JP2006117888A - Composite, prepreg using the same, metal foil-clad laminate plate, circuit board and method for producing the circuit board - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a composite sufficiently excellent in adhesive reliability, sufficiently suppressed in generation of resin powder and fiber liable to fall off, to provide a prepreg using the composite, and to provide a metal foil-clad laminate plate using the composite. <P>SOLUTION: The composite settling the above problems is a composite 100 which is obtained by impregnating a fiber sheet 101 with a curable resin composition 102 and gives a cured product of the curable resin composition and having 100-2,000 MPa storage elastic modulus at 20°C. The curable resin composition has ≥30,000 weight-average molecular weight, contains an acrylic polymer containing 2-20 mass% glycidyl acrylate as a polymerizable component and has 2-36 epoxy number. <P>COPYRIGHT: (C)2006,JPO&NCIPI

Description

  The present invention relates to a composite, a prepreg using the composite, a metal foil-clad laminate, a circuit board, and a method for manufacturing the circuit board.

  2. Description of the Related Art In recent years, with the increase in performance and miniaturization of electronic devices, circuit boards are required to have higher multilayers and higher densities. In order to increase the density of circuit boards, inner via hole (IVH) connections that can connect ICs and components at the shortest distance are widely used as connection methods between board layers. In the IVH connection, it is possible to connect only necessary layers, and there is no through hole in the uppermost layer of the substrate, and the mountability is excellent.

As a circuit board using this IVH connection, for example, a sheet substrate material obtained by impregnating a sheet-like organic nonwoven fabric with a thermosetting resin is used to form a through hole by laser processing, and a conductive paste is formed in the through hole. There has been proposed a circuit board in which an IVH structure is formed by filling and heating and pressing a sheet substrate material (see, for example, Patent Document 1).
JP-A-6-268345

  However, the circuit board having the above-mentioned IVH structure may cause dents on the board during the manufacture or may cause the disconnection of the wiring, so that there is a circuit board that does not have sufficient reliability. It was. In particular, when the thickness of each layer is reduced in order to increase the density, the above-described defects tend to occur frequently.

  Therefore, as a result of examining the cause of the defect in detail, the present inventors, as described above, when the sheet substrate material in which the fiber sheet is impregnated with the resin is used as the insulating substrate, the resin powder or fibers that fall off from the insulating substrate Has been found to be a major cause of the above defects. Further, it has been found that a large amount of resin powder or fiber that falls off is generated particularly when an insulating substrate having a via hole is formed.

  Here, even if the material for the insulating substrate is selected only considering the suppression of the dropping of resin powder or fiber, if the insulating substrate used for the circuit board does not have sufficient adhesive reliability, the result As a result, a circuit board having sufficient reliability cannot be obtained.

  An object of the present invention is to solve the above-mentioned problems, and to provide a composite that is sufficiently excellent in adhesion reliability and sufficiently suppressed from generating resin powder or fibers that may drop off. . Another object of the present invention is to provide a prepreg, a metal foil-clad laminate, a circuit board, and a manufacturing method thereof using such a composite.

  In order to achieve the above object, the composite of the present invention is a composite comprising a fiber sheet impregnated with a curable resin composition, and the cured product of the curable resin composition has a storage elastic modulus at 20 ° C. 100 to 2000 MPa.

  In the composite of the present invention, the fiber sheet is impregnated with a curable resin composition in which the storage modulus of the cured product falls within the above range, thereby sufficiently suppressing the occurrence of resin powder or fibers that may fall off. In addition, the adhesive reliability is sufficiently excellent. Therefore, a circuit board having excellent reliability can be manufactured by using the composite of the present invention as a material for an insulating substrate.

  When the storage elastic modulus at 20 ° C. of the cured product of the curable resin composition is less than 100 MPa, handleability and dimensional stability are deteriorated, and sufficient adhesion reliability cannot be obtained. If it exceeds, the cured resin becomes brittle, and thus generation of resin powder or fibers that may fall off cannot be sufficiently suppressed.

  In the composite of the present invention, the ratio Va / Vb of the volume Va of the curable resin composition to the volume Vb of the fiber sheet is preferably 0.3 to 0.9.

  When the Va / Vb is less than 0.3, the resin component is insufficient when integrated with the metal foil, and when integrated at a high speed, bubbles or blurring occurs, or fibers are formed on the surface of the integrated metal foil. The unevenness of the sheet is reflected and the surface smoothness tends to decrease. Thereby, it tends to be difficult to obtain sufficient adhesion reliability. On the other hand, when Va / Vb exceeds 0.9, there is a tendency that the dimensional stability such as distortion occurs in the base material in a heat resistance test such as leaving at high temperature.

  Furthermore, in the composite of the present invention, the curable resin composition preferably contains a viscoelastic resin. Such a composite is more reliably suppressed from generating resin powder or fibers that may fall off, and has sufficiently excellent adhesion reliability.

  Further, in the composite of the present invention, the curable resin composition contains an acrylic polymer having a weight average molecular weight of 30000 or more, and the acrylic polymer contains 2 to 20% by mass of glycidyl acrylate as a polymerization component, The epoxy value is preferably 2 to 36. In addition, the value calculated | required by the HLC measuring method is employ | adopted for an epoxy value.

  When the weight average molecular weight of the acrylic polymer is less than 30000, the flexibility tends to be lowered and become brittle. Further, if the glycidyl acrylate contained as a polymerization component in the acrylic polymer is less than 2% by mass, the glass transition temperature Tg of the cured product tends to be lowered and the heat resistance tends to be insufficient, whereas 10% by mass. If it exceeds 1, the storage elastic modulus of the cured product tends to increase and the generation of resin powder or fibers cannot be sufficiently suppressed. Furthermore, when the epoxy value of the acrylic polymer is less than 2, the glass transition temperature Tg of the cured product tends to decrease and the heat resistance tends to be insufficient. The rate tends to increase and the generation of resin powder or fibers cannot be sufficiently suppressed.

  Furthermore, in the composite of the present invention, the fiber sheet is preferably a glass cloth having a thickness of 10 to 200 μm. According to such a composite, it is possible to obtain an insulating substrate that has sufficient mechanical strength, improves dimensional stability, and makes it easier to increase the density of the circuit board.

  In the composite of the present invention, the total thickness of the composite is preferably 100 μm or less. When the total thickness of the composite is 100 μm or less, it is easier to increase the density when used as an insulating substrate constituting the circuit board.

  Furthermore, in the composite of the present invention, the composite preferably has a through hole. According to such a composite, the step of forming the through-hole can be omitted by providing the through-hole in a predetermined position in advance, and the yield of the circuit board having an IVH structure that is excellent in reliability by using such a composite. Can be manufactured well.

  The prepreg of the present invention is characterized in that, in the composite of the present invention, the curable resin composition is semi-cured.

  By using the curable resin composition described above, the prepreg of the present invention is sufficiently suppressed in the generation of resin powder or fibers that may fall off and has sufficiently excellent adhesion reliability. Yes. Therefore, when manufacturing the circuit board which has IVH structure using the prepreg of this invention, the circuit board excellent in reliability can be obtained.

