JP2006108363A - Housing of light emitting device - Google Patents

Housing of light emitting device Download PDF

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Publication number
JP2006108363A
JP2006108363A JP2004292569A JP2004292569A JP2006108363A JP 2006108363 A JP2006108363 A JP 2006108363A JP 2004292569 A JP2004292569 A JP 2004292569A JP 2004292569 A JP2004292569 A JP 2004292569A JP 2006108363 A JP2006108363 A JP 2006108363A
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Prior art keywords
opening
light emitting
transparent resin
guide
emitting element
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JP2004292569A
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Japanese (ja)
Inventor
Junichi Kinoshita
順一 木下
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Toshiba Lighting and Technology Corp
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Harison Toshiba Lighting Corp
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Priority to JP2004292569A priority Critical patent/JP2006108363A/en
Publication of JP2006108363A publication Critical patent/JP2006108363A/en
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    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42Wire connectors; Manufacturing methods related thereto
    • H01L2224/47Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805Shape
    • H01L2224/4809Loop shape
    • H01L2224/48091Arched

Abstract

<P>PROBLEM TO BE SOLVED: To suppress the manufacturing cost of the housing of a light emitting device and realize wide-angle light from the light emitting device. <P>SOLUTION: The housing 10 of the light emitting device has a plurality of guides 24 provided with gaps 25 around an opening 21 which are directed outwardly from the opening 21 and fixed in a state wherein their sides are inclined in the direction of the center of the opening 21. The guides 24 consist of a plurality of support members 22 whose one ends are fixed to the circumference of the opening 21 and locking members 23 for fixing the other ends of the support members. The gap 25 defined by the spacing between the support members 22 is made to have such an area that a transparent resin 30 in the liquid phase before curing applied there does not exude externally due to the surface tension thereof. Consequently, the transparent resin 30 can be projected externally from the housing 20 by one time injection thereof without adding the manufacturing process for processing the transparent resin 30, and the light from the light emitting device 1 disposed on the bottom of the opening 21 can be radiated upward from the opening and can be radiated from the side surface of the guide by using the transparent resin as a medium. <P>COPYRIGHT: (C)2006,JPO&NCIPI

Description

本発明は、表面実装型の発光素子の外囲器に関する。   The present invention relates to an envelope of a surface mount type light emitting element.

発光ダイオード(以下LEDと呼ぶ)はInGaAlPやGaN等の化合物半導体ウエハ上にPN接合を形成し、これに順方向電流を通じて可視光又は近赤外光の発光を得る発光素子であり、近年、表示をはじめ、通信、計測、制御等に広く応用されている。   A light-emitting diode (hereinafter referred to as LED) is a light-emitting element that forms a PN junction on a compound semiconductor wafer such as InGaAlP or GaN, and emits visible or near-infrared light through a forward current. It is widely applied to communication, measurement, control, etc.

一般に、LED等の発光素子にはパッケージ(以下外囲器と呼ぶ)が必要であるが、その一例として従来から図7の斜視図に示すような構成の表面実装型の発光素子の外囲器がある(例えば、特許文献1参照)。   Generally, a package (hereinafter referred to as an envelope) is required for a light emitting element such as an LED. As an example, an envelope of a surface mount type light emitting element having a configuration as shown in the perspective view of FIG. (For example, refer to Patent Document 1).

同図の外囲器50は、開口部21を備えた筐体20と、開口部21の底面に配置された発光素子1と、開口部21の底から上部まで充填された透明樹脂30と、を備える。透明樹脂30は液体の状態でポッティングし、その後、加温して硬化させる。液相での粘性は高いが、重力のため透明樹脂30の表面はほぼ平坦になる。また、開口部21の底面には、2極あるリードフレームの一方の極11上に、発光素子1を銀ペースト等の導電材料でマウントする。さらに、発光素子1の上側の電極からは、リードフレームの他方の極12上に金製のワイヤ3が張られている。   The envelope 50 in the figure includes a housing 20 having an opening 21, the light emitting element 1 disposed on the bottom surface of the opening 21, a transparent resin 30 filled from the bottom to the top of the opening 21, Is provided. The transparent resin 30 is potted in a liquid state, and then heated and cured. Although the viscosity in the liquid phase is high, the surface of the transparent resin 30 becomes almost flat due to gravity. On the bottom surface of the opening 21, the light emitting element 1 is mounted on one pole 11 of a lead frame having two poles with a conductive material such as silver paste. Further, a gold wire 3 is stretched from the upper electrode of the light emitting element 1 on the other pole 12 of the lead frame.

