JP2006148005A - Semiconductor device, radiation imaging apparatus, and its manufacturing method - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a radiation imaging apparatus having an arrangement of allowing connection and exchange of an electric connection component 150 even after a substrate having a pixel area 110 having pixels of a photosensor and a TFT two-dimensionally arranged is positioned on a support member 300 and fixed thereto. <P>SOLUTION: In a semiconductor device or a radiation imaging apparatus provided with a substrate having a semiconductor element or a conversion element bonded to a support member with a bonding member disposed therebetween; the support member has a first support member bonded to the substrate with the bonding member disposed therebetween, and also has a second support member mechanically connected to the first support member. When an electric component 150 such as TCP positioned at the periphery of a substrate 100 and connected thereto becomes fault, it becomes necessary to remove the faulty component and exchange it with a new electric component 160. Such an arrangement can solve the problem in the prior art that, when a laminating member 350 is present between a region of the substrate 100 having the electric component 160 disposed thereon and a support member 300, heat or pressure upon the exchange and connection causes the laminating member 350 to be displaced, so that a displacement takes place in an electric connection part between the electric component 160 and the substrate 100, with the result that the electric connection part cannot be uniformly pushed and thus the exchange and connection of the electric component cannot be preferably made. <P>COPYRIGHT: (C)2006,JPO&NCIPI

Description

  The present invention relates to a radiation imaging apparatus that detects radiation used for medical diagnostic equipment, non-destructive testing equipment, and the like as an electrical signal. Note that in this specification, in addition to X-rays, electromagnetic waves such as α rays, β rays, and γ rays are included in radiation.

  Conventionally, an X-ray film system having a fluorescent screen having an X-ray phosphor layer provided therein and a double-side coating agent has been generally used for X-ray photography. However, recently, the image characteristics of a digital radiation imaging apparatus having an X-ray phosphor layer and a two-dimensional photodetector (sensor panel) are good, and since the data is digital data, the networked computer system Since there is an advantage that data can be shared by taking in, the digital radiation imaging apparatus has been actively researched and developed, and various patent applications have been filed.

  In particular, a two-dimensional photodetector (hereinafter referred to as a sensor panel) using a thin film semiconductor made of a-Si is used not only as a photoelectric conversion material but also as a thin film field effect transistor (hereinafter referred to as “TFT”). It can also be used as a semiconductor material, and can be formed at the same time as a photoelectric conversion element and a TFT as a switch element, and has been proposed as disclosed in Patent Document 1.

FIG. 8 is a cross-sectional view of a radiation imaging apparatus in which the above-described phosphor layer is formed on a two-dimensional sensor panel including a photoelectric conversion element portion in which a plurality of photosensors and electric elements such as TFTs are arranged. In FIG. 8, reference numeral 100 denotes a substrate on which a photoelectric conversion element made of glass is formed. A photosensor using amorphous silicon (not shown) and a pixel made of TFT are two-dimensionally arranged on the substrate 110 to form a pixel region 110. Is formed. The substrate 100 and the pixel region 110 constitute a sensor panel. Further, in the peripheral region on the substrate 100, an electrical connection portion (not shown) connected to a photosensor or TFT element and connected to an external electric circuit is formed. An electrical component 150 such as a carrier package (hereinafter abbreviated as “TCP”) and an adhesive member (not shown) such as an anisotropic conductive film are electrically connected by thermocompression bonding and fixed. Reference numeral 200 denotes a scintillator that converts X-rays into visible light, and is bonded and fixed to the substrate 100 with an adhesive 250 such as an acrylic resin. Further, a support member 300 made of a stainless steel plate (cold rolled stainless steel plate, hereinafter abbreviated as “SUS”) or the like for supporting and fixing the substrate 100 is disposed under the substrate 100. It is bonded or adhesively fixed by a bonding member 350 made of an adhesive material such as an acrylic resin or a double-sided pressure-sensitive adhesive sheet made of a foam material such as urethane or acrylic. The entirety constitutes a radiation imaging apparatus.
JP 09-298287 A

  In the manufacturing process or inspection process of the radiation imaging apparatus, there is a problem with the electrical component 150 such as TCP that is disposed and connected around the substrate 100 during in-process inspection or screening after the substrate 100 is disposed and fixed to the support member 300. When a failure occurs, it may be necessary to remove the defective component of the electrical component 150 and replace it with a new electrical connection component.

  However, in the conventional radiation imaging apparatus, since there is a bonding member 350 under the substrate 100 on which the electrical component 150 is arranged, the connection is made when the flexible bonding member 350 is interposed in the middle under high temperature and high pressure connection conditions. Cannot be made uniform, and defective parts of the electrical connection part 150 cannot be replaced well.

  This is because the bonding member 350 is displaced by heat and pressure at the time of connection, and a deviation occurs between the heater head surface of the connecting device facing the electric connecting portion of the substrate 100 electrically connected to the electric component 150, This is because the electrical connection portions of the substrate 100 cannot be pressed uniformly at a time.

  Therefore, according to the present invention, the electrical connection component 150 can be connected and replaced even after the substrate 100 having the pixel region 110 in which pixels including photosensors and TFTs are two-dimensionally arranged is fixed on the support member 300. An object of the present invention is to provide a radiation imaging apparatus having a simple configuration.

