JP2006148026A - Structure of mounting electronic component onto printed wiring board, and mounting method thereof - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a structure of mounting an electronic component onto a printed wiring board and a mounting method thereof that can stably locate, solder and mount the electronic component, which cannot stably be fitted because of its outer shape, onto the printed wiring board. <P>SOLUTION: The mounting method is configured to include the steps of: adhering an insulating base chip 11 used for tentatively fixing the electronic component 21 to a prescribed position on the printed wiring board 1, the prescribed position being determined related to the mounted electronic component 21; tentatively fixing the electronic component 21 via an adhering layer 14 provided to an upper side 13 of the base chip 11; and soldering and mounting the electronic component 21 to a side of the printed wiring board 1 by passing the printed wiring board 1 through a soldering bath after the tentative fixing. <P>COPYRIGHT: (C)2006,JPO&NCIPI

Description

  The present invention provides a mounting structure of an electronic component on a printed wiring board that can stably and surely mount an electronic component having a relatively unstable appearance including a toroidal type coil on the printed wiring board side, and This is a technology related to the mounting method.

  On the printed wiring board, individual electronic components are individually soldered and mounted on the corresponding electric circuit side. In this case, depending on the specific shape and structure of the electronic component, it may be difficult to reliably mount it on the printed wiring board side in a stable state.

  For example, when the electronic component is a toroidal type coil used to remove noise in a specific frequency region in a power supply circuit or the like, the entire shape thereof has an annular shape, so that it is on the printed wiring board. It is arranged under an unstable state where the position cannot be fixed. For this reason, conventionally, an electronic component having an unstable shape has been mounted by soldering after being stably fixed in position by interposing a pedestal or the like.

  FIG. 3 is an explanatory view showing a conventional method for fixing a position on a printed wiring board, taking as an example the case where the electronic component is a toroidal coil, of which (a) is a front view, b) shows side views, respectively.

  According to the figure, the toroidal type coil 5 is stably arranged on the printed wiring board 1 via the base 7 provided on the upper surface thereof with the coil mounting portion 8 inserted into the outer periphery thereof so as to follow the outer peripheral shape thereof. For example, the end 6a of the lead 6 drawn out from the winding side is inserted into the through hole 2 formed on the conductor pattern 3 side and soldered to be mounted on the printed wiring board 1 side. It can be done.

Also, in this type of toroidal coil, as shown in Patent Document 1 below, the toroidal core is wrapped from both sides by a pair of half-structure synthetic resin core covers in which the core cover portion and the pedestal portion are integrated. In addition, there is already one that can be mounted after being stably fixed to the printed wiring board side via the pedestal portion.
JP 2002-57034 A

  However, in the case of the example shown in FIG. 3, the toroidal coil 5 can be stably disposed on the printed wiring board 1 side via the base 7, but for example, for a large current, etc. When the wire diameter of the winding is large, there is a problem that the diameter does not match when it is placed on the coil placement portion 8 of the pedestal 7 and lacks stability. In addition, the windings have severe irregularities, and depending on the number of windings, there is a disadvantage that it is difficult to place the windings in a stable state without inclination with respect to the pedestal 7 side.

  As a method of avoiding such inconvenience, it is possible to prepare a dedicated pedestal of standard size corresponding to the size of each toroidal type coil, but the mold for producing the dedicated pedestal is also in accordance with it. There is a problem that it is necessary to prepare a large number of types and the cost increases accordingly.

  For this reason, toroidal coils with poor matching with the pedestal prepared in advance have been placed directly on the printed wiring board side without using the pedestal, but the position state at that time is unstable Therefore, when passing through the solder bath, the solder cannot be sufficiently distributed, and as a result, there is a problem that the work efficiency is lowered, for example, the soldering operation has to be performed again.

  On the other hand, in the case of the disclosed technique disclosed in Patent Document 1, although the toroidal coil can be stably arranged on the printed wiring board side, the gold cover for individually creating the core cover corresponding to the size is available. The molds had to be prepared separately, and the problem of increasing the cost as in the case shown in FIG. 3 still remained.

  In view of the above-mentioned problems found in the prior art, the present invention provides a printed wiring board side without using a dedicated pedestal, even if it is an electronic component that exhibits an unstable external shape such as a toroidal coil. It is an object of the present invention to provide a mounting structure of an electronic component on a printed wiring board and a mounting method thereof that can be stably placed and securely soldered and mounted.

