JP2006120914A - Component suction nozzle, component mounting apparatus, and component mounting method - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a component suction nozzle for securing component suction force without dashing off adjacent components by interference when mounting components. <P>SOLUTION: The size of a component suction surface 6 in the component suction nozzle 1 is enlarged relatively to a component 10, and an already mounted adjacent component 10z is held down from the above when mounting components at one portion of the enlarged component suction surface 6, thus avoiding the knocking down of the adjacent component 10z. The size of a suction hole 7 open on the component suction surface 6 is made relatively smaller than that of the component suction surface 6, the leakage of negative pressure from the suction hole 7 is avoided even if a suction position deviates, and a gap negative pressure effect is utilized positively. In this case, the ratio (opening ratio) of the opening area of the suction hole 7 to the area of the component suction surface 6 is set to 0.3 or smaller, preferably 0.2 or smaller. And the ratio of the length of the opening of the suction hole 7 to that of the component suction surface 6 in an arbitrary direction on the component suction surface 6 is set to 0.5 or smaller. <P>COPYRIGHT: (C)2006,JPO&NCIPI

Description

  The present invention relates to a component mounting apparatus and a component mounting method for taking out a component supplied to a component supply unit and mounting the component on a mounting position of a circuit board. More specifically, the present invention relates to a component suction nozzle that separates and mounts the component using positive pressure after the component is sucked and taken out from the component supply tape using negative pressure, and the component suction nozzle The present invention relates to a component mounting apparatus and a component mounting method for mounting a component using the above.

  An example of a component mounting apparatus is shown in FIG. In the figure, a component mounting apparatus 50 includes a component supply unit 51 that supplies components to be mounted, a mounting head 53 that takes out components from the component supply unit 51 and mounts them on a circuit board 52, and conveys the mounting head 53 to a predetermined position. A robot 54, a substrate holding device 56 that carries in and holds the circuit board 52, and a control device 57 that controls the overall operation are provided. A component supply device 30 capable of sequentially supplying the components 10 is attached to the component supply unit 51.

  In the component mounting apparatus 50 configured as described above, in order to take out the supplied component 10 and mount it on the circuit board 52, a component suction nozzle (hereinafter referred to as "nozzle") that sucks and holds the component using negative pressure. 1) is generally used. In the example of the component mounting apparatus 50 shown in FIG. 8, four nozzles 1 are mounted on the mounting head 53, and each nozzle 1 performs from taking out the component 10 to mounting.

  9A to 9C show an example of the nozzle 1. In each figure, the nozzle 1 has a connecting portion 2 with the mounting head 53 located above the longitudinal axis, and a suction portion 3 also located below. Between the upper connecting part 2 and the lower suction part 3, two flanges 4 into which an attaching / detaching tool (not shown) is inserted when attaching / detaching the nozzle 1 to / from the mounting head 53 are provided. Depending on the shape, size, etc. of the component 10 to be picked up, the nozzle 1 mounted on the mounting head 53 can be replaced using the above-mentioned detachable tool. A component suction surface 6 orthogonal to the longitudinal axis (center axis) 5 of the nozzle 1 is formed at the lower end of the suction portion 3, and this component suction surface 6 is brought into contact with the upper end surface of the component 10 during suction.

  A suction hole 7 (see FIG. 9C) is opened in the component suction surface 6 of the nozzle 1, and an upper opening 9 formed in the suction hole 7 and the upper end surface 8 of the connecting portion 2 (see FIG. 9A). Are fluidly connected to each other via an air passage 15 (partially indicated by a broken line) formed in the nozzle 1. With the nozzle 1 mounted on the mounting head 53, the component 10 is sucked to the component suction surface 6 by using the negative pressure supplied from the mounting head 53 when the component is sucked, and is similarly supplied from the mounting head 53 when the component is mounted. The component 10 is separated from the nozzle 1 and mounted using positive pressure.

  As shown in FIG. 9B, in the suction portion 3, a lower cylindrical portion 13 extends from the upper cylindrical portion 12, and an inverted truncated pyramid portion 14 extends further downward from the lower cylindrical portion 13 to form a rectangular shape at the tip. It is connected to the component adsorption surface 6. In the example shown in the bottom view of FIG. 9C, the suction hole 7 has an approximately X-shape and is open. The shape of the suction hole 7 is circular (one) according to the shape of the component 10 and the like. Various shapes such as an oval shape, a star shape, a king shape, and an H shape are conceivable. In general, if the negative pressure is the same, a larger suction force can be obtained as the opening area of the suction hole 7 is larger. However, if the opening area of the suction hole 7 is too large with respect to the component 10, the component 10 may be sucked into the suction hole 7 or fall off and cause mounting failure. In order to avoid this, various opening shapes that make it difficult to suck the component 10 while making the opening area as large as possible have been considered (for example, see Patent Document 1).

  Next, FIG. 10 shows an example of the component supply tape 20 that continuously supplies components to the component mounting apparatus 50. In the figure, the component supply tape 20 includes a base tape 21 that houses the component 10 and a cover tape 22 that covers the base tape 21. The base tape 21 is formed with a component storage portion 23 composed of a concave embossed portion formed by embossing at equal intervals in the longitudinal direction. The component 10 is stored in the component storage portion 23 and is covered and protected by a cover tape 22 attached to the base tape 21. The cover tape 22 prevents the component 10 from falling off the component storage unit 23 or being displaced in the component storage unit 23 until it is peeled off from the base tape 21 later. The component supply tape 20 configured as described above is wound around the reel 25 and loaded into the component supply device 30 (see FIG. 8).

  FIGS. 11A to 11C show an operation when the nozzle 1 sucks the component 10. The nozzle 1 is lowered with respect to the component 10 whose cover tape 22 has been peeled off immediately before the component removal position and the upper part is opened (FIG. 11A), and the component suction surface 6 at the lower end of the nozzle is placed on the component 10. It is made to contact | abut to an end surface (FIG.11 (b)). At this time, a negative pressure indicated by a broken line arrow 16 acts on the air passage 15 of the nozzle 1 to suck the component 10 on the component suction surface 6. At this time, the component suction surface 6 descends beyond the upper end surface AA of the base tape 21, descends by a distance d into the component storage portion 23, and contacts the component 10. The nozzle 1 that has sucked the component 10 is then lifted while holding the component 10 by the action of negative pressure, and moves to the component mounting position (FIG. 11C).