  A semiconductor device according to the present invention includes a semiconductor element portion in which a plurality of semiconductor elements are disposed, an electrical connection portion that is disposed around the semiconductor element portion and is electrically connected to the semiconductor element portion via a wiring, A substrate having an electrical connection part, an electrical component electrically connected to the electrical connection portion, and a support member that supports the substrate bonded to the substrate through a bonding member. A first support member bonded to the substrate via the bonding member in a region excluding a region including at least the electrical connection portion, and the first support member according to the substrate in a region including at least the electrical connection portion. And a second support member mechanically connected to the support member.

  The semiconductor device according to the present invention further includes a buffer member between the substrate and the second support member.

  In addition, the radiation imaging apparatus according to the present invention includes a pixel unit in which a plurality of conversion elements that convert radiation into an electrical signal are arranged, and an electrical connection that is arranged around the pixel unit and has a wiring arranged in the pixel unit. A substrate having an electrical connection portion, an electrical component electrically connected to the electrical connection portion, and a support member for supporting the substrate bonded to the substrate through a bonding member. The support member includes a first support member that is bonded to the substrate via the bonding member in a region excluding at least the region including the electrical connection portion, and the region including at least the electrical connection portion. And a second support member mechanically connected to the first support member in accordance with the substrate.

  The radiation imaging apparatus according to the present invention further includes a buffer member between the substrate and the second support member.

  Moreover, it is preferable that the buffer member in the present invention is a non-adhesive elastic body at least on the surface in contact with the substrate.

  Moreover, the 1st support member in this invention has a shape substantially equal to the board | substrate except the area | region containing an electrical connection part at least, Furthermore, the 2nd support member in this invention contains an electrical connection part at least. It is desirable to have a shape approximately equal to the region.

  In addition, the second support member in the present invention is desirably mechanically connected to the first support member by screws or fitting.

  According to another aspect of the present invention, there is provided a method of manufacturing a semiconductor device in which an electrical component is placed on a substrate having a semiconductor element portion including a plurality of semiconductor elements via an electrical connection portion provided on the substrate around the semiconductor element portion. In accordance with the step of connecting, the step of adhering the first support member via the bonding member to the substrate, and the region including at least the electric connection portion in the region excluding the region including at least the electric connection portion And mechanically connecting a second support member to the first support member.

  The method for manufacturing a semiconductor device according to the present invention preferably further includes a step of disposing a buffer member between the substrate and the second support member.

  In addition, a method of manufacturing a semiconductor device according to the present invention includes a semiconductor element portion in which a plurality of semiconductor elements are disposed, an electrical connection portion that is disposed around the semiconductor element portion and is electrically connected to the semiconductor element portion, A first support member bonded to the substrate via the bonding member in a region excluding at least the region including the electrical connection portion, a substrate having the electrical connection portion, A second support member mechanically connected to the first support member according to the substrate in a region including at least the electrical connection portion, and disposed between the substrate and the second support member A step of detaching the electrical component from the electrical connection portion, the cushioning member corresponding to the electrical connection portion from which the electrical component has been removed, and the second method. With support members Removing the electrical component, connecting the new electrical component to the electrical connection portion from which the electrical component has been removed, and the first support member according to the electrical connection portion to which the new electrical component is connected. Mechanically connecting a second support member, and disposing a buffer member between the substrate and the second support member.

  The present invention provides a first support member bonded to a substrate via a bonding member in a region excluding a region including at least the electrical connection portion, and a first support according to the substrate in the region including at least the electrical connection portion. The substrate is supported by the support member having the second support member mechanically connected to the member, so that it is easy to replace and connect the electrical component when a defect is found in the connected electrical component. Can be performed. Further, by disposing the buffer member between the substrate and the second support member, the impact resistance of the substrate in the region including the electrical connection portion is improved, and the adhesion between the electrical component and the electrical connection portion is improved. . Moreover, since the buffer member and the second support member can be easily removed by using an elastic body having at least a non-adhesive surface in contact with the substrate as the buffer member, the connected electrical components In the case where a defect is found, it is possible to easily replace and connect electrical components. Therefore, even after the substrate is arranged and fixed on the support member, the electrical components can be connected, and it is possible to provide a semiconductor device and a radiation imaging apparatus in which the electrical components can be replaced.

  In addition, in the radiation imaging apparatus, a buffer member is disposed between the substrate and the second support member in a region including at least an electrical connection part to which an electrical component is connected, so that the radiation imaging apparatus can be installed in a medical examination car. It is possible to obtain an effect of suppressing vibrations in the installation environment and a shock absorbing effect against dropping or impact. By virtue of the suppression effect against vibration and the impact absorption effect, it is possible to prevent adverse effects such as a reduction in resolution of the radiation imaging apparatus due to a minute connection resistance or a change in wiring capacitance caused by vibration or shock.

  The best mode for carrying out the present invention will be described below in detail with reference to the drawings.

  1A to 1C are schematic configuration diagrams showing a configuration of an embodiment of a radiation imaging apparatus according to the present invention. FIG. 1A is a schematic plan view of the radiation imaging apparatus in the present embodiment. 1B is a schematic cross-sectional view taken along the line AA ′ of FIG. 1A, and FIG. 1C is a schematic cross-sectional view taken along the line BB ′ of FIG. Show.

