JP2006138787A - Testing system for semiconductor integrated circuit device, and probe card - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To achieve high-accuracy measurement, using an inspection device (tester) in a general semiconductor integrated circuit device in a test system for measuring the output voltage of the semiconductor integrated circuit device, having an analog signal output terminal, or the like that requires the assurance of changes in the output voltage value with high accuracy. <P>SOLUTION: In the semiconductor integrated circuit device testing system, an input signal conversion circuit is installed at the prestage of an analog/digital conversion circuit on a probe card, thus achieving precise measurement, in agreement with the measurement purpose. As the input signal conversion circuit, a voltage level conversion circuit, an impedance matching circuit, an integral circuit, and the serial connection of these circuits are available. <P>COPYRIGHT: (C)2006,JPO&NCIPI

Description

  The present invention relates to a semiconductor integrated circuit device test system for testing a semiconductor integrated circuit device having an analog signal output terminal that needs to guarantee a change in output voltage value with high accuracy.

  2. Description of the Related Art In recent years, research and development of semiconductor integrated circuit devices having an analog signal output terminal that needs to guarantee a change in output voltage value with very high accuracy, such as a baseband LSI for a high-speed wireless LAN, has been actively conducted. When testing such a semiconductor integrated circuit device, it is built in a test head of a semiconductor integrated circuit device inspection device (hereinafter abbreviated as a tester) widely used as a general semiconductor integrated circuit device test system. The input comparator has an input comparison accuracy of about several tens of mV. For this reason, when the voltage output of the analog signal output terminal requires high accuracy of several mV or less, there is a problem that the semiconductor integrated circuit cannot be tested by a general semiconductor integrated circuit device test system.

  Therefore, when testing a semiconductor integrated circuit device having a high-precision analog signal output terminal that cannot be tested by a general semiconductor integrated circuit device test system (confirming normal operation), a general semiconductor integrated circuit device test is required. It is necessary to perform the test not with the system but with a special inspection device with a built-in high-accuracy comparator, which increases the purchase cost and maintenance cost of the inspection device, which increases the inspection cost. .

  In order to solve this problem, a method of installing a high-precision analog-to-digital converter incurring high costs on a performance board is conceivable, but regarding this method, a similar configuration described in Patent Document 1 below is disclosed. Yes. However, the aim of this Patent Document 1 is basically a method of using a conventional tester, providing an additional circuit on a performance board, and using this to make the tester multifunctional. In this Patent Document 1, the measurement of general DC electrical characteristics of a semiconductor integrated circuit device as a device under test is performed by setting a switch at a position directly connected to a tester, and measuring the switch with an analog / digital converter. When set, for example, a device to be measured is a digital-to-analog converter, and a method used for a test such as measurement of operation accuracy of the device to be measured such as measuring the conversion accuracy is disclosed.

In this known example, the device is designed to be multi-functional and not intended for high-accuracy measurement beyond the measurement accuracy of the tester, so the configuration is an analog installed on the performance board connected to the tester input side. Although it suggests the use of digital converters, it is not mentioned until high-precision measurements. FIG. 7 shows the configuration described in Patent Document 1 in a simplified manner. In this configuration, the output of the switch 63 and the analog-digital conversion circuit 64 is connected to the conventional tester 65 on the performance board 61.
Here, the output of the device under test 62 is connected to the common terminal of the switch 63, the first terminal of the switch 63 is directly connected to the tester, and the second terminal is an analog-to-digital conversion circuit 64 with high accuracy. In this method, voltage measurement is performed and the measurement result is displayed by the tester 65.

JP-A-7-243875

  In the case of the prior art, as described above, in order to test a semiconductor integrated circuit device having a high-precision analog signal output terminal that cannot be tested by a general semiconductor integrated circuit device test system, a high-precision A special inspection device with a built-in comparator has to be prepared, which inevitably increases the inspection cost such as the purchase cost and maintenance cost of the inspection device.

  Therefore, in the present invention, in a test system for measuring a semiconductor integrated circuit device having an analog signal output terminal that needs to guarantee a change in voltage value with extremely high accuracy, the measurement accuracy of the tester used is more than Another object of the present invention is to provide a means that makes it possible to measure an analog signal output level of a semiconductor integrated circuit device to be measured with improved accuracy.

