JP2006108909A - Seating for electron device - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a seating for electron devices for increasing junction strength with a printed circuit board. <P>SOLUTION: The seating for electron devices comprises a seating body 21 made of an electrical insulating member, and a metal terminal 23 in the seating body 21 made of a conductive member is electrically connected to a lead wire 12 in the electron device 10 attached to the seating body 21. In the seating for electron devices, a circuit pattern is electrically connected to the lead wire 12 for surface-mounting onto the printed circuit board 30, by soldering one portion of the metal terminal 23 exposed from the seating body 21 to the circuit pattern of the printed circuit board 30. The metal terminal 23 projects from the sidewall of the seating body 21 while the metal terminal 23 is placed side by side with the circuit pattern, and has a plane 23b formed so that the bottom surface of a projecting place and that exposed from the bottom surface of the seating body 21 become a continuous plane. The projecting place at the plane 23b in the metal terminal 23 is soldered to the circuit pattern. <P>COPYRIGHT: (C)2006,JPO&NCIPI

Description

  The present invention relates to a pedestal for electronic elements, and more specifically, a pedestal body made of an electrically insulating member, and electrically connected to a lead wire of an electronic element mounted on the pedestal body and exposed from the pedestal body. And a metal terminal, wherein the metal terminal is electrically connected to the circuit pattern of the printed circuit board by soldering and is mounted on the printed circuit board.

  Electronic devices use piezoelectric elements, particularly inexpensive and high-performance crystal elements such as crystal oscillators, as a reference for frequency and time. When the electronic element is a crystal resonator, for example, a pair of lead wires is implanted in the base member, and a crystal piece formed in a predetermined shape is held at the tip of the lead wire. The base is covered with a metal cover, soldered at the outer peripheral edge of the base, resistance welded, etc., and hermetically sealed.

  In this way, since the container has conductivity, when the lead wire led out from the base member is directly connected to the circuit pattern on the surface of the printed board, the circuit pattern is short-circuited by the metallic container. There was a possibility of an accident. Therefore, surface mounting is performed by placing the base of the crystal resonator on a pedestal made of an insulating material and soldering the bottom surface of the pedestal to the circuit pattern of the printed circuit board.

In addition, as a conventional electronic component for surface mounting, a technical idea that can be securely fixed to a printed circuit board or the like is disclosed. The electronic component includes a pedestal main body made of an electrically insulating material, an electronic element mounted on the pedestal main body, and a metal terminal that is electrically connected to the lead-out portion of the electronic element and bent toward the pedestal main body. The base body is provided with a groove corresponding to the metal terminal to be bent and having a width larger than the width of the metal terminal by a predetermined dimension. Therefore, when soldering a metal terminal to the surface of a printed circuit board or the like, the solder rises via capillary action along the gap formed between the metal terminal and the groove so as to obtain a reliable bonding state I have done it.
JP-A-6-85146

  As in the above-described electronic component, the fixing strength between the lead-out portion and the metal terminal is improved. However, the metal terminal in the above-described electronic component is bent on the pedestal main body side and provided on the pedestal main body. If a fine crack occurs in the bent part, an oxide film is formed in that part, and when the metal terminal is soldered to the circuit pattern of the printed board, the solder is repelled and the base body and the printed board are joined. There was a problem that the strength was lowered. Therefore, even if the solder wettability of the metal terminal is improved, it is difficult to improve the bonding strength between the base body and the printed board.

  Therefore, in view of the above-described problems, an object of the present invention is to provide an electronic element base that can improve the bonding strength with a printed circuit board.

  In order to solve the above-mentioned problems, the electronic element pedestal according to claim 1, which is made according to the present invention, is a pedestal body made of an electrically insulating member, and an electronic element lead wire that is provided on the pedestal body and is attached to the pedestal body. A metal terminal made of a conductive member electrically connected to the circuit board, and soldering a part of the metal terminal exposed from the pedestal body to a circuit pattern on a printed circuit board. In the electronic device pedestal that is electrically connected to the printed circuit board and is electrically connected, the metal terminal protrudes from the side wall of the pedestal main body so as to be juxtaposed with the circuit pattern, and the bottom surface of the protruding protruding portion And the bottom surface exposed from the bottom surface of the pedestal body has a flat plate portion formed so as to be a continuous plane, and the protruding portion of the flat plate portion of the metal terminal is soldered to the circuit pattern. Characterized in that way the.

