is substantially coincident with the center of the suction area. Here, as shown in FIG. 3, protrusions 107 as engaging portions are provided at two positions (on both sides in the X direction) of the lower surface of the head main body 100. On the other hand, guide hole portions 25 with which the protrusions 107 can be engaged are formed at two locations on the upper surface of the test head 21.

  The positional relationship between the center of each suction area in the head body 100 and the center of the projection 107 is substantially the same as the positional relationship between the center of each socket 22 and the center of the guide hole 25 in the test head 21. For this reason, by bringing the transport head 10 close to the test head 21 so that the protrusion 107 is engaged with the guide hole 25, the semiconductor package 30 is attracted to the transport head 10 and aligned by the alignment claw. Each terminal 31 can be reliably brought into contact with each contact pin 23 of the socket 22.

  In the present embodiment, the four alignment claws are pressed against the socket 22 of the test apparatus 20 while keeping the four alignment claws in contact with the semiconductor package 30 for the alignment. As shown in FIG. 7B, the position of the semiconductor package 30 may be shifted by an external force such as a vibration caused by a transfer operation to the test apparatus 20 only by the suction force by the negative pressure 105a introduced into the suction nozzle 105. . For this reason, at least until the setting to the test apparatus 20 is completed, as shown in FIG. 7A, the four positional alignment claws are brought into contact with the semiconductor package 30 so that the positional deviation after the positional alignment is achieved. It is possible to avoid the inspection failure due to.

  Furthermore, as schematically shown in FIG. 4B, a spring 130 may be disposed between the base member 101 and the alignment claw 101a. In FIG. 4B, the first base member 101 and the alignment claw 101a are shown as representative examples, but the same applies to all the base members and the alignment claw. Then, when aligning the semiconductor package 30, the driving amount of the base member 101 (that is, the driving amount of the motor 131) is set to a predetermined amount larger than the size of the semiconductor package 30, and the alignment claw 101 a contacts the semiconductor package 30. When the contact is made, the alignment claw 101a is pushed into the base member 101 side by elastic deformation of the spring 130. Accordingly, the alignment claw 101a can be reliably brought into contact with the semiconductor package 30 without applying an excessive load on the semiconductor package 30, and the alignment of the semiconductor package 30 can be performed more accurately. In addition, with this configuration, the size variation in the cutting process of the semiconductor package 30 can be more reliably absorbed.

  It should be noted that the arrangement position of the spring 130 may not be between the alignment claw and the base member, but may be any position from the lever to the alignment claw via the base member.

  Next, the operation of the handler 1 of the above embodiment will be described using the flowchart of FIG. This operation is controlled by the controller 160 according to a program. However, here, the operation of the fourth transport unit 7 will be mainly described.

  In step (abbreviated as “S” in the figure) 1, the operator of the handler 1 uses the input device (not shown) provided or connected to the controller 160 to measure the X-direction dimension and the Y-direction dimension of the semiconductor package 30. Necessary information is input to the controller 160.

    Next, when it is detected in step 2 that the semiconductor package 30 to be inspected has been transported to a predetermined position by the third transport unit 6, the controller 160 in step 3, the fourth transport unit 7 (arm 8). To move the transport head 10 above the predetermined position. In the next step 4, the controller 160 drives the first and second motors 131 and 132 by driving amounts corresponding to the X dimension and Y dimension information of the semiconductor package 30 previously input. Thus, the center of the semiconductor package 30 is substantially aligned with the center of the suction area (the semiconductor package 30 is aligned). Specifically, when the motors 131 and 132 are stepping motors, a number of pulse signals corresponding to information on the X-direction dimensions and the Y-direction dimensions of the semiconductor package 30 are supplied to the stepping motors 131 and 132. However, when the configuration shown in FIG. 4B is adopted, a number of pulse signals larger by a predetermined amount than the number corresponding to the information of the X direction dimension and the Y direction dimension of the semiconductor package 30 are given.

  The controller 160 may vary the drive timings of the first motor 131 and the second motor 132. For example, according to the shape and size of the semiconductor package, the alignment claw is first contacted from the direction in which alignment is easy, and then the alignment claw is contacted from the other direction.

  In the next step 5, the controller 160 sucks the semiconductor package 30 aligned in the previous step 4 by the negative pressure introduced into the suction nozzle 105. Here, a case where the semiconductor package 30 is aligned before suction will be described. However, the alignment may be performed substantially simultaneously with the suction, or may be performed after suction.

  In the next step 6, the controller 160 drives the fourth transport unit 7 (arm 8) to move the transport head 10 onto the test head 21 of the test apparatus 20, and the protrusion provided on the head body 100. The semiconductor package 30 is pressed against the socket 22 while engaging 107 and the guide hole 25 formed in the test head 21. In this state, the first and second stepping motors 131 and 132 may be driven again to finely adjust the alignment of the semiconductor package 30.

