JP2006110488A - Coater - Google Patents

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JP2006110488A
JP2006110488A JP2004301739A JP2004301739A JP2006110488A JP 2006110488 A JP2006110488 A JP 2006110488A JP 2004301739 A JP2004301739 A JP 2004301739A JP 2004301739 A JP2004301739 A JP 2004301739A JP 2006110488 A JP2006110488 A JP 2006110488A
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substrate
absence
foreign matter
coating
predetermined
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Yoshiyuki Hara
義行 原
Taku Iwade
卓 岩出
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Toray Engineering Co Ltd
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Toray Engineering Co Ltd
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  • Coating Apparatus (AREA)

Abstract

<P>PROBLEM TO BE SOLVED: To provide a novel coater capable of inspecting whether or not a foreign matter exists on a surface of a substrate. <P>SOLUTION: This coater has a mouthpiece 2 provided on a base 1; a substrate support base 3 capable of being reciprocated in a predetermined direction by a driving source not shown; the substrate 4 supported on the base support base 3 in the adsorption state; a light projection unit 5 for irradiating with a semiconductor laser beam in parallel to the mouthpiece 2 in the state having predetermined spreading; and a light receiving unit 6 for receiving the semiconductor laser beam. <P>COPYRIGHT: (C)2006,JPO&NCIPI

Description

本発明は、ガラス基板などの平板状の基板を塗布機構に対して相対的に移動させながら、基板の上表面に薬液などの流体を均一な所定厚みとなるように塗布するための装置に関する。   The present invention relates to an apparatus for applying a fluid such as a chemical solution to an upper surface of a substrate so as to have a uniform predetermined thickness while moving a flat substrate such as a glass substrate relative to an application mechanism.

従来から、塗布機構に対して基板を相対的に移動させながら塗布処理を行う基板塗布システムが提供されている。   Conventionally, there has been provided a substrate coating system that performs a coating process while moving a substrate relative to a coating mechanism.

そして、塗布厚みを薄くするとともに、厚みのばらつきを小さくすることが要求される用途においては、コータを採用し、しかも、コータの口金部と基板上面とのクリアランスを著しく小さくしている。   In applications where it is required to reduce the coating thickness and to reduce variations in thickness, a coater is employed, and the clearance between the base portion of the coater and the upper surface of the substrate is significantly reduced.

このような基板塗布システムにおいては、基板の表面に異物が存在するか否かを検査する装置は基板塗布システムには組み込まれていなかった。   In such a substrate coating system, an apparatus for inspecting whether or not a foreign substance exists on the surface of the substrate has not been incorporated in the substrate coating system.

したがって、基板の洗浄を行うこと、基板に流体を塗布する工程に異物が進入することを防止すること、などが必要である。   Therefore, it is necessary to clean the substrate, prevent foreign matter from entering the step of applying a fluid to the substrate, and the like.

しかし、このような対処を施しても、異物の侵入、付着を完全には排除することができないので、基板の表面に異物が存在すると、不良品が得られることになるとともに、口金部が破損する可能性があった。   However, even if such measures are taken, the intrusion and adhesion of foreign matter cannot be completely eliminated. If foreign matter exists on the surface of the substrate, a defective product will be obtained and the base part will be damaged. There was a possibility.

本発明は、基板の表面に異物が存在するか否かを検査することができる新規な塗布装置を提供することを目的としている。   An object of this invention is to provide the novel coating device which can test | inspect whether the foreign material exists in the surface of a board | substrate.

本発明の塗布装置は、平板状の基板を支承するテーブル部材と、テーブル部材に支承された基板の上表面に流体を塗布する塗布手段と、テーブル部材に支承された基板の表面における異物の有無を検出する異物有無検出手段と、塗布手段と異物有無検出手段とを所定の位置関係を保持するよう連結する連結手段と、塗布手段と異物有無検出手段とをテーブル部材に支承された基板に対して所定の相対的速度で所定の相対的方向に移動させる駆動手段とを含むものである。   The coating apparatus according to the present invention includes a table member that supports a flat substrate, a coating unit that applies fluid to the upper surface of the substrate supported by the table member, and the presence or absence of foreign matter on the surface of the substrate supported by the table member. A detecting means for detecting the presence or absence of foreign matter, a connecting means for connecting the applying means and the detecting means for detecting the presence or absence of foreign matter to maintain a predetermined positional relationship, and the applying means and the detecting means for detecting the presence or absence of foreign matter. Driving means for moving in a predetermined relative direction at a predetermined relative speed.