  1A to 1C, reference numeral 100 denotes a substrate made of glass or the like. On the substrate 100, there is a pixel portion 110 in which pixels composed of a conversion element that converts radiation or light into an electric signal and a signal transfer element such as a TFT are two-dimensionally arranged. Further, on the substrate 110 around the pixel portion 110, a drive wiring for driving the signal transfer means, a signal wiring for reading the electric signal converted by the conversion element and transferred by the signal transfer means, and a bias for the conversion element are provided. A bias wiring for applying and an electrical connection for connecting each of the wirings to an external circuit are provided. The sensor panel 10 is configured by the substrate 100, the pixel portion 110, the drive wiring, the signal wiring, the bias wiring, and the electrical connection portion. Here, the conversion element may use amorphous selenium (a-Se) or the like that directly converts radiation into an electric signal, or amorphous silicon or the like that converts light converted from radiation by a scintillator described later into an electric signal. Photosensors (photoelectric conversion elements) such as photodiodes and photocapacitors may be used. Further, the pixel portion 110, the drive wiring, the signal wiring, and the bias wiring may be covered with a protective layer made of an inorganic film such as SiO 2 or SiN. Further, the surface of the sensor panel may be flattened by further covering the protective layer with a passivation film made of an organic film such as polyimide.

  Reference numeral 150 denotes an electrical component such as TCP that is electrically connected to the electrical connection portion of the substrate 100. The electrical component 150 includes a drive circuit that drives the pixel or a signal processing circuit that performs signal processing such as amplifying an electrical signal read from the pixel. In addition, the electrical component 150 includes an adhesive member (such as an anisotropic conductive film) that connects a connection electrode (not shown) of the electrical component 150 and a connection electrode (not shown) of the electrical connection portion at the electrical connection portion on the outer periphery of the substrate 100. (Not shown). The electrical component 150 is mechanically fixed to the substrate 100 with an adhesive member. The electrical component 150 is connected to an electrical circuit board (not shown) such as a printed wiring board at a position facing the board 100.

Reference numeral 200 denotes a scintillator (wavelength converter) for converting the wavelength of radiation into visible light. The scintillator 200 is arranged so as to cover the pixel unit 110 on the surface of the substrate 100 having the pixel unit 110 (the surface on which radiation such as X-rays is incident). In this embodiment, the adhesive is fixed on the surface having the pixel portion 110 of the substrate 100 with an adhesive 250 such as an acrylic resin. The scintillator 200 has a particle crystal structure such as Gd ₂ O ₂ S (hereinafter abbreviated as “GOS”) on a binder resin such as polyester on a base material such as polyethylene terephthalate (hereinafter abbreviated as “PET”). Thallium activity on a base material such as a structure in which a phosphor layer formed by applying and curing phosphor powder is disposed through an adhesive 250, or amorphous carbon (hereinafter abbreviated as “a-C”) A structure in which a phosphor layer having a columnar crystal structure made of an alkali halide such as cesium iodide (hereinafter abbreviated as “CsI: Tl”) is arranged through an adhesive 250, or a pixel portion 110 of the substrate 100 is included. A structure in which a phosphor layer having a columnar crystal structure made of an alkali halide such as CsI: Tl formed by direct vapor deposition on the surface can be appropriately adopted. Noh. The scintillator 200 and the sensor panel 10 constitute a radiation imaging panel 20.

  Reference numeral 300 denotes a support member that is disposed on the surface of the substrate 100 opposite to the surface having the pixel portion 110 and supports the substrate 100. The support member 300 is bonded to the substrate 100 via a bonding member 350 described later, and a first support member 301 supporting the substrate 100, and a second support member connected to the first support member 301 by a mechanical configuration. The supporting member 311 is configured. The first support member 301 and the second support member 311 are made of a metal material such as SUS (Stainless Used Steel), Al, or Mo, glass, ceramic, or the like. The first support member 301 is arranged in accordance with the region of the substrate 100 excluding the region including one or a plurality of electrical connection portions arranged on one side of the substrate 100, and is arranged on one side of the substrate 100. The substrate 100 has substantially the same shape as that of the substrate 100 excluding a region including one or a plurality of electrical connection portions. Due to the arrangement and shape of the first support substrate 301, the region including the electrical connection portion of the substrate 100 is located below the surface of the substrate 100 where the pixel portion 110 of the substrate 100 is formed via the bonding member 350. The first support member 301 is not bonded. Further, since the bonding member 350 is disposed so as to bond the first support member 301 and the substrate 100, the bonding member 350 has approximately the same shape as the first support member 301 and includes the electrical connection portion of the substrate 100. A second support member 311 that is mechanically connected to the first support member 301 and is not disposed on the back side of the surface on which the pixel portion 110 of the substrate 100 is formed, which is below the region, and an electrical connection portion. A region having a gap between the region and the substrate 100 is formed. The second support member 311 is connected to the first support member 311 by a mechanical configuration such as fastening with a further part such as a screw or forming the support members in a hook shape with each other. It arrange | positions, without adhere | attaching via the bonding member 350. FIG.

  A bonding member 350 is disposed between the substrate 100 and the first support member 301, and adheres and fixes the substrate 100 and the first support member 301. The bonding member 350 in the present embodiment is configured by a sheet-like double-sided adhesive acrylic foam sheet or a resin adhesive such as silicon. Here, the bonding member 350 is preferably made of a double-sided pressure-sensitive adhesive tape in which an acrylic pressure-sensitive adhesive is applied to both sides of an acrylic foam substrate, such as Sumitomo 3M acrylic foam structure bonding tape Y-4899. Used for. Further, the bonding member 350 according to the present invention has a gap between the second connecting member 311 and the second connecting member 311 and the electric connecting portion forming region including at least the electric connecting portion electrically connected to the electric component 150 of the substrate 100. Are arranged.

