JP2007105931A - Liquid droplet ejection head, liquid droplet ejector, manufacturing apparatus for liquid droplet ejection head, and manufacturing apparatus for liquid droplet ejector - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a liquid droplet ejection head which prevents the intrusion of cutting water by sealing a gap, made between an FPC mounting part and an IC input mounting part, by a simple structure and a simple manufacturing process, a liquid droplet ejector, a manufacturing method for the liquid droplet ejection head, and a manufacturing method for the liquid droplet ejector. <P>SOLUTION: In the liquid droplet ejection head in which a nozzle substrate, a reservoir substrate, a cavity substrate and an electrode substrate are laminated together, the electrode substrate is provided with a groove for mounting a driver IC for supplying a driving signal to an individual electrode, and a flexible print substrate for supplying an input signal for driving the driver IC; the cavity substrate is provided with a hole part for housing the driver IC; and a through-hole, which communicates with a gap made between the groove and the cavity substrate by joining the electrode substrate and the cavity substrate together, is formed between the hole part of the cavity substrate and a flexible print substrate-mounted side. <P>COPYRIGHT: (C)2007,JPO&INPIT

Description

  The present invention relates to a droplet discharge head, a method of manufacturing the droplet discharge head, and a method of manufacturing a droplet discharge device, and in particular, seals between an FPC mounting portion and an IC input mounting portion of a driver IC to supply cutting water. The present invention relates to a droplet discharge head, a droplet discharge device, a method for manufacturing a droplet discharge head, and a method for manufacturing a droplet discharge device that are prevented from entering.

  In recent years, ink jet heads having a structure having a plurality of nozzle arrays have been required for the purpose of high-speed printing of high-resolution images and multi-coloring. In order to realize this requirement, it is necessary to increase the nozzle density of the inkjet head and lengthen it (increase the number of nozzles per row). Along with this, the number of actuators in the ink jet head is also increasing. Under such circumstances, various small-sized inkjet heads having long and multi-row nozzle rows with a high nozzle density have been proposed.

  As such, for example, “the control IC chip is mounted face down on the surface of the substrate on which the electrothermal conversion element, the ink flow path and the ink discharge port are formed, and the input side of the IC chip is flexible printed. A liquid ejecting head, a liquid ejecting apparatus, and an IC package structure that are “connected to an external extraction electrode of a substrate” have been proposed (see, for example, Patent Document 1). This liquid ejecting head, liquid ejecting apparatus, and IC package structure can improve printing quality and printing speed by making the head more precise, thinner, smaller and longer, and can also contribute to lower costs. It is what I did.

JP 2002-210969 (5th page and FIG. 1)

  In the liquid ejecting head, the liquid ejecting apparatus, and the IC package structure described in Patent Document 1, since the IC chip surface forms part of the nozzle surface, a layer for protecting the ink from the ink is necessary on the IC chip surface. there were. Since such a layer is formed on the surface of the IC chip, there is a problem that the structure of the liquid jet head becomes complicated. Further, since the IC position is closer to the printing paper than the nozzle position, the flying distance of the ink droplets cannot be shortened. For this reason, there has been a problem that landing deviation of ink droplets is likely to occur and high-definition printing is difficult. Furthermore, since the ink flow path and the flexible printed circuit board are arranged on opposite sides of the IC chip, the entire liquid ejecting head becomes larger when the number of nozzle rows is increased. There was also a problem of end.

  In order to solve such a problem, an inkjet in which an input mounting portion of a driver IC and a flexible printed circuit board (FPC) mounting portion for supplying an input signal for driving the driver IC from the outside are communicated with each other. The head is considered. However, it is assumed that the cutting water enters the IC input mounting portion of the driver IC through the FPC mounting portion when the head chip is divided (cut) after the substrate assembly (assembly). If water such as cutting water enters the IC input mounting portion, there is a problem that there is a high possibility of electrolytic corrosion or disconnection when the head is driven (when voltage is applied).

