JP2006130839A - Inkjet recording head manufacturing method and inkjet recorder - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a method for manufacturing a low-cost and high precision inkjet recording head, in which a manufacturing process of welding a filter to an ink storage is simplified. <P>SOLUTION: The method of manufacturing the inkjet recording head is characterized in that, in a welding process of heat welding a filter H1700 removing foreign matters to a filter welding part H2020 being a supporter of the filter H1700, a heat welding fixture 500 is preliminarily heated in advance of holding the filter H1700 on the holding surface 503 of the welding part H2020. <P>COPYRIGHT: (C)2006,JPO&NCIPI

Description

  The present invention relates to an ink jet recording head manufacturing method and an ink jet recording apparatus that perform a recording operation by discharging a liquid such as ink.

As an improvement of the bubble jet method in the ink jet recording apparatus, as a new method proposed by the applicant of the present application, an air communication method in which bubbles are made constant by allowing bubbles to communicate with the atmosphere, and micro droplets can be ejected, Printers using a so-called bubble through jet system (hereinafter referred to as BTJ system) have been put on the market. This printer has heads for each color of black, cyan, magenta, and yellow, and by using the BTJ method in common, it achieves high-quality printing based on ensuring the stable discharge amount of microdroplets. Yes. In other words, in order to achieve high-quality color recording equivalent to silver halide photography, it is necessary to make the dots small so that the dots are not visible on the paper (no graininess). The setting is about 5 pl (pico liter, 10 ^-12 liter), dot diameter 40-50 μm, resolution 600 × 1200-1200 × 1200 dpi (dpi is the unit indicating the number of dots per inch), but it can be fully supported It is.

  On the other hand, with the demand for higher image quality, the diameter of the discharge port is reduced in order to reduce the size of the droplet, and therefore management and countermeasures against foreign matter entering the discharge port are a major issue. New development items such as improvement of the filtration performance of the filter for removing foreign substances and a method of joining the filter and the ink storage container have become essential. As a method for joining the filter and the ink storage container, for example, a filter peripheral part described in Patent Document 1 is embedded and fixed in a container filter receiving part, or a filter described in Patent Document 2 is stored in ink. There is a method of fixing via a melting member on the filter welding surface of the container.

  FIG. 11 shows an example of a process flow of conventional filter welding.

  Conventionally, since a filter H1700 for removing foreign matters is disposed in advance in the filter weld portion H2020, a positioning portion H2030 is provided on the periphery of the weld portion so as to be disposed at a predetermined position (FIG. 11A). The positioning portion H2030 is often formed as small and thin as possible so as not to hinder the liquid holding member H1600 from coming into pressure contact with the filter H1700 later. When the ink storage container H2000 is molded as small and thin as possible, it causes a bad effect such as short molding due to insufficient flow of resin when molding the ink storage container H2000, which causes a decrease in productivity.

  When the filter H1700 cut out to a predetermined size is positioned in the ink storage container H2000, the filter H1700 is arranged from the ink chamber 2010 side with fingers such as a robot (not shown) (FIG. 11B).

After the filter H1700 is disposed on the welding part 40 of the filter welding part H2020, the heated heat welding jig 50 is lowered (FIG. 11C). The temperature rise of the filter H1700 starts only when the heat welding jig 50 comes into contact with the filter H1700. The heat of the heat welding jig 50 is conducted to the filter H1700 by the filter H1700, and the filter H1700 rises to a predetermined temperature, so that the temperature of the welded portion 40 rises through the filter H1700, starts melting, and the metal nonwoven fabric. Solidifies while flowing into the filter H1700.
JP-A-6-238910 JP-A-8-080616

  However, such an ink jet recording head has the following problems. That is, in order to produce a high-precision inkjet recording head, a large capital investment is required, and the depreciation cost of equipment occupies a large proportion of the head cost. Therefore, further efficiency improvement of productivity is required, and for this purpose, development of a new manufacturing method in a process that hinders efficiency improvement has been a major issue.

