JP2006123114A - Polishing tool - Google Patents

Polishing tool Download PDF

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Publication number
JP2006123114A
JP2006123114A JP2004316314A JP2004316314A JP2006123114A JP 2006123114 A JP2006123114 A JP 2006123114A JP 2004316314 A JP2004316314 A JP 2004316314A JP 2004316314 A JP2004316314 A JP 2004316314A JP 2006123114 A JP2006123114 A JP 2006123114A
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Prior art keywords
polishing
optical element
mold
polishing tool
aspheric surface
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JP2004316314A
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Japanese (ja)
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Taku Yokote
卓 横手
Atsushi Hibino
敦 日比野
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Shimadzu Corp
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Shimadzu Corp
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Priority to JP2004316314A priority Critical patent/JP2006123114A/en
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Abstract

<P>PROBLEM TO BE SOLVED: To provide a polishing tool capable of uniform polishing by following after an aspheric surface, when a polishing surface of an optical element is the aspheric surface. <P>SOLUTION: A polishing material 2 is composed of a pattern body 1 for imitating a member for pressing to the optical element 5 from a polishing object surface, that is, the aspheric surface 5F of the optical element 5. This pattern body 1 is composed of an elastic material having proper hardness represented by, for example, a silicon rubber material, and has both of the function of following after the aspheric surface 5F of the optical element 5 and the function of making an aspheric surface shape of the elastic material on a polishing surface of the polishing material 2, that is, polishing cloth. a shock absorbing material 3 has the function of adjusting hardness of the pattern body 1 being the eleastic material. A holding frame 4 of a metal mold integrally holds these polishing tools KD. The holding frame 4 is composed of, for example, stainless steel and an aluminum material, and surely holds the pattern body 1. <P>COPYRIGHT: (C)2006,JPO&NCIPI

Description

本発明は、研磨される面が非球面である光学素子を精度よく研磨する研磨工具に関する。   The present invention relates to a polishing tool for accurately polishing an optical element whose surface to be polished is an aspherical surface.

通常、この種の光学素子の研磨では、研磨される光学素子を研磨装置の機台に固定設置し、この光学素子の非球面に対して研磨材(たとえば研磨布)を面接合させ、その研磨材を上方より押圧部材等を介して一定の圧力で押圧しつつ光学素子に対して移動(往復動)させ研磨する。このような研磨工具における研磨材は、非球面に直接接合する1ミリメートル前後の薄い研磨材(布)または数10ミクロンの研磨シートが利用され、押圧部材としては光学素子の非球面の大きさに比して小さい小型の部材あるいは大型の機器を構成した工具が採用されている。このような研磨工具においては、研磨材を非球面に対していかに精度よく沿わせるかが重要で、種々の方法が提案されている(たとえば特許文献1参照)。押圧部材や押圧機器としては、光学素子の非球面の大きさに比して小さい小型の部材と、が採用されている。たとえば、非球面全域の大きさをする型体をたとえば金型を利用してプレス加工(成形加工)し、この型体を用いて研磨する方法や機械加工で製作する方法等がある。
特開2002−307280号公報
Normally, in polishing of this type of optical element, the optical element to be polished is fixedly installed on the machine base of the polishing apparatus, and an abrasive (for example, a polishing cloth) is surface-bonded to the aspherical surface of this optical element, and the polishing is performed. The material is moved (reciprocated) with respect to the optical element while being pressed from above with a constant pressure via a pressing member or the like, and polished. As a polishing material in such a polishing tool, a thin polishing material (cloth) of about 1 millimeter that is directly bonded to an aspherical surface or a polishing sheet of several tens of microns is used, and an aspherical surface of an optical element is used as a pressing member. Compared to this, a small component or a tool constituting a large device is employed. In such a polishing tool, it is important how accurately the abrasive is aligned with the aspherical surface, and various methods have been proposed (see, for example, Patent Document 1). As the pressing member and the pressing device, a small member smaller than the aspherical size of the optical element is employed. For example, there is a method in which a mold body having a size of the entire aspherical surface is pressed (molded) using, for example, a mold, and polished using this mold body, or a method of manufacturing by machining.
JP 2002-307280 A