ここでは、発光素子1としてLEDが使用され、透明樹脂30にはエポキシ樹脂が使用される。筐体20には熱可塑性のPPA(ポリフタルアミド)樹脂が使用される。図7に示されるような筐体20は、加熱により流動化したPPA樹脂を冷たい金型内に射出して成型される(射出成形法)。   Here, an LED is used as the light emitting element 1, and an epoxy resin is used as the transparent resin 30. The casing 20 is made of thermoplastic PPA (polyphthalamide) resin. The casing 20 as shown in FIG. 7 is molded by injecting PPA resin fluidized by heating into a cold mold (injection molding method).

一方で、LED等の発光素子を、車載用LEDランプとして自動車のメータクラスタ等へ応用する際には、1個の外囲器でなるべく広角に発光素子を発光させるために、拡散板によって広範囲に渡って対象物を均一に照明する必要がある。   On the other hand, when a light emitting element such as an LED is applied to an automobile meter cluster or the like as an in-vehicle LED lamp, in order to cause the light emitting element to emit light at a wide angle as much as possible with a single envelope, it is widely used by a diffusion plate. It is necessary to illuminate the object evenly across.

図8は、図7に示した発光素子の空間放射パターンを示している。同図によれば、エポキシ樹脂の屈折率が約1.5であるので、空気との屈折率差により上方への放射が優位になる。これにより、発光素子の光は、放射角θの半値全幅が約110度となる様な指向特性を持つ。
特開2003−163378号公報
FIG. 8 shows a spatial radiation pattern of the light emitting device shown in FIG. According to the figure, since the refractive index of the epoxy resin is about 1.5, upward radiation is dominant due to the difference in refractive index with air. Thereby, the light of the light emitting element has directivity characteristics such that the full width at half maximum of the radiation angle θ is about 110 degrees.
JP 2003-163378 A

しかしながら、図7に示したような従来の表面実装型発光素子の外囲器の構成においては、透明樹脂30は液相において表面が平坦化するため、図8に示したように光の放射角の広がりには限界がある。これに対し、光学的手法を用いて硬化後の透明樹脂の表面を加工する、又は透明樹脂の表面に適当な盛り上がり形状を有する透明樹脂を貼り付けるなどした場合、光の広角化を実現することができるが、そのためには別の製造工程が必要となり、製造コストが上昇してしまうという問題があった。   However, in the configuration of the envelope of the conventional surface mount type light emitting element as shown in FIG. 7, the surface of the transparent resin 30 is flattened in the liquid phase, so that the radiation angle of light as shown in FIG. There is a limit to the spread of. On the other hand, when the surface of the cured transparent resin is processed using an optical method, or when a transparent resin having an appropriate raised shape is attached to the surface of the transparent resin, a wide angle of light is realized. However, there is a problem that a separate manufacturing process is required for this purpose, resulting in an increase in manufacturing cost.

本発明はこのような問題点に鑑み、発光素子の外囲器について製造コストの上昇を抑制し、且つ発光素子の光の広角化を実現する。   In view of such problems, the present invention suppresses an increase in manufacturing cost of the envelope of the light emitting element and realizes a wide angle of light of the light emitting element.