  The present invention has been made to achieve the above object, and a first invention (mounting structure) includes the electronic component at a predetermined position on a printed wiring board determined in relation to the electronic component to be mounted. Insulating base piece that is preliminarily pasted and arranged to be temporarily fixed, and soldering under a temporary fixing state via an adhesive layer provided on the upper surface of the base piece The electronic component is mounted on the printed wiring board side, and the electronic component includes a lead that is drawn out from the main body side and preliminarily soldered to the end thereof, and the base piece has The preliminary solder of the lead having a thickness not less than a variation limit in the attachment length direction of the pre-solder attachment portion at the end of the lead, and the electronic component is inserted through a through hole provided in the printed wiring board Solder through the attachment site The most important feature that was implemented in Rukoto.

  On the other hand, in the second invention (mounting method), an insulating base piece used for stably temporarily fixing the electronic component at a predetermined position on the printed wiring board determined by the relationship with the electronic component to be mounted is provided. A step of adhering, a step of temporarily fixing the electronic component via an adhesive layer provided on the upper surface of the base piece, and the electronic component on the printed wiring board side by passing through a solder tank after temporary fixing And at least a process of soldering and mounting.

  In this case, the electronic component includes at least a lead drawn out from the main body side, and the lead part is temporarily fixed on the base piece in a state where the end portion of the lead is inserted into the through hole side provided in the printed wiring board. It is desirable to mount by soldering. In this case, it is preferable that the thickness of the base piece is not less than a variation limit in the attached length direction of the preliminary solder attached in advance to the end side of the lead.

  According to the invention (mounting structure) according to claim 1 of the present invention, the electronic component is in a state where it is stably temporarily fixed on the base piece that is preliminarily pasted and arranged at a predetermined position on the printed wiring board. Since it is originally soldered and mounted, for example, even if it exhibits a relatively unstable external shape including a toroidal coil, it is stable on the printed wiring board side without using a costly pedestal, and It can be surely mounted under a simple structure.

  Moreover, the electronic component is printed after interposing a base piece having a thickness greater than the variation limit in the attachment length direction of the preliminary solder attached to the end portion of the lead drawn from the main body side. Soldered and mounted under the condition that the lead side is inserted into the through-hole provided on the wiring board, so soldering is performed under the condition that the pre-solder adhering part in the lead is securely positioned on the through-hole side. Will be able to.

  On the other hand, according to the invention according to claim 2 (mounting method), the base piece for temporarily fixing the electronic component is attached to the predetermined position on the printed wiring board, and the electronic component is temporarily fixed to the upper surface thereof. Since it is possible to mount electronic components on the printed wiring board side by passing through the solder bath and soldering, the pedestal is expensive even for electronic components that exhibit unstable external shapes such as toroidal coils. It can be easily soldered and mounted without using.

  According to the invention of claim 3, the electronic component is temporarily soldered on the base piece while the end portion of the lead drawn out from the electronic component is inserted into the through hole of the printed wiring board. Since it can be attached and mounted, the electronic component having the leads can be surely soldered.

  Furthermore, according to the invention of claim 4, the base piece has a thickness that is longer than the variation limit in the attachment length direction of the preliminary solder attached to the end side of the lead of the electronic component in advance. Thus, the pre-solder adhesion site in the lead can always be positioned on the through hole side of the printed wiring board, so that soldering can be performed more reliably.

  FIG. 1 is an explanatory view of a main part showing an example of an electronic component mounting structure (first invention) on a printed wiring board according to the present invention, in which (a) is a front view and (b) is a side view. Each figure is shown. FIG. 1 shows an example in which the electronic component to be mounted is a toroidal coil.

  According to the figure, the mounting structure of the electronic component on the printed wiring board according to the present invention is a predetermined position on the printed wiring board 1 determined by the relationship with the toroidal coil 22 which is one of the electronic components 21 to be mounted. A base piece 11 made of a material rich in heat resistance and insulation, which is preliminarily pasted and arranged to stably temporarily fix the toroidal coil 22, and an adhesive provided on the upper surface 13 of the base piece 11. It comprises at least a toroidal coil 22 mounted on the printed wiring board 1 side by soldering under a temporarily fixed state via the layer 14.

  Among these, the base piece 11 is formed with an appropriate surface size on which the toroidal type coil 22 can be placed via the upper surface 13. For example, in addition to natural rubber materials and elastomers, It is formed using an appropriate material rich in heat resistance and insulation, such as engineering plastic.

  Further, the base piece 11 has a thickness that exceeds the variation limit in the attachment length direction of the pre-solder attachment portion 27 in which the pre-solder is preliminarily attached to the end portion 26a side of the lead 26 drawn from the toroidal coil 22 side. The bottom surface 12 and the upper surface 14 have an adhesive layer 14 formed by applying an appropriate adhesive (such as an epoxy resin) or a pressure-sensitive adhesive. It is formed with a structure like a double-sided tape.

