JP2006128180A - Method of manufacturing transparent sheet for electromagnetic wave shield - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a method of manufacturing a transparent sheet for an electromagnetic wave shield at a low cost in relation with the transparent sheet for the electromagnetic wave shield which intercepts a harmful electromagnetic wave generated from the display of a CRT, a liquid crystal, plasma, etc. <P>SOLUTION: As shown in Fig., high and low constitutions are provided on the front surface of the transparent sheet 1, and a metal layer 3 is laminated on the front surface of the transparent sheet 1. Next, the high part of the metal layer 3 is deleted, and thereby, a lattice-like conductive pattern is formed in a low part. <P>COPYRIGHT: (C)2006,JPO&NCIPI

Description

  The present invention relates to a method for producing a transparent sheet for electromagnetic wave shielding that effectively blocks harmful electromagnetic waves generated from a display such as a CRT, liquid crystal, or plasma. In particular, the present invention relates to a method for producing a transparent sheet for electromagnetic wave shielding having a conductive pattern.

Conventionally, a transparent sheet for electromagnetic wave shielding that blocks harmful electromagnetic waves generated from a display such as CRT, liquid crystal, plasma, etc. has a lattice-like shape on the surface of a transparent substrate in order to achieve both translucency and electromagnetic wave blocking effect. Metal was provided (for example, Patent Document 1).
JP-A-3-35284

  However, in order to provide a grid-like metal on the surface of the transparent substrate, a metal layer is formed on the entire surface of the transparent substrate by foil, plating or vapor deposition, and then a resist film is attached, exposed, developed, chemically etched, and the resist film is peeled off. Since the thin wire processing is performed using the photolithography method, the cost is extremely high.

In order to solve the above-mentioned problems, the present invention provides a transparent sheet in which a height is provided on the surface and a metal layer is laminated on the surface, and by removing a high portion of the metal layer, The present invention provides a method for producing a transparent sheet for electromagnetic wave shielding in which a conductive pattern is formed in the lower part of the metal layer.
More specifically, in the method for producing a transparent sheet for electromagnetic wave shielding having a conductive pattern, a first step of providing a deformable laminate on a transparent substrate, and a second step of providing a metal layer on the laminate. A step, a third step of pressing the laminate from the metal layer side with a pressing jig provided with a convex portion corresponding to the conductive pattern, and providing a height on the metal layer, and a high portion of the metal layer. The manufacturing method of the transparent sheet for electromagnetic wave shields which has the 4th process to delete is provided.
Moreover, in the method for producing a transparent sheet for electromagnetic wave shielding having a conductive pattern, a first step of providing a laminate on a transparent substrate, and a second step of providing a slit or a recess substantially corresponding to the conductive pattern on the laminate. And a third step of providing a metal layer on the transparent substrate from the laminate side, and a fourth step of removing a high portion of the metal layer, and a method for producing a transparent sheet for electromagnetic wave shielding. is there.
Moreover, in the method for producing a transparent sheet for electromagnetic wave shielding having a conductive pattern, a first step of providing a printed laminate on a transparent substrate on a portion other than the conductive pattern, and on the transparent substrate from the laminate side. The present invention provides a method for producing a transparent sheet for electromagnetic wave shielding, which includes a second step of providing a metal layer and a third step of removing a high portion of the metal layer.

As described above, according to the present invention, a transparent sheet for electromagnetic wave shielding having excellent translucency and excellent electromagnetic wave shielding effect can be produced by a simple method and at low cost.

Hereinafter, the present invention will be described in detail.
The transparent substrate referred to in the present invention mainly includes polyesters such as polyethylene terephthalate and polyethylene naphthalate, polyolefins such as polyethylene, polypropylene, polystyrene and EVA, vinyl resins such as polyvinyl chloride and polyvinylidene chloride, polysulfone, A film made of plastic such as polyethersulfone, polycarbonate, polyamide, polyimide, acrylic resin, etc., having a total visible light transmittance of 70% or more. These may be colored to such an extent that they do not interfere with the object of the present invention, and can be used as a single layer, but may be used as a multilayer film in which two or more layers are combined. Of these, a polyethylene terephthalate film is most suitable in terms of transparency, heat resistance, ease of handling, and cost.
The thickness of the transparent plastic substrate is preferably 5 to 300 μm because the handleability is poor when it is thin, and the transmittance of visible light decreases when it is thick. More preferably, it is 10-200 micrometers, More preferably, it is 25-100 micrometers. Also, a glass plate or a ceramic plate that is equally transparent may be used.

