JP2006148100A5 - - Google Patents
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- Publication number
- JP2006148100A5 JP2006148100A5 JP2005329871A JP2005329871A JP2006148100A5 JP 2006148100 A5 JP2006148100 A5 JP 2006148100A5 JP 2005329871 A JP2005329871 A JP 2005329871A JP 2005329871 A JP2005329871 A JP 2005329871A JP 2006148100 A5 JP2006148100 A5 JP 2006148100A5
- Authority
- JP
- Japan
- Prior art keywords
- gas
- plasma discharge
- organic silicon
- reactor
- substrate
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Withdrawn
Links
- 239000007789 gas Substances 0.000 claims 33
- 238000000034 method Methods 0.000 claims 28
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 claims 17
- 229910052710 silicon Inorganic materials 0.000 claims 17
- 239000010703 silicon Substances 0.000 claims 17
- 239000000758 substrate Substances 0.000 claims 11
- 239000010419 fine particle Substances 0.000 claims 10
- 239000011261 inert gas Substances 0.000 claims 7
- 239000012495 reaction gas Substances 0.000 claims 7
- 239000004215 Carbon black (E152) Substances 0.000 claims 5
- 238000000151 deposition Methods 0.000 claims 5
- 229930195733 hydrocarbon Natural products 0.000 claims 5
- 239000002105 nanoparticle Substances 0.000 claims 5
- 125000001183 hydrocarbyl group Chemical group 0.000 claims 4
- 230000015572 biosynthetic process Effects 0.000 claims 3
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 claims 1
- 229910052786 argon Inorganic materials 0.000 claims 1
- 229910052799 carbon Inorganic materials 0.000 claims 1
- 238000010438 heat treatment Methods 0.000 claims 1
- 229910052734 helium Inorganic materials 0.000 claims 1
- 150000002430 hydrocarbons Chemical class 0.000 claims 1
- 230000001590 oxidative effect Effects 0.000 claims 1
- 238000009832 plasma treatment Methods 0.000 claims 1
- 229910052724 xenon Inorganic materials 0.000 claims 1
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US10/990,562 US20060105583A1 (en) | 2004-11-17 | 2004-11-17 | Formation technology of nano-particle films having low dielectric constant |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JP2006148100A JP2006148100A (ja) | 2006-06-08 |
| JP2006148100A5 true JP2006148100A5 (enExample) | 2008-12-25 |
Family
ID=36386956
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2005329871A Withdrawn JP2006148100A (ja) | 2004-11-17 | 2005-11-15 | 低誘電率ナノ粒子膜の形成技術 |
Country Status (2)
| Country | Link |
|---|---|
| US (1) | US20060105583A1 (enExample) |
| JP (1) | JP2006148100A (enExample) |
Families Citing this family (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP4628900B2 (ja) * | 2005-08-24 | 2011-02-09 | 株式会社日立ハイテクノロジーズ | プラズマ処理装置 |
| US8080282B2 (en) * | 2006-08-08 | 2011-12-20 | Asm Japan K.K. | Method for forming silicon carbide film containing oxygen |
| US20130189446A1 (en) * | 2008-09-03 | 2013-07-25 | Dow Corning Corporation | Low pressure high frequency pulsed plasma reactor for producing nanoparticles |
| JP5616737B2 (ja) * | 2009-11-20 | 2014-10-29 | 株式会社日立国際電気 | 半導体装置の製造方法、基板処理方法および基板処理装置 |
Family Cites Families (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5763429A (en) * | 1993-09-10 | 1998-06-09 | Bone Care International, Inc. | Method of treating prostatic diseases using active vitamin D analogues |
| US6245690B1 (en) * | 1998-11-04 | 2001-06-12 | Applied Materials, Inc. | Method of improving moisture resistance of low dielectric constant films |
| KR100311234B1 (ko) * | 1999-01-18 | 2001-11-02 | 학교법인 인하학원 | 고품위 유도결합 플라즈마 리액터 |
| TW507256B (en) * | 2000-03-13 | 2002-10-21 | Mitsubishi Heavy Ind Ltd | Discharge plasma generating method, discharge plasma generating apparatus, semiconductor device fabrication method, and semiconductor device fabrication apparatus |
| US6602800B2 (en) * | 2001-05-09 | 2003-08-05 | Asm Japan K.K. | Apparatus for forming thin film on semiconductor substrate by plasma reaction |
| US6667577B2 (en) * | 2001-12-18 | 2003-12-23 | Applied Materials, Inc | Plasma reactor with spoke antenna having a VHF mode with the spokes in phase |
| US20030211244A1 (en) * | 2002-04-11 | 2003-11-13 | Applied Materials, Inc. | Reacting an organosilicon compound with an oxidizing gas to form an ultra low k dielectric |
-
2004
- 2004-11-17 US US10/990,562 patent/US20060105583A1/en not_active Abandoned
-
2005
- 2005-11-15 JP JP2005329871A patent/JP2006148100A/ja not_active Withdrawn
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