JP2006110139A - Ultrasonic vibrator array - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide an ultrasonic transducer array by which wiring work for connecting ultrasonic transducers and a signal line through a wire is facilitated even when the plurality of the ultrasonic transducers are arranged with narrow pitches. <P>SOLUTION: The wire 17 is constituted by coating the entire of the base material 26 of the wire 17 with dissimilar metal 19 having conductivity different from that of metal serving as the base material 26 into a prescribed thickness, and by melting the dissimilar metal at both ends of the wire 17, the ultrasonic transducers and the signal line 11 are connected electrically through the wire 17. <P>COPYRIGHT: (C)2006,JPO&NCIPI

Description

  The present invention relates to an ultrasonic transducer array in which a selected ultrasonic transducer among a plurality of ultrasonic transducers arranged in series transmits and receives ultrasonic waves, and is particularly provided in an ultrasonic endoscope apparatus and the like. The present invention relates to a wire manufacturing method for electrically connecting an ultrasonic transducer and a signal line in a radial ultrasonic transducer array.

FIG. 4 is a diagram showing an existing ultrasonic endoscope apparatus.
The ultrasonic endoscope apparatus 40 illustrated in FIG. 4 includes a connection unit 41, an operation unit 42, and an insertion unit 43. The insertion unit 43 includes a distal end portion 44.

The connection unit 41 is connected to, for example, a measuring device including a display, and an image obtained by a micro camera provided at the tip end portion 44 is displayed on the display.
The operation unit 42 performs, for example, an up / down / left / right bending operation of the insertion unit 43 by a user operation.

  In addition to the ultra-small camera, the distal end portion 44 is provided with, for example, an ultrasonic transducer array configured by continuously arranging a plurality of ultrasonic transducers. The ultrasonic wave is transmitted / received in the selected ultrasonic vibrator among the ultrasonic vibrators. The ultrasonic waves received by the ultrasonic transducer array are converted into electrical signals and displayed as images on the display or the like.

FIG. 5 is an enlarged view of the distal end portion 44 shown in FIG.
As shown in FIG. 5, the distal end portion 44 is configured to include a camera unit 50 provided with the ultra-small camera, illumination, and the like, and an ultrasonic unit 51 provided with the ultrasonic transducer array and the like.

FIG. 6 is a diagram illustrating an example of an ultrasonic transducer array. The ultrasonic transducer array shown in FIG. 6 shows only a basic configuration.
As shown in FIG. 6, the ultrasonic transducer array 60 includes a piezoelectric element 61, an electrode 62, a first acoustic matching layer 63, a second acoustic matching layer 64, a conductive resin 65, a conductor 66, And a substrate 67.

  In addition, the piezoelectric element 61, the electrode 62, the first acoustic matching layer 63, the second acoustic matching layer 64, the conductive resin 65, the conductor 66, and the substrate 67 are divided into a plurality by the groove 68 provided in common, The ultrasonic transducer is configured.

  Each ultrasonic transducer is electrically connected to the corresponding signal line, and when a signal is sent from the measurement device or the like to the ultrasonic transducer via the signal line, the ultrasonic transducer is Send. In addition, the ultrasonic transducer that receives the ultrasonic wave converts the ultrasonic wave into an electric signal and sends the electric signal to a measuring device or the like via a signal line.

  Further, the ultrasonic transducer array 60 is formed in a cylindrical shape by connecting the end faces in the direction perpendicular to the longitudinal direction of the ultrasonic transducer array 60, so that the ultrasonic wave is transmitted in an annular manner. An acoustic transducer array is constructed.

  In some radial ultrasonic transducer arrays, the ultrasonic transducer and the signal line are connected at the tip of the ultrasonic transducer array. Further, in this way, in the radial ultrasonic transducer array in which the ultrasonic transducer and the signal line are connected at the tip, the substrate at the tip of the cylindrical structure member assembled inside the ultrasonic transducer array is used. In some cases, the ultrasonic transducer and the signal line are connected via each other.