  Furthermore, the prepreg of the present invention preferably has a through hole. According to such a prepreg, the step of forming the through-hole can be omitted by providing the through-hole in a predetermined position in advance, and by using such a prepreg, a highly reliable circuit board having an IVH structure can be more easily obtained. Can be manufactured.

  Further, the first metal foil-clad laminate of the present invention is a composite of the present invention having a through hole, in which the through hole is filled with a conductor and a metal foil is disposed on at least one surface of the composite, It is obtained by heating and pressing.

  By using the composite of the present invention, such a metal foil-clad laminate is sufficiently suppressed from falling off the resin powder or fibers from the metal foil-clad laminate and has sufficiently excellent adhesion reliability. is doing. Therefore, when a circuit board having an IVH structure is manufactured using the metal foil-clad laminate of the present invention, a circuit board having excellent reliability can be obtained with a high yield.

  Further, the second metal foil-clad laminate of the present invention is a prepreg of the present invention having a through-hole, in which a through-hole is filled with a conductor and a metal foil is disposed on at least one surface of the prepreg. It is obtained by pressing.

  Such a metal foil-clad laminate has a sufficiently excellent adhesion reliability while sufficiently preventing the resin powder or fibers from falling off the metal foil-clad laminate by using the prepreg of the present invention. ing. Therefore, when a circuit board having an IVH structure is manufactured using the metal foil-clad laminate of the present invention, a circuit board having excellent reliability can be obtained with a high yield.

  In the first circuit board of the present invention, a first through hole penetrating in the thickness direction is formed in the insulating substrate made of the composite of the present invention, and in the first through hole, A conductive portion made of the first resin composition containing conductive particles is formed so as to fill the entire first through hole, and the conductive portion is electrically connected in the thickness direction of the insulating substrate. In the circuit board, the insulating substrate is further formed with a second through hole penetrating in the thickness direction, and the second through hole is provided at both ends of the second through hole. A heat radiating portion is formed which is formed of a second resin composition containing conductive particles and filled in a portion excluding the opening, and an insulating resin layer disposed in the opening. .

  In the second circuit board of the present invention, a first through hole penetrating in the thickness direction is formed in the insulating substrate made of the composite of the present invention, and in the first through hole, A conductive portion made of the first resin composition containing conductive particles is formed so as to fill the entire first through hole, and the conductive portion is electrically connected in the thickness direction of the insulating substrate. The circuit board, wherein the insulating substrate is further formed with a second through hole penetrating in the thickness direction, and the second through hole has an insulating property containing insulating particles. The heat radiation part made of the third resin composition is formed so as to fill the entire second through hole.

  Furthermore, in the third circuit board of the present invention, a first through hole penetrating in the thickness direction is formed in the insulating substrate made of the composite of the present invention, and in the first through hole, A conductive portion made of the first resin composition containing conductive particles is formed so as to fill the entire first through hole, and the conductive portion is electrically connected in the thickness direction of the insulating substrate. In the circuit board, the insulating substrate is further formed with a second through hole penetrating in the thickness direction, and the second through hole is provided at both ends of the second through hole. A first heat dissipating portion is formed which is formed of a second resin composition containing conductive particles filled in a portion excluding the opening, and an insulating resin layer disposed in the opening; and The insulating substrate is further formed with a third through-hole penetrating in the thickness direction, The third through hole, wherein the second heat radiation member formed of the third resin composition containing the insulating particles is formed to fill the entire said third through hole.

  In the circuit board having the conventional IVH structure as described above, heat dissipation is not sufficient, and this is a problem when used as a semiconductor chip mounting board. In addition, the land of the electrode on the uppermost layer of the substrate limits the region for forming the wiring (for example, wiring for electrical connection with the semiconductor chip) in the uppermost layer of the substrate, and the wiring is formed with high density. There was a problem that could not.

  On the other hand, in the first to third circuit boards of the present invention, the insulating substrate is composed of the composite of the present invention in which the above-described adhesive reliability is excellent and resin powder and fibers are sufficiently prevented from falling off. In addition, the conductive portion and the heat dissipation portion described above are formed on the insulating substrate. In a circuit board having such a configuration, not only heat dissipation by the conductive portion, but also sufficient heat dissipation by the heat dissipation portion, and electrode lands are not formed around the heat dissipation portion. Can be arranged. Therefore, according to such a circuit board, sufficient heat dissipation can be obtained, high-density wiring can be formed, and excellent reliability can be obtained. In addition, the 1st-3rd circuit board of the said invention may have another another electroconductive part and a thermal radiation part other than the electroconductive part and thermal radiation part which were mentioned above.

  Here, in the first to third circuit boards, the insulating resin layer and the constituent resin of the resin composition are preferably cured resins. Thereby, while being excellent in heat resistance, durability in solder and solder reflow processing is improved. The constituent resin of the insulating resin layer and the resin composition is preferably an epoxy resin. Thereby, the adhesion reliability of the conductive part and the heat radiating part and the insulating substrate is improved.

  In the first to third circuit boards, it is preferable that a metal foil pattern, a part of which is bonded to the conductive portion, is formed on at least one of the upper and lower surfaces of the insulating substrate. Thereby, the circuit board which uses a metal foil pattern as an electric circuit can be comprised.

  Furthermore, in the first to third circuit boards, the conductive particles are preferably at least one selected from gold, silver, copper, aluminum, palladium, nickel, and alloys thereof. Thereby, the electroconductive part which has sufficient electrical conductivity can be formed.

  In the first to third circuit boards, the insulating particles are preferably at least one selected from alumina particles, silica particles, and magnesia particles. Thereby, the thermal radiation part which has sufficient electrical insulation can be formed.

  A first manufacturing method of a circuit board according to the present invention includes a step of bonding cover films to both surfaces of a substrate made of the composite of the present invention, and penetrating the substrate and the cover film in the thickness direction of the substrate. Forming a first through hole and a second through hole, and filling the first through hole and the second through hole with a conductive paste containing at least conductive particles and a resin component; Removing the cover film from the substrate, and applying pressure and heat treatment in a state in which metal foils are disposed on both surfaces of the substrate, and the curable resin composition in the substrate and the resin in the conductive paste. A step of curing the components, and etching the metal foil so that at least a portion blocking the opening of the second through hole is removed, and patterning the metal foil into a predetermined circuit pattern A step of dissolving and removing the conductive particles present in the opening in the second through-hole, and forming an insulating insulating resin layer made of the resin component in the opening. It is characterized by.

  The second manufacturing method of the circuit board of the present invention includes a step of bonding cover films to both surfaces of the substrate made of the composite of the present invention, and a thickness direction of the substrate on the substrate and the cover film. Forming a first through hole and a second through hole penetrating into the first through hole, filling the first through hole with a conductive paste containing at least conductive particles and a resin component, and the second Filling the through-holes with an insulating paste containing at least insulating particles and the resin component, removing the cover film from the substrate, and applying metal foil on both sides of the substrate. Performing a pressure heat treatment to cure the curable resin composition in the substrate and the resin component in the conductive paste and the insulating paste; and at least the second penetration in the metal foil. Etched as part closes the opening of the hole is removed, characterized in that it and a step of patterning the metal foil into a predetermined circuit pattern.

