JP2006120890A - Component mounting apparatus, component mounting method, and component suction method - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a component suction method for dispensing with miniaturization in the component suction surface of a nozzle for sucking a component accordingly even if the size of the component to be mounted is compact and for sucking the component reliably. <P>SOLUTION: The component suction nozzle 1, having the component suction surface 6 with a dimension that is longer than the width of the opening at least in one direction of the opening of a component storage section 23, is used. When sucking the component, the component suction surface 6 is pushed into the region of the component storage section 23. In this case, the component suction surface 6 presses the periphery of the component storage section 23, deforms it, and brings it into contact with a component 10, or brings it closer so that it almost comes into contact with the component 10. When negative pressure operates on the component suction nozzle 1 in this state, atmospheric air is introduced from the periphery of the deformed component storage section 23, and a component 1 can be sucked reliably along with suction effect by the component suction surface 6 at a position close to the component 1. An enlargement section 24 is provided at the upper portion of the component storage section 23 and may be open to a base tape 21. <P>COPYRIGHT: (C)2006,JPO&NCIPI

Description

  The present invention relates to a component mounting apparatus and a component mounting method for taking out a component supplied to a component supply unit and mounting the component on a mounting position of a circuit board. More specifically, the present invention relates to a component suction method for picking up and removing a component supplied by a component supply tape by the negative pressure action of a component suction nozzle, a component mounting apparatus using the component suction method, and a component It relates to the implementation method.

  An example of a component mounting apparatus is shown in FIG. In the figure, a component mounting apparatus 50 includes a component supply unit 51 that supplies components to be mounted, a mounting head 53 that takes out components from the component supply unit 51 and mounts them on a circuit board 52, and conveys the mounting head 53 to a predetermined position. A robot 54, a substrate holding unit 56 that carries in and holds the circuit board 52, and a control unit 57 that controls the overall operation. A component supply device 30 capable of sequentially supplying the components 10 is attached to the component supply unit 51.

  In the technical field of component mounting, in order to take out the supplied component 10 and mount it on the circuit board 52, there is a component suction nozzle (hereinafter referred to as “nozzle”) 1 that sucks and holds the component using negative pressure. Widely used. In the example shown in FIG. 5, four nozzles 1 are mounted on the mounting head 53, and each nozzle 1 performs from the removal of the component 10 to mounting.

  6A to 6C show an example of the nozzle 1. In the figure, the nozzle 1 has a connecting portion 2 for connecting to a mounting head 53 located at the upper side in the longitudinal direction, and an adsorbing portion 3 for adsorbing components under the same. Between the upper connecting part 2 and the lower suction part 3, two flanges 4 into which an attaching / detaching tool (not shown) is inserted when attaching / detaching the nozzle 1 to / from the mounting head 53 are provided. Depending on the shape, size, etc. of the component 10 to be sucked, the nozzle 1 mounted on the mounting head 53 can be replaced using the mounting / demounting tool. A component suction surface 6 orthogonal to the longitudinal axis (center axis) 5 of the nozzle 1 is formed at the lower end of the suction portion 3, and this component suction surface 6 is brought into contact with the upper end surface of the component 10 during suction.

  A suction hole 7 (see FIG. 6C) is opened on the component suction surface 6 of the nozzle 1, and an upper opening 9 formed on the suction hole 7 and the upper end surface 8 of the connecting portion 2 (see FIG. 6A). Are fluidly connected to each other via an air passage 15 (partially indicated by a broken line) formed in the nozzle 1. At the time of component adsorption, the negative pressure supplied from the mounting head 53 is used to adsorb the mounted component 10 to the component adsorption surface 6, and at the time of component mounting, the component 10 is moved to the nozzle 1 using the positive pressure supplied from the mounting head 53. Implement separately from the above.

  FIG. 6B shows an enlarged view of the suction portion 3. As shown in the drawing, in the suction portion 3, a lower cylindrical portion 13 extends from the upper cylindrical portion 12, and an inverted truncated pyramid portion 14 extends further downward from the lower cylindrical portion 13 to form a rectangular component suction surface 6 at the tip. Connected to. In the example of the nozzle 1 shown in the drawing, the suction hole 7 opens in a substantially X shape as shown in the bottom view of FIG. 6C. The shape of the suction hole 7 depends on the shape of the component 10 and the like. Various types such as a circle (single or plural), an oval, a star, and a king shape are considered. Generally, if the negative pressure is the same, a stronger suction force can be obtained as the opening area of the suction hole 7 is increased. However, if the suction hole 7 is made larger than the component 10, the component 10 may be sucked into the suction hole 7 or fall off and cause defective mounting. In order to avoid this, various opening shapes that make it difficult for the component 10 to be sucked in while making the opening area as large as possible have been considered (for example, see Patent Document 1).

  Next, FIG. 7 shows an example of the component supply tape 20 that continuously supplies components to the component mounting apparatus 50. In the figure, the component supply tape 20 includes a base tape 21 that houses the component 10 and a cover tape 22 that covers the base tape 21. The base tape 21 is provided with a component storage portion 23 composed of a concave embossed portion formed by embossing at equal intervals in the longitudinal direction. The component 10 is stored in the component storage portion 23 and is covered and protected by a cover tape 22 attached to the base tape 21. The cover tape 22 prevents the component 10 from dropping from the component storage unit 23 or being displaced in the component storage unit 23 until it is peeled off from the base tape 21 later. The component supply tape 20 configured as described above is wound around a reel 25 and loaded into a component supply device described later.

