JP2006095808A - Liquid drop ejection head, its manufacturing process and liquid drop ejector - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a liquid drop ejection head capable of preventing occurrence of short circuit at a mounting portion of external wiring even if nozzles and ejection chambers are arranged with high density. <P>SOLUTION: The liquid drop ejection head comprises a plurality of ejection chambers 15, a vibrating plate 14 forming the bottom face of the ejection chamber 15, discrete electrodes 18 and 19 opposing the vibrating plate 14 at least partially and driving the vibrating plate 14, and an electrode substrate 12 for forming the discrete electrodes 18 and 19 wherein the electrode substrate 12 has a joint 25 for connecting the discrete electrodes 18 and 19 with external wiring and the discrete electrodes 18 and 19 are laid in layers through an insulating film 26 at the joint 25. <P>COPYRIGHT: (C)2006,JPO&NCIPI

Description

The present invention relates to a droplet discharge head, a manufacturing method thereof, and a droplet discharge device, and more particularly to a droplet discharge head capable of preventing a short circuit from occurring in a mounting portion with an external wiring even when a nozzle or a discharge chamber is densified. Etc.

In recent inkjet printers, the number of nozzles and the miniaturization of inkjet heads are increasing for high-speed printing of high-resolution images and space-saving of the printer, and the nozzle density is increasing accordingly. However, when the nozzle density is increased, it is necessary to increase the density of the mounting portion with the external wiring, which causes a problem of short-circuiting between adjacent terminals.

For this reason, in the conventional droplet discharge head, drive electrodes for driving the first head unit and the second head unit on the same plane are provided, and wiring for supplying a drive voltage to the drive electrodes of the second head unit, The drive electrode of the first head portion is stacked and disposed via an insulating film, and one end of this wiring is connected to an external electrode input pad provided at one end of the support substrate (for example, Patent Document 1). reference).
JP 2004-58288 A (FIGS. 1 and 2)

In a conventional droplet discharge head (see, for example, Patent Document 1), a wiring for supplying a drive voltage to the drive electrode of the second head portion and the drive electrode of the first head portion are stacked and disposed via an insulating film, One end of the wiring is connected to an external electrode input pad provided at one end of the support substrate, and the external electrode input pads are arranged in a staggered manner to prevent short-circuiting between the external electrode input pads (terminals). I have to. However, such a structure has a problem that when the nozzle density is further increased, the density of the external electrode input pads becomes high and a short circuit between the external electrode input pads cannot be prevented.

The present invention relates to a droplet discharge head capable of preventing a short circuit from occurring in a mounting portion with an external wiring even if the density of nozzles and discharge chambers is increased, a method for manufacturing the same, and a droplet mounted with the droplet discharge head An object is to provide a discharge device.

A droplet discharge head according to the present invention includes a plurality of discharge chambers, a diaphragm that forms a bottom surface of the discharge chamber,
At least a part of the electrode is opposed to the diaphragm and drives the diaphragm. The electrode substrate includes an electrode substrate on which the individual electrode is formed. The electrode substrate has a connection portion for connecting the individual electrode to external wiring. ,
In the connection portion, at least two or more individual electrodes are laminated via an insulating film.
Since at least two or more individual electrodes are laminated via an insulating film in the connection part of the electrode substrate, a plurality of individual electrodes are gathered at the part where the individual electrodes are laminated, and the individual electrodes are connected to the external wiring. The surface density of the terminal portion to be reduced can be reduced. It should be noted that, for example, an FPC (Flexible Print C) having a wiring having a laminated structure in the laminated portion of the individual electrodes.
If ircut) is connected, conduction to an external power source can be established without short-circuiting the stacked individual electrodes.

In the droplet discharge head according to the present invention, the individual electrode in the connection portion has a terminal portion that does not overlap the other individual electrode and the insulating film stacked above the individual electrode, and the terminal portion is connected to the external wiring. To be connected.
Since the individual electrode in the connection portion has a terminal portion that does not overlap with another individual electrode and the insulating film stacked above the individual electrode, the area of the connection portion with the external wiring can be increased. Further, if the FPC for connecting to the plurality of individual electrodes stacked in this way is used as an external wiring, a short circuit between the terminal portions can be surely prevented.

