JP2006126087A - Magnetoresistive element - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a magnetoresistive element capable of preventing surely peeling of a flexible substrate from an element substrate, and measuring accurately detection of a moving origin position of a movable detection object by a Z-phase magnetoresistive pattern. <P>SOLUTION: In this magnetoresistive element 10, since element substrate side dummy terminals 113c, 123c are formed on the element substrates 11, 12 and flexible substrate side dummy terminals 166c, 176c are formed on the flexible substrates 16, 17, a domain wherein the element substrates 11, 12 are not connected to the flexible substrates 16, 17 is small. Hereby, peeling of the flexible substrates 16, 17 from the element substrates 11, 12 can be prevented surely. Since heating patterns 113a-113f are added to the Z-phase magnetoresistive patterns 123a-123d for detecting the moving origin position, temperature dispersion among the Z-phase magnetoresistive patterns 123a-123d can be suppressed small, to thereby detect the moving origin position accurately. <P>COPYRIGHT: (C)2006,JPO&NCIPI

Description

  The present invention relates to a magnetoresistive element for detecting a moving amount, a position, a moving speed, and the like of a movable detection object.

As a magnetic sensor device for detecting the amount of displacement of a movable object to be detected, for example, a multipolar magnetic layer (magnetic scale) magnetized at a constant pitch is formed on the movable object to be detected. Some magnetoresistive elements are arranged so as to face the magnetized layer. The magnetoresistive element used here is composed of an element substrate on which a magnetoresistive pattern for detecting movement of a movable object to be detected is formed, and a flexible substrate in which the element substrate and terminals are connected to each other. (For example, refer to Patent Document 1).
Japanese Patent No. 2529960

  In a structure in which a flexible substrate is connected to an element substrate, conventionally, the end portion of the flexible substrate is not connected to the end portion of the flexible substrate by crimping or the like. There is a problem that peeling from the element substrate is likely to occur.

  In addition, when a plurality of magnetoresistive patterns are arranged on a single substrate, the interval between each magnetoresistive thin film becomes very narrow, making it difficult to arrange at a desired position. Forms an A-phase magnetoresistive pattern on one of the two element substrates, and forms a B-phase magnetoresistive pattern on the other element substrate, and then arranges these two element substrates to face each other. Is proposed to compose. With this configuration, since the A-phase magnetoresistive pattern and the B-phase magnetoresistive pattern are formed on different substrates, there is no need to extremely narrow the interval between the magnetoresistive thin films formed on one substrate. There is an advantage that the layout flexibility of the magnetoresistive thin film is high.

  However, when configured in this way, the number of terminals formed on one element substrate is reduced, so there is a wide area where the terminals are not connected to each other on the flexible substrate and the element substrate. There is a problem that the flexible substrate is easily peeled off from the element substrate.

  Furthermore, if a Z-phase magnetoresistive pattern for detecting the movement origin position of the movable object to be detected is formed on the magnetoresistive element, the rotational speed of the movable object can be easily measured. In the pattern, there is a problem that a measurement error is likely to occur due to the temperature distribution.

  In view of the above problems, an object of the present invention is to provide a magnetoresistive element that can reliably prevent peeling of a flexible substrate from an element substrate.

  Another object of the present invention is to provide a magnetoresistive element capable of accurately measuring the detection of the movement origin position of a movable object to be detected by a Z-phase magnetoresistive pattern.

  In order to solve the above problems, in the present invention, an element substrate on which a magnetoresistive pattern for detecting the movement of a movable object to be detected is formed, and flexibility in which the element substrate and terminals are connected to each other In the magnetoresistive element having a substrate, the element substrate has an element substrate side actual use terminal used for voltage application or signal output, and an element substrate side dummy terminal not used for voltage application or signal output. Formed on the flexible substrate, the flexible substrate side actual use terminal connected to the element substrate side actual use terminal, and the flexible substrate side dummy terminal connected to the element substrate side dummy terminal; Is formed.

  In the present invention, an element substrate side dummy terminal is formed on the element substrate, and a flexible substrate side dummy terminal connected to the element substrate side dummy terminal is formed on the flexible substrate. The area where the element substrate and the flexible substrate are not connected is narrow. Therefore, peeling of the flexible substrate from the element substrate can be reliably prevented.

  In the present invention, in the element substrate, it is preferable that an element substrate side actual use terminal connected to the magnetoresistive pattern and the element substrate side dummy terminal are arranged at a substantially pitch interval.

