JP2006114779A - Manufacturing method of etching metal body - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide the manufacturing method of an etching metal body which improves yield. <P>SOLUTION: In the manufacturing method of an etching metal body; a process for preparing a metal foil sticking body 10 comprising a protective film 2 supporting a pressure sensitive adhesive layer 4 which can lower adhesion by irradiation of active energy beam in the surface of a supporter 3 and a metallic layer 1 to be etched, and forming a resist film 5 in the surface of the metallic layer to be etched; and a process for irradiating an adhesive layer with active energy beam via an irradiation mask sheet 31 with a transmitting region 31b and a non-transmitting region 31a of active energy beam, hardening an adhesive by at least irradiating an etchant contact region, and keeping the adhesive in its un-hardened state without irradiating at least a part of the etchant non-contact region are carried out in an arbitrary order. An etching process is carried out, and the method comprises each of processes for hardening the un-hardened adhesive by irradiation of active energy beam and for forming an etching metal body by peeling the protection film. <P>COPYRIGHT: (C)2006,JPO&NCIPI

Description

  The present invention relates to a method for producing an etched metal body. According to the manufacturing method of the present invention, it is possible to manufacture an etching metal body, for example, a wiring layer film connecting member, a circuit member, or an electromagnetic wave shielding metal mesh member with an excellent yield.

  In a conventional manufacturing method of an etching metal body such as a wiring layer inter-film connecting member or a circuit member, a technique using a protective film is known. That is, a process of forming a metal bump on the protective film by etching the metal layer to be etched that is adhered to the protective film with a pressure-sensitive adhesive (in the case of a wiring layer film connecting member), or a metal circuit A method is known in which the step of forming the film (in the case of a circuit member) is performed, and the protective film is peeled off after the etching step.

First, a conventional method using a protective film when manufacturing a wiring layer inter-film connecting member will be specifically described.
For electronic component elements such as semiconductor elements and liquid crystal display elements, the use of multilayer wiring boards has been proposed, and the use of metal bump groups as interlayer connection means between circuits formed in each layer has been proposed. Attempts to adopt such metal bumps were proposed as an improved method for printed circuit boards using conductive paste as an interlayer connection means, and a method was proposed in which a bump group was formed by etching copper foil and a protective film was used at that time. (Patent Document 1).

The outline of the prior art for manufacturing the wiring layer inter-film connecting member by using the protective film as described above will be described below with reference to FIGS.
FIGS. 10 (1a) to (1f) and FIGS. 11 (11g) to (1l) show a manufacturing process of a conventional wiring layer film connecting member and a wiring circuit board using the wiring layer film connecting member. It is typical sectional drawing which shows the process of manufacturing in order.

(1) Step (1a):
As shown in FIG. 10 (1a), a metal foil patch 10 is prepared. The metal foil patch 10 includes a bump-forming metal layer (for example, a copper layer) 1 and a protective film 2. The protective film 2 includes a support 3 and a pressure-sensitive adhesive layer 4 supported on one surface thereof, and is bonded to the bump-forming metal layer 1 by the pressure-sensitive adhesive layer 4. As the pressure-sensitive adhesive constituting the pressure-sensitive adhesive layer 4, a normal pressure-sensitive adhesive can be used as described in the embodiment of Patent Document 1, but active energy (for example, ultraviolet light) is used. It is also possible to use a curable adhesive. Hereinafter, it demonstrates along the case where an active energy curable adhesive is used. The active energy curable adhesive has a sufficient adhesive force before irradiation with active energy rays, whereas the adhesive strength decreases after irradiation with active energy rays and can be easily peeled off from the adherend. In this step (1a), the pressure-sensitive adhesive is entirely before active energy ray irradiation, and thus the protective film 2 is a completely adhesive protective film.

(2) Steps (1b) to (1c):
Next, as shown in FIG. 10 (1 b), a resist film 5 is selectively formed on the surface of the bump forming metal layer 1. The resist film 5 is formed so as to cover only a portion where a bump is to be formed. Subsequently, as shown in FIG. 10 (1 c), the bump forming metal layer 1 is etched using the resist film 5 as a mask material to form a large number of bumps 6. This etching can be performed, for example, by wet etching, and the etching solution used is an etching solution that can erode the metal layer 1 for bump formation.

(3) Step (1d):
Next, as shown in FIG. 10D, the resist film 5 used as an etching mask material in the etching is removed. FIG. 10 (1d) shows the state after removing the etching mask. Thus, a bump group carrier 11 having a structure in which a large number of bumps 6 are formed on the complete adhesion state protective film 2 is formed.

(4) Step (1e)
Subsequently, as shown in FIG. 10 (1 e), the insulating resin layer 7 is inserted into the gaps of the bumps 6 in the bump group carrier 11. For example, the insulating resin layer 7 made of the adhesive sheet is formed by pressing an insulating adhesive sheet onto the surface of the bump group carrier 11 on the side where the bumps 6 are formed with a heat roller. Can do. At this time, after the formation of the insulating resin layer 7, it is necessary to expose the tops of the bumps 6 by projecting from the insulating resin layer 7. Therefore, as the adhesive sheet, a sheet that is appropriately thinner than the height of the bump 6 is used. If the upper portion of the bump 6 is not exposed, interlayer connection by the bump 6 cannot be reliably performed. By this step (1e), the bump group resin carrier 12 carrying the bump group resin filler is formed on the complete adhesion state protective film 2.

(5) Step (1f):
Next, as shown by an arrow Z in FIG. 10 (1 f), when the pressure sensitive adhesive layer 4 is irradiated with active energy rays (for example, ultraviolet rays or electron beams) through the support 3, the pressure sensitive adhesive is cured. Then, the pressure-sensitive adhesive layer 4B having reduced adhesive strength is converted, and the complete adhesion state protective film 2 is converted to the peelable protective film 2B. In addition, the support body 3 consists of material which can permeate | transmit the active energy ray which can reduce the adhesive force of the said pressure sensitive adhesive by irradiation.

(6) Steps (1g) to (1h):
Subsequently, when the peelable protective film 2B is peeled from the bump group resin carrier 12 as shown in FIG. 11 (1g), the bump group resin filler 13 can be obtained as shown in FIG. 11 (1h). . As shown in FIG. 12 (schematic plan view), the bump group resin filler 13 thus obtained has both ends 6a and 6b of each bump 6 exposed, and each bump 6 has an insulating property. The resin layers 7 are isolated from each other by an insulating resin. Further, by using this bump group resin filler 13, a circuit forming substrate 14 [FIG. 11 (1j)] or a printed circuit board 15 [FIG. 11 (1l)] is manufactured as described later, and further, a multilayer wiring A circuit board can be manufactured.

(6) Steps (1i) to (1j):
In order to manufacture the circuit forming substrate 14 as shown in FIG. 11 (1j) using the bump group resin filler 13, as shown in FIG. 11 (1i), a conductive circuit forming metal foil (for example, The copper foils 21 and 22 are thermocompression bonded from both sides of the bump group resin filler 13 by a lamination press. At this time, the conductive circuit forming metal foils 21 and 22 are bonded to the exposed surfaces 6a and 6b of the bumps 6 in the bump group resin filler 13. In the circuit forming substrate 14 thus obtained, the conductor circuit forming metal layers 23 and 24 are electrically connected via the bumps 6, and the bumps 6 are electrically connected to each other by the insulating resin layer 7. Insulative insulation. The thickness of the conductor circuit forming metal foils 21 and 22 is, for example, about 18 μm.

(7) Steps (1k) to (l):
As shown in FIG. 11 (1k), a conductor circuit resist film 8 serving as an etching mask is formed on each surface of the conductor circuit forming metal layers 23 and 24 of the circuit forming substrate 14 obtained in the step (1j). Subsequently, the conductive circuit 9 can be formed by etching the conductive circuit forming metal layers 23 and 24 using the resist film 8 as a mask. The resist film 8 is removed, and a printed circuit board 15 is formed as shown in FIG. The printed circuit board 15 has conductor circuits 9 on both surfaces, and is electrically connected via bumps 6 at portions where the circuits on both surfaces are necessary. The resin layers 7 are electrically insulated from each other.

Next, a conventional method using a protective film when manufacturing a circuit member will be specifically described.
Conventionally, a ceramic wiring board or a resin wiring board is known as a high-density wiring board, for example, a high-density multilayer wiring board used for a package containing a semiconductor element. The ceramic wiring board is formed by forming a wiring conductor made of a refractory metal such as tungsten or molybdenum on an insulating board such as alumina, and a recess is formed in a part of the insulating board. A semiconductor element is accommodated in the recess, and the recess is hermetically sealed with an appropriate lid to form a package. In addition, the resin wiring board is formed by forming a circuit pattern made of a metal layer such as copper on the surface of an insulating substrate containing an organic resin. This resin wiring board is easily chipped and cracked like a ceramic wiring board. There are no disadvantages such as being easy, and there is an advantage that a heat treatment at a high temperature such as firing is not required for multilayering.
The outline of the conventional method (for example, patent document 2) which utilizes a protective film when manufacturing the circuit member used as such a resin wiring board is demonstrated concretely below along FIG.13 and FIG.14. FIGS. 13 (2a) to (2e) and FIGS. 14 (2f) to (2g) are schematic cross-sectional views illustrating a conventional method of manufacturing a circuit member in the order of steps.