  According to the electronic element pedestal of the present invention described in claim 1, the pedestal main body projects from the side wall of the pedestal main body so as to be provided side by side with the circuit pattern of the printed circuit board. A flat plate portion formed so that the exposed bottom surface is a continuous plane is formed on the metal terminal. When the electronic element is attached to the pedestal body, the lead wire of the electronic element is electrically connected to the metal terminal. An electronic element base is arranged on the printed circuit board so that the protruding flat portion of the metal terminal matches the circuit pattern of the printed circuit board, and the flat plate portion is soldered to the circuit pattern so that the electronic element base is placed on the surface of the printed circuit board. Implemented.

  In order to solve the above-mentioned problem, the invention according to claim 2 is the electronic element pedestal according to claim 1, wherein the flat portion of the metal terminal is provided so as to protrude from the bottom surface of the pedestal body. It is characterized by being.

  According to the electronic element pedestal of the present invention described in claim 2, the flat portion of the metal terminal is provided on the pedestal main body so as to protrude from the bottom surface of the pedestal main body and from the side surface of the pedestal main body. The flat plate portion protruding from the base body is soldered to the circuit pattern, and the electronic element base is mounted on the surface of the printed board.

  According to a third aspect of the present invention, there is provided an electronic element base according to the first or second aspect, wherein the surface of at least a part of the end surface of the flat plate portion protruding from the side surface of the base body is provided. Is covered with a plating film.

  According to the electronic element pedestal of the present invention described in claim 3, the metal terminal has a plating film formed on at least a part of the end face of the flat plate portion, and the end face protrudes from the side face of the pedestal main body. Metal terminals are provided on the pedestal body.

  As described above, according to the electronic element base of the present invention described in claim 1, the flat plate portion formed on the metal terminal is exposed from the bottom surface of the base body and protrudes from the side surface of the base body. Since the metal terminal is provided on the base body and the protruding part of the flat plate part is soldered to the circuit pattern of the printed circuit board, the metal terminal to be soldered to the printed circuit board has no bent part. Since the occurrence of cracks can be prevented, the solder can be surely wetted on the flat portion of the metal terminal, and the bonding strength with the printed circuit board can be improved.

  According to the invention described in claim 2, in addition to the effect of the invention described in claim 1, the metal terminal is provided on the base body so that the flat portion of the metal terminal protrudes from the bottom surface of the base body. As a result, the number of joints where the metal terminal is joined by the circuit pattern and the solder can be increased, so that the joint strength of the metal terminal can be further improved.

  According to the invention described in claim 3, in addition to the effect of the invention described in claim 1 or 2, the metal terminal is formed with a plating film on at least a part of the end face of the flat plate portion. Even when the end face of the flat plate part is cut, the solder can be reliably wetted from the end face, so that the solder wettability can be improved and the bonding strength with the printed circuit board is further improved. Can be made.

  Hereinafter, an embodiment of an electronic component using an electronic element pedestal according to the present invention will be described with reference to the drawings of FIGS.

  Here, FIG. 1 is a diagram for explaining a schematic configuration of the electronic element pedestal of the present invention, FIG. 2 is a plan view of the electronic element pedestal of FIG. 1, and FIG. 3 is a straight line A of FIG. FIG. 4 is a cross-sectional view showing a cross-section in the arrow direction passing through -A, FIG. 4 is a view for explaining an example of manufacturing a metal terminal, and FIG. 5 is an enlarged view of an end surface of a portion B in FIG. .

