JP2006105738A - Device and method for inspecting semiconductor integrated circuit and program - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To determine acceptable/non-acceptable for a semiconductor integrated circuit easily without performing logical simulation and fault simulation. <P>SOLUTION: Each resistor of the resistor unit 3 is connected between the output terminal of the DUT 1 and the voltage impression circuit 5 selectively, and the input terminal of the DUT 1 is input with the prescribed operation pattern signal. The total current of each current flowing through each resistor caused by this input is measured at the current measurement circuit 4 for every operation block of operation pattern signal. The LSI tester 8 compares the total current measured by the current measurement circuit 4 with the normal value of the total current of every operation block measured by the current measurement circuit 4, for the acceptable sample which is previously confirmed that having the same function with the DUT 1, in place of the DUT 1. <P>COPYRIGHT: (C)2006,JPO&NCIPI

Description

  The present invention relates to a semiconductor integrated circuit inspection apparatus, a semiconductor integrated circuit inspection method, and a program, and more particularly to a semiconductor integrated circuit inspection apparatus that performs a function inspection of a semiconductor integrated circuit including a logic circuit, and the semiconductor integrated circuit inspection apparatus. The present invention relates to a semiconductor integrated circuit inspection method and a program for causing a computer to execute the semiconductor integrated circuit inspection method.

  Conventionally, in a function test of a semiconductor integrated circuit including a logic circuit, a predetermined test pattern for testing the function of the semiconductor integrated circuit is input to the semiconductor integrated circuit, and an output pattern output from the semiconductor integrated circuit is output as an output pattern. A method of determining a non-defective product / defective product by comparing with an expected value is used (for example, see Non-Patent Document 1). The predetermined test pattern is a test pattern in which an expected value of an output pattern to be output from the semiconductor integrated circuit when the test pattern is input to the semiconductor integrated circuit is previously known by logic simulation or the like. .

  By the way, in the inspection method using the test pattern in which the expected value of the output pattern is known, it becomes difficult to create a test pattern that simulates all the logic states as the scale of the semiconductor integrated circuit to be measured increases. Thus, an undetected area in the test pattern exists. As a result, there is a possibility that a malfunction that does not operate normally when the mechanical apparatus is used in the above-described undetected region in a mechanical apparatus or the like having a semiconductor integrated circuit as one of the components.

When such a failure occurs, a logic simulation and failure simulation are performed based on the failure phenomenon of the mechanical device, a test pattern that can detect the failure phenomenon is created, and the test pattern is added to the original test pattern. It was.
"VLSI testing / failure analysis technology", Trikes, Inc., 1992, p. 119-120

  However, as described above, the conventional method of performing a logic simulation and a failure simulation, creating a test pattern capable of detecting a defect phenomenon, and adding the test pattern to the original test pattern is used in a machine device. In many cases, it is difficult to confirm the logic state of a semiconductor integrated circuit, and a simulation method has to process a huge amount of data, and a simpler method has been demanded.

  The present invention has been made in view of such problems, and does not perform logic simulation or failure simulation, and makes it possible to easily determine whether a semiconductor integrated circuit is non-defective or defective. An object is to provide an apparatus, a semiconductor integrated circuit inspection method, and a program.

  In order to achieve the above object, according to the first aspect of the present invention, a plurality of resistors having a predetermined resistance value, and a voltage applying means for applying a predetermined voltage to each one end of the plurality of resistors, Connection disconnecting means for selectively connecting or disconnecting each other end of the plurality of resistors and each of a plurality of output terminals of the semiconductor integrated circuit, and a plurality of input terminals of the semiconductor integrated circuit including the semiconductor integrated circuit Input means for inputting a predetermined operation pattern signal including a plurality of operation blocks for inspecting the function of the circuit, and each resistor connected by the connection cut-off means by the input of the predetermined operation pattern signal by the input means Measuring means for measuring the total amount of current flowing in each of the operation blocks of the predetermined operation pattern signal, and the total amount of current for each operation block measured by the measurement means A non-defective sample having the same function as that of the semiconductor integrated circuit, which has been confirmed in advance to operate normally upon input of the predetermined operation pattern signal, was measured by the measuring means instead of the semiconductor integrated circuit. There is provided a semiconductor integrated circuit inspection apparatus having comparison means for comparing with a normal value of a sum of current amounts for each operation block.

  According to the fourth aspect of the present invention, a plurality of resistors having a predetermined resistance value, a voltage applying means for applying a predetermined voltage to each end of the plurality of resistors, and a polarity aligned in parallel A plurality of diodes connected to each other, and one side of each of the plurality of diodes is connected to each other end of the plurality of resistors, respectively, and the other side is connected to a plurality of output terminals of a semiconductor integrated circuit including a logic circuit. A diode unit connected thereto; input means for inputting a predetermined operation pattern signal including a plurality of operation blocks for testing the function of the semiconductor integrated circuit to a plurality of input terminals of the semiconductor integrated circuit; and the input The total amount of current flowing through each of the plurality of resistors by the input of the predetermined operation pattern signal by the means for each operation block of the predetermined operation pattern signal The same function as that of the semiconductor integrated circuit that has been confirmed in advance to operate normally with the input of the predetermined operation pattern signal, the measuring means for measuring, and the total amount of current for each operation block measured by the measuring means A semiconductor integrated circuit test, comprising: a non-defective sample having a comparison with a normal value of a sum of current amounts for each operation block measured by the measuring means instead of the semiconductor integrated circuit An apparatus is provided.

  According to the ninth aspect of the present invention, a plurality of resistors having predetermined resistance values each having one end connected to a plurality of output terminals of the semiconductor integrated circuit, and the plurality of resistors A voltage applying means for applying a predetermined voltage to each other end of the device, and a control for monitoring the predetermined voltage output from the voltage applying means and controlling the voltage applying means so that the predetermined voltage is constant. Means for inputting a predetermined operation pattern signal composed of a plurality of operation blocks for testing the function of the semiconductor integrated circuit to at least a plurality of input terminals of the semiconductor integrated circuit, and by the input means The voltage sign that measures the total amount of current flowing through each of the plurality of resistors by inputting a predetermined operation pattern signal for each operation block of the predetermined operation pattern signal. The semiconductor integrated circuit that has been confirmed in advance to operate normally with the input of the predetermined operation pattern signal, the measuring means included in the means, and the sum of the current amounts for each operation block measured by the measuring means And a comparison means for comparing a non-defective sample having the same function with a normal value of the sum of current amounts for each operation block measured by the measurement means instead of the semiconductor integrated circuit. An integrated circuit inspection apparatus is provided.