  When the size of the component 10 is very small, the base tape 21 does not have to be provided with a component storage portion 23 by an embossed portion formed by embossing, and the paper base tape 21 is simply punched into the hollow punched portion. There is also a punching-type component supply tape 20 that houses the component 10 and protects it from the front and back with a cover tape 22.

  FIG. 8 shows an example of a component supply device 30 that attaches the above-described reel 25 and sequentially supplies components to the component mounting device 50. In the figure, a component supply device 30 includes a main body portion 31 formed so as to be attachable to a component supply portion 51 (see FIG. 5) of a component mounting device 50, and a reel attachment portion for attaching a reel 25 around which the component supply tape 20 is wound. 32, a tape transport drive unit 33 that pulls and transports the component supply tape 20 from the reel 25, and a cover tape recovery unit 34 that recovers the cover tape 22. A support pin 35 that holds the reel 25 rotatably is fixed to the reel mounting portion 32.

  The component supply device 30 configured as described above operates as follows. In FIG. 8, the component supply tape 20 is pulled out from the reel 25 that is rotatably attached to the support pin 35, and is located on the left front side of the drawing by intermittent rotation drive of the drive wheel 36 in the tape transport drive unit 33 (not shown). It is conveyed toward the component mounting apparatus 50. A shutter 37 that protects the component 10 is provided immediately in front of the tape conveyance drive unit 33, and the nozzle 1 (not shown) of the component mounting apparatus descends from above from the component supply tape 20 in synchronization with the opening of the shutter 37. The component 10 is sucked and taken out. The cover tape 22 that previously protected the component 10 is peeled off immediately before the shutter 37, and is wound and collected by the cover tape collecting unit 34 that is intermittently driven to rotate.

  FIGS. 9A to 9C show an operation when the nozzle 1 sucks and takes out the component 10 from the component storage portion 23 formed on the base tape 21 of the component supply tape 20. With respect to the component 10 whose cover tape 22 has been peeled off immediately before the component removal position and the upper portion is opened, the nozzle 1 is lowered (FIG. 9 (a)), and the component suction surface 6 at the lower end is moved to the upper end surface of the component 10. (FIG. 9B). At this time, a negative pressure indicated by a broken line arrow 16 acts on the air passage 15 of the nozzle 1 to suck the component 10 on the component suction surface 6. At this time, the component suction surface 6 descends beyond the upper end surface AA of the base tape 21, enters the interior of the component storage portion 23 by a distance d, and contacts the component 10. The nozzle 1 that has sucked the component 10 is then lifted while holding the component 10 by the action of negative pressure, and moves to a predetermined component mounting position (FIG. 9C).

  As shown in FIGS. 9A to 9C, the component suction surface 6 at the tip of the nozzle 1 needs to be pushed into the component storage portion 23 of the base tape 21 when the component 10 is sucked. It is designed to avoid interference with the opening of the component storage unit 23. That is, there is a relationship of b> a between the width a of the component suction surface 6 and the width b of the component storage unit 23. Although not shown in the drawing, the same relationship is maintained for the width in the direction perpendicular to the drawing. The same applies to the case where the component storage unit 23 and the component suction surface 6 are circular. In order to maintain the component suction surface 6 in such dimensions, the suction portion 3 of the nozzle 1 is connected to the component suction surface 6 via an inverted truncated pyramid portion 14 extending from the lower cylindrical portion 13 as shown in FIG. The size is reduced toward the component, and the component suction surface 6 is formed in a shape that can be lowered into the component storage portion 23.

  FIGS. 9A to 9C show an example of a component supply tape 20 having a component storage portion 23 embossed on the base tape 21, but a paper base tape 21 is used instead of embossing. The same dimensional constraints are imposed on the component suction surface 6 even for a component supply tape of a punching type in which a hollow punched portion is used as a component storage portion. The punched-type component supply tape 20 is mainly used for supplying small chip components such as a rectangular surface having a side of about 2 mm or less, and the embossed-type component supply tape 20 is used for supplying other relatively large components. Mainly used for.

  By the way, along with the recent demand for multi-functionalization and reduction in size and weight of electronic devices in the market, parts themselves mounted on electronic devices are required to be further downsized. For example, rectangular parts having a side of less than 0.5 mm have already been used. If the parts 10 are reduced in size, the nozzles 1 to which these parts 10 should be sucked need to be correspondingly reduced. However, the processing required when machining the part suction surface 6 and the suction holes 7 of the nozzle 1 is required. Considering the accuracy and securing the necessary strength against damage to the component suction surface 6 due to external force, there is a limit to the further miniaturization of the nozzle 1.

In order to cope with such a situation and avoid further downsizing of the nozzle tip, the following measures can be considered.
1. The opening area of the component storage unit 23 storing the component 10 is widened, and even a relatively large component suction surface 6 with respect to the component 10 can be pushed into the component storage unit 23.
2. The component suction surface 6 can be sucked by the height of the upper end surface AA of the base tape 21, and the pushing of the component suction surface 6 into the component storage portion 23 becomes unnecessary.

  Of these, in response to 1, the component 10 is reduced while the area of the component storage unit 23 is increased, and the component 10 stored in the component storage unit 23 moves inside during the conveyance process of the component supply tape 20. Therefore, the positioning accuracy at the time of suction is lowered. For this reason, implementation is difficult as it is.