  In any of the above-described filter welding methods, the filter is disposed in advance in the welded portion, and then the welded portion is melted by a heated heat welding jig or the like to fix the filter. At this time, since the filter positioning wall is arranged in the filter welding part, not only a high-precision robot is required to place the filter in the positioning wall, but also the positioning wall is formed by a mold. To achieve this, precision molding technology is required.

  In addition, in the method in which the filter is directly welded to the filter welding surface of the ink storage container, the heat of the heat welding jig is transferred to the welded portion through the filter after the filter whose temperature has not been raised is pressed against the welded portion. Unfortunately, the tact time required for welding is increased, resulting in a decrease in productivity and hindering cost reduction.

  In recent years, printers using the BTJ system have become widespread and the price has been rapidly reduced. To cope with this low-priced, high-performance wave, the cost of the BTJ recording head has been further reduced. This is becoming an issue, and the above-described filter welding process is also becoming a target.

  SUMMARY OF THE INVENTION An object of the present invention is to provide a method for manufacturing an inkjet recording head and an inkjet recording apparatus that can simplify the manufacturing process when a filter is welded to an ink storage container, and that are low-cost and highly accurate.

  In order to achieve the above object, a method of manufacturing an ink jet recording head according to the present invention includes a filter held on a holding surface in a welding step in which a filter for removing foreign matter is welded to a support supporting the filter by thermal fusion. A heat welding jig that heats and presses the filter against the support to weld the filter to the support is heated in advance before the filter is held on the holding surface.

  ADVANTAGE OF THE INVENTION According to this invention, the manufacturing process in filter welding can be simplified and the manufacturing method of an inexpensive inkjet recording head and an inkjet recording device can be provided.

  Next, embodiments of the present invention will be described with reference to the drawings.

  1 to 7 are explanatory views for explaining a suitable recording head in which the present invention is implemented or applied. Hereinafter, each component will be described with reference to these drawings.

  The recording head of the present invention has an ink tank integrated structure as shown in FIGS. 1 and 4, the first recording head H1000 in FIG. 1 uses black ink, and the second recording head H1001 in FIG. Each color ink (cyan ink, magenta ink, yellow ink) is mounted. These recording heads H1000 and H1001 are fixedly supported by positioning means and electrical contacts of a carriage mounted on the ink jet recording apparatus main body, and are detachable from the carriage, so that the mounted ink is consumed. Then each will be replaced.

Next, these recording heads will be described in detail for each component constituting the recording head.
(1) Recording Head The first recording head H1000 and the second recording head H1001 in the present embodiment are electrothermal transducers that generate thermal energy for causing film boiling on ink according to an electrical signal. This is a bubble jet (registered trademark) type recording head used, and is a so-called side shooter type recording head in which an electrothermal transducer and an ink discharge port are arranged to face each other.
(1-1) First Recording Head The first recording head H1000 is used for black ink. As shown in the exploded perspective view of FIG. 2, the recording element substrate H1100, the electric wiring tape H1300, and the ink storage. It includes a container H1500, a filter H1700 for removing foreign matter, an ink absorber H1600, a lid member H1900, and a seal member H1800.
(1-1-1) First Recording Element Substrate FIG. 3 is a partially broken perspective view for explaining the configuration of the first recording element substrate H1100. For example, the first recording element substrate H1100 is anisotropically etched by using a Si substrate H1110 having a thickness of 0.5 to 1 mm and an ink supply port H1102 having a long groove-like through-hole serving as an ink flow path using the crystal orientation of Si. Or sandblasting.

  On both sides of the ink supply port H1102, the electrothermal conversion elements H1103 are formed and arranged in a row, and an electric wiring (not shown) made of Al or the like for supplying electric power to the electrothermal conversion elements H1103. Is formed. These electrothermal conversion elements H1103 and electric wiring are formed by a film forming technique. The electrothermal conversion elements H1103 are arranged in a staggered manner in each row, that is, the positions of the ejection ports in each row are slightly shifted so as not to line up in a direction orthogonal to the row direction. Furthermore, electrode portions H1104 for supplying electric power to the electric wiring or supplying an electric signal for driving the electrothermal conversion element H1103 are arranged along both outer sides of the electrothermal conversion element H1103. A bump H1105 made of Au or the like is formed on the electrode portion H1104.