  In the present invention, in the flexible substrate, it is preferable that the flexible substrate side actual use terminals and the flexible substrate side dummy terminals are arranged over substantially the entire width direction of the substrate.

  In the present invention, as the element substrate, a first element substrate and a second element substrate which are arranged to face each other so as to expose a terminal formation region are used, and as the flexible substrate, the first element substrate is used. The first flexible substrate connected to the element substrate and the second flexible substrate connected to the second element substrate are used, and the magnetoresistive element is used for the first element substrate. As a pattern, an A-phase magnetoresistive pattern for detecting the movement of the movable detection object, and a B-phase magnetoresistance for detecting the movement of the movable detection object with a phase difference of 90 ° from the A-phase magnetoresistance pattern A magnetoresistive pattern on one side of the pattern is formed, and a magnetoresistive pattern on the other side of the A-phase magnetoresistive pattern and the B-phase magnetoresistive pattern is formed on the second element substrate. I prefer There. With this configuration, the A-phase magnetoresistive pattern and the B-phase magnetoresistive pattern are formed on different substrates (first element substrate and second element substrate), and these two substrates are arranged to face each other. Even if multiple magnetoresistive thin films are used from the viewpoint of canceling harmonic components and improving detection accuracy to form a magnetoresistive pattern, the magnetoresistive formed on a single substrate There is no need to extremely narrow the distance between the body thin films. Therefore, even when a plurality of magnetoresistive thin films are used, the manufacturing process does not require extremely high accuracy, and the magnetoresistive thin film has a high degree of freedom in layout.

  In this case, both the element substrate side actual use terminal and the element substrate side dummy terminal are formed on at least one of the first element substrate and the second element substrate, and the first possible substrate is formed. It is preferable that both the flexible substrate side actual use terminal and the flexible substrate side dummy terminal are formed on the flexible substrate and / or the second flexible substrate. When two element substrates are used, the number of terminals formed on one element substrate is reduced correspondingly. However, when dummy terminals are added as in the present invention, terminals are formed on the flexible substrate and the element substrate. Since the region where the connections are not made is narrow, the flexible substrate is not peeled off from the element substrate.

  In the present invention, a Z-phase magnetoresistive pattern for detecting a movement origin position of the movable object to be detected is formed on the second element substrate, and the first element substrate has the first element It is preferable that a heat generation pattern is formed so as to sandwich the Z-phase magnetoresistive pattern on both sides when the substrate and the second element substrate are opposed to each other. If comprised in this way, since the temperature variation between several Z-phase magnetoresistive patterns can be suppressed small, the movement origin position of a movable to-be-detected body can be detected accurately.

  In the present invention, it is preferable that the first element substrate is, for example, a ceramic glaze substrate, a zirconia substrate, a silicon substrate, or a glass substrate, and the second element substrate is a glass substrate. If comprised in this way, a 1st element substrate and a 2nd element substrate can be bonded together with a photocuring adhesive agent. That is, if the second element substrate is a transparent substrate, the second element substrate is transparent with the first element substrate and the second element substrate facing each other with a photo-curing adhesive such as a UV-curing adhesive interposed therebetween. The adhesive can be cured by irradiating UV light or the like from the element substrate side. Further, if a ceramic glaze substrate, a zirconia substrate, or a silicon substrate is used as the first element substrate, the strength can be improved as compared with the case where both element substrates are glass substrates. Moreover, since the surface state of the glass substrate is more stable than the ceramic glaze substrate, zirconia substrate, and silicon substrate, when the Z-phase magnetoresistive pattern is formed on the glass substrate side, the Z-phase magnetoresistive pattern is There is an advantage that the measurement accuracy is high as compared with the case where it is formed on the ceramic glaze substrate, zirconia substrate, or silicon substrate side. In addition, the ceramic glaze substrate, zirconia substrate, and silicon substrate have higher heat resistance than the glass substrate. Therefore, if the heating pattern is formed on the ceramic glaze substrate, zirconia substrate, or silicon substrate, the substrate is not warped by heat. There is an advantage.

  In the present invention, an element substrate side dummy terminal is formed on the element substrate, and a flexible substrate side dummy terminal connected to the element substrate side dummy terminal is formed on the flexible substrate. A region where the element substrate and the flexible substrate are not connected by pressure bonding or the like is narrow. Therefore, peeling of the flexible substrate from the element substrate can be reliably prevented.