  Next, regarding the second countermeasure, various measures have been studied so far. FIGS. 10A and 10B show an example. In FIG. 10A, the width a of the component suction surface 6 of the nozzle 1 is larger than the opening width b of the component storage portion 23 of the base tape 21. Widely formed (a> b). During operation, the nozzle 1 descends until it contacts the upper end surface AA of the base tape 21 as shown in FIG. 10 (b), and applies a negative pressure indicated by a broken line arrow 16 through the air passage 15. However, as shown in FIG. 10 (b), the periphery of the component storage unit 23 is sealed by the periphery of the component suction surface 6 of the nozzle, and the entire interior of the component storage unit 23 is at the same negative pressure. The suction force does not work.

One solution according to the prior art that overcomes this situation is to provide a groove 17 as shown by a broken line on the surface of the component suction surface 6, through which the outside air is guided into the component storage portion 23 and the negative pressure of the nozzle 1. Measures to exert an effect on the part 10 are considered. Further, in another solution, for example, a vent hole 18 as shown in FIG. 10B is formed in the bottom surface or side surface of the component storage portion 23, and the outside air is guided into the component storage portion 23 from the vent hole 18 to create a negative pressure. Measures have been considered to make the suction by the function (for example, see Patent Documents 2 and 3).
JP 2002-292587 A JP-A-5-21989 JP 2000-151185 A

  However, there has been a problem with the above-described conventional problem solution. First, in the measure of providing the groove 17 on the component suction surface 6, air can always flow through the groove 17. For this reason, for example, the negative pressure leakage continues even after the component 10 is adsorbed, thereby reducing the force for adsorbing and holding the component 10. Alternatively, a stronger negative pressure is required to ensure the suction holding force. In addition, the nozzle 1 can generally be used for sucking a plurality of types of components, but it is impossible to avoid the occurrence of negative pressure leakage even when the components 10 that can be sucked without the grooves 17 are sucked.

  Further, in the measure in which the vent hole 18 is provided on the bottom surface or the side surface of the component storage portion 23, dust or the like enters the component storage portion 23 through the vent hole 18, or moisture in the atmosphere enters and condenses inside. As a result, an unexpected failure may occur in the component 10, or the component 10 may come into close contact with the bottom surface of the component storage unit 23 and cause a suction failure.

  As described above, the present invention eliminates the problems in the prior art described above, and it is not necessary to downsize the nozzle 1 correspondingly to the small component 10, and the component adsorption that makes it possible to reliably adsorb the component 10. It aims to provide a method.

  The present invention uses a nozzle provided with a component suction surface having a dimension longer than the width of the opening in at least one direction of the opening of the component storage provided on the component supply tape, and stores the component on the component suction surface. A part or the whole of the periphery of the part is pressed and deformed, and the part suction surface is pushed into an area before deformation of the part storage part, or the side wall of the part storage part is partly above the part storage part By providing an enlarged part that spreads outside the part storage part and allowing the part suction surface to be pushed in, the part suction surface can be brought into contact with or close to the part to enable part suction and eliminate the above-mentioned problems Specifically, the following contents are included.

  That is, according to one aspect of the present invention, a component mounted on a circuit board is picked up and taken out by a component suction surface of a component suction nozzle by a negative pressure from a component storage portion opened in a base tape of a component supply tape. A suction method comprising: using a component suction nozzle having a component suction surface having a dimension longer than the width of the opening in at least one direction of the opening of the component storage portion; A component suction method, wherein the component suction surface is lowered until it reaches the inside of the component storage portion beyond the upper end surface of the tape, and the component is suctioned and taken out from the component storage portion. .

  When the component is taken out, the entire circumference of the opening of the component storage portion can be pressed and deformed by the component suction surface, and the component suction surface can be pushed into the region before deformation of the component storage portion. Further, when the component is stored in the component storage portion, the difference in height between the upper end surface of the base tape and the upper end surface of the component is d, and the region before the deformation of the component storage portion is determined from the upper end surface of the base tape. When the descending amount of the component suction surface to e is defined as e, the relationship of e ≧ d can be established.

  Another aspect of the present invention is a component suction that picks up a component mounted on a circuit board from a component storage portion formed on a base tape of a component supply tape by sucking it onto a component suction surface of a component suction nozzle by the action of negative pressure. In the method, the base tape is provided with an enlarged portion where a side wall of the component storage portion extends outside the component storage portion above the component storage portion, and the component storage is performed in at least one direction of the opening of the expansion portion. When a component suction nozzle having a component suction surface having a dimension that is longer than the width of the non-enlarged portion of the portion and shorter than the width of the opening of the enlarged portion is used to take out the component, the upper end surface of the base tape More specifically, the present invention relates to a component suction method, wherein the component suction surface is further lowered to reach the inside of the enlarged portion, and the component is sucked and taken out from the component storage portion.

  In the component suction method described above, the difference in height between the upper end surface of the base tape and the upper end surface of the component is d in a state where the component is stored in the component storage unit, and the component storage unit from the upper end surface of the base tape The relationship of f ≧ e ≧ d can be established, where e is the amount by which the component suction surface descends into the enlarged portion, and f is the depth of the enlarged portion from the upper end surface of the base tape.