  On the other hand, the toroidal coil 22 includes an annular core portion 23 having appropriate inner and outer diameters, an insulating material 24 covering the core portion 23, and an insulating material 24 interposed therebetween. A through-hole 2 is formed by a winding 25 having an appropriate wire diameter that is spirally wound around the core portion 23, and a lead 26 is drawn from the winding 25 on the main body side and provided in the printed wiring board 1. It can be inserted into. In addition, the code | symbol 3 in a figure shows the conductor pattern 3. FIG.

  Therefore, the toroidal coil 22 as the electronic component 21 has a predetermined position on the printed wiring board 1 even if it has a relatively unstable appearance to be placed on the printed wiring board 1. Are mounted by soldering in a state where they are stably temporarily fixed via the adhesive layer 14 on the upper surface 13 side of the base piece 11 that is previously attached and attached to the base piece 11.

  In addition, the lead 26 which is in the toroidal coil 22 and is drawn from the main body side has a pre-solder attachment portion 27 in which pre-solder is applied after an insulating layer such as an enamel layer covering the end portion 26a side is peeled off in advance. It has. Further, the base piece 11 is formed with a thickness greater than the variation limit in the attachment length direction of the pre-solder attachment portion 27.

  For this reason, the toroidal coil 22 is mounted by soldering with the base piece 11 interposed, and with the pre-solder attachment portion 27 of the lead 26 inserted in the through hole 2 provided in the printed wiring board 1. Therefore, the lead 26 side is surely soldered to the through hole 2 under the positional relationship in which the preliminary solder adhering portion 27 located at the end 26a of the lead 26 is always located on the through hole 2 side. Will be able to.

  Next, referring to FIG. 2, a method for mounting an electronic component on a printed wiring board according to the present invention (second invention), and a structure for mounting the electronic component on a printed wiring board according to the present invention (first invention). ) And the operation and effect will be described below.

  That is, in the method of the present invention, a base used to temporarily fix the toroidal coil 22 side at a predetermined position on the printed wiring board 1 determined by the relationship with the toroidal coil 22 which is one of the electronic components 21 to be mounted. A step of adhering the piece 11, a step of temporarily fixing the toroidal coil 22 side via the adhesive layer 14 provided on the upper surface 13 of the base piece 11, and passing through a solder bath (not shown) after temporary fixing. Thus, at least a step of soldering and mounting the toroidal type coil 22 on the printed wiring board 1 side is included.

  Among these, the step of attaching the base piece 11 to a predetermined position on the printed wiring board 1 is formed by applying an appropriate adhesive or adhesive to the bottom surface 12 and the top surface 13 as described above. The base piece 11 having the sticking layer 14 is used, and as shown in FIG. 2A, the printed wiring board 1 has a predetermined shape via the sticking layer 14 that the base piece 11 has on the bottom surface 13. This is done by sticking to the position.

  In addition, the step of temporarily fixing the toroidal type coil 22 which is the electronic component 21 includes the toroidal type coil with respect to the adhesive layer 14 which the base piece 11 attached to a predetermined position of the printed wiring board 1 has on the upper surface 13 thereof. 2A, the bottom surface side of the toroidal coil 22 is pasted while the end portion 26a side of the lead 26 is inserted into the through hole 2 of the printed wiring board 1 as shown in FIG. It is performed by sticking to the wearing layer 14 and temporarily fixing. In this case, the toroidal type coil 22 is against the base piece 11 having a thickness equal to or larger than the variation limit in the attachment length direction of the preliminary solder attachment portion 27 on the end portion 26a side of the lead 26 drawn out from the main body side. Since it is attached, the lead 26 side can be more reliably soldered to the through hole 2 with the preliminary solder adhesion portion 27 in the lead 26 always located on the through hole 2 side. .

  Further, in the process of soldering and mounting the toroidal coil 22 which is the electronic component 21, the toroidal coil 22 is temporarily fixed on the base piece 11, and the end 26 a side of the lead 26 has a preliminary solder adhesion site 27. An end portion of the lead 26 of the toroidal coil 22 is passed through the through hole 2 side of the printed wiring board 1 through a flow type or reflow type solder bath while being inserted into the through hole 2 of the printed wiring board 1. The toroidal coil 22 is mounted on the printed wiring board 1 side by reliably soldering via the pre-solder attachment portion 27a.