  In addition, when sealing is performed so that cutting water does not enter the IC input mounting part from the FPC mounting part side or the IC input mounting part side of the driver IC by using a discharge device such as a dispenser. The width to which the material is applied must be taken into account, and a problem such as an increase in the size of the entire head chip and a problem in that the height of the sealing material causes poor adhesion or the like can be assumed. .

  The present invention has been made to solve the above-described problems, and seals a gap generated between the FPC mounting portion and the IC input mounting portion by a simple structure and a simple manufacturing process, thereby cutting water. It is an object of the present invention to provide a droplet discharge head, a droplet discharge device, a method for manufacturing a droplet discharge head, and a method for manufacturing a droplet discharge device that prevent entry of liquid.

  A droplet discharge head according to the present invention includes a nozzle substrate in which nozzle holes for discharging droplets are formed, and a cavity in which a bottom wall forms a vibration plate and a recess serving as a pressure chamber for storing droplets. A substrate, an electrode substrate on which an individual electrode for driving the diaphragm is opposed to the substrate, a recess serving as a reservoir for supplying droplets to the pressure chamber, and a droplet for supplying droplets from the reservoir to the pressure chamber A reservoir substrate having a supply hole, a nozzle communication hole for transferring a droplet from the pressure chamber to the nozzle hole, a driver IC for supplying a drive signal to the individual electrode, and an input signal for driving the driver IC A groove for mounting a flexible printed circuit board for supplying the driver IC is provided, and the cavity board is provided with a hole part for accommodating the driver IC, and the hole part of the cavity board and the flexi board are provided. Between the side where Le PCB is mounted, and characterized by forming a through hole communicated with the gap formed between the groove and the cavity substrate by bonding the electrode substrate and the cavity substrate.

  In this way, the cavity substrate is formed with a through hole that communicates with the gap formed between the groove and the cavity substrate by joining the electrode substrate and the cavity substrate, and between the groove and the cavity substrate through the through hole. Since the gap is sealed, it is not necessary to increase the size of the droplet discharge head without adding new parts. Further, it is possible to prevent the cutting water from entering the gap (between the FPC mounting portion and the IC input mounting portion) during head chip division (dicing) after the substrate assembly (assembly). Therefore, it is possible to provide a multi-row / small droplet discharge head having stable printing performance and quality without causing electric corrosion or disconnection when the head is driven (when voltage is applied).

  The liquid droplet ejection head according to the present invention is characterized in that the gap is sealed with a sealing material. It is not necessary to provide a new component separately, and the gap (between the FPC mounting portion and the IC input mounting portion) can be sealed (sealed) by using a sealing material. Therefore, it is possible to prevent the cutting water from entering the gap with a simple structure. Further, it is possible to provide a multi-row / small droplet discharge head having stable printing performance and quality without causing electric corrosion or disconnection when the head is driven (when voltage is applied).

  The droplet discharge head according to the present invention is characterized in that the gap is sealed with an adhesive that joins the cavity substrate and the reservoir substrate. As described above, since the adhesive used to join the cavity substrate and the reservoir substrate is used as the sealing material, it is cut into a gap (between the FPC mounting portion and the IC input mounting portion) with a simpler structure. Water can be prevented from entering. Further, it is possible to provide a multi-row / small droplet discharge head having stable printing performance and quality without causing electric corrosion or disconnection when the head is driven (when voltage is applied).

  The droplet discharge head according to the present invention is characterized in that the gap is sealed by a sealing member that seals the connection portion between the individual electrode and the driver IC. Thus, since the sealing member used for sealing the gap is used as the sealing material, the cutting water enters the gap (between the FPC mounting portion and the IC input mounting portion) with a simpler structure. Can be prevented. Further, it is possible to provide a multi-row / small droplet discharge head having stable printing performance and quality without causing electric corrosion or disconnection when the head is driven (when voltage is applied).