  According to a twelfth aspect of the present invention, a semiconductor integrated circuit comprising a plurality of resistors having a predetermined resistance value and a voltage applying means for applying a predetermined voltage to each end of the plurality of resistors. In a semiconductor integrated circuit inspection method applied to an inspection apparatus, a connection disconnecting step of selectively connecting or disconnecting each other end of each of the plurality of resistors and each of a plurality of output terminals of the semiconductor integrated circuit, and the semiconductor An input step of inputting a predetermined operation pattern signal including a plurality of operation blocks for testing the function of the semiconductor integrated circuit to a plurality of input terminals of the integrated circuit, and the predetermined operation pattern signal is input by the input step The total amount of current flowing through each resistor connected by the connection disconnection step is determined for each operation block of the predetermined operation pattern signal. The same function as the semiconductor integrated circuit that has been confirmed in advance to operate normally with the input of the predetermined operation pattern signal, the measurement step for measuring, and the sum of the current amount for each operation block measured in the measurement step A semiconductor integrated circuit test comprising: comparing a non-defective sample having a current value with a normal value of a sum of current amounts for each operation block measured in the measurement step instead of the semiconductor integrated circuit A method is provided.

  Furthermore, a program for causing a computer to execute the semiconductor integrated circuit inspection method is provided.

  According to the present invention, in the semiconductor integrated circuit inspection apparatus comprising a plurality of resistors having a predetermined resistance value, and a voltage applying means for applying a predetermined voltage to each end of the plurality of resistors, Each other end of the resistor is selectively connected to or disconnected from each of the plurality of output terminals of the semiconductor integrated circuit. A predetermined operation pattern signal including a plurality of operation blocks for testing the function of the semiconductor integrated circuit is input to the plurality of input terminals of the semiconductor integrated circuit. When the predetermined operation pattern signal is input, the total amount of current flowing through each resistor connected between the semiconductor integrated circuit and the voltage application unit is determined as the operation of the predetermined operation pattern signal. Measured for each block, and the total of the measured current amount for each operation block has the same function as the semiconductor integrated circuit that has been confirmed in advance to operate normally by inputting the predetermined operation pattern signal. The good product sample is compared with the normal value of the total sum of the current amount for each of the measured operation blocks in place of the semiconductor integrated circuit.

  As a result, it is possible to easily determine whether the semiconductor integrated circuit is non-defective / defective without performing logic simulation and failure simulation.

  Further, according to the present invention, a plurality of resistors having a predetermined resistance value, a voltage applying means for applying a predetermined voltage to each one end of the plurality of resistors, and a polarity are connected in parallel. Each of the plurality of diodes is connected to each other end of the plurality of resistors, and each other side is connected to a plurality of output terminals of a semiconductor integrated circuit including a logic circuit. A diode unit; input means for inputting a predetermined operation pattern signal including a plurality of operation blocks for testing the function of the semiconductor integrated circuit to a plurality of input terminals of the semiconductor integrated circuit; and a predetermined input by the input means A measurement that measures the total amount of current flowing in each of the plurality of resistors for each operation block of the predetermined operation pattern signal by inputting the operation pattern signal. And the sum of the current amounts for each operation block measured by the measurement unit has the same function as the semiconductor integrated circuit that has been confirmed in advance to operate normally by inputting the predetermined operation pattern signal. Comparing means for comparing a non-defective sample with a normal value of the sum of current amounts for each operation block measured by the measuring means instead of the semiconductor integrated circuit.

  As a result, leakage current from the terminals of the semiconductor integrated circuit can be prevented, the current that should be measured by the measuring means is accurately measured by the measuring means, and a good / defective product of the semiconductor integrated circuit can be accurately determined. .

  In addition, the measurement means can perform accurate measurement without being affected by variations in the output terminal voltage of the semiconductor integrated circuit, and it is possible to accurately determine whether the semiconductor integrated circuit is good or defective.

  Further, the amount of current flowing through the plurality of resistors can be set to an appropriate current value regardless of the internal resistance of the voltage applying means.

  Furthermore, according to the present invention, a plurality of resistors having predetermined resistance values each having one end connected to a plurality of output terminals of the semiconductor integrated circuit, respectively, and the other of the plurality of resistors Voltage applying means for applying a predetermined voltage to an end, control means for monitoring the predetermined voltage output from the voltage applying means, and controlling the voltage applying means so that the predetermined voltage is constant; and Input means for inputting a predetermined operation pattern signal composed of a plurality of operation blocks for testing the function of the semiconductor integrated circuit to at least a plurality of input terminals of the semiconductor integrated circuit, and a predetermined operation pattern by the input means In the voltage applying unit, the total amount of current flowing through each of the plurality of resistors is measured for each operation block of the predetermined operation pattern signal by inputting a signal. The same function as that of the semiconductor integrated circuit that has been confirmed in advance to operate normally with the input of the predetermined operation pattern signal, and the total of the current amount for each operation block measured by the measurement unit. In place of the semiconductor integrated circuit, a non-defective product sample having a comparison value is compared with a normal value of the sum of the current amounts for each operation block measured by the measurement unit.

  As a result, even if the measuring means has an internal resistance and the amount of current flowing through the measuring means is large, the predetermined voltage output by the voltage applying means is kept constant, and the measuring means does not decrease the measurement accuracy in the measuring means. Measurements can be made.

  The best mode for carrying out the present invention will be described below with reference to the drawings.

[First Embodiment]
FIG. 1 is a block diagram showing a configuration of a semiconductor integrated circuit inspection apparatus according to the first embodiment of the present invention.