In order to solve the above problem, in claim 1 of the present invention,
A probe brought into contact with a measurement point of the semiconductor integrated circuit device for determining the quality of the semiconductor integrated circuit device to be measured, and an input signal from the semiconductor integrated circuit device connected to the probe via a first wiring An input signal conversion circuit that converts the signal into a signal that can be measured with high accuracy, an output terminal for connection to a tester that is a voltage measurement unit, and the output of the input signal conversion circuit are input via a second wiring And a probe card comprising an analog-to-digital conversion circuit having higher accuracy than the tester that is the voltage measurement unit, and a third wiring that connects the digital output of the analog-to-digital conversion circuit and the output terminal unit The semiconductor integrated circuit test system has a configuration in which the output terminal portion of the probe card is connected to a tester that is the voltage measuring portion.

  The voltage for the input signal conversion circuit in the probe card according to claim 1 to output by adding or subtracting a predetermined DC voltage to the DC voltage level of the output signal of the semiconductor integrated circuit device. It defines the probe card which is a level conversion circuit.

  According to a third aspect of the present invention, the input signal conversion circuit in the probe card according to the first aspect defines a probe card that is an impedance matching circuit for removing waveform distortion due to impedance mismatching.

  According to a fourth aspect of the present invention, the input signal conversion circuit in the probe card according to the first aspect defines a probe card that is an integration circuit.

  In claim 5, the input signal conversion circuit in the probe card according to claim 1 is configured by serial connection of at least two of the voltage level conversion circuit, the impedance matching circuit, and the integration circuit. The probe card is specified.

  According to a sixth aspect of the present invention, there is provided a semiconductor integrated circuit comprising the probe card according to any one of the second to fifth aspects, wherein the output terminal portion of the probe card is connected to a tester that is the voltage measuring portion. It specifies the circuit device test system.

According to the first embodiment of the present invention, high-accuracy analog-to-digital conversion is enabled by inputting an analog output of a semiconductor integrated circuit device, which is a device under test, to an analog-to-digital conversion circuit via an input signal conversion circuit. Since the digital output signal is read by the voltage measurement unit, which is a general tester, the analog output signal of the device under test is indirectly measured via the digital signal. Measurement accuracy can be improved by the accuracy of the instrument, and high-accuracy measurement is possible regardless of the measurement accuracy of the tester itself.
According to the second embodiment, even when the output voltage of the semiconductor integrated circuit device, which is a device under test, is outside the range of voltage values that can be input to the high-precision analog-to-digital conversion circuit, the voltage level conversion circuit performs direct current conversion as the input signal conversion circuit. The DC voltage level is converted so that the voltage level can be input and input to the high-precision analog-to-digital conversion circuit so that high-precision measurement can be performed.

  According to the invention according to the third embodiment, by using the impedance conversion circuit as the input signal conversion circuit, it is possible to reduce deterioration in measurement accuracy due to noise generated due to impedance mismatch and improve measurement accuracy.

  According to the invention according to the fourth embodiment, since the integration circuit is used as the input signal conversion circuit, the same test as when the output voltage of the semiconductor integrated circuit device is directly monitored cannot be performed. It is possible to measure the average value of the output voltage or to remove noise in a high frequency range, thereby improving the measurement accuracy.

  According to the invention according to the fifth embodiment, impedance matching is performed as an input signal conversion circuit, a DC voltage level (bias voltage) of a signal can be arbitrarily set, and an average value can be measured. Thus, it is possible to measure a wide range of measurement items for signals in a wide voltage range.

Hereinafter, embodiments of the present invention will be described with reference to the drawings. In addition, the same number is assigned to the common part in all drawings, and duplication description is avoided.
(Embodiment 1)
In the present invention, as shown in FIG. 1, the analog output terminal voltage of the semiconductor integrated circuit device 11 which is a device under test is detected by the probe 4 so that the detected voltage value can be measured with high accuracy, or The input signal conversion circuit 10 processes the input signal so that measurement according to the purpose is possible, and the processed input signal is connected to the output side of the input signal conversion circuit 10. The digital data is digitized, and the digitized data is read as a digital data series of serial output or parallel output by discriminating logic “1” or logic “0” by a voltage comparator built in the tester which is the voltage measuring unit 12. A configuration in which the digital data series is converted into analog data in the voltage measurement unit 12 and the voltage data is read and displayed. It has been with the present form. That is, according to the configuration of the present invention, it is the analog-to-digital conversion circuit that determines the measurement accuracy, and the tester that is the voltage measuring unit 12 simply reads the output digital level of the analog-to-digital conversion circuit and displays the analog value. Therefore, it is possible to apply a generally used tester as it is without requiring a highly accurate measuring instrument.