  A droplet discharge head according to the present invention includes a nozzle substrate in which nozzle holes for discharging droplets are formed, and a cavity in which a bottom wall forms a vibration plate and a recess serving as a pressure chamber for storing droplets. A substrate, an electrode substrate on which an individual electrode for driving the diaphragm is opposed to the substrate, a recess serving as a reservoir for supplying droplets to the pressure chamber, and a droplet for supplying droplets from the reservoir to the pressure chamber A reservoir substrate having a supply hole, a nozzle communication hole for transferring a droplet from the pressure chamber to the nozzle hole, a driver IC for supplying a drive signal to the individual electrode, and an input signal for driving the driver IC A groove for mounting a flexible printed circuit board for supplying the driver IC is provided, and the gap formed between the groove board and the cavity board by joining the electrode board and the cavity board is different from that for mounting the driver IC in the groove. Wherein the sealed with sexual conductive adhesive.

  As described above, the anisotropic conductive adhesive used for mounting the driver IC seals (seals) the gap formed between the groove and the cavity substrate by joining the electrode substrate and the cavity substrate. It is not necessary to increase the size of the droplet discharge head without adding additional parts. Further, it is possible to prevent the cutting water from entering the gap (between the FPC mounting portion and the IC input mounting portion) during head chip division (dicing) after the substrate assembly (assembly). Therefore, it is possible to provide a multi-row / small droplet discharge head having stable printing performance and quality without causing electric corrosion or disconnection when the head is driven (when voltage is applied).

  A droplet discharge apparatus according to the present invention includes the droplet discharge head described above. Therefore, it is possible to manufacture a droplet discharge device having the above effects and high ink droplet discharge performance and printing performance. In addition, since it is not necessary to increase the head size of the droplet discharge head mounted in the droplet discharge device, it is possible to reduce the size of the droplet discharge device.

  The method for manufacturing a droplet discharge head according to the present invention includes mounting a driver IC that forms individual electrodes and supplies a drive signal to the individual electrodes and a flexible printed circuit board that supplies an input signal for driving the driver IC. A step of joining a cavity substrate that forms a liquid flow path to an electrode substrate provided with a groove for forming a recess, and a concave portion that forms a vibration plate on the cavity substrate and serves as a pressure chamber for storing droplets And a step of forming a through hole communicating with the gap formed between the groove and the cavity substrate by joining the electrode substrate and the cavity substrate, injecting an adhesive into the through hole, and applying the adhesive to the cavity A concave portion serving as a reservoir for applying droplets to the pressure chamber and supplying droplets to the pressure chamber, a supply hole for supplying droplets from the reservoir to the pressure chamber, and a nozzle link for transferring droplets from the pressure chamber to the nozzle holes A reservoir substrate having a hole, and having a step of bonding the cavity substrate.

  In this way, the adhesive is injected into the through-hole, and the adhesive is applied to the cavity substrate, and the reservoir substrate and the cavity substrate are joined. Therefore, the gap (FPC mounting portion) can be added without adding a new manufacturing process. And the IC input mounting portion) can be prevented from entering the cutting water. Therefore, it is possible to provide a multi-row / small droplet discharge head having stable printing performance and quality without causing electric corrosion or disconnection when the head is driven (when voltage is applied).

  The method for manufacturing a droplet discharge head according to the present invention includes mounting a driver IC that forms individual electrodes and supplies a drive signal to the individual electrodes and a flexible printed circuit board that supplies an input signal for driving the driver IC. A step of joining a cavity substrate that forms a liquid flow path to an electrode substrate provided with a groove for forming a recess, and a concave portion that forms a vibration plate on the cavity substrate and serves as a pressure chamber for storing droplets And a step of forming a through hole communicating with the gap formed between the groove and the cavity substrate by joining the electrode substrate and the cavity substrate, and a driver IC for supplying a drive signal to the individual electrode is mounted on the electrode substrate. And a step of injecting the sealing member into the through hole when sealing the gap formed between the individual electrode and the pressure chamber with the sealing member.

  Thus, when the gap formed between the individual electrode and the pressure chamber is sealed with the sealing member, the sealing member is also injected into the through hole, so that a new manufacturing process is not added. The cutting water can be prevented from entering the gap (between the FPC mounting portion and the IC input mounting portion). Therefore, it is possible to provide a multi-row / small droplet discharge head having stable printing performance and quality without causing electric corrosion or disconnection when the head is driven (when voltage is applied).