  In the figure, reference numeral 1 denotes a semiconductor integrated circuit (DUT) including a logic circuit to be inspected. The output terminal (OUT) and the input / output terminal (I / O) of the DUT 1 are all connected to the switch unit 2 and the resistance unit 3. To the voltage application circuit 5. The switch unit 2 includes a plurality of switches configured by relays or the like connected in parallel, and the resistance unit 3 includes a plurality of resistors having the same resistance value connected in parallel. One end of the plurality of resistors constituting the resistance unit 3 is short-circuited and connected to the voltage application circuit 5, and the other end is connected to one end of the plurality of switches constituting the switch unit 2. The other ends of the plurality of switches constituting the switch unit 2 are respectively connected to the output terminal and the input / output terminal of the DUT 1. A switch control signal generator 9 is connected to the switch unit 2, and each switch constituting the switch unit 2 is turned on / off according to a control signal generated from the switch control signal generator 9.

  The voltage application circuit 5 includes a DC power source 7 whose negative end is grounded, and a current measurement circuit 4 provided between the positive end of the DC power source 7 and the resistance unit 3, and the voltage application circuit 5 includes the DUT 1 The same potential as that of the power supply voltage VDD terminal is output.

  6 is an operation pattern generator, which generates a predetermined operation pattern (logic signals 0, 1) for testing the function of the DUT 1, which is determined based on use in a mechanical device having the DUT 1 as a component. The data is output to the input terminal (IN) of the DUT 1 and the input / output terminal (I / O) in the input state. As a result, the output logic signal (0, 1) is output from each output terminal (OUT) of the DUT 1 in a stationary state (state after transition from the transient state to the stable state) for each operation step (operation block) of the predetermined operation pattern. In this state, the sum of currents flowing through the resistors of the resistor unit 3 connected to the output terminal (OUT) and the input / output terminal (I / O) via the switch unit 2 is obtained as a current measurement circuit. 4 measures. The voltage application circuit 5 including the current measurement circuit 4, the operation pattern generator 6, and the switch control signal generator 9 are configured by an LSI tester 8, and the LSI tester 8 stores information such as storage and comparison of measurement results described later. It has a processing function.

  On the other hand, a semiconductor integrated circuit having the same function as DUT 1 (hereinafter referred to as “non-defective sample”), which has been confirmed to operate normally when the predetermined operation pattern is input, is used in place of DUT 1 as shown in FIG. In the configuration, the total of the currents flowing through the resistors of the resistor unit 3 is measured in advance by the current measuring circuit 4 for each operation step of a predetermined operation pattern, and the measurement result is stored in the LSI tester 8. Then, the LSI tester 8 compares the measurement result obtained in advance using the non-defective sample with the measurement result obtained by the DUT 1 for each operation step.

  Note that the predetermined operation pattern input to the DUT 1 or the non-defective sample does not need to have an output expected value obtained in advance by logic simulation. In addition, the current measurement circuit 4 is a measurement resolution of the current value flowing through the one resistor calculated from the voltage value output from the voltage application circuit 5 and the value of one resistor constituting the resistor unit 3. And a measurement range capable of covering a current value obtained by multiplying the current value flowing through the one resistor by the number of all resistors constituting the resistor unit 3.

  FIG. 2 is a flowchart showing the procedure of the inspection process for the DUT 1 executed in the LSI tester 8 in the first embodiment.

  First, a non-defective sample is connected in place of DUT 1 in the semiconductor integrated circuit inspection apparatus shown in FIG. The switch control signal generator 9 generates a control signal for turning on all the switches constituting the switch unit 2, and outputs all the output terminals and input / output terminals of the non-defective samples to the resistors of the resistor unit 3. (Step S1).

  Thereafter, the operation pattern generator 6 inputs a predetermined operation pattern composed of a plurality of operation steps to the input terminal and the input / output terminal of the non-defective sample. Then, in the stationary state of the non-defective sample, the current measurement circuit 4 measures the total current flowing through the resistance unit 3 for each operation step and stores it as reference data (step S2).

  Next, the DUT 1 is connected in place of the non-defective sample in the semiconductor integrated circuit inspection apparatus. The switch control signal generator 9 generates a control signal for turning on all the switches constituting the switch unit 2, and all the output terminals and input / output terminals of the DUT 1 are connected to the resistors of the resistor unit 3. Connect (step S3).

  Thereafter, the operation pattern generator 6 inputs a predetermined operation pattern to the input terminal and the input / output terminal of the DUT 1. Then, in the stationary state of the DUT 1, the current measurement circuit 4 measures the total sum of currents flowing through the resistance unit 3 for each operation step (step S4).

  The current value obtained in step S4 and the reference data stored in step S2 are compared for each operation step (step S5). This comparison will be described in detail with reference to FIG.

  FIG. 3 is a timing chart showing a predetermined operation pattern generated from the operation pattern generator 6 and an example of a current value measured by the current measurement circuit 4.

  3A shows a predetermined operation pattern composed of a plurality of operation steps generated by the operation pattern generator 6, and FIG. 3B shows a predetermined operation pattern flowing through the resistance unit 3 and measured by the current measurement circuit 4. (C) shows a current measurement timing signal, and the current measurement circuit 4 performs current measurement in accordance with the current measurement timing signal.

  A current pattern 25 in FIG. 3B indicates the sum of currents measured in the DUT 1 and the non-defective sample corresponding to the operation step 1 of the predetermined operation pattern shown in FIG. In FIG. The current pattern 26 indicates the total current measured in the DUT 1 corresponding to the operation step 2, and the current pattern 27 indicates the total current measured in the non-defective sample corresponding to the operation step 2. In FIG. 2, both current values are different. The current pattern 28 indicates the sum of currents measured in the non-defective samples corresponding to the operation step 4, and the current pattern 29 indicates the sum of currents measured in the DUT 1 corresponding to the operation step 4. In 4, the current values are different.

  This means that in the operation step 2 and the operation step 4, either the output terminal or the input / output terminal of the DUT 1 outputs a logical value different from the corresponding terminal of the non-defective sample. It is determined that the measured DUT 1 is abnormal.

  Here, when the DUT 1 outputs a logic value different from that of the non-defective sample, an operation step (fail operation step) in which a different logic value is output is specified (step S6).

  Next, a non-defective sample is connected instead of DUT 1 in the semiconductor integrated circuit inspection apparatus. Then, the switch control signal generator 9 generates a control signal for turning on one of all the switches constituting the switch unit 2, and the output terminal or input / output of the non-defective sample corresponding to the one switch The terminal is connected to the corresponding resistor of the resistance unit 3 (step S7).

