JP2006140252A - Semiconductor element cooling apparatus - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a cooling apparatus corresponding to increase in the amount of heat generated of a semiconductor element. <P>SOLUTION: The cooling apparatus of semiconductor element is constituted in the structure that a space 2 is formed within a cooling plate 1, both ends of the space 2 of the cooling plate 1 are joined with an inlet pipe 5 and an outlet pipe 6, the piping is connected with a coolant pump 4, and the coolant 8 within the cooling plate is forcibly circulated with the coolant pump 4. With this structure, the liquid coolant is forcibly supplied to the evaporating surface being in contact with the semiconductor element, and thereby the cooling apparatus can realize excellent heat conductivity without the occurrence of burnout. <P>COPYRIGHT: (C)2006,JPO&NCIPI

Description

  The present invention relates to a cooling device for a highly heat-generating semiconductor element, and relates to a cooling device that efficiently cools using a refrigerant.

  Conventionally, there has been a cooling plate of this type of cooling device as shown in FIG. 5 (see, for example, Patent Document 1). FIG. 5 is a perspective partial cross-sectional view of a conventional semiconductor device cooling apparatus, showing a partial cross-section of a cooling plate.

In FIG. 5, the inside of the cooling plate 31 is a cavity 32, filled with a refrigerant 33, a heat pipe 34 is inserted therein, and fins 35 are formed in the heat pipe 33. In such a configuration, when the amount of heat generated by the semiconductor element increases, the surface that is in contact with the semiconductor element 36 burns out in the portion that is not in contact with the liquid refrigerant 33, and the semiconductor element 36B is There was a possibility of damage.
JP-A-6-120383

  However, despite the fact that the amount of heat generated by semiconductor elements has been increasing in recent years, it is necessary for devices having semiconductors to be configured so that the contact surface with the semiconductor elements does not burn out without being too large. is there.

  The present invention solves such a conventional problem, and an object of the present invention is to obtain a configuration that forcibly supplies liquid refrigerant and does not cause burnout.

  In order to solve this problem, a cooling device according to the present invention is thermally intimately connected to a cooling plate for forming a space inside and cooling a semiconductor element as a heating element using a refrigerant. A suction circuit connected to a refrigerant pump at both ends of the space to form a closed circuit, and the refrigerant pump forcibly circulates the refrigerant in the closed circuit. It is comprised as follows. With this configuration, since the liquid refrigerant is forcibly supplied to the evaporation surface in contact with the semiconductor element, it is possible to obtain a cooling device excellent in heat transfer without causing burnout.

  The cooling device of the present invention can provide cooling that can cope with an increase in the amount of heat generated by the semiconductor element.

  1st invention has a cooling plate for cooling the semiconductor element which is a heat generating body using a refrigerant | coolant, forming a space inside, and a heat sink thermally contacted with the cooling plate, The suction pipe and the discharge pipe connected to the refrigerant pump are connected to both ends to form a closed circuit, and the refrigerant in the closed circuit is forcibly circulated by the refrigerant pump. Since the refrigerant can be forcibly supplied to the evaporation surface, even if the amount of heat generated by the semiconductor element increases, the evaporation surface does not burn out, and good heat transfer is obtained.

According to a second aspect of the present invention, a loop pipe having a cooling plate space as an inlet / outlet is joined to form a part of a closed circuit, and the loop pipe is thermally in contact with a position away from the cooling plate of a heat sink. As a result, heat can be transferred from the heat of the cooling plate to the portion where the heat sink has a temperature difference, and the efficiency can be improved.

  According to a third aspect of the present invention, a notch is provided in a tip surface of the fin of the heat sink, a loop pipe is press-fitted into the notch, and the heat sink is fixed to a cooling plate, and heat is transmitted to the fin of the heat sink through the loop pipe. In addition, it is possible to fix the heat sink to the cooling plate at the same time, and it is possible to make the device inexpensive.

  According to a fourth aspect of the present invention, the connection position of the suction pipe and the discharge pipe joined to both ends of the space of the cooling plate is the lower part of the space, and the liquid refrigerant accumulated in the lower part of the space of the cooling plate is sucked It is possible to avoid the deterioration of the performance of the refrigerant pump by biting the vapor refrigerant.

  In the fifth invention, the refrigerant amount in the closed circuit is set to 20% or more and 60% or less of the total volume. Since the refrigerant amount is 60% or less, a sufficient condensing surface of the cooling plate space can be secured, and since the refrigerant amount is 20% or more, liquid refrigerant can be secured so that the lower surface of the cooling plate space does not burn out. A highly efficient cooling system can be obtained.

  In the sixth aspect of the invention, since the displacement type refrigeration pump uses a positive displacement pump, the refrigerant can be sent out even if some amount of vapor refrigerant is included.

