JP2006152388A - Plating method and coating agent - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To perform plating on a molding subjected to powder coating and a shaped article coated with a general coating film. <P>SOLUTION: In the case of plating to a powder coating film surface of the molding subjected to the powder coating, one layer of the film surface PAL is newly formed on the powder coating film surface PP of the molding CM subjected to the powder coating with the coating agent which comes in tight contact with the powder coating film, bonds to electroless nickel and has corrosion resistance, thereafter, an electrolss nickel layer NI is formed on the new film surface, and electroplating of metal is applied onto the electrolss nickel layer. <P>COPYRIGHT: (C)2006,JPO&NCIPI

Description

  The present invention relates to a plating method and a coating agent, and in particular, forms a new film surface on a powder coating film surface or forms a new film surface on a coating film surface of a molded product. In particular, the present invention relates to a method for plating a coating film surface that enables plating, and a coating agent.

  Conventionally, the conditions of a material that can be plated are (1) a material that has smoothness and electrical conductivity and can form an electrolytic nickel layer, or (2) a smooth material that contains butadiene as a component. In addition, it is a substance that can form an electroless nickel layer on the corroded surface by corroding the surface. That is, a material that does not satisfy any of the above conditions cannot be plated.

・ Plating of cast products:
In the manufacturing process of a cast molded product, a non-ferrous metal or a metal, which is a raw material, is melted in a mold by heat treatment and is poured and cooled, but the raw material contains air by melting. The air becomes bubbles, and as shown in FIG. 1, a burrow H is generated in the cast product CM finished after cooling, and smoothness cannot be obtained.
Since the plated product reflects the smoothness of the surface of the material as it is, the smoothness of the material is inevitably required to produce a smooth plated product. In order to obtain the smoothness of the cast product, the powder coating P must be applied so as to cover the burrow (see FIG. 2).
However, since the electroless nickel layer does not adhere to the powder coating surface, plating is impossible. That is, there is a problem that conventional plating cannot be easily performed on the powder coating film surface for imparting smoothness to the cast product.

・ Plating of forged molded products:
In the manufacturing process of forged products, the material is pressed. Since the material is melted and hardened by heat treatment, the surface is not smooth. Polishing is necessary to obtain a smooth surface. Polishing the details of a molded product by polishing is difficult, time consuming and requires skill.
Further, when re-plating for repairing, such as when the plated surface is scratched, it is necessary to peel the plating layer MP as shown in FIG. 3, and the surface of the forged molded product base FM is removed after the peeling processing. There is a problem that polishing is necessary again because of roughening.
As described above, conventionally, it is not easy to plate a forged product with smoothness, and there is a problem that re-plating cannot be easily performed.

・ Plating of general paint products:
Conventionally, non-ferrous metals (aluminum), molded products that do not contain butadiene in substances other than metal and composition components are not electrically conductive and are not corroded, so electroless nickel does not bond and plating is impossible. Therefore, it is conceivable to coat these materials and molded products with a general coating film (general coating film other than fluorine, silicone, soft vinyl) and plating, but it can adhere to the general coating film surface and is electroless. Since there is no substance to which nickel can be bonded, the above-mentioned substances and molded products cannot be plated.
Accordingly, an object of the present invention is to provide a plating method and a coating agent capable of plating a cast molded product and a forged molded product with smoothness.
Another object of the present invention is to provide a plating method and a coating agent capable of plating a powder-coated molded product and a molded product coated with a general coating film.

According to the present invention, there is provided a plating method for plating a coating film surface, wherein the above-mentioned problem is in close contact with the powder coating film on the powder coating film surface of a powder-coated molded product, and in electroless nickel. A step of forming a new film surface with a corrosive coating agent to be bonded, a step of forming an electroless nickel layer on the new film surface, and electroplating a metal on the electroless nickel layer This is achieved by a plating method comprising steps.
Further, according to the present invention, in the plating method for plating a coating film surface according to the present invention, the coating film surface formed by coating a molded product is adhered to the coating film and bonded to electroless nickel. A step of forming a new film surface with a corrosive coating agent, a step of forming an electroless nickel layer on the new film surface, and a step of performing electroplating of metal on the electroless nickel layer This is achieved by the plating method provided.
The coating agent contains cyclohexanone bonded to the electroless nickel surface and corrosive and acetone having adhesion to the coating film surface. The coating agent includes butyl acetate and methyl isobutyl ketone as a coating film adhesion auxiliary material.