  In each fail operation step specified in step S6, the current flowing through the corresponding resistor of the resistance unit 3 is measured by the current measurement circuit 4, and the measured value is stored (step S8).

  Next, the DUT 1 is connected in place of the non-defective sample in the semiconductor integrated circuit inspection apparatus. Then, the switch control signal generator 9 generates a control signal to turn on again the switch turned on in step S7 among all the switches constituting the switch unit 2, and the output terminal of the DUT 1 corresponding to the switch or The input / output terminals are connected to the corresponding resistors of the resistance unit 3 (step S9).

  Then, in each of the fail operation steps specified in step S6, the current flowing through the corresponding resistor of the resistor unit 3 is measured by the current measuring circuit 4 (step S10).

  The current value in each fail operation step measured in step S10 is compared with the current value in each fail operation step stored in step S8 for each fail operation step. If both values are the same, one output terminal or input / output terminal of the DUT 1 connected to the one resistor of the resistance unit 3 is determined to be normal, while if both are different, the resistance unit 3 One output terminal or input / output terminal of the DUT 1 connected to the one resistor is determined to be abnormal (step S11).

  Next, it is determined whether or not there is a switch that has not been selected by the switch control signal generator 9 and is not turned on, and therefore there is a resistor that has not yet been subjected to individual current measurement ( Step S12). If there is a resistor in the resistance unit 3 that has not yet been measured for the amount of current, the process proceeds to step S7, and the processing of steps S7 to S112 is performed on the unmeasured resistor. If individual current amount measurements are performed for all the resistors constituting the unit 3, the present inspection process is terminated.

  As described above, in the first embodiment, it is possible to easily identify an abnormal terminal in the DUT 1 without performing a logic simulation and a failure simulation.

  In the semiconductor integrated circuit inspection apparatus shown in FIG. 1, the resistor unit 3 and the switch unit 2 are interchanged, and one end of each switch constituting the switch unit 2 is connected to the voltage application circuit 5 to configure the resistor unit 3. One end of each resistor may be connected to the DUT 1, and the other end of each switch may be connected to the other end of each resistor.

[Second Embodiment]
Next, a second embodiment of the present invention will be described.

  FIG. 4 is a block diagram showing a configuration of a semiconductor integrated circuit inspection apparatus according to the second embodiment. Since the configuration of the second embodiment is basically the same as the configuration of the first embodiment, in FIG. 4, the same parts as those of the first embodiment shown in FIG. The reference numerals are attached, the description is omitted, and only different parts are described.

  In the second embodiment, a diode unit 10 is added. In FIG. 4, the switch unit 2 and the switch control signal generator 9 are not illustrated, but in the second embodiment, these may or may not be provided. In the following, description will be given taking a case where it is not provided as an example.

  The diode unit 10 is configured by the same number of diodes as the plurality of resistors of the resistor unit 3, the cathode side of each diode is connected to each resistor of the resistor unit 3, and the anode side of each diode is the output terminal (OUT) of the DUT 1. And an input / output terminal (I / O).

  Here, first, problems in the case where the diode unit 10 is not provided in the semiconductor integrated circuit inspection device will be described below.

  That is, when the output voltage of the voltage application circuit 5 is set equal to the terminal voltage when the L (low level signal) signal is output to the output terminal (OUT) or the input / output terminal (I / O) of the DUT 1, A current flows to each resistor of the resistor unit 3 connected to the output terminal or input / output terminal of the DUT 1 from which the H (high level signal) signal is output, but the L signal is output. No current flows through each resistor of the resistor unit 3 connected to the output terminal or input / output terminal of the DUT 1. In order to measure the total value of the current flowing through each resistor of the resistor unit 3 connected to the output terminal or the input / output terminal of the DUT 1 from which the H signal is output by the current measuring circuit 4, the voltage applying circuit 5 Setting the output voltage is ideal.

  In this ideal setting, when the number of output terminals and input / output terminals of the DUT 1 is large, as the number of terminals of the DUT 1 to which the L signal is output increases, each of the DUT 1 to which the L signal is output It cannot be said that the combined resistance value of each resistor of the resistor unit 3 connected to the terminal is sufficiently larger than the internal resistance of the current measuring circuit 4. Therefore, it is conceivable that a part of the current flowing out from each terminal of the DUT 1 from which the H signal is output flows into each terminal of the DUT 1 from which the L signal is output, instead of the current measurement circuit 4. An error occurs in the current measurement value obtained by the current measurement circuit 4 that should measure the total value of the current flowing out from each terminal of the DUT 1 that is being used, and it is impossible to accurately determine whether the DUT 1 is good or defective.

  On the other hand, in the semiconductor integrated circuit inspection apparatus according to the second embodiment provided with the diode unit 10, all the input terminals and input / output terminals of the DUT 1 have directions of the resistors of the resistor unit 3 from the DUT 1. Since the diode unit 10 is connected in the direction in which the current flows to the terminal, the current flowing out from each terminal of the DUT 1 from which the H signal is output does not flow into each terminal of the DUT 1 from which the L signal is output. All of the current flowing out from each terminal of the DUT 1 from which the signal is output flows into the current measuring circuit 4.

  Therefore, the total value of the currents flowing out from the respective terminals of the DUT 1 to which the H signal is output is accurately measured by the current measuring circuit 4, and it is possible to accurately determine whether the DUT 1 is good or defective.

  In addition, when the diode unit 10 is not provided in the semiconductor integrated circuit inspection device, the terminal voltage at each terminal of the DUT 1 from which the L signal is output varies for each DUT and for each terminal. The current flows slightly through any resistor corresponding to each terminal of DUT1 to which is output, and the total value of current flowing out from each terminal of DUT1 to which the H signal is output should be measured An error occurs in the current measurement value obtained by the current measurement circuit 4, and it is impossible to accurately determine whether the DUT 1 is good or defective.