  In each of the component suction methods described above, the descending amount of the component suction surface from the upper end surface of the base tape into the component storage area can be about 0.2 mm. The component may be a chip component having a substantially rectangular surface with sides of approximately 2 mm or less. Furthermore, the opening width of the suction hole in any one direction on the component suction surface can be about 50% or less of the length of the component suction surface in the same direction.

  According to still another aspect of the present invention, a component supplied to the component supply unit is picked up and taken out by a component suction nozzle under the action of negative pressure, and the component is transported and mounted at a circuit board mounting position regulated and held. The component mounting method according to any one of the above, wherein when the component is taken out by the component supply unit, the component adsorption method according to any one of the above is used.

  Still another aspect of the present invention includes a component supply unit that continuously supplies components stored in a component storage unit of a component supply tape, and a mounting head that takes out components from the component supply unit and mounts them on a circuit board. A robot that transports the mounting head, a substrate holding unit that carries in and holds the circuit board, and a control unit that controls the overall operation, and uses a component suction nozzle mounted on the mounting head A component mounting apparatus that takes out a component from the component supply unit by air suction action and mounts the component at a mounting position of a circuit board by air blowing action, wherein the component suction nozzle is an opening of the component storage unit The component mounting apparatus includes a component suction surface having a dimension longer than the width of the opening in at least one direction.

  According to still another aspect of the present invention, there is provided a long base tape in which a plurality of component storage portions are continuously formed at equal intervals along a longitudinal direction, and the component storage portion is attached to the base tape. A component supply tape configured to sequentially supply the components stored in the component storage unit to the component mounting apparatus, the component storage unit comprising: Further, the present invention relates to a component supply tape characterized in that an enlarged portion is provided above the component storage portion so that a side wall of the component storage portion spreads outside the component storage portion and opens into the base tape.

  The enlarged portion includes a stepped portion formed near the upper end surface of the base tape of the component storage portion, an expanded portion that expands from the component storage portion toward the upper end surface of the base tape, the component storage portion, and the It can be formed by any of the chamfered portions provided in the connecting portion of the base tape. The component storage portion can be formed by either a punched portion obtained by punching the base tape or an embossed portion obtained by embossing the base tape.

  By implementing the present invention, it is no longer necessary to downsize the component suction surface of the nozzle for sucking even small components, and a component suction nozzle that is easy to process and excellent in strength is used. This makes it possible to mount small parts.

  A component suction method according to a first embodiment of the present invention will be described with reference to the drawings. Fig.1 (a)-(d) has shown the outline | summary of the components adsorption | suction method concerning this Embodiment. In each figure, the nozzle 1 that descends from above facing the component 10 has a component suction surface 6 having a width a. On the other hand, the width of the corresponding opening of the component storage portion 23 of the base tape 21 located below is b, and the corresponding width of the component 10 is c. The difference in height between the upper end surface AA of the base tape 21 and the upper end surface of the component 10 is assumed to be d. At the time shown, the cover tape 22 of the component supply tape 20 has already been peeled off from the base tape 21.

  In the component suction method according to the present embodiment, there is a relationship of a> b> c between the widths a, b, and c described above. It is assumed that there is an equivalent relationship with respect to the width in the direction perpendicular to the drawing. For this reason, as for each area, similarly, the component suction surface 6 has an area larger than the opening area of the component storage portion 23, and the opening area is larger than the surface area of the component 10. That is, if the component storage portion 23 and the nozzle 1 are in a normal positional relationship, the outer peripheral edge portion of the component suction surface 6 is positioned outside the opening edge portion of the component storage portion 23.

  FIG. 1B shows a state where the nozzle 1 is lowered with respect to FIG. 1A and the component suction surface 6 is in contact with the upper end surface AA of the base tape 21. In the prior art, the height at which the component suction surface 6 is in contact with the upper end surface AA is the bottom dead center of the nozzle 1, and it has been studied how to suck the component 10 at this position. It is as follows.

  On the other hand, in the present embodiment, the component suction surface 6 of the nozzle 1 is pushed further over the upper end surface AA of the base tape 21 and further downward of the component storage portion 23, as shown in FIG. In this way, the component suction surface 6 comes into contact with the component 10 or descends until reaching a distance just before the contact, and reaches the bottom dead center of the nozzle 1. Thereby, in the period from FIG. 1B to FIG. 1C, the periphery of the tape portion forming the opening of the component storage portion 23 as shown in FIG. The surroundings ”are pressed by the component suction surface 6 and deformed. This deformation is indefinite, and the periphery of the component storage unit 23 is crushed and dents or wavy.

  Generally, a soft resin such as polystyrene is used as the material of the base tape 21, and the base tape 21 has a flexibility that can be sufficiently deformed by a crushing action by the component adsorption surface 6. Further, since the tip portion of the nozzle 1 forming the component suction surface 6 is made of a hard material such as industrial diamond, there is no possibility that the tip portion is damaged by crushing the component storage portion 23. Since the atmospheric air can enter from the irregularly deformed portion in the state where the component storage portion 23 is crushed, when the negative pressure indicated by the broken arrow 16 acts through the air passage 15, The component 10 can be easily sucked by the suction action of the component suction surface 6 in the close position. Thereafter, as shown in FIG. 1 (d), the nozzle 1 is lifted while the component 10 is sucked and held by the action of the negative pressure, and is conveyed toward the component mounting position.