The metal layer of the present invention is mainly one or two of metals such as copper, aluminum, nickel, cobalt, iron, gold, silver, stainless steel, tungsten, chromium, titanium, tantalum, silicon, zinc, and tin. It refers to an alloy or layered body combining more than one species. Further, additives such as phosphorus and boron, and organic substances may be mixed to such an extent that conductivity is not affected. Copper, aluminum, or nickel is suitable from the viewpoint of conductivity, ease of circuit processing, and cost, and a metal having a thickness of 0.1 μm to 10 μm is preferable. More preferably, it is 0.5 μm to 5 μm. If the thickness is 10 μm or more, it is difficult to form the line width or the viewing angle becomes narrow. If the thickness is 0.1 μm or less, the surface resistance increases and the shielding effect is poor. It is preferable that the metal layer is copper and at least the surface thereof is blackened because the contrast becomes high. In addition, the metal layer can be prevented from being oxidized and faded over time. In addition, it is preferable that the metal layer is a paramagnetic metal because of excellent magnetic field shielding properties.
This can be achieved by combining one or more methods among thin film forming techniques such as vacuum deposition, sputtering, ion plate, chemical vapor deposition, and electroless / electroplating. In particular, a vacuum vapor deposition method with less wraparound during film formation is preferable. Further, the metal layer may be a thin foil, and in that case, the metal layer is laminated directly or with an adhesive or the like on the transparent sheet.

The conductive pattern in the present invention is not particularly limited, but is a triangle such as a regular triangle, an isosceles triangle, a right triangle, a square such as a square, a rectangle, a rhombus, a parallelogram, a trapezoid, a (positive) hexagon, ) Also includes patterns that combine (positive) n-gons such as octagons, (positive) dodecagons, (positive) icosahedrons, circles, ellipses, stars, etc. These units can be repeated alone or in two types It can also be used in the above combinations.
Such a grid-like conductive pattern line width is preferably in a range of 40 μm or less and a line interval of 200 μm or more. Further, the line width is more preferably 25 μm or less from the viewpoint of invisibility, and the line interval is more preferably 300 μm or more from the viewpoint of visible light transmittance. The larger the line interval, the better the visible light transmittance. However, if this value becomes too large, the EMI shielding property is deteriorated, so that it is preferably 1 mm or less.
The stripe-shaped conductive pattern is not preferable because of the problem of disconnection, but may be adopted if the quality is improved.

Hereinafter, embodiments of the present invention will be described with reference to the drawings.
FIG. 1 shows a method for removing a high portion of a metal layer having a height on the surface of a transparent sheet.
2 is a laminate, and is preferably provided on the surface of the transparent substrate 1 so that the post-process can be easily performed. The material of the laminated body 2 is a transparent plastic similar to the transparent substrate 1, and is a simple substance, a copolymer, etc., including a modified resin, particularly including a low cross-linkage, a low polymer, and easily deformed by mechanical pressure. And those which undergo crosslinking or polymerization by heat or light after deformation. Further, it may be conductive.
In the case of only the transparent substrate 1, the concave substrate is processed on the surface of the transparent substrate, or the transparent substrate 1 is formed by pouring resin into a container having a convex portion corresponding to the conductive pattern on the bottom and curing it. The metal layer 3 is provided after providing a recess in the transparent substrate 1 itself.
In the case where the laminate 2 is provided, the metal layer 3 is provided on the surface of the laminate 2 after slitting or recessing the laminate 2, or the metal layer 3 is provided on the surface of the laminate 2. After that, the recess is processed. You may provide a recessed part at the time of lamination | stacking of laminated body 2 itself by the printing by a mask plate or transcription | transfer.
For the recess processing, cutting with a cutter, router, laser, or the like, press processing with a pressing jig provided with a convex portion corresponding to the conductive pattern, or the like is used. A laser etching process etc. are used for a slit process.
A base on which the metal layer 3 is provided may be vapor-deposited such that the metal layer 3 is easily peeled off, for example, a fluorine-based resin or a silicone-based resin.
4 is a pressure-sensitive adhesive sheet in which a pressure-sensitive adhesive 6 is applied to a base film 5 made of polyester, polyolefin, or polyvinyl chloride resin, and the pressure-sensitive adhesive sheet and the transparent sheet are sandwiched between upper and lower sandwiching rolls 7. FIG. 1 shows one method for removing the high portion of the metal layer 3.
Alternatively, the adhesive film may be attached to the metal layer surface, the adhesive film may be cured and deposited, and then the adhesive film may be peeled off to remove the high portion of the metal layer.