  On the other hand, in the semiconductor integrated circuit inspection apparatus according to the second embodiment provided with the diode unit 10, no current flows into each terminal of the DUT 1 from which the L signal is output. The total value of the current flowing out from each terminal of the DUT 1 from which the H signal is output is accurately measured by the current measuring circuit 4. Therefore, the output voltage of the voltage application circuit 5 only needs to satisfy the following conditions.

Output voltage of voltage application circuit 5 <(terminal voltage of each terminal of DUT 1 from which H signal is output−forward voltage of each diode of diode unit 10)
Thus, it is possible to accurately determine whether the DUT 1 is good or defective without being affected by variations in the terminal voltage of each terminal of the DUT 1 to which the L signal is output.

[Third Embodiment]
Next, a third embodiment of the present invention will be described.

  FIG. 5 is a block diagram showing a configuration of a semiconductor integrated circuit inspection apparatus according to the third embodiment. Since the configuration of the third embodiment is basically the same as the configuration of the second embodiment, the same parts in FIG. 5 as those of the second embodiment shown in FIG. The reference numerals are attached, the description is omitted, and only different parts are described.

  In the third embodiment, in place of the diode unit 10 of the second embodiment shown in FIG. 4, a diode unit 11 having a reverse current flow direction is added. In the third embodiment, the switch unit 2 and the switch control signal generator 9 may or may not be provided. In the following, description will be given taking a case where it is not provided as an example.

  The diode unit 11 is composed of the same number of diodes as the plurality of resistors of the resistor unit 3, the anode side of each diode is connected to each resistor of the resistor unit 3, and the cathode side of each diode is the output terminal (OUT) of the DUT 1. And an input / output terminal (I / O).

  Here again, first, problems in the case where the diode unit 11 is not provided in the semiconductor integrated circuit inspection apparatus will be described below.

  That is, when the output voltage of the voltage application circuit 5 is set equal to the terminal voltage when the H (high level signal) signal is output to the output terminal (OUT) or the input / output terminal (I / O) of the DUT 1, A current flows from the voltage application circuit 5 to each resistor of the resistor unit 3 connected to the output terminal or input / output terminal of the DUT 1 from which the L (low level signal) signal is output, but the H signal is output. No current flows through each resistor of the resistor unit 3 connected to the output terminal or the input / output terminal of the DUT 1. In order to measure the total value of the current flowing through each resistor of the resistor unit 3 connected to the output terminal or input / output terminal of the DUT 1 from which the L signal is output by the current measuring circuit 4, the voltage applying circuit 5 Setting the output voltage is ideal.

  In this ideal setting, when the number of output terminals and input / output terminals of the DUT 1 is large, as the number of terminals of the DUT 1 to which the H signal is output increases, each of the DUTs 1 to which the H signal is output. It cannot be said that the combined resistance value of each resistor of the resistor unit 3 connected to the terminal is sufficiently larger than the internal resistance of the current measuring circuit 4. Therefore, it is conceivable that not only the current flows from the voltage application circuit 5 to each terminal of the DUT 1 to which the L signal is output, but also flows from each terminal of the DUT 1 to which the H signal is output. An error occurs in the current measurement value obtained by the current measurement circuit 4 that should measure the total value of the currents flowing through the terminals of the DUT 1 to which the L signal is output from the LUT, and it becomes impossible to accurately determine whether the DUT 1 is good or defective. .

  On the other hand, in the semiconductor integrated circuit inspection apparatus according to the third embodiment provided with the diode unit 11, all the input terminals and input / output terminals of the DUT 1 are connected to the DUT 1 from each resistor of the resistor unit 3. Since the diode unit 11 is connected in the direction in which the current flows to the terminal, the current does not flow from each terminal of the DUT 1 that outputs the H signal to each terminal of the DUT 1 that outputs the L signal. The current value measured by the circuit 4 is only the total amount of current flowing through each terminal of the DUT 1 from which the L signal is output from the voltage application circuit 5.

  Therefore, the total value of the currents flowing through the terminals of the DUT 1 to which the L signal is output from the voltage application circuit 5 is accurately measured by the current measurement circuit 4, and it is possible to accurately determine whether the DUT 1 is good or defective. .

  When the diode unit 11 is not provided in the semiconductor integrated circuit inspection device, the terminal voltage at each terminal of the DUT 1 from which the H signal is output varies from DUT to DUT and from terminal to terminal. The current flows slightly into each terminal of the DUT 1 to which the H signal is output via a resistor corresponding to one of the terminals of the DUT 1 to which the signal is output, and the L signal is output from the voltage application circuit 5. An error occurs in the current measurement value obtained by the current measurement circuit 4 that should measure the total value of the currents flowing through the terminals of the DUT 1, and the correct / defective product of the DUT 1 cannot be determined accurately.

  On the other hand, in the semiconductor integrated circuit inspection apparatus according to the third embodiment provided with the diode unit 11, each terminal of the DUT 1 from which the L signal is output from each terminal of the DUT 1 from which the H signal is output. Since the current does not flow into the diode unit 11, the total value of the current flowing through the terminals of the DUT 1 from which the L signal is output from the voltage application circuit 5 is accurately measured by the current measurement circuit 4. Therefore, the output voltage of the voltage application circuit 5 only needs to satisfy the following conditions.

Output voltage of voltage application circuit 5> (terminal voltage of each terminal of DUT 1 outputting L signal + forward voltage of each diode of diode unit 11)
Thus, it is possible to accurately determine whether the DUT 1 is non-defective / defective without being affected by variations in the terminal voltage of each terminal of the DUT 1 to which the H signal is output.

[Fourth Embodiment]
Next, a fourth embodiment of the present invention will be described.

  FIG. 6 is a block diagram showing a configuration of a semiconductor integrated circuit inspection apparatus according to the fourth embodiment. Since the configuration of the fourth embodiment is basically the same as the configuration of the second embodiment, the same parts in FIG. 6 as those of the second embodiment shown in FIG. The reference numerals are attached, the description is omitted, and only different parts are described.

  In the second embodiment, the output voltage of the voltage application circuit 5 is set to the terminal voltage when the L signal is output to the output terminal (OUT) or the input / output terminal (I / O) of the DUT 1. In the third embodiment, the output voltage of the voltage application circuit 5 is used when the H signal is output to the output terminal (OUT) or the input / output terminal (I / O) of the DUT 1. Although it is necessary to set the terminal voltage, the fourth embodiment provides a semiconductor integrated circuit inspection apparatus that does not require such setting.