On the surface on which the pattern on the Si substrate H1110 is formed, there is an ink flow path wall H1106 that forms an ink flow path corresponding to the electrothermal conversion element H1103 and a top part that covers the top thereof, and is discharged to the ceiling part. A structure body made of a resin material with an outlet H1107 opened is formed by a photolithography technique. The discharge port 1107 is provided to face the electrothermal conversion element H1103, and forms a discharge port group H1108. In the first recording element H1100, the ink supplied from the ink flow path H1102 is ejected from the ejection port 1107 facing each electrothermal conversion element H1103 by the pressure of the bubbles generated by the heat generated by each electrothermal conversion element H1103. The
(1-1-2) Electric Wiring Tape The electric wiring tape H1300 forms an electric signal path for applying an electric signal for ejecting ink to the first recording element substrate H1100. Is formed, and an electrode terminal H1304 connected to the electrode portion H1104 of the recording element substrate is formed near the edge of the opening. The electrical wiring tape H1300 has an external signal input terminal H1302 for receiving an electrical signal from the main unit, and the electrode terminal H1304 and the external signal input terminal H1302 are connected by a continuous copper foil wiring pattern. Yes.

The electrical connection between the electrical wiring tape H1300 and the first recording element substrate 1100 is, for example, the bump H1105 formed on the electrode portion H1104 of the first recording element substrate H1100 and the electrode portion H1104 of the first recording element substrate H1100. The electrode terminal H1304 of the electric wiring tape H1300 corresponding to is electrically bonded by a thermosonic bonding method.
(1-1-3) Ink Storage Container The ink storage container H1500 is formed by, for example, resin molding. As the resin material, it is desirable to use a resin material mixed with 5 to 40% of glass filler in order to improve rigidity. As shown in FIG. 2, the ink storage container H1500 has an ink holding member H1600 for holding ink therein and generating negative pressure, thereby leading the ink tank function and the ink to the recording element substrate H1100. The ink flow path is formed to provide an ink supply function. As the ink holding member H1600, a compressed PP (polypropylene) fiber is used, but a compressed urethane fiber may be used. A filter H1700 for preventing dust from entering the recording element substrate H1100 is joined to the boundary with the ink holding member H1600, which is the upstream portion of the ink flow path, by welding. The filter H1700 may be a SUS metal mesh type, but is preferably a SUS metal fiber sintered type.

  A first ink supply port H1200 for supplying black ink to the first recording element substrate H1100 is formed in the downstream portion of the ink flow path, and the ink supply port 1102 of the first recording element substrate H1100 is formed. The first recording element substrate H1100 is bonded and fixed to the ink storage container H1500 with high positional accuracy so as to communicate with the first ink supply port H1200 of the ink storage container H1500. The first adhesive (not shown) used for the bonding is desirably a low viscosity, low curing temperature, cured in a short time, has a relatively high hardness after curing, and has ink resistance. For example, a thermosetting adhesive mainly composed of an epoxy resin is used as the first adhesive, and the thickness of the adhesive layer at that time is preferably about 50 μm.