  As shown in FIGS. 1 to 3, the electronic component 1 includes a crystal resonator 10 that is an electronic element, and an electronic element base 20 of the present invention on which the crystal resonator 10 is mounted. As is well known, the crystal resonator 10 has a pair of lead wires 12 implanted in the base member 11 and holds a crystal piece formed in a predetermined shape at the tip of the lead wire 12. The base member 11 is covered with a metal cover 13, soldered at the outer peripheral edge of the base member 11, and subjected to resistance welding or the like to be hermetically sealed.

  The electronic element pedestal 20 has a pair of penetrations into which a pedestal main body 11 formed of an electrically insulating member in a substantially rectangular flat plate shape and a lead wire 12 of the crystal resonator 10 attached to the pedestal main body 11 are inserted. A hole 22 and a metal terminal 23 that is electrically connected to the lead wire 12 and embedded in the pedestal main body 11 so as to be partially exposed from the pedestal main body 11 are provided.

  The metal terminal 23 includes a connecting portion 23a that is electrically connected to the lead wire 12 of the crystal resonator 10 that is mounted on the pedestal main body 21, a flat plate portion 23b that is soldered to the circuit pattern of the printed circuit board 30, and a connecting portion 23a. And a bent portion 23c interposed between the flat plate portion 23b and the flat plate portion 23b. A plating film made of, for example, Sn is formed on the surface of the metal terminal 23 in order to improve solder wettability.

  The connecting portion 23a has an insertion hole 23a1 for inserting the lead wire 12 of the crystal resonator 10 in the vicinity of the center thereof. The insertion hole 23a1 is formed in a taper shape with respect to the insertion direction of the lead wire 12 of the crystal unit 10. When the lead wire 12 is inserted into the insertion hole 23a1, it is electrically connected by soldering.

  The flat plate portion 23b protrudes from the side wall 25 of the pedestal main body 21 so as to be provided side by side with the circuit pattern, and the bottom surface of the protruded protruding portion and the bottom surface exposed from the bottom surface 24 of the pedestal main body 21 become a continuous plane. And is embedded in the base body 21 by insert molding or the like. Since the protruding portion of the flat plate portion 23b of the metal terminal 23 is soldered to the circuit pattern, the metal terminal 23 to be soldered to the printed circuit board 30 has no bent portion and prevents the occurrence of cracks. I made it.

  In the best mode, when the length in the longitudinal direction of the flat plate portion 23b is 11 mm, the end portion 23b1 of the flat plate portion 23b is formed so as to protrude by 0.2 mm. The length is not limited, and the length can be variously changed according to the specification of the product.

  Further, by providing the metal terminal 23 on the base body 21 so that the flat plate portion 23b of the metal terminal 23 protrudes from the bottom surface 24 of the base body 21, the metal terminal 23 is joined to the circuit pattern by solder. The number of locations is increased, and the bonding strength between the metal terminal 23 and the printed board 30 is improved.

  Here, an example of a manufacturing method of the metal terminal 23 will be described. In the present best mode, as shown in FIG. 4, a plurality of regions continuously provided from the frame portion 41 of the plate member 40 are punched out by pressing or the like from the plate member 40 made of a metal member such as phosphor bronze. Metal terminals 23 are formed. A circular hole 43 is formed in the continuous portion 42 between the frame 41 and the metal terminal 23.

  The plating film is formed at a predetermined thickness on at least the surface of the metal terminal 23. Then, the metal part 23 is formed by being cut | disconnected by the connection part 42 so that the hole part 43 may be divided into about equal parts. The end surface 23b2 of the end portion 23b1 of the flat plate portion 23b in the metal terminal 23 formed in this way is a part of the inner wall of the hole portion 43 as shown in FIG. It has a configuration having a plating surface 23b21 and a cut surface 23b22 sandwiching the plating surface 23b21 and having no plating film formed thereon.

  In the best mode, the case where the flat plate portion 23b of the metal terminal 23 is cut and formed from the frame portion 41 of the plate member 40 will be described. However, the present invention is not limited to this, and the end face after cutting is described. When the plating film is formed on 23b2 or is manufactured without being cut, various forms such as forming a plating film on the entire end face 23b2 can be used.