  FIGS. 12A and 12B show the operation when the component 10 that is attracted to the mounting position of the circuit board 52 is mounted by the nozzle 1 that has moved to the component mounting position. In FIG. 12A, the nozzle 1 that has moved to a predetermined mounting position is lowered toward the circuit board 52. At this time, there may be another component 10z that has already been mounted adjacent to a predetermined mounting position of the circuit board 52 as illustrated. If the mounting is in a normal state, as shown in FIG. 12B, the lower end surface of the component 10 that the nozzle 1 descends and sucks is brought into contact with the circuit board 52, and at the same time through the air passage 15 of the nozzle 1. Then, by supplying positive pressure air indicated by a broken-line arrow 19, the component 10 is separated from the component suction surface 6 of the nozzle 1, and the mounting of the component 10 is completed. A cream solder layer 58 is formed in advance on the surface of the circuit board 52, and the component 10 is restrained and fixed to this layer. The circuit board 52 that has finished mounting the components is transported together with the mounted components to a reflow process so that the cream solder layer 58 is melted, and the component 10 is soldered to the circuit board 52 by subsequent cooling.

  However, at the time of component mounting, as shown in FIG. 12 (c), a part of the component suction surface 6 of the nozzle 1 has already been mounted due to a positional shift between the nozzle 1 and the component 10 at the time of component suction. Contacting the corners of the adjacent component 10z can occur. The adjacent component 10z fixed only by the adhesiveness of the cream solder layer 58 is sputtered off by the impact at the time of this contact, so that the circuit board 52 can be defective due to the lack of components to be mounted.

  Further, as shown in FIG. 12 (d), when a part of the suction hole 7 of the nozzle 1 protrudes to one side of the part 10 due to the position shift at the time of part suction, an air passage for separating the part 10 is used. When the positive pressure air indicated by the broken line arrow 19 is supplied to FIG. 15, the amount of air blown in the protruding direction increases, which may cause a problem that the adjacent component 10 z is blown away.

  With the recent demands for multi-functionalization, miniaturization, and weight reduction of electronic devices in the market, the components mounted on the electronic devices have become smaller, and at the same time, the component mounting density on the circuit board has increased. From the viewpoint of component miniaturization, for example, a chip component having a side of about 0.5 mm has been used. If the component is miniaturized, the nozzle 1 is also miniaturized. For this reason, the suction force at the nozzle 1 is insufficient, and the component 10 tends to fall off due to slight vibrations or wind pressure during conveyance or the like, resulting in loss. Further, from the viewpoint of increasing the mounting density, the gap between components mounted on the circuit board has been reduced to about 0.1 to 0.2 mm. As described above, there is a tendency that the nozzle 1 easily interferes with the adjacent component 10z and jumps off.

In order to deal with the above situation, the basic design concept at the time of nozzle development considered in the prior art was as follows.
1. The part suction surface of the nozzle is made as small as possible in accordance with the part to avoid interference with the mounted adjacent parts.
2. The opening area of the nozzle suction hole is made as large as possible to ensure a sufficient suction force even for small parts.

While it is basically a contradictory requirement to make the component suction surface 6 of the nozzle 1 as small as possible while increasing the opening area of the suction hole 7 opening in the component suction surface 6, conventionally, it is along the above direction. Efforts have been made to find solutions. However, as part miniaturization further progresses, the challenge in this direction is approaching its limit, and some breakthrough measures are necessary in consideration of processing accuracy, ensuring the strength of the nozzle tip, and profitability. .
JP 2002-292587

  As described above, the present invention solves the above-described problems while reducing the size of components and increasing the component mounting density of circuit boards, and narrows the distance between adjacent components without causing the adjacent components to jump off due to interference during mounting. This makes it possible to increase the mounting density, as well as to ensure the strength of the component suction surface of the nozzle and to provide sufficient suction force at the same time without imposing a burden on precision processing, as well as component mounting It aims to provide a method.

  The present invention changes the conventional basic design concept described above by 180 degrees, and avoids the jumping of the adjacent component mounted by increasing the size of the component suction surface of the nozzle, and the suction hole that opens to the component suction surface This problem is solved by reducing the size of the component relative to the size of the component suction surface, and specifically includes the following contents.

  That is, a first aspect according to the present invention includes a connecting portion for connecting to a mounting head above the longitudinal axis, a suction portion including a component suction surface below the longitudinal axis, and between the connecting portion and the suction portion. An air passage that fluidly connects and opens to the suction hole of the component suction surface, and sucks the component onto the component suction surface using a negative pressure supplied from the mounting head via the air passage, A component suction nozzle that detaches the component from the component suction surface and mounts it at a mounting position of a circuit board using positive pressure supplied from a mounting head via the air passage, and has an opening area of the suction hole The component suction nozzle is about 30% or less of the area of the component suction surface. The opening area of the suction hole may be about 20% or less of the area of the component suction surface.

  In another aspect of the present invention, one suction hole of the component suction nozzle is opened at a substantially center of the component suction surface, and an opening width of the suction hole in an arbitrary direction on the component suction surface is the same in the same direction. The present invention relates to a component suction nozzle that is about 50% or less of the width of the component suction surface. Alternatively, when the component suction surface is formed in an elongated rectangular shape extending in one direction, a plurality of the suction holes can be opened along the one direction, and a total opening of the plurality of suction holes along the one direction. The width may be about 50% or less of the width in the same direction of the component suction surface.

  Still another aspect of the present invention includes a component supply unit that continuously supplies components, a mounting head that takes out components from the component supply unit and mounts them on a circuit board, a robot that transports the mounting head, a circuit, A substrate holding unit that carries in and holds a substrate, and a control unit that controls the overall operation, and a component is supplied from the component supply unit by an air suction action using a component suction nozzle mounted on the mounting head. A component mounting apparatus for mounting the component at a circuit board mounting position by air blowing action, wherein any of the component suction nozzles described above is used as the component suction nozzle About.

  Still another aspect according to the present invention provides a component suction nozzle having a suction hole having an opening area of about 30% or less with respect to the area of the component suction surface of the component suction nozzle. The present invention relates to a component mounting method characterized by taking out and mounting. The ratio of the opening area of the suction hole to the area of the component suction surface may be about 20% or less.