  In addition, when a heat generation pattern is added to the Z-phase magnetoresistive pattern for detecting the movement origin position of the movable object to be detected, temperature variations among a plurality of Z-phase magnetoresistive patterns can be suppressed to a small level. Therefore, the movement origin position of the movable detection object can be detected with high accuracy.

  The best mode for carrying out the present invention will be described with reference to the drawings.

(Overall configuration of magnetic sensor device)
1 (a), 1 (b), and 1 (c) are explanatory views showing the positional relationship between a head equipped with a magnetoresistive element to which the present invention is applied and a magnetic scale, and the magnetoresistive element to which the present invention is applied is used. FIG. 2 is an explanatory diagram of a magnetic linear encoder and a rotary encoder using a magnetoresistive element to which the present invention is applied.

  In FIG. 1A, a magnetoresistive element 10 to which the present invention is applied includes a magnetic sensor device for measuring a table moving distance of a machine tool or a mounting device, a rotational position detection by a robot, a rotational speed of a motor device, or the like. In FIG. 1, the magnetic sensing surface 50 of the head 5 is configured and mounted in the sensor holder 6 of the head 5. The magnetosensitive surface 50 of the head 5 is disposed opposite to the magnetic scale 3, and the magnetic scale 3 is mounted on the movable object 2 side. As will be described in detail later, the magnetoresistive element 10 has an A-phase magnetoresistive pattern for detecting the movement of the movable object to be detected 2 and a phase difference of 90 ° from this phase magnetoresistive pattern. A B-phase magnetoresistive pattern for detecting movement and a Z-phase magnetoresistive pattern for detecting the movement origin position of the movable object 2 are provided.

  In this embodiment, the magnetoresistive element 10 includes a first element substrate 11 on which an A-phase magnetoresistive pattern is formed, and a second element substrate 12 on which a B-phase magnetoresistive pattern is formed. The element substrates 11 and 12 are bonded so that the surfaces on which the magnetoresistive pattern is formed face each other.

  Each of the first element substrate 11 and the second element substrate 12 partially protrudes from the edge of the other substrate, and an extension region 115 (terminal formation region) of the first element substrate 11 formed thereby. The first flexible substrate 16 and the second flexible substrate 17 are connected to the overhang region 125 (terminal formation region) of the second element substrate 12 by a method such as pressure bonding. Moreover, the connection location of the flexible substrates 16 and 17 is covered with a resin (not shown).

  The head 5 configured as described above includes, for example, a magnetic scale 3 linearly extending on the moving table (movable detected body 2) side in the magnetic sensor device 1 (magnetic linear encoder) shown in FIG. The position of the moving table is detected. The head 5 is disposed so as to face the magnetic scale 3 disposed on the outer peripheral surface of the rotating drum (movable detected body 2) in the magnetic sensor device 1 (magnetic rotary encoder) shown in FIG. The rotational position and rotational speed of the rotating drum are detected. In either case, the magnetic scale 3 has N poles and S poles alternately arranged at a predetermined pitch.

(Manufacturing method and schematic configuration of magnetoresistive element 10)
With reference to FIG. 2 and FIG. 3, the schematic configuration of the magnetoresistive element 10 and its characteristics will be described in detail while explaining the method of manufacturing the magnetoresistive element 10 of the present embodiment. 2A to 2D are explanatory views showing a method for manufacturing the magnetoresistive element 10 of the present invention. FIG. 3 is a graph showing the time-series sensor output of the magnetoresistive element 10 to which the present invention is applied.

  In this embodiment, first, as shown in FIGS. 2A and 2B, a first substrate 111 for constituting the lower first element substrate 11 and an upper second element substrate 12 are provided. A second substrate 121 is prepared for configuration.

  In this embodiment, a ceramic glaze substrate, a zirconia substrate, a silicon substrate, or a glass substrate is prepared as the first substrate 111, and a glass substrate (transparent substrate) is prepared as the second substrate 121. The ceramic glaze substrate is obtained by forming a glass layer on the surface of a ceramic substrate such as an alumina substrate made of oxide or nitride. In the present embodiment, since the first element substrate 11 is disposed on the magnetic scale 3 side among the first element substrate 11 and the second element substrate 12, the first substrate 111 is the second substrate. Those thinner than 121 are used. For example, the first substrate 111 has a thickness of 0.3 mm, and the second substrate 121 has a thickness of 0.7 mm.