  The droplet discharge head according to the present invention is characterized in that the through hole is formed by wet etching or dry etching. Therefore, the through hole can be formed by etching (wet etching or dry etching) normally performed on the cavity substrate without requiring a special process or procedure. That is, since the through hole can be manufactured by a simple process / procedure, it is possible to easily prevent the cutting water from entering the gap (between the FPC mounting portion and the IC input mounting portion).

  The method for manufacturing a droplet discharge head according to the present invention includes mounting a driver IC that forms individual electrodes and supplies a drive signal to the individual electrodes and a flexible printed circuit board that supplies an input signal for driving the driver IC. A step of joining a cavity substrate that forms a liquid flow path to an electrode substrate provided with a groove for forming a recess, and a concave portion that forms a vibration plate on the cavity substrate and serves as a pressure chamber for storing droplets An anisotropic conductive adhesive is injected into the gap formed between the groove and the cavity substrate by joining the electrode substrate and the cavity substrate, and the individual electrodes are driven by the anisotropic conductive adhesive. Mounting a driver IC for supplying a signal.

  In this way, since the anisotropic conductive adhesive for mounting the driver IC is injected into the gap and the gap is sealed, the gap (FPC mounting portion and IC input are not added without adding a new manufacturing process. It is possible to prevent the cutting water from entering between the mounting part). Therefore, it is possible to provide a multi-row / small droplet discharge head having stable printing performance and quality without causing electric corrosion or disconnection when the head is driven (when voltage is applied).

  A method for manufacturing a droplet discharge device according to the present invention is characterized in that a droplet discharge device is manufactured by applying the method for manufacturing a droplet discharge head described above. Accordingly, it is possible to manufacture a droplet discharge head having the above effects and high ink droplet discharge performance and printing performance. In addition, since it is not necessary to increase the head size of the droplet discharge head mounted in the droplet discharge device, it is possible to reduce the size of the droplet discharge device.

Hereinafter, embodiments of the present invention will be described with reference to the drawings.
Embodiment 1 FIG.
FIG. 1 is an exploded perspective view of a droplet discharge head 100 according to Embodiment 1 of the present invention. FIG. 2 is a longitudinal sectional view showing an AA ′ section in a state where the droplet discharge head 100 is assembled. The droplet discharge head 100 is of a face eject type that discharges droplets from nozzle holes provided on the surface side of the nozzle substrate, and is of an electrostatic drive type that is driven by electrostatic force. . FIG. 1 also shows a part of an FPC (Flexible Printed Circuit) for supplying a drive signal.

  As shown in FIG. 1, the droplet discharge head 100 does not have a three-layer structure like a general electrostatic drive type droplet discharge head, but an electrode substrate 4, a cavity substrate 3, a reservoir substrate 2, and a nozzle substrate 1. It is characterized by a four-layer structure composed of four substrates. The nozzle substrate 1 is bonded to one surface of the reservoir substrate 2, and the cavity substrate 3 is bonded to the other surface of the reservoir substrate 2. An electrode substrate 4 is bonded to the opposite surface of the cavity substrate 3 to which the reservoir substrate 2 is bonded. That is, the electrode substrate 4, the cavity substrate 3, the reservoir substrate 2, and the nozzle substrate 1 are bonded in this order. The droplet discharge head 100 is provided with a driver IC 15 that supplies a drive signal to the individual electrode 17.

[Electrode substrate 4]
The electrode substrate 4 may be formed of glass such as borosilicate glass. Here, a case where the electrode substrate 4 is formed of borosilicate glass is shown as an example, but the present invention is not limited to this. For example, the electrode substrate 4 may be formed of single crystal silicon. A concave portion (groove) 12 is formed in the electrode substrate 4. The recess 12 may be formed with a depth of 0.3 μm, for example. In addition, the individual electrodes 17 are formed inside the recesses 12 so as to face a diaphragm 8 described later with a certain interval. The individual electrode 17 is preferably made by sputtering ITO (Indium Tin Oxide) with a thickness of 0.1 μm, for example.