第1の本発明に係る発光素子の外囲器は、開口部を備えた筐体と、開口部の底面に配置された発光素子と、開口部の周囲に開口部の外へ向い、且つ側部が開口部の中心方向に傾斜した状態で固定された複数の間隙を備えたガイドと、開口部の底から前記ガイドの上部まで充填された透明樹脂と、を有し、ガイドに備えられた間隙は、透明樹脂の硬化前の液相において、表面張力により透明樹脂が外部に滲出しない範囲にあることを特徴とする。   The envelope of the light-emitting element according to the first aspect of the present invention includes a housing having an opening, a light-emitting element disposed on the bottom surface of the opening, the periphery of the opening facing the outside of the opening, and the side A guide having a plurality of gaps fixed in a state where the portion is inclined toward the center of the opening, and a transparent resin filled from the bottom of the opening to the top of the guide, and provided in the guide The gap is characterized in that the transparent resin does not exude to the outside due to surface tension in the liquid phase before the transparent resin is cured.

本発明にあっては、発光素子の外囲器において、開口部の周囲に開口部の外へ向い、且つ側部が開口部の中心方向に傾斜した状態で固定された複数の間隙を備えたガイドを有したことで、透明樹脂を加工するための製造工程を加えることなく、一回の注入で透明樹脂を筐体外部に突出させることができ、開口部の底に配置された発光素子からの光を、透明樹脂を媒体とし、開口部の上方向及びガイドの側面からも放射させることが可能となる。   According to the present invention, the envelope of the light emitting element includes a plurality of gaps that are fixed around the periphery of the opening so as to face the outside of the opening and the side portions are inclined toward the center of the opening. By having a guide, the transparent resin can be protruded outside the housing by a single injection without adding a manufacturing process for processing the transparent resin, and from the light emitting element arranged at the bottom of the opening. This light can be emitted from the upper direction of the opening and the side surface of the guide using a transparent resin as a medium.

さらに、第1の本発明に係る発光素子の外囲器に備えられるガイドは、開口部の周囲に一端が固定された複数の支持部と、支持部の他端を固定する留め部とで構成され、ガイドに備えられる間隙は、透明樹脂の硬化前の液相において、表面張力により透明樹脂が外部に滲出しない範囲にあることが好適であり、上記間隙は支持部間の間隔で規定されることが望ましい。   Furthermore, the guide provided in the envelope of the light emitting device according to the first aspect of the present invention includes a plurality of support portions whose one ends are fixed around the opening portion, and a fastening portion that fixes the other end of the support portion. The gap provided in the guide is preferably in a range in which the transparent resin does not bleed out due to surface tension in the liquid phase before the transparent resin is cured, and the gap is defined by the interval between the support portions. It is desirable.

また、第1の本発明に係る発光素子の外囲器に備えられるガイドは、開口部の周囲に、開口径方向に一端部の幅方向を合わせた状態で当該一端部が固定された複数の支持部で構成され、ガイドに備えられる間隙は、透明樹脂の硬化前の液相において、表面張力により透明樹脂が外部に滲出しない範囲にあることが好適であり、支持部は、その一端部の幅よりも、他端部の幅のほうが短く、上記間隙は支持部間の間隔で規定されることが望ましい。   Further, the guide provided in the envelope of the light emitting element according to the first aspect of the present invention includes a plurality of guides having one end fixed to the periphery of the opening in a state where the width direction of the one end is aligned with the opening radial direction. The gap formed in the support and provided in the guide is preferably in a range where the transparent resin does not bleed out due to surface tension in the liquid phase before the transparent resin is cured. It is desirable that the width of the other end is shorter than the width, and the gap is defined by the interval between the support portions.

本発明の発光素子の外囲器によれば、製造コストの上昇を抑制し、且つ発光素子の光の広角化を実現できる。   According to the envelope of the light emitting element of the present invention, an increase in manufacturing cost can be suppressed and a wide angle of light of the light emitting element can be realized.

以下、本発明の実施の形態について、図面を用いて説明する。   Hereinafter, embodiments of the present invention will be described with reference to the drawings.