  Reference numeral 1 denotes a buffer member disposed in a gap provided between an electrical connection portion forming region including at least the electrical connection portion of the substrate 100 and the second support member 311. The buffer member 1 is preferably an elastic sheet having no adhesiveness, and a sheet using a resin material such as acrylic, urethane, polyethylene, silicon, polyolefin, acrylonitrile butadiene, chloroprene, ethylene / propylene, and the above-mentioned A foam material having bubbles in the material can be used. Here, the non-adhesive elastic body is a non-tacky resin that does not have a pressure-sensitive adhesive layer and is prepared without adding a tackifier component such as rosin and its derivatives, polyterpene, and xylene resin. It shows that. Moreover, as the buffer member 1, the sheet | seat which uses the said resin material, and also the sheet | seat which has a bubble in the said resin material are used suitably.

Example 1
This embodiment is an example of the radiation imaging apparatus shown in FIGS.

  1A to 1C are schematic configuration diagrams illustrating the configuration of the radiation imaging apparatus according to the present embodiment. FIG. 1A is a schematic plan view of the radiation imaging apparatus according to the present embodiment. 1B is a schematic cross-sectional view taken along the line AA ′ of FIG. 1A, and FIG. 1C is a schematic cross-sectional view taken along the line BB ′ of FIG.

Pixels constituted by photosensors and TFTs made of amorphous silicon are two-dimensionally arranged on the pixel portion 110 on the substrate 100 made of glass. Further, on the substrate 100 around the pixel portion 110, a driving wiring for driving the TFT, a signal wiring for reading out an electric signal converted by the photosensor and transferred by the TFT, and a bias for applying a bias to the photosensor. Bias wirings and electrical connection parts for connecting the respective wirings and external circuits are provided. Further, a protective film (not shown) made of SiN _x or the like that covers the pixel portion 100, the drive wiring, the signal wiring, and the bias wiring is formed on the substrate 100 excluding the region where the electrical connection portion is provided. . The sensor panel 10 is configured by the substrate 100, the pixel portion 110, the drive wiring, the signal wiring, the bias wiring, the electrical connection portion, and the protective film.

  An electrical component 150 made of TCP is connected to the electrical connection portion formed around the substrate 100.

  On the pixel portion 110 of the substrate 100, a scintillator 200 formed by applying a binder containing GOS to PET is bonded and fixed by an acrylic adhesive 250.

  Further, a first support member 301 made of SUS is disposed under the substrate 100, and is adhesively fixed by a sheet-like bonding member 350 made of adhesive acrylic foam. The first support member 301 is arranged according to the area of the substrate 100 excluding the area including all the electrical connection portions arranged on one side of the substrate 100, and all the electric power arranged on one side of the substrate 100. It has substantially the same shape as the shape of the substrate 100 excluding the region including the connecting portion. Further, a second support member 311 mechanically connected to the first support member 301 is disposed corresponding to a region including all the electrical connection portions arranged on one side of the substrate 100, and The first support member 301 and the second support member 311 are mechanically connected to constitute the support member 300. The bonding member 350 is disposed with a gap between the second support member 311 and the electrical connection portion forming region including at least an electrical connection portion electrically connected to the electrical component 150 of the substrate 100. A buffer member 1 made of an acrylic resin that is an elastic body having no adhesiveness is disposed in the gap.

  In the present embodiment, one second support member 311 and a buffer member 1 are prepared for each side of the substrate 100, and are collectively collected for a region where a plurality of electrical components 150 arranged on one side are arranged. It is formed to be provided.

  Next, the manufacturing method of the radiation imaging apparatus of the present invention will be described in detail with reference to FIGS.

First, as shown in FIG. 2A, on a substrate 100 made of glass or the like, a pixel portion 110 in which pixels made up of photosensors and TFTs made of amorphous silicon are two-dimensionally arranged is formed. In addition, on the substrate 100 around the pixel portion 110, a driving wiring for driving the TFT, a signal wiring for reading out an electric signal converted by the photosensor and transferred by the TFT, and a bias for applying the photosensor. Bias wirings and electrical connection portions for connecting the wirings and external circuits are formed. Further, a protective film (not shown) made of SiN _x or the like that covers the pixel portion 100, the drive wiring, the signal wiring, and the bias wiring is formed on the substrate 100 excluding the region where the electrical connection portion is provided. . These are produced by a thin film semiconductor process, and the sensor panel 10 is completed here.

  Next, as shown in FIG. 2B, a scintillator 200 formed by applying a binder containing phosphor particles to a base material such as PET is attached to an acrylic adhesive on the pixel portion 110 of the substrate 100. The radiation imaging panel 20 is formed by pasting together using 250.

  Next, as shown in FIG. 2C, an electrical component 150 having a connection electrode facing the electrical connection portion on the electrical connection portion prepared in the peripheral region of the substrate 100 is formed using an anisotropic conductive film. Then, mechanical and electrical connections are made by thermocompression bonding. In the present embodiment, the electrical component 150 uses a wiring board on which the semiconductor chip is mounted, such as TCP (Tape Carrier Package) or COF (Chip On Flexible printed circuit board). The number of connection electrodes is reduced to facilitate mounting with an electric circuit board. Of course, the electric component 150 having no semiconductor chip such as a flexible printed wiring board is fixed to the electric connecting portion of the substrate 100, and the semiconductor chip is mounted on the electric circuit board or a circuit having a similar function is formed. It is also possible.