  The concave portion 12 is patterned in a slightly larger shape similar to these shapes so that a part of the concave electrode 12 can be attached to the individual electrode 17, and the other portion (center portion) can be attached with the driver IC 15. A pattern is formed. The driver IC 15 is installed at the center. One end of the individual electrode 17 is connected to the driver IC 15, and a drive signal is supplied from the driver IC 15.

  In the droplet discharge head 100, a plurality of individual electrodes 17 are formed in a rectangular shape having long sides and short sides, and the individual electrodes 17 are arranged so that their long sides are parallel to each other. Two electrode rows extending in the short side direction of 17 are formed. In addition, when the short side of the individual electrode 17 is formed obliquely with respect to the long side and the individual electrode 17 has an elongated parallelogram shape, an electrode array extending in a direction perpendicular to the long side direction is formed. What should I do?

  In the droplet discharge head 100, the driver IC 15 is formed between two electrode rows and is connected to both electrode rows. Therefore, it becomes possible to supply drive signals from the driver IC 15 to the two electrode rows, and it is easy to increase the number of electrode rows. Furthermore, since the number of driver ICs 15 can be reduced, the cost required for manufacturing can be reduced, and the droplet discharge head 100 can be downsized.

  An ink supply hole 11 is formed in the electrode substrate 4. The ink supply hole 11 passes through the electrode substrate 4. Further, the FPC mounting portion 21 is formed on the electrode substrate 4. A sealing member 14 for sealing the IC output mounting portion 18 and the gap 13 is formed after the electrode substrate 4 and the cavity substrate 3 are joined. The sealing member 14 will be described in detail later. (See FIG. 2). Further, here, a case where two driver ICs 15 are installed is shown as an example, but the present invention is not limited to this. For example, these driver ICs 15 may be constituted by one IC or may be constituted by three or more ICs.

[Cavity substrate 3]
The cavity substrate 3 is made of, for example, single crystal silicon, and a plurality of pressure chambers (or discharge chambers) 7 whose bottom walls are the diaphragms 8 are formed. The pressure chambers 7 are formed in two rows corresponding to the electrode rows of the individual electrodes 17. Further, a first hole (hole) 22 is formed in the cavity substrate 3 so as to penetrate the cavity substrate 3 between the electrode arrays. Further, the cavity substrate 3 has a common electrode 16 for applying a voltage to the diaphragm 8. The common electrode 16 is connected to the FPC 30.

  The cavity substrate 3 is made of single crystal silicon, and an insulating film (not shown) made of TEOS (Tetra Ethyl Ortho Silicate) is formed on the entire surface by plasma CVD (Chemical Vapor Deposition). This is for preventing dielectric breakdown and short-circuit when the diaphragm 8 is driven, and for preventing etching of the cavity substrate 3 by droplets of ink or the like.

The diaphragm 8 may be formed of a high concentration boron doped layer. The etching rate in etching single crystal silicon with an alkaline solution such as an aqueous potassium hydroxide solution is very small in a high concentration region of about 5 × 10 ¹⁹ atoms / cm ³ or more when the dopant is boron. For this reason, when the diaphragm 8 is made of a high-concentration boron-doped layer and the pressure chamber 7 is formed by anisotropic etching with an alkaline solution, the boron-doped layer is exposed and the etching rate becomes extremely small, so-called etching stop. By using the technique, the diaphragm 8 can be formed in a desired thickness.

  When the electrode substrate 4 and the cavity substrate 3 are joined, a vibration chamber (gap) 13 that is a gap is formed between the individual electrode 17 and the diaphragm 8. The vibration chamber 13 is formed to have a depth of 0.2 μm, for example. In addition, the ink supply hole 11 penetrating the cavity substrate 3 is formed in the cavity substrate 3.