[第1の実施の形態]
図1は、第1の実施の形態に係る発光素子の外囲器の構成を示す斜視図である。同図の外囲器10は、開口部21を備えた筐体20と、開口部21の底面に配置された発光素子1と、開口部21の周囲に開口部21の外へ向い、且つ側部が開口部21の中心方向に傾斜した状態で固定された複数の間隙25a、25b、25c…(以下総称して25とする)を備えたガイド24と、開口部21の底からガイド24の上部まで充填された透明樹脂30と、を有する。ここで、ガイド24は、開口部21の周囲に一端が固定された複数の支持部22a、22b、22c…(以下総称して22とする)と支持部22の他端を固定する円環状の留め部23とで構成され、ガイド24に備えられた間隙25は支持部22間の間隔で規定される。また、開口部21の底面には、2極あるリードフレームの一方の極11上に、発光素子1を銀ペースト等の導電材料でマウントする。さらに、発光素子1の上側の電極からは、リードフレームの他方の極12上に金製のワイヤ3が張られている。ここでは、発光素子1として、LEDを使用し、筐体20には完全拡散反射に近い条件で反射する白色の熱可塑性であるPPA(ポリフタルアミド)樹脂を使用する。また、透明樹脂30には、エポキシ樹脂を使用する。
[First Embodiment]
FIG. 1 is a perspective view showing the configuration of the envelope of the light emitting element according to the first embodiment. The envelope 10 shown in FIG. 1 includes a housing 20 having an opening 21, the light emitting element 1 disposed on the bottom surface of the opening 21, and the side of the opening 21 around the opening 21. The guide 24 having a plurality of gaps 25 a, 25 b, 25 c... (Hereinafter collectively referred to as 25) fixed in a state where the portion is inclined toward the center of the opening 21, and the guide 24 from the bottom of the opening 21. Transparent resin 30 filled up to the top. Here, the guide 24 has an annular shape that fixes a plurality of support portions 22 a, 22 b, 22 c... (Hereinafter collectively referred to as 22) having one end fixed around the opening 21 and the other end of the support portion 22. The gap 25 provided in the guide 24 is defined by the interval between the support portions 22. On the bottom surface of the opening 21, the light emitting element 1 is mounted on one pole 11 of a lead frame having two poles with a conductive material such as silver paste. Further, a gold wire 3 is stretched from the upper electrode of the light emitting element 1 on the other pole 12 of the lead frame. Here, an LED is used as the light emitting element 1, and a PPA (polyphthalamide) resin that is white thermoplastic that reflects under conditions close to perfect diffuse reflection is used for the housing 20. The transparent resin 30 is an epoxy resin.

図2は、第1の実施の形態に係る発光素子の外囲器の構成を示す断面図である。図1と同一物には同一の符号を付し、すでに行った説明は省略する。同図に示すように、開口部21内へ注入された透明樹脂30は、ガイド24の上部まで達し、その上部には平坦な面が形成される。ここで、ガイドに備えられた間隙25は、支持部22間の間隔として十分小さな範囲に規定されているので、たとえ硬化前の液相であったとしても、透明樹脂30が、ガイドの側部から外部に滲出することはない。   FIG. 2 is a cross-sectional view showing the configuration of the envelope of the light emitting element according to the first embodiment. The same components as those in FIG. 1 are denoted by the same reference numerals, and the description already given is omitted. As shown in the figure, the transparent resin 30 injected into the opening 21 reaches the upper part of the guide 24, and a flat surface is formed on the upper part. Here, since the gap 25 provided in the guide is defined in a sufficiently small range as the interval between the support portions 22, even if it is a liquid phase before curing, the transparent resin 30 remains on the side portion of the guide. It does not ooze out from the outside.

図3は、第1の実施の形態に係る発光素子についての空間放射パターンである。開口部の底面に配置された発光素子から放射された光は、ガイドの上部に形成された平坦な透明樹脂30の上面から放射されるとともに、ガイドの側面からも放射されるので、発光素子は、放射角θの半値全幅が約160度となるような指向特性をもつことになり、図8の従来の表面実装型の放射パターンと比べて、発光素子の放射角の広角化が実現される。   FIG. 3 is a spatial radiation pattern for the light emitting device according to the first embodiment. The light emitted from the light emitting element disposed on the bottom surface of the opening is emitted from the upper surface of the flat transparent resin 30 formed on the upper portion of the guide and also from the side surface of the guide. Therefore, the radiation angle θ has a directional characteristic such that the full width at half maximum is about 160 degrees, and the emission angle of the light emitting element can be widened as compared with the conventional surface-mounted radiation pattern of FIG. .