(Embodiment 2)
FIG. 2 is a diagram showing a configuration of a semiconductor integrated circuit device test system according to the second embodiment of the present invention. The semiconductor integrated circuit device test system includes a probe card 1, a voltage level conversion circuit 2 as an input signal conversion circuit, a high-precision analog-digital conversion circuit 3, and an output terminal of a semiconductor integrated circuit device 11 as a device under test. A probe 4 that is connected to a measurement point such as a test pin or a pad for connection to a tester that is to be a voltage measurement unit 12, and an output terminal unit 5 that is a measurement point such as a probe card 1 The first wiring 6 for analog transmission for connecting the input terminal 54 (see FIG. 6 described later) of the voltage level conversion circuit 2 and the probe 4, the output of the voltage level conversion circuit 2, and the high-precision analog-digital conversion circuit The second wiring 7 for inter-circuit connection with the input 3, the output of the high-precision analog-to-digital conversion circuit 3, and the voltage measuring unit 12 are connected to the above. Incorporating a third wiring 8 for digital data transmission that connects the power terminal unit 5.

The voltage level conversion circuit 2 has a voltage range that allows the high-precision analog-to-digital conversion circuit 3 to process the voltage of a signal input from the semiconductor integrated circuit device 11 that is the device under measurement via the probe 4 and the first wiring 6. Thus, the signal is converted into a signal of a preset DC voltage level and output to the high-precision analog-digital conversion circuit 3.
As the voltage level conversion circuit, for example, a circuit that divides a DC power supply voltage by two resistors 51 and 52 as shown in FIG. 6 can be applied. In this case, the voltage value to be pulled up may be set by the power supply voltage or the resistance ratio of the two resistors 51 and 52. For example, a circuit (such as a voltage dividing circuit) corresponding to a plurality of voltage levels may be provided and used by switching according to the input voltage level. Here, the movement of the DC voltage shifted by the voltage level conversion circuit is displayed by adding or subtracting the movement of the voltage to the analog / digital conversion circuit output in the voltage measuring unit 12 or generating a digital voltage. A digital device may be provided, and digital addition or subtraction may be performed at the output side of the analog-digital conversion circuit and sent to the voltage measurement unit 12.
The high-precision analog-to-digital conversion circuit 3 converts the voltage value of the signal input from the voltage level conversion circuit 2 via the second wiring 7 into an n-bit (n is an integer of 2 or more) digital signal, and converts the digital data The voltage measurement unit 12 is connected to the transmission line via the third wiring 8 and the output terminal unit 5.

  Since the output voltage of the voltage level conversion circuit 2 and the output value of the analog-to-digital converter 3 obtained by digitizing it are determined by the output voltage of the semiconductor integrated circuit device 11 which is the device under measurement, the semiconductor according to the second embodiment In the integrated circuit device test system, the output of the semiconductor integrated circuit device is once converted into a digital quantity, so that the output voltage of the semiconductor integrated circuit device 11 which is a device under test is indirectly measured. Thereby, the measurement accuracy is determined not by the accuracy of the voltage measurement unit 12 but by the accuracy of the voltage level conversion circuit 2 and the accuracy of the high-precision analog-digital conversion circuit 3. Therefore, by increasing the accuracy of the voltage level conversion circuit 2 and the high-precision analog-digital conversion circuit 3 mounted on the probe card 1, it becomes possible to use a normal tester that is not particularly accurate as the voltage measurement unit 12. .

  The high-accuracy analog-to-digital conversion circuit 3 generally has a limited range of voltage values that can be input (for example, 0 to 1 V, etc.), but the output voltage of the semiconductor integrated circuit device 11 that is a device under test is high. Even if it is outside the range of voltage (full scale voltage) that can be input to the high-precision analog-to-digital conversion circuit 3, the voltage level conversion circuit 2 converts the level of the DC voltage and can be processed by the high-precision analog-to-digital conversion circuit 3 A highly accurate test can be performed by setting the range to be in the proper range.

(Embodiment 3)
FIG. 3 shows the configuration of a semiconductor integrated circuit device test system according to the third embodiment. In this semiconductor integrated circuit device test system, an impedance matching circuit 21 is installed as an input signal conversion circuit on the probe card 1, and a high-precision analog-digital conversion circuit 3 and a semiconductor integrated circuit device 11 which is a device under test are installed on the impedance matching circuit 21. A probe 4 for connection to a measurement point such as an output terminal, an output terminal portion 5 forming a probe card output terminal for connection to the voltage measurement unit 12, and an input of the impedance matching circuit 21 and the probe 4 are connected. A first wiring 22 for analog high-frequency transmission, a second wiring 23 for connecting the output of the impedance matching circuit 21 and the input of the high-precision analog-digital conversion circuit 3, and the output of the high-precision analog-digital conversion circuit 3 A third wiring 8 for connecting to the output terminal portion 5 is built in.