In the liquid droplet ejection head according to the present invention, the individual electrodes are installed in the recesses formed on the electrode substrate, and a plurality of recesses merge outside the part facing the diaphragm to form a single recess. The single recess is formed deeper than the recess. In the single recess, individual electrodes formed in a plurality of confluent recesses are stacked via an insulating film.
A single recess is formed in which a plurality of recesses merge, and the individual electrodes are stacked in this single recess via an insulating film, so that a gap between the individual electrode and the diaphragm can be secured. Does not interfere with electrostatic drive. Moreover, since this single recessed part is formed deeper than the part which opposes the diaphragm of a recessed part, it can accommodate several laminated | stacked individual electrodes.

Further, the droplet discharge head according to the present invention includes an individual electrode stacked in the uppermost layer among the individual electrodes stacked in the single recess, and an individual electrode formed on a portion facing the diaphragm of the recess. They are formed on the same plane.
Since the individual electrode stacked in the uppermost layer among the individual electrodes stacked in the single recess and the individual electrode formed in the portion facing the diaphragm of the recess are formed on the same plane, the single recess Can be formed with a minimum depth.

In the droplet discharge head according to the present invention, the individual electrode is made of ITO.
Since the individual electrode is made of ITO (Indium Tin Oxide), the individual electrode can be easily formed by sputtering or the like.

In the droplet discharge head according to the present invention, the electrode substrate is made of borosilicate glass.
Since the electrode substrate is made of borosilicate glass, the recess can be easily formed by wet etching using a hydrofluoric acid aqueous solution or the like.

In the method for manufacturing a droplet discharge head according to the present invention, after forming a recess for forming an individual electrode on a material substrate to be an electrode substrate, a first individual electrode is formed and formed at least on a part of a connection portion. After forming the insulating film on the surface of the formed first individual electrode, the second individual electrode is formed so that the portion formed in the connection portion is laminated on the surface of the insulating film, and the droplet discharge head described above Is to be manufactured.
If the first individual electrode is formed after forming the recess in the material substrate, the insulating film is formed on the surface, and the second individual electrode is formed on the insulating film, the above-described droplet discharge head can be easily formed. Can be manufactured.

In the method for manufacturing a droplet discharge head according to the present invention, a single recess is formed by joining two recesses closer to the connecting portion than a portion facing the diaphragm, and the single recess is formed as a diaphragm diaphragm. Are formed deeper than the portion facing each other, and individual electrodes formed in two converging concave portions are laminated in a single concave portion via an insulating film.
By forming the single concave portion deeper than the portion of the concave portion facing the diaphragm, the two individual electrodes stacked in the single concave portion are accommodated in the single concave portion to ensure a gap between the individual electrode and the diaphragm. This can prevent electrostatic driving of the diaphragm.

A droplet discharge apparatus according to the present invention includes any one of the above-described droplet discharge heads, and an FPC having a multilayer structure wiring as an external wiring is connected to the droplet discharge head.
By connecting an FPC having a wiring with a laminated structure for joining to the terminal portion to the droplet discharge head having the terminal portion having the above structure, a short circuit between the terminal portions can be surely prevented. .

In the droplet discharge device according to the present invention, the FPC is connected to a droplet discharge head by a conductive anisotropic adhesive.
For example, if the FPC and the droplet discharge head are connected using a conductive anisotropic adhesive such as ACF (Anisotropic Conductive Film), a lateral short circuit can be reliably prevented. The FPC and the droplet discharge head can be easily connected.

In the droplet discharge device according to the present invention, conductive particles are kneaded with the above-described conductive anisotropic adhesive, and the thickness of the insulating film is smaller than the diameter of the conductive particles.
Since the thickness of the insulating film is smaller than the diameter of the conductive particles, conduction between the FPC and the terminal portion of the droplet discharge head can be ensured.