  Next, when it is determined in step 7 that the inspection of the semiconductor package 30 by the test apparatus 20 has been completed, the controller 160 drives the fourth transport unit 7 in step 8 and causes the transport head 10 to leave the test apparatus 20. At the delivery position to the fifth transport unit, the first and second stepping motors 131 and 132 are driven to release the contact of the alignment claws with the semiconductor package 30 and also release the suction by the suction nozzle 105. .

  Next, in step 9, it is determined whether or not the semiconductor package to be inspected still remains. If it remains, the process returns to step 2, and if all semiconductor packages have been inspected, this flow ends. To do.

  In this embodiment, the case where four semiconductor packages 30 are sucked and transported by one transport head 10 has been described. However, in the present invention, the number of semiconductor packages that can be sucked by one transport head (the number of suction nozzles). Is not limited to four, but may be one, two, three, or five or more.

  In addition, the embodiment of the present invention is not limited to the configuration described in the above example, and can be modified as appropriate. For example, the present invention can be applied to an apparatus in which a test apparatus and a transport apparatus are integrated.

BRIEF DESCRIPTION OF THE DRAWINGS The side view which shows the whole structure of the semiconductor manufacturing apparatus in Example 1 of this invention. FIG. 6 is a side view showing the configuration of a fourth transfer unit of the semiconductor manufacturing apparatus in Example 1. FIG. 3 is a diagram illustrating a schematic configuration of a transport head and a test head of the semiconductor manufacturing apparatus in the first embodiment. FIG. 3 is a schematic diagram illustrating a configuration of a transport head of the semiconductor manufacturing apparatus according to the first embodiment. FIG. 6 is a schematic diagram illustrating a modified example of the transport head in the first embodiment. FIG. 3 is a diagram illustrating a detailed configuration of a transport head in Embodiment 1. FIG. 3 is a diagram illustrating a state of alignment between the semiconductor package and the transport head in the first embodiment. The figure for demonstrating the difference in effect of Example 1 and a prior art. 3 is a flowchart showing an operation procedure of the semiconductor manufacturing apparatus according to the first embodiment. FIG. 6 is a diagram for explaining the relationship between the width of the alignment claw and the size of the semiconductor package in the first embodiment. The figure which shows the jig | tool for position alignment of the workpiece | work conventionally used. The figure which shows the jig | tool for position alignment of the workpiece | work conventionally used. The figure which shows the mode of cutting out from the wafer of a semiconductor package. The figure which shows the mode of the position shift of the workpiece | work with respect to the conventional positioning jig.

Explanation of symbols

DESCRIPTION OF SYMBOLS 1 Handler 4-7 Conveyance unit 8 Arm 10 Conveyance head 20 Test apparatus 21 Test head 22 Socket 23 Contact pin 25 Guide hole 30 Semiconductor package 100 Head main body 101-104 Base member 101a-101d, 102a-102d, 103a-103d, 104a to 104d Positioning claw 105 Suction nozzle 107 Protruding part 120, 125 Lever 131, 132 Motor 160 Controller

Claims (6)

A transport head having a suction portion for sucking the semiconductor device by negative pressure;
The transport head is
First and second alignment members disposed on both sides of the suction portion in a first direction and movable in the first direction;
Third and fourth alignment members disposed on both sides of the suction portion in a second direction substantially perpendicular to the first direction and movable in the second direction;
A first drive mechanism driven by a first drive source to drive the first and second alignment members in a direction approaching and retreating from each other;
A second drive mechanism that is driven by a second drive source and drives the third and fourth alignment members in a direction toward and away from each other;
A controller that independently controls each of the first and second drive sources;
A semiconductor manufacturing apparatus, wherein each of the alignment members is brought into contact with the semiconductor device to perform alignment of the semiconductor device with respect to the transport head.   The first drive mechanism drives the first and second alignment members in substantially the same amount relative to the drive amount of the first drive source in each of the approaching direction and the retracting direction, and The second drive mechanism drives the third and fourth alignment members in substantially the same amount relative to the drive amount of the second drive source in each of the approaching direction and the retracting direction. Item 2. The semiconductor manufacturing apparatus according to Item 1. The transport head is provided with a plurality of suction portions for sucking the semiconductor device, and the first to fourth alignment members are provided corresponding to the suction portions,
The first drive mechanism drives the first and second alignment members corresponding to all the suction portions, and the second drive mechanism corresponds to the third and fourth corresponding to all the suction portions. The semiconductor manufacturing apparatus according to claim 1, wherein the alignment member is driven. The control unit independently controls each of the first and second drive sources in accordance with information indicating a size of the semiconductor device in the first and second directions. 4. The semiconductor manufacturing apparatus according to claim 1. 5. The semiconductor according to claim 1, wherein the control unit controls the drive timing of the first and second drive sources with respect to the suction timing of the semiconductor device by the suction unit. Manufacturing equipment. A semiconductor manufacturing apparatus according to any one of claims 1 to 5,
And a test apparatus for inspecting the semiconductor device conveyed by the semiconductor manufacturing apparatus.