  FIG. 7A is a diagram illustrating a state where a cylindrical structural member is assembled to a radial ultrasonic transducer array. FIG. 7B is a diagram showing a radial ultrasonic transducer array in which cylindrical structural members are assembled. In addition, the same code | symbol is attached | subjected to the same structure as the structure shown in FIG.

  As shown in FIGS. 7A and 7B, a substrate 71 is provided at the tip of the cylindrical structural member 70, and a plurality of pads 72 corresponding to the plurality of ultrasonic transducers are provided on the substrate 71. ing. A conductive layer 73 is provided on each substrate 67 of the plurality of ultrasonic transducers. An acoustic lens 74 is provided on the outer periphery of the radial ultrasonic transducer array. A backing material 75 is provided on the inner periphery of the radial ultrasonic transducer array.

  First, as shown in FIG. 7A, a cylindrical structural member 70 is inserted into the radial ultrasonic transducer array. It is assumed that the pads 72 on the substrate 71 and the signal lines are electrically connected in advance.

Then, as shown in FIG. 7B, the cylindrical structural member 70 is assembled to the radial ultrasonic transducer array.
After the cylindrical structural member 70 is assembled to the radial ultrasonic transducer array, for example, each pad 72 on the substrate 71 and each conductive layer 73 are electrically connected through a conductive wire. Is done.

Thereby, each ultrasonic transducer | vibrator and each signal line are electrically connected through the pad 72, the said wire, the conductive layer 73, the conductor 66, and the electrode 62, respectively.
As described above, the configuration in which the ultrasonic transducer and the signal line are electrically connected via the substrate facilitates the alignment of the ultrasonic transducer and the signal line. The wiring work can be made smooth (see, for example, Patent Document 1 or Patent Document 2).

  As a wiring method for connecting a signal line to a substrate, for example, wire bonding is known (for example, see Patent Document 3). In addition, when connecting a wire to each ultrasonic transducer of the radial ultrasonic transducer array, since each ultrasonic transducer is arranged in a ring shape, for example, the pad 72 and the wire are connected by wire bonding. It is difficult to let

FIG. 8 is a view showing a radial ultrasonic transducer array in which the cylindrical structural member 70 is assembled. In addition, the same code | symbol is attached | subjected to the same structure as the structure shown to FIG. 7A and 7B.
In FIG. 8, it is desirable that the substrate 67 having the pad 72 and the conductive layer corresponding to the pad 72 on the surface is aligned as accurately as possible. If the alignment is performed accurately, the wiring work of the wire becomes easy, and the wiring work of the ultrasonic transducer and the signal line can be made smoother.

  By the way, it is desirable that the distal end portion of the ultrasonic endoscope apparatus is as thin as possible, and not only a radial ultrasonic transducer array but also an ultrasonic transducer array mounted on the ultrasonic endoscope apparatus. Is preferably configured as small as possible.

  For this reason, in the ultrasonic transducer array mounted on the ultrasonic endoscope apparatus, the ultrasonic transducers are arranged at a narrow pitch, making it difficult to wire the wires. For example, when a radial ultrasonic transducer array composed of 192 ultrasonic transducers is mounted on the tip 44 having a diameter of 10 mm, the ultrasonic transducers are arranged at a pitch of about 0.2 mm or less.

Thus, as described above, when the ultrasonic transducers are arranged at a narrow pitch, for example, there is a method of providing preliminary solder at the tip of the wire as a method of smoothing the wiring work of the wire.
Japanese Patent No. 2729442 (Pages 2-4, FIGS. 1-4) JP 2003-33354 A (pages 2 to 4 and FIGS. 1 to 12) JP-A-3-254737 (Pages 1 to 4, FIGS. 1 to 7)

  However, when preparatory solder is provided at the tip of the wire, generally, there are a method of applying a small amount of solder to the tip of the wire with a soldering iron or the like and a method of putting the tip of the wire into a solder bath. There may be a case where a uniform amount of preliminary solder cannot be provided at each tip of each wire. Therefore, when connecting wires to a plurality of ultrasonic transducers arranged at a narrow pitch, if there is variation in the amount of spare solder provided at the tip of each wire, the solder of adjacent wires will be There is a risk that the sticking wires will bridge.