(1) Step (2a):
As shown in FIG. 13 (2a), a metal foil patch 40 is prepared. The metal foil patch 40 includes a circuit-forming metal layer (for example, a copper layer) 41 and the protective film 2. Here, the protective film 2 has basically the same structure as the protective film used in the method for manufacturing the wiring layer inter-film connecting member described with reference to FIGS. 10 and 11, and the support 3 and one of the protective films. The pressure-sensitive adhesive layer 4 is carried on the surface, and is bonded to the circuit-forming metal layer 41 by the pressure-sensitive adhesive layer 4. The pressure-sensitive adhesive constituting the pressure-sensitive adhesive layer 4 is an active energy (for example, ultraviolet ray or electron beam) curable adhesive, and has sufficient adhesive force before irradiation with the active energy ray. After the irradiation with active energy rays, the adhesive strength is reduced, and it can be easily peeled off from the adherend. In this step (2a), the pressure-sensitive adhesive is entirely before active energy ray irradiation, and thus the protective film 2 is a completely adhesive protective film.

(2) Steps (2b) to (2c)
Next, as shown in FIG. 13 (2 b), a resist film 45 is selectively formed on the surface of the circuit forming metal layer 41. The resist film 45 is formed so as to cover only a portion where a circuit is to be formed. Subsequently, as shown in FIG. 13 (2c), the circuit-forming metal layer 41 is etched using the resist film 45 as a mask material, so that a desired circuit pattern is formed on the surface of the complete adhesion state protective film 2. A circuit layer 46 is formed, and a circuit carrier 41A carrying the circuit layer 46 is formed. This etching can be performed, for example, by wet etching, and the etching solution used is an etching solution that can erode the metal layer 41 for circuit formation.

(3) Step (2d)
Subsequently, by laminating an insulating sheet on the surface on the circuit layer 46 side of the circuit carrier 41A formed by the step (2c), by embedding the circuit layer 46 in the insulating sheet layer 47 and fixing it, A circuit board carrier 42A is formed. As shown in FIG. 13 (2 d), this embedding and fixing can be performed not only in a mode in which part of the circuit layer 46 is embedded, but also in a mode in which the circuit layer 46 is completely embedded in the insulating sheet layer 47. You can also. In the embedding and fixing step, for example, the circuit carrier 41A and the semi-cured insulating sheet layer 47 are overlapped and pressure-bonded so that the circuit layer 46 is in between, and then the insulating sheet layer 47 is necessary. Can be performed by curing. The insulating sheet layer 47 thus cured corresponds to the insulating substrate of the wiring substrate.

  As long as the resist film 45 on the circuit layer 46 does not adversely affect the characteristics of the wiring substrate on the insulating substrate and the adhesion between the circuit layer 46 and the insulating sheet layer 47, FIG. As shown in FIG. 5, the embedding and fixing step (2d) can be performed in a state where the resist film 45 is left without being removed. Alternatively, the embedding and fixing step (2d) may be performed after the resist film 45 is removed.

(5) Step (2e):
Next, as shown by an arrow Z in FIG. 13 (2e), when the pressure sensitive adhesive layer 4 is irradiated with active energy rays (for example, ultraviolet rays or electron beams) through the support 3, the pressure sensitive adhesive is cured. Then, the pressure-sensitive adhesive layer 4B having reduced adhesive strength is converted, and the complete adhesion state protective film 2 is converted to the peelable protective film 2B. In addition, the support body 3 consists of material which can permeate | transmit the active energy ray which can reduce the adhesive force of the said pressure sensitive adhesive by irradiation.

(6) Steps (2f) to (2g)
Subsequently, as shown in FIG. 14 (2f), when the peelable protective film 2B is peeled from the circuit board carrier 42A, the circuit board 43A can be obtained as shown in FIG. 14 (2g). The circuit board 43A thus obtained has a structure in which a circuit layer 46 having a desired circuit pattern is embedded in an insulating sheet layer 47 as shown in FIG. 15 (schematic plan view).

JP 2003-309370 A Japanese Patent Laid-Open No. 10-173316

The inventor has conducted earnest research on a conventional method for manufacturing an etching metal body (particularly, a member for connecting an inter-wiring layer film or a circuit member) by using the protective film as described above. I found a problem.
That is, as a result of diligent research on the conventional method of manufacturing the wired circuit board shown in FIGS. 10 and 11, the bump group resin filler 13 shown in FIG. 11 (1h) to the wiring shown in FIG. 11 (1l). When the circuit board 15 is manufactured, it is found that the yield is poor, and one of the causes is that the pressure-sensitive adhesive remains on the surface of the bump group resin filler 13 shown in FIG. 11 (1h). It was.
Also, in the conventional circuit member manufacturing method shown in FIG. 13 and FIG. 14, when a high-density multilayer wiring board is manufactured from the circuit board 43A shown in FIG. 14 (2g), the yield is similarly poor. It has been found that one of the causes is that pressure-sensitive adhesive remains on the surface of the circuit board 43A shown in FIG. 14 (2g).
Accordingly, an object of the present invention is to eliminate the above-mentioned drawback of the pressure-sensitive adhesive remaining in the technique of producing an etched metal body by using a protective film (that is, the disadvantage of adhesive residue) and to improve the yield. It is in.

The above problems are solved by the present invention.
(1) (a) a protective film carrying, on one surface of a support, a layer made of a pressure-sensitive adhesive capable of reducing the adhesive strength by irradiating with active energy rays; and (b) Including a metal layer to be etched that is attached to the protective film via the pressure-sensitive adhesive layer, and preparing a metal foil patch,
(2) (a) a step of forming a resist film on the surface of the metal layer to be etched of the metal foil patch, and (b) a transmission region that transmits the active energy rays and a non-transmission that does not transmit the active energy rays. Irradiating the pressure-sensitive adhesive layer with the active energy ray through an irradiation mask sheet having a region, and contacting the etching solution in the etching process of the metal layer to be etched performed through the resist film. The pressure sensitive adhesive is cured by at least irradiating the contact area to be maintained, and the pressure sensitive adhesive is maintained in an uncured state without irradiating at least a part of the non-contact area that is not in contact with the etching solution. Perform the steps in any order,
(3) An etching process is performed on the metal layer to be etched,
(4) It includes the steps of curing the pressure-sensitive adhesive in an uncured state by irradiation with the active energy ray, and (5) peeling the protective film to form an etching metal body. This can be solved by the manufacturing method of the etching metal body.

According to a preferred aspect of the method of the present invention, the etching metal body is a wiring layer inter-film connecting member, a circuit member, or an electromagnetic shielding metal mesh member.
According to another preferred embodiment of the method of the present invention, in the step (2) (b), a part of the non-contact region that does not contact the etching solution and adjacent to the contact region with the etching solution. The active energy ray is also irradiated to the area to be cured to cure the pressure sensitive adhesive.
According to still another preferred aspect of the method of the present invention, the initial peel force of the pressure-sensitive adhesive before irradiation with the active energy ray is 0.05 to 30 N / 25 mm.
According to still another preferred aspect of the method of the present invention, the peel strength of the pressure-sensitive adhesive after irradiation with the active energy ray is less than 0.05 N / 25 mm.
Moreover, this invention relates also to the etching metal body obtained by the said manufacturing method.

A preferred embodiment of the method of the present invention comprises:
(1) (a) a protective film carrying, on one surface of a support, a layer made of a pressure-sensitive adhesive capable of reducing the adhesive strength by irradiating with active energy rays; and (b) Including a metal layer for forming a bump attached to the protective film via the pressure-sensitive adhesive layer, and preparing a metal foil patch,
(2) (a) a step of forming a resist film on the surface of the bump-forming metal layer of the metal foil patch, and (b) a transmission region that transmits the active energy ray and a non-permeation of the active energy ray. The pressure-sensitive adhesive layer is irradiated with the active energy ray through an irradiation mask sheet having a transmission region, and comes into contact with an etching solution in the bump forming metal layer etching step performed through the resist film. Irradiate at least the contact area to be cured to cure the pressure-sensitive adhesive, and leave the pressure-sensitive adhesive in an uncured state without irradiating at least a part of the non-contact area that does not come into contact with the etching solution. Perform the steps to maintain in any order,
(3) An etching process is performed on the bump-forming metal layer,
(4) After removing the resist film, filling a gap between the bump group layers formed by the etching step with an insulating resin layer, forming a bump group resin filler on the protective film,
(5) The active energy ray is irradiated onto the protective film to cure the uncured pressure-sensitive adhesive, and (6) the protective film is peeled to form a wiring layer inter-film connection member. The present invention relates to a method for manufacturing the inter-wiring layer film connecting member, characterized in that each step is included.