Embodiment 1. FIG.
FIG. 1 is an exploded perspective view of a droplet discharge head according to Embodiment 1 of the present invention, and a part thereof is shown in a sectional view. 2 is a cross-sectional view taken along the line AA in a state where the droplet discharge head shown in FIG. 1 is assembled (see FIG. 1). The droplet discharge head shown in FIGS. 1 and 2 is of a face eject type that discharges droplets from nozzle holes provided on the surface side of the nozzle substrate, and is an electrostatic drive system that is driven by electrostatic force. belongs to. In the first embodiment, a face eject type liquid droplet ejection head will be described. However, a side eject type liquid ejection head that ejects liquid droplets from nozzle holes provided on a side surface of a nozzle substrate or a cavity substrate may be used. The droplet discharge head according to the first embodiment is particularly characterized by individual electrodes.
As shown in FIG. 1, the droplet discharge head 10 according to the first exemplary embodiment mainly includes a cavity substrate 11.
The electrode substrate 12 and the nozzle substrate 13 are configured. An electrode substrate 12 is bonded to one surface of the cavity substrate 11, and a nozzle substrate 13 is bonded to the other surface of the cavity substrate 11.
Are joined (see FIG. 2).

The cavity substrate 11 is made of, for example, single crystal silicon, and is formed with a recess 15 a that becomes a discharge chamber 15 having a bottom wall as a vibration plate 14 and a recess 17 a that becomes a reservoir 17 for supplying droplets to each discharge chamber 15. Has been. In the first embodiment, the cavity substrate 11 is made of single crystal silicon, and plasma CVD (Chemical Vapor Deposition) is formed on the entire surface thereof.
The insulating film (not shown) made of TEOS (Tetra Ethyl Ortho Silicate) is formed to 0.1 μm. This is to prevent dielectric breakdown and short-circuit when the diaphragm 14 is driven, and to the cavity substrate 11 due to droplets of ink or the like.
This is to prevent etching.

The diaphragm 14 of the droplet discharge head 10 according to the first embodiment is formed of a high-concentration boron doped layer 34, and the boron doped layer 34 has the same thickness as the diaphragm 14. The etching rate in etching single crystal silicon with an alkaline solution such as an aqueous potassium hydroxide solution is very small in a high concentration region of about 5 × 10 ¹⁹ atoms / cm ³ or more when the dopant is boron. In the first embodiment, the portion of the diaphragm 14 is a high-concentration boron-doped layer 34, and the discharge chamber 15 is subjected to anisotropic etching with an alkaline solution.
When the recess 15a to be formed is formed, the diaphragm 14 is formed in a desired thickness by using a so-called etching stop technique in which the boron doped layer 34 is exposed and the etching rate becomes extremely small.

The nozzle substrate 13 bonded to the cavity substrate 11 is, for example, a silicon substrate having a thickness of 100 μm. The nozzle substrate 22 is provided with nozzle holes 22 communicating with the respective discharge chambers 15 on the surface of the nozzle substrate 13. Is provided with a narrow groove 16a to be an orifice 16 that communicates with each other. Note that the narrow groove 16 a serving as the orifice 16 may be provided in the cavity substrate 11.

The electrode substrate 12 bonded to the cavity substrate 11 uses, for example, borosilicate glass or single crystal silicon. When the electrode substrate 12 is made of borosilicate glass, the cavity substrate 11
The electrode substrate 12 is bonded by anodic bonding. When the electrode substrate 12 is made of single crystal silicon, the cavity substrate 11 and the electrode substrate 12 are joined by direct joining. In the first embodiment, the electrode substrate 12 is made of borosilicate glass.
A plurality of recesses 20 are formed in the electrode substrate 12 with a depth of 0.3 μm, for example. Inside the recesses 20, the drive unit 18 a and the lead unit 18 b of the individual electrode 18, the drive unit 19 a of the individual electrode 19, A lead portion 19b is formed. The concave portion 20 is patterned in a slightly larger shape similar to these shapes so that the driving portion 18a and the lead portion 18b of the individual electrode 18 and the driving portion 19a and the lead portion 19b of the individual electrode 19 can be mounted. Yes. The lead portion 18b and the lead portion 19b are respectively connected to the terminal portion 1 of the connection portion 25, as will be described later.
8c and the terminal part 19c are connected.