  As described above, when a plurality of ultrasonic transducers are arranged at a narrow pitch, when the ultrasonic transducers and the signal lines are connected via wires, there is a problem that wiring work of the wires is difficult.

  Therefore, the present invention facilitates wiring work when connecting an ultrasonic transducer and a signal line via a wire even when a plurality of ultrasonic transducers are arranged at a narrow pitch. It is an object of the present invention to provide an ultrasonic transducer array that can be used and a method of manufacturing the wire.

In order to solve the above problems, the present invention adopts the following configuration.
That is, the ultrasonic transducer array of the present invention includes a plurality of ultrasonic transducers arranged in succession and a plurality of signal lines electrically connected to the plurality of ultrasonic transducers, respectively. The ultrasonic transducer corresponding to the signal line through which the signal has flowed among the signal lines transmits ultrasonic waves, and the signal line corresponding to the ultrasonic transducer that has received the ultrasonic wave among the plurality of ultrasonic transducers An ultrasonic transducer array through which signals flow, wherein the plurality of ultrasonic transducers and the plurality of signal lines are electrically connected to each other to electrically connect the plurality of ultrasonic transducers and the plurality of signal lines, respectively. A plurality of wires provided between each of the plurality of wires, and the plurality of wires are coated on the entire base material with a predetermined thickness of a different conductive metal different from the metal serving as the base material of the wire. Configured and said The dissimilar metal at both ends of the ear is characterized by the plurality of ultrasonic transducers and said plurality of the signal lines be electrically connected by being melted.

  Further, the wire of the ultrasonic transducer array is coated on the entire base material with the thickness of the dissimilar metal so as not to bridge with the adjacent wire when the dissimilar metal at both ends of the wire is melted. It is desirable to be constituted by.

Moreover, the base material of the wire of the ultrasonic transducer array may be composed of copper or silver, and the dissimilar metal may be composed of a metal mainly composed of lead, tin, or bismuth.
Further, the wire of the ultrasonic transducer array may be configured by coating the dissimilar metal on the entire base material by wet plating.

In addition, the wire base material of the ultrasonic transducer array may not have an insulating coating formed thereon.
Moreover, a rectangular wire may be used as the base material of the wire of the ultrasonic transducer array.

The end surfaces of both ends of the wire of the ultrasonic transducer array may not be coated with the different metal.
The wire manufacturing method of the present invention includes a plurality of ultrasonic transducers arranged in succession and a plurality of signal lines electrically connected to the plurality of ultrasonic transducers, respectively. The ultrasonic transducer corresponding to the signal line through which the signal flows transmits ultrasonic waves, and the signal is transmitted to the signal line corresponding to the ultrasonic transducer that received the ultrasonic wave among the plurality of ultrasonic transducers. In the flowing ultrasonic transducer array, a method of manufacturing a wire provided between the ultrasonic transducer and the signal line to electrically connect the ultrasonic transducer and the signal line, the method being wet The wire is configured by coating the entire base material with a different metal different from the metal serving as the base material of the wire by plating.

In addition, the wet plating in the wire manufacturing method may be an electrolytic plating method or an electroless plating method.
Moreover, in the manufacturing method of the said wire, the said base material may be wound around the some rod provided in the fixing jig, and the said base material may be wet-plated.

  According to the present invention, the ultrasonic vibrator and the signal line are electrically connected through the wire by melting the dissimilar metal having a predetermined thickness coated on the base material of the wire. The child and each signal line can be connected by a predetermined amount of different metal. As a result, it is possible to prevent the occurrence of bridging in the wiring portion of all the wires, so even if the ultrasonic transducers are arranged at a narrow pitch, the ultrasonic transducers and the signal lines are connected via the wires. The wiring work when connecting can be facilitated.

Hereinafter, embodiments of the present invention will be described with reference to the drawings.
FIG. 1 is a diagram showing a cross section of an ultrasonic transducer array according to an embodiment of the present invention. In addition, the same code | symbol is attached | subjected to the same structure as the structure shown to FIG. 7A and 7B.