  Next, as shown in FIG. 2A, after a magnetic film made of ferromagnetic NiFe or the like is formed on the surface of the first substrate 111 by sputtering or the like, the magnetic film is formed by using a photolithography technique. Then, the A-phase magnetoresistive pattern 112 and a heat generation pattern (not shown) to be described later are formed simultaneously. At that time, an alignment mark (not shown) and a terminal (not shown) described later are simultaneously formed on the first substrate 111 by a magnetic film. Next, if a protective layer is formed on the surface side of the A-phase magnetoresistive pattern 112, the first element substrate 11 is completed.

  Similarly, as shown in FIG. 2B, after a magnetic film made of ferromagnetic NiFe or the like is formed on the surface of the second substrate 121 by sputtering or the like, the magnetic film is used by using a photolithography technique. Then, the B phase magnetoresistive pattern 122 and a Z phase magnetoresistive pattern (not shown) to be described later are formed simultaneously. At that time, an alignment mark (not shown) and a terminal (not shown) to be described later are simultaneously formed on the second substrate 121 by a magnetic film. Next, if a protective layer is formed on the surface side of the B-phase magnetoresistive pattern 122, the second element substrate 12 is completed.

  Here, both the magnetoresistive thin film included in the A-phase magnetoresistive pattern 112 and the magnetoresistive thin film included in the B-phase magnetoresistive pattern 122 have a differential configuration in order to improve temperature characteristics. Moreover, in order to remove the harmonic component superimposed on the fundamental wave component of the output signal, each of the A-phase magnetoresistive pattern 112 and the B-phase magnetoresistive pattern 122 includes a plurality of magnetoresistive thin films.

  Next, after applying a UV curable adhesive as a light curable adhesive to the first element substrate 11 or the second element substrate 12, as shown in FIGS. 2C and 2D, the UV curable adhesive is used. The first element substrate 11 and the second element substrate 12 are bonded to each other. Or after making the 1st element board | substrate 11 and the 2nd element board | substrate 12 oppose, UV hardening adhesive agent is apply | coated from the edge part. At this time, since the second substrate 121 is a transparent glass substrate, the alignment mark of the first element substrate 11 and the alignment mark of the second element substrate 12 are observed through the second substrate 121. The first element substrate 11 and the second element substrate 12 are aligned. When the alignment mark is not formed on the first element substrate 11 and the second element substrate 12, the first element is observed while observing the A-phase magnetoresistive pattern 112 and the B-phase magnetoresistive pattern 122. The substrate 11 and the second element substrate 12 may be aligned.

  Next, UV light is irradiated from the transparent second substrate 121 side to cure the UV curable adhesive, and the first element substrate 11 and the second element substrate 12 are bonded together.

  Here, when the first element substrate 11 and the second element substrate 12 are bonded together, the first element substrate 11 and the second element substrate 12 partially protrude from the edge of the other substrate. Therefore, even when the magnetoresistive element 10 is configured by bonding the two element substrates 11 and 12, as shown in FIG. 1A, the protruding portions 115 and 125 of the element substrates 11 and 12 are formed. The flexible substrates 16 and 17 can be connected by a method such as pressure bonding. In this way, the magnetoresistive element 10 is manufactured.

  In the magnetoresistive element 10 configured as described above, the A-phase magnetoresistive pattern 112 and the B-phase magnetoresistive pattern 122 are formed on different element substrates (the first element substrate 11 and the second element substrate 12). In order to form a magnetoresistive pattern by arranging these two element substrates 11 and 12 facing each other, a plurality of magnetoresistive thin films are used from the viewpoint of canceling harmonic components and improving detection accuracy. However, it is not necessary to extremely narrow the gap between the magnetoresistive thin films formed on one substrate. Therefore, even when a plurality of magnetoresistive thin films are used, the manufacturing process does not require extremely high accuracy, and the magnetoresistive thin film has a high degree of freedom in layout.

  Moreover, in this embodiment, since the second substrate 121 of the first substrate 111 and the second substrate 121 is made of a transparent substrate, the first substrate 111 of the first substrate 111 is interposed through the second substrate 121 (transparent substrate). Since the position can be confirmed, the first element substrate 11 and the second element substrate 12 can be opposed with high positional accuracy.