  Furthermore, the third manufacturing method of the circuit board of the present invention includes a step of bonding cover films to both surfaces of the substrate made of the composite of the present invention, and a thickness direction of the substrate on the substrate and the cover film. Forming a first through hole, a second through hole, and a third through hole penetrating through the first through hole, and the first through hole and the second through hole include at least conductive particles and a resin component. Filling the conductive paste; filling the third through-hole with an insulating paste containing at least insulating particles and the resin component; removing the cover film from the substrate; and Applying pressure and heat treatment in a state where metal foils are disposed on both surfaces of the substrate, and curing the curable resin composition in the substrate, and the resin component in the conductive paste and the insulating paste; Above money Etching is performed on the foil so as to remove at least the opening of the second through-hole and the opening of the third through-hole, and the metal foil is patterned into a predetermined circuit pattern. And a step of dissolving and removing the conductive particles present in the opening in the second through hole and forming an insulating insulating resin layer made of the resin component in the opening. .

  In the first to third circuit board manufacturing methods of the present invention, the insulating substrate is composed of the composite of the present invention which is excellent in the above-described adhesion reliability and sufficiently suppresses resin powder and fibers from falling off. A conductive part and a heat radiating part are formed on the insulating substrate. The circuit board obtained by such a manufacturing method is not only radiated by the conductive portion, but also sufficiently radiated by the radiating portion, and no electrode land is formed around the radiating portion. Wiring can be arranged. Therefore, according to this manufacturing method, it is possible to manufacture a circuit board having sufficient heat dissipation, high-density wiring formation, and excellent reliability. In the first to third circuit board manufacturing methods of the present invention, other conductive portions and heat dissipation portions may be formed in addition to the above-described conductive portions and heat dissipation portions.

  ADVANTAGE OF THE INVENTION According to this invention, the composite_body | complex which is excellent in adhesion reliability and generation | occurrence | production of the resin powder or fiber which may drop | omit is fully suppressed can be provided. Moreover, according to this invention, the prepreg using this composite_body | complex and a sheet | seat with metal foil can be provided. Furthermore, according to the present invention, it is possible to provide a circuit board having sufficient heat dissipation and high-density wiring formation, and having excellent reliability, and a manufacturing method thereof.

  Hereinafter, embodiments of the present invention will be described with reference to the drawings.

  First, an embodiment of the composite of the present invention will be described. FIG. 1 is a schematic cross-sectional view showing one embodiment of the composite of the present invention. A composite 100 in FIG. 1 is formed by impregnating a curable resin composition 102 into a fiber sheet 101. The composite 100 includes a through hole 103.

  Examples of the fiber sheet 101 include heat resistant synthetic fibers such as paper, glass cloth such as glass fiber woven fabric and glass fiber nonwoven fabric, and aramid nonwoven fabric. Among these, a glass fiber woven fabric and a glass fiber nonwoven fabric are preferable, and a glass fiber woven fabric is particularly preferable. Examples of the glass material include E glass, S glass, and D glass. Moreover, about the weaving method of the fiber when using a woven fabric as a fiber sheet, a plain weave, satin weave, twill weave, etc. are mentioned, for example.

  About the thickness of a fiber sheet, if the fiber sheet has sufficient intensity | strength, the thinner one is preferable. Specifically, for example, the thickness is preferably 10 to 200 μm, and more preferably 20 to 80 μm. The fiber sheet is preferably one having a smaller linear expansion coefficient.

  The curable resin composition 102 only needs to have a storage elastic modulus at 20 ° C. of 100 to 2000 MPa of the cured product, and includes, for example, a curable resin and a curing agent that cures the curable resin. Things. As the resin component of the curable resin, it is preferable to use a viscoelastic resin, and examples thereof include epoxy resins, rubber-modified epoxy resins, SBR, NBR, CTBN, acrylic resins, polyamides, polyamideimides, and silicone-modified polyamideimides. . Examples of the curing agent include dicyandiamide, phenol resin, imidazole, amine compound, acid anhydride and the like.

  The curable resin composition 102 can be used as a varnish containing a predetermined solvent for the purpose of impregnating the fiber sheet. Solvents include aromatic hydrocarbon solvents such as benzene, toluene, xylene, and trimethylbenzene; ether solvents such as tetrahydrofuran; ketone solvents such as acetone, methyl ethyl ketone, and methyl isobutyl ketone; glycol ethers such as methyl cellosolve and diethylene glycol. Solvents; ester solvents such as methyl cellosolve acetate; dialkyl glycol solvents such as ethylene glycol dimethyl ether; amide solvents such as N-methylpyrrolidone, N, N′-dimethylformamide, N, N′-dimethylacetamide; methanol, butanol , Alcohol solvents such as isopropanol; ether alcohol solvents such as 2-methoxyethanol and 2-butoxyethanol can be used, and one or more of these can be used. It is possible.

  In the present embodiment, it is preferable to use a combination of a curable acrylic polymer and a curing agent that cures the acrylic polymer as the curable resin composition. In this case, it is preferable to use the curing agent in a proportion of 60 to 350 parts by mass with respect to 100 parts by mass of the acrylic polymer. When the curing agent is less than 60 parts by mass with respect to 100 parts by mass of the acrylic resin, the storage elastic modulus of the cured product tends to be less than 300 MPa, the handleability is lowered, and the Tg of the cured product is lowered, resulting in a high temperature. There is a tendency that problems such as dimensional shrinkage due to deterioration during standing and a decrease in solder heat resistance are likely to occur. On the other hand, when the ratio of the curing agent exceeds 350 parts by mass, the storage elastic modulus of the cured product tends to exceed 2000 MPa. In this case, the cured product becomes brittle, and thus the resin powder or fibers tend to fall off.

  The acrylic polymer preferably has a weight average molecular weight (Mw) of 30000 or more. Further, the acrylic polymer has 2 to 20% by mass of glycidyl acrylate as a polymerization component in the polymer. The epoxy value is preferably 2 to 36.

  Examples of the method for producing the composite 100 include a method in which a fiber sheet is impregnated with a curable resin composition and dried, and then a through hole is formed at a predetermined position. Examples of the method of impregnating the fiber sheet with the curable resin composition include, for example, a method of immersing the fiber sheet in a resin composition solution such as a wet method and a dry method, and a method of applying the curable resin composition to the fiber sheet. Etc.

  The amount of the curable resin composition impregnated into the fiber sheet may be adjusted so that the ratio Va / Vb of the volume Va of the curable resin composition to the volume Vb of the fiber sheet is 0.3 to 0.9. preferable. Here, the volume ratio can be obtained from the weight of the fiber sheet and the curable resin composition contained in the composite and the specific gravity of each.