An ultrasonic transducer array 10 shown in FIG. 1 is a radial ultrasonic transducer array, and is mounted on, for example, an ultrasonic endoscope apparatus.
The ultrasonic transducer array 10 includes a piezoelectric element 61, an electrode 62, a first acoustic matching layer 63, a second acoustic matching layer 64, a conductor 66, a substrate 67, and a backing material 75. Configured. A plurality of ultrasonic transducers are configured by providing a plurality of grooves in common in the piezoelectric element 61, the electrode 62, the first acoustic matching layer 63, the second acoustic matching layer 64, the conductor 66, and the substrate 67. It shall be.

  The ultrasonic transducer array 10 is a tube for passing a cable 12 configured by bundling signal lines 11 electrically connected to a plurality of ultrasonic transducers, through the ultrasonic transducer array 10. The structural member 13 is provided.

In addition, a substrate 14 is provided at the tip of the cylindrical structural member 13, and a plurality of pads 15 corresponding to the signal lines 11 are provided on the substrate 14.
Each pad 15 is electrically connected to a plurality of pads 16 via a wiring pattern on the substrate 14.

  The ultrasonic transducer array 10 includes a plurality of wires 17 for electrically connecting each pad 16 and each conductive layer 73 provided on each substrate 67 of each ultrasonic transducer.

  For example, when the ultrasonic transducer array 10 is configured by 192 ultrasonic transducers, 192 pads 15, pads 16, wires 17, and conductive layers 73 are prepared.

  Each signal line 11 and each pad 15 are electrically connected and fixed with a potting resin 18. Further, one end of each wire 17 is electrically connected to each pad 16 by a different metal 19 described later, and the other end of each wire 17 is also electrically connected to each conductive layer 73 by a different metal 19. ing.

  Thereby, each ultrasonic transducer | vibrator and each signal line are electrically connected through the pad 15, the pad 16, the wire 17, the conductive layer 73, the conductor 66, and one electrode 62, respectively.

  Further, the inner side surface 20 of the cylindrical structural member 13 is plated with a conductive metal, and is connected by a solder wire 22 and a GND wire 21 extending through the cable 12 to the cylindrical structural member 13. . The outer side surface 23 of the cylindrical structural member 13 is also plated with a conductive metal, extends through the cable 12 to the cylindrical structural member 13, and has a hole on the side surface of the cylindrical structural member 13. 24 is connected to a GND line 25 that is passed through 24 by solder 22. The other electrode 62 is electrically connected to the outer side surface 23 of the cylindrical structural member 13.

  The characteristic feature of the ultrasonic transducer array 10 is that a different kind of conductive metal 19 different from the metal used as the base material of the wire 17 is coated on the entire base material with a predetermined thickness, whereby each wire 17 is formed. Each ultrasonic transducer is electrically connected to each signal line 11 through each wire 17 by melting different types of metals at both ends of each wire 17 using a soldering iron or the like. It is a point.

FIG. 2A is a diagram illustrating an example of the wire 17. Moreover, FIG. 2B is a figure which shows the A1-A2 cross section of the wire 17 shown to FIG. 2A.
As shown in FIGS. 2A and 2B, the conductor wire that is the base material 26 of the wire 17 is, for example, a so-called rectangular wire formed in a plate shape having a width W of 0.1 mm and a thickness H1 of 0.025 mm. As the material of the base material 26, for example, a highly conductive metal such as copper or silver can be considered. The shape of the base material 26 is not limited to a flat wire such as a round wire, but when the flat wire base material 26 is used, the pad 16 and the wire 17 are compared with the case where the round wire base material 26 is used. Since both the contact area between the wire 17 and the conductive layer 73 can be increased, the pad 16 and the wire 17 and the wire 17 and the conductive layer 73 can be connected more reliably. The reliability of the wiring portion can be improved. Further, when the flat wire base material 26 is used, a necessary allowable current can be obtained with a minimum necessary cross-sectional area, which is suitable for reducing the diameter of the wire 17 and fine wiring.