  According to the present invention, a corrosive coating agent that adheres to a powder coating film or a general coating film and binds to electroless nickel is coated on the powder coating film surface or the general coating film surface. Then, since the electroless nickel layer was formed, it was possible to plate the material on which the powder coating film or the general coating film was formed with smoothness. In particular, it was possible to plate with smoothness to cast products, forged products, non-ferrous metals (aluminum), and non-metal materials and compositions that did not contain butadiene. .

When plating on a powder coating film surface of a powder coated molded product, the powder coating film surface of the molded product coated with powder is adhered to the powder coating film and bonded to electroless nickel. A new film surface is formed with a corrosive coating agent, and then an electroless nickel layer is formed on the new film surface, and metal electroplating is performed on the electroless nickel layer. .
In addition, on the coating film surface formed by coating a molded product with a general coating agent, a new film surface is formed with a corrosive coating agent that adheres to the coating film and bonds to electroless nickel, Thereafter, an electroless nickel layer is newly formed on the film surface, and metal electroplating is performed on the electroless nickel layer.
The coating agent is a cyclohexanone that binds to the electroless nickel surface and has corrosive properties, acetone that has adhesion to the coating film surface, and butyl acetate and methyl isobutyl ketone diluted with a diluent as a coating film adhesion auxiliary material. is there.

シクロヘキサノンは、無電解ニッケル面に結合する性質および腐食性を備えており、アセトンは塗装膜面に対する密着性を保持する性質を有している。本発明のコーティング剤は、少なくともこれらの性能を備えた材料を含むことが必須であるが、同様の性能を持つものであれば、シクロヘキサノン、アセトンに限らない。酢酸ブチルとメチルイソブチルケトンは塗装膜密着補助剤として機能し、トルエンは希釈剤である。表1の配合比が良好な密着性と無電解ニッケルメッキを可能にするが、希釈剤であるトルエンの量を増減して配合比を多少変えても、良好な密着性、無電解ニッケル面に対する結合性、腐食性を維持できる。換言すれば、シクロヘキサノンやアセトンなどの配合比は、塗装膜に対する密着性能および無電解ニッケル面に対する結合性能および腐食性能を維持できる範囲で変えることができる。 FIG. 4 is an explanatory view of the plating process of the first embodiment of the present invention, in which a powder coating film is formed on a cast molded article, and then an electroless nickel layer is formed by electroless plating after coating with a coating agent. Is the case.
After melting at a high temperature, a cast molded product CM is molded with a mold (see FIG. 1). Next, a powder coating surface PP is formed by powder coating in order to give smoothness to the surface of the mold-molded product made of bubbles (see FIG. 2). After the powder coating surface is formed, the smooth powder coating surface is coated with the coating agent according to the present invention to form a plating auxiliary layer PAL. The coating agent has the components and blending ratios shown in Table 1.

Cyclohexanone has the property of bonding to the electroless nickel surface and corrosivity, and acetone has the property of maintaining adhesion to the coating film surface. The coating agent of the present invention must contain at least a material having these performances, but is not limited to cyclohexanone or acetone as long as it has similar performance. Butyl acetate and methyl isobutyl ketone function as a coating film adhesion aid, and toluene is a diluent. The blending ratio in Table 1 enables good adhesion and electroless nickel plating, but good adhesion to the electroless nickel surface even if the blending ratio is slightly changed by increasing or decreasing the amount of diluent toluene. Bondability and corrosivity can be maintained. In other words, the compounding ratio of cyclohexanone, acetone, or the like can be changed within a range in which adhesion performance to the coating film, bonding performance to the electroless nickel surface, and corrosion performance can be maintained.