  Therefore, according to the method of the present invention, the toroidal type coil 22 as the electronic component 21 is preliminarily soldered on the end portion 26a side of the lead 26 in a state where it is stably temporarily fixed via the base piece 11. Since it is possible to pass through the solder bath in a state where the adhesion portion 27 is positioned on the through hole 2 side of the printed wiring board 1, it is possible to sufficiently spread the solder to the end portion 26 a side of the lead 26. Therefore, the toroidal coil 22 is surely mounted on the printed wiring board 1 side without reworking due to poor connection that is not soldered, and the work efficiency can be improved accordingly.

  Moreover, since the base piece 11 is formed with a thickness that is greater than the variation limit in the attachment length direction of the pre-solder attachment portion 27 on the end portion 26a side of the lead 26 of the toroidal coil 22, By fixing the toroidal type coil 22 while the lead 26 is securely connected to the through hole 2 of the printed wiring board 1, it is possible to prevent the drop from the printed wiring board 1 side.

  Further, when the base piece 11 is formed of an elastic material such as a natural rubber material or an elastomer, for example, even when a thermal shock is applied to the printed wiring board 1 side in addition to vibration or impact, the impact Therefore, it is possible to reliably avoid the inconvenience that the lead 26 is broken due to stress.

  The above is a description of a preferred example of the present invention, and the specific contents thereof are not limited to the above description. For example, the electronic component mounted on the printed wiring board is not limited to the toroidal type coil shown in the figure, and is likely to move when placed on the printed wiring board, such as a large capacitor or transformer. The present invention can be suitably applied to those that exhibit an unstable external shape. Therefore, the electronic component to be mounted may not include a lead that is inserted into the through hole of the printed wiring board.

  Further, the planar shape of the base piece is not limited to a square shape, and a shape that can securely fix electronic components to be mounted, such as a circular shape or an oval shape, is appropriately adopted as desired. be able to. Further, the base piece may be formed with a recess that can support the lower bottom surface of the electronic component to be mounted to some extent, with the upper surface being not flat.

It is principal part explanatory drawing which shows an example of the mounting structure (1st invention) of the electronic component to the printed wiring board which concerns on this invention, (a) shows a front view, (b) shows a side view, respectively. . It is principal part explanatory drawing which shows the example of a process of the mounting method (2nd invention) of the electronic component to the printed wiring board which concerns on this invention, (a) is the state before temporary fixing, (b) is temporary fixing It is a front view which shows the back state. It is explanatory drawing which shows roughly the attachment process of the mounting component to the pudding board which concerns on this invention. It is explanatory drawing which shows the position fixing method on the printed wiring board conventionally performed taking the case where an electronic component is a toroidal type coil as an example, (a) is a front view, (b) is a side view Each figure is shown.

Explanation of symbols

DESCRIPTION OF SYMBOLS 1 Printed wiring board 2 Through hole 3 Conductor pattern 11 Base piece 12 Bottom surface 13 Upper surface 14 Adhesion layer 21 Electronic component 22 Toroidal type coil 23 Core part 24 Insulation material 26 Winding 26 Lead 26a End part 27 Preliminary solder adhesion part

Claims (4)

An insulative base piece that is preliminarily adhered and disposed in a predetermined position on a printed wiring board determined by the relationship with the electronic component to be mounted, and is fixed on the upper surface of the base piece. It is composed of the electronic component mounted on the printed wiring board side by performing soldering under a temporarily fixed state through the provided adhesive layer,
The electronic component includes a lead that is pulled out from the main body side and preliminarily attached with a pre-solder at an end thereof, and the base piece has an attachment length direction of a pre-solder adhering portion at the end of the lead. With a thickness greater than the variation limit in
Mounting structure of electronic component on printed wiring board, wherein electronic component is mounted by soldering through said pre-solder attachment portion of lead inserted through hole provided in said printed wiring board .   A step of attaching an insulating base piece used to temporarily fix the electronic component at a predetermined position on a printed wiring board determined by the relationship with the electronic component to be mounted; and an upper surface of the base piece. It includes at least a step of temporarily fixing the electronic component via an adhesive layer and a step of soldering and mounting the electronic component on the printed wiring board side by passing a solder bath after the temporary fixing. A method of mounting electronic components on a printed wiring board.   The electronic component includes at least a lead pulled out from the main body side, and the end of the lead is inserted into the through-hole side provided in the printed wiring board and temporarily fixed on the base piece, and then soldered. The mounting method of the electronic component to the printed wiring board of Claim 2 to mount and mount. 4. The electronic component on a printed wiring board according to claim 3, wherein the thickness of the base piece is equal to or greater than a variation limit in the attachment length direction of a pre-solder attachment portion that is attached in advance to the end portion side of the lead. How to implement

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