  Further, as shown in FIG. 2B, the outer periphery of the base material 26 is coated with a dissimilar metal 19 having a substantially uniform thickness H2 (for example, a thickness of 0.005 mm) over the entire length of the base material 26. In addition, the dissimilar metal 19 can consider the metal which has lead, tin, bismuth, etc. as a main component, for example. Further, it is desirable that the thickness of the dissimilar metal 19 is such that it does not bridge with the adjacent wire 17 when the dissimilar metal 19 is melted with a soldering iron or the like.

  As described above, the wire 17 is formed by coating the base material 26 with the dissimilar metal 19 having a predetermined thickness. Therefore, each ultrasonic transducer and each signal line 11 are respectively connected by a predetermined amount of the dissimilar metal 19. Can be connected.

  Thereby, since it is possible to prevent the occurrence of bridging in the wiring portions of all the wires 17, even if the ultrasonic transducers of the ultrasonic transducer array 10 are arranged at a narrow pitch, the pads 16 and the wires 17, and Wiring work between the wire 17 and the conductive layer 73 can be facilitated.

  Moreover, since the dissimilar metal 19 is coated on the whole base material 26, the base material 26 can be prevented from being oxidized. Thereby, the corrosion resistance of the wire 17 can be improved, the quality of the ultrasonic transducer array 10 can be stabilized, and the wiring workability of the wire 17 can be improved. In addition, the wire 17 formed by coating the entire base material 26 with the dissimilar metal 19 is an ultrasonic wave mounted on an ultrasonic endoscope apparatus that is frequently cleaned in the manufacturing process of the ultrasonic endoscope. This is particularly effective as a wire used in the transducer array. In addition, the wire 17 configured by coating the different material 19 on the entire base material 26 can give the wire 17 itself a certain degree of stiffness, so that the wiring workability of the wire 17 can be improved.

  Further, the end faces at both ends of the wire 17 may not be coated with the dissimilar metal 19. When the wire 17 configured as described above is connected to the pad 16 or the conductive layer 73, the end surface is covered with the melted dissimilar metal 19. Thereby, it is easy to determine whether the pad 16 and the wire 17 or the wire 17 and the conductive layer 73 are connected by the different metal 19 only by checking whether or not the different metal 19 covers the end face of the wire 17. Thus, the wiring workability of the wire 17 can be improved.

  Further, the wire 17 formed by coating the entire base material 26 with the dissimilar metal 19 does not need to be determined whether or not a pre-solder is provided for each wire 17 as in the prior art. It is possible to reduce mistakes in 17 wiring operations.

Next, a plating method for coating the base material 26 with the different metal 19 will be described.
In general, as a plating method, for example, wet plating (electrolytic plating method, electroless plating method, etc.), dry plating (vacuum deposition method, sputtering method, ion plating method, etc.), chemical vapor deposition (CVD method), or Although hot-dip plating (dipping) or the like is conceivable, as described above, when the dissimilar metal 19 having a substantially uniform thickness is coated on the entire base material 26, wet plating is preferably performed.

Hereinafter, a method of coating the base material 26 with the dissimilar metal 19 by the wet plating electrolytic plating method will be described.
FIG. 3A is a view showing a jig used for coating the base material 26 with the dissimilar metal 19. In addition, the same code | symbol is attached | subjected to the same structure as the structure shown to FIG. 2A and 2B.

  As shown in FIG. 3A, the fixing jig 30 is formed of a square plate member. The material and size of the fixing jig 30 are not particularly limited. However, when the electrolytic plating method is used, it is desirable that the plate member has no metal portion on the surface.

  In addition, metal bars 31 are provided at four corners of the fixing jig 30, respectively. In addition, the number of the metal rods 31 provided in the fixing jig 30 may be two, five or more, and is not particularly limited.

In addition, the base material 26 constituting the wire 17 is wound around the four metal rods 31 at a predetermined interval.
As described above, the base material 26 is wound around the metal rod 31, so that the base material 26 can be coated with the different metal 19 while the base material 26 is stretched.