The drive unit 18a of the individual electrode 18 and the drive unit 19a of the individual electrode 19 are, for example, made of ITO (Indium Tin O 2) so as to face the diaphragm 14 through the gap G inside the recess 19.
xide) is sputtered to a thickness of 0.1 μm (see FIG. 2). In the above example, the gap G after the cavity substrate 11 and the electrode substrate 12 are joined is 0.2 μm. In the first embodiment, the lead 18b and the lead 19b are also made of 0.1 μm ITO.
It is fabricated by sputtering with a thickness of m.
The concave portion 20 is bent at a portion where the lead portion 18b and the lead portion 19b are formed, and the adjacent concave portion 20 merges outside the portion where the driving portion 18a and the driving portion 18b are formed to form a single concave portion 21. Is forming. That is, the concave portion 2 formed with the drive portion 18a and the lead portion 18b.
0 and the concave portion 20 in which the drive portion 19a and the lead portion 19b are formed merge to form a single concave portion 21. As shown in FIG. 2, the single recess 21 is formed deeper than the recess 20, for example, with a depth of 0.5 μm.
In the single recess 21, a lead portion 18 b of the individual electrode 18 and a lead portion 19 b of the individual electrode 19 are laminated with an insulating film 26 interposed therebetween. In the first embodiment, the lead portion 18b, the insulating film 26, and the lead portion 19b are stacked in this order from the bottom inside the single recess 21, and these are all formed to a thickness of 0.1 μm. For this reason, the drive part 19a (not shown in FIG. 2), the lead part 19b, and the terminal part 19c are formed on substantially the same plane. Further, a sealing material 33 is applied to the connection portion 25 side of the single recess 21 and is sealed so that foreign matter does not enter a space such as the gap G.

An end portion of the electrode substrate 12 opposite to the portion where the drive portions 18 a and 19 a are formed is a connection portion 25. The connecting portion 25 is not joined to the cavity substrate 11, and the lead portion 18 b of the individual electrode 18 and the lead portion 19 b of the individual electrode 19 are extended. The individual electrode 18 and the individual electrode 19 extending to the connection portion 25 are stacked via the insulating film 26 in the connection portion 25 as well as inside the single recess 21.
The exposed portion of the individual electrode 19 in the connection portion 25 is a terminal portion 19c. In addition, in the connection portion 25, the individual electrode 18 has a portion that does not overlap the insulating film 26 and the terminal portion 19c laminated thereon, and the portion that does not overlap becomes the terminal portion 18c. That is,
The insulating film 26 does not cover the entire portion extending to the connection portion 25 of the individual electrode 18, and the terminal portion 19 c is laminated on the insulating film 26.
As will be described later, in the connection portion 25, the terminal portion 18c, the terminal portion 19c, and the FPC
By connecting an external wiring such as (Flexible Print Circuit, not shown in FIGS. 1 and 2), the individual electrode 18 and the individual electrode 19 are electrically connected to an external power source (not shown).

Here, the operation of the droplet discharge head shown in FIGS. 1 and 2 will be described. When a pulse voltage of about 0V to 24V is applied to the terminal portion 18c of the individual electrode 18 and the terminal portion 19c of the individual electrode 19 by a transmission circuit (not shown) and the driving unit 18a and the driving unit 19a are positively charged,
The corresponding diaphragm 14 is negatively charged, and the diaphragm 14 is attracted and bent to the drive unit 18a side and the drive unit 19a side by electrostatic force. Next, when the pulse voltage is turned off, the electrostatic force applied to the diaphragm 14 disappears and the diaphragm 14 is restored. At this time, the pressure inside the discharge chamber 15 rises rapidly, and droplets such as ink are discharged from the nozzle holes 22. Then, a pulse voltage is applied again, and the vibration plate 14 is bent toward the drive unit 18 a and the drive unit 19 a, whereby droplets are supplied from the reservoir 17 into the discharge chamber 15 through the orifice 16.
The cavity substrate 11 and the transmission circuit are connected by a common electrode (not shown) opened in a part of the cavity substrate 11 by dry etching. Further, the supply of droplets to the reservoir 17 of the droplet discharge head 10 is performed from the droplet supply port 23 formed in the electrode substrate 12 and the cavity substrate 11.