ここで、「所定の位置関係」とは、塗布手段と異物有無検出手段との位置関係を表すものであり、両者間の距離が好ましい距離となるように位置関係が設定されていることが好ましい。そして、好ましい距離は、例えば、異物有無検出手段により異物が検出された場合に、塗布手段の異物回避動作などを確実にでき、しかも、異物有無検出と塗布との間で異物が進入するおそれを小さくするとともに、タクトタイムを短くすることができるように定められる距離であり、例えば経験的に定められる。   Here, the “predetermined positional relationship” represents the positional relationship between the applying unit and the foreign matter presence / absence detecting unit, and the positional relationship is preferably set so that the distance between the two is a preferable distance. . For example, when a foreign object is detected by the foreign object presence / absence detecting unit, the preferable distance can ensure the operation of avoiding the foreign object of the applying unit and the possibility that the foreign object may enter between the detection of the presence / absence of the foreign object and the application. The distance is determined so that the tact time can be shortened while decreasing, for example, empirically determined.

「所定の相対的速度」とは、テーブル部材に支承された基板に対して塗布手段と異物有無検出手段とを移動させる場合の速度を表すものであり、異物有無検出および流体塗布の品質を高く維持できる限り、大きな速度であることが好ましい。また、相対的速度であるから、基板のみが移動する場合、塗布手段および異物有無検出手段のみが移動する場合、両者が移動する場合を包含する。   The “predetermined relative speed” represents the speed when the application means and the foreign object presence / absence detection means are moved relative to the substrate supported by the table member. A high speed is preferable as long as it can be maintained. Moreover, since it is a relative speed, the case where only a board | substrate moves, the case where only an application | coating means and a foreign material presence detection means move, and the case where both move are included.

「所定の相対的方向」とは、テーブル部材に支承された基板に対する塗布手段と異物有無検出手段との移動方向を表すものであり、塗布装置の構成などにより定められる。そして、基板のみが移動する場合、塗布手段および異物有無検出手段のみが移動する場合、両者が移動する場合を包含する。   The “predetermined relative direction” represents the moving direction of the coating unit and the foreign matter presence / absence detecting unit with respect to the substrate supported by the table member, and is determined by the configuration of the coating apparatus. The case where only the substrate moves, the case where only the coating means and the foreign matter presence / absence detecting means move, and the case where both move are included.

本発明の塗布装置であれば、連結手段によって塗布手段と異物有無検出手段とを所定の位置関係を保持するよう連結しているので、塗布手段による塗布スキャンと同時に異物有無検出スキャンを行うことができる。この結果、異物に起因する不都合の発生を未然に防止することができる。また、塗布スキャンと異物有無検出スキャンとを別々に行う場合と比較して所要時間、タクトを短縮することができる。   In the coating apparatus of the present invention, since the application unit and the foreign object presence / absence detection unit are connected by the connection unit so as to maintain a predetermined positional relationship, the foreign object presence / absence detection scan can be performed simultaneously with the application scan by the application unit. it can. As a result, it is possible to prevent the occurrence of inconvenience due to the foreign matter. Further, the required time and tact time can be shortened as compared with the case where the application scan and the foreign matter presence detection scan are separately performed.

この場合において、塗布手段と異物有無検出手段とで規定される空間を覆うカバー部材をさらに含むことが好ましい。   In this case, it is preferable to further include a cover member that covers a space defined by the application unit and the foreign matter presence / absence detection unit.

この場合には、異物有無検出手段による異物の有無の検出と塗布装置による流体の塗布との間に基板の上表面に異物が侵入することを防止することができる。   In this case, it is possible to prevent foreign matter from entering the upper surface of the substrate between the detection of the presence or absence of foreign matter by the foreign matter presence / absence detection means and the application of fluid by the coating apparatus.