  Next, assembly of the electronic element base 20 having the above-described configuration will be described. First, while inserting the lead wire 12 of the crystal resonator 10 into the insertion hole 23a1 of the metal terminal 23 of the pedestal main body 21, the crystal resonator 10 is mounted on the pedestal main body 21 and electrically connected by soldering or the like. The electronic element pedestal 20 is configured such that the protruding flat plate portion 23b of the metal terminal 20 matches the circuit pattern of the printed circuit board 30, and the electronic device pedestal 20 is arranged on the printed circuit board 30. By soldering to the pattern, the solder wets the flat plate portion 23 b of the metal terminal 23 protruding from the side surface 25 of the pedestal main body 21, and the electronic element pedestal 20 is mounted on the surface of the printed board 30. As a result, the lead wire 12 of the crystal unit 10 and the printed board 30 are electrically connected via the metal terminal 23.

  As described above, according to the electronic element pedestal 20 of the present invention, the flat flat plate portion 23 b formed on the metal terminal 23 is exposed from the bottom surface 24 of the base body 21 and from the side surface 25 of the base body 21. Since the metal terminal 23 is provided on the base body 21 so as to protrude, and the protruding portion of the flat plate portion 23b is soldered to the circuit pattern of the printed circuit board 30, the metal terminal 23 to be soldered to the printed circuit board 30 is attached. Since no bent portion exists and cracks can be prevented, solder can be surely wetted on the flat plate portion 23b of the metal terminal 23, and the bonding strength with the printed circuit board 30 can be improved. Can do.

  Further, since the metal terminal 23 is provided on the base body 21 so that the flat plate portion 23b of the metal terminal 23 protrudes from the bottom surface 24 of the base body 21, the metal terminal 23 is soldered to the circuit pattern of the printed circuit board 30. As a result, it is possible to increase the number of joints that are joined together, so that the joint strength of the metal terminal 23 can be further improved.

  Further, since the metal terminal 23 is formed with a plating film on at least a part of the end surface 23b2 of the flat plate portion 23b, even when the end surface 23b2 is a cut surface, the solder is surely wetted from the end surface 23b2. Therefore, the solder wettability can be improved, and the bonding strength with the printed circuit board 30 can be further improved.

It is a figure for demonstrating schematic structure of the base for electronic devices of this invention. It is a surface view of the base for electronic devices of FIG. It is sectional drawing which shows the cross section of the arrow direction which passes along the straight line AA of FIG. It is a figure for demonstrating an example of manufacture of a metal terminal. It is the enlarged view to which the end surface of the part B of FIG. 3 was expanded.

Explanation of symbols

1 Electronic component 10 Crystal resonator (electronic element)
12 Lead wire 20 Base for electronic element 21 Base body 23 Metal terminal 23b Flat plate portion 30 Printed circuit board

Claims (3)

A pedestal body made of an electrically insulating member; and a metal terminal made of a conductive member provided on the pedestal body and electrically connected to a lead wire of an electronic element mounted on the pedestal body. In a base for an electronic element that is surface-mounted on the printed circuit board by electrically connecting the circuit pattern and the lead wire by soldering a part of the metal terminal exposed from the printed circuit board,
The metal terminal protrudes from a side wall of the pedestal main body so as to be provided side by side with the circuit pattern, and is formed so that a bottom surface of the protruding protruding portion and a bottom surface exposed from the bottom surface of the pedestal main body are a continuous plane. Having a flat plate part,
The projecting portion of the flat plate portion of the metal terminal is soldered to the circuit pattern.   The pedestal for electronic elements according to claim 1, wherein the flat portion of the metal terminal is provided so as to protrude from the bottom surface of the pedestal main body.   The base for an electronic element according to claim 1 or 2, wherein at least a part of the surface of the end surface of the flat plate portion protruding from the side surface of the base body is covered with a plating film.

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