  Next, as shown in FIG. 2D, the back surface of the sensor panel 10 to which the electrical component 150 is connected and the first support member 301 made of SUS are formed into a sheet shape made of an adhesive acrylic foam having a thickness of 1 mm. The adhesive member 350 is adhesively fixed. Here, the first support member 301 is arranged in accordance with the area of the substrate 100 excluding the area including all the electrical connection portions arranged on one side of the substrate 100, and is arranged on one side of the substrate 100. The substrate 100 has substantially the same shape as that of the substrate 100 except for the region including all the electrical connection portions. In the present invention, the bonding member 350 is arranged according to the shape of the first support member 350, and there is a gap between the lower surface of the substrate 100 and the support member 300 at least in the region where the electric component 150 is disposed. The bonding member 350 is not arranged. Further, the surface of the radiation imaging panel 20 on the scintillator 200 and the surface of the support member 300 are pressed using a planar press device, and are bonded and fixed by a bonding member 350.

  Next, as shown in FIG. 2E, the second support member 311 is screwed onto the first support member 301 at a position corresponding to the region including the electrical connection portion arranged on one side of the substrate 100. Tighten and fix with. Here, the second support member 311 has substantially the same shape as the shape of the region including the electrical connection portion arranged on one side of the substrate 100. A support member 300 is configured by the first support member 301 and the second support member 311.

  Further, the buffer member 1 made of non-adhesive acrylic foam is inserted from the side into the gap between the lower surface of the substrate 100 and the second support member 311 in the region where the electrical component 150 is disposed, 1 (A) and the radiation imaging apparatus shown by (B) were produced.

  In the radiation imaging apparatus of this embodiment, as shown in FIGS. 1A and 1B, there is a gap between the lower surface of the substrate 100 and the second support member 311 in at least the region where the electric component 150 is disposed. Therefore, the lower surface of the substrate 100 in the region where the electrical component 150 is disposed and the second support member 311 are not bonded and fixed. Moreover, since the buffer member 1 is only inserted in the corresponding part, the buffer member 1 can be easily removed. Further, since the second support member 311 is not bonded to the substrate 100 by the bonding member 350 and is fixed to the first support member 301 by mechanical connection, the second support member 311 is configured. Can be easily removed.

  Next, with reference to FIGS. 3A to 3C, a method for exchanging and connecting electrical components in the radiation imaging apparatus of the present invention will be described in detail. In addition, the same code | symbol is provided about the same or equivalent component as FIG. 1, and description is simplified or abbreviate | omitted.

  FIG. 3A is a schematic plan view showing a replacement preparation state of the electrical component 150 in the radiation imaging apparatus shown in FIG. 1, and FIG. 3B is a cross-sectional view taken along line AA ′ of FIG. It is typical sectional drawing.

  FIG. 3C is a schematic cross-sectional view illustrating a method of connecting a new electrical component 160 to the radiation imaging apparatus in a replacement preparation state.

  3A to 3C, 160 is an electrical component different from the electrical component 150, 180 is mechanically and electrically connected to the connection electrode 101 of the electrical connection portion of the substrate 100 and the connection electrode 161 of the electrical component 160. It is the conductive adhesive which consists of an anisotropic conductive film etc. which are used in order to do. Reference numeral 501 denotes a press member such as a heating head used to connect the electrical component 160 and the electrical connection portion of the substrate 100, and reference numeral 502 denotes a backup stage made of ceramic, glass, or the like that is subjected to pressure during connection. The press member 501 and the backup stage 502 constitute a part of the connection device. In addition, when the electric component 160 is heated and pressurized and bonded to the electric connection portion, a heater 503 for heating the press member 501 may be provided. Reference numeral 505 denotes a Teflon (registered trademark) sheet that is used to uniformly press the head surface of the press member 501 at the time of connection and to prevent the anisotropic conductive film from being welded to the press member 501.

  In the present embodiment, the electrical component replacement method replaces any one of the electrical components 150 for the sake of simplicity of description, but the present invention is not limited to this, and the plurality of electrical components 150 When replacement is necessary, it can be achieved by repeating the same operation a plurality of times.

  Below, the replacement | exchange method of the electrical component of the radiation imaging device in this invention is demonstrated using FIG. 3 (A)-(C). Here, a case will be described as an example where a defect is found in the electrical component 150 connected to the location indicated by R in FIG.

  First, as shown in FIGS. 3A and 3B, the electrical component 150 arranged at the position R is peeled off from the electrical connection portion of the substrate 100, and the anisotropic conductive film remaining on the substrate 100 is acetone. And using a solvent such as MEK (methyl ethyl ketone). When the electrical component 150 is removed, the buffer member 1 and the second support member 311 inserted in the gap between the substrate 100 and the second support member 311 are used for improving the impact resistance at the time of removal. It functions as a pedestal. Next, the buffer member 1 inserted at the position R is taken out, and the second support member 311 mechanically connected to the first support member 301 by screwing is removed from the first support member 301. Through the above steps, the preparation state for exchanging and connecting a new electrical component 160 to the radiation imaging apparatus is completed.

  Next, the planar alignment of the opposing surfaces of the substrate 100 and the press member 501 is confirmed or adjusted, and a new anisotropic conductive film is pasted on the connection electrode 101 formed on the electrical connection portion of the substrate 100 and transferred by thermocompression bonding. Paste.

  Next, as shown in FIG. 3C, the press member 501 is disposed above the connection electrode 101, and the backup 502 is disposed below the connection electrode 101. Alignment is arranged and temporarily fixed so that the connection electrodes 161 provided on the component 160 face each other. Here, the temporary fixation means holding by the tackiness of the anisotropic conductive film or the adsorption of the stage for adjusting the arrangement of the wiring member or the mechanical pressure.