  The impedance matching circuit 21 includes impedance mismatch due to connection between the semiconductor integrated circuit device 11 to be tested and the probe card 1, impedance mismatch at the connection point between the probe 4 and the wiring, and input to the high-precision analog-to-digital conversion circuit 3. This is to suppress impedance mismatching at the connection point of the wiring. That is, a resistor network or a transformer is used so that impedance is matched at these connection points with respect to the frequency band to be measured. Which of these is adopted is determined according to the frequency band to be used and other measurement purposes.

  In the semiconductor integrated circuit device test system according to the third embodiment, the digital signal output of the high-precision analog-to-digital conversion circuit 3 is monitored by the voltage measuring unit 12 via the third wiring 8 and the output terminal unit 5, thereby generating an impedance. The output voltage of the matching circuit 21 can be measured. Since the output voltage of the impedance matching circuit 21 is determined by the output voltage of the semiconductor integrated circuit device 11 that is the device under measurement, the output voltage of the device under measurement is indirectly measured by the semiconductor integrated circuit device test system of the third embodiment. The output voltage of a certain semiconductor integrated circuit device 11 can be tested.

  Also in this case, the accuracy when the output voltage of the semiconductor integrated circuit device 11 is tested by the semiconductor integrated circuit device test system of the third embodiment is not the accuracy of the voltage measuring unit 12 but the matching accuracy of the impedance matching circuit 21. It is determined by the accuracy of the high-precision analog-digital conversion circuit 3. Therefore, by increasing the matching accuracy of the impedance matching circuit 21 mounted on the probe card 1 and the accuracy of the high-precision analog-to-digital conversion circuit 3, the general voltage measuring unit 12 with low accuracy can be used.

  As described above, when the output voltage of the semiconductor integrated circuit device 11 that is a device under test changes at high speed, if the impedance mismatch at the input of the high-precision analog-to-digital conversion circuit is large, noise is generated at the input of the high-precision analog-to-digital conversion circuit. The test accuracy is deteriorated and the impedance matching circuit 21 is mounted on the probe card 1, so that the noise generation due to the impedance mismatch at the input of the high-precision analog-digital conversion circuit can be reduced.

(Embodiment 4)
FIG. 4 shows the configuration of a semiconductor integrated circuit device test system according to the fourth embodiment. This semiconductor integrated circuit device test system uses an integration circuit 31 on the probe card 1 as an input signal conversion circuit. By using the integration circuit 31, it is possible to measure the average value of the input signal or eliminate the influence of noise in the high frequency region. Other configurations are the same as those of the first and second embodiments. That is, the high-precision analog-to-digital conversion circuit 3, the probe 4 for connecting to the semiconductor integrated circuit device 11 that is the device under measurement, the output terminal unit 5 for connecting to the voltage measuring unit 12, and the input of the integrating circuit 31 The first wiring 32 for connecting the probe 4 and the probe 4, the second wiring 33 for connecting the output of the integration circuit 31 and the input of the high-precision analog-digital conversion circuit 3, the output of the high-precision analog-digital conversion circuit 3, and the voltage measurement A third wiring 8 for connecting the output terminal portion 5 for connection to the portion 12 is incorporated.

  In the semiconductor integrated circuit device test system according to the fourth embodiment, the digital signal output of the high-precision analog-to-digital conversion circuit 3 is monitored by the voltage measurement unit 12 via the third wiring 8 and the output terminal unit 5, thereby integrating the signal. The output voltage of the circuit 31 can be tested. Since the output voltage of the integration circuit 31 is determined by the output voltage of the semiconductor integrated circuit device 11 which is the device under measurement, the semiconductor which is the device under test indirectly by the semiconductor integrated circuit device test system of the fourth embodiment. The output voltage of the integrated circuit device 11 can be tested.