  In addition, since the second substrate 121 is made of a transparent substrate, UV light can be irradiated between the substrates via the second substrate 121 (transparent substrate). The element substrate 12 can be bonded together. Therefore, unlike the case where the first element substrate 11 and the second element substrate 12 are bonded with a thermosetting resin, no thermal stress is generated in the first element substrate 11 and the second element substrate 12. In addition, it is not necessary to transport the first element substrate 11 and the second element substrate 12 to the heating device. Therefore, according to this embodiment, the magnetoresistive element 10 can be efficiently manufactured and the highly reliable magnetoresistive element 10 can be manufactured.

  Moreover, in this embodiment, since the first element substrate 11 is disposed on the magnetic scale 3 side among the first element substrate 11 and the second element substrate 12, the first substrate 111 is the second element substrate 11. A substrate thinner than the substrate 121 is used. Therefore, since the gap between the magnetoresistive pattern and the magnetic scale 2 can be narrowed, the sensitivity is high. Moreover, although the first substrate 111 is thin, it has sufficient strength when a ceramic glaze substrate, zirconia substrate, or silicon substrate is used.

  Furthermore, in this embodiment, since the first element substrate 11 and the second element substrate 12 partially protrude from the edge of the other substrate, the two magnetoresistive substrates 11 and 12 are bonded to each other. Even when the resistive element 10 is configured, the flexible substrates 16 and 17 can be connected to the projecting portions 115 and 125 of the magnetoresistive substrates 11 and 12, and signals from the element substrates 11 and 12 can be input. Is possible.

  Further, since the A-phase magnetoresistive pattern 112 and the B-phase magnetoresistive pattern 122 are sandwiched between the first substrate 111 and the second substrate 121, they are resistant to external impacts and the like. Further, since the A-phase magnetoresistive pattern 112 and the B-phase magnetoresistive pattern 122 are sandwiched between the first substrate 111 and the second substrate 121, they do not react sensitively to a sudden change in external temperature, As shown in FIG. 3, stable temperature characteristics can be obtained.

  In FIG. 3, in the conventional magnetoresistive element 10 in which the magnetoresistive pattern is formed on one substrate, even in the constant temperature layer, for example, when the temperature changes from −20 ° C. to 70 ° C., A in FIG. Overshoot occurs like the part. This is usually due to the fact that a differential output is obtained to improve the temperature characteristics of the magnetoresistive thin film, but it does not result in a uniform temperature distribution when the temperature changes rapidly. However, in the magnetoresistive element 10 to which the present invention is applied, since the A-phase magnetoresistive pattern 112 and the B-phase magnetoresistive pattern 122 are sandwiched between the first substrate 111 and the second substrate 121, B in FIG. As shown in the part, the temperature characteristics are stable such that no overshoot occurs.

  In FIG. 2D, the A-phase magnetoresistive pattern 112 and the B-phase magnetoresistive pattern 122 are in close contact with each other without a gap, but this does not mean that a gap may exist between them. .

(Detailed configuration of magnetoresistive element 10)
4 (a), 4 (b), and 4 (c) are explanatory diagrams of the magnetoresistive pattern and terminals formed on the element substrate of the magnetoresistive element to which the present invention is applied, and the terminals formed on the first flexible substrate. It is explanatory drawing and explanatory drawing of the terminal formed in the 2nd flexible substrate. FIGS. 5A and 5B are enlarged views of a Z-phase magnetoresistive pattern formed by a magnetoresistive thin film (hatched area) on the second element substrate of the magnetoresistive element to which the present invention is applied. FIG. 2 is an explanatory diagram showing an enlarged view of a heat generation pattern formed by a magnetoresistive thin film (shaded area) on the first element substrate. 6A and 6B are explanatory diagrams of a bridge circuit constituted by an A-phase magnetoresistive pattern and a B-phase magnetoresistive pattern in a magnetoresistive element to which the present invention is applied, and are constituted by a Z-phase magnetoresistive pattern. It is explanatory drawing of a bridge circuit.

  In configuring the magnetoresistive element 10 of the present embodiment, the first element substrate 11 and the second element substrate 12 are each configured as follows.

  First, as shown in FIG. 4A, an A-phase magnetoresistive pattern 112 is formed on the first element substrate 11 and connected to the A-phase magnetoresistive pattern 112 in the protruding region 115. Five element substrate side actual use terminals 116a are formed.