  In the above description, when the pushing amount (intrusion amount) of the component suction surface 6 from the upper end surface AA of the base tape 21 into the region before the deformation of the component storage portion 23 is e, the upper end surface A- The relationship between the height difference d between A and the upper end surface of the component 10 was d ≧ e. In another aspect of the present embodiment, it is possible to further lower the nozzle 1 so that e ≧ d. At this time, after the nozzle 1 abuts against the component 10, it can be pressed further, and the component suction can be performed more reliably. When a component is pressed with a conventional nozzle having a narrow suction surface, the component may be unstable, such as tilting. However, in the nozzle 1 according to the present embodiment, the suction surface 6 is smaller than that of the conventional device. Therefore, even when pressing further on such a component, it can be stably performed. When e ≧ d, the bottom of the component storage unit 23 is deformed and pushed down to some extent by the pressing by the component suction surface 6, but this deformation is applied to the component supply device 30 (see FIG. 8) that supports the base tape 21. Allowable clearance is provided. The component 10 can also be sucked when d> e, that is, when the component suction surface 6 does not contact the upper end surface of the component 10 and approaches it.

  2 (a) and 2 (b), the nozzle 1 having the component suction surface 6 having an area larger than the opening area of the component storage unit 23 is used, and the punching-type component storage unit 23 is used instead of the embossed unit. A situation in which a similar pushing operation is performed on the base tape 21 is shown. In the figure, the thickness of the base tape 21 is 0.6 mm, the difference d in the height of the upper end surface of the component 10 relative to the upper end surface AA of the base tape 21 is 0.15 mm, and the pushing amount e by the component suction surface 6 at this time is About 0.15 mm. The punched base tape 21 made of paper does not undergo complicated deformation unlike the plastic embossed portion 23 when pressed. Instead, the periphery of the component storage portion 23 of the base tape 21 is compressed and deformed by the pressing action of the component suction surface 6 as illustrated. Since the original paper has a low density, this level of compression is easy. Further, the outside air can be introduced into the component storage portion 23 even in the pressed state due to the air permeability of the paper itself. At this time, unlike the prior art, the component suction surface 6 is in contact with or close to the component 10, so the suction effect of the component 10 due to the negative pressure acts more strongly and enables suction. Also in this aspect, by making the relationship e ≧ d, the component suction surface 6 can be pressed against the component 10 to ensure component suction.

  According to the experiments conducted by the inventors of the present application, the base tape 21 provided with either the embossed type or the punched type component storage unit 23 has no adverse effect on the component suction operation due to the deformation of the component storage unit 23. In addition, since the effect of pressing the component 1 by the nozzle 1 can be obtained, the defect rate at the time of component removal can be made equal to or less than the component extraction method according to the prior art shown in FIG.

  As described above, when the pushing amount e of the nozzle 1 is in the relationship of e ≧ d between the height difference d between the component 10 and the base tape 21 (see FIG. 1a), The impact load is applied to the component 10 at the moment when the component suction surface 6 of the nozzle comes into contact with the end surface. However, since the endurance load of the component 10 is generally about twice that of the impact load, even if the impact load is applied, the component 10 does not break. Further, since the connecting portion 2 (see FIG. 6A) at the top of the nozzle 1 is supported via a spring (not shown) in the mounting head 53, the bottom dead center of the nozzle 1 is higher than the upper end surface of the component 10. Even if the height is set low, the spring is only compressed after the nozzle 1 comes into contact with the component 10, and this does not cause the component 10 to break.

  In relation to this, in the present embodiment, there is an advantage that the descending speed of the nozzle 1 descending for component adsorption can be increased. That is, when the nozzle 1 is lowered, the component suction surface 6 contacts the upper end surface AA of the base tape 21 and then crushes the component storage portion 23. Since this crushing absorbs the descent energy of the nozzle 1 and performs a buffering action, even if the descent speed of the nozzle 1 is increased, the effect of reducing the impact when contacting the component 10 can be obtained. An increase in the lowering speed of the nozzle 1 can lead to a merit of shortening the machining cycle.

  FIGS. 1 and 2 show an example in which the rectangular component 10 is sucked by the rectangular nozzle 1, but both the component 10 and the nozzle 1 have other shapes such as a circle, an ellipse, and a polygon. Can do the same. For example, if the component 10 is circular, the component storage portion 23 of the base tape 21 is also circular. At this time, the component storage is performed by using the nozzle 1 having the component suction surface 6 having a diameter larger than the diameter of the component storage portion 23. By pressing the periphery of the opening of the portion 23, the component suction surface 6 can enter the region before deformation of the component storage portion 23 and suck the component.

  Further, in the above description, regarding the width (a) of the component suction surface 6 and the opening width (b) of the component storage portion 23, the same relationship is obtained in the direction perpendicular to the drawing in addition to the front surface displayed in each drawing. I have been there. In this case, the periphery of the component suction surface 6 protrudes to the outside over the entire periphery of the opening of the component storage portion 23, but the application of the present embodiment is not limited to this. That is, when the component suction surface 6 protrudes outside the component storage portion 23 at one of the opposite sides (a> b) and the component suction surface 6 is shorter than the component storage portion 23 at the other opposite side (a <b However, the present embodiment can be applied. More generally, it is possible to use the component suction surface 6 having a dimension longer than the width of the opening in at least one direction of the opening of the component storage portion 23. In this case, the pressing action around the component storage portion 23 by the component suction surface 6 occurs in at least one direction.