In addition, a part of the back surface of the electric wiring tape H1300 is bonded and fixed to a plane around the bonding surface of the first recording element substrate H1100 with a second adhesive (not shown). The electrical connection portion between the first recording element substrate H1100 and the electrical wiring tape H1300 is sealed with a first sealant H1307 and a second sealant H1308 (see FIG. 7), and the electrical connection portion is made of ink. Protected against corrosion and external impacts. The first sealing agent H1307 mainly seals the back surface side of the connection portion between the electrode terminal H1302 of the electric wiring tape H1300 and the bump H1105 of the recording element substrate and the outer peripheral portion of the recording element substrate, and the second sealing agent. The agent H1308 seals the front side of the connection portion described above. The unbonded portion of the electric wiring tape H1300 is bent and fixed to the side surface of the ink supply holding member H1500 that is substantially perpendicular to the bonding surface of the first recording element substrate H1100 by heat caulking or bonding.
(1-1-4) Lid Member The lid member H1900 seals the inside of the ink storage container H1500 by being welded to the upper opening of the ink storage container H1500. However, the lid member H1900 has a narrow opening H1910 for releasing pressure fluctuation inside the ink storage container H1500 and a fine groove H1920 communicating with the narrow opening H1910. An atmospheric communication port is formed by opening one end of H1920. In addition, an engaging portion H1930 for fixing the first recording head H1100 to the ink jet recording apparatus (see FIG. 11) is provided.
(1-2) Second Recording Head The second recording head H1001 is for ejecting ink of three colors of cyan, magenta, and yellow, and as shown in the exploded perspective view of FIG. 5, the recording element substrate H1101. , Electrical wiring tape H1301, ink storage container H1501, filters H1701, H1702, and H1703, ink holding members H1601, H1602, and H1603, a lid member H1901, and a seal member H1801.
(1-2-1) Second Recording Element Substrate FIG. 6 is a partially broken perspective view for explaining the configuration of the second recording element substrate H1101, and includes three elements for cyan, magenta, and yellow. The ink supply ports H1102 are formed in parallel. Electrothermal conversion elements H1103 and discharge ports H1107 are arranged in a row in a staggered manner on both sides of each ink supply port H1102. Similar to the Si substrate H1110 and the first recording element substrate H1100, electrical wiring, fuses, electrode portions H1104, and the like are formed on the Si substrate H1101, and an ink flow is made of a resin material by photolithography technology. A road wall H1106 and a discharge port H1107 are formed, and a bump H1105 such as Au is formed on an electrode portion H1104 for supplying electric power to the electric wiring.
(1-2-2) Electric Wiring Tape The electric wiring tape H1301 forms an electric signal path for applying an electric signal for ejecting ink to the second recording element substrate H1101, and the recording element substrate. Is formed, and an electrode terminal H1304 connected to the electrode portion H1104 of the recording element substrate is formed near the edge of the opening. The electric wiring tape H1301 is formed with an external signal input terminal H1302 for receiving an electric signal from the main unit, and the electrode terminal H1304 and the external signal input terminal H1302 are connected by a continuous copper foil wiring pattern. Yes.

The electrical connection between the electrical wiring tape H1301 and the second recording element substrate 1101 is, for example, the bump H1105 formed on the electrode portion H1104 of the second recording element substrate H1101 and the electrode portion H1104 of the second recording element substrate H1101. The electrode terminal H1304 of the electric wiring tape H1301 corresponding to is electrically bonded by a thermosonic bonding method.
(1-2-3) Ink Storage Container The ink storage container H1501 is formed by resin molding, for example. As the resin material, it is desirable to use a resin material mixed with 5 to 40% of glass filler in order to improve the shape rigidity. As shown in FIG. 5, the ink supply holding member H1501 independently holds ink holding members H1601, H1602, and H1603 for generating negative pressure for holding cyan, magenta, and yellow ink therein. Thus, the ink tank function and the ink supply function are provided by forming independent ink flow paths for guiding ink to the ink supply ports H1102 of the recording element substrate H1100. As the ink holding members H1601, H1602, and H1603, PP fibers compressed are used, but urethane fibers may be compressed. Filters H1701, H1702, and H1703 for preventing dust from entering the inside of the recording element substrate H1101 are joined to the boundary portions with the ink holding members H1601, H1602, and H1603 in the upstream portion of each ink flow path by welding. . Each filter H1701, H1702, and H1703 may be a SUS metal mesh type, but a SUS metal fiber sintered type is more preferable.

  In the downstream portion of the ink flow path, ink supply ports H1201 for supplying cyan, magenta, and yellow ink to the second recording element substrate H1101 are formed, and each ink of the second recording element substrate H1101 is formed. The second recording element substrate H1101 is bonded and fixed to the ink storage container H1501 with high positional accuracy so that the supply port 1102 communicates with each ink supply port H1201 of the ink storage container H1501. The first adhesive used for the bonding is desirably a low viscosity, low curing temperature, cured in a short time, has a relatively high hardness after curing, and has ink resistance. For example, a thermosetting adhesive mainly composed of an epoxy resin is used as the first adhesive, and the thickness of the adhesive layer at that time is preferably about 50 μm.