  On the other hand, a B-phase magnetoresistive pattern 122 is formed on the second element substrate 12, and six element substrate side actual uses connected to the B-phase magnetoresistive pattern 122 are provided in the overhanging region 125. Terminal 126a is formed. Note that two of the six element substrate side actual use terminals 126a are integrally formed.

  Also, as shown in FIGS. 4A and 5A, the second element substrate 12 includes two magnetoresistive thin films (a region with a diagonal line rising to the right in FIG. 5A), A total of four Z-phase magnetoresistive patterns 123a, 123b, 123c, and 123d are formed by the slanting right slanted line), and Z-phase magnetoresistive patterns 123a, 123b, and 123c are formed in the overhanging region 125. , 123d, a total of six element substrate side actual use terminals 126b are formed.

  On the other hand, as shown in FIGS. 4A and 5B, when the first element substrate 11 and the second element substrate 12 are opposed to the first element substrate 11. Two magnetoresistive thin films (a region with a right-up diagonal line and a region with a right-down diagonal line in FIG. 5B so that the Z-phase magnetic resistance patterns 123a, 123b, 123c, and 123d are sandwiched between the two sides. ), A total of six heat generation patterns 113a, 113b, 113c, 113d, 113e, and 113f are formed, and four overhanging regions 115 are connected to the heat generation patterns 113a, 113b, 113c, 113d, 113e, and 113f. An element substrate side actual use terminal 116b is formed.

  Accordingly, corresponding to the configuration of the element substrates 11 and 12, as shown in FIGS. 4A and 4B, the first flexible substrate 16 includes an element substrate connected to the A-phase magnetoresistive pattern 112. There are a total of five flexible substrate side actual use terminals 166a connected to the side actual use terminals 116a by crimping, etc. and the element substrate side actual use terminals 116b connected to the heat generation patterns 113a, 113b, 113c, 113d, 113e, 113f. A total of four flexible substrate side actual use terminals 166b connected by pressure bonding or the like are formed.

  Further, as shown in FIGS. 4A and 4C, the second flexible substrate 17 is connected to the element substrate side actual use terminal 126a connected to the B-phase magnetoresistive pattern 122 by pressure bonding or the like. A total of five flexible substrates connected by crimping or the like to a total of six flexible substrate side actual use terminals 176a and element substrate side actual use terminals 126b connected to the Z-phase magnetoresistive patterns 123a, 123b, 123c, 123d A side actual use terminal 176b is formed.

  Therefore, as shown in FIG. 1A, the first flexible substrate 16 and the second flexible substrate are provided in the overhang regions 115 and 125 of the first element substrate 11 and the second element substrate 12, respectively. When 17 is connected, predetermined terminals are connected to each other on the flexible substrates 16 and 17, and as a result, the A phase magnetoresistive pattern 112 and the B phase magnetoresistive pattern 122 are movable as shown in FIG. A bridge circuit for detecting the movement of the detection object 2 is configured. Here, the output signal from the A-phase magnetoresistive pattern 112 and the signal output from the B-phase magnetoresistive pattern 122 have a phase difference of 90 °.

  Further, as shown in FIG. 1A, the first flexible substrate 16 and the second flexible substrate 17 are formed in the overhang regions 115 and 125 of the first element substrate 11 and the second element substrate 12, respectively. As a result of connecting predetermined terminals on the flexible substrates 16 and 17, as shown in FIG. 6 (b), the Z-phase magnetoresistive patterns 123a, 123b, 123c, and 123d are used to detect the movement. A bridge circuit for detecting the movement origin of the body 2 is configured.

  Moreover, since the first element substrate 11 is provided with the heat generation patterns 113a, 113b, 113c, 113d, 113e, and 113f so as to sandwich the Z-phase magnetoresistive patterns 123a, 123b, 123c, and 123d on both sides, a plurality of them are formed. Since the temperature variation among the Z-phase magnetoresistive patterns 123a, 123b, 123c, and 123d can be suppressed small, the movement origin position of the movable body to be detected 2 can be accurately detected.