したがって、第1の実施の形態によれば発光素子の外囲器について、開口部の周囲に開口部の外へ向い、且つ側部が開口部の中心方向に傾斜した状態で固定された複数の間隙を備えたガイドを設け、ガイドを、開口部の周囲に一端が固定された複数の支持部と支持部の他端を固定する留め部とで構成し、ガイドに備えた間隙を、透明樹脂の硬化前の液相において、表面張力により透明樹脂が外部に滲出しない範囲を支持部間の間隔で規定したことで、透明樹脂を加工するための製造工程を加えることなく、一回の注入で透明樹脂を筐体外部に突出させることができ、開口部の底に配置された発光素子からの光を、透明樹脂を媒体として、開口部の上方向及び、ガイドの側面から放射させることが可能となる。これにより、製造コストの上昇を抑制し、且つ発光素子の光の広角化を実現できる。   Therefore, according to the first embodiment, a plurality of envelopes of the light emitting element are fixed around the opening so as to face the outside of the opening and the side portions are inclined toward the center of the opening. A guide having a gap is provided, and the guide is composed of a plurality of support portions whose one ends are fixed around the opening and a fastening portion for fixing the other end of the support portion. In the liquid phase before curing, the range in which the transparent resin does not bleed out due to surface tension is defined by the interval between the support parts, so that a single injection can be performed without adding a manufacturing process for processing the transparent resin. Transparent resin can be projected outside the housing, and light from the light emitting element placed at the bottom of the opening can be emitted from the top of the opening and the side of the guide using the transparent resin as a medium It becomes. As a result, an increase in manufacturing cost can be suppressed and a wide angle of light of the light emitting element can be realized.

なお、上記の第1の実施の形態においては、ガイド24の支持部22の他端を固定する留め部23には円環状の部材を使用したが、これに限られるものではない。ガイド24の支持部を固定する機能を有する構成であれば、例えば留め部に多角形状の部材を使用してもよい。   In the first embodiment, an annular member is used for the fastening portion 23 that fixes the other end of the support portion 22 of the guide 24. However, the present invention is not limited to this. If it is the structure which has the function to fix the support part of the guide 24, you may use a polygon-shaped member for a fastening part, for example.

[第2の実施の形態]
図4は、第2の実施の形態に係る発光素子の外囲器の構成を示す斜視図である。同図の外囲器40は、第1の実施の形態と同様な筐体20と、発光素子1と、開口部21の周囲に開口部21の外へ向い、且つ側部が開口部21の中心方向に傾斜した状態で固定された複数の間隙26a、26b、26c…(以下総称して26とする)を備えたガイド28と、開口部21の底からガイド24の上部まで充填された透明樹脂30と、を有する。第1の実施の形態との違いは、ガイド28は開口部の周囲に、開口径方向に一端部の幅方向を合わせた状態でこの一端部が固定された複数の支持部27a、27b、27c…(以下総称して27とする)で構成されている点である。ガイド28に備えられた間隙26は支持部27間の間隔で規定される。また、ここでも同様に開口部21の底面には、2極あるリードフレームの一方の極11上に、発光素子1を銀ペースト等の導電材料でマウントする。さらに、発光素子1の上側の電極からは、リードフレームの他方の極12上に金製のワイヤ3が張られている。ここでは、発光素子1として、LEDを使用し、透明樹脂30には、エポキシ樹脂を使用する。筐体20には熱可塑性のPPA(ポリフタルアミド)樹脂を使用する。図4に示される筐体20は、加熱により流動化したPPA樹脂を冷たい金型内に射出して成型することにより支持部27と一体的に形成される。
[Second Embodiment]
FIG. 4 is a perspective view showing the configuration of the envelope of the light emitting element according to the second embodiment. The envelope 40 shown in the figure has the same housing 20 as that of the first embodiment, the light emitting element 1, the opening 21 around the opening 21, and the side of the opening 21. A guide 28 having a plurality of gaps 26 a, 26 b, 26 c... (Hereinafter collectively referred to as 26) fixed in an inclined state in the center direction, and a transparent filled from the bottom of the opening 21 to the top of the guide 24 And resin 30. The difference from the first embodiment is that the guide 28 has a plurality of support portions 27a, 27b, and 27c each having one end fixed to the periphery of the opening in a state where the width direction of the one end matches the opening radial direction. ... (hereinafter collectively referred to as 27). The gap 26 provided in the guide 28 is defined by the interval between the support portions 27. Similarly, the light emitting element 1 is mounted on the bottom surface of the opening 21 on one electrode 11 of a lead frame having two electrodes with a conductive material such as silver paste. Further, a gold wire 3 is stretched from the upper electrode of the light emitting element 1 on the other pole 12 of the lead frame. Here, an LED is used as the light emitting element 1, and an epoxy resin is used as the transparent resin 30. The casing 20 is made of thermoplastic PPA (polyphthalamide) resin. The casing 20 shown in FIG. 4 is integrally formed with the support portion 27 by injecting and molding PPA resin fluidized by heating into a cold mold.