上述した2つの加工法による工具についてはつぎの問題がある。すなわち、金型による成形品を型体とする研磨工具は、型体の厚みの高低差が大きいものとか、外形の形状が円形でないものは成形が難しく、種々の制限を有する。これは、光学素子の非球面が8次式などにて形成されているという特殊事情があり、プレス加工等では精度の点で限界がある。他方、切削加工や研削加工によって型体を機械加工で製作する場合も、8次式による複雑な形状の非球面体であるため、平面や球面形状の研磨と同様の大きさの工具を用いて研磨すれば被研磨面の形状を著しく悪化させることになる。したがって通常では、被研磨面の光学素子の大きさに比して小さな工具を用いて部分研磨をし、この研磨を繋ぎ合わせていくことにより全面研磨する。しかしこの方法では繋ぎ合わせ部が不連続面になりやすく、光学性能に悪影響を及ぼす。
本発明はこのような問題を解決する研磨工具を提供する。
The tools according to the two processing methods described above have the following problems. That is, it is difficult to mold a polishing tool that uses a molded product of a mold as a mold, or has a large difference in thickness of the mold or a non-circular outer shape, and has various limitations. This has a special circumstance that the aspherical surface of the optical element is formed by an 8th order equation or the like, and there is a limit in terms of accuracy in press working or the like. On the other hand, when a die body is manufactured by machining by grinding or grinding, it is an aspherical body having a complicated shape by an 8th-order equation, and therefore a tool having the same size as that for polishing a flat surface or a spherical shape is used. Polishing significantly deteriorates the shape of the surface to be polished. Therefore, in general, partial polishing is performed using a tool smaller than the size of the optical element on the surface to be polished, and the entire surface is polished by connecting the polishing. However, in this method, the joining portion tends to be a discontinuous surface, which adversely affects the optical performance.
The present invention provides a polishing tool that solves such problems.

本発明が提供する研磨工具は、上記課題を解決するために、研磨される面が非球面である光学素子に対して、前記非球面に面接合させる研磨材と、この研磨材を非球面に押し付ける押圧部材を有し、この押圧部材を光学素子に対して相対的に移動させることによって光学素子を研磨する研磨工具において、前記押圧部材が前記非球面を模りした型体で構成したものである。したがって研磨工具は光学素子とほぼ同様の大きさであり、非球面全体を均一かつ精度よく研磨できる。さらに本発明は、型体を弾性材料にて構成するものであり、研磨材を非球面になじませることができる。
さらに本発明は、研磨材と型体との間に緩衝材を介在させたものであり、より緻密ななじみが実現される。
In order to solve the above-described problems, the polishing tool provided by the present invention provides an abrasive that is bonded to the aspheric surface with respect to an optical element whose surface to be polished is an aspheric surface, and the abrasive is aspherical. In a polishing tool having a pressing member to be pressed and polishing the optical element by moving the pressing member relative to the optical element, the pressing member is formed of a mold imitating the aspherical surface. is there. Therefore, the polishing tool is approximately the same size as the optical element, and can polish the entire aspheric surface uniformly and accurately. Further, according to the present invention, the mold body is made of an elastic material, and the abrasive can be adapted to an aspherical surface.
Furthermore, according to the present invention, a cushioning material is interposed between the abrasive and the mold body, and a finer familiarity is realized.

弾性材料で構成させることによって、研磨材の光学素子への接触面がその非球面になじみ、高平滑な非球面を実現することができる。さらに全面均等研磨を行うことができ、機械加工によって創生された非球面形状を維持した状態での非球面が実現できる。   By using an elastic material, the contact surface of the abrasive with the optical element fits into the aspheric surface, and a highly smooth aspheric surface can be realized. Further, the entire surface can be evenly polished, and an aspherical surface can be realized while maintaining the aspherical shape created by machining.

本発明の特徴は、研磨材を光学素子に対して押圧する部材を光学素子の被研磨面すなわち非球面から模りした型体で構成することにあり、しかもこの型体を弾性材料で構成することによって、研磨工具として被研磨面に最もなじみのよい研磨面を実現できる構成としたものである。   A feature of the present invention resides in that a member that presses an abrasive against an optical element is constituted by a mold body imitating the polished surface of the optical element, that is, an aspherical surface, and this mold body is constituted by an elastic material. Thus, a polishing surface that is most familiar to the surface to be polished can be realized as a polishing tool.

以下実施例を示す図1、図2にしたがって本発明の特徴を説明する。
図1は模りした型体1を金型の保持枠4にて保持させた状態を示す縦断面図で、型体1の下方の面1Fが光学素子5の非球面5Fに近い形状を呈している。この型体1が非球面5Fを押圧する面1Fには、図示例では緩衝材3たとえばウレタンパッドのような材料が貼り付けられ、そのさらに下方に研磨材2(具体的には研磨布)が貼り付けられている。
The features of the present invention will be described below with reference to FIGS.
FIG. 1 is a longitudinal sectional view showing a state in which a simulated mold body 1 is held by a mold holding frame 4, and a lower surface 1 F of the mold body 1 has a shape close to an aspheric surface 5 F of an optical element 5. ing. In the illustrated example, a material such as a cushioning material 3 such as a urethane pad is attached to a surface 1F on which the mold body 1 presses the aspherical surface 5F, and an abrasive 2 (specifically, a polishing cloth) is further provided below the cushioning material 3. It is pasted.