Another preferred embodiment of the method of the present invention comprises:
(1) (a) a protective film carrying, on one surface of a support, a layer made of a pressure-sensitive adhesive capable of reducing the adhesive strength by irradiating with active energy rays; and (b) Including a metal layer for circuit formation that is affixed to the protective film via the pressure-sensitive adhesive layer, and preparing a metal foil patch,
(2) (a) a step of forming a resist film on the surface of the metal layer for circuit formation of the metal foil patch, and (b) a transmission region that transmits the active energy ray and a non-permeation of the active energy ray. The pressure-sensitive adhesive layer is irradiated with the active energy rays through an irradiation mask sheet having a transmission region, and contacts with an etching solution in the etching process of the circuit forming metal layer performed through the resist film. Irradiate at least the contact area to be cured to cure the pressure-sensitive adhesive, and leave the pressure-sensitive adhesive in an uncured state without irradiating at least a part of the non-contact area that does not come into contact with the etching solution. Perform the steps to maintain in any order,
(3) An etching process is performed on the metal layer for circuit formation,
(4) irradiating the active energy ray to the protective film to cure the pressure-sensitive adhesive in an uncured state, and (5) including each step of peeling the protective film to form a circuit member. It is related with the manufacturing method of the said circuit member characterized by these.
In this aspect, the step of embedding and fixing the circuit layer formed by the etching step (3) in an insulating sheet can be further performed.

Yet another preferred embodiment of the method of the present invention comprises:
(1) (a) a protective film carrying, on one surface of a support, a layer made of a pressure-sensitive adhesive capable of reducing the adhesive strength by irradiating with active energy rays; and (b) Including a metal layer for forming an electromagnetic wave shielding metal mesh attached to the protective film via the pressure-sensitive adhesive layer, and preparing a metal foil patch,
(2) (a) a step of forming a resist film on the surface of the metal layer for forming the metal mesh of the metal foil patch, and (b) a transmission region that transmits the active energy rays and the active energy rays that do not pass. In the etching process of the metal layer for forming a metal mesh, the pressure-sensitive adhesive layer is irradiated with the active energy ray through an irradiation mask sheet having a non-transmissive region, and the metal mesh forming metal layer is etched through the resist film. Irradiate at least a contact area to be contacted to cure the pressure-sensitive adhesive, and uncured the pressure-sensitive adhesive without irradiating at least part of a non-contact area that does not contact the etching solution. The process of maintaining the state is performed in an arbitrary order,
(3) An etching process is performed on the metal mesh forming metal layer,
(4) Irradiating the active energy ray to the protective film to cure the uncured pressure-sensitive adhesive, and (5) peeling the protective film to form an electromagnetic wave shielding metal mesh member. It includes a process, and relates to a method for producing the electromagnetic shielding metal mesh member.
In this aspect, the step of blackening the surface of the electromagnetic wave shielding metal mesh layer formed by the etching step (3) can be further performed.
Moreover, in this aspect, the process of sticking the electromagnetic wave shielding metal mesh layer formed by the said etching process (3) to the to-be-adhered body which has a pressure-sensitive adhesive layer can be further implemented.

For example, when the wiring layer film connecting member (bump group resin filler) is manufactured by the method of the present invention, the use of a multilayer metal plate can be avoided by using a protective film as in the conventional method. The cost can be reduced, and the defect of the adhesive residue can be eliminated, so that the yield can be improved.
Further, for example, when the circuit member is manufactured by the method of the present invention, the defect of the adhesive residue is eliminated, so that the yield can be improved.
Furthermore, the method of the present invention using a protective film can be used for the production of an electromagnetic shielding metal mesh member. For example, unreacted substances in the pressure-sensitive adhesive are not eluted during the blackening treatment, and the blackening treatment is performed. Since the number of times the liquid is repeated can be increased, it is economically advantageous.

First, the inventor's estimation regarding the problems of the conventional method and the principle of the method of the present invention for solving it will be described. The present invention is not limited to the following estimation.
For example, in the conventional method shown in FIGS. 10 and 11, the etching solution directly contacts the pressure-sensitive adhesive layer 4 in the etching process of the step (1c). By the contact, it is estimated that a part of the unreacted polymerizable monomer and the photoinitiator contained in the pressure-sensitive adhesive are also removed. When a part of the unreacted polymerizable monomer and the photoinitiator is removed, the curing reaction becomes insufficient even when the active energy ray is irradiated in the step (1f), and the adhesive force is not sufficiently lowered. For this reason, when peeling off the peelable protective film 2B in the step (1g), a part of the pressure sensitive adhesive is not detached from the surface of the bump group resin filler 13 and is not transferred to the support 3 side. As a result of the transfer failure, it remains on the surface of the bump group resin filler 13. That is, the phenomenon of “glue residue” occurs. When the printed circuit board 15 shown in FIG. 11 (1l) is manufactured using the bump group resin filler 13 in the “glue remaining” state, the insulation is not required, so that the yield is lowered.
Note that the above inference applies to the conventional manufacturing method of the circuit member shown in FIGS.

On the other hand, in the method of the present invention, an active energy ray is irradiated in advance to a region (that is, a contact region) in the pressure-sensitive adhesive layer that will come into contact with the etching solution, thereby imparting the etching solution resistance to the contact region. At the same time, the region that does not come into contact with the etching solution (that is, the non-contact region) is not irradiated with active energy rays, and the adhesive force remains. When the etching treatment is performed after this pretreatment, the etching solution contacts only the contact area of the pressure-sensitive adhesive layer and does not contact the non-contact area. Therefore, the unreacted polymerization is performed from the non-contact area of the pressure-sensitive adhesive layer. Outflow of the ionic monomer and photoinitiator is prevented. Also, when the protective film is peeled off, if the active energy ray is irradiated to the non-contact area of the pressure-sensitive adhesive layer, the polymerization reaction proceeds as planned, and the adhesive force is sufficiently reduced. It is possible to effectively prevent the occurrence of an adhesive residue phenomenon due to.
The inventor has experimentally confirmed that the yield is improved when the printed circuit board 15 shown in FIG. 11 (1l) is manufactured by using the bump group resin filler 13 by the method of the present invention, for example. However, the effect seems to be based on the above mechanism.

Next, typical embodiments of the method of the present invention will be described below in order with reference to the accompanying drawings. First, a method for manufacturing a wiring layer film connecting member (bump group resin filler) according to the present invention will be described with reference to FIGS. 1 and 2.
(1) Step (1A):
As shown in FIG. 1 (1A), a metal foil patch 10 is prepared. This step (1A) is the same as the step (1a) of the conventional method shown in FIGS. Therefore, the metal foil patch 10 includes a bump-forming metal layer (for example, a copper layer) 1 as a metal layer to be etched and a protective film 2. The thickness of the bump forming metal layer 1 is, for example, about 3 to 100 μm. The protective film 2 includes a support 3 and a pressure-sensitive adhesive layer 4 carried on one surface thereof, and is bonded to the bump-forming metal layer 1 by the pressure-sensitive adhesive layer 4. The pressure-sensitive adhesive constituting the pressure-sensitive adhesive layer 4 is an active energy (for example, ultraviolet ray or electron beam) curable adhesive, and has sufficient adhesive force before irradiation with the active energy ray. After the irradiation with active energy rays, the adhesive strength is reduced, and it can be easily peeled off from the adherend. In this step (1A), the pressure-sensitive adhesive is entirely before active energy ray irradiation, and thus the protective film 2 is a completely adhesive protective film.

(2) Step (1B)
Next, as shown in FIG. 1 (1 B), a resist film 5 is selectively formed on the surface of the bump forming metal layer 1. This step (1B) is also the same as the step (1b) of the conventional method shown in FIGS. Therefore, the resist film 5 is formed so as to cover only the portion where the bump is to be formed.

(3) Steps (1C) to (1D)
Subsequently, as shown in FIG. 1 (1C), the irradiation mask sheet 31 is placed on the surface side of the support 3, and as shown by the arrow X in FIG. 1 (1C), the irradiation mask sheet 31 and the support. The pressure-sensitive adhesive layer 4 is irradiated with active energy rays (for example, ultraviolet rays or electron beams) through 3. This partial irradiation step (1C) is a step that is not performed in the conventional method shown in FIGS. The irradiation mask sheet 31 has a pattern including a non-transmissive region 31a that does not transmit the active energy rays and a transmissive region 31b that transmits the active energy rays. In addition, the support body 3 consists of material which can permeate | transmit the active energy ray which can reduce the adhesive force of the said pressure sensitive adhesive by irradiation.

  In the etching step (1E), which will be described later, the transmissive region 31b of the irradiation mask sheet 31 is necessarily irradiated with the active energy ray in the region (contact region) of the pressure-sensitive adhesive layer 4 that comes into contact with the etching solution. It must be provided to ensure that it is cured. The non-transmissive region 31a is provided so as to prevent the active energy ray from being irradiated to the region (non-contact region) of the pressure-sensitive adhesive layer 4 that does not come into contact with the etching solution. . Therefore, the pattern shape of the non-transmissive region 31a in the irradiation mask sheet 31 and the pattern shape of the resist film 5 are not necessarily perfect, but generally coincide. The relationship between these pattern shapes will be described later with reference to FIGS.