本発明は、異物に起因する不都合の発生を未然に防止することができるという特有の効果を奏する。   The present invention has a specific effect that it is possible to prevent the occurrence of inconvenience due to foreign matter.

以下、添付図面を参照して、本発明の塗布装置の実施の形態を詳細に説明する。
図1は基板処理システムの一例としての基板塗布システムの一例を示す概略斜視図である。
Hereinafter, embodiments of a coating apparatus of the present invention will be described in detail with reference to the accompanying drawings.
FIG. 1 is a schematic perspective view showing an example of a substrate coating system as an example of a substrate processing system.

この基板塗布システムは、基台1上に設けられた口金部2と、図示しない駆動源によって所定方向に往復動可能な基板支承台3と、基板支承台3に吸着状態で支承される基板4と、口金部2と平行に(基板支承台3の移動方向と直交し、かつ基板4の上面に沿う方向に)半導体レーザー光を、所定の広がりを有する状態で照射する投光器5と、この半導体レーザー光を受光する受光器6とを有している。この投光器5と受光器6とで異物有無検出手段を構成する。すなわち、受光器6による受光光量の多少に応じて、異物の不存在、異物の存在を検出することができる。また、口金部2と異物有無検出手段とは、基台1によって互いに連結されているとともに、所定の相対位置関係を保持するよう構成されている。そして、口金部2と異物有無検出手段とにより規定される空間を覆うカバー部材7を設けることが好ましく(図2参照)、異物有無検出手段による異物の有無の検出と塗布装置による流体の塗布との間に基板の上表面に異物が侵入することを防止することができる。   This substrate coating system includes a base portion 2 provided on a base 1, a substrate support 3 that can be reciprocated in a predetermined direction by a drive source (not shown), and a substrate 4 that is supported by the substrate support 3 in an adsorbed state. And a light projector 5 for irradiating a semiconductor laser beam in a state having a predetermined spread in parallel with the base part 2 (in a direction perpendicular to the moving direction of the substrate support 3 and along the upper surface of the substrate 4), and the semiconductor And a light receiver 6 for receiving laser light. The light projector 5 and the light receiver 6 constitute a foreign matter presence / absence detecting means. That is, the absence of foreign matter and the presence of foreign matter can be detected according to the amount of light received by the light receiver 6. Further, the base part 2 and the foreign substance presence / absence detecting means are connected to each other by the base 1 and are configured to maintain a predetermined relative positional relationship. It is preferable to provide a cover member 7 that covers the space defined by the base 2 and the foreign matter presence / absence detection means (see FIG. 2). It is possible to prevent foreign matter from entering the upper surface of the substrate during this period.

ここで、所定の相対位置関係は、具体的には、例えば、以下のように定めることができる。   Here, the specific relative positional relationship can be specifically determined as follows, for example.

基板1の上表面に100m/secで塗布する場合であって、異物検出から、異物検出信号発信、口金部退避用駆動源の駆動を経て口金部2の退避までの所要時間が500msecである場合には、500msecの時間内に50mmだけ塗布位置が移動するのであるから、所定の相対位置関係として、基板1の上表面と実質的に平行な方向における距離を50mm〜100mmに設定すればよい。   When applying to the upper surface of the substrate 1 at 100 m / sec, the required time from foreign matter detection to foreign matter detection signal transmission, drive of the base part withdrawal drive source and withdrawal of the base part 2 is 500 msec In this case, since the coating position moves by 50 mm within 500 msec, the distance in the direction substantially parallel to the upper surface of the substrate 1 may be set to 50 mm to 100 mm as the predetermined relative positional relationship.

前記投光器5は、例えば、上下方向のレーザー光出射角度を微調整するマイクロメータ(図示せず)と、水平方向のレーザー光出射角度を微調整する微調整ねじ機構(図示せず)と、上下方向のレーザー光出射位置を微調整する送りねじ機構(図示せず)とを有している。そして、マイクロメータによる微調整後にロックするためのクランプ(図示せず)を有している。   The projector 5 includes, for example, a micrometer (not shown) that finely adjusts the vertical laser beam emission angle, a fine adjustment screw mechanism (not shown) that finely adjusts the horizontal laser beam emission angle, And a feed screw mechanism (not shown) for finely adjusting the laser light emission position in the direction. And it has the clamp (not shown) for locking after fine adjustment with a micrometer.