  According to still another aspect of the present invention, a part suction nozzle having a suction hole having an opening area of about 35% or less with respect to a suction face surface area of a part to be sucked is used to take out the part. The present invention relates to a component mounting method characterized by performing mounting.

  According to still another aspect of the present invention, when a component is mounted at a mounting position of a circuit board, the component is mounted while pressing another adjacent component already mounted on the circuit board from above by a component suction nozzle. It relates to a component mounting method. The pressing allowance of the other adjacent component by the component suction nozzle can be about 20% or more of the surface area of the surface of the other component facing the component suction nozzle.

  By implementing the component suction nozzle according to the present invention, it is not necessary to downsize the nozzle for sucking even a small component, and a component suction nozzle that is easy to process and excellent in strength can be obtained. It becomes possible to provide.

  In addition, by implementing the component mounting apparatus and component mounting method according to the present invention, it is possible to eliminate the problem of jumping off the mounted adjacent components at the time of mounting, and to improve the component mounting quality by making the component suction and holding more reliable. It is possible to increase productivity.

  The present invention aims to break the current situation by changing the concept of the conventional basic nozzle design concept. More specifically, firstly, the area of the component suction surface of the nozzle is increased, and interference with adjacent mounted components is actively attempted to be pressed down to avoid jumping (see the first embodiment). Form). Second, the suction force is ensured by relatively reducing the opening area of the suction hole that opens to the component suction surface of the nozzle to avoid leakage of negative pressure (second embodiment). .

  Prior to the description of each embodiment, the suction portion of the nozzle 1 that has been used conventionally will be described in detail with reference to the drawings. In the following description, the same reference numerals are used for the same components as those described in the background art section. However, these symbols represent general indications of the corresponding constituent elements, and suffixes such as a and b are attached to the specific constituent elements. For example, “nozzle 1” means a general nozzle, and when a suffix such as “nozzle 1a” is added, it means a specific nozzle 1a displayed in advance in a drawing or the like.

  FIGS. 13A and 13B illustrate nozzles that have been conventionally used. First, in the nozzle 1b shown in FIG. 13A, the dimensions of the component suction surface 6b are X = 1.00 mm, Y = 0.80 mm, and the H-shaped suction hole 7b has an opening size of x = 0.80 mm, y = 0.55. mm. In this state, the ratio x / X of the suction hole 7b in the horizontal direction to the component suction surface 6b is 0.80, the ratio y / Y in the vertical direction is 0.69, and the opening area of the suction hole 7b with respect to the area of the component suction surface 6b. The ratio (hereinafter referred to as “aperture ratio”) R is 0.39. The term “area of the component suction surface 6” in the present specification means a nominal area (X × Y) before subtracting the opening area of the suction hole 7 opening in the component suction surface 6. Yes.

  Next, in another example of the conventional nozzle 1c shown in FIG. 13B, a king-shaped suction hole 7c is opened in the component suction surface 6c. Here, the dimensions of the component suction surface 6c are X = 1.7 mm and Y = 1.2 mm, and the dimensions of the suction hole 7c are x = 1.35 mm and y = 0.90 mm. In this state, the ratio x / X of the suction hole 7c in the lateral direction to the component suction surface 6c is 0.79, the ratio y / Y in the vertical direction is 0.75, and the opening ratio R of the suction hole 7c to the component suction surface 6c is 0.41.

  As shown in the above example, in the conventional nozzle 1, the ratio of the length of the suction hole 7 to the length of the component suction surface 6 in an arbitrary direction within the surface of the component suction surface 6 is generally about 0.7 to 0.8, Further, the opening ratio R of the suction holes 7 in the component suction surface 6 occupies about 0.4 to 0.5. This is because the boundary of the suction hole 7 is extended to the vicinity of the edge of the component suction surface 6 and the opening area of the suction hole 7 is earned as much as possible. For this reason, in the example of the nozzle 1b shown in FIG. 13A, the minimum thickness dimension from the boundary of the suction hole 7b to the edge of the component suction surface 6b is reduced to 0.1 mm, causing a problem in strength and high. Processing accuracy is required.

  Next, let us look at the relationship between the conventionally used nozzle and the parts to be sucked. A nozzle 1b shown in FIG. 13A is conventionally used for adsorbing a component 10b (not shown) having a size of, for example, 1.0 mm × 0.5 mm. If the dimension of the component 10b is a horizontal a = 1.0 mm and the vertical b = 0.5 mm, the ratio X / a of the length of the component suction surface 6b to the length of the component 10b in the horizontal direction is 1.00, which is also the length in the vertical direction. The ratio Y / b is 1.60, and the ratio S / s of the area S of the component suction surface 6b to the surface area s of the component 10b is 1.60. Further, the ratio w / s of the opening area w of the suction hole 7b to the surface area s of the component 10b is 0.63.

  Similarly, in the example of the nozzle 1c shown in FIG. 13B, conventionally, a chip component 10c (not shown) having a size of 1.6 mm × 0.8 mm, for example, is adsorbed using the nozzle 1c. If the dimension of the component 10c is a horizontal a = 1.6 mm and the vertical b = 0.8 mm, the ratio X / a of the length of the component suction surface 6c to the length of the component 10c in the horizontal direction is 1.06, which is also the length in the vertical direction. The ratio Y / b is 1.50, and the ratio S / s of the area S of the component suction surface 6c to the surface area s of the component 10c is 1.59. Furthermore, the ratio w / s of the opening area w of the suction hole 7c to the surface area s of the component 10c is 0.65.

  As shown in the above example, in general, in the relationship between the conventional nozzle 1 and the component 10, the length of the component suction surface 6 is 1.0 to 1.6 times the length of the component 10, and in terms of area, the component suction surface 6 is equal to the component 10. It occupies about 1.6 times. Thus, it can be seen that the component suction surface 6 of the nozzle 1 generally has a size close to the size of the component 10 in order to avoid interference with adjacent components during mounting. The ratio of the opening area of the suction hole 7 to the surface area of the component 10 is 0.65 inside or outside.