When the pressure sensitive adhesive layer 4 is irradiated with active energy rays (for example, ultraviolet rays or electron beams) through the irradiation mask sheet 31 (and the support 3), as shown in FIG. 1 (1D). In addition, in the pressure-sensitive adhesive layer 4, an uncured region 4a and a cured region 4b are formed, and at least the contact region is cured. The uncured region 4a maintains the adhesive force, whereas the cured region 4b decreases the adhesive force, so that the pressure-sensitive adhesive layer 4A is partially tacky, and thus the protective film 2A is also partially tacky. .
In addition, the said process (1B) and the said process (1C) can each be implemented in arbitrary orders. That is, the step (1B) is performed first, the step (1C) is performed later, the step (1C) is performed first, and the step (1B) is performed later, or The step (1B) and the step (1C) can be performed simultaneously.

(4) Step (1E)
Subsequently, as shown in FIG. 1 (1E), the bump forming metal layer 1 is etched using the resist film 5 as a mask material, thereby forming a large number of bumps 6. This etching can be performed by, for example, wet etching, as in the conventional method, and the etching solution used is an etching solution that can attack the metal layer 1 for bump formation. Further, during this etching, the etching solution contacts the cured region 4b of the partially tacky pressure-sensitive adhesive layer 4A and does not contact the uncured region 4a. In the curing region 4b, since the curing reaction has already been performed, even if it comes into contact with the etching solution, the peelability is not adversely affected. On the other hand, the uncured region 4a does not come into contact with the etching solution, and the cured region 4b acts as a barrier layer against the intrusion of the etching solution, so that a part of the unreacted polymerizable monomer and the photoinitiator is not removed. The state in which the curing reaction is possible is maintained.

(5) Step (1F)
Next, as shown in FIG. 2 (1F), the resist film 5 used as an etching mask material in the etching is removed. This step (1F) can also be carried out in the same manner as in the conventional method. FIG. 2 (1F) shows the state after the etching mask is removed. Thus, a bump group carrier 11A having a structure in which a large number of bumps 6 are formed on the partially adhesive protective film 2A is formed.

(6) Step (1G)
Subsequently, as shown in FIG. 2 (1G), the insulating resin layer 7 is inserted into the respective gaps of the bumps 6 in the bump group carrier 11A. This step (1G) can also be carried out in the same manner as in the conventional method. For example, the insulating resin layer 7 made of the adhesive sheet is formed by pressing an insulating adhesive sheet onto the surface of the bump group carrier 11A on the side where the bumps 6 are formed with a heat roller. Can do. At this time, after the formation of the insulating resin layer 7, it is necessary to expose the tops of the bumps 6 by projecting from the insulating resin layer 7. Therefore, as the adhesive sheet, a sheet that is appropriately thinner than the height of the bump 6 is used. If the upper portion of the bump 6 is not exposed, interlayer connection by the bump 6 cannot be reliably performed. By this step (1G), the bump group resin carrier 12A for carrying the bump group resin filler is formed on the partial adhesive protective film 2A.

(7) Step (1H):
Next, as shown by an arrow Y in FIG. 2 (1H), when the active energy ray (for example, an ultraviolet ray or an electron beam) is irradiated to the partial adhesive pressure-sensitive adhesive layer 4A through the support 3, the uncured region 4a Since the pressure-sensitive adhesive is also cured and the adhesive strength is reduced, the partial adhesive protective film 2A is converted into the peelable protective film 2B as a whole. In this way, the bump group resin carrier 12 carrying the bump group resin filler is formed on the peelable protective film 2B. In addition, as above-mentioned, the support body 3 consists of a material which can permeate | transmit the active energy ray which can reduce the adhesive force of the said pressure sensitive adhesive by irradiation.

(8) Steps (1I) to (1J)
Subsequently, as shown in FIG. 2 (1I), when the peelable protective film 2B is peeled off from the bump group resin carrier 12, as shown in FIG. 2 (1J), the bump group resin filling is performed in the same manner as in the conventional method. The body 13 can be obtained. As shown in FIG. 12 (schematic plan view), the bump group resin filler 13 thus obtained exposes both ends 6a and 6b of each bump 6 in the same manner as the bump group resin filler according to the conventional method. In addition, the bumps 6 are isolated from each other by the insulating resin of the insulating resin layer 7. Further, using this bump group resin filler 13, a circuit forming substrate 14 shown in FIG. 11 (1 j) or a wired circuit board 15 shown in FIG. 11 (11) is manufactured in the same manner as in the conventional method. Can manufacture a multilayer printed circuit board. Further, the bump group resin filler 13 obtained by the method of the present invention is less prone to “transfer defects” and “adhesive residue”, so that the yield in manufacturing a printed circuit board or a multilayer printed circuit board is improved.

  By the way, in the etching step (1E) shown in FIG. 1 (1E), the bump-forming metal layer 1 is first brought into contact with the etching solution on the surface side (resist film side), and thereafter the pressure-sensitive adhesive layer gradually. Since the etching proceeds in the direction 4, each finally formed bump has a trapezoidal cross section as shown in FIG. 1 (1 E) and FIGS. 7 to 9. Therefore, in the method of the present invention, it is necessary that the entire region (contact region) of the pressure-sensitive adhesive layer that comes into contact with the etching solution in such an etching step (1E) is cured. On the other hand, in the etching step (1E) as described above, the entire region that is not in contact with the etching solution (non-contact region) is in an uncured state, or the adhesive force with the bump group formed later is entirely As long as it is maintained, it may be partially cured.

  The irradiation mask sheet used in the method of the present invention has a pattern composed of a non-transmissive region 31a that does not transmit the active energy rays and a transmissive region 31b that transmits the active energy rays, as shown in FIG. 1 (1C). The transmissive region 31b is provided so as to ensure that the active energy ray is irradiated to the entire region of the pressure-sensitive adhesive layer 4 in contact with the etching solution, and the non-transmissive region 31a does not come into contact with the etching solution. The pressure sensitive adhesive layer 4 is provided so as to ensure that the entire region of the pressure sensitive adhesive layer 4 or a partial region thereof is prevented from being irradiated with the active energy rays.

  FIG. 7 shows a case where the boundary between the uncured region 4a and the cured region 4b in the partially adhesive pressure-sensitive adhesive layer 4A is formed so as to coincide with the contour of the bump 6c of the bump 6. The irradiation mask sheet used in the method may have a pattern composed of a non-transmissive region 31a and a transmissive region 31b that forms an uncured region 4a and a cured region 4b as shown in FIG.

  On the other hand, for example, as shown in FIG. 8, when the boundary between the uncured region 4 a and the cured region 4 b in the partial adhesive pressure-sensitive adhesive layer 4 </ b> A is formed outside the contour of the bump portion 6 c of the bump 6, The exposed portion 4x of the uncured region 4a comes into contact with the etching solution, and the entire unreacted polymerizable monomer and photoinitiator in the uncured region 4a flows out from the exposed portion 4x, so that the exposed portion 4x is generated. The irradiation mask sheet having a pattern composed of the non-transmissive region 31a and the transmissive region 31b cannot be used. That is, it is necessary to provide the irradiation mask sheet with a pattern composed of the non-transmissive region 31a and the transmissive region 31b so that the exposed portion 4x as described above does not occur.

  Furthermore, as shown in FIG. 9, when the boundary between the uncured region 4 a and the cured region 4 b in the pressure-sensitive adhesive layer 4 is formed on the inner side of the contour of the bump portion 6 c of the bump 6, the cured region 4 b The non-exposed portion 4y acts as a barrier region against the intrusion of the etchant into the bottom surface of the bump 6, and can effectively prevent the unreacted polymerizable monomer and the photoinitiator from flowing out from the uncured region 4a. It is preferable to provide a pattern including a non-transmissive region 31a and a transmissive region 31b on the irradiation mask sheet so that such a non-exposed portion 4y is formed. In this case, it is necessary to avoid that the non-exposed portion 4y is enlarged and the entire adhesive force of the partially tacky pressure-sensitive adhesive layer 4A becomes insufficient.

  The irradiation mask sheet used in the method of the present invention can be made of any material as long as it can provide a non-transmission region and a transmission region related to the active energy rays (for example, ultraviolet rays or electron beams). Or a general mask such as dry film can be used. The thickness of the irradiation mask sheet is not particularly limited, and is, for example, 50 to 200 μm.

  The protective film used in the method of the present invention has a pressure-sensitive adhesive layer on one surface of the support. As this support, any synthetic resin film can be used as long as it can carry a pressure-sensitive adhesive, can transmit active energy rays (for example, ultraviolet rays or electron beams), and has etching resistance. As the synthetic resin, preferably, polyester such as polyethylene terephthalate or polyethylene naphthalate, polyolefin such as polyimide, polyphenylene sulfide, polyvinyl chloride, or polypropylene can be used. Although not particularly limited, the synthetic resin film may be annealed to improve dimensional stability at high temperatures.

  The thickness of the support is not particularly limited as long as it does not adversely affect the workability as a process film in each of the above processes, and is, for example, 100 μm or less, preferably 75 μm or less, more preferably 50 μm or less. On the other hand, the lower limit of the thickness of the support is not particularly limited, but is, for example, 10 μm. If the thickness of the support exceeds 100 μm, the flexibility of the protective film is impaired, and in the peeling process of the protective film, peeling becomes difficult, and the etching metal body such as the bump group resin filler may be bent or bent. Yes, when the thickness is less than 10 μm, the protective film is likely to be deformed or bent.