  The present embodiment includes a component mounting apparatus and a component mounting method that use the component suction method in addition to the component suction method described above.

  Next, a component suction method according to a second embodiment of the present invention will be described with reference to the drawings. The present embodiment relates to a component suction method in which a part having a relatively large area that can receive the component suction surface 6 is provided in a part of the component storage unit 23 to perform component suction.

  In FIG. 3A, the component storage portion 23 formed on the base tape 21 is provided with an enlarged portion 24 composed of a stepped portion with a side wall extending outside the component storage portion in a part above it. The enlarged portion 24 opens in the base tape 21. The enlarged portion 24 forms a part of the component storage portion 23. The depth f of the enlarged portion 24 with respect to the upper end surface AA of the base tape 21 has a relationship of f ≧ d with respect to the difference d between the upper end surface AA and the upper end surface of the component 10. Further, the opening width g of the stepped portion 24 has a relationship of g> a with respect to the corresponding width a of the component suction surface 6. Although not shown in the drawing, the same relationship is assumed in the direction perpendicular to the drawing. Alternatively, the same relationship is assumed when the component storage portion and the enlarged portion are circular.

  In the example shown in FIG. 3A, since the component storage unit 23 is formed by embossing a plastic base tape 21, it is easy to form the enlarged portion 24 by changing the embossing die. . Also, in the punching-type base tape 21 in which the paper base tape 21 is punched to form the component storage portion 23, the enlargement portion 24 is pressed with a mold and plastically deformed simultaneously with the punching or in another process. Formation of the portion 24 is easy.

  As shown in FIG. 3A, the component suction surface 6 at the tip of the nozzle 1 is provided by providing the enlarged portion 24 that satisfies the relationship of f ≧ d and g> a above the component storage portion 23. Can descend into the enlarged portion 24 without contacting any of the base tape 21, the component storage portion 23, and the enlarged portion 24, and can abut against the component 10 by adsorbing the component under the action of negative pressure. Can be taken out. Since the component 10 is kept positioned and held in the component storage unit 23 in exactly the same manner as the conventional component storage unit 23, the component 10 does not move even if the enlargement unit 24 is provided. The component 10 can be sucked and taken out.

The distance e (see FIG. 3A) during which the component suction surface 6 descends from the upper end surface AA of the base tape 21 to the bottom dead center position is the distance between the upper end surface AA and the component upper end surface. A relationship of e ≧ d can be established between the difference d and the difference d as shown in the first embodiment. Including the relationship with the depth f of the enlarged portion 24 described above, the relationship f ≧ e ≧ d can be obtained. Among these, when d = e, the component suction surface 6 contacts the upper end surface of the component 10, and when e> d, the component 10 is further pressed by the component suction surface 6 to make the suction more reliable. it can. However,
The state of d> e, that is, even if the component suction surface 6 does not necessarily contact the upper end surface of the component 10, the component 10 can be sucked by approaching.

  FIGS. 3B and 3C show an alternative embodiment of the enlarged portion 24, and FIG. 3B is configured by an expanded portion that spreads upward in a morning glory shape toward a part of the component storage portion 23. FIG. FIG. 3C shows an enlarged portion 24b formed by a chamfered portion of the connecting portion between the component storage portion 23 and the base tape 21, respectively. In any case, most parts of the component storage portion 23 function to position and hold the component 10 as usual, and an enlarged portion that can receive the component suction surface 6 is provided in an upper part into which the component suction surface 6 is pushed. . The enlarged portions 24a and 24b are preferably dimensioned sufficiently to avoid contact with the component suction surface 6 descending into the component storage portion 23.

  In addition, in FIG.3 (c), although the enlarged part 24b is formed by the linear chamfering, this may be a curved chamfering. 3A, the relationship of f ≧ d and g> a is established among the dimensions of the component suction surface 6, the base tape 21, and the enlarged portion 24, or in FIGS. 3B and 3C. Although it is preferable that the component suction surface 6 is dimensioned so as not to contact the base tape 21 and the enlarged portions 24a and 24b, intermediate dimensioning that is a compromise with the first embodiment may be employed. Is possible. That is, an enlarged portion enlarged by a slight amount is provided above the component storage portion 23 in accordance with the requirements such as dimensional constraints of the base tape 21 and the component suction surface 6, and a certain amount of pressing by the component suction surface 6 is performed at this enlarged portion. The component suction surface 6 comes into contact with the enlarged portion at the time of the remaining push-in, and the component is pushed and widened to enter the region before deformation of the component storage portion 23 to suck the component. You can also. If the crushing around the component storage unit 23 by the component suction surface 6 is completely eliminated or a fixed amount is eliminated, noise and vibration generated during the crushing operation can be reduced.

  In the above description, the enlarged portions 24, 24a, and 24b are provided over the entire circumference of the component storage unit 23. However, the application of the present embodiment is not limited to this, and any one of the component storage units 23, for example. An enlarged portion may be provided on one side, and the other portion may be configured to press the component storage portion 23 with the component suction surface 6.

  In the present embodiment, in addition to the component suction method using the component supply tape including the component storage portion 23 having the enlarged portions 24, 24a, and 24b described above, the component mounting method using the component suction method, and FIG. It also includes a component supply tape 20 that includes a component storage portion 23 having enlarged portions 24, 24a, and 24b as shown in FIGS.