  Next, a preferred embodiment of the prepreg of the present invention will be described.

  FIG. 2 is a schematic cross-sectional view showing an embodiment of the prepreg of the present invention. A prepreg 200 shown in FIG. 2 includes a fiber sheet 201 and a semi-cured resin composition layer 202 obtained by semi-curing a curable resin composition impregnated in the fiber sheet 201. Further, the prepreg 200 includes a through hole 203.

  The prepreg 200 can be obtained by semi-curing the curable resin composition 102 in the composite 100 described above. In this case, the fiber sheet 201 is the same as the fiber sheet 101, and the semi-cured resin composition layer 202 is obtained by semi-curing the curable resin composition 102. As another method, the prepreg 200 is prepared by impregnating the above curable resin composition into the above fiber sheet and drying, and then semi-curing the curable resin composition to obtain a semi-cured resin composition. It can also be obtained by forming the through hole 203 at a predetermined position after forming the physical layer 202.

  Examples of the method for semi-curing the curable resin composition include methods such as heating, ultraviolet irradiation, and electron beam irradiation. Examples of the conditions for semi-curing by heating include conditions of 100 to 200 ° C. and 1 to 30 minutes.

  In the prepreg of this embodiment, it is preferable that the curing rate of the curable resin composition be in the range of 10 to 70%. When the curing rate of the curable resin composition is less than 10%, when integrated with the metal foil, the unevenness of the fiber sheet is reflected on the surface of the integrated metal foil, and the surface smoothness tends to be reduced. The control of the thickness of the insulating substrate tends to be difficult. On the other hand, when the curing rate of the curable resin composition exceeds 70%, the resin component is insufficient when it is integrated with the metal foil, and when it is integrated at a high speed, bubbles and blurring are likely to occur, and adhesion with the metal foil. Power tends to be insufficient.

  Next, an embodiment of the metal foil-clad laminate of the present invention will be described.

  FIG. 3 is a schematic cross-sectional view showing an embodiment of the metal foil-clad laminate of the present invention. A metal foil-clad laminate 300 shown in FIG. 3 includes an insulating substrate 301 having a through hole 303, a conductor 304 filled in the through hole 303, and a conductor layer 302 stacked on the insulating substrate 301. Has been.

  Examples of the conductor layer 302 include metal foil such as copper foil, aluminum foil, and nickel foil. In the metal foil-clad laminate of this embodiment, the conductor layer 302 is preferably a copper foil, and the thickness is preferably 1 to 70 μm. Moreover, electrolytic copper foil, rolled copper foil, etc. can be used for copper foil. In the metal foil-clad laminate of this embodiment, the conductor layer 302 may be a film having conductivity, and other than the above metal foil, for example, a metal, an organic substance, and a composite thereof may be used. Good.

  Examples of the conductor 304 include a heat-pressed one of a conductive paste containing a metal such as gold, silver, nickel, copper, platinum, palladium, ruthenium oxide, a metal oxide, an organometallic compound, or the like.

  The insulating substrate 301 having the through hole 303 is formed using the composite 100 or the prepreg 200 described above.

  For example, when the metal foil-clad laminate 300 is obtained using the prepreg 200, first, the conductive paste is filled into the through holes 203 of the prepreg 200. Next, a metal foil as a conductor layer is arranged on the surface of the prepreg 200, and the metal foil and the prepreg can be integrated to manufacture the metal foil-clad laminate 300. Further, even if the composite 100 is used instead of the prepreg 200, the metal foil-clad laminate 300 can be similarly manufactured.

Examples of the method for integrating the metal foil with the prepreg or the composite include metallization, press lamination method, and hot roll continuous lamination method. In the present embodiment, it is preferable to use a press lamination method from the viewpoint of efficiently forming the conductor layer 302. Examples of the heating and pressing conditions for integrating the metal foil and the prepreg or the composite by the press lamination method include a temperature of 120 to 230 ° C., a pressure of 10 to 60 kg / cm ² , and a heating time of 30 to 120 minutes. A range condition is mentioned.

  Further, before continuously laminating the metal foil and the prepreg or the composite, the same photosensitive resin composition as that contained in the prepreg or the composite is applied to the surface of the metal foil, and the resin composition It is preferable to form a layer. Thereby, it can further reduce that the unevenness | corrugation of the surface of the fiber sheet contained in a prepreg or a composite_body | complex is reflected in the surface of a conductor layer.

  Next, a preferred embodiment of the circuit board of the present invention will be described.

  FIG. 4 is a schematic cross-sectional view showing the first embodiment of the circuit board of the present invention. As shown in FIG. 4, in the circuit board 400, the insulating substrate 401 is formed with a first through hole 410 and a second through hole 420 that penetrate in the thickness direction. A conductive portion 411 made of the first resin composition is formed in the first through hole 410 so as to fill the entire first through hole 410, and a wiring pattern is formed on both surfaces of the insulating substrate 401. 412a and 412b are formed in a state of being in electrical contact with the conductive portion 411. That is, the electrical connection in the thickness direction of the insulating substrate 401 is made by the conductive portion 411. Further, in the second through hole 420, a second resin composition 421 filled in a portion excluding the openings at both ends of the second through hole 420, and an insulating resin disposed in the opening. A heat dissipating part 423 composed of the layers 422a and 422b is formed.

  Here, the insulating substrate 400 is formed using the composite 100 or the prepreg 200 of the present invention described above.

  The 1st resin composition which comprises the said electroconductive part 411 contains electroconductive particle, For example, metals, metal oxides, such as gold | metal | money, silver, nickel, copper, platinum, palladium, or ruthenium oxide, or organic It consists of conductive particles such as a metal compound and the above-described curable resin composition such as an epoxy resin and its curing agent. Moreover, the 2nd resin composition 421 which comprises the thermal radiation part 423 also consists of a material similar to the said 1st resin composition.

  Furthermore, the insulating resin layers 422a and 422b constituting the heat radiation portion 423 are made of the above-described insulating curable resin composition such as the epoxy resin and its curing agent.

  The wiring patterns 412a and 412b are made of a metal such as copper, aluminum, or nickel.

  In the circuit board 400 having such a configuration, not only heat dissipation by the conductive portion 411 but also internal heat is sufficiently dissipated by the heat dissipation portion 423. In addition, since no electrode lands are formed around the heat dissipating part 423, wiring can be arranged in the substrate region around the heat dissipating part 423. Therefore, according to such a circuit board, sufficient heat dissipation can be obtained, high-density wiring can be formed, and excellent reliability can be obtained.

  FIG. 5 is a schematic cross-sectional view showing a second embodiment of the circuit board of the present invention. As shown in FIG. 5, in the circuit board 500, a first through hole 510 and a second through hole 520 that penetrate in the thickness direction are formed in the insulating substrate 501. A conductive portion 511 made of the first resin composition is formed in the first through hole 510 so as to fill the entire first through hole 510, and a wiring pattern is formed on both surfaces of the insulating substrate 501. 512a and 512b are formed in electrical contact with the conductive portion 511. That is, electrical connection in the thickness direction of the insulating substrate 501 is made by the conductive portion 511. Further, in the second through hole 520, a heat radiating portion 523 made of an insulating third resin composition containing insulating particles is formed so as to fill the entire second through hole 520.