  Furthermore, in this embodiment, the first element substrate 11 on which the heat generation patterns 113a, 113b, 113c, 113d, 113e, and 113f are formed is a ceramic glaze substrate, a zirconia substrate, or a silicon substrate, whereas a Z-phase magnetoresistive pattern The second element substrate 12 on which 123a, 123b, 123c, and 123d are formed is a glass substrate, and the surface state of the glass substrate is more stable than that of the ceramic glaze substrate. Therefore, when the Z-phase magnetoresistive patterns 123a, 123b, 123c, and 123d are formed on the second element substrate 12 made of a glass substrate, the Z-phase magnetoresistive patterns 123a, 123b, 123c, and 123d are ceramic glaze substrates. There is an advantage that the measurement accuracy is high as compared with the case where the first element substrate 11 made of a zirconia substrate and a silicon substrate is formed. In addition, since the ceramic glaze substrate, the zirconia substrate, and the silicon substrate have higher heat resistance than the glass substrate, the heat generation patterns 113a, 113b, 113c, 113d, 113e, and 113f are formed of the ceramic glaze substrate, the zirconia substrate, and the silicon substrate. Forming on one substrate has an advantage that the substrate is not warped by heat.

(Configuration of dummy terminal of magnetoresistive element 10)
In this embodiment, as shown in FIGS. 4A, 4B, and 4C, the first element substrate 11 has element substrate side actual use terminals 116a and 116b used for voltage application or signal output. Two element substrate side dummy terminals 116c that are formed and are not used for voltage application and signal output are formed between these terminals. Corresponding to such a configuration, the flexible substrate side actual use terminals 166a and 166b connected to the element substrate side actual use terminals 116a and 116b by pressure bonding or the like are formed on the first flexible substrate 16. In addition, two flexible substrate side dummy terminals 166c connected to the element substrate side dummy terminals 116c by pressure bonding or the like are formed.

  Similarly, the element substrate side actual use terminals 126a and 126b used for voltage application or signal output are formed on the second element substrate 12, and at the end of the formation region of these terminals, voltage is applied. One element substrate side dummy terminal 126c that is not used for either application or signal output is formed. Corresponding to such a configuration, the flexible substrate side actual use terminals 176a and 176b connected to the element substrate side actual use terminals 126a and 126b by pressure bonding or the like are formed on the second flexible substrate 17. In addition, one flexible substrate side dummy terminal 176c connected to the element substrate side dummy terminal 126c by pressure bonding or the like is formed.

  Therefore, in both the first element substrate 11 and the second element substrate 12, the element substrate side actual use terminals 116a, 116b, 126a, 126b and the element substrate side dummy terminals 116c, 116c are arranged at a substantially pitch interval. Has been. Therefore, in both the first flexible substrate 16 and the second flexible substrate 17, the flexible substrate side actual use terminals 166a, 166b, 176a, 176b, the flexible side dummy terminals 166c, 176c, Are arranged at substantially pitch intervals.

  Further, in both of the first element substrate 11 and the second element substrate 12, the element substrate side actual use terminals 116a, 116b, 126a, 126b are provided over substantially the entire width direction (direction indicated by the arrow W) of these substrates. And the element substrate side dummy terminals 116c, 116c are arranged, and in both the first flexible substrate 16 and the second flexible substrate 17, the width direction of these substrates (direction indicated by the arrow W) The flexible substrate side actual use terminals 166a, 166b, 176a, 176b and the flexible side dummy terminals 166c, 176c are arranged substantially throughout.

  Therefore, in a state where the first flexible substrate 16 is connected to the first element substrate 11, there is a region where the first element substrate 11 and the first flexible substrate 16 are not connected by pressure bonding or the like. Since it is narrow, peeling from the first element substrate 11 such as an end portion of the first flexible substrate 16 can be surely prevented. In addition, in a state where the second flexible substrate 17 is connected to the second element substrate 12, there is a region where the second element substrate 12 and the second flexible substrate 17 are not connected by pressure bonding or the like. Since it is narrow, peeling from the second element substrate 12 such as an end portion of the second flexible substrate 17 can be surely prevented.

  Note that the structure in which the flexible substrate is prevented from peeling off by the dummy terminal may be applied to only one side of the two element substrates. The structure for preventing the flexible substrate from being peeled off by the dummy terminal can also be applied to a magnetoresistive element using a single element substrate.