The coating (coating) of the coating agent is performed by spraying or applying the coating agent onto the powder coating surface PP using a spray gun 11 as shown in FIG. 5 or a brush 12 as shown in FIG. And wear it. It can also be automatically applied by a coating robot.
Next, an electroless nickel layer NI is formed on the plating auxiliary layer PAL (FIG. 4 (4)). Since metal plating is thereby possible, electrolytic plating is performed with a desired metal on the electroless nickel layer NI to form a plating layer MPL (FIG. 4 (5)). In the electroplating of metal, for example, an electrolytic nickel layer is formed on an electroless nickel layer, and then electrolytic plating is performed on the electrolytic nickel layer with a desired metal.
As described above, according to the first embodiment, the corrosive coating agent that adheres to the powder coating film and binds to the electroless nickel is coated on the surface of the powder coating film. An electroless nickel layer can be formed on the electroless nickel layer, whereby a predetermined metal plating can be performed on the electroless nickel layer.

FIG. 7 is an explanatory diagram of the plating process of the second embodiment of the present invention, in which a general coating film (general coating film other than fluorine, silicone, soft vinyl) is formed on an object that is not conductive and cannot be etched. In this case, an electroless nickel layer is formed after coating a coating agent thereon.
A surface PS of a general coating film (a general coating film other than fluorine, silicone, or soft vinyl) is formed on the molded product ML that is not electrically conductive and cannot be etched ((1) and (2) in FIG. 7). Thereafter, the general coating film surface PS is coated with the coating agent according to the present invention to form a plating auxiliary layer PAL (FIG. 7 (3)). The coating agent is shown in Table 1. The coating (coating) method for the coating agent is performed in the same manner as in the first embodiment.
Next, an electroless nickel layer NI is formed on the plating auxiliary layer PAL (FIG. 7 (4)). Since metal plating is thereby possible, electrolytic plating is performed with a desired metal on the electroless nickel layer NI to form a plating layer MPL (FIG. 7 (5)).
As described above, according to the second embodiment, the corrosive coating agent that adheres to the general coating film and binds to the electroless nickel is coated on the surface of the general coating film. A nickel layer can be formed, which allows predetermined metal plating on the electroless nickel layer.

It is sectional drawing of a cast molding product. It is explanatory drawing of the reason why plating cannot be carried out on a cast product. It is explanatory drawing of the reason why the replating process of a forge molded product is difficult. It is explanatory drawing of the plating process of 1st Example of this invention. It is explanatory drawing of the coating method of the coating agent using a spray gun. It is explanatory drawing of the coating method of the coating agent using a brush. It is explanatory drawing of the plating process of 2nd Example of this invention.

Explanation of symbols

CM Cast molding PP Powder coating surface PAL Plating auxiliary layer NI Electroless nickel layer MPL Electroplating layer with desired metal

Claims (6)

In the plating method of plating the paint film surface,
A step of forming a new film surface on the powder coating film surface of a powder coated molded article with a corrosive coating agent that adheres to the powder coating film and bonds to electroless nickel ,
Forming an electroless nickel layer on the new film surface;
Applying a metal electrolytic plating on the electroless nickel layer;
A plating method comprising: In the plating method of plating the paint film surface,
A step of forming a new film surface with a corrosive coating agent that adheres to the paint film and binds to electroless nickel on the paint film surface obtained by painting a molded product,
Forming a new electroless nickel layer on the film surface;
Applying a metal electrolytic plating on the electroless nickel layer;
A plating method comprising: The plating method according to claim 1, wherein the coating agent contains acetone that binds to electroless nickel and has corrosive properties and has adhesion to a coating film surface. The plating method according to claim 3, wherein the coating agent contains butyl acetate and methyl isobutyl ketone as paint film adhesion auxiliary materials. In the coating agent that enables the formation of an electroless nickel layer on the paint film,
A coating agent comprising: cyclohexanone bonded to electroless nickel and corrosive, and acetone having adhesion to a paint film surface. 6. The coating agent according to claim 5, wherein the coating agent contains butyl acetate and methyl isobutyl ketone as paint film adhesion assistants, and toluene as a diluent.

Images