  Here, the third resin composition constituting the heat radiation part 523 is an insulating resin composition containing insulating particles. For example, ceramic particles such as alumina particles, silica particles, and magnesia particles are used as insulating particles. And those obtained by dispersing and mixing them in the above-described curable resin composition such as an epoxy resin and its curing agent.

  In the circuit board of the second embodiment, the configuration other than the heat dissipation portion 523 is the same as the configuration of the circuit board of the first embodiment.

  In the circuit board 500 having such a configuration, not only heat dissipation by the conductive portion 511 but also internal heat is sufficiently dissipated by the heat dissipation portion 523. In addition, since no electrode land is formed around the heat dissipating part 523, wiring can be arranged in the substrate region around the heat dissipating part 523. Therefore, according to such a circuit board, sufficient heat dissipation can be obtained, high-density wiring can be formed, and excellent reliability can be obtained.

  FIG. 6 is a schematic cross-sectional view showing a third embodiment of the circuit board of the present invention. As shown in FIG. 6, in the circuit board 600, a first through hole 610, a second through hole 620, and a third through hole 630 that penetrate in the thickness direction are formed in the insulating substrate 601. . A conductive portion 611 made of the first resin composition is formed in the first through hole 610 so as to fill the entire first through hole 610, and a wiring pattern is formed on both surfaces of the insulating substrate 601. 612a and 612b are formed in electrical contact with the conductive portion 611. That is, electrical connection in the thickness direction of the insulating substrate 601 is made by the conductive portion 611. Further, in the second through hole 620, a second resin composition 621 filled in a portion excluding the openings at both ends of the second through hole 620, and an insulating resin disposed in the opening. A first heat radiating portion 623 composed of the layers 622a and 622b is formed. Further, in the third through hole 630, a second heat radiating portion 633 made of an insulating third resin composition containing insulating particles is formed so as to fill the entire third through hole 630. Yes.

  In the circuit board of the third embodiment, the conductive portion 611 has the same configuration as the conductive portion 411 in the first embodiment, and the first heat dissipation portion 623 is the same as the heat dissipation portion 423 in the first embodiment. The second heat radiation part 633 has the same structure as the heat radiation part 523 in the second embodiment. Furthermore, the insulating substrate 601 and the wiring patterns 612a and 612b have the same configuration as the insulating substrate 401 and the wiring patterns 412a and 412b in the first embodiment.

  In the circuit board 600 having such a configuration, not only heat dissipation by the conductive portion 611 but also internal heat is sufficiently dissipated by the first heat dissipation portion 623 and the second heat dissipation portion 633. In addition, since no land of electrodes is formed around the first heat radiation part 623 and the second heat radiation part 633, wiring is arranged in the substrate region around the first heat radiation part 623 and the second heat radiation part 633. Is possible. Therefore, according to such a circuit board, sufficient heat dissipation can be obtained, high-density wiring can be formed, and excellent reliability can be obtained.

  The preferred embodiment of the circuit board of the present invention has been described above, but the circuit board of the present invention is not limited to the above-described embodiment formation.

  For example, in the circuit boards in the first to third embodiments, one conductive part is provided, but a plurality of conductive parts having the same configuration may be provided. Similarly, with regard to the heat radiating portion, a plurality of heat radiating portions having the same configuration as the first heat radiating portion 623 and the second heat radiating portion 633 shown in the third embodiment may be provided.

  Furthermore, although the circuit board in the first to third embodiments is only one layer, a circuit board may be further laminated on the upper and lower surfaces of the circuit board to form a multilayer wiring board. In this case, the circuit board to be further laminated may have the configuration of the circuit board of the present invention, or may have a configuration different from the configuration of the circuit board of the present invention.

  Next, a preferred embodiment of the circuit board manufacturing method of the present invention will be described.

  FIGS. 7A to 7D are a series of process diagrams showing a first embodiment of a circuit board manufacturing method according to the present invention. First, as shown in FIG. 7 (a), a prepreg 210 made of the composite of the present invention is used as a base, and resin films 120a and 120b such as polyethylene terephthalate films are attached to both surfaces as cover films, and the overall thickness is obtained. A first through hole 410 and a second through hole 420 that penetrate in the direction are formed.

  In general, a drill or a laser beam is used to form the first through hole 410 and the second through hole 420. Drilling with a laser beam is preferable because holes can be made with a fine pitch and no shavings are produced.

  Then, the conductive paste 130 is filled in each of the first and second through holes (via holes) 410 and 420 thus formed. As a filling method of the conductive paste 130, various methods such as gravure printing, pressing with a roll, and reduced pressure filling can be employed.

  The conductive paste 130 used here contains at least conductive particles and a resin component. As the conductive particles, for example, conductive particles such as a metal such as gold, silver, nickel, copper, platinum, palladium, ruthenium oxide, a metal oxide, or an organometallic compound are used. Moreover, as a resin component, curable resin compositions mentioned above, such as an epoxy resin and its hardening | curing agent, are used, for example.

  Next, as shown in FIG. 7B, after removing the resin films 120 a and 120 b from both surfaces of the prepreg 210, the metal foils 140 a and 140 b are disposed so as to sandwich the prepreg 210. In this state, the whole is subjected to pressure heat treatment by heating while pressing in the directions of arrows A and B.

  FIG.7 (c) has shown the state after performing a pressurization heat processing, and while the prepreg 210 is compressed and thickness is thinned, the curable resin composition in a prepreg hardens | cures, and insulation is shown. A substrate 401 is formed. In addition, the conductive paste 130 filled in the first through-hole 410 and the second through-hole 420 is also compressed, and the resin component in the conductive paste 130 is cured, so that the conductive portion 411 and the conductive portion ( Second resin composition) 421 is formed.

  Thereafter, the metal foils 140a and 140b are etched to form a desired wiring pattern. At this time, etching is performed so that the metal foil covering at least the openings at both ends of the second through-hole 420 is removed, and the etching is further continued, so that an opening in the second through-hole 420 is obtained. The conductive particles in the conductive portion 421 existing in the substrate are dissolved and removed. As a result, as shown in FIG. 7D, insulating insulating resin layers 422a and 422b made of the resin component after the conductive particles are removed are formed in the openings in the second through holes 420. To do. The insulating resin layers 422a and 422b and the conductive portion 421 form a heat radiating portion 423. Thus, the manufacture of the circuit board 400 is completed.

  The etching here can be performed, for example, by wet etching using ferric chloride as an etchant.

  In the circuit board 400, a conductive portion 411 is formed, and wiring patterns 412a and 412b are formed so as to be in electrical contact with the conductive portion. Thereby, the electrical connection between the electrode layers by an IVH structure is performed. In addition, a wiring pattern may be formed on a portion of the insulating substrate 401 where the conductive portion 411 does not exist, and such wiring patterns 432a and 432b are formed on the circuit board 400. Such wiring patterns 432a and 432b are effective when a multilayer wiring board is manufactured.