  That is, the accuracy when the output voltage of the semiconductor integrated circuit device 11 is tested by the semiconductor integrated circuit device test system of the fourth embodiment is not the accuracy of the voltage measuring unit 12 but the accuracy of the integrating circuit 31 and the high-precision analog. It is determined by the accuracy of the digital conversion circuit 3. Therefore, by increasing the accuracy of the integration circuit 31 and the high-precision analog-to-digital conversion circuit 3 mounted on the probe card 1, it is possible to use the voltage measurement unit 12 with a relatively low accuracy like a normal tester.

  When the output voltage of the semiconductor integrated circuit device 11 is tested by the semiconductor integrated circuit device test system according to the fourth embodiment, the output voltage of the semiconductor integrated circuit device 11 is directly monitored because of the integration circuit. However, the average value of the output voltage of the semiconductor integrated circuit device 11 can be measured every preset period. Further, a low-pass filter can be used in the integrating circuit 31 for removing high frequency band noise.

(Embodiment 5)
FIG. 5 shows the configuration of a semiconductor integrated circuit device test system according to the fifth embodiment. This semiconductor integrated circuit device test system uses a circuit in which an impedance matching circuit 41, a voltage level conversion circuit 42, and an integration circuit 43 are connected in series on the probe card 1 as an input signal conversion circuit. A conversion circuit 3 and a probe 4 for connecting to a measurement point such as an output terminal of the semiconductor integrated circuit device 11 as a device to be measured are provided, and the output of the high-precision analog-digital conversion circuit is connected to the voltage measurement unit 12 An output terminal unit 5 for connecting the input terminal of the impedance matching circuit 41 and the probe 4, an output of the impedance matching circuit 41, and an input terminal 54 of the voltage level conversion circuit 42 (see FIG. 6). A fourth wiring 44 to be connected, a fifth wiring 45 for connecting the output of the voltage level conversion circuit 42 and the input of the integration circuit 43, and a product The second wiring 33 that connects the output of the circuit 43 and the input of the high-precision analog-digital conversion circuit 3, and the output terminal unit 5 for connection to the output of the high-precision analog-digital conversion circuit 3 and the voltage measurement unit 12 A third wiring 8 to be connected is built in.

  The impedance matching circuit 41 suppresses impedance mismatching or the like at the input terminal 54 of the voltage level conversion circuit 42. The voltage level conversion circuit 42 converts the voltage of the signal input from the impedance matching circuit 41 through the fourth wiring 44 into a signal having a preset DC voltage level, and outputs the signal to the integration circuit 43.

  In the semiconductor integrated circuit device test system according to the fifth embodiment, the digital signal output of the high-precision analog-to-digital conversion circuit 3 is measured by the voltage measuring unit 12 via the third wiring 8 and the output terminal unit 5, thereby integrating the signal. The output voltage of the circuit 43 can be tested. Since the output voltage of the integration circuit 43 is determined by the output voltage of the semiconductor integrated circuit device 11 which is the device under measurement, the semiconductor which is the device under test indirectly by the semiconductor integrated circuit device test system of the fifth embodiment. The output voltage of the integrated circuit device 11 can be tested.

  As a result, the accuracy when testing the output voltage of the semiconductor integrated circuit device 11 by the semiconductor integrated circuit device test system of the fifth embodiment is not the accuracy of the voltage measuring unit 12, but the accuracy and voltage of the impedance conversion circuit 41. It is determined by the accuracy of the level conversion circuit 42, the accuracy of the integration circuit 43, and the accuracy of the high-precision analog-digital conversion circuit 3. Therefore, the accuracy of the impedance conversion circuit 41, the voltage level conversion circuit 42, the integration circuit 43, and the high-precision analog-digital conversion circuit 3 mounted on the probe card 1 is set so as to obtain a desired accuracy. Can be used.

  When the test of the output voltage of the semiconductor integrated circuit device 11 is performed by the semiconductor integrated circuit device test system of the fifth embodiment, since the integration circuit is provided, the semiconductor integrated circuit device is the same as in the fourth embodiment. Although the instantaneous value measurement similar to the case of directly measuring the output voltage of 11 is not possible, the average value of the output voltage of the semiconductor integrated circuit device 11 can be tested every preset period.

  Even when the output voltage of the impedance conversion circuit 41 is outside the range of voltage values that can be input to the high-precision analog-digital conversion circuit 3, the voltage level conversion circuit 42 converts the voltage value and inputs it to the integration circuit 43. This makes it possible to perform a highly accurate test. Furthermore, by installing the impedance matching circuit 41, noise generation due to impedance mismatching or the like at the input of the voltage level conversion circuit 42 can be reduced. Even in this case, the voltage value shifted by the voltage level conversion circuit 42 can be corrected when the voltage measurement unit reads digital data.