図5は、第2の実施の形態に係る発光素子の外囲器の構成を示す断面図である。ここでも図4と同一物には同一の符号を付し、すでに行った説明は省略する。同図に示すように、開口部21内へ注入された透明樹脂30は、ガイド28の上部まで達し、その上部には平坦な面が形成される。ここで、ガイド28に備えられた間隙26は、支持部27間の間隔として十分に小さな範囲に規定されているので、たとえ硬化前の液相であったとしても、透明樹脂30が、ガイドの側部から外部に滲出することはない。   FIG. 5 is a cross-sectional view showing the configuration of the envelope of the light emitting element according to the second embodiment. Here, the same components as those in FIG. 4 are denoted by the same reference numerals, and the description already given is omitted. As shown in the figure, the transparent resin 30 injected into the opening 21 reaches the upper part of the guide 28, and a flat surface is formed on the upper part. Here, since the gap 26 provided in the guide 28 is defined in a sufficiently small range as the interval between the support portions 27, even if it is a liquid phase before curing, the transparent resin 30 is not There is no oozing out from the side.

また、本実施の形態では、図5で示したようにガイド28を構成する支持部27の一端部の幅L1よりも他端部の幅L2のほうが短い。それは、このような構成により、上記の射出成形法による筐体20の成形時において、加熱により流動化した熱可塑性の樹脂を冷たい金型内に射出して型を取った後、熱可塑性の樹脂の冷却にしたがって、支持部27を開口部21の中心側に倒れこませることで、ガイドの側部を成形することが可能となるからである。   Further, in the present embodiment, as shown in FIG. 5, the width L2 at the other end is shorter than the width L1 at the one end of the support portion 27 constituting the guide 28. With such a configuration, at the time of molding of the casing 20 by the above-described injection molding method, a thermoplastic resin fluidized by heating is injected into a cold mold to take a mold, and then the thermoplastic resin This is because the side portion of the guide can be formed by causing the support portion 27 to fall down toward the center of the opening portion 21 in accordance with the cooling.

図6は、第2の実施の形態に係る発光素子の空間放射パターンである。開口部の底面に配置された発光素子から放射された光は、ガイドの上部に形成された平坦な透明樹脂30の上面から放射されるとともに、ガイドの側部からも放射されるので、発光素子は、放射角θの半値全幅が約160度となるような指向特性を持つことになり、図8の従来の表面実装型の放射パターンと比べて、発光素子の放射角の広角化が実現されていることがわかる。   FIG. 6 shows a spatial radiation pattern of the light emitting device according to the second embodiment. The light emitted from the light emitting element arranged on the bottom surface of the opening is emitted from the upper surface of the flat transparent resin 30 formed on the upper part of the guide and also from the side part of the guide. Has a directional characteristic such that the full width at half maximum of the radiation angle θ is about 160 degrees, and compared with the conventional surface-mount radiation pattern of FIG. You can see that