  After the temporary fixing, the press member 510 is lowered, and the upper and lower connection electrodes are electrically connected and the electrical components are bonded and fixed by thermocompression bonding at a desired temperature and pressure. In this example, the measurement was performed under the conditions of an effective temperature of 170 ° C., a pressure of 2.5 MPa, and a time of 15 seconds.

  After the connection of the electrical component 160 is completed, the second support member 311 is mechanically connected to the first support member 301 by screw tightening, and the buffer member 1 removed earlier is again connected to the substrate 100 and the second support member. The radiation imaging apparatus can be obtained in which the replacement operation of the electrical component 150 and the electrical component 160 is completed by inserting the gap between the electrical component 150 and the electrical component 160.

  In the exchange connection of the electrical components of the radiation imaging apparatus according to the present embodiment, it is possible to easily arrange the backup 502 directly below the substrate 100 in the region including at least the electrical connection portion at the time of exchange connection. The rigidity of the position is ensured, and the displacement between the substrate 100 and the press member 501 at the time of replacement connection and the connection failure between the connection electrode 101 of the electrical connection portion of the substrate 100 and the connection electrode 161 of the electrical component 160 can be prevented. it can.

(Example 2)
A present Example is an example of the radiographic imaging apparatus shown by FIG. 4 (A)-(C).

  4A to 4C are schematic configuration diagrams illustrating the configuration of the radiation imaging apparatus according to the present embodiment. FIG. 4A is a schematic plan view of the radiation imaging apparatus according to the present embodiment. 4B is a schematic cross-sectional view taken along line AA ′ of FIG. 4A, and FIG. 4C is a schematic cross-sectional view taken along line BB ′ of FIG. Note that the same or equivalent components as those described above are denoted by the same reference numerals, and description thereof is simplified or omitted.

  In the second embodiment, similarly to the first embodiment, the pixel portion 110, the drive wiring, the signal wiring, the bias wiring, and the electrical connection portion are provided on the substrate 100 made of glass. The sensor panel 10 is configured by the wiring, the signal wiring, the bias wiring, and the electrical connection portion. In addition, an electrical component 150 made of TCP is connected to an electrical connection portion formed around the substrate 100. On the pixel portion 110 of the substrate 100, a scintillator 200 formed by applying a binder containing GOS to PET is bonded and fixed with an acrylic adhesive 250. Further, a first support member 301 made of SUS is disposed under the substrate 100, and is adhesively fixed by a bonding member 350 made of a sheet shape made of adhesive acrylic foam. The first support member 302 is arranged in accordance with the region of the substrate 100 excluding all regions including one electrical connection portion, and is substantially the same shape as the shape of the substrate 100 excluding all regions including one electrical connection portion. Have Further, a second support member 312 mechanically connected to the first support member 302 is disposed corresponding to a region including one electrical connection portion, and the first support member 302 and the second support member 302 are disposed. The support member 312 is mechanically connected to form the support member 300. The second support member 312 has substantially the same shape as the shape of the region of the substrate 100 including one electrical connection portion. The bonding member 350 is disposed with a gap between the second connection member 312 and the electrical connection portion formation region including at least the electrical connection portion that is electrically connected to the electrical component 150 of the substrate 100. A buffer member 2 made of an acrylic resin that is an elastic body having no adhesiveness is disposed in the gap.

  In the present embodiment, a second support member 312 is disposed for each region to which each electrical component 150 provided on each side of the substrate 100 is connected, and between the substrate 100 and the second support member 312. A gap is prepared, and the buffer member 2 is arranged in each gap corresponding to each electric component 150.

  In addition, the replacement connection work of the electrical component 150 in the present embodiment can be performed in the same manner as the replacement connection work of the first embodiment shown in FIG.

  In the radiation imaging apparatus of the present embodiment, since the buffer member 2 and the second support member 312 are arranged without being bonded in units of connection parts of the electric component 150, the buffer member is used when the electric component 150 is exchanged and connected. 2 can be taken out and the second support member 312 can be removed more easily, and the workability is further improved. In addition, when a new buffer member is prepared and inserted after the replacement work, the buffer member used is smaller than the buffer member 1 provided for each side collectively, so that the replacement connection work can be performed at a low cost. Become.

(Example 3)
This embodiment is an example of the radiation imaging apparatus shown in FIG.

  FIG. 5 is a schematic cross-sectional view of the radiation imaging apparatus in the present embodiment. Note that the same or equivalent components as those described above are denoted by the same reference numerals, and description thereof is simplified or omitted.

  In the third embodiment, as in the first embodiment, the pixel portion 110, the drive wiring, the signal wiring, the bias wiring, and the electrical connection portion are provided on the substrate 100 made of glass, and the substrate 100 and the pixel portion 110 are driven. The sensor panel 10 is configured by the wiring, the signal wiring, the bias wiring, and the electrical connection portion. In addition, an electrical component 150 made of TCP is connected to an electrical connection portion formed around the substrate 100. On the pixel portion 110 of the substrate 100, a scintillator 200 formed by applying a binder containing GOS to PET is bonded and fixed with an acrylic adhesive 250. Further, a first support member 303 made of SUS is disposed under the substrate 100, and is bonded and fixed by a sheet-like bonding member 350 made of adhesive acrylic foam. The first support member 303 is arranged according to the region of the substrate 100 except for the region including all the electrical connection portions arranged on one side of the substrate 100, and all the electricity arranged on one side of the substrate 100. It has substantially the same shape as the shape of the substrate 100 excluding the region including the connecting portion. Further, a second support member 313 mechanically connected to the first support member 303 is disposed corresponding to a region including all the electrical connection portions arranged on one side of the substrate 100, and The first support member 303 and the second support member 313 are mechanically connected to constitute the support member 300. The second support member 313 has approximately the same shape as the shape of the region including all the electrical connection portions arranged on one side of the substrate 100. The bonding member 350 is disposed with a gap between the second connecting member 313 and the electric connecting portion forming region including at least the electric connecting portion that is electrically connected to the electric component 150 of the substrate 100. A buffer member 1 made of an acrylic resin that is an elastic body having no adhesiveness is disposed in the gap.