  The pressure-sensitive adhesive forming the pressure-sensitive adhesive layer is a pressure-sensitive adhesive whose adhesive strength is reduced by active energy ray irradiation (for example, ultraviolet ray or electron beam irradiation). Specifically, known active energy curable acrylic resins, silicone resins, epoxy resins, styrene-butadiene, SBS or SIS, isoprene, chloroprene, acrylic butadiene, etc. An adhesive such as natural rubber or recycled rubber can be used. In particular, an acrylic resin pressure sensitive adhesive is preferable. If necessary, a tackifier such as a polyterpene resin, gum rosin, rosin ester or rosin derivative, oil-soluble phenol resin, coumarone-indene resin, or petroleum hydrocarbon resin can be blended. In addition, any type of pressure-sensitive adhesive such as a solvent type, an emulsion type, or a solventless type can be used.

  The initial peel force after application of the pressure-sensitive adhesive is preferably 0.05 to 30 N / 25 mm, more preferably 0.1 to 10 N / 25 mm. If the initial peel force exceeds 30 N / 25 mm, it becomes difficult to make the peel force after the adhesive strength reduction treatment less than 0.05 N / 25 mm, and if the initial peel force is less than 0.05 N / 25 mm, the adhesive force is insufficient. In some cases, the peeling process may be performed before the peeling process is performed. On the other hand, the peel strength after the adhesive strength reduction treatment is preferably less than 0.05 N / 25 mm. If the peeling force after the adhesive strength reduction treatment is 0.05 N / 25 mm or more, the etching metal body such as the bump group resin filler may be bent or bent during the peeling operation. In this specification, “peeling force” means a value measured according to JIS Z0237. The “initial peel force” means a peel force within 20 minutes after the sticking process.

  The thickness of the pressure-sensitive adhesive layer is not particularly limited as long as it is a thickness that can express the above-mentioned peeling force after the initial peeling force and the adhesive strength reduction treatment. Specifically, although it varies depending on the type of pressure-sensitive adhesive to be used, it is preferably 0.5 to 20 μm, more preferably 0.5 to 10 μm. When the thickness of the pressure-sensitive adhesive layer exceeds 20 μm, when the formed bump is inserted into the insulating resin layer, the pressure-sensitive adhesive on the bottom surface of the bump flows due to the pressure, so that the pressure cannot be applied uniformly. If this phenomenon occurs, the final circuit connection will be poor. On the other hand, if the thickness is less than 0.5 μm, the pressure-sensitive adhesive may have insufficient adhesive strength and peel before performing the peeling step.

The method of the present invention can be applied not only to the manufacturing method of the bump group resin filler (that is, the wiring layer inter-film connecting member), but also to manufacture various etching metal bodies having the same kind of structure as described above. Can be used. For example, an embodiment of manufacturing a circuit member by the method of the present invention will be described with reference to FIGS.
(1) Step (2A):
As shown in FIG. 3 (2A), a metal foil patch 40 is prepared. This step (2A) is the same as the step (2a) of the conventional method shown in FIGS. Therefore, the metal foil patch 40 includes a circuit forming metal layer (for example, a copper layer) 41 as the metal layer to be etched and the protective film 2. The thickness of the circuit forming metal layer 41 is, for example, about 1 to 200 μm. The protective film 2 includes a support 3 and a pressure-sensitive adhesive layer 4 carried on one surface thereof, and is bonded to the circuit-forming metal layer 41 by the pressure-sensitive adhesive layer 4. The pressure-sensitive adhesive constituting the pressure-sensitive adhesive layer 4 is an active energy (for example, ultraviolet ray or electron beam) curable adhesive, and has sufficient adhesive force before irradiation with the active energy ray. After the irradiation with active energy rays, the adhesive strength is reduced, and it can be easily peeled off from the adherend. In this step (2A), the pressure-sensitive adhesive is entirely before irradiation with active energy rays, and thus the protective film 2 is a completely adhesive protective film.

(2) Step (2B)
Next, as shown in FIG. 3 (2 B), a resist film 45 is selectively formed on the surface of the circuit forming metal layer 41. This step (2B) is also the same as the step (2b) of the conventional method shown in FIGS. Therefore, the resist film 45 is formed so as to cover only a portion where a circuit having a desired pattern is to be formed.

(3) Steps (2C) to (2D)
Subsequently, as shown in FIG. 3 (2C), the irradiation mask sheet 31 is placed on the surface side of the support 3, and as shown by the arrow X in FIG. 3 (2C), the irradiation mask sheet 31 and the support. The pressure-sensitive adhesive layer 4 is irradiated with active energy rays (for example, ultraviolet rays or electron beams) through 3. This step (2C) is a step that is not performed in the conventional method shown in FIGS. The irradiation mask sheet 31 has a pattern including a non-transmissive region 31a that does not transmit the active energy rays and a transmissive region 31b that transmits the active energy rays. In addition, the support body 3 consists of material which can permeate | transmit the active energy ray which can reduce the adhesive force of the said pressure sensitive adhesive by irradiation.

  In the etching step (2E) described later, the transmission region 31b of the irradiation mask sheet 31 is always irradiated and cured by the active energy rays in the contact region of the pressure-sensitive adhesive layer 4 that comes into contact with the etching solution. It is necessary to ensure that this is the case. The non-transmissive region 31a is provided so as to prevent the region of the pressure-sensitive adhesive layer 4 that does not come into contact with the etching solution from being irradiated with the active energy rays. Therefore, the pattern shape of the non-transmission region 31a in the irradiation mask sheet 31 and the pattern shape of the resist film 5 are not necessarily complete as shown in FIGS.

When the pressure-sensitive adhesive layer 4 is irradiated with active energy rays (for example, ultraviolet rays or electron beams) through the irradiation mask sheet 31 (and the support 3), as shown in FIG. 3 (2D). In addition, the pressure-sensitive adhesive layer 4 is formed with an uncured region 4a and a cured region 4b. The uncured region 4a maintains the adhesive strength, whereas the cured region 4b decreases the adhesive strength, so that the pressure-sensitive adhesive layer 4A is partially tacky, and thus the protective film 2A is also partially tacky. .
In addition, the said process (2B) and the said process (2C) can each be implemented in arbitrary orders. That is, the step (2B) is performed first, the step (2C) is performed later, the step (2C) is performed first, and the step (2B) is performed later, or A process (2B) and the said process (2C) can also be implemented simultaneously.

(4) Step (2E)
Subsequently, as shown in FIG. 3 (2E), the circuit layer 46 having a desired pattern is formed by etching the circuit-forming metal layer 41 using the resist film 45 as a mask material. In this way, the circuit carrier 41B carrying the circuit layer 46 is formed on the partial adhesive protective film 2A. This etching can be performed by, for example, wet etching, as in the conventional method, and the etching solution used is an etching solution that can erode the circuit forming metal layer 41. Further, during this etching, the etching solution contacts the cured region 4b of the partially tacky pressure-sensitive adhesive layer 4A and does not contact the uncured region 4a. In the curing region 4b, since the curing reaction has already been performed, even if it comes into contact with the etching solution, the peelability is not adversely affected. On the other hand, since the uncured region 4a does not come into contact with the etching solution, a part of the unreacted polymerizable monomer and the photoinitiator is not removed, and a state capable of curing reaction is maintained.
As shown in FIG. 13, the resist film 45 can proceed to the next step without being removed, but can also proceed to the next step after being removed. In the following description, the case where the resist film 45 is removed will be described. The step of removing the resist film 45 is not shown.

(5) Step (2F)
Subsequently, as shown in FIG. 4 (2F), an insulating sheet is laminated on the circuit layer 46 side surface of the circuit carrier 41B formed by the step (2E), and the circuit layer is formed on the insulating sheet layer 47. The circuit board carrier 42B is formed by embedding 46 and fixing. As shown in FIG. 4 (2F), this embedding and fixing can be performed not only in a mode in which part of the circuit layer 46 is embedded, but also in a mode in which the circuit layer 46 is completely embedded in the insulating sheet layer 47. You can also. In the embedding and fixing step, for example, the circuit carrier 41A and the semi-cured insulating sheet layer 47 are overlapped and pressure-bonded so that the circuit layer 46 is in between, and then the insulating sheet layer 47 is necessary. Can be performed by curing. The insulating sheet layer 47 thus cured corresponds to the insulating substrate of the wiring substrate.

  As long as the resist film 45 on the circuit layer 46 does not adversely affect the characteristics of the wiring substrate on the insulating substrate and the adhesion between the circuit layer 46 and the insulating sheet layer 47, the resist film 45 shown in FIG. As shown in FIG. 2, the embedding and fixing step (2F) can be performed in a state where the resist film 45 is left without being removed.

(6) Step (2G):
Next, as shown by the arrow Y in FIG. 4 (2G), when the active energy ray (for example, ultraviolet ray or electron beam) is irradiated to the partial adhesive pressure-sensitive adhesive layer 4A through the support 3, the uncured region 4a Since the pressure-sensitive adhesive is also cured and the adhesive force is reduced, it is converted into the peelable protective film 2B as a whole. In addition, the support body 3 consists of material which can permeate | transmit the active energy ray which can reduce the adhesive force of the said pressure sensitive adhesive by irradiation.