第2の実施の形態によれば、発光素子の外囲器に備えたガイドについて、開口部の周囲に、開口径方向に一端部の幅方向を合わせた状態でその一端部が固定された複数の支持部で構成し、ガイドに設けた間隙を、透明樹脂の硬化前の液相において、表面張力により透明樹脂が外部に滲出しない範囲を支持部の間隔で規定したことに加え、ガイドを構成する支持部の一端部の幅よりも、他端部の幅のほうを短くした。これにより、射出成形法により筐体を成形する際に使用する金型の構造を、より単純なものにすることができ、一回の工程で加熱により流動化した熱可塑性樹脂からガイドと筐体を一体的に成形することが可能となるので、上記第1の実施の形態による効果に加えて、製造工程数の増加に伴う製造コストの上昇をより抑制することができる。   According to the second embodiment, with respect to the guide provided in the envelope of the light emitting element, a plurality of one end portions thereof are fixed around the opening portion in a state where the width direction of the one end portion is aligned with the opening radial direction. In addition to defining the range where the transparent resin does not bleed to the outside due to surface tension in the liquid phase before curing of the transparent resin, the guide is configured with the support portion. The width of the other end portion is shorter than the width of one end portion of the supporting portion. As a result, the structure of the mold used when molding the casing by the injection molding method can be made simpler, and the guide and the casing can be made from the thermoplastic resin fluidized by heating in a single process. Can be formed integrally, so that in addition to the effects of the first embodiment, an increase in manufacturing cost accompanying an increase in the number of manufacturing steps can be further suppressed.

第1の実施の形態に係る発光素子の外囲器の構成を示す断面図である。It is sectional drawing which shows the structure of the envelope of the light emitting element which concerns on 1st Embodiment. 第1の実施の形態に係る発光素子の外囲器の構成を示す斜視図である。It is a perspective view which shows the structure of the envelope of the light emitting element which concerns on 1st Embodiment. 第1の実施の形態に係る発光素子の空間放射パターンである。It is a spatial radiation pattern of the light emitting element which concerns on 1st Embodiment. 第2の実施の形態に係る発光素子の外囲器の構成を示す断面図である。It is sectional drawing which shows the structure of the envelope of the light emitting element which concerns on 2nd Embodiment. 第2の実施の形態に係る発光素子の外囲器の構成を示す斜視図である。It is a perspective view which shows the structure of the envelope of the light emitting element which concerns on 2nd Embodiment. 第2の実施の形態に係る発光素子の空間放射パターンである。It is a spatial radiation pattern of the light emitting element which concerns on 2nd Embodiment. 従来の表面実装型発光素子の外囲器の構成を示す斜視図である。It is a perspective view which shows the structure of the envelope of the conventional surface mount type light emitting element. 従来の表面実装型発光素子の外囲器における発光素子の空間放射パターンである。It is the spatial radiation pattern of the light emitting element in the envelope of the conventional surface mount type light emitting element.

符号の説明Explanation of symbols

1…発光素子,3…金ワイヤ,10…第1の実施の形態に係る発光素子の外囲器,11…リードフレームの一方の極,12…リードフレームの他方の極,20…筐体,21…外囲器の開口部,22…透明樹脂を支える支持部,23…支持部を固定する円環状の留め部,24…支持部と円環状の留め部から成るガイド,25…ガイドの間隙,26…ガイドの間隙,27…透明樹脂を支える支持部,28…複数の支持部から成るガイド,30…透明樹脂,40…第2の実施の形態に係る発光素子の外囲器,50…従来の表面実装型の発光素子の外囲器,