  In the circuit board 400 having the above configuration, the internal heat is sufficiently radiated by the heat radiating portion 423. In addition, since no electrode lands are formed around the heat dissipating part 423, wiring can be arranged in the substrate region around the heat dissipating part 423. Therefore, according to such a circuit board, sufficient heat dissipation can be obtained, high-density wiring can be formed, and excellent reliability can be obtained.

  Next, a second embodiment of the circuit board manufacturing method of the present invention will be described. FIGS. 8A to 8D are a series of process diagrams showing a second embodiment of the circuit board manufacturing method of the present invention. First, as shown in FIG. 8 (a), the prepreg 210 made of the composite of the present invention is used as a base, and the resin films 120a and 120b described above are attached to both surfaces as cover films, and the entire thickness direction A first through hole 510 and a second through hole 520 are formed.

  Next, the conductive paste 130 described above is filled in the first through hole 510. On the other hand, the second through hole 520 is filled with an insulating paste 150 containing at least insulating particles and a resin component. As a filling method of the conductive paste 130 and the insulating paste 150, various methods such as gravure printing, pressing with a roll, and filling under reduced pressure can be adopted.

  The insulating paste 150 used here contains at least insulating particles and a resin component. As the insulating particles, for example, ceramic particles such as alumina particles, silica particles, and magnesia particles are used. Moreover, as a resin component, curable resin compositions mentioned above, such as an epoxy resin and its hardening | curing agent, are used, for example.

  Next, as shown in FIG. 8B, after removing the resin films 120 a and 120 b from both surfaces of the prepreg 210, the metal foils 140 a and 140 b are arranged so as to sandwich the prepreg 210. In this state, the whole is subjected to pressure heat treatment by heating while pressing in the directions of arrows A and B.

  FIG. 8C shows a state after the pressure and heat treatment is performed. The prepreg 210 is compressed and thinned, and the curable resin composition in the prepreg is cured and insulated. A substrate 501 is formed. Further, the conductive paste 130 filled in the first through hole 510 and the insulating paste 150 filled in the second through hole 520 are also compressed. The resin component in the conductive paste 130 is cured to form the conductive portion 511, and the resin component in the insulating paste 150 is cured to form the heat dissipation portion 523.

  Thereafter, the metal foils 140a and 140b are etched to form a desired wiring pattern. At this time, etching is performed so that at least the metal foil covering the openings at both ends of the second through-hole 520 is removed. Thereby, the manufacture of the circuit board 500 having the structure shown in FIG.

  In the circuit board 500, the conductive portions 511 and the wiring patterns 512a and 512b are formed in a state of being in electrical contact with the conductive portion 511, whereby electrical connection between the electrode layers by the IVH structure is performed. In addition, wiring patterns 532a and 532b are formed in a portion where the conductive portion 511 of the insulating substrate 501 does not exist.

  In the circuit board 500 having the above configuration, the internal heat is sufficiently dissipated by the heat dissipating part 523. In addition, since no electrode land is formed around the heat dissipating part 523, wiring can be arranged in the substrate region around the heat dissipating part 523. Therefore, according to such a circuit board, sufficient heat dissipation can be obtained, high-density wiring can be formed, and excellent reliability can be obtained.

  Next, a third embodiment of the circuit board manufacturing method of the present invention will be described. FIGS. 9A to 9D are a series of process diagrams showing a third embodiment of the circuit board manufacturing method of the present invention. First, as shown in FIG. 9 (a), the prepreg 210 made of the composite of the present invention is used as a base, and the resin films 120a and 120b described above are pasted on both surfaces as cover films, and the entire thickness direction A first through hole 610, a second through hole 620, and a third through hole 630 are formed.

  Next, each of the first through hole 610 and the second through hole 620 is filled with the conductive paste 130 described above. Meanwhile, the third through hole 630 is filled with the insulating paste 150 described above. As a filling method of the conductive paste 130 and the insulating paste 150, various methods such as gravure printing, pressing with a roll, and filling under reduced pressure can be adopted.

  Next, as shown in FIG. 9B, after removing the resin films 120 a and 120 b from both surfaces of the prepreg 210, metal foils 140 a and 140 b are arranged so as to sandwich the prepreg 210. In this state, the whole is subjected to pressure heat treatment by heating while pressing in the directions of arrows A and B.

  FIG. 9C shows a state after the pressure and heat treatment is performed. The prepreg 210 is compressed and thinned, and the curable resin composition in the prepreg is cured and insulated. A substrate 601 is formed. In addition, the conductive paste 130 filled in the first through-hole 610 and the second through-hole 620 and the insulating paste 150 filled in the third through-hole 630 are also compressed. Then, the resin component in the conductive paste 130 is cured to form the conductive portion 611 and the conductive portion 621, and the resin component in the insulating paste 150 is cured to form the second heat radiating portion 633. .

  Thereafter, the metal foils 140a and 140b are etched to form a desired wiring pattern. At this time, etching is performed so that the metal foil covering the openings at both ends of at least the second through-hole 620 and the third through-hole 630 is removed. Here, by further performing etching, the conductive particles in the conductive portion 621 existing in the opening in the second through hole 620 are dissolved and removed. As a result, as shown in FIG. 9D, insulating insulating resin layers 622a and 622b made of the resin component after the conductive particles are removed are formed in the openings in the second through holes 620. To do. The insulating resin layers 622a and 622b and the conductive portion 621 form a first heat radiating portion 623. Thus, the manufacture of the circuit board 600 is completed.

  In the circuit board 500, the conductive portions 611 and the wiring patterns 612a and 612b are formed in electrical contact with the conductive portion 611, whereby electrical connection between the electrode layers by the IVH structure is performed. In addition, wiring patterns 632a and 632b are formed in a portion of the insulating substrate 601 where the conductive portion 611 is not present.

  In the circuit board 600 having the above configuration, the internal heat is sufficiently radiated by the first heat radiating portion 623 and the second heat radiating portion 633. In addition, since no electrode lands are formed around the first and second heat radiating portions 623 and 633, wiring can be arranged in the peripheral substrate region. Therefore, according to such a circuit board, sufficient heat dissipation can be obtained, high-density wiring can be formed, and excellent reliability can be obtained.

  Next, a fourth embodiment of the circuit board manufacturing method of the present invention will be described. FIGS. 10A to 10B are a series of process diagrams showing a fourth embodiment of a circuit board manufacturing method of the present invention. The circuit board manufacturing method according to the fourth embodiment is a method of forming a multilayer wiring board by repeatedly performing the circuit board manufacturing method according to the first embodiment. First, the first through-hole 710, the second through-hole 720, and the third through-hole 730 are formed in the insulating substrate 701. The conductive portion 711 and the third through-hole 730 are formed in the first through-hole 710 and the third through-hole 730, respectively. A circuit board 750 having a configuration in which conductive portions 731 are respectively formed and a heat radiating portion 723 including a conductive portion 721 and insulating resin layers 722a and 722b is formed in the second through-hole 720 is prepared. On both surfaces of the circuit board 750, circuit patterns 712a and 712b electrically connected to the conductive portion 711 and circuit patterns 732a and 732b electrically connected to the conductive portion 731 are formed.