  In the example shown in FIG. 3A, one base material 26 is wound around four metal rods 31, but a plurality of base materials 26 are spaced apart from each other by four metal rods 31. It may be wound.

  FIG. 3B is a diagram illustrating an example of a wet plating electrolytic plating method. In addition, the same code | symbol is attached | subjected to the same structure as the structure shown to FIG. 3A. In addition, it is assumed that a plating solution 33 is placed in the plating tank 32 in advance.

First, the base material 26 and the electrode plate 34 wound around the metal rod 31 are placed in the plating solution 33.
Next, the electrode plate 34 is connected to the positive electrode of the power source 35 for a predetermined time, and the terminal 36 provided at the tip of a certain metal rod 31 is connected to the negative electrode of the power source 35 outside the plating solution 33. It is assumed that a stirring device 37 is provided at the bottom of the plating tank 32 and the plating solution 33 is stirred.

  For example, the composition of the metal component of the plating solution 33 is 87% to 92% tin (the remainder is lead), the electrode plate 34 made of 85% tin is used, the current value is lowered, and the voltage value is 1V. When the substrate 26 is slowly plated, 85% of the tin is coated on the substrate 26.

  Further, for example, the composition of the metal component of the plating solution 33 is 87% to 92% tin (the remainder is lead), and the electrode plate 34 composed of 85% tin is used. Is plated on the substrate 26 with 87% to 92% tin.

  In addition, the dissimilar metal 19 may be coated on the substrate 26 in a lead-free manner using the plating method shown in FIG. 3B. For example, the substrate 26 may be coated with 100% tin or tin-copper dissimilar metal 19.

Then, the base material 26 coated with the dissimilar metal 19 is cut out from the metal rod 31 to form the wire 17 as shown in FIGS. 2A and 2B.
Thus, as a plating method for coating the base material 26 with the dissimilar metal 19, it is possible to coat the dissimilar metal 19 having a substantially uniform thickness over the entire base material 26 by using an electroplating method of wet plating. it can. Moreover, the thickness of the dissimilar metal 19 can be controlled to a substantially predetermined thickness by adjusting the metal component of the plating solution 33, the electrolysis time, and the like.

  Thereby, the thickness of the dissimilar metal 19 can be set to a thickness that does not bridge with the adjacent wire 17 when the dissimilar metal 19 is melted with a soldering iron or the like. Even when the ultrasonic transducers are arranged at a narrow pitch as in the case of the ultrasonic transducers in the mounted ultrasonic transducer array, the occurrence of bridges is prevented in the wiring portions of all the wires 17. Therefore, the wiring work of the wire 17 when the ultrasonic transducer and the signal line 11 are electrically connected via the wire 17 can be facilitated.

  In the above embodiment, the base material 26 is coated with the dissimilar metal 19 by an electroplating method of wet plating. However, the dissimilar metal 19 may be coated on the base material 26 by an electroless plating method of wet plating. . As described above, when the base material 26 is coated with the different metal 19 by the electroless plating method of wet plating, the metal component of the plating solution (for example, palladium) or the time during which the base material 26 is put in the plating solution is adjusted. By doing so, the thickness of the dissimilar metal 19 can be controlled to a substantially predetermined thickness.

  As described above, even when the base material 26 is coated with the dissimilar metal 19 by the electroless plating method of wet plating, the dissimilar metal 19 having a substantially uniform thickness can be coated on the entire base material 26, and the dissimilar metal can be coated. The thickness of 19 can be controlled to a substantially predetermined thickness.

It is a figure showing a section of an ultrasonic transducer array of an embodiment of the present invention. It is a figure which shows an example of a wire. It is a figure which shows the cross section of a wire. It is a figure which shows an example of the jig | tool used when plating a wire. It is a figure which shows an example of the plating method of a wire. It is a figure which shows the existing ultrasonic endoscope apparatus. It is an enlarged view of a front-end | tip part. It is a figure which shows an example of an ultrasonic transducer | vibrator array. It is a figure which shows a mode that a cylindrical structure member is assembled | attached to a radial type ultrasonic transducer | vibrator array. It is a figure which shows the radial type ultrasonic transducer | vibrator array with which the cylindrical structural member was assembled | attached. It is a figure which shows the radial type ultrasonic transducer | vibrator array with which the cylindrical structural member was assembled | attached.