  Hereinafter, a component suction nozzle according to a first embodiment of the present invention will be described with reference to the drawings. Fig.1 (a) has shown the component adsorption | suction surface 6a of the nozzle 1a concerning this Embodiment. The illustrated nozzle 1a is an alternative to the conventional nozzle 1b shown in FIG. 13 (a). As can be seen by comparing the two drawings, the nozzle 1a of the present embodiment has the same size and shape as the nozzle 1b. While having the suction holes 7b, the dimensions of the component suction surface 6a are expanded to 1.7 mm for X and 1.2 mm for Y. By using the enlarged nozzle 1a, it is possible to suck the chip component 10b (not shown) having the same size of 1.0 mm × 0.5 mm as the nozzle 1b.

  Despite adsorbing the same component 10b, the nozzle 1a according to the present embodiment is 1.5 times and 1.7 times larger than the conventional nozzle 1b in length and width, and 2.55 times in area. Yes. As a result, in terms of the relationship with the component 10b, the ratio S / s of the area S of the component suction surface 6a to the surface area s of the component 10b increases more than double from about 1.6 to 4.0. In consideration of interference with adjacent components due to the high density of component mounting, there has been no idea of mounting a chip component 10b of 1.0 mm × 0.5 mm using such a large nozzle 1a until now. It was. FIG.1 (b) has shown the example of the more specific dimension specification of the nozzle 1a.

  1 (a) and 1 (b), the ratio x / X of the length of the component suction surface 6a to the length of the opening of the suction hole 7b in the horizontal direction is 0.47, and the ratio y / Y is 0.46, and the aperture ratio R of the suction hole 7b with respect to the component suction surface 6a is 0.15. Compared to the conventional nozzle 1b, the relative ratio of the specifications regarding the suction holes 7b is reduced to about 2/3 in terms of length and to less than half in terms of area (that is, component suction to the suction holes 7b). The dimension of the surface 6a has increased.) As a result, the minimum wall thickness from the boundary of the suction hole 7 to the edge of the component suction surface 6 is increased by more than three times to 0.325 mm with respect to 0.1 mm of the nozzle 1b, and the strength of the component suction portion 6 is increased and the processing accuracy is increased. It also contributes to relaxed requirements.

  FIG. 2A shows an example of another nozzle 1d according to the present embodiment, and this nozzle 1d is an alternative to the conventional nozzle 1c shown in FIG. 13B. Comparing the two drawings, the nozzle 1d of the present embodiment is provided with the suction hole 7c having the same size and shape as the nozzle 1c, but the dimensions of the component suction surface 6d are 4.0 mm for X and 3.4 mm for Y. It has expanded to 2.4 times and 2.8 times, respectively, and the area has expanded to 6.7 times. By using the enlarged nozzle 1d, it is possible to suck the chip part 10d (not shown) having the same size of 1.6 mm × 0.8 mm as the nozzle 1c and the tantalum X part having a size of 3.5 mm × 2.5 mm. . FIG. 2B shows an example of more specific dimensions of the nozzle 1d, and each corner is provided with a curved surface drop.

  In the nozzle 1d shown in FIGS. 2A and 2B, the ratio x / X of the length of the component suction surface 6a to the length of the opening of the suction hole 7b in the horizontal direction is 0.34, and the length of both is also the same in the vertical direction. The ratio y / Y is 0.26, and the opening ratio R of the suction holes 7b with respect to the component suction surface 6a is 0.06. Compared with the corresponding conventional nozzle 1c, the relative ratio of the specifications regarding the suction holes 7c is reduced to 1/2 or less in terms of length and 1/4 or less in terms of area (that is, the suction holes). The dimension of the component suction surface 6d with respect to 7c has increased.) As a result, the minimum wall thickness from the boundary of the suction hole 7 to the edge of the component suction surface 6 is 1.325 mm, which is 7 times larger than 0.18 mm of the nozzle 1b, and the strength of the component suction portion 6 is increased and the machining accuracy is increased. It also contributes to relaxed requirements.

  3A to 3C show an operation when the component 10 is mounted using the nozzle 1a shown in FIG. As shown in FIG. 3A, the nozzle 1a that has moved to the mounting position by sucking and holding the component 10 is lowered toward a predetermined mounting position adjacent to the mounted component 10z. FIG. 3B shows a situation in which the nozzle 1 a reaches the bottom dead center and the component 10 is mounted in contact with the circuit board 52. At the time of mounting, the component suction surface 6a according to the present embodiment having an enlarged surface area simultaneously presses a part of the upper end surface of the adjacent component 10z from above. Due to this pressing effect, the adjacent component 10z cannot be moved by being constrained to the mounted position, and is not splashed off by contact with the nozzle 1.

  In the past, only the miniaturization of the nozzle 1 was attempted so as to avoid interference with the adjacent component 10z, but the tip of the nozzle 1 was already mounted at the time of mounting due to misalignment at the time of adsorption, no matter how small the nozzle 1 was. It was possible to approach the adjacent part 10z. In the present embodiment, this idea is changed, and the area of the component suction surface 6 is increased to conversely hold down the adjacent component 10z to eliminate the cause of the jumping.

  Regarding how much the upper end surface of the adjacent component 10z can be pressed by enlarging the component suction surface 6 of the nozzle 1, the shape of the adjacent component 10z (size, aspect ratio, etc.), the state of the cream solder layer 58 can be prevented. It can be assumed that it fluctuates due to various factors such as the lowering speed of the nozzle 1. According to experiments conducted by the present inventors, the ratio of the holding allowance g (see FIG. 3B) by the component suction surface 6a to the width x of the adjacent component 10z is generally about 0.20 or more, preferably about 0.30 or more. Then, it was found that the jumping of the adjacent component 10z can be avoided.

  FIG. 3C shows a situation where a large suction position shift occurs between the nozzle 1a and the component 10 according to the present embodiment, and corresponds to FIG. 12D described above. Yes. As shown in FIG. 12D, in the prior art, the ejection of air in the shifted direction of the nozzle 1 has been a factor that blows away the adjacent component 10z. According to the nozzle 1a according to the present embodiment, since the component suction surface 6a is widely formed, the component suction surface 6a protrudes more in the direction of the adjacent component 10z by the amount of displacement of the nozzle 1a as shown in the figure. This produces an effect of more reliably pressing the adjacent component 10z. As a result, even when a large amount of air is ejected toward the adjacent component 10z as indicated by a plurality of arrows when the component 10 is separated from the air passage 15 of the nozzle 1a, the adjacent component 10z is prevented from being pressed by the nozzle 1a. It is restrained and will not be blown away.