Further, a part of the back surface of the electric wiring tape H1301 is bonded and fixed to the plane around the ink supply port H1201 by the second adhesive. The electrical connection portion between the second recording element substrate H1101 and the electrical wiring tape H1301 is sealed with a first sealant H1307 and a second sealant H1308 (see FIG. 7), and the electrical connection portion is made of ink. Protected against corrosion and external impacts. The first sealing agent H1307 mainly seals the back surface side of the connection portion between the electrode terminal H1302 of the electric wiring tape H1300 and the bump H1105 of the recording element substrate and the outer peripheral portion of the recording element substrate, and the second sealing agent. The agent H1308 seals the front side of the connection portion described above. The unbonded portion of the electrical wiring tape H1301 is bent and fixed to the side surface of the ink storage container H1501 that is substantially perpendicular to the surface having the ink supply port H1201 by heat caulking or bonding.
(1-2-4) Lid Member The lid member H1901 closes an independent space inside the ink storage container H1501 by being welded to the upper opening of the ink supply container H1501. However, the lid member H1901 has narrow ports H1911, H1912, and H1913 for releasing pressure fluctuations in the respective chambers inside the ink storage container H1501, and fine grooves H1921, H1922, and H1923 that communicate with the narrow ports. The other ends of the fine grooves H1921 and H1922 join in the middle of the fine groove H1923. Further, most of the narrow holes H1911, H1912, and H1913, the fine grooves H1921, H1922, and the fine groove H1923 are covered with a seal member H1801, and the other end of the fine groove H1923 is opened to form an air communication port. Further, an engaging portion H1930 for fixing the second recording head to the ink jet recording apparatus is provided.
(First embodiment)
A method of welding the filter and the ink storage container in the best mode described above with reference to FIG. 8 in the embodiment of the present invention will be described. FIG. 8 is an explanatory diagram for explaining the process flow of filter welding in the first embodiment of the present invention.

  In the embodiment of the present invention, the above-described first recording head H1000 will be described as an example, but a similar manufacturing method can be used for the second recording head H1001.

  First, the structure of the heat welding jig 500 used for the filter welding of a present Example is demonstrated. The heat welding jig 500 of the present embodiment includes a heat welding jig suction port 501 for sucking and holding the filter H1700 to the heat welding jig 500, and a filter sucked by the heat welding jig suction port 501. It has a positioning mechanism including a holding surface 503 for holding H1700 and a rib 502 formed on the outer periphery of the holding surface 503 for positioning the filter H1700 held on the holding surface 503 without tilting. The heat welding jig suction port 501 is connected to a suction device (not shown), for example, a vacuum pump.

  The filter H1700 is preferably a metal non-woven fabric cut out to a predetermined size, and in this example, SUS was used in consideration of chemical resistance. In order to make the welding more reliable, the outer shape of the filter H1700 is preferably larger than the outer shape of the filter welding portion H2020.

  Further, a protruding welded portion 400 is formed at a portion where the filter H1700 is welded to the filter welded portion H2020 which is a support of the filter H1700 (FIG. 8A).

  Hereinafter, the process flow of filter welding according to the present embodiment will be described.

  First, it arrange | positions so that the welding part 400 of the filter welding part H2020 may become upwards in a gravitational direction (FIG. 8 (a)), and the heat welding jig 500 of the structure mentioned above is heated to predetermined temperature. In this embodiment, the temperature of the heat welding jig 500 at the time of welding is adjusted to be equal to or higher than the melting temperature of the welding member material and lower than the temperature at which voids are generated.