(7) Steps (2H) to (2I)
Subsequently, when the peelable protective film 2B is peeled from the circuit board carrier 42A as shown in FIG. 4 (2H), the circuit board 43A can be obtained as shown in FIG. 4 (2I). In the circuit board 43A thus obtained, as shown in FIG. 15 (schematic plan view), a circuit layer 46 having a desired circuit pattern is embedded in an insulating sheet layer 47, as in the case of the conventional technique. Have a structure.

  The insulating sheet used in the embedding and fixing step (2F) corresponds to the insulating substrate of the wiring substrate, and the same material as that of the conventional method can be used. An insulating sheet consists of resin and an inorganic filler or a fibrous base material, for example. As the resin, for example, PPE (polyphenylene ether), BT resin (bismaleimide triazine resin), epoxy resin, polyimide resin, fluororesin, phenol resin, and the like are preferable. A thermosetting resin (uncured state) is desirable.

  Further, the inorganic filler or the fibrous base material is used for imparting a certain strength to the insulating substrate and further adjusting the expansion coefficient and the like to an appropriate range. In general, examples of inorganic fillers include silica, alumina, zirconium oxide, zeolite, titanium oxide, aluminum nitride, silicon carbide, barium titanate, strontium titanate, calcium titanate, and aluminum borate. Is preferably substantially spherical with an average particle size of 20 μm or less. Further, fibrous particles having an average aspect ratio of 2 or more can be used. Moreover, as a fibrous base material, paper, a glass woven fabric, a glass nonwoven fabric, or a synthetic fiber can be mentioned, for example. The resin and the inorganic filler may be used in a volume ratio of 60:40 to 30:70, and the resin and the fibrous base material may be used in a volume ratio of 60:40 to 40:60. It is better to use at a rate of.

  In the embedding and fixing step (2F) shown in FIG. 4 (2F), when the circuit layer 46 is embedded and fixed in the insulating sheet layer 47, for example, the circuit carrier 41B and the semi-cured insulating sheet are connected to the circuit. It can be carried out by superposing and pressing the layer 46 so that the layer 46 is in the middle, and then curing the insulating sheet layer 47 if necessary.

  In this case, as the semi-cured insulating sheet, a woven or nonwoven fabric of glass, or a brigreg obtained by impregnating and drying a varnish-like curable resin on a base material of paper or synthetic resin can also be used. Moreover, an insulating sheet can also be produced by a doctor blade method, extrusion molding, injection molding or the like using an insulating slurry containing the thermosetting resin.

The mechanical pressure for pressure bonding is generally about 10 to 500 kg / cm ² , but if this pressure is small, a part of the circuit layer 46 is partially embedded in the insulating sheet layer 47 together with the remaining resist film 45. [Refer to FIG. 4 (2 F)] If this pressure is increased, the entire circuit layer 46 can be completely embedded in the insulating sheet layer 47.

  Further, an insulating slurry containing a thermosetting resin is applied to the circuit layer 46 side of the circuit carrier 41B shown in FIG. 3 (E) by the doctor blade method, extrusion molding, injection molding, or the like from the thickness of the circuit layer 46. Furthermore, the embedding and fixing step (2F) can be performed by applying the thickness to a thickness corresponding to the insulating substrate and curing the insulating slurry. In this case, the entire circuit layer 46 is completely embedded in the insulating sheet layer 47. The insulating slurry is, for example, a composite material of the thermosetting organic resin and inorganic filler constituting the insulating substrate, such as toluene, butyl acetate, methyl ethyl ketone, methanol, methyl cellosolve acetate, or isopropyl alcohol. It can be prepared by adjusting the viscosity by adding a solvent. The viscosity of the insulating slurry is generally 100 to 3000 poise (25 ° C.) although it depends on the molding method.

  The single-layer wiring board 43A obtained by the method shown in FIG. 3 and FIG. 4 is further subjected to heat treatment as necessary to completely cure the insulating sheet layer, and further, if desired, via holes or a method using a laser. The via hole is filled with a conductive material containing a conductive resin or a metal filler, or a conductive material such as a metal paste, and this is laminated with a predetermined number of circuit boards formed separately, A multilayer wiring board can be produced by applying pressure or heating and closely adhering and integrating. In addition, the formation of the via hole and the filling of the conductive material can be performed prior to the pressure bonding between the insulating sheet and the circuit carrier or at the time of the pressure bonding or the like.

Next, the aspect which manufactures an electromagnetic wave shielding metal mesh member by the method of this invention is demonstrated.
In recent years, electromagnetic noise generated from the front of various displays has become a problem. In order to shield electromagnetic waves radiated from the front of various displays such as CRT (cathode ray tube), plasma, liquid crystal, or EL (electroluminescence), various electromagnetic shielding structures having both electromagnetic shielding properties and transparency are used. It is attached to the front face of the display and connected to an external electrode for grounding the electromagnetic shielding structure. Various conventional methods for producing such an electromagnetic wave shielding metal mesh member by etching have also been proposed (for example, Japanese Patent No. 3480898, Japanese Patent Laid-Open No. 2000-323890, or Japanese Patent Laid-Open No. 2000-323891). Below, the aspect which manufactures an electromagnetic wave shielding metal mesh member by the method of this invention is demonstrated along FIG.5 and FIG.6.

(1) Step (3A):
As shown in FIG. 5 (3A), a metal foil patch 50 is prepared. This step (3A) is the same as each step of the present invention shown in FIGS. 1 (1A) and 2 (2A), and the metal foil patch 50 is a metal mesh forming metal as an etched metal layer. It consists of a layer (for example, a copper layer) 51 and a protective film 2. As described above, the protective film 2 includes the support 3 and the pressure-sensitive adhesive layer 4 carried on one surface thereof, and is adhered to the metal mesh forming metal layer 51 by the pressure-sensitive adhesive layer 4. is doing. The pressure-sensitive adhesive constituting the pressure-sensitive adhesive layer 4 is an active energy (for example, ultraviolet ray or electron beam) curable adhesive, and has sufficient adhesive force before irradiation with the active energy ray. After the irradiation with active energy rays, the adhesive strength is reduced, and it can be easily peeled off from the adherend. In this step (3A), the pressure-sensitive adhesive is entirely before irradiation with active energy rays, and thus the protective film 2 is a completely tacky protective film. The thickness of the metal mesh forming metal layer 51 is, for example, about 1 to 50 μm.

(2) Step (3B)
Next, as shown in FIG. 5 (3B), a resist film 55 is selectively formed on the surface of the metal layer 51 for forming the metal mesh. This step (3B) is also the same as each step of the present invention shown in FIG. 1 (1B) and FIG. 2 (2B). That is, the resist film 55 is formed so as to cover only a portion where a metal mesh having a desired pattern is to be formed.

(3) Steps (3C) to (3D)
Subsequently, as shown in FIG. 5 (3C), the irradiation mask sheet 31 is placed on the surface side of the support 3, and as shown by the arrow X in FIG. 5 (3C), the irradiation mask sheet 31 and the support. The pressure-sensitive adhesive layer 4 is irradiated with active energy rays (for example, ultraviolet rays or electron beams) through 3. The irradiation mask sheet 31 has a pattern including a non-transmissive region 31a that does not transmit the active energy rays and a transmissive region 31b that transmits the active energy rays. In addition, the support body 3 consists of material which can permeate | transmit the active energy ray which can reduce the adhesive force of the said pressure sensitive adhesive by irradiation.

  In the etching step (3E) described later, the transmission region 31b of the irradiation mask sheet 31 is always irradiated and cured by the active energy rays in the contact region of the pressure-sensitive adhesive layer 4 that comes into contact with the etching solution. It is necessary to ensure that this is the case. The non-transmissive region 31a is provided so as to prevent the region of the pressure-sensitive adhesive layer 4 that does not come into contact with the etching solution from being irradiated with the active energy rays. Therefore, the pattern shape of the non-transmission region 31a in the irradiation mask sheet 31 and the pattern shape of the resist film 5 are not necessarily complete as shown in FIGS.

When the pressure-sensitive adhesive layer 4 is irradiated with active energy rays (for example, ultraviolet rays or electron beams) through the irradiation mask sheet 31 (and the support 3), as shown in FIG. 5 (3D). In addition, the pressure-sensitive adhesive layer 4 is formed with an uncured region 4a and a cured region 4b. The uncured region 4a maintains the adhesive strength, whereas the cured region 4b decreases the adhesive strength, so that the pressure-sensitive adhesive layer 4A is partially tacky, and thus the protective film 2A is also partially tacky. .
In addition, the said process (3B) and the said process (3C) can each be implemented in arbitrary orders. That is, the step (3B) is performed first, the step (3C) is performed later, the step (3C) is performed first, and the step (3B) is performed later, or A process (3B) and the said process (3C) can also be implemented simultaneously.