この型体1は、たとえばシリコンゴム材などで代表される適度の硬度を有する弾性材料で製作され、光学素子5の非球面5Fに倣う機能と、研磨材2(すなわち研磨布)の研磨面に弾性材料の非球面形状を造る機能の両方を備えている。緩衝材3は弾性材料である型体1の硬さを調整する機能を有する。そして、これら研磨工具の各要素が金型の保持枠4にて一体的に保持されている。なお、この保持枠4はたとえばステンレスやアルミニウム材料で構成され、型体1を確実に保持する。このような構成からなる研磨工具KDによって、図2に示す状態で研磨が行われる。研磨工具KDはその全体が光学素子5の上面全域に面接合される。この場合、保持枠4そして型体1の全自重が光学素子5に作用し、研磨材2が非球面5Fに押圧される形となる。   The mold 1 is made of an elastic material having an appropriate hardness represented by, for example, a silicon rubber material, and has a function that follows the aspheric surface 5F of the optical element 5 and a polishing surface of the polishing material 2 (that is, a polishing cloth). It has both the function of creating an aspherical shape of elastic material. The cushioning material 3 has a function of adjusting the hardness of the mold 1 that is an elastic material. Each element of these polishing tools is integrally held by a holding frame 4 of the mold. The holding frame 4 is made of, for example, stainless steel or aluminum material, and holds the mold body 1 securely. Polishing is performed in the state shown in FIG. 2 by the polishing tool KD having such a configuration. The entire polishing tool KD is surface bonded to the entire upper surface of the optical element 5. In this case, the entire weight of the holding frame 4 and the mold 1 acts on the optical element 5, and the abrasive 2 is pressed against the aspherical surface 5F.

通常、光学素子5は図3に示される研磨装置の機台6上に固定設置される。そしてその光学素子5の上方に研磨工具KDが載置される形となる。具体的には保持枠4の上方中央部にはカンザシ7の下端が係止され、このカンザシ7を保持する保持体8の荷重が研磨工具KDに作用するようになっている。この保持体8には移動運動を与えるためのリンク9の一端が連接され、このリンク9の他端はガイド棒11にて往復動を規制された往復動板10の一端側に連接されている。さらにこの往復動板10の他端側には、モータ15にて回転する回転盤13に偏位して植設されたピン14に連結されたクランク12の他端が連結されている。以上の構成により、モータ15の回転にてリンク9がその長手方向に往復動する。研磨工具KDはその被研磨面の形状にもよるが、通常数センチメートル程度の往復移動動作が与えられる。さらにこの往復動ごとに光学素子5をその往復運動方向と垂直の方向に少量ずつ変位させる機構(図示せず)も設置される。   Usually, the optical element 5 is fixedly installed on the machine base 6 of the polishing apparatus shown in FIG. Then, the polishing tool KD is placed above the optical element 5. Specifically, the lower end of the kanzashi 7 is locked to the upper center portion of the holding frame 4, and the load of the holding body 8 that holds the kanzashi 7 acts on the polishing tool KD. One end of a link 9 for giving a moving motion is connected to the holding body 8, and the other end of the link 9 is connected to one end side of a reciprocating plate 10 whose reciprocating motion is restricted by a guide rod 11. . Further, the other end of the reciprocating plate 10 is connected to the other end of a crank 12 connected to a pin 14 that is displaced from a rotating plate 13 that is rotated by a motor 15. With the above configuration, the link 9 reciprocates in the longitudinal direction by the rotation of the motor 15. The polishing tool KD is usually given a reciprocating movement of about several centimeters depending on the shape of the surface to be polished. Further, a mechanism (not shown) for displacing the optical element 5 little by little in the direction perpendicular to the reciprocating motion direction for each reciprocating motion is installed.

このような研磨装置によって光学素子5の研磨が行われる。前述したとおり研磨工具KDは、それ自体が金型の保持枠4や型体1が一定の重量体でありそれ自体で研磨材(布)2を光学素子5に押圧するが、カンザシ7の保持体8の重量にても型体1が光学素子5を押圧される。したがって型体1、緩衝材3および研磨材2が光学素子5の非球面5Fに倣うような形で変形する。この場合、型体1が非球面形状に近い形状にできていることで、その変形量は少量になる。そのため、光学素子5の非球面形状と型体1の変形状を考慮した左右方向または垂直方向への運動量を調整するようにすれば、研磨進行中に常時研磨材(布)2と光学素子5の全域の非球面5Fが接触し、形状を損なうことなく均等な研磨を実現できる。   The optical element 5 is polished by such a polishing apparatus. As described above, in the polishing tool KD, the mold holding frame 4 and the mold body 1 have a constant weight and press the abrasive (cloth) 2 against the optical element 5 by itself. The mold body 1 presses the optical element 5 even with the weight of the body 8. Therefore, the mold body 1, the buffer material 3, and the polishing material 2 are deformed so as to follow the aspherical surface 5F of the optical element 5. In this case, since the mold body 1 has a shape close to an aspherical shape, the amount of deformation is small. Therefore, if the momentum in the left-right direction or the vertical direction is adjusted in consideration of the aspherical shape of the optical element 5 and the deformed shape of the mold body 1, the abrasive (cloth) 2 and the optical element 5 are always used during polishing. The aspherical surface 5F in the entire area contacts, and uniform polishing can be realized without impairing the shape.