  That is, in the fourth embodiment, a diode unit 12 is added in place of the diode unit 10 of the second embodiment shown in FIG. In the fourth embodiment, the switch unit 2 and the switch control signal generator 9 may or may not be provided. In the following, description will be given taking a case where it is not provided as an example.

  The diode unit 12 is composed of twice as many diodes as the resistors of the resistor unit 3, and two diodes are connected in parallel in different directions to form one set, and one end of each set is the resistor unit 3. The other end of each set is connected to the output terminal (OUT) and the input / output terminal (I / O) of the DUT 1 respectively.

  Such a diode unit 12 is provided, and the following conditions are set for the terminal voltages of the output terminal (OUT) and the input / output terminal (I / O) of the DUT 1.

(Terminal voltage of the terminal of DUT 1 from which the H signal is output-Terminal voltage of the terminal of DUT 1 from which the L signal is output)> (forward voltage of the diode constituting the diode unit 12 × 2)
As a result, one of the two diodes constituting each pair of the diode units 12 blocks an unnecessary current flow, so that the current measurement circuit 4 does not depend on the output voltage of the voltage application circuit 5. Accurate current measurement is performed, and it is possible to accurately determine whether the DUT 1 is good or defective.

  That is, at the start of measurement, the terminal voltage of each terminal of the DUT 1 to which the H signal and the L signal are output is obtained, and among the obtained voltage values, the terminal voltage on the stable side with less variation. And the output voltage of the voltage application circuit 5 is set so as to be equal to the selected terminal voltage.

  In the fourth embodiment, since the measurement can be performed regardless of the magnitude of the output voltage of the voltage application circuit 5, the current flowing through the resistance unit 3 can be adjusted by adjusting the magnitude of the output voltage of the voltage application circuit 8. Therefore, it is possible to always select an optimum measurement condition.

[Fifth Embodiment]
Next, a fifth embodiment of the present invention will be described.

  FIG. 7 is a block diagram showing a configuration of a semiconductor integrated circuit inspection apparatus according to the fifth embodiment. Since the configuration of the fifth embodiment is basically the same as the configuration of the second embodiment, the same parts in FIG. 6 as those of the second embodiment shown in FIG. The reference numerals are attached, the description is omitted, and only different parts are described.

  In the fifth embodiment, the diode unit 10 in the second embodiment shown in FIG. 4 is not provided, and the configuration of the voltage application circuit 13 is different from the voltage application circuit 5 in the second embodiment. . In the fifth embodiment, the switch unit 2 and the switch control signal generator 9 may or may not be provided. In the following, description will be given taking a case where it is not provided as an example.

  The voltage application circuit 13 includes a variable DC power supply 14 that can vary the output voltage in place of the DC power supply 7 in the second embodiment, and newly responds to the voltage applied by the voltage application circuit 13 to the resistance unit 3. And a voltage control circuit 23 for controlling the output voltage of the variable DC power supply 14. The voltage control circuit 23 has one end connected to the terminal on the side of the resistance unit 3 of the current measurement circuit 4 and the other end grounded. The voltage application circuit 13 monitors the voltage applied to the resistance unit 3, and when the voltage decreases. The output voltage of the variable DC power supply 14 is raised so that the voltage applied to the resistance unit 3 by the voltage application circuit 13 is kept constant.

  Here, the output voltage of the voltage application circuit 13 is set equal to the terminal voltage when the L (low level signal) signal is output to the output terminal (OUT) or the input / output terminal (I / O) of the DUT 1. Shall.

  That is, when the number of terminals of the DUT 1 is large and the number of terminals of the DUT 1 from which the H signal is output increases, the sum of the currents flowing from the respective terminals of the DUT 1 from which the H signal is output to the current measuring circuit 4 increases. Therefore, a voltage drop in the current measurement circuit 4 due to the internal resistance of the current measurement circuit 4 cannot be ignored. In other words, the voltage applied to the resistance unit 3 by the current application circuit 13 changes by this voltage drop, and each resistor of the resistance unit 3 connected to each terminal of the DUT 1 to which the H signal is output is applied. The amount of current flowing fluctuates from the original value.

  Therefore, the voltage control circuit 23 constantly monitors the voltage on the resistance unit 3 side of the current measurement circuit 4 and the voltage control circuit 23 controls the variable DC power supply 14 so that the voltage always maintains a predetermined constant voltage. Thus, the voltage applied to the resistance unit 3 by the current application circuit 13 is held at a predetermined constant voltage. As a result, even if the number of terminals of the DUT 1 to which the H signal is output is greatly increased or decreased, each resistor of the resistor unit 3 connected to each terminal of the DUT 1 to which the H signal is output is always constant. Current can flow.

[Sixth Embodiment]
Next, a sixth embodiment of the present invention will be described.

  FIG. 8 is a block diagram showing a configuration of a semiconductor integrated circuit inspection apparatus according to the sixth embodiment. The configuration of the sixth embodiment is a combination of the fourth embodiment and the fifth embodiment. In FIG. 8, the same parts as those of the configuration of the fourth embodiment shown in FIG. 6 and the configuration of the fifth embodiment shown in FIG.

  Thus, by combining the configuration of the fourth embodiment and the configuration of the fifth embodiment, accurate current measurement is performed by the current measurement circuit 4 regardless of the output voltage of the voltage application circuit 13, It is possible to accurately determine whether the DUT 1 is good or defective, and by adjusting the magnitude of the output voltage of the voltage application circuit 13, the magnitude of the current flowing through the resistance unit 3 can be controlled to an appropriate value. Therefore, it is possible to always select the optimum measurement conditions. Further, the voltage applied to the resistance unit 3 by the current application circuit 13 is held at a predetermined constant voltage, and the H signal is output even if the number of terminals of the DUT 1 to which the H signal is output is greatly increased or decreased. A constant current can always flow through each resistor of the resistor unit 3 connected to each terminal of the DUT 1.

  In the sixth embodiment, the fourth embodiment is combined with the fifth embodiment, but instead, the second embodiment or the third embodiment is added to the fifth embodiment. The embodiments may be combined.