FIG. 2 shows a manufacturing process diagram according to claim 2 of the present invention.
First, the laminate 2 is provided on the surface of the transparent substrate 1, and then the metal layer 3 is provided on the entire surface of the laminate 2 (step (2a)). The laminate 2 in this case is a particularly deformable resin, including a low-crosslinking, low-polymer, and easily deformable by mechanical pressure, and those that undergo crosslinking and polymerization by heat and light after deformation. The metal layer 3 is preferably thinner than the laminate 2.
8 is a pressing plate or a rotating body pressing jig provided with a convex portion 9 corresponding to the conductive pattern, and the convex portion can be pressed from the surface of the metal layer 3 to deform the portion of the metal layer 3 corresponding to the conductive pattern. Is pushed into the laminated body 2 to provide a step in the metal layer 3 (step (2b)-(2c)-(2d)). The height of the convex portion 9 of the pressing jig 8 is preferably higher than the thickness of the metal layer 3.
Next, the upper layer part of the metal layer 3 that has become a step is peeled off from the laminate 2 with the peeling tool 10 or the like (step (2e)).
As an additional step, the surface is coated with a transparent planarizing resin 11 (step (2f)).

FIG. 3 shows a manufacturing process diagram according to claim 3 of the present invention.
The laminated body 2 is provided on the surface of the transparent substrate 1 ((3a) step), and the concave portion is provided in the laminated body 2 with the pressing jig 8 provided with the convex portion 9 corresponding to the conductive pattern ((3b)-(3c) step. ), Providing the metal layer 3 (step (3d)), peeling off the upper layer of the metal layer 3 from the laminate 2 (step (3e)), and coating the surface with the transparent planarizing resin 11 (step (3f)) ) Do things sequentially.
The difference from the step of FIG. 2 is that the metal layer 3 is provided after the concave portion is provided in the deformable laminate 2 with the pressing jig 8.

FIG. 4 shows another process diagram for manufacturing according to claim 3 of the present invention.
A laminate 2 is provided on the surface of the transparent substrate 1 (step (4a)), and a concave portion is provided in the laminate 2 by etching with plasma or laser while being protected by the photomask 12 (steps (4b)-(4c)). The metal layer 3 is provided (step (4d)), the upper layer of the metal layer 3 is peeled off from the laminate 2 (step (4e)), and the surface is coated with a transparent planarizing resin 11 (step (4f)). Do things sequentially. At the time of etching, the laminated body 2 is selected from a material or a material state that is easy to etch from the transparent substrate 1, for example, the degree of curing is not advanced.
On the other hand, a slit that is an uncured portion is provided while a photomask is provided in the slit processed portion, the laminate 2 other than the slit processed portion is cured by infrared laser or ultraviolet exposure, and the difference in melting temperature is used to heat the laminate. The processed part can also be absorbed and removed with a nonwoven fabric or the like. In addition, it can be removed by utilizing differences in adhesive strength, adhesive strength, dissolving power, and the like.
The difference from the process of FIG. 3 is that the metal layer 3 is provided after a mask is provided on the laminate 2 and slit processing or recess processing is performed, not mechanical. In the case of a laser, a mask may not be necessary if the line width is processed.