ただし、従来公知の他の構成を採用することも可能である。
そして、投光器5に含まれるレーザーは、楕円形状のレーザー光のうち、長軸が基板4の上面と平行になるように位置決めされており、この結果、半導体レーザー光を、所定の広がりを有する状態で照射することができる。したがって、レーザー光をスポット状に絞り込んだ場合には、基板4の厚みが変化したことに応答して、投光器および受光器の上下位置を変更する必要があるのに対して、本実施形態では、基板4の厚みが変化した場合であっても、投光器5および受光器6の上下位置を変更する必要がない。
However, other conventionally known configurations may be employed.
The laser included in the projector 5 is positioned so that the major axis of the elliptical laser light is parallel to the upper surface of the substrate 4, and as a result, the semiconductor laser light has a predetermined spread. Can be irradiated. Therefore, when the laser beam is narrowed down in a spot shape, it is necessary to change the vertical position of the projector and the light receiver in response to the change in the thickness of the substrate 4, whereas in the present embodiment, Even if the thickness of the substrate 4 changes, it is not necessary to change the vertical positions of the projector 5 and the light receiver 6.

また、受光器6は、例えば、フォトダイオード(図示せず)の受光面の前方に、基板4の上面と直交する方向に延びるスリット(図示せず)を有するスリット部材(図示せず)を有している。この結果、スリットによって制限された範囲のレーザー光のみをフォトダイオードに入射させることができる。   The light receiver 6 has, for example, a slit member (not shown) having a slit (not shown) extending in a direction orthogonal to the upper surface of the substrate 4 in front of the light receiving surface of a photodiode (not shown). is doing. As a result, only laser light in a range limited by the slit can be incident on the photodiode.

ただし、従来公知の他の構成を採用することも可能である。
上記の構成の基板塗布システムであれば、図示しない駆動源によって基板支承台3を所定方向に所定速度で移動させれば、口金部2と異物有無検出手段とを基板4に対して相対的に移動させることができ、この結果、口金部2による塗布スキャンと異物有無検出手段による異物有無検出スキャンとを同時に行うことができる。
However, other conventionally known configurations may be employed.
In the case of the substrate coating system having the above-described configuration, the base 2 and the foreign matter presence / absence detecting means are relatively moved with respect to the substrate 4 by moving the substrate support 3 in a predetermined direction at a predetermined speed by a driving source (not shown). As a result, the application scan by the base 2 and the foreign object presence detection scan by the foreign object detection means can be performed simultaneously.

また、口金部2による塗布が行われる直前(非常に短時間前)に異物有無検出手段による異物有無検出が行われるのであるから、異物の有無を検出し、異物の不存在が検出された場合にのみ口金部2による塗布を行うことができ、逆に、異物の存在が検出された場合に口金部2による塗布を中断することができ、不良品が発生する可能性、口金部2が破損する可能性を大幅に低減することができる。   In addition, since the presence / absence detection of foreign matter is performed by the foreign matter presence / absence detection means immediately before application by the base part 2 (very short time before), the presence / absence of foreign matter is detected and the absence of foreign matter is detected. Can be applied only to the base part 2, and conversely, when the presence of foreign matter is detected, the application by the base part 2 can be interrupted, possibly causing defective products, and the base part 2 is damaged. The possibility of doing so can be greatly reduced.

基板処理システムの一例としての基板塗布システムの一例を示す概略斜視図である。It is a schematic perspective view which shows an example of the substrate coating system as an example of a substrate processing system. 基板処理システムの一例としての基板塗布システムの他の例を示す概略斜視図である。It is a schematic perspective view which shows the other example of the substrate coating system as an example of a substrate processing system.