(A), (b), (c) is an explanatory view showing the positional relationship between a head equipped with a magnetoresistive element to which the present invention is applied and a magnetic scale, and magnetism using a magnetoresistive element to which the present invention is applied. It is explanatory drawing of a type | formula linear encoder and explanatory drawing of the rotary encoder using the magnetoresistive element to which this invention is applied. (A)-(d) is explanatory drawing which shows the manufacturing method of the magnetoresistive element to which this invention is applied. It is a graph which shows the time series sensor output of the magnetoresistive element to which this invention is applied. (A), (b), (c) is explanatory drawing of the magnetoresistive pattern and terminal which were formed in the element substrate of the magnetoresistive element to which this invention is applied, explanatory drawing of the terminal formed in the 1st flexible substrate FIG. 5 is an explanatory diagram of terminals formed on the second flexible substrate. (A), (b) is explanatory drawing which expands and shows a mode that the Z phase magnetoresistive pattern was formed with the magnetoresistive thin film with respect to the 2nd element substrate of the magnetoresistive element to which this invention is applied, and 1st It is explanatory drawing which expands and shows a mode that the heat-generation pattern was formed with the magnetoresistive thin film with respect to the element substrate. (A), (b) is explanatory drawing of the bridge circuit comprised by A phase magnetoresistive pattern and B phase magnetoresistive pattern in the magnetoresistive element to which this invention is applied, and the bridge comprised by Z phase magnetoresistive pattern It is explanatory drawing of a circuit.

Explanation of symbols

DESCRIPTION OF SYMBOLS 1 Magnetic sensor apparatus 2 Movable body 3 Magnetic scale 5 Head 10 Magnetoresistive element 11 1st element substrate 12 2nd element substrate 16 1st flexible substrate 17 2nd flexible substrate 112 A phase magnetoresistive pattern 113a to 113f Heat generation patterns 116a, 116b, 126a, 126b Element substrate side actual use terminals 116c, 126c Element substrate side dummy terminals 115, 125 Overhang area (terminal formation area) of the element substrate
122 B-phase magnetoresistive patterns 123a to 123d Z-phase magnetoresistive patterns 166a, 166b, 176a, 176b Flexible substrate side actual use terminals 166c, 176c Flexible substrate side dummy terminals

Claims (6)

In a magnetoresistive element having an element substrate on which a magnetoresistive pattern for detecting movement of a movable object to be detected is formed and a flexible substrate in which the element substrate and terminals are connected to each other,
In the element substrate, an element substrate side actual use terminal used for voltage application or signal output and an element substrate side dummy terminal not used for either voltage application or signal output are formed,
The flexible substrate is formed with a flexible substrate side actual use terminal connected to the element substrate side actual use terminal and a flexible substrate side dummy terminal connected to the element substrate side dummy terminal. A magnetoresistive element characterized by comprising:   2. The magnetoresistive element according to claim 1, wherein the element substrate side actual use terminals connected to the magnetoresistive pattern and the element substrate side dummy terminals are arranged at substantially pitch intervals in the element substrate.   3. The flexible substrate according to claim 1, wherein the flexible substrate side actual use terminals and the flexible substrate side dummy terminals are arranged over substantially the entire width direction of the substrate. Magnetoresistive element. In any one of Claim 1 thru | or 3, While using as the said element substrate the 1st element substrate and 2nd element substrate which were opposingly arranged so that a terminal formation area might be exposed,
As the flexible substrate, a first flexible substrate connected to the first element substrate and a second flexible substrate connected to the second element substrate are used,
On the first element substrate, as the magnetoresistive pattern, the A phase magnetoresistive pattern for detecting the movement of the movable subject to be detected, and the movable subject to be detected with a phase difference of 90 ° from the A phase magnetoresistive pattern. A magnetoresistive pattern on one side of the B-phase magnetoresistive pattern for detecting body movement is formed,
A magnetoresistive pattern on the other side of the A phase magnetoresistive pattern and the B phase magnetoresistive pattern is formed on the second element substrate,
Both the element substrate side actual use terminal and the element substrate side dummy terminal are formed on at least one element substrate of the first element substrate and the second element substrate,
In the first flexible substrate and / or the second flexible substrate, both the flexible substrate side actual use terminal and the flexible substrate side dummy terminal are formed. A magnetoresistive element. The Z-phase magnetoresistive pattern for detecting the movement origin position of the movable object to be detected is formed on the second element substrate according to claim 4,
A heating pattern is formed on the first element substrate so that the Z-phase magnetoresistive pattern is sandwiched between both sides when the first element substrate and the second element substrate are opposed to each other. A characteristic magnetoresistive element.   6. The magnetoresistive element according to claim 4, wherein the first element substrate is a ceramic glaze substrate, a zirconia substrate, a silicon substrate, or a glass substrate, and the second element substrate is a glass substrate.

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