FIG. 3 is a cross-sectional view illustrating a mounting method when the droplet discharge head according to the first embodiment of the present invention is mounted on a droplet discharge device such as an inkjet printer. Note that FIG. 3 shows A in FIG.
This is a cross section of -A, and the portions other than the connecting portion 25 of the droplet discharge head 10 are omitted.
As shown in FIG. 3, the droplet discharge head 10 according to the first embodiment has an FPC 4 at the connection portion 25.
Connected to 0. The FPC 40 includes an insulating layer 41 and an insulating layer 42 made of, for example, two layers of flexible resin, and a wiring 43 made of metal or the like is provided between the insulating layer 41 and the insulating layer 42 to provide insulation. A wiring 44 made of metal or the like is also provided on the surface of the layer 42 opposite to the wiring 43.
Further, the insulating layer 41 and the wiring 43 are protruded from the insulating layer 42 and the wiring 44.
As shown in FIG. 3, the portion of the wiring 43 that protrudes from the insulating film 42 and the wiring 44 is the terminal portion 1.
The wiring 44 is connected to the terminal portion 18c. These wirings are, for example, ACF
It is connected to the terminal portion 18c and the terminal portion 19c by a conductive anisotropic adhesive 50 such as (Anisotropic Conductive Film, anisotropic conductive film). AC
F is obtained by kneading conductive particles 51 called a filler having a diameter of several μm in an insulating resin such as an epoxy-based main agent called a binder. As the conductive particles 51, for example, metal particles such as nickel and silver or resin particles plated with nickel and gold are used. The ACF has conductivity in the direction in which the conductive particles 51 kneaded in the insulating resin are pressure-bonded, but insulative in the direction perpendicular thereto.
In the first embodiment, since the insulating film 26 is formed with a thickness of 0.1 μm, the insulating film 2
The thickness of 6 is sufficiently smaller than the diameter of the conductive particles 51.

In the first embodiment, the individual electrode 18 and the individual electrode 19 in the connection portion 25 of the electrode substrate 12.
Are laminated via the insulating film 26, the two individual electrodes are gathered at the portion where the individual electrodes 18 and 19 are laminated, and the surface density of the terminal portion can be reduced.
Further, the wiring 4 having a laminated structure as shown in FIG. 3 is connected to the terminal portion 18c and the terminal portion 19c of the connecting portion 25.
3 and the FPC 40 having the wiring 44 can be connected to the external power supply without short-circuiting the stacked individual electrode 18 and individual electrode 19.
Further, a single recess 21 where two recesses 20 merge is formed, and the lead portion 18b and the lead portion 19b are stacked in this single recess 21 with an insulating film 26 interposed therebetween.
In addition, a gap G between the individual electrode 19 and the diaphragm 14 can be ensured, and the electrostatic drive of the diaphragm 14 is not hindered.

In the first embodiment, the example in which the individual electrode 18 and the individual electrode 19 are stacked via the insulating film 26 in the single recess 21 and the connection portion 25 has been described. For example, in the single recess 21, three or more recesses are provided. Three or more individual electrodes may be stacked with an insulating film interposed therebetween.
In this case, the FPC connected to the terminal portion can also be mounted on the droplet discharge device using a structure in which three or more wirings are stacked via an insulating layer.
Further, in the first embodiment, the droplet discharge head 10 in which both the lead portion 18b and the lead portion 19b are bent is shown. For example, only one lead portion is bent and the other lead portion is linear. It may be formed.

Embodiment 2. FIG.
4 and 5 are cross-sectional views showing manufacturing steps of the droplet discharge head shown in FIGS. 1 and 2 according to the first embodiment. 4 and 5, the electrode substrate 12 of the droplet discharge head 10 of Embodiment 1 is used.
The manufacturing process will be described. 4 and 5 show portions corresponding to the AA cross section of the electrode substrate 12 of FIG.
First, a material substrate 12a made of, for example, borosilicate glass is prepared, and a chromium film and a gold film 60 are sequentially formed on one surface thereof by sputtering or the like to form a chromium / gold film 60. Then, a resist film 61 is formed on the entire surface of the chromium / gold film 60 (FIG. 4A).
Next, patterning is performed by exposing the resist film 61 to a pattern corresponding to the single concave portion 21 and the connecting portion 25 and developing the pattern. Then, the gold film and the chrome film are sequentially wet-etched with an etching solution to remove portions corresponding to the single concave portion 21 and the connection portion 25 of the chrome / gold film 60 (FIG. 4B).
Then, using the remaining chromium / gold film 60 as an etching mask, the portion corresponding to the single recess 21 and the connection portion 25 is etched to a depth of 0.2 μm with, for example, a hydrofluoric acid aqueous solution (FIG. 4C).