  Then, as shown in FIG. 10 (a), through holes are formed in the prepregs 761a and 761b made of the composite material of the present invention on both sides (upper and lower surfaces) of the circuit board 750, and the conductivity described above is formed in the through holes. The paste filled with the conductive paste 762a, 762b, 763a and 763b was disposed, and the metal foils 770a and 770b were further disposed outside these. In this state, the whole is subjected to pressure and heat treatment by heating while pressing in the directions of arrows A and B, and further, the metal foils 770a and 770b are processed into a desired wiring pattern, so that FIG. A laminated circuit board (multilayer wiring board) 700 shown is obtained.

  In the circuit board 700 in FIG. 10B, the curable resin compositions in the prepregs 761a and 761b are cured to form the insulating substrates 781a and 781b, respectively, and the conductive pastes 762a, 762b, 763a, and 763b The resin component is cured to form conductive portions 782a, 782b, 783a and 783b, respectively. Further, the metal foils 770a and 770b are processed into wiring patterns 790a and 790b.

  In the circuit board 700 having the above configuration, the internal heat is sufficiently radiated by the heat radiating portion 723. In addition, since no electrode lands are formed around the heat dissipating portion 723, wiring is arranged in the peripheral substrate region. Therefore, according to the circuit board 700, sufficient heat dissipation can be obtained, high-density wiring can be formed, and excellent reliability can be obtained.

  Next, a fifth embodiment of the circuit board manufacturing method of the present invention will be described. FIGS. 11A to 11B are a series of process diagrams showing a fifth embodiment of the circuit board manufacturing method of the present invention. The circuit board manufacturing method according to the fifth embodiment is a method different from the fourth embodiment for manufacturing a multilayer wiring board. First, the first through hole 810, the second through hole 820, and the third through hole 830 are formed in the insulating substrate 801. The conductive portion 811 and the second through hole 820 are formed in the first through hole 810 and the second through hole 820, respectively. A circuit board 850 having a configuration in which the conductive portions 821 are respectively formed and the heat radiating portion 833 including the conductive portions 831 and the insulating resin layers 832a and 832b is formed in the third through hole 830 is prepared. On both surfaces of the circuit board 850, circuit patterns 812a and 812b electrically connected to the conductive portion 811 and circuit patterns 822a and 822b electrically connected to the conductive portion 821 are formed. In addition, a circuit board 840 is prepared in which two through holes are formed in the insulating substrate 841 and conductive portions 842 and 843 are formed in these through holes. On both surfaces of the circuit board 840, circuit patterns 844a and 844b electrically connected to the conductive portion 842 and circuit patterns 845a and 845b electrically connected to the conductive portion 843 are formed.

  And as shown to Fig.11 (a), between these circuit boards 840 and 850, the through-hole was formed in the prepreg 861 which consists of a composite material of this invention, and the electrically conductive paste demonstrated previously to the through-hole The one filled with 862 and 863 was placed. In this state, the laminated circuit board (multilayer wiring board) 800 shown in FIG. 10B is obtained by applying pressure and heat treatment to the whole by heating while applying pressure in the directions of arrows A and B. .

  In the circuit board 800 having the above configuration, the internal heat is sufficiently dissipated by the heat dissipating part 833. In addition, since no land of electrodes is formed around the heat dissipating portion 833, wiring is arranged in the peripheral substrate region. Therefore, according to the circuit board 800, sufficient heat dissipation can be obtained, high-density wiring can be formed, and excellent reliability can be obtained.

  FIGS. 12A to 12B are views showing a solder surface in a double-sided board for mounting a bare chip (multilayer board) manufactured by the method for manufacturing a circuit board of the present invention, and a copper foil is provided on the surface of the insulating substrate 901. Many patterns 902 exist. FIG. 12B is a diagram showing a semiconductor chip (IC) mounting surface in a bare chip mounting double-sided board (multilayer board) manufactured by the circuit board manufacturing method of the present invention. 2 shows a portion where a copper foil pattern (copper land) 902 existing in FIG. 2 and an IC pad 904 for via IC mounting are connected by a wiring 906. Further, a heat radiating portion 903 is formed on the insulating substrate 901, and a copper foil pattern (copper land) is not formed in a portion where the heat radiating portion 903 is formed. A wide space can be taken around. Therefore, in the substrate region around the heat radiating portion 903, as shown in FIG. Although the IC pad 905 is actually provided with wiring, it is omitted for convenience of explanation.

  The preferred embodiment of the method for manufacturing a circuit board according to the present invention has been described above, but the method for manufacturing a circuit board according to the present invention is not limited to the above-described embodiment formation.

  For example, in the circuit boards in the first to third embodiments, one conductive portion is formed, but a plurality of conductive portions having the same configuration may be formed by the same manufacturing procedure. Similarly, a plurality of heat radiating parts having the same configuration as the first heat radiating part 623 and the second heat radiating part 633 shown in the third embodiment may be formed in the same manufacturing procedure.

  Furthermore, in the circuit boards (multilayer wiring boards) in the fourth to fifth embodiments, the heat radiation part having the configuration of the first heat radiation part 623 shown in the third embodiment is formed. Instead, one having the configuration of the second heat radiation portion 633 may be formed. Further, a plurality of heat radiating portions having the configuration of the first heat radiating portion 623 or the second heat radiating portion 633 may be formed.

  Furthermore, since the heat radiation part having the configuration of the second heat radiation part 633 shown in the third embodiment has a very high degree of insulation, it is possible to directly form a wiring pattern on the heat radiation part. ing. Therefore, in the second to third embodiments, a wiring pattern may be formed on the heat dissipation part. That is, also in FIG. 12B, when the heat radiating portion 903 has the configuration of the second heat radiating portion 633, a wiring pattern may be formed on the heat radiating portion 903. As a result, higher density wiring can be formed.

FIG. 1 is a schematic cross-sectional view showing one embodiment of the composite of the present invention. FIG. 2 is a schematic cross-sectional view showing an embodiment of the prepreg of the present invention. FIG. 3 is a schematic cross-sectional view showing an embodiment of the metal foil-clad laminate of the present invention. 1 is a schematic cross-sectional view showing a first embodiment of a circuit board of the present invention. It is a schematic cross section which shows 2nd Embodiment of the circuit board of this invention. It is a schematic cross section which shows 3rd Embodiment of the circuit board of this invention. (A)-(d) is a series of process drawings which show 1st Embodiment of the manufacturing method of the circuit board of this invention. (A)-(d) is a series of process drawings which show 2nd Embodiment of the manufacturing method of the circuit board of this invention. (A)-(d) is a series of process figures which show 3rd Embodiment of the manufacturing method of the circuit board of this invention. (A)-(b) is a series of process drawings which show 4th Embodiment of the manufacturing method of the circuit board of this invention. (A)-(b) is a series of process drawings which shows 5th Embodiment of the manufacturing method of the circuit board of this invention. (A)-(b) is a figure which shows the solder surface and semiconductor chip mounting surface in the double-sided board for multilayer mounting (multilayer board | substrate) manufactured by the manufacturing method of the circuit board of this invention.