Explanation of symbols

DESCRIPTION OF SYMBOLS 10 Ultrasonic transducer array 11 Signal line 12 Cable 13 Tubular structure member 14 Substrate 15 Pad 16 Pad 17 Wire 18 Potting resin 19 Dissimilar metal 20 Internal side surface 21 GND line 22 Solder 23 External side surface 24 Hole 25 GND line 26 Base material 30 Fixing jig 31 Metal rod 32 Plating tank 33 Plating solution 34 Electrode plate 35 Power source 36 Terminal 37 Stirrer 61 Piezoelectric element 62 Electrode 63 First acoustic matching layer 64 Second acoustic matching layer 65 Conductive resin 66 Conductor 67 Substrate 75 Backing material

Claims (10)

A plurality of ultrasonic transducers arranged in series and a plurality of signal lines electrically connected to each of the plurality of ultrasonic transducers, and corresponding to a signal line through which a signal flows among the plurality of signal transducers An ultrasonic transducer array in which the ultrasonic transducer transmits an ultrasonic wave and a signal flows through the signal line corresponding to the ultrasonic transducer that has received the ultrasonic wave among the plurality of ultrasonic transducers,
A plurality of wires respectively provided between the plurality of ultrasonic transducers and the plurality of signal lines in order to electrically connect the plurality of ultrasonic transducers and the plurality of signal lines, respectively.
Each of the plurality of wires is configured by coating the entire base material with a predetermined thickness of a different type of conductive metal different from the metal serving as the base material of the wire, and the different types of wires at both ends of the wire. Electrically connecting the plurality of ultrasonic transducers and the plurality of signal lines by melting the metal,
An ultrasonic transducer array characterized by that. The ultrasonic transducer array according to claim 1,
The said wire is comprised when the said dissimilar metal of the thickness which does not bridge with the said adjacent wire is coated on the whole said base material, when the said dissimilar metal in the both ends of the said wire is melted An ultrasonic transducer array. The ultrasonic transducer array according to claim 1,
The base material is made of copper or silver,
The ultrasonic transducer array, wherein the dissimilar metal is made of a metal mainly composed of lead, tin, or bismuth. The ultrasonic transducer array according to claim 1,
2. The ultrasonic transducer array according to claim 1, wherein the wire is formed by coating the dissimilar metal on the entire substrate by wet plating. The ultrasonic transducer array according to claim 1,
The ultrasonic transducer array, wherein the base material is not coated with an insulating film. The ultrasonic transducer array according to claim 1,
The ultrasonic transducer array, wherein the substrate is a rectangular wire. The ultrasonic transducer array according to claim 1,
The ultrasonic transducer array according to claim 1, wherein end surfaces of both ends of the wire are not coated with the dissimilar metal. A plurality of ultrasonic transducers arranged in series and a plurality of signal lines electrically connected to each of the plurality of ultrasonic transducers, and corresponding to a signal line through which a signal flows among the plurality of signal transducers In the ultrasonic transducer array in which the ultrasonic transducer transmits an ultrasonic wave and a signal flows through the signal line corresponding to the ultrasonic transducer that has received the ultrasonic wave among the plurality of ultrasonic transducers, A method of manufacturing a wire provided between the ultrasonic transducer and the signal line in order to electrically connect the ultrasonic transducer and the signal line,
A method for producing a wire, comprising forming the wire by coating the entire base material with a different metal different from a metal serving as a base material of the wire by wet plating. It is a manufacturing method of the wire of Claim 8, Comprising:
The method of manufacturing a wire, wherein the wet plating is an electrolytic plating method or an electroless plating method. It is a manufacturing method of the wire of Claim 8, Comprising:
A method of manufacturing a wire, wherein the substrate is wound around a plurality of rods provided on a fixing jig and the substrate is wet-plated.