(4) Step (3E)
Subsequently, as shown in FIG. 5 (3E), the metal mesh forming metal layer 51 is etched using the resist film 55 as a mask material to form a metal mesh layer 56 having a desired pattern. This etching can be performed by wet etching, for example, as in the conventional method, and the etching solution used is an etching solution that can erode the metal layer 51 for forming the metal mesh. Further, during this etching, the etching solution contacts the cured region 4b of the partially tacky pressure-sensitive adhesive layer 4A and does not contact the uncured region 4a. Since the curing reaction has already been performed in the curing region 4b, the curing reaction is not adversely affected even if it comes into contact with the etching solution. On the other hand, since the uncured region 4a does not come into contact with the etching solution, a part of the unreacted polymerizable monomer and the photoinitiator is not removed, and a state capable of curing reaction is maintained.

(5) Step (3F)
Subsequently, as shown in FIG. 5 (3F), the resist film 55 used as an etching mask material in the etching is removed. FIG. 5 (3F) shows the state after removing the etching mask. In this way, the metal mesh carrier 51A carrying the metal mesh layer 56 is formed on the partial adhesive protective film 2A.

(6) Process (3G)
Next, as shown in FIG. 6 (3G), the exposed surface (that is, the upper surface and the side surface) of the metal mesh layer 56 is blackened by a known method, and the blackened metal mesh layer 57 is replaced with the partially adhesive protective film 2A. A blackened metal mesh carrier 52B carried on the surface is formed. In addition, in the metal foil sticking body 50 shown to FIG. 5 (3A), a blackening metal layer can also be used as the metal layer 51 for metal mesh formation, and a blackening process can be abbreviate | omitted in this case.

(7) Step (3H)
Subsequently, as shown in FIG. 6 (3H), the surface of the blackened metal mesh carrier 52B on the blackened metal mesh layer 57 side is attached to the release film 58. The release film 58 has a pressure-sensitive adhesive layer 58b on the substrate 58a subjected to the release treatment, and the blackened metal mesh layer 57 is bonded by the pressure-sensitive adhesive layer 58b.

(8) Step (3I):
Next, as shown by an arrow Y in FIG. 6 (3I), when an active energy ray (for example, an ultraviolet ray or an electron beam) is irradiated to the partial adhesive pressure-sensitive adhesive layer 4A through the support 3, the uncured region 4a Since the pressure-sensitive adhesive is also cured and the adhesive strength is reduced, the partial adhesive protective film 2A is converted into the peelable protective film 2B as a whole. In addition, the support body 3 consists of material which can permeate | transmit the active energy ray which can reduce the adhesive force of the said pressure sensitive adhesive by irradiation.

(9) Steps (3J) to (3K)
Subsequently, when the peelable protective film 2B is peeled off as shown in FIG. 6 (3J), an electromagnetic wave shielding metal mesh member 53A can be obtained as shown in FIG. 6 (3K). The electromagnetic shielding metal mesh member 53A thus obtained has a structure in which a blackened metal mesh layer 57 having a desired pattern is supported on a release film 58, as shown in FIG. 16 (schematic plan view). ing. The electromagnetic wave shielding metal mesh member 53A is formed by separating the substrate 58a before being attached to an adherend (for example, an electromagnetic wave shielding structure or an electromagnetic wave shielding display plastic plate), and leaving the pressure sensitive adhesive layer. By 58b, it can be made to stick to the said adherend. The electromagnetic shielding structure and the plastic plate for electromagnetic shielding display are laminated on one or both sides of a transparent plastic plate for the purpose of color tone correction, heat ray cut, antireflection, and / or scratch prevention. A laminate having (generally called an optical filter) is pasted.

  Examples of the metal foil of the metal layer for forming the metal mesh carried as the metal layer to be etched on the metal foil patch 50 include copper, aluminum, nickel, iron, gold, silver, stainless steel, tungsten, chromium, titanium, and the like. A foil made of the above metal or an alloy made by combining two or more of them can be used. Copper, aluminum, or nickel foil is suitable from the viewpoint of conductivity (electromagnetic wave shielding property), ease of forming a mesh pattern, and cost. Further, a foil made of a paramagnetic metal such as nickel, iron, stainless steel, or titanium is preferable because of its excellent magnetic shielding properties.

  As for the thickness of the metal layer for metal mesh formation, 0.5-40 micrometers is preferable. If it exceeds 40 μm, it becomes difficult to form fine lines and the viewing angle becomes narrow. On the other hand, when the thickness is less than 0.5 μm, the surface resistance increases and the electromagnetic shielding effect tends to be inferior. From the viewpoint of electromagnetic shielding properties, 1 to 20 μm is more preferable.

  As the metal foil of the metal layer for forming the metal mesh, a metal foil that has been blackened in advance is usually used, but in the present invention, it is not always necessary to use a metal foil that has been blackened in advance. That is, in the electromagnetic shielding metal mesh member obtained by the method of the present invention, the metal blackening surface for improving the contrast of the display (adhered body) is attached to the display (adhered body). There is no need to use a blackened metal foil. Of course, a blackened metal foil can also be used. That is, in the method for producing an electromagnetic wave shielding metal mesh member according to the present invention, the electromagnetic shielding metal mesh member is produced and then blackened, and then the final adherend (for example, display) is subjected to electromagnetic wave shielding properties. Since the metal mesh member is transferred, it is a feature that the unevenness accompanying the blackening treatment is not transferred to the adhesive for adhering the electromagnetic shielding metal mesh member to the adherend (for example, display).

  In the blackening treatment step (3G), the blackening treatment of the exposed surface of the metal mesh layer 56 is performed using a normal blackening treatment liquid by a normal method performed in the printed wiring board field. it can. In the blackening process (3G), the exposed upper surface and exposed lateral surface of the metal mesh layer 56 are blackened. For example, the blackening treatment is carried out at 95 ° C. for 2 minutes in an aqueous solution of sodium chlorite (31 g / L), sodium hydroxide (15 g / L), or trisodium phosphate (12 g / L). It can be carried out.

The electromagnetic shielding metal mesh member obtained by the method of the present invention can be attached to an adherend support used as a part of a display.
Since the adherend support is used as a part of the display, it is preferable that the adherend support has high transparency. Specifically, the total light transmittance is preferably 70% or more. Further, the adherend support may be in the form of a flexible film or sheet, or in the form of a plate having no flexibility.

  Examples of the adherend support include polyesters such as polyethylene terephthalate (PET), polyethylene naphthalate (PEN), and polypropylene terephthalate, polyolefins such as polyethylene, polypropylene, polystyrene, and ethylene-vinyl acetate copolymer (EVA). , Vinyls such as polyvinyl chloride or polyvinylidene chloride, acrylics such as polysulfone, polyethersulfone, polyphenylene sulfide, polycarbonate, polyamide, polyimide, polyamideimide, polyetherimide, cycloolefin resin, or polymethyl methacrylate Resin, polyetherketone, polyarylate, polyacetal, cellulose triacetate, fluororesin plate, polymethylpentene, polyurethane, diallyl phthalate resin, etc. And sexual resin, plastic film or plastic plate such as a thermosetting resin.

  As the adherend support, the resin can be used as a single layer, but two or more kinds can be laminated and used as a multilayer resin. Among the supports, polyethylene terephthalate, polycarbonate, or cycloolefin resin is preferable from the viewpoint of transparency, heat resistance, handleability, and price.

  As thickness of a to-be-adhered body support, 5-5 mm is preferable, suitable thickness changes with shapes, and in the case of a film shape, 10-200 micrometers is still more preferable. When the thickness is less than 5 μm, the handleability is deteriorated, and when it exceeds 500 μm, the visible light transmittance is deteriorated. In the case of a plate shape, 0.5 mm to 5 mm is preferable from the viewpoint of display protection, strength, and handleability.

  Adhesiveness and transparency are required for the adhesive used when attaching the electromagnetic wave shielding metal mesh member obtained by the method of the present invention and the adherend support. That is, since the electromagnetic wave shielding mesh in which the metal mesh member and the adherend support are attached via an adhesive is attached to the surface of the display, the difference in refractive index between the adhesive and the adherend support. Is preferably as small as possible, and is preferably about 0.1. The adhesive is generally referred to as a pressure-sensitive adhesive (pressure-sensitive adhesive) or adhesive, and is an acrylic resin-based, urethane resin-based, or a blend of both, or a composite resin-based pressure-sensitive adhesive or adhesive. Agents can be used.

  The method of the present invention can be used for producing a wiring layer inter-film connection member (bump group resin filler), a circuit member, or an electromagnetic shielding metal mesh member.