  Embodiments of the present invention will be described below with reference to the drawings. Note that the present invention is not limited to the embodiments.

(Embodiment 1)
FIG. 1 is a schematic diagram of a cooling device for a semiconductor element according to Embodiment 1 of the present invention, and FIG. 2 is a longitudinal sectional view of FIG. 1 and 2, the semiconductor element 7 which is a high heating element, the cooling plate 1 for cooling the semiconductor element 7 and the heat sink 3 are thermally intimately applied by applying thermo grease between them. . The positive displacement refrigerant pump 4 is connected to the space 2 inside the cooling plate 1 by a suction pipe 5 and a discharge pipe 6 to form a closed circuit. In the closed circuit, the refrigerant 8 corresponding to 50% of the total volume is enclosed, and the suction port of the suction pipe 5 is installed in the lower part of the space 8 so as to mainly suck the liquid refrigerant. The amount of refrigerant is 60% or less of the total volume in the closed circuit, and a sufficient condensing surface of the cooling plate space can be secured. If the amount of refrigerant is 20% or more, liquid can be used so that the lower surface of the cooling plate space does not burn out. A refrigerant can be secured and a highly efficient cooling system can be obtained.

  As described above, in the present embodiment, the suction pipe 5 and the discharge pipe 6 are connected to both ends of the space 2 inside the cooling plate 1, and the positive displacement refrigerant pump 4 is installed in the pipe. A refrigerant can be supplied to the evaporation surface, and even if the amount of heat generated by the semiconductor element 7 increases, the evaporation surface does not burn out, and a cooling device with good heat transfer can be obtained.

(Embodiment 2)
FIG. 3 is a schematic diagram of a semiconductor element cooling apparatus according to Embodiment 2 of the present invention, and FIG. 4 is a longitudinal sectional view of FIG. 3 and 4, two loop pipes 10 having the space 2 of the cooling plate 1 as the entrance and exit are installed on the upper portion of the cooling plate 1. The loop pipe 10 is press-fitted into a notch 11 provided at the tip of the fin 9 of the heat sink 3 and is in close thermal contact. Further, each loop pipe is provided with a spring property in advance so that a force that presses the heat sink 3 toward the cooling plate 1 works. According to this configuration, since both ends of the loop pipe 10 are open to the space 2 of the cooling plate 1, the refrigerant vapor in the space 2 passes through the loop pipe 10 and heats the fin 9 having a temperature difference from the heat sink 3. Since it can be exchanged, efficient cooling becomes possible. Further, since each loop pipe 10 has a spring property, it also has a function of fixing the heat sink 3 to the cooling plate 1, and it is not necessary to use a separate member such as a fixing band in particular, so that an inexpensive cooling device can be obtained. Can do.

  As described above, the semiconductor device cooling apparatus according to the present invention enables high-efficiency cooling of highly heat-generating semiconductor elements. Is also applicable.

Schematic diagram of a semiconductor element cooling device according to the first embodiment of the present invention. 1 is a longitudinal sectional view of FIG. Schematic diagram of semiconductor device cooling device in Embodiment 2 of the present invention 3 is a longitudinal sectional view Perspective partial cross-sectional view of a conventional semiconductor device cooling device

Explanation of symbols

DESCRIPTION OF SYMBOLS 1 Cooling plate 2 Space 3 Heat sink 4 Refrigerant pump 5 Suction piping 6 Discharge piping 7 Semiconductor element 8 Liquid refrigerant 9 Fin 10 Loop piping 11 Notch

Claims (6)

A cooling plate for forming a space in the interior and cooling the semiconductor element, which is a heating element using a refrigerant, and a heat sink that is thermally in close contact with the cooling plate, and a refrigerant pump at both ends of the space A cooling device for a semiconductor element, wherein the connected suction pipe and discharge pipe are respectively connected to form a closed circuit, and the refrigerant in the closed circuit is forcibly circulated by the refrigerant pump. . A loop pipe having a cooling plate space as an inlet / outlet is joined to form a part of a closed circuit, and the loop pipe is thermally in close contact with a position away from the cooling plate of a heat sink. The cooling device for a semiconductor element according to 1. 3. The semiconductor device cooling device according to claim 1, wherein a notch is provided in a fin tip surface of the heat sink, a loop pipe is press-fitted into the notch, and the heat sink is fixed to a cooling plate. 4. The semiconductor device cooling apparatus according to claim 1, wherein a connection position between the suction pipe and the discharge pipe joined to both ends of the space of the cooling plate is the lower part of the space. 5. The semiconductor element cooling apparatus according to claim 1, wherein the amount of the refrigerant in the closed circuit is 20% to 60% of the total volume. 6. The cooling device for a semiconductor element according to claim 1, wherein a positive displacement pump is used as the refrigerant pump.

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