本発明が提供する研磨工具KDの特徴は以上詳述したとおりであるが、上記ならびに図示例に限定されるものではなく、本発明の要旨を包含するあらゆる実施例を包含する。たとえば図示例では型体1を金属性の保持枠4で保持させ、この保持枠4にカンザシ7を係止させるようにしたが、保持枠4を省略して型体1にカンザシ7用の係止凹部を形成してカンザシ7を型体1に直接的に係止させ移動させる方式とすることもできる。また通常的には光学素子5を機台6に対して固定設置させ、型体1を移動させる方式を採用するが、型体1を固定設置し、光学素子5を機械的に移動させるようにすることもできる。さらに型体1の材料は上記に限定されないし、緩衝材3の材質も上記材料に限定されない。   The characteristics of the polishing tool KD provided by the present invention are as described in detail above, but the present invention is not limited to the above and illustrated examples, and includes all embodiments including the gist of the present invention. For example, in the illustrated example, the mold body 1 is held by the metallic holding frame 4 and the Kanzashi 7 is locked to the holding frame 4, but the holding frame 4 is omitted and the mold 1 is engaged with the Kanzashi 7. It is also possible to adopt a method in which a stop recess is formed and the Kanzashi 7 is directly locked to the mold body 1 and moved. Normally, the optical element 5 is fixedly installed on the machine base 6 and the mold 1 is moved. However, the mold 1 is fixedly installed and the optical element 5 is mechanically moved. You can also Furthermore, the material of the mold 1 is not limited to the above, and the material of the buffer material 3 is not limited to the above material.

本発明の研磨工具を縦断して示す図である。It is a figure which cuts and shows the polish tool of the present invention longitudinally. 本発明の研磨工具による研磨状態を示す例である。It is an example which shows the grinding | polishing state by the grinding | polishing tool of this invention. 本発明の研磨工具を取り付けた研磨装置の一例を示す図である。It is a figure which shows an example of the grinding | polishing apparatus which attached the grinding | polishing tool of this invention.

符号の説明Explanation of symbols

1 型体
1F 面
2 研磨材
3 緩衝材
4 保持枠
5 光学素子
5F 非球面
6 機台
7 カンザシ
8 保持体
9 リンク
10 往復動板
11 ガイド棒
12 クランク
13 回転盤
14 ピン
15 モータ
KD 研磨工具
DESCRIPTION OF SYMBOLS 1 Type body 1F surface 2 Abrasive material 3 Buffer material 4 Holding frame 5 Optical element 5F Aspherical surface 6 Machine stand 7 Kanzashi 8 Holding body 9 Link 10 Reciprocating plate 11 Guide rod 12 Crank 13 Rotary disk 14 Pin 15 Motor KD Polishing tool

Claims (5)

研磨される面が非球面である光学素子に対して、前記非球面に面接合させる研磨材と、この研磨材を非球面に押し付ける押圧部材を有し、この押圧部材と光学素子に対して相対的に移動させることによって光学素子を研磨する研磨工具において、前記押圧部材が前記非球面を模りした型体で構成したことを特徴とする研磨工具。   For an optical element whose surface to be polished is an aspherical surface, the optical element has an abrasive that is bonded to the aspherical surface, and a pressing member that presses the abrasive against the aspherical surface. A polishing tool for polishing an optical element by moving the polishing element according to claim 1, wherein the pressing member is formed of a mold imitating the aspherical surface. 型体を弾性材料で製作したことを特徴とする請求項1記載の研磨工具。   2. The polishing tool according to claim 1, wherein the mold is made of an elastic material. 型体をシリコンゴム材で構成したことを特徴とする請求項2記載の研磨工具。   3. The polishing tool according to claim 2, wherein the mold body is made of a silicon rubber material. 型体と研磨材との間に緩衝材を介在させたことを特徴とする請求項1記載の研磨工具。   The polishing tool according to claim 1, wherein a buffer material is interposed between the mold body and the abrasive. 緩衝材をウレタンパッドで構成したことを特徴とする請求項4記載の研磨工具。
The polishing tool according to claim 4, wherein the cushioning material is formed of a urethane pad.
JP2004316314A 2004-10-29 2004-10-29 Polishing tool Pending JP2006123114A (en)

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Application Number Priority Date Filing Date Title
JP2004316314A JP2006123114A (en) 2004-10-29 2004-10-29 Polishing tool

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