Explanation of symbols

DESCRIPTION OF SYMBOLS 100 ... Composite, 101 ... Fiber sheet, 102 ... Curable resin composition, 103, 203, 303 ... Through-hole, 200 ... Pre-preg, 201 ... Fiber sheet, 202 ... Semi-cured resin composition layer, 300 ... Metal foil tension Laminated plate, 301 ... insulating substrate, 302 ... conductor layer, 304 ... conductive portion.

Claims (17)

A composite comprising a fiber sheet impregnated with a curable resin composition,
The composite whose storage elastic modulus in 20 degreeC of the hardened | cured material of the said curable resin composition is 100-2000 Mpa.   The composite according to claim 1, wherein a ratio Va / Vb of a volume Va of the curable resin composition to a volume Vb of the fiber sheet is 0.3 to 0.9.   The composite_body | complex of Claim 1 or 2 in which the said curable resin composition contains a viscoelastic resin.   The curable resin composition contains an acrylic polymer having a weight average molecular weight of 30000 or more, and the acrylic polymer contains 2 to 20% by mass of glycidyl acrylate as a polymerization component and has an epoxy value of 2 to 36. The complex according to any one of claims 1 to 3.   The composite according to any one of claims 1 to 4, wherein the fiber sheet is a glass cloth having a thickness of 10 to 200 µm.   The composite according to any one of claims 1 to 5, wherein the total thickness of the composite is 100 µm or less.   The complex according to any one of claims 1 to 6, which has a through-hole.   The composite according to any one of claims 1 to 6, wherein the curable resin composition is semi-cured.   The prepreg of Claim 8 which has a through-hole.   8. The composite according to claim 7, wherein the metal foil-clad laminate is obtained by heating and pressurizing the through-hole filled with a conductor and a metal foil disposed on at least one surface of the composite.   The prepreg according to claim 9, wherein the metal foil-clad laminate is obtained by heating and pressing a through-hole filled with a conductor and a metal foil disposed on at least one surface of the prepreg. A first through hole penetrating in the thickness direction is formed in the insulating substrate made of the composite according to any one of claims 1 to 6, and conductive particles are formed in the first through hole. A circuit board in which a conductive portion made of a first resin composition containing the conductive resin is formed so as to fill the entire first through hole, and electrical connection in the thickness direction of the insulating substrate is made by the conductive portion. There,
The insulating substrate is further formed with a second through-hole penetrating in the thickness direction, and the second through-hole is formed in a portion excluding openings at both ends of the second through-hole. A circuit board on which a heat radiating portion is formed which is composed of a filled second resin composition containing conductive particles and an insulating resin layer disposed in the opening. A first through hole penetrating in the thickness direction is formed in the insulating substrate made of the composite according to any one of claims 1 to 6, and conductive particles are formed in the first through hole. A circuit board in which a conductive portion made of a first resin composition containing the conductive resin is formed so as to fill the entire first through hole, and electrical connection in the thickness direction of the insulating substrate is made by the conductive portion. There,
The insulating substrate is further formed with a second through-hole penetrating in the thickness direction, and an insulating third resin composition containing insulating particles in the second through-hole. A circuit board, wherein the heat dissipation portion is formed so as to fill the entire second through hole. A first through hole penetrating in the thickness direction is formed in the insulating substrate made of the composite according to any one of claims 1 to 6, and conductive particles are formed in the first through hole. A circuit board in which a conductive portion made of a first resin composition containing the conductive resin is formed so as to fill the entire first through hole, and electrical connection in the thickness direction of the insulating substrate is made by the conductive portion. There,
The insulating substrate is further formed with a second through-hole penetrating in the thickness direction, and the second through-hole is formed in a portion excluding openings at both ends of the second through-hole. A filled first resin composition containing conductive particles and an insulating resin layer disposed in the opening are formed; and
A third through hole penetrating in the thickness direction is further formed in the insulating substrate, and a third resin composition containing an insulating particle is contained in the third through hole. A circuit board, wherein two heat dissipating parts are formed so as to fill the entire third through hole. A step of bonding a cover film to both surfaces of a substrate made of the composite according to any one of claims 1 to 6;
Forming a first through hole and a second through hole penetrating in the thickness direction of the base body in the base body and the cover film;
Filling the first through hole and the second through hole with a conductive paste containing at least conductive particles and a resin component;
Removing the cover film from the substrate;
Applying pressure and heat treatment in a state where metal foils are arranged on both surfaces of the base, and curing the curable resin composition in the base and the resin component in the conductive paste;
Etching is performed on the metal foil so that at least a portion blocking the opening of the second through hole is removed, the metal foil is patterned into a predetermined circuit pattern, and the metal foil is formed in the second through hole. Dissolving and removing the conductive particles present in the opening, and forming an insulating insulating resin layer made of the resin component in the opening;
A method for manufacturing a circuit board, comprising: A step of bonding a cover film to both surfaces of a substrate made of the composite according to any one of claims 1 to 6;
Forming a first through hole and a second through hole penetrating in the thickness direction of the base body in the base body and the cover film;
Filling the first through hole with a conductive paste containing at least conductive particles and a resin component;
Filling the second through-hole with an insulating paste containing at least insulating particles and the resin component;
Removing the cover film from the substrate;
Applying pressure and heat treatment in a state where metal foils are disposed on both surfaces of the substrate, and curing the curable resin composition in the substrate, and the resin component in the conductive paste and the insulating paste; ,
Etching the metal foil so that at least a portion blocking the opening of the second through hole is removed, and patterning the metal foil into a predetermined circuit pattern;
A method for manufacturing a circuit board, comprising: A step of bonding a cover film to both surfaces of a substrate made of the composite according to any one of claims 1 to 6;
Forming a first through hole, a second through hole, and a third through hole penetrating in the thickness direction of the base body in the base body and the cover film;
Filling the first through hole and the second through hole with a conductive paste containing at least conductive particles and a resin component;
Filling the third through-hole with an insulating paste containing at least insulating particles and the resin component;
Removing the cover film from the substrate;
Applying pressure and heat treatment in a state where metal foils are disposed on both surfaces of the substrate, and curing the curable resin composition in the substrate, and the resin component in the conductive paste and the insulating paste; ,
Etching is performed on the metal foil so as to remove at least a portion covering the opening of the second through hole and the opening of the third through hole, and the metal foil is patterned into a predetermined circuit pattern. Dissolving and removing the conductive particles present in the opening in the second through hole, and forming an insulating insulating resin layer made of the resin component in the opening;
A method for manufacturing a circuit board, comprising:

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