JP2006148152A5 - - Google Patents
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- Publication number
- JP2006148152A5 JP2006148152A5 JP2005375248A JP2005375248A JP2006148152A5 JP 2006148152 A5 JP2006148152 A5 JP 2006148152A5 JP 2005375248 A JP2005375248 A JP 2005375248A JP 2005375248 A JP2005375248 A JP 2005375248A JP 2006148152 A5 JP2006148152 A5 JP 2006148152A5
- Authority
- JP
- Japan
- Prior art keywords
- heated
- fluid
- heater
- soldering apparatus
- blower
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
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Claims (4)
上記送風機と上記ヒーターとの間に配置され、上記送風機から送られる流体の圧力を均一にするとともに、上記ヒーターに対して通風可能な複数の孔を有する多孔質体と、
上記ヒーターと上記被加熱物の間に配置され、上記ヒーターによって加熱された流体を乱流として上記被加熱物に吹き付ける輻射板とを備え、
上記送風機が流体を吸引して加圧することにより、ケーシングと上記多孔質体により仕切られた空間内部の流体圧を上昇させ、
上記空間内部において流体圧が上昇した流体を、上記多孔質体に設けられた上記複数の孔から上記輻射板の方向に噴出することにより、略一定速度の流体とすることを特徴とするはんだ付け装置。 In a soldering apparatus having a heating furnace unit for heating a fluid to be heated by heating a fluid sent from a blower with a heater and spraying the heating fluid on the object to be heated.
A porous body that is disposed between the blower and the heater and has a plurality of holes that can ventilate the heater while making the pressure of the fluid sent from the blower uniform.
Is disposed between the heater and the heated object, e Bei a radiation plate for blowing fluid heated by the heater to the object to be heated as a turbulent flow,
The air blower sucks and pressurizes the fluid to increase the fluid pressure inside the space partitioned by the casing and the porous body,
Soldering, wherein the fluid whose fluid pressure has increased inside the space is made to be a substantially constant speed fluid by ejecting the fluid from the plurality of holes provided in the porous body in the direction of the radiation plate. apparatus.
上記加熱炉ユニットを上記被加熱物の搬送方向に複数個接続するとともに、上記被加熱物の搬送方向と逆方向に流体の流れを形成することを特徴とするはんだ付け装置。 The soldering apparatus according to claim 1,
A soldering apparatus, wherein a plurality of the heating furnace units are connected in a conveying direction of the object to be heated, and a fluid flow is formed in a direction opposite to the conveying direction of the object to be heated.
さらに、上記加熱炉ユニットによって加熱された被加熱物を冷却する冷却ユニットを備え、
この冷却ユニットは、冷却用流体を上記被加熱物に吹き付ける送風機と、被加熱物によって昇温した流体を冷却する冷却器と、上記送風機と上記被加熱物との間に配置され、上記送風機から送られる流体の圧力を均一にするとともに、上記被加熱物に対して通風可能な複数の孔を有する多孔質体とを備えたことを特徴とするはんだ付け装置。 The soldering apparatus according to claim 1,
Furthermore, a cooling unit for cooling an object to be heated heated by the heating furnace unit is provided,
The cooling unit is disposed between a blower that blows a cooling fluid onto the object to be heated, a cooler that cools the fluid heated by the object to be heated, and the fan and the object to be heated. A soldering apparatus comprising: a porous body having a plurality of holes through which the pressure of fluid to be fed is made uniform and can be ventilated to the object to be heated.
上記冷却ユニットを上記被加熱物の搬送方向に複数個接続するとともに、上記被加熱物の搬送方向と逆方向に流体の流れを形成することを特徴とするはんだ付け装置。 The soldering apparatus according to claim 3,
A plurality of the cooling units are connected in the conveying direction of the heated object, and a fluid flow is formed in a direction opposite to the conveying direction of the heated object.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2005375248A JP2006148152A (en) | 2005-12-27 | 2005-12-27 | Soldering equipment |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2005375248A JP2006148152A (en) | 2005-12-27 | 2005-12-27 | Soldering equipment |
Related Parent Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP35146899A Division JP2001170767A (en) | 1999-12-10 | 1999-12-10 | Soldering apparatus |
Related Child Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2010036991A Division JP2010135839A (en) | 2010-02-23 | 2010-02-23 | Soldering equipment |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JP2006148152A JP2006148152A (en) | 2006-06-08 |
| JP2006148152A5 true JP2006148152A5 (en) | 2006-12-28 |
Family
ID=36627378
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2005375248A Pending JP2006148152A (en) | 2005-12-27 | 2005-12-27 | Soldering equipment |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP2006148152A (en) |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN113145963B (en) * | 2021-06-08 | 2023-05-02 | 广西易德科技有限责任公司 | Water nozzle welding method for water chamber of water-cooled radiator |
-
2005
- 2005-12-27 JP JP2005375248A patent/JP2006148152A/en active Pending
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