  In summary, the nozzle 1 according to the present embodiment has a ratio of the opening width of the suction hole 7 to the length of the component suction surface 6 in an arbitrary direction on the surface of the component suction surface 6. The aperture ratio R, which is the ratio of the opening area of the suction hole 7 to the area of the component suction surface 6, is reduced to 0.5 or less from 0.7 to 0.8, and is reduced from about 0.4 to 0.5 to 0.3 or less, more preferably 0.2 or less. ing. The lower limit of the aperture ratio R, that is, the lower limit of the area ratio of the suction hole 7 to the component suction surface 6 does not require the component suction surface 6 to be extremely large with respect to the suction hole 7 or the component 10. Since it is sufficient if it is large enough to hold down, it will be about 0.1. In terms of the relationship with the component, the ratio of the area of the component adsorption surface 6 to the surface area of the component 10 is increased to 3.0, more preferably 4.0, which is almost doubled from the conventional 1.6.

  When the area S of the component suction surface 6 of the nozzle 1 is made relatively large with respect to the component 10 to be sucked, there is a problem when taking out the component from the component supply tape 20 using the nozzle 1 having the enlarged area. Can occur. That is, in FIG. 4A, when the nozzle 1 having the component suction surface 6 having a width a which is relatively large with respect to the width c of the component 10 is used, this width a is the base tape 21 of the component supply tape 20 (FIG. 10) may be wider than the width b of the opening of the component storage portion 23 provided in FIG. In this case, since the upper end surface of the component 10 at the stored position is lower than the upper end surface AA of the base tape 21 by the height d, it is considered that the suction of the component 10 is difficult with the conventional technique. It was.

  On the other hand, in this embodiment, the nozzle 1 is further lowered from the state where the component suction surface 6 shown in FIG. 4B is in contact with the upper end surface AA of the base tape 21, as shown in FIG. The component is inserted into the component storage unit 23 by a distance e (d ≧ e) and comes into contact with the component 10 or approaches to the point just before the contact and sucks the component. At the time of pushing into the component storage portion 23, the component suction surface 6 presses the periphery of the component storage portion 23, descends while being deformed, and is pushed into the region before the deformation of the component storage portion 23. According to an experiment conducted by a person, it has been found that the deformation caused by this pressing has no problem with respect to component adsorption. By applying the negative pressure indicated by the broken line arrow 16 in FIG. 4C, the nozzle 1 sucks the component 10 and then ascends while holding the component 10 as shown in FIG. Can be moved to.

  Note that, depending on the component supply tape 20, instead of the component storage unit 23 embossed on the base tape 21 as shown in FIGS. 4A to 4D, a paper base tape is punched to form a hollow component storage unit. There is a type that covers both sides of the front and back with cover tape. In this case as well, it has been confirmed by experiments by the inventors of the present application that component suction is possible by pressing and crushing the base tape 21 with the component suction surface 6 of the nozzle 1.

  That is, when the nozzle 1 having the relatively large component suction surface 6 with respect to the component 10 is used, the problem at the time of component suction is caused by pressing the component suction surface 6 against the base tape 21 at all. It has been found that parts can be sucked and taken out without any trouble. Conversely, by crushing the component storage portion of the base tape 21 with the component suction surface 6, the energy of the descending nozzle is absorbed, so that the descending speed of the nozzle 1 can be increased and the cycle time can be shortened. Is obtained.

  It should be noted that the pushing amount e of the component suction surface 6 can be set to be further pushed down after contacting the component 10 (that is, e ≧ d), thereby making the component suction more reliable. At this time, the bottom surface of the component storage unit 23 is deformed to absorb the excessive pushing amount.

As described above, the nozzle 1 according to the present embodiment can skillfully eliminate the obstacles to adjacent components that have been a major bottleneck for miniaturization of components and high density of component mounting. However, in addition to this, at least the following secondary effects can be obtained.
1. The nozzle 1 can be easily processed. Specifically, in order to avoid interference with the adjacent component 10z that has been mounted so far, it has been necessary to strictly manage the dimensions of the component suction surface 6, but it is necessary to consider this interference in the nozzle 1 of the present embodiment. Therefore, the dimensional accuracy can be relaxed. Moreover, since the area of the component suction surface 6 is enlarged, the centering accuracy of the suction hole 7 that secures the extra width around the suction hole 7 can be relaxed.
2. By increasing the area of the component suction surface 6, the strength of the tip of the nozzle 1 is increased, and it is possible to avoid unforeseen impacts and chipping of the tip due to foreign object biting.
3. There is no restriction on the gap between components on the circuit board to avoid interference with the nozzle 1, and the gap can be made extremely narrow. Thereby, the component mounting density can be further increased.
4). By expanding the area of the component suction surface 6, it is possible to suck and transport a relatively large component 10 using the same nozzle 1. As a result, it is possible to realize common use of nozzles corresponding to small components to large components. If the nozzles used for a plurality of types of components can be shared, the number of types of nozzles to be secured in production can be reduced. This will be further described in the second embodiment.

  In the present embodiment, in addition to the nozzle 1 itself having an increased area of the component suction surface 6 as described above, a part of the adjacent component 10z that has already been mounted when mounting the component on the circuit board 52 is used for the nozzle 1. This includes a component mounting apparatus and a component mounting method that prevent the adjacent component 10z from jumping off by being pressed down from above by the component suction surface 6.

  Next, a nozzle according to a second embodiment of the present invention and a component mounting method using the nozzle will be described with reference to the drawings. The nozzle according to the present embodiment relates to a second concept change with respect to the basic design concept of the nozzle in the above-described prior art, that is, a direction in which the suction hole 7 of the nozzle 1 is made relatively small.

For example, the nozzle 1c shown in FIG. 13B has been used for sucking a chip component 10c (not shown) having a size of 1.6 mm × 0.8 mm as described above. The dimensions X and Y of the component suction surface 6c are 1.7 mm and 1.2 mm, respectively, and the opening area w of the king-shaped suction hole 7c is 0.830 mm ² . As described above, the ratio w / s of the opening area of the suction hole 7c to the surface area s of the part 10c to be sucked is 0.65 (the dimensional ratio is about 0.8). Conventionally, it has been considered that the suction force for the component 10 is more advantageous as the opening area of the suction hole 7 is larger if the negative pressure applied to the nozzle 1 is the same.