FIG. 5 shows a manufacturing process diagram according to claim 4 of the present invention.
On the transparent substrate 1, a laminate 2 with a recess is provided by plate printing with a squeegee 14 using a plate mask 13 corresponding to a conductive pattern (step (5a)-(5b)), and a metal layer 3 is provided ((5c Step), the upper layer of the metal layer 3 is peeled off from the laminate 2 (step (5d)), and the surface is coated with the transparent planarizing resin 11 (step (5e)).
The difference from the process of FIG. 4 is that the metal mask 3 is provided on the transparent substrate 1 with the plate mask 10 corresponding to the conductive pattern, and the laminated body 2 with the recesses is provided by plate printing with the squeegee 11. is there.

FIG. 6 shows an example of another apparatus for providing a laminate 2 with a recess by printing according to the fourth aspect of the present invention.
The difference from the process of FIG. 5 is that while the film-like transparent substrate 1 is being transported, the resin is transferred to the plate roll 15 whose convex portions corresponding to the conductive pattern are processed on the surface by the resin supply roll 16 and then transparent. Transferring to the substrate 1 and providing the metal layer 3 after providing the laminated body 2 with the recesses. If the viscosity of the resin that becomes the laminate 2 is increased by drying or curing to some extent immediately before being transferred to the transparent substrate 1, the concave wall surface of the laminate 2 is likely to be formed sharply.

Fig. 4 illustrates one method of removing the high portion of the metal layer. The manufacturing process figure which concerns on Claim 2 of this invention is shown. The manufacturing process figure which concerns on Claim 3 of this invention is shown. The another process figure of manufacture which concerns on Claim 3 of this invention is shown. The manufacturing process figure which concerns on Claim 4 of this invention is shown. An example of the apparatus of another manufacture concerning Claim 4 of the present invention is shown.

Explanation of symbols

  DESCRIPTION OF SYMBOLS 1 ... Transparent substrate, 2 ... Laminate body, 3 ... Metal layer, 4 ... Adhesive sheet, 5 ... Base film, 6 ... Adhesive, 7 ... Interposing roll, 8 ... Pressing jig, 9 ... Convex part, 10 ... Stripping tool 11 ... Planarizing resin, 12 ... Photomask, 13 ... Plate mask, 14 ... Squeegee, 15 ... Plate roll, 16 ... Resin supply roll, 17 ... Pressure roll.

Claims (4)

A transparent sheet is provided with a height on the surface and a metal layer is laminated on the surface. By removing the high portion of the metal layer, a conductive pattern is formed on the low portion of the metal layer. A method for producing a transparent sheet for electromagnetic wave shielding.
In the method for producing a transparent sheet for electromagnetic wave shielding having a conductive pattern,
A first step of providing a deformable laminate on a transparent substrate;
A second step of providing a metal layer on the laminate;
A third step of pressing the laminate from the metal layer side with a pressing jig provided with a convex portion corresponding to the conductive pattern, and providing the metal layer with a height; and
A fourth step of removing the high portion of the metal layer;
The manufacturing method of the transparent sheet for electromagnetic wave shields which has this.
In the method for producing a transparent sheet for electromagnetic wave shielding having a conductive pattern,
A first step of providing a laminate on a transparent substrate;
A second step of providing a slit or a recess substantially corresponding to the conductive pattern in the laminate;
A third step of providing a metal layer on the transparent substrate from the laminate side;
A fourth step of removing the high portion of the metal layer;
The manufacturing method of the transparent sheet for electromagnetic wave shields which has this.
In the method for producing a transparent sheet for electromagnetic wave shielding having a conductive pattern,
A first step of providing a printed laminate on a portion of the transparent substrate other than the conductive pattern,
A second step of providing a metal layer on the transparent substrate from the laminate side;
A third step of removing the high portion of the metal layer;
The manufacturing method of the transparent sheet for electromagnetic wave shields which has this.

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