  Next, the filter H1700 is sucked and held by the heat welding jig suction port 501 on the holding surface 503 of the heat welding jig 500 heated to a predetermined temperature. That is, in this embodiment, the filter H1700 is disposed on the lower side in the gravity direction with respect to the heat welding jig 500. Further, the filter H1700 is sucked and held without being inclined with respect to the holding surface 503 by being guided by the rib 502.

  Next, the heat welding jig 500 holding the filter H1700 is lowered with respect to the filter welding portion H2020 of the ink storage container H1500 that is fixed so that the ink chamber H2010 is opened (FIG. 8B). Since the heat welding jig 500 is preheated, the heat of the heat welding jig 500 is transmitted to the filter H1700 while the heat welding jig 500 is lowered, and the filter H1700 reaches a predetermined temperature suitable for heat welding. It is heated. That is, the temperature of the filter H1700 is heated to a temperature equal to or higher than the melting temperature of the welding member material and equal to or lower than a temperature at which voids are generated.

  Subsequently, the filter H1700 is pressed into contact with the welded part 400 of the filter welded part H2020. At this time, the position of the heat welding jig 500 is adjusted so that the center of gravity of the filter welding portion H2020 and the center of gravity of the heat welding jig 500 are arranged in the same straight line.

  By directly pressing the heated filter H1700 to the welding part 400 while the heat welding jig 500 is moving, the welding part 400 starts to melt simultaneously with the pressure welding and solidifies while flowing into the SUS unwoven cloth. (FIG. 8 (c)). In order to prevent the molten resin from passing through the filter H1700 and coming into contact with the heat welding jig, it is preferable to use a SUS nonwoven fabric filter.

  According to the present embodiment, the tact time required for welding is reduced by approximately half compared to the conventional example in which the filter H1700 is disposed in the filter welding portion H2020 shown in FIG. And greatly contributed to productivity improvement.

  Table 1 shows a comparison of tact times in the filter welding process of the present invention and the conventional example.

従来例では、所定の大きさに切り出したフィルタＨ１７００をインク収納容器Ｈ２０００のフィルタ溶着部Ｈ２０２０に位置決めする際、インク室２０１０側からロボット等のフィンガーで配置していたため、本実施例で行った、熱溶着治具５００に配置するときよりも移動量が多く、時間を多く要していたが、本実施例によれば、フィルタＨ１７００を熱溶着治具５００に配置することで位置決めが簡略化されるので位置決めに要する時間が短縮され、また、高精度に位置決めを行うことが可能なロボット等も不要である。

In the conventional example, when the filter H1700 cut out to a predetermined size is positioned on the filter welding portion H2020 of the ink storage container H2000, the filter H1700 is arranged with fingers such as a robot from the ink chamber 2010 side. Although the movement amount is larger and the time is longer than when the heat welding jig 500 is arranged, according to the present embodiment, the positioning is simplified by arranging the filter H1700 on the heat welding jig 500. Therefore, the time required for positioning is shortened, and a robot capable of positioning with high accuracy is not required.

  In the case of the present invention, since the positioning mechanism for the filter H1700 is provided on the heat welding jig 500 side, it is not necessary to provide the positioning part H2030 in the filter welding part H2020 of the ink storage container H2000. No harmful effects of molding occurred. Naturally, the precision molding technique for forming the positioning wall with a mold is also unnecessary.

  In the conventional example, the time for welding the filter H1700 to the filter welding portion H2020 is also long. This is because, in the case of the conventional example, the temperature starts to rise after the heat welding jig 50 moves and then contacts the filter H1700. On the other hand, in this embodiment, the temperature of the filter H1700 is raised to a predetermined temperature while the heat welding jig 500 is moving. That is, in the case of this example, since the heat fusion is started immediately after the filter H1700 is in contact with the filter welding portion H2020, the time required for welding can be relatively shortened. In the case of an ink jet recording head that requires a large number of productions, halving the tact time not only contributes to an improvement in productivity but also contributes to an inexpensive product supply.

As described above, according to this embodiment, it is possible to simplify the manufacturing process when the filter is welded to the ink storage container. And with this manufacturing method, a highly accurate inkjet recording head can be manufactured at low cost.
(Second embodiment)
Next, the present embodiment will be described below with reference to FIG. 9 which is an explanatory diagram of the process flow of the present embodiment.