  Next, a component mounting method according to a third embodiment of the present invention will be described with reference to the drawings. This embodiment uses a nozzle having a size larger than the opening of the component storage section shown in the first embodiment, or a nozzle that can enter the enlarged section of the component storage section shown in the second embodiment. The present invention relates to a component mounting method for performing mounting. FIG. 4A shows the component suction surface 6a (bottom view) of the nozzle 1a used in the component mounting method according to the present embodiment, and FIG. 4B is used in the conventional technology corresponding to this. The component suction surface 6b of the nozzle 1b is shown.

  4A, the component suction surface 6a of the nozzle 1a has outer dimensions of X = 1.7 mm and Y = 1.2 mm, and a substantially H-shaped suction hole 7b is opened therein. The opening size of the suction hole 7b is x = 0.80 mm and y = 0.55 mm. According to this, the ratio x / X of the length of the component suction surface 6a and the length of the opening of the suction hole 7b in the horizontal direction of the nozzle 1a is 0.47, and the ratio y / Y of both lengths in the vertical direction is 0.46. It becomes.

  On the other hand, in the conventionally used nozzle 1b shown in FIG. 4B, the external dimensions of the component suction surface 6b in which the suction holes 7b having the same dimensions are opened are X = 1.00 mm and Y = 0.80 mm. is there. According to this, the ratio x / X of the horizontal length of the suction hole 7b to the component suction surface 6b is 0.80, and the ratio y / Y in the vertical direction is 0.69.

  That is, conventionally, the ratio of the suction hole opening length in the same direction to the length in any one direction of the component suction surface was about 0.70 to 0.80, whereas in the present embodiment, this ratio is about 0.50 or less. Can be significantly reduced. In the nozzle 1b according to the prior art, the size of the component suction surface 6b is made as small as possible so as not to interfere with the component storage hole 23, and the suction hole 7b is made as large as possible in order to secure the component suction force therein. there were. On the other hand, according to the present embodiment, there is no restriction on interference with the component storage hole 23 by the component suction surface 6a, and the area of the component suction surface 6a can be increased. The dimensional ratio with respect to the hole 7b can be greatly reduced.

  As a result, in the conventional nozzle 1b shown in FIG. 4B, the distance from the suction hole 7b to the edge of the component suction surface 6b is only 0.1 mm in the X direction and 0.125 mm in the Y direction. In the nozzle 1a of the present embodiment shown in a), these can be increased more than twice to 0.25 mm and 0.325 mm, respectively. The increase in the distance from the suction hole 7b to the edge of the component suction surface 6a not only increases the strength of the nozzle 1a when the component suction surface 6a is caught in a foreign object, but also when the component 10 is sucked. This produces an effect of increasing the seal width of the negative pressure seal formed between the suction surface 6a (the width in which the component 10 overlaps the component suction surface 6a). According to the experiments conducted by the inventors of the present application, the effect of increasing the negative pressure seal width of the nozzle 1a according to the present embodiment is also added, and the parts are held compared with the conventional nozzle 1b shown in FIG. As a result, the force was increased about 4 times, and the variation in the holding force was reduced to about 1/3.

  The nozzle 1a shown in FIG. 4A is merely an example, and the ratio of the opening length of the suction hole in the same direction to the length of any one direction of the component suction surface in the nozzles of other shapes and dimensions is about By reducing it to 0.50 or less (that is, by making the component suction surface relatively larger than the suction holes), the same effect can be obtained. As the shape of the opening of the suction hole 7b, various shapes such as an X shape, a king shape, a circle, and an oval are conceivable in addition to the H shape. Further, even when the component suction surface is formed to be relatively large, by applying the component suction method shown in the first and second embodiments, there is no problem of component suction during component suction. .

  As mentioned above, although the component adsorption | suction method and component mounting method of each embodiment concerning this invention were described, application of this invention is not limited to each embodiment described so far. For example, the component mounting apparatus shown in FIG. 5 is of a type that includes a robot that moves the mounting head in the XY directions. A number of nozzles are arranged circumferentially around the index and rotated intermittently. The present invention can be similarly applied to a rotary type component mounting apparatus that sequentially takes out from component mounting to mounting. In addition, the nozzle shown in FIG. 6 has a form that can be replaced according to the part to be sucked. For example, a plurality of nozzles are arranged radially, and an appropriate nozzle is selected by rotation according to the part to be sucked. The present invention can also be applied to the format used.

  The component mounting apparatus, component suction method, and component mounting method according to the present invention can be widely used in the industrial field of component mounting.

It is explanatory drawing which shows the outline | summary of the components adsorption | suction method of embodiment concerning this invention. It is explanatory drawing which shows the different aspect of the components adsorption | suction method shown in FIG. It is explanatory drawing which shows the outline | summary of the components adsorption | suction method of other embodiment concerning this invention. It is a bottom view which shows each component adsorption | suction surface of the nozzle (a) which can be used in embodiment concerning this invention shown in FIG.1 and FIG.3, and the nozzle (b) by a prior art. It is a perspective view which shows the outline | summary of a component mounting apparatus. It is the side view (a) which shows the outline | summary of a component adsorption nozzle, a perspective view (b), and a bottom view (c). It is a perspective view which shows the structure of a component supply tape. It is a perspective view which shows the outline | summary of a components supply apparatus. It is explanatory drawing which shows the outline | summary of the components adsorption | suction method in a prior art. It is explanatory drawing which shows the outline | summary of the other component adsorption | suction method in a prior art.