[Other Embodiments]
The object of the present invention is to supply a storage medium storing software program codes for realizing the functions of the above-described embodiments to a system or apparatus, and a computer (or CPU, MPU, etc.) of the system or apparatus. Is also achieved by reading and executing the program code stored in the storage medium.

  In this case, the program code itself read from the storage medium realizes the novel function of the present invention, and the storage medium and program storing the program code constitute the present invention.

  The storage medium for supplying the program code is, for example, a flexible disk, hard disk, optical disk, magneto-optical disk, CD-ROM, CD-R, CD-RW, DVD-ROM, DVD-RAM, DVD-RW. DVD + RW, magnetic tape, nonvolatile memory card, ROM, etc. can be used. Alternatively, the program is supplied by downloading from another computer or database connected to the Internet, a commercial network, a local area network, or the like.

  Further, by executing the program code read by the computer, not only the functions of the above-described embodiments are realized, but also an OS (Operating System) running on the computer based on the instruction of the program code. Includes a case where the functions of the above-described embodiments are realized by performing part or all of the actual processing.

  Further, after the program code read from the storage medium is written in a memory provided in a function expansion board inserted into the computer or a function expansion unit connected to the computer, the function expansion is performed based on the instruction of the program code. This includes the case where the CPU or the like provided in the board or the function expansion unit performs part or all of the actual processing, and the functions of the above-described embodiments are realized by the processing.

1 is a block diagram showing a configuration of a semiconductor integrated circuit inspection apparatus according to a first embodiment of the present invention. It is a flowchart which shows the procedure of the test | inspection process with respect to DUT performed in the LSI tester in 1st Embodiment. 5 is a timing chart showing a predetermined operation pattern generated from an operation pattern generator and an example of a current value measured by a current measurement circuit. It is a block diagram which shows the structure of the semiconductor integrated circuit inspection apparatus which concerns on 2nd Embodiment. It is a block diagram which shows the structure of the semiconductor integrated circuit inspection apparatus which concerns on 3rd Embodiment. It is a block diagram which shows the structure of the semiconductor integrated circuit inspection apparatus which concerns on 4th Embodiment. It is a block diagram which shows the structure of the semiconductor integrated circuit inspection apparatus which concerns on 5th Embodiment. It is a block diagram which shows the structure of the semiconductor integrated circuit inspection apparatus which concerns on 6th Embodiment.

Explanation of symbols

1 Semiconductor integrated circuit (DUT) including logic circuit to be inspected
2 Switch unit (connection blocking means)
3 Resistance unit (multiple resistors)
4 Current measurement circuit (measuring means)
5 Voltage application circuit (voltage application means)
6 Operation pattern generator (input means)
7 DC power supply 8 LSI tester (comparison means, first and second control means, operation block detection means, resistor detection means, determination means)
9 Switch control signal generator (connection cutoff means)
10-12 Diode unit 13 Voltage application circuit (voltage application means)
14 Variable DC power supply 23 Voltage control circuit (control means)

Claims (15)