  Even if the impedance conversion circuit 41 and the voltage level conversion circuit 42 in the diagram showing the configuration of the semiconductor integrated circuit device test system in FIG. Even if the voltage level conversion circuit 42 and the integration circuit 43 in the diagram showing the configuration of the semiconductor integrated circuit device test system in FIG. 5 are replaced, the effect is not changed. The second embodiment and the second embodiment also have a configuration in which one of the impedance conversion circuit 41, the voltage level conversion circuit 42, and the integration circuit 43 in the diagram showing the configuration of the semiconductor integrated circuit device test system in FIG. 3 or the same effect as the fourth embodiment can be obtained.

In addition to the impedance matching circuit (21, 41), the voltage level conversion circuit (2, 42), and the integration circuit (31, 42), an amplifier circuit or the like can be inserted.
In addition, when a semiconductor integrated circuit device, which is a device under test, has a current output like a current output type digital-analog conversion integrated circuit, and measures the output, a probe, a voltage level conversion circuit, impedance matching By inserting a current-voltage conversion circuit between the circuit or the integration circuit, the same effect as in the second to fourth embodiments can be obtained. It is possible to use a circuit in which the voltage level conversion circuit and the impedance matching circuit are integrated. It is also possible to use a circuit in which a current-voltage conversion circuit and an impedance conversion circuit are integrated.

1 is a configuration diagram of a semiconductor integrated circuit device test system showing a basic configuration of the present invention described in Embodiment 1. FIG. FIG. 3 is a configuration diagram of a semiconductor integrated circuit device test system according to a second embodiment. FIG. 6 is a configuration diagram of a semiconductor integrated circuit device test system according to a third embodiment. FIG. 6 is a configuration diagram of a semiconductor integrated circuit device test system according to a fourth embodiment. FIG. 10 is a configuration diagram of a semiconductor integrated circuit device test system according to a fifth embodiment. The circuit diagram which shows an example of a voltage level conversion circuit. 1 is a schematic configuration diagram of a conventional semiconductor integrated circuit device test system.

Explanation of symbols

1: Probe card 2: Voltage level conversion circuit 3: High precision analog-digital conversion circuit 4: Probe 5: Output terminal 6: First wiring 7: Second wiring 8: Third wiring 10: Input signal conversion circuit 11: Semiconductor integrated circuit device 12: Voltage measurement unit (tester) 21: Impedance matching circuit 22: First wiring 23: Second wiring 31: Integration circuit 32: First wiring 33: Second wiring 41: Impedance Conversion circuit 42: Voltage level conversion circuit 43: Integration circuit 44: Fourth wiring 45: Fifth wiring 51, 52: Resistor 54: Input terminal 61: Performance board 62: Semiconductor integrated circuit device 63: Switch 64: Analog Digital conversion circuit 65: tester

Claims (6)

A probe that is brought into contact with a measurement point of the semiconductor integrated circuit device to determine whether the semiconductor integrated circuit device being measured is good or bad;
An input signal conversion circuit connected to the probe via a first wiring and converting an input signal from the semiconductor integrated circuit device into a signal capable of high-precision measurement;
An output terminal for connection to a tester which is a voltage measuring unit;
The input signal conversion circuit output is input through a second wiring, and an analog-to-digital conversion circuit having higher accuracy than a tester that is the voltage measurement unit;
A probe card comprising a digital output of the analog-digital conversion circuit and a third wiring connecting the output terminal portion;
The semiconductor integrated circuit device test system, wherein the output terminal portion of the probe card is connected to a tester which is the voltage measuring portion. The input signal conversion circuit in the probe card according to claim 1,
A probe card, comprising: a voltage level conversion circuit for adding or subtracting a predetermined DC voltage to a DC voltage level of the semiconductor integrated circuit device output signal. The input signal conversion circuit in the probe card according to claim 1,
A probe card, wherein the probe card is an impedance matching circuit for removing waveform distortion caused by impedance mismatching. The input signal conversion circuit in the probe card according to claim 1,
A probe card characterized by being an integrating circuit. The input signal conversion circuit in the probe card according to claim 1,
A probe card comprising a series connection of at least two of the voltage level conversion circuit, the impedance matching circuit, and the integration circuit. A probe card according to any one of claims 2 to 5,
The semiconductor integrated circuit device test system, wherein the output terminal portion of the probe card is connected to a tester which is the voltage measuring portion.

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