It is typical sectional drawing which shows process (1A)-process (1E) of the method of this invention which manufactures the member for wiring layer film connection. It is typical sectional drawing which shows the process (1F)-process (1J) of the method of this invention which manufactures the member for wiring layer film connection. It is typical sectional drawing which shows the process (2A)-process (2E) of the method of this invention which manufactures a circuit member in order. It is typical sectional drawing which shows the process (2F)-process (2I) of the method of this invention which manufactures a circuit member in order. It is typical sectional drawing which shows the process (3A)-process (3F) of the method of this invention which manufactures an electromagnetic wave shielding metal mesh member in order. It is typical sectional drawing which shows the process (3G)-process (3K) of the method of this invention which manufactures an electromagnetic wave shielding metal mesh member in order. It is sectional drawing which shows typically the critical state of the uncured area | region and hardening area | region in a partial adhesive pressure-sensitive-adhesive layer, and a bump fumoto part. It is sectional drawing which shows typically the undesired relationship between the uncured area | region and hardening area | region in a partial adhesive pressure-sensitive-adhesive layer, and a bump fumoto part. It is sectional drawing which shows typically the preferable relationship between the unhardened area | region and hardening area | region in a partial adhesive pressure-sensitive adhesive layer, and a bump fumoto part. It is typical sectional drawing which shows process (1a)-process (1f) of the manufacturing method of the conventional member for wiring layer film | membrane connection and a wiring circuit board in order. It is typical sectional drawing which shows the process (1g)-process (1l) of the manufacturing method of the conventional member for wiring layer film | membrane connection and a wiring circuit board in order. It is a schematic plan view of a bump group resin filler manufactured by the method of the present invention or a conventional method. It is typical sectional drawing which shows the process (2a)-process (2e) of the manufacturing method of the conventional circuit member in order. It is typical sectional drawing which shows the process (2f)-process (2g) of the manufacturing method of the conventional circuit member in order. It is a typical top view of the circuit member manufactured by the method of the present invention or the conventional method. It is a schematic plan view of the electromagnetic wave shielding metal mesh member manufactured by the method of the present invention or the conventional method.

Explanation of symbols

DESCRIPTION OF SYMBOLS 1 ... Metal layer for bump formation; 2 ... Protective film;
2A ... Partial adhesive protective film; 2B ... Peelable protective film;
3, 63 ... support; 4 ... pressure sensitive adhesive layer; 4a ... uncured region;
4b ... cured region; 4x ... exposed portion; 4y ... non-exposed portion;
4A ... Partially sticky pressure-sensitive adhesive layer; 5, 45, 55 ... Resist film;
6 ... Bump; 6a, 6b ... Bump end; 6c ... Bump moto part;
7 ... Insulating resin layer; 8 ... Resist film for conductor circuit; 9 ... Conductor circuit;
10 ... Metal foil paste; 11, 11A ... Bump group carrier;
12, 12A ... bump group resin carrier; 13 ... bump group resin filler;
14 ... Circuit forming board; 15 ... Wiring circuit board;
21, 22 ... Metal foil for forming a conductor circuit;
23, 24 ... Metal layer for forming a conductive metal mesh; 31 ... Irradiation mask sheet;
31a ... non-transmissive region; 31b ... transmissive region; 40 ... metal foil patch;
41 ... Metal layer for circuit formation; 41A ... Circuit carrier; 42A ... Circuit board carrier;
43A ... circuit board; 46 ... circuit layer; 47 ... insulating sheet layer;
50 ... Metal foil paste; 51 ... Metal layer for forming metal mesh;
51A ... metal mesh carrier;
52B ... Blackened metal mesh carrier;
53A, electromagnetic shielding metal mesh member;
56 ... metal mesh layer; 57 ... blackened metal mesh layer;
58 ... release film; 58a ... substrate; 58b ... pressure-sensitive adhesive layer.

Claims (12)

(1) (a) a protective film carrying, on one surface of a support, a layer made of a pressure-sensitive adhesive capable of reducing the adhesive strength by irradiating with active energy rays; and (b) Including a metal layer to be etched that is attached to the protective film via the pressure-sensitive adhesive layer, and preparing a metal foil patch,
(2) (a) a step of forming a resist film on the surface of the metal layer to be etched of the metal foil patch, and (b) a transmission region that transmits the active energy rays and a non-transmission that does not transmit the active energy rays. Irradiating the pressure-sensitive adhesive layer with the active energy ray through an irradiation mask sheet having a region, and contacting the etching solution in the etching process of the metal layer to be etched performed through the resist film. The pressure sensitive adhesive is cured by at least irradiating the contact area to be maintained, and the pressure sensitive adhesive is maintained in an uncured state without irradiating at least a part of the non-contact area that is not in contact with the etching solution. Perform the steps in any order,
(3) An etching process is performed on the metal layer to be etched,
(4) It includes the steps of curing the pressure-sensitive adhesive in an uncured state by irradiation with the active energy ray, and (5) peeling the protective film to form an etching metal body. The manufacturing method of the said etching metal body.   The manufacturing method according to claim 1, wherein the etching metal body is a wiring layer inter-film connecting member, a circuit member, or an electromagnetic shielding metal mesh member.   In the step (2) (b), the active energy ray is also irradiated to a part of the non-contact region that does not come into contact with the etching solution and adjacent to the contact region with the etching solution. The manufacturing method according to claim 1, wherein the pressure-sensitive adhesive is cured.   The manufacturing method as described in any one of Claims 1-3 whose initial stage peeling force before the said active energy ray irradiation of the said pressure sensitive adhesive is 0.05-30 N / 25mm.   The manufacturing method as described in any one of Claims 1-4 whose peeling force after the said active energy ray irradiation of the said pressure sensitive adhesive is less than 0.05 N / 25mm.   The etching metal body obtained by the manufacturing method as described in any one of Claims 1-5. (1) (a) a protective film carrying, on one surface of a support, a layer made of a pressure-sensitive adhesive capable of reducing the adhesive strength by irradiating with active energy rays; and (b) Including a metal layer for forming a bump attached to the protective film via the pressure-sensitive adhesive layer, and preparing a metal foil patch,
(2) (a) a step of forming a resist film on the surface of the bump-forming metal layer of the metal foil patch, and (b) a transmission region that transmits the active energy ray and a non-permeation of the active energy ray. The pressure-sensitive adhesive layer is irradiated with the active energy ray through an irradiation mask sheet having a transmission region, and comes into contact with an etching solution in the bump forming metal layer etching step performed through the resist film. Irradiate at least the contact area to be cured to cure the pressure-sensitive adhesive, and leave the pressure-sensitive adhesive in an uncured state without irradiating at least a part of the non-contact area that does not come into contact with the etching solution. Perform the steps to maintain in any order,
(3) An etching process is performed on the bump-forming metal layer,
(4) After removing the resist film, filling a gap between the bump group layers formed by the etching step with an insulating resin layer, forming a bump group resin filler on the protective film,
(5) The active energy ray is irradiated onto the protective film to cure the uncured pressure-sensitive adhesive, and (6) the protective film is peeled to form a wiring layer inter-film connection member. The method for producing a member for connecting between wiring layer films, comprising each step. (1) (a) a protective film carrying, on one surface of a support, a layer made of a pressure-sensitive adhesive capable of reducing the adhesive strength by irradiating with active energy rays; and (b) Including a metal layer for circuit formation that is affixed to the protective film via the pressure-sensitive adhesive layer, and preparing a metal foil patch,
(2) (a) a step of forming a resist film on the surface of the metal layer for circuit formation of the metal foil patch, and (b) a transmission region that transmits the active energy ray and a non-permeation of the active energy ray. The pressure-sensitive adhesive layer is irradiated with the active energy rays through an irradiation mask sheet having a transmission region, and contacts with an etching solution in the etching process of the circuit forming metal layer performed through the resist film. Irradiate at least the contact area to be cured to cure the pressure-sensitive adhesive, and leave the pressure-sensitive adhesive in an uncured state without irradiating at least a part of the non-contact area that does not come into contact with the etching solution. Perform the steps to maintain in any order,
(3) An etching process is performed on the metal layer for circuit formation,
(4) irradiating the active energy ray to the protective film to cure the pressure-sensitive adhesive in an uncured state, and (5) including each step of peeling the protective film to form a circuit member. A method for producing the circuit member, comprising:   The manufacturing method according to claim 8, further comprising the step of embedding and fixing the circuit layer formed by the etching step (3) in an insulating sheet. (1) (a) a protective film carrying, on one surface of a support, a layer made of a pressure-sensitive adhesive capable of reducing the adhesive strength by irradiating with active energy rays; and (b) Including a metal layer for forming an electromagnetic wave shielding metal mesh attached to the protective film via the pressure-sensitive adhesive layer, and preparing a metal foil patch,
(2) (a) a step of forming a resist film on the surface of the metal layer for forming the metal mesh of the metal foil patch, and (b) a transmission region that transmits the active energy rays and the active energy rays that do not pass. In the etching process of the metal layer for forming a metal mesh, the pressure-sensitive adhesive layer is irradiated with the active energy ray through an irradiation mask sheet having a non-transmissive region, and the metal mesh forming metal layer is etched through the resist film. Irradiate at least a contact area to be contacted to cure the pressure-sensitive adhesive, and uncured the pressure-sensitive adhesive without irradiating at least part of a non-contact area that does not contact the etching solution. The process of maintaining the state is performed in an arbitrary order,
(3) An etching process is performed on the metal mesh forming metal layer,
(4) Irradiating the active energy ray to the protective film to cure the uncured pressure-sensitive adhesive, and (5) peeling the protective film to form an electromagnetic wave shielding metal mesh member. The manufacturing method of the said electromagnetic wave shielding metal mesh member characterized by including a process.   The manufacturing method of Claim 10 which further implements the process of blackening the surface of the electromagnetic wave shielding metal mesh layer formed by the said etching process (3).   The manufacturing method of Claim 10 or 11 which further implements the process of sticking the electromagnetic wave shielding metal mesh layer formed by the said etching process (3) to the to-be-adhered body which has a pressure sensitive adhesive layer.

Images