On the other hand, in this embodiment, as an alternative to the nozzle 1c shown in FIG. 13B, the nozzle 1a shown in FIG. 1A in which the opening area of the suction hole 7 is less than half (0.315 mm ² ) is used. Then, the same 1.6 mm × 0.8 mm size component 10c is sucked.

  When the nozzle 1c shown in FIG. 13B and the nozzle 1a shown in FIG. 1A are compared, the size of the component suction surface 6 remains the same (1.7 mm × 1.2 mm), and the opening area of the suction hole 7 is as follows. It has decreased to just over 1/3 (38%). As a result, the ratio w / s of the opening area of the suction hole 7c to the surface area s of the part 10c to be sucked also decreases from 0.65 to 0.25, but it is confirmed that the same part can be sucked sufficiently. It was done. That is, it was found that the basic design concept of securing the suction hole 7 having the widest possible area according to the size of the conventional component suction surface 6 is not always in the correct direction according to the experimental results conducted by the inventors. .

  The reason can be explained as follows. That is, in FIG. 5A, when the suction hole 7c having a large opening area is provided in the component suction surface 6c having a constant area, the suction position shift between the nozzle 1c and the component 10c (shown by hatching) occurs. Occasionally, a part of the suction hole 7c protrudes out of the part, and a negative pressure leaks from the part to cause a phenomenon in which the suction force is reduced. This is the same even when the component 10c is picked up with an angle shifted (rotated). Further, even if the suction hole 7c does not completely protrude from the part, negative pressure leaks even when the opening edge of the suction hole 7c and the outer peripheral edge of the part 10c approach each other. Conventionally, as a result of further increasing the area of the suction hole 7c in order to compensate for the decrease in the suction force due to this phenomenon, a vicious circle has occurred that increases the possibility of negative pressure leakage.

  On the other hand, if the nozzle 1a according to the present embodiment is used, as is apparent from FIG. 5B, even if the same amount of suction position shift occurs, the suction hole 7b becomes a part of the component 10c. The phenomenon that the negative pressure leaks out does not occur. Alternatively, at least negative pressure leakage hardly occurs, and even if it occurs, the leakage can be suppressed slightly. For this reason, even if the opening area of the suction hole 7 is about 1/3 of that of the conventional one, the suction force required for component suction is sufficiently ensured, causing any trouble in component suction and mounting. I understand that there is no.

  It is as follows if this is verified from a theoretical value. That is, based on the mass of the component 10 (about 3 mg) and the negative pressure (about −80 K Pascal) acting on the nozzle, the ratio (safety factor) between the required suction force and the theoretical suction force of both nozzles 1a and 1c is obtained. In the conventional nozzle 1c shown in FIG. 13B, the number is about 13, that is, the suction force is 13 times as much as the theoretical value. The nozzle 1a according to the present embodiment shown in FIG. 1 also has a safety factor of about 5 times. Therefore, in the example shown in FIG. 1, it can theoretically be said that the opening area of the suction hole 7b can be further reduced with respect to the component suction surface 6b.

  However, even when the illustrated nozzle 1a is used, a certain safety factor is necessary because the suction hole 7b may protrude to the outside of the component 10 due to the displacement of the suction position, and negative pressure leakage may occur. The lower limit value seems to be around R = 0.075 (safety factor of about 2.5), which is half the aperture ratio R shown in FIG. In addition, the reduction by half in area is about 30% reduction in dimension.

  In order to avoid negative pressure leakage from the suction hole 7 during component suction, the opening area of the suction hole 7 is reduced, and at the same time, the suction hole 7 is arranged as centrally as possible on the component suction surface 6 as shown in FIG. However, it is also important that the suction hole 7 does not protrude from the component 10 or hardly protrudes regardless of the direction in which the suction position of the component 10 is displaced.

  According to the experiment conducted by the inventors of the present application, the opening area of the suction hole 7b is smaller in the nozzle 1a shown in FIG. 1A than the conventional nozzle 1c shown in FIG. 13B. Despite being less than half, the average holding force at the time of component adsorption was about 4 times, and the variation in holding force was reduced to about 1/3. As a result, it was confirmed that the occurrence of defective component adsorption could be reduced and stable component supply could be implemented.

  The suction surface 6 of the nozzle 1 according to the present embodiment is finished to a surface having a maximum height roughness (Ry) of about 10 to about 25 μm, preferably about 15 to about 20 μm. As a result, as shown in FIG. 6A, when the component 10 is sucked and held on the suction surface 6, the distance between the surface of the component 10 in contact with the suction surface 6 and the suction surface 6 is about 10 to 25 μm, preferably 15 A gap δ of about 20 μm is generated. Due to the negative pressure suction action of the suction hole 7 during component suction, air rapidly flows through this minute gap δ to the suction hole 7 as shown by the arrow 16a. Due to the principle (Bernoulli's law) in which negative pressure is generated when fluid flows rapidly through a narrow gap, negative pressure is generated between the component 10 and the suction surface 6, and the component 10 is sucked and held by the suction surface 6. (This is hereinafter referred to as “gap negative pressure effect”). As the contact area between the component 10 and the suction surface 6 is increased as in the present invention, the holding force due to the gap negative pressure effect can be increased.

  In the nozzle 1 according to the present embodiment, in order to hold the component 10, the suction hole 7 is made negative pressure by suction of a vacuum source, and the surface of the component 10 in contact with the suction hole 7 is sucked by this negative pressure. In addition to the considered holding force (hereinafter referred to as “vacuum source negative pressure effect”), the holding force due to the gap negative pressure effect described above is used more actively.

  In order to enhance the gap negative pressure effect, the surface roughness of the suction surface 6 is preferably formed as uniformly as possible. The adsorption surface 6 is usually made of a hard material such as diamond or ceramic. The surface roughness of these materials can be formed by grinding or sintering (in the case of ceramics), but additional processing can be added to obtain a more uniform surface roughness. For example, shot blasting is applied to the suction surface 6 or, as shown in FIG. 6B, a unidirectional groove 17a having a depth of about 10 to 25 μm, preferably about 15 to 20 μm, or a cross-shaped groove. The surface roughness can be adjusted by forming 17b. The grooves 17a and 17b can be formed by grinding, or in the case of ceramic, by providing them in advance in a sintered mold.