DESCRIPTION OF SYMBOLS 1 ... Light emitting element, 3 ... Gold wire, 10 ... The envelope of the light emitting element which concerns on 1st Embodiment, 11 ... One pole of a lead frame, 12 ... The other pole of a lead frame, 20 ... Housing | casing, DESCRIPTION OF SYMBOLS 21 ... Opening part of envelope, 22 ... Support part which supports transparent resin, 23 ... Ring-shaped fastening part which fixes support part, 24 ... Guide which consists of support part and annular-shaped fastening part, 25 ... Gap of guide , 26 ... guide gaps, 27 ... support portions for supporting the transparent resin, 28 ... guides made up of a plurality of support portions, 30 ... transparent resin, 40 ... the envelope of the light emitting device according to the second embodiment, 50 ... A conventional surface-mounted light emitting device envelope,

Claims (3)

開口部を備えた筐体と、
前記開口部の底面に配置された発光素子と、
前記開口部の周囲に前記開口部の外へ向い、且つ側部が開口部の中心方向に傾斜した状態で固定された複数の間隙を備えたガイドと、
前記開口部の底から前記ガイドの上部まで充填された透明樹脂と、
を有し、
前記ガイドに備えられた間隙は、前記透明樹脂の硬化前の液相において、表面張力により当該透明樹脂が外部に滲出しない範囲にあることを特徴とする発光素子の外囲器。
A housing with an opening;
A light emitting device disposed on a bottom surface of the opening;
A guide provided with a plurality of gaps that are fixed to the periphery of the opening in a state in which the opening is directed to the outside of the opening and the side is inclined toward the center of the opening;
A transparent resin filled from the bottom of the opening to the top of the guide;
Have
The gap provided in the guide is in a range where the transparent resin does not bleed out due to surface tension in the liquid phase before the transparent resin is cured.
前記ガイドは、前記開口部の周囲に一端が固定された複数の支持部と、
当該支持部の他端を固定する留め部と、
で構成され、
前記間隙は支持部間の間隔で規定されることを特徴とする請求項1に記載の発光素子の外囲器。
The guide has a plurality of support portions each having one end fixed around the opening;
A fastening part for fixing the other end of the support part;
Consists of
The envelope of the light emitting device according to claim 1, wherein the gap is defined by an interval between support parts.
前記ガイドは、前記開口部の周囲に、開口径方向に一端部の幅方向を合わせた状態で当該一端部が固定された複数の支持部で構成され、
当該支持部は前記一端部の幅よりも他端部の幅のほうが短く、前記間隙は支持部間の間隔で規定されることを特徴とする請求項1に記載の発光素子の外囲器。

The guide is composed of a plurality of support portions around which the one end portion is fixed in a state where the width direction of the one end portion is aligned with the opening radial direction.
2. The envelope of the light emitting device according to claim 1, wherein the support portion has a width at the other end shorter than a width at the one end, and the gap is defined by an interval between the support portions.

JP2004292569A 2004-10-05 2004-10-05 Housing of light emitting device Pending JP2006108363A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
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Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2013115368A (en) * 2011-11-30 2013-06-10 Rohm Co Ltd Led module
JP2019192778A (en) * 2018-04-25 2019-10-31 日亜化学工業株式会社 Method for manufacturing light-emitting device and light-emitting device
CN111554792A (en) * 2019-02-11 2020-08-18 陈在彦 Light emitting element package with adjusted pointing angle and light emitting device using the same

Cited By (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2013115368A (en) * 2011-11-30 2013-06-10 Rohm Co Ltd Led module
JP2019192778A (en) * 2018-04-25 2019-10-31 日亜化学工業株式会社 Method for manufacturing light-emitting device and light-emitting device
JP7037053B2 (en) 2018-04-25 2022-03-16 日亜化学工業株式会社 Manufacturing method of light emitting device and light emitting device
US11552227B2 (en) 2018-04-25 2023-01-10 Nichia Corporation Method of manufacturing light emitting device, and light emitting device
CN111554792A (en) * 2019-02-11 2020-08-18 陈在彦 Light emitting element package with adjusted pointing angle and light emitting device using the same
CN111554792B (en) * 2019-02-11 2023-08-18 陈在彦 Light emitting element package with adjusted pointing angle and light emitting device using the same

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