A plurality of resistors having a predetermined resistance value;
Voltage applying means for applying a predetermined voltage to each one end of the plurality of resistors;
Connection blocking means for selectively connecting or blocking each other end of the plurality of resistors and each of the plurality of output terminals of the semiconductor integrated circuit;
Input means for inputting a predetermined operation pattern signal including a plurality of operation blocks for testing the function of the semiconductor integrated circuit to the plurality of input terminals of the semiconductor integrated circuit;
Measuring means for measuring the total amount of current flowing through each resistor connected by the connection cut-off means for each operation block of the predetermined operation pattern signal by inputting the predetermined operation pattern signal by the input means;
A non-defective sample having the same function as that of the semiconductor integrated circuit, which has been confirmed in advance to operate normally by inputting the predetermined operation pattern signal, is a sum of current amounts for each operation block measured by the measuring means. In place of the semiconductor integrated circuit, there is provided a semiconductor integrated circuit inspection apparatus, comprising: a comparing means for comparing with a normal value of a sum of current amounts for each operation block measured by the measuring means. First control means for operating the measuring means and the comparing means in a state where all of the plurality of resistors are connected by the connection disconnecting means;
The second control means for operating the measurement means and the comparison means in each state in which each one of the plurality of resistors is sequentially connected by the connection cutoff means. Semiconductor integrated circuit inspection equipment. The measuring means and the comparing means are operated in a state where all of the plurality of resistors are connected to the semiconductor integrated circuit by the connection disconnecting means, and the sum of the current amounts is calculated by the comparing means as a sum of the current amounts. An operation block detecting means for detecting an operation block when it is determined not to match the normal value;
In each state where each one of the plurality of resistors is sequentially connected to the semiconductor integrated circuit by the connection cut-off means, the measurement means and the comparison means are operated in the operation block detected by the operation block detection means, Resistor detecting means for detecting a resistor when it is determined by the comparing means that the sum of the current amounts does not match a normal value of the sum of the current amounts;
The semiconductor integrated circuit inspection apparatus according to claim 1, further comprising: a determination unit that determines that an abnormality exists in a terminal of the semiconductor integrated circuit connected to the resistor detected by the resistor detection unit. A plurality of resistors having a predetermined resistance value;
Voltage applying means for applying a predetermined voltage to each one end of the plurality of resistors;
A semiconductor integrated circuit comprising a plurality of diodes connected in parallel with the same polarity, wherein one side of each of the plurality of diodes is connected to the other end of each of the plurality of resistors, and the other side includes a logic circuit. A diode unit connected to each of a plurality of output terminals;
Input means for inputting a predetermined operation pattern signal including a plurality of operation blocks for testing the function of the semiconductor integrated circuit to the plurality of input terminals of the semiconductor integrated circuit;
Measuring means for measuring the sum of the amounts of current flowing through any of the plurality of resistors for each operation block of the predetermined operation pattern signal by inputting the predetermined operation pattern signal by the input means;
A non-defective sample having the same function as that of the semiconductor integrated circuit, which has been confirmed in advance to operate normally by inputting the predetermined operation pattern signal, is a sum of current amounts for each operation block measured by the measuring means. In place of the semiconductor integrated circuit, there is provided a semiconductor integrated circuit inspection apparatus, comprising: a comparing means for comparing with a normal value of a sum of current amounts for each operation block measured by the measuring means.   5. The semiconductor integrated circuit inspection device according to claim 4, further comprising a connection blocking means for selectively connecting or blocking each one side of the plurality of diodes and each other end of the plurality of resistors.   The diode unit includes a plurality of diodes each having a cathode connected to each other end of the plurality of resistors and each anode connected to a plurality of output terminals of the semiconductor integrated circuit. 5. The semiconductor integrated circuit inspection apparatus according to claim 4, wherein:   The diode unit includes a plurality of diodes each having an anode connected to each other end of the plurality of resistors and each cathode connected to a plurality of output terminals of the semiconductor integrated circuit. 5. The semiconductor integrated circuit inspection apparatus according to claim 4, wherein:   The diode unit includes twice as many diodes as the plurality of resistors, and two diodes are connected in parallel in different directions to form one set, and one end of each set is the plurality of resistors. 5. The semiconductor integrated circuit inspection device according to claim 4, wherein the other end of each set is connected to at least a plurality of output terminals of the semiconductor integrated circuit. A plurality of resistors having predetermined resistance values each capable of being connected to each of a plurality of output terminals of the semiconductor integrated circuit;
Voltage applying means for applying a predetermined voltage to each other end of the plurality of resistors;
Control means for monitoring the predetermined voltage output by the voltage applying means and controlling the voltage applying means so that the predetermined voltage is constant;
Input means for inputting a predetermined operation pattern signal composed of a plurality of operation blocks for testing the function of the semiconductor integrated circuit to at least a plurality of input terminals of the semiconductor integrated circuit;
In the voltage application unit, a total amount of currents flowing in any of the plurality of resistors is measured for each operation block of the predetermined operation pattern signal by inputting the predetermined operation pattern signal by the input unit. Measuring means included;
A non-defective sample having the same function as that of the semiconductor integrated circuit, which has been confirmed in advance to operate normally by inputting the predetermined operation pattern signal, is a sum of current amounts for each operation block measured by the measuring means. In place of the semiconductor integrated circuit, there is provided a semiconductor integrated circuit inspection apparatus, comprising: a comparing means for comparing with a normal value of a sum of current amounts for each operation block measured by the measuring means.   A plurality of diodes connected in parallel with the same polarity, one side of each of the plurality of diodes being connected to the one end of each of the plurality of resistors, and the other side being at least a plurality of the semiconductor integrated circuits The semiconductor integrated circuit inspection device according to claim 9, further comprising a diode unit connected to each of the output terminals of the semiconductor integrated circuit.   10. The semiconductor integrated circuit inspection according to claim 9, further comprising connection disconnecting means for selectively connecting or disconnecting each one end of the plurality of resistors and each of the plurality of output terminals of the semiconductor integrated circuit. apparatus. In a semiconductor integrated circuit inspection method applied to a semiconductor integrated circuit inspection apparatus comprising a plurality of resistors having a predetermined resistance value and a voltage applying means for applying a predetermined voltage to each end of the plurality of resistors. ,
A connection blocking step of selectively connecting or blocking each other end of the plurality of resistors and each of the plurality of output terminals of the semiconductor integrated circuit;
An input step of inputting a predetermined operation pattern signal including a plurality of operation blocks for testing the function of the semiconductor integrated circuit to the plurality of input terminals of the semiconductor integrated circuit;
Measurement in which the total amount of current flowing through each resistor connected by the connection disconnection step is measured for each operation block of the predetermined operation pattern signal when a predetermined operation pattern signal is input by the input step. Steps,
A non-defective sample having the same function as that of the semiconductor integrated circuit, which has been confirmed in advance to operate normally by inputting the predetermined operation pattern signal, is a sum of current amounts for each operation block measured in the measurement step. In place of the semiconductor integrated circuit, the semiconductor integrated circuit inspection method further comprises a comparison step of comparing with a normal value of a total sum of current amounts for each operation block measured in the measurement step. A first control step for executing the measurement step and the comparison step in a state where all of the plurality of resistors are connected by the connection disconnection step;
13. The method according to claim 12, further comprising: a second control step that executes the measurement step and the comparison step in each state in which each one of the plurality of resistors is sequentially connected by the connection disconnection unit. Semiconductor integrated circuit inspection method. The measurement step and the comparison step are executed in a state where all of the plurality of resistors are connected to the semiconductor integrated circuit by the connection disconnection step, and the total of the current amount is calculated as a sum of the current amount by the comparison step. An operation block detection step for detecting an operation block when it is determined that the value does not match the normal value;
In each state where each one of the plurality of resistors is sequentially connected to the semiconductor integrated circuit by the connection disconnection step, the measurement step and the comparison step are executed in the operation block detected by the operation block detection step, A resistor detection step of detecting a resistor when it is determined by the comparison step that the sum of the current amounts does not match a normal value of the sum of the current amounts;
13. The semiconductor integrated circuit inspection method according to claim 12, further comprising a determination step of determining that an abnormality exists in a terminal of the semiconductor integrated circuit connected to the resistor detected by the resistor detection step. Semiconductor integrated circuit inspection method applied to a semiconductor integrated circuit inspection apparatus comprising a plurality of resistors having a predetermined resistance value and a voltage applying means for applying a predetermined voltage to each other end of the plurality of resistors In a program for causing a computer to execute
A connection blocking step of selectively connecting or blocking each other end of the plurality of resistors and each of the plurality of output terminals of the semiconductor integrated circuit;
An input step of inputting a predetermined operation pattern signal including a plurality of operation blocks for testing the function of the semiconductor integrated circuit to the plurality of input terminals of the semiconductor integrated circuit;
Measurement in which the total amount of current flowing through each resistor connected by the connection disconnection step is measured for each operation block of the predetermined operation pattern signal when a predetermined operation pattern signal is input by the input step. Steps,
A non-defective sample having the same function as that of the semiconductor integrated circuit, which has been confirmed in advance to operate normally by inputting the predetermined operation pattern signal, is a sum of current amounts for each operation block measured in the measurement step. In place of the semiconductor integrated circuit, the program has a comparison step for comparing with a normal value of the sum of the current amounts for each operation block measured in the measurement step.

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