  In the nozzles 1b and 1c having a small surface area of the suction surface 6 as compared with the suction holes 7 such as the suction nozzles 1b and 1c according to the prior art shown in FIGS. The holding force due to the gap negative pressure effect was not fully utilized. For example, according to an experiment conducted by the inventors of the present application, even if the component 10c is completely closed and held in the suction hole 7c of the nozzle 1c in the state shown in FIG. As a result, the nozzle 1a having the suction hole 7b shown in FIG. 5B, which is much smaller than the suction hole 7c of a), has a larger holding force. This indicates that the holding force due to the above-described gap negative pressure effect contributes greatly in addition to the conventionally considered vacuum source negative pressure effect by the suction hole 7c.

  Since the size of the suction surface 6 is necessarily limited in relation to the size of the component 10, how the limited suction surface 6 is distributed to the suction holes 7 and the suction surfaces 6 other than the suction holes 7. In other words, the ratio of the vacuum source negative pressure effect and the gap negative pressure effect to be used is extremely important in determining the overall adsorption force. The specifications of each nozzle shown in FIG. 1B and FIG. 2B show a specific example of an ideal distribution for increasing the total suction force by the nozzle 1.

  In summary, the nozzle 1 according to the present embodiment has a ratio of the length of the suction hole 7 to the length of the component suction surface 6 in an arbitrary direction within the surface of the component suction surface 6. The aperture ratio R, which is the ratio of the opening area of the suction hole 7 to the area of the component suction surface 6, is reduced to 0.5 or less from 0.7 to 0.8, and is reduced from about 0.4 to 0.5 to 0.3 or less, more preferably 0.2 or less. ing. The above conditions are exactly the same as those described in the first embodiment. In addition to this, in the relationship with the component 10, the nozzle 1 according to the present embodiment reduces the ratio of the opening area of the suction hole 7 to the surface area of the component 10 from the conventional 0.65 to about 0.35 or less, preferably 0.25. Can be reduced to:

By making it possible to reduce the opening area of the suction hole 7 relative to the component suction surface 6 of the nozzle, the following secondary merit can be obtained.
1. Since the opening area of the suction hole is reduced, even if a suction position shift between the nozzle and the component occurs to some extent, the negative pressure leakage from the nozzle does not occur, and it is possible to avoid the occurrence of component suction failure or mounting failure due to component dropout. .
2. Since negative pressure leakage from the nozzle can be eliminated, it is possible to relax the required accuracy for the displacement of the suction position between the nozzle and the component, and the production efficiency can be increased by reducing the defect rate.
3. The processing time for the suction holes can be greatly reduced. The component suction surface is formed of, for example, cemented carbide and industrial diamond or ceramic, and the suction holes are conventionally processed by an end mill or a wire cutter. As is apparent from a comparison between FIG. 13B and FIG. 1A, if the suction hole 7 can be reduced, the processing length is shortened, and the processing time can be shortened.
4). In relation to item 3 above, the shape of the suction hole can be a simple shape such as a round hole, and processing can be facilitated. Conventionally, complicated shapes such as a king shape and an H shape have been considered in order to avoid sucking and falling off parts while widening the opening area. If the suction hole is relatively small with respect to the size of the part, there is no need to worry about sucking the part, and the processing can be facilitated with a simple shape.
5. It becomes possible to share nozzles for a plurality of types of components, and the number of types of nozzles to be held can be reduced. For example, the nozzle 1a shown in FIG. 1A can be used not only for the component 10c of 1.8 mm × 0.6 mm size but also for the component 10b of 1.0 mm × 0.5 mm size as usual. This content is the same as item 4 in the first embodiment.

  As mentioned above, although each embodiment of the component adsorption | suction nozzle concerning this invention has been described, application of this invention is not limited to the nozzle of the fundamentally symmetrical type shown so far. For example, there is a case where an elongated rectangular nozzle 1d extending in one direction as shown in a bottom view in FIG. 7A is used to adsorb an elongated component such as a relay. The contents shown in each embodiment can be applied to the above. That is, in the conventional elongated rectangular nozzle 1d, a suction hole 7d having as large an area as possible is provided in the component suction surface 6d whose outer shape is cut as much as possible in order to avoid interference with adjacent components. .

  On the other hand, if the present invention is applied, the component suction surface 6e is made relatively wide with respect to the suction hole 7e as in the nozzle 1e shown in FIG. It is possible to avoid pressing and jumping, or conversely to make the suction hole 7e relatively small with respect to the component suction surface 6e, and to avoid negative pressure leakage due to the suction position shift to ensure suction force. .

  FIGS. 7C and 7D show alternatives to the suction holes 7 in the elongated rectangular nozzles 1f and 1g, in which two oval suction holes 7f are arranged (FIG. 7C). FIG. 7 (d) shows a plurality of circular suction holes 7g. In this case, an air passage 15 (see FIG. 9) extending along the longitudinal axis of the nozzle 1 branches in the middle and is connected to the illustrated oval or circular suction holes 7f and 7g.

  Also in the nozzles 1f and 1g shown in FIGS. 7C and 7D, the total opening width of the suction holes 7f and 7g with respect to the length of the component suction surfaces 6f and 6g extending in the elongated rectangular shape is as follows. It can be 50% or less. Similarly, the opening ratio can be 50% or less in the direction perpendicular to the elongated direction.

  The component adsorption method, component mounting apparatus, and component mounting method according to the present invention can be widely used in the industrial field of component mounting.

It is a bottom view which shows the suction surface of the component suction nozzle concerning embodiment of this invention. It is a bottom view which shows the suction surface of the other component suction nozzle concerning embodiment of this invention. It is explanatory drawing which shows the component mounting operation | movement by the component suction nozzle shown in FIG. 1, FIG. It is explanatory drawing which shows the components taking-out operation | movement by the components adsorption | suction nozzle shown in FIG. 1, FIG. It is explanatory drawing which shows the difference of the influence by the suction position shift in the component suction nozzle by a prior art, and the component suction nozzle shown in FIG. It is explanatory drawing which shows the outline | summary of the clearance negative pressure effect utilized by this invention. It is a bottom view which shows the other aspect of the component adsorption nozzle concerning embodiment of this invention. It is a perspective view which shows the outline | summary of a components supply apparatus. It is the side view which shows the outline | summary of a component adsorption | suction nozzle, a partial expansion perspective view, and a bottom view. It is a perspective view which shows the outline | summary of a component supply tape. It is explanatory drawing which shows the components extraction operation | movement by the components suction nozzle by a prior art. It is explanatory drawing which shows the problem at the time of component mounting of the component adsorption nozzle by a prior art. It is a bottom view which shows the suction surface of the component suction nozzle by a prior art.