Explanation of symbols

1. 1. Part suction nozzle, 2. connecting part; 3. Adsorption part, 4. flange, Central axis, 6. 6. Component adsorption surface Adsorption hole, 8. 8. Upper end surface Top opening, 10. Parts, 12. 12. upper cylindrical part; Lower cylindrical part, 14. 15. inverted frustum, Air passage, 17. Groove, 18. Vents, 20. 21. parts supply tape Base tape, 22. Cover tape, 23. 24. Parts storage part (embossed part) Reel, 30. Component supply device, 50. Component mounting apparatus, 51. Component supply unit, 52. Circuit board, 53. Mounting head, AA. The top surface of the base tape.

Claims (14)

A component suction method for picking up a component mounted on a circuit board from a component storage portion opened in a base tape of a component supply tape by sucking it to a component suction surface of a component suction nozzle by the action of negative pressure,
Using a component suction nozzle having a component suction surface having a dimension longer than the width of the opening in at least one direction of the opening of the component storage portion,
When taking out the component, the component suction surface is moved down beyond the upper end surface of the base tape to reach the inside of the component storage portion, and the component is sucked to the component suction surface and taken out from the component storage portion. Part adsorption method characterized by the above.   When taking out the component, pressing the entire periphery of the opening of the component storage portion or a part thereof with the component suction surface to deform the component suction surface, and pushing the component suction surface into the region before the deformation of the component storage portion. The component suction method according to claim 1, wherein the component suction method is a feature.   In a state where the component is stored in the component storage portion, the difference in height between the upper end surface of the base tape and the upper end surface of the component is d, and the height difference between the upper end surface of the base tape and the region before the deformation of the component storage portion is reached. The component suction method according to claim 1, wherein a relationship of e ≧ d is established, where e is a descending amount of the component suction surface. A component suction method for picking up a component mounted on a circuit board from a component storage portion formed on a base tape of a component supply tape by sucking it to a component suction surface of a component suction nozzle by the action of negative pressure,
An opening is provided in the base tape to provide an enlarged portion where the side wall of the component storage unit extends outside the component storage unit above the component storage unit,
A component suction nozzle having a component suction surface having a dimension that is longer than the width of the non-enlarged portion of the component storage portion and shorter than the width of the opening portion of the enlarged portion in at least one direction of the opening of the enlarged portion. And
When picking up the component, the component suction surface is lowered until it reaches the inside of the enlarged portion beyond the upper end surface of the base tape, and the component is sucked and taken out from the component storage portion. Method.   The height difference between the upper end surface of the base tape and the upper end surface of the component is d in a state where the component is stored in the component storage portion, and the component enters the enlarged portion of the component storage portion from the upper end surface of the base tape. 5. The component according to claim 4, wherein a relationship of f ≧ e ≧ d is established, where e is a descending amount of the suction surface and f is a depth of the enlarged portion from the upper end surface of the base tape. Adsorption method.   The component according to any one of claims 1 to 5, wherein a descending amount of the component suction surface from the upper end surface of the base tape into the region of the component storage portion is about 0.2 mm. Adsorption method.   The component storage portion is formed by either a punched portion obtained by punching the base tape or an embossed portion obtained by embossing the base tape. The component adsorption | suction method as described in any one of Claims 6.   The component adsorption method according to claim 1, wherein the component is a chip component having a substantially rectangular surface each having a side of about 2 mm or less.   The opening width of the suction hole in any one direction on the component suction surface is about 50% or less of the length of the component suction surface in the same direction. The part adsorption | suction method as described in one.   In the component mounting method in which the component supplied to the component supply unit is picked up and taken out by a component suction nozzle by the action of negative pressure, and the component is transported and mounted at a circuit board mounting position regulated and held, the component supply unit 10. A component mounting method using the component adsorption method according to claim 1 when taking out a component. A component supply unit that continuously supplies components stored in a component storage unit of a component supply tape, a mounting head that takes out components from the component supply unit and mounts them on a circuit board, and a robot that conveys the mounting head; A circuit board holding unit that carries in and holds the circuit board and a control unit that controls the entire operation, and from the component supply unit by air suction using a component suction nozzle mounted on the mounting head. In a component mounting apparatus that takes out a component and mounts the component on the mounting position of the circuit board by air blowing action,
The component mounting apparatus, wherein the component suction nozzle includes a component suction surface having a dimension longer than the width of the opening in at least one direction of the opening of the component storage portion. A long base tape in which a plurality of component storage portions are continuously formed at equal intervals along the longitudinal direction, and a component that is affixed to the base tape and covers the component storage portion and holds the components stored inside A component supply tape configured to sequentially supply the components stored in the component storage unit to the component mounting device.
The component supply tape according to claim 1, wherein the component storage portion includes an enlarged portion above the component storage portion in which a side wall of the component storage portion spreads outside the component storage portion and opens into the base tape.   The enlarged portion is a stepped portion formed near the upper end surface of the base tape of the component storage portion, an expanded portion that expands from the component storage portion toward the upper end surface of the base tape, the component storage portion, and the The component supply tape according to claim 12, wherein the component supply tape is formed by any one of chamfered portions provided in a connecting portion of the base tape. The component storage portion is formed by either a punched portion obtained by punching the base tape or an embossed portion obtained by embossing the base tape. The component supply tape according to claim 13.

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