  In the first embodiment, the filter H1700 is arranged on the lower side in the gravity direction with respect to the heat welding jig 500, and the filter H1700 is sucked and held on the heat welding jig 500 by the heat welding jig suction port 501. It was lowered and welded to the filter weld H2020. In addition, ribs 502 are provided on the outer periphery of the holding surface 503 of the heat welding jig 500 so that the filter H1700 does not tilt on the jig.

  On the other hand, in the present embodiment, the filter H1700 is disposed on the upper side in the gravity direction with respect to the heat welding jig 510. That is, in the heat deposition method of the present embodiment, the filter H1700 is placed on the holding surface 513 of the heat welding jig 510, and this is raised with respect to the filter welding portion H2020 disposed above the heat welding jig 510. It is a method to make it. According to this method, the heat welding jig suction port 501 provided in the heat welding jig 500 of the first embodiment can be omitted, and the structure of the heat welding jig 510 can be simplified. Further, in the case of the heat welding jig 500 of the first embodiment, the temperature control of the heat welding jig 500 in consideration of the endothermic phenomenon at the time of adsorption is necessary, but in the case of this embodiment, this is not necessary.

  Hereinafter, the process flow of filter welding according to the present embodiment will be described.

  First, it arrange | positions so that the welding part 400 of the filter welding part H2020 may become a gravity direction downward (FIG. 9 (a)), and it makes the heat welding jig | tool 510 into more than the melting temperature of a welding member quality, and a void generate | occur | produces. Adjust below the temperature.

  Next, the filter H1700 is placed on the holding surface 513 of the heat welding jig 510 heated to a predetermined temperature. The filter H1700 is held by the rib 512 without being inclined with respect to the holding surface 513.

  Next, it raises with respect to the filter welding part H2020 arrange | positioned above the heat welding jig | tool 510 (FIG.9 (b)). Also in this embodiment, since the heat welding jig 510 is preheated, the heat of the heat welding jig 510 is transmitted to the filter H1700 while the heat welding jig 510 is lowered, and the filter H1700 is subjected to heat welding. Heated to a suitable predetermined temperature. That is, the temperature of the filter H1700 is heated to a temperature equal to or higher than the melting temperature of the welding member material and equal to or lower than a temperature at which voids are generated.

  Subsequently, while adjusting the position of the heat welding jig 510 so that the center of gravity of the filter welding part H2020 and the center of gravity of the heat welding jig 510 are arranged in the same straight line, the filter H1700 is attached to the welding part 400 of the filter welding part H2020. Press contact.

  Also in the present embodiment, when the heated filter H1700 is directly pressed against the welded part 400 while the heat welding jig 510 is moving, the welded part 400 starts to melt simultaneously with the pressure welding, and the SUS unclothed cloth. It solidifies while flowing into the inside (FIG. 9C).

  As in the first embodiment, since this embodiment also simplifies positioning, the time required for positioning is shortened and welding is started at the same time as pressure welding. Therefore, this embodiment requires a welding process as compared with the conventional example. The tact time can be halved, greatly contributing to productivity. Furthermore, in the case of the present embodiment, the mechanism for sucking and holding the filter H1700, the temperature control mechanism associated therewith, and the like can be omitted, so that the apparatus cost can be greatly reduced.

  As described above, this embodiment can also simplify the manufacturing process when the filter is welded to the ink storage container, as in the first embodiment. And with this manufacturing method, a highly accurate inkjet recording head can be manufactured at low cost.

In each embodiment, in order to improve the positional accuracy, the filter welding portion H2020 and the filter H1700 held by the heat welding jigs 500 and 510 are pressed in the direction of gravity so as not to be affected by gravity. However, the present invention is not limited to this. In particular, in the case of a jig having a device for holding the filter H1700, such as the heat welding jig suction port 501 shown in the first embodiment, welding is performed by pressing in a direction crossing the direction of gravity. May be.
(Inkjet recording device)
Next, FIG. 10 shows a perspective view of an example of an ink jet recording apparatus on which the ink jet recording head manufactured by the manufacturing method of the present invention described above can be mounted.