  In the present embodiment, the second support member 313 is a housing that holds and fixes the first support member 303, is made of metal such as SUS, and corresponds to a frame or an exterior cover of the radiation imaging unit.

  Also in this embodiment, the bonding member 350 is not disposed so that there is a gap between the lower surface of the substrate 100 and the second support member 313 in the region where at least the electrical component 150 is disposed, and the electrical component 150 is disposed. The lower surface of the substrate 100 and the second support member 313 are not fixedly bonded to each other. Moreover, since the buffer member 1 is only inserted in the corresponding part, the buffer member 1 can be easily removed. Further, since the second support member 313 is not bonded to the substrate 100 by the bonding member 350 and is fixed to the first support member 303 by mechanical connection, the second support member 313 is used. Can be easily removed. In addition, since the second support member 313 and the buffer member 1 can be easily detached during the exchange connection work, the electrical component exchange connection work can be easily performed as in the first embodiment.

Example 4
A present Example is an example of the radiation imaging device shown by FIG.

  FIG. 6 is a schematic cross-sectional view in which an end portion of the radiation imaging apparatus in the present embodiment is enlarged. Note that the same or equivalent components as those described above are denoted by the same reference numerals, and description thereof is simplified or omitted.

  In the present embodiment, the support member 300 is configured by mechanically connecting the first support member 304 and the second support member 314 by fitting. In this embodiment, the fitting shape is formed along the periphery of the substrate 100 so as to be assembled. Also, by forming a fitting shape in a direction perpendicular to the side surfaces of the first support member 304 and the second support member 314, the first used in the second embodiment corresponding to each region including one electrical connection portion. Similarly, the support member 302 and the second support member 312 can be mechanically connected by fitting.

  Also in the present embodiment, the bonding member 350 is not disposed so as to have a gap between the lower surface of the substrate 100 and the second support member 314, and the lower surface of the substrate 100 in the region where the electrical component 150 is disposed The two support members 314 are not bonded and fixed. Moreover, since the buffer member 1 is only inserted in the corresponding part, the buffer member 1 can be easily removed. Further, since the second support member 314 is not bonded to the substrate 100 by the bonding member 350 and is fixed to the first support member 304 by mechanical connection, the second support member 314 is configured. Can be easily removed. In addition, since the second support member 314 and the buffer member 1 can be easily detached during the exchange connection work, the electric component exchange connection work can be easily performed as in the first embodiment.

  In addition, although the acrylic resin which does not have adhesiveness was demonstrated as a buffer material member (1 and 2) in the Example, it has adhesiveness in the surface which contact | connects a 2nd support member (311, 312, 313, and 314). It can comprise using the sheet-like shock absorbing member which consists of a letting single-sided adhesive acrylic foam. In this case, in each embodiment, it can be manufactured by pasting and fixing the buffer member to the second support member in advance, and fixing the second support member to the first support member. It can be set as the structure which the board | substrate 100, a buffer member, and a 2nd supporting member are not adhesive-fixed, and the same effect is acquired.

(Application examples)
Below, the application example to the X-ray diagnostic system of the radiation imaging device by this invention is demonstrated. FIG. 5 shows an application example of the radiation imaging apparatus according to the present invention to an X-ray diagnostic system.

  X-rays 6060 generated by the X-ray tube 6050 pass through the chest 6062 of the patient or subject 6061 and enter a radiation imaging apparatus (image sensor) 6040 as shown in FIG. This incident X-ray includes information inside the body of the patient 6061. The scintillator (phosphor layer) emits light in response to the incidence of X-rays, and this is photoelectrically converted by the photoelectric conversion element of the sensor panel to obtain electrical information. This information can be digitally converted and image-processed by an image processor 6070 serving as a signal processing means and observed on a display 6080 serving as a display means in a control room.

  Further, this information can be transferred to a remote location by transmission processing means such as a telephone line 6090 and can be displayed on a display 6081 serving as a display means such as a doctor room in another place or stored in a recording means such as an optical disk. It is also possible for a local doctor to make a diagnosis. Moreover, it can also record on the film 6110 by the film processor 6100 used as a recording means.

  The present invention relates to an active matrix panel using a thin film semiconductor element, a two-dimensional area sensor using the active matrix panel, a radiation imaging apparatus using the two-dimensional area sensor, and a medical diagnostic apparatus using the radiation imaging apparatus or Used for non-destructive inspection equipment.

1A is a schematic plan view of a radiation imaging apparatus according to an embodiment of the present invention and Example 1. FIG. FIG. 2B is a schematic cross-sectional view taken along line A-A ′ of FIG. FIG. 2C is a schematic cross-sectional view taken along B-B ′ in FIG. (A)-(E) are typical sectional drawings explaining the manufacturing method of the radiation detection apparatus which concerns on embodiment and Example 1 of this invention. (A)-(C) are typical sectional drawings explaining the electrical component replacement | exchange connection method of the radiation imaging device which concerns on embodiment of this invention. (A) is a schematic plan view of a radiation imaging apparatus according to Embodiment 2 of the present invention. FIG. 4B is a schematic cross-sectional view taken along line A-A ′ of FIG. FIG. 4C is a schematic cross-sectional view taken along the line B-B ′ in FIG. It is typical sectional drawing of the radiation imaging device which concerns on Example 2 of this invention. It is typical sectional drawing which expanded the edge part of the radiation imaging device which concerns on Example 3 of this invention. It is a conceptual diagram which shows the structure of the radiography system which concerns on the application example of this invention. (A) is a typical top view which shows the radiation imaging device of a prior art example. FIG. 6B is a schematic cross-sectional view taken along line A-A ′ of FIG.