Then, in the same manner as in the process of FIG. 4B, the portion corresponding to the recess 20 of the chromium / gold film 60 is removed (FIG. 4D).
Thereafter, using the remaining chromium / gold film 60 as an etching mask, the portion corresponding to the single recess 21 and the connection portion 25 and the portion corresponding to the recess 20 are both 0.3% by using, for example, a hydrofluoric acid aqueous solution.
Etching is performed at a depth of μm (FIG. 4E). Thereby, the concave portion 20,
A single recess 21 and a connection portion 25 are formed.
Next, the entire surface of the etched surface of the material substrate 12a is subjected to IT, for example, by sputtering.
An O film 62 is formed (FIG. 5F).
Then, a resist film (not shown) is formed on the surface of the ITO film 62, and exposure and development are performed.
A portion corresponding to the individual electrode 18 is patterned. Then, using this resist film as an etching mask, the individual electrodes 18 are formed by etching, for example, with a mixed solution of hydrochloric acid and nitric acid (FIG. 5G).

Thereafter, the mask 6 made of, for example, silicon and having a through hole having a shape corresponding to the insulating film 26.
3 is used to form an insulating film 26 in a part of the single recess 21 and the connecting portion 25 (FIG. 5H).
. This insulating film 26 can be formed, for example, by sputtering or vapor-depositing silicon oxide.
Then, the mask 63 is removed (FIG. 5 (i)), and this time, the individual electrode 19 is formed using the mask 64 having a through hole having a shape corresponding to the individual electrode 19 (FIG. 5 (j)). The individual electrodes 19 can be formed by sputtering ITO using a mask 64 made of silicon, for example. Although not shown in FIG. 5 (j), the mask 64
Has a through hole corresponding to the drive portion 19a and the lead portion 19b. Further, the portion of the through hole of the mask 64 corresponding to the insulating film 26 is formed to be smaller than the insulating film 26, so that the individual electrode 18 and the individual electrode 19 are not short-circuited even when there is a mask shift or sputtering wraparound. It has become.
Finally, the mask 64 is removed to complete the electrode substrate 12 (FIG. 5 (k)).

In the second embodiment, the individual electrodes 18 are formed after forming the recesses 20 and the like in the material substrate 12a, the insulating film 26 is formed on the surface, and the individual electrodes 19 are formed on the insulating film 26. The droplet discharge head 10 of Embodiment 1 can be manufactured.
Further, by forming the single concave portion 21 deeper than the concave portion 20, two individual electrodes stacked in the single concave portion 21 are accommodated in the single concave portion 21, and a gap between the individual electrode 19 and the diaphragm 14 is formed. It can be ensured and does not hinder electrostatic drive of the diaphragm.

Embodiment 3. FIG.
FIG. 6 is a perspective view showing an example of a droplet discharge device equipped with the droplet discharge head according to the first embodiment. The droplet discharge device 100 shown in FIG. 6 is a general ink jet printer, and the droplet discharge head 10 is mounted by the mounting method shown in FIG.
As described above, the droplet discharge head 10 according to the first embodiment has no short circuit between the terminal portions, and the droplet discharge device 100 has few discharge defects and the like.
In addition to the injet printer shown in FIG. 6, the droplet discharge head 10 according to the first embodiment is capable of variously changing droplets to manufacture a color filter for a liquid crystal display and to form a light emitting portion of an organic EL display device. It can also be applied to the discharge of biological liquids.

The droplet discharge head, the manufacturing method thereof, and the droplet discharge apparatus of the present invention are not limited to the embodiments of the present invention, and can be modified within the scope of the idea of the present invention.
For example, the single recess 21 may not be formed deeper than the recess 20, and the individual electrode 19 and the insulating film 26 may be formed on the individual electrode 18.