符号の説明Explanation of symbols

1 基台
2 口金部
3 基板支承台
4 基板
5 投光器
6 受光器
7 カバー部材


DESCRIPTION OF SYMBOLS 1 Base 2 Base part 3 Substrate support stand 4 Substrate 5 Emitter 6 Light receiver 7 Cover member


Claims (2)

平板状の基板(4)を支承するテーブル部材(3)と、テーブル部材(3)に支承された基板(4)の上表面に流体を塗布する塗布手段(2)と、テーブル部材(3)に支承された基板(4)の表面における異物の有無を検出する異物有無検出手段(5)(6)と、塗布手段(2)と異物有無検出手段(5)(6)とを所定の位置関係を保持するよう連結する連結手段(1)と、塗布手段(2)と異物有無検出手段(5)(6)とをテーブル部材(3)に支承された基板(4)に対して所定の相対的速度で所定の相対的方向に移動させる駆動手段とを含むことを特徴とする塗布装置。 A table member (3) for supporting a flat substrate (4), a coating means (2) for applying a fluid to the upper surface of the substrate (4) supported by the table member (3), and a table member (3) The foreign substance presence / absence detecting means (5) (6) for detecting the presence / absence of foreign substances on the surface of the substrate (4) supported on the substrate, the coating means (2) and the foreign substance presence / absence detecting means (5) (6) are arranged at predetermined positions. The connecting means (1) for connecting so as to maintain the relationship, the applying means (2), and the foreign substance presence / absence detecting means (5) (6) with respect to the substrate (4) supported by the table member (3) are predetermined. And a driving means for moving in a predetermined relative direction at a relative speed. 塗布手段(2)と異物有無検出手段(5)(6)とで規定される空間を覆うカバー部材(7)をさらに含む請求項1に記載の塗布装置。


The coating apparatus according to claim 1, further comprising a cover member (7) covering a space defined by the coating means (2) and the foreign substance presence / absence detection means (5) (6).


JP2004301739A 2004-10-15 2004-10-15 Coater Pending JP2006110488A (en)

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Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR100775086B1 (en) 2006-06-02 2007-11-08 주식회사 케이씨텍 Apparatus and method for detecting foreign substance
JP2008032481A (en) * 2006-07-27 2008-02-14 Toray Eng Co Ltd Method of measuring distance between member, nozzle height adjustment method for applicator, and applicator
CN107462228A (en) * 2017-07-17 2017-12-12 深圳市华星光电半导体显示技术有限公司 Positioner and localization method, color film coating machine
US10955239B2 (en) 2017-07-17 2021-03-23 Shenzhen China Star Optoelectronics Semiconductor Display Technology Co., Ltd. Positioning device and positioning method, color film coating machine

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2000024571A (en) * 1998-07-10 2000-01-25 Hirata Corp Slit coat type coating apparatus and slit coat type coating method
JP2000140736A (en) * 1993-05-31 2000-05-23 Hirata Corp Apparatus and method for fluid coating
JP2002001195A (en) * 2000-06-19 2002-01-08 Toray Ind Inc Method and device for coating and method and device for manufacturing color filter

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2000140736A (en) * 1993-05-31 2000-05-23 Hirata Corp Apparatus and method for fluid coating
JP2000024571A (en) * 1998-07-10 2000-01-25 Hirata Corp Slit coat type coating apparatus and slit coat type coating method
JP2002001195A (en) * 2000-06-19 2002-01-08 Toray Ind Inc Method and device for coating and method and device for manufacturing color filter

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR100775086B1 (en) 2006-06-02 2007-11-08 주식회사 케이씨텍 Apparatus and method for detecting foreign substance
JP2008032481A (en) * 2006-07-27 2008-02-14 Toray Eng Co Ltd Method of measuring distance between member, nozzle height adjustment method for applicator, and applicator
CN107462228A (en) * 2017-07-17 2017-12-12 深圳市华星光电半导体显示技术有限公司 Positioner and localization method, color film coating machine
US10955239B2 (en) 2017-07-17 2021-03-23 Shenzhen China Star Optoelectronics Semiconductor Display Technology Co., Ltd. Positioning device and positioning method, color film coating machine

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