  A guide shaft 1003 is attached to the main body chassis 1012, and the carriage 1008 is supported by the guide shaft 1003 so as to be slidable in the arrow B direction. In the carriage 1008, a part of the carriage 1008 is fixed to a timing belt 1010 stretched between a driving pulley 1006 coupled to a carriage motor 1020 and an idler pulley 1007, and the carriage 1008 responds to the rotation of the carriage motor 1020. It can reciprocate in the direction of arrow B along the guide shaft 1003.

  The recording head cartridge 1017 is detachably mounted on the carriage 1008 and is attached to the back surface of the main body chassis 1012 via a flexible cable 1002 that transmits and receives current and signals for driving the recording head cartridge 1017. It is electrically connected to a control board which is a board for controlling the main body.

  The ink jet recording head 1016 of the recording head cartridge 1017 has a discharge port formed downward in the figure.

  On the paper feed tray 1021, a plurality of recording media P are stacked and stored. A conveyance roller (not shown) is connected to a recording medium conveyance motor (not shown) via a conveyance gear, and conveys the recording medium P in the sub-scanning direction indicated by an arrow A.

  Recording is performed by ejecting the ink supplied from the ink tank 1005 to the recording medium conveyed to the recording area from the ejection port of the inkjet recording head 1016.

1 is an external perspective view of a first recording head to which the present invention is applicable. FIG. 2 is an exploded perspective view of the first recording head illustrated in FIG. 1. FIG. 3 is a perspective view in which the first recording element substrate is partially broken. FIG. 6 is an external perspective view of a second recording head to which the present invention is applicable. FIG. 5 is an exploded perspective view of the second recording head illustrated in FIG. 4. FIG. 6 is a perspective view in which a second recording element substrate is partially broken. FIG. 3 is a partial cross-sectional view of the recording head of the present invention. It is a figure explaining each process of the 1st Example of this invention. It is a figure explaining each process of the 2nd Example of this invention. 1 is a perspective view of an example of an ink jet recording apparatus on which an ink jet recording head of the present invention can be mounted. It is a figure which shows an example of the conventional filter welding process.

Explanation of symbols

H1000 First recording head H1700, H1701, H1702, H1703 Filter H2020 Filter welding portion H2030 Positioning portion 500 Thermal welding jig 501 Thermal welding jig suction port

Claims (9)

In the method of manufacturing an ink jet recording head including a welding step of welding a filter that removes foreign matter to a support that supports the filter,
In the welding step, a heat welding jig that heats the filter held on a holding surface and presses the filter against the support to weld the filter to the support, and holds the filter A method of manufacturing an ink jet recording head, characterized by heating in advance before holding the surface. The method for manufacturing an ink jet recording head according to claim 1, comprising a step of preparing the filter having a mesh structure. The manufacturing method of the inkjet recording head of Claim 1 including the process of preparing the said filter consisting of a metal nonwoven fabric. 4. The method of manufacturing an ink jet recording head according to claim 1, wherein the support and the filter held by the heat welding jig are pressed in the direction of gravity. 5. The method of manufacturing an ink jet recording head according to claim 4, wherein the filter is held below the heat welding jig in the direction of gravity. The ink jet recording head according to claim 5, wherein the heat welding jig includes an adsorption unit that adsorbs and holds the filter on the holding surface, and the adsorbing unit adsorbs and holds the filter on the holding surface. Manufacturing method. The method for manufacturing an ink jet recording head according to claim 4, wherein the filter is held above the heat welding jig in the direction of gravity. 8. The method of manufacturing an ink jet recording head according to claim 1, comprising a step of integrally forming the ink jet recording head with an ink tank that stores ink therein. 9. Conveying means for conveying a recording medium;
9. An ink jet recording head manufactured by the method of manufacturing an ink jet recording head according to claim 1, and holding to reciprocate in a direction intersecting a transport direction of the recording medium. And an ink jet recording apparatus.

Images