1 is an exploded perspective view of a droplet discharge head according to Embodiment 1 of the present invention. FIG. 2 is a cross-sectional view taken along line AA in a state where the droplet discharge head shown in FIG. 1 is assembled. FIG. 3 is a cross-sectional view illustrating a mounting method of the droplet discharge head according to the first embodiment. FIG. 3 is a cross-sectional view showing a manufacturing process of the droplet discharge head shown in FIGS. 1 and 2 according to the first embodiment. Sectional drawing which shows the manufacturing process of the continuation of FIG. FIG. 3 is a perspective view illustrating an example of a droplet discharge device equipped with the droplet discharge head according to the first embodiment.

Explanation of symbols

10 droplet discharge head, 11 cavity substrate, 12 electrode substrate, 13 nozzle substrate,
14 Diaphragm, 15 Discharge chamber, 15a Recess, 16 Orifice, 16a Narrow groove, 17
Reservoir, 17a Recessed part, 18 Individual electrode, 18a Drive part, 18b Lead part, 18c
Terminal part, 19 Individual electrode, 19a Drive part, 19b Lead part, 19c Terminal part, 20
Recess, 21 Single recess, 23 Droplet supply port, 25 Connection, 26 Insulating film, 33 Sealing material, 34 Boron doped layer, 40 FPC, 41 Insulating layer, 42 Insulating layer, 43 Wiring,
44 wiring, 50 conductive anisotropic adhesive, 51 conductive particles.

Claims (11)

A plurality of discharge chambers, a diaphragm forming a bottom surface of the discharge chamber, an individual electrode at least partially facing the diaphragm and driving the diaphragm, and an electrode substrate on which the individual electrode is formed The electrode substrate has a connection portion for connecting the individual electrode to an external wiring, and at least two or more of the individual electrodes are stacked via an insulating film in the connection portion. Droplet discharge head. In the connection portion, the individual electrode has a terminal portion that does not overlap with another individual electrode and an insulating film stacked above the individual electrode, and the terminal portion is connected to the external wiring. The droplet discharge head according to claim 1. The individual electrode is installed in a recess formed in an electrode substrate, and the plurality of recesses merge outside a portion facing the diaphragm to form a single recess, and the single recess is The individual electrode formed in the said several recessed part is laminated | stacked through the insulating film in the said single recessed part, and it is formed deeper than the said recessed part. The droplet discharge head described. Among the individual electrodes stacked in the single recess, the individual electrode stacked in the uppermost layer and the individual electrode formed in the portion of the recess facing the diaphragm are formed on the same plane. 4. The liquid droplet ejection head according to claim 3, wherein The droplet discharge head according to claim 1, wherein the individual electrode is made of ITO. The droplet discharge head according to claim 1, wherein the electrode substrate is made of borosilicate glass. After forming a recess for forming an individual electrode in a material substrate to be an electrode substrate, a first individual electrode is formed, and an insulating film is formed on the surface of the first individual electrode formed at least in a part of the connection portion 2. The droplet discharge head according to claim 1, wherein a second individual electrode is formed so that a portion formed in the connection portion is laminated on a surface of the insulating film after forming the first and second contact electrodes. Manufacturing method of a droplet discharge head. The two concave portions are joined on the connecting portion side from the portion facing the diaphragm to form a single concave portion, and the single concave portion is formed deeper than the portion of the concave portion facing the diaphragm. 8. The method of manufacturing a droplet discharge head according to claim 7, wherein the individual electrodes formed in the two concave portions to be joined are stacked in the single concave portion with an insulating film interposed therebetween. 7. A liquid droplet ejection apparatus, comprising: the liquid droplet ejection head according to claim 1; and an FPC having a multilayer structure wiring as an external wiring connected to the liquid droplet ejection head. . 10. The droplet discharge apparatus according to claim 9, wherein the FPC is connected to the droplet discharge head by a conductive anisotropic adhesive. The droplet discharge device according to claim 10, wherein conductive particles are kneaded in the conductive anisotropic adhesive, and the thickness of the insulating film is smaller than the diameter of the conductive particles.

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