Explanation of symbols

1. 2. Part suction nozzle, 4. adsorption part; Central axis, 6. 6. Component adsorption surface Adsorption holes, 10. Parts, 12. 12. upper cylindrical part; Lower cylindrical part, 14. 15. inverted frustum, Air passage, 20. 21. parts supply tape Base tape, 22. Cover tape, 23. Component storage section, 25. Reel, 30. Component supply device, 50. Component mounting apparatus, 51. Component supply unit, 52. Circuit board, 53. Mounting head,
A-A. The top surface of the base tape.

Claims (15)

A connecting portion for connecting to a mounting head above the longitudinal axis, a suction portion including a component suction surface below the longitudinal axis, and a fluid connection between the connecting portion and the suction portion to connect the component suction surface An air passage that opens to the suction hole formed in the component, and sucks the component onto the component suction surface using the negative pressure supplied from the mounting head via the air passage, and mounts it via the air passage. In the component suction nozzle that separates the component from the component suction surface using the positive pressure supplied from the head and mounts it on the mounting position of the circuit board,
The component suction nozzle, wherein an opening area of the suction hole is about 30% or less of an area of the component suction surface.   The component suction nozzle according to claim 1, wherein an opening area of the suction hole is about 20% or less of an area of the component suction surface. A connecting portion for connecting to a mounting head above the longitudinal axis, a suction portion including a component suction surface below the longitudinal axis, and a fluid connection between the connecting portion and the suction portion to connect the component suction surface An air passage that opens to the suction hole formed in the component, and sucks the component onto the component suction surface using the negative pressure supplied from the mounting head via the air passage, and mounts it via the air passage. In the component suction nozzle that separates the component from the component suction surface using the positive pressure supplied from the head and mounts it on the mounting position of the circuit board,
One suction hole is opened at substantially the center of the component suction surface, and the opening width of the suction hole in an arbitrary direction on the component suction surface is about 50% or less of the width of the component suction surface in the same direction. A component suction nozzle characterized by that.   The component suction surface is formed in a substantially rectangular shape with a length of one side approximately orthogonal to approximately 1.7 mm and a length of the other side of approximately 1.2 mm, and the one of the suction holes opening in the component suction surface 4. The component suction nozzle according to claim 3, wherein an opening width in the same direction as the other side is about 0.8 mm, and an opening width in the same direction as the other side is about 0.55 mm.   The component suction surface is formed in a substantially rectangular shape having a length of one side approximately orthogonal to about 4.0 mm and a length of the other side of about 3.4 mm, and the one of the suction holes opening in the component suction surface 4. The component suction nozzle according to claim 3, wherein an opening width in the same direction as the other side is about 1.35 mm and an opening width in the same direction as the other side is about 0.9 mm.   The opening shape of the suction hole is any one of an X shape, an H shape, a king shape, a circle, and an oval, according to any one of claims 1 to 5. Parts suction nozzle. A connecting portion for connecting to a mounting head above the longitudinal axis, a suction portion including a component suction surface below the longitudinal axis, and a fluid connection between the connecting portion and the suction portion to connect the component suction surface An air passage that opens to the suction hole formed in the component, and sucks the component onto the component suction surface using the negative pressure supplied from the mounting head via the air passage, and mounts it via the air passage. In the component suction nozzle that separates the component from the component suction surface using the positive pressure supplied from the head and mounts it on the mounting position of the circuit board,
The component suction surface is formed in an elongated rectangular shape extending in one direction, the suction holes are branched from the air passage, and a plurality of openings are formed along the one direction, and a total opening of the plurality of suction holes along the one direction. A component suction nozzle having a width of about 50% or less of a width in the same direction of the component suction surface.   The component suction nozzle according to claim 7, wherein the shape of the opening of the suction hole is circular or oval. A component supply unit that continuously supplies components, a mounting head that takes out components from the component supply unit and mounts them on a circuit board, a robot that conveys the mounting head, and a substrate holding unit that carries in and holds the circuit board And a control unit that controls the overall operation, and using the component suction nozzle mounted on the mounting head, the component is taken out from the component supply unit by an air suction action, and the component is discharged by an air blowing action. In the component mounting device that mounts the circuit board on the mounting position
The component mounting nozzle according to any one of claims 1 to 8, wherein the component suction nozzle is the component suction nozzle. The component supplied to the component supply unit is picked up and taken out by a component suction nozzle, and the component is transported to a position facing a regulated and held circuit board. In the component mounting method of mounting at the mounting position,
The component suction nozzle having an opening area of about 30% or less with respect to the area of the component suction surface of the component suction nozzle is used to take out and mount the component using the component suction nozzle. Component mounting method.   The component mounting method according to claim 10, wherein a ratio of an opening area of the suction hole to an area of the component suction surface is about 20% or less. The component supplied to the component supply unit is picked up and taken out by a component suction nozzle, and the component is transported to a position facing a regulated and held circuit board. In the component mounting method of mounting at the mounting position,
The component is picked up and mounted using a component suction nozzle that opens a suction hole having an opening area of about 35% or less with respect to a suction surface area of the suctioned component to the component suction surface. Component mounting method. The component supplied to the component supply unit is picked up and taken out by a component suction nozzle, and the component is transported to a position facing a regulated and held circuit board. In the component mounting method of mounting at the mounting position,
A component mounting method, wherein when mounting the component at a mounting position of a circuit board, the component is mounted while pressing another adjacent component mounted on the circuit board from above by the component suction nozzle.   The press margin of the other adjacent component by the component suction nozzle is about 20% or more of the surface area of the surface of the other component facing the component suction nozzle. Component mounting method. When a component is taken out from the component supply tape that supplies the component to the component mounting apparatus by the component suction nozzle, the periphery of the component storage portion that stores the component by the component tape is pressed by the component suction surface of the component suction nozzle and deformed. The component suction surface penetrates into a region before deformation of the component storage portion and comes into contact with or close to the component, and the component is sucked and taken out. The component mounting method according to claim 1.

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