Explanation of symbols

DESCRIPTION OF SYMBOLS 1, 2 Buffer member 10 Sensor panel 20 Radiation imaging panel 100 Board | substrate 101 Connection electrode of a board | substrate 110 Pixel part 150,160 Electrical component 161 Connection electrode of an electrical component 180 Conductive adhesive 200 Scintillator 250 Adhesive 300 Support member 301,302, 303, 304 First support member 311, 312, 313, 314 Second support member 350 Bonding member 501 Press member 502 Backup 503 Heater 505 Teflon (registered trademark) sheet

Claims (17)

A substrate having a semiconductor element portion in which a plurality of semiconductor elements are disposed, and an electrical connection portion disposed around the semiconductor element portion and electrically connected to the semiconductor element portion via a wiring;
An electrical component electrically connected to the electrical connection;
In a semiconductor device having a support member that supports the substrate bonded to the substrate via a bonding member,
The support member includes a first support member that is bonded to the substrate through the bonding member in a region excluding at least the region including the electrical connection portion, and the substrate in a region including at least the electrical connection portion. And a second support member mechanically connected to the first support member.   The semiconductor device according to claim 1, further comprising a buffer member between the substrate and the second support member.   The semiconductor device according to claim 2, wherein the buffer member is a non-adhesive elastic body at least in contact with the substrate.   The first support member has substantially the same shape as the substrate excluding at least the region including the electrical connection portion, and the second support member has a shape approximately equal to the region including at least the electrical connection portion. The semiconductor device according to claim 1, wherein the semiconductor device is provided.   The semiconductor device according to claim 1, wherein the second support member is mechanically connected to the first support member by a screw or fitting. A substrate having a pixel portion provided with a plurality of conversion elements for converting radiation into an electrical signal, and an electrical connection portion disposed around the pixel portion and electrically connected by wiring to the pixel portion. When,
An electrical component electrically connected to the electrical connection;
In a radiation imaging apparatus having a support member that supports the substrate bonded to the substrate via a bonding member,
The support member includes a first support member that is bonded to the substrate through the bonding member in a region excluding at least the region including the electrical connection portion, and the substrate in a region including at least the electrical connection portion. And a second support member mechanically connected to the first support member.   The radiation imaging apparatus according to claim 6, further comprising a buffer member between the substrate and the second support member.   The radiation imaging apparatus according to claim 7, wherein the buffer member is a non-adhesive elastic body at least in contact with the substrate.   The conversion element is a photoelectric conversion element, a switch element provided in accordance with the photoelectric conversion element, and wavelength conversion that is disposed on at least the photoelectric conversion element and converts radiation into light that can be sensed by the photoelectric conversion element. The radiation imaging apparatus according to claim 6, further comprising: a body.   The radiation imaging apparatus according to claim 6, wherein the electrical component is connected to the electrical connection portion via a conductive adhesive.   The radiation imaging apparatus according to claim 7, wherein the buffer member is disposed between the substrate and the second support member in accordance with a plurality of the electrical components. .   The radiation imaging apparatus according to claim 7, wherein the buffer member is disposed between the substrate and the second support member in accordance with one electric component. .   The first support member has substantially the same shape as the substrate excluding at least the region including the electrical connection portion, and the second support member has a shape approximately equal to the region including at least the electrical connection portion. The radiation imaging apparatus according to claim 6, wherein the radiation imaging apparatus is provided.   The said 2nd supporting member is mechanically connected to the said 1st supporting member by either of a screw, a fitting, and (circle), The one of Claims 6-13 characterized by the above-mentioned. Radiation imaging device. Connecting an electrical component on a substrate having a semiconductor element portion including a plurality of semiconductor elements via an electrical connection portion provided on the substrate around the semiconductor element portion;
Bonding the first support member via the substrate and the bonding member at least in a region excluding the region including the electrical connection portion;
Mechanically connecting a second support member to the first support member according to at least a region including the electrical connection portion;
A method for manufacturing a semiconductor device comprising:   And a step of disposing a buffer member between the substrate and the second support member. A substrate having a semiconductor element portion in which a plurality of semiconductor elements are arranged, an electrical connection portion arranged around the semiconductor element portion and electrically connected to the semiconductor element portion, and connected to the electrical connection portion The first supporting member bonded to the substrate via the bonding member in the region excluding the region including at least the electrical connection portion, and the substrate in the region including at least the electrical connection portion. Accordingly, a method of manufacturing a semiconductor device, comprising: a second support member mechanically connected to the first support member; and a buffer member disposed between the substrate and the second support member. There,
Removing the electrical component from the electrical connection;
Removing the buffer member and the second support member according to the electrical connection part from which the electrical component has been removed;
Connecting a new electrical component to the electrical connection from which the electrical component has been removed;
A second support member is mechanically connected to the first support member according to the electrical connection portion to which the new electrical component is connected, and a buffer member is provided between the substrate and the second support member. A step of arranging
A method for manufacturing a semiconductor device, comprising:

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