[Reservoir substrate 2]
The reservoir substrate 2 is made of, for example, single crystal silicon, and two reservoirs 10 for supplying droplets to the pressure chamber 7 are formed, and droplets from the reservoir 10 to the pressure chamber 7 are formed on the bottom surface of the reservoir 10. A supply hole 9 for transfer is formed. An ink supply hole 11 that penetrates the bottom surface of the reservoir 10 is formed on the bottom surface of the reservoir 10. The ink supply hole 11 formed in the reservoir substrate 2, the ink supply hole 11 formed in the cavity substrate 3, and the ink supply hole 11 formed in the electrode substrate 4 are the reservoir substrate 2, the cavity substrate 3, and the electrode substrate 4. Are connected to each other in the joined state, and are for supplying droplets to the reservoir 10 from the outside (see FIG. 2). Further, a second hole 23 that penetrates the reservoir substrate 2 is formed between the reservoirs 10 of the reservoir substrate 2.

  As shown in FIG. 2, the first hole portion 22 provided in the cavity substrate 3 and the second hole portion 23 provided in the reservoir substrate 2 communicate with each other to form an accommodating portion 24. The driver IC 15 is accommodated in the accommodating portion 24. Further, nozzle communication holes 6 are formed in portions of the reservoir substrate 2 other than the reservoir 10 so as to communicate with the respective pressure chambers 7 and to transfer droplets from the pressure chambers 7 to the nozzle holes 5 described later. The nozzle communication hole 6 penetrates the reservoir substrate 2 and communicates with one end of the pressure chamber 7 opposite to one end with which the supply hole 9 communicates.

[Nozzle substrate 1]
The nozzle substrate 1 is made of, for example, a silicon substrate having a thickness of 100 μm, and a plurality of nozzle holes 5 communicating with the respective nozzle communication holes 6 are formed. The nozzle holes 5 are formed in two stages to improve the straightness when discharging droplets (see FIG. 2). Further, when the electrode substrate 4, the cavity substrate 3, the reservoir substrate 2 and the nozzle substrate 1 are bonded, when the silicon substrate and the borosilicate glass substrate are bonded, the silicon substrates are bonded to each other by anodic bonding. If so, it can be joined by direct joining. Further, the substrates made of silicon can be bonded using an adhesive. Here, the nozzle substrate 1 and the reservoir substrate 2 are adhesively bonded using an epoxy adhesive.

  As shown in FIG. 2, in the droplet discharge head 100, the driver IC 15 is accommodated in the accommodating portion 24, and the accommodating portion 24 is closed by the nozzle substrate 1, the reservoir substrate 2, the cavity substrate 3, and the electrode substrate 4. ing. That is, the nozzle substrate 1 forms the upper surface of the housing portion 24, the electrode substrate 4 forms the lower surface of the housing portion 24, and the cavity substrate 3 and the reservoir substrate 2 form the side surfaces of the housing portion 24, thereby closing the housing portion 24. It is like that. As will be described in detail below, it is desirable that the accommodating portion 24 be sealed in order to protect the driver IC 15 from liquid droplets and outside air.

The sealing member 14 seals the gap 13 between the diaphragm 8 and the individual electrode 17. The sealing member 14 is formed of, for example, silicon oxide (SiO ₂ ), aluminum oxide (Al ₂ O ₃ ), silicon oxynitride (SiON), silicon nitride (SiN), polyparaxylylene, or the like having low moisture permeability. Good. In addition, polyparaxylylene is a crystalline polymer resin and has properties that are excellent in moisture permeation prevention and chemical resistance. If these materials are formed by sputtering, CVD, or the like, the sealing member 14 having low moisture permeability can be formed small, and the droplet discharge head 100 can be further downsized.

  Next, the operation of the droplet discharge head 100 will be described. A droplet such as ink is supplied to the reservoir 10 from the outside through the ink supply hole 11. In addition, droplets are supplied from the reservoir 10 to the pressure chamber 7 through the supply hole 9. The driver IC 15 receives a drive signal (not shown) from a control unit (not shown) of the droplet discharge device via an FPC internal wiring (IC input) 32 of the FPC 30 and an IC input mounting unit 20 (see FIG. 1) provided on the electrode substrate 4. Pulse voltage).

  Then, a pulse voltage of about 0 V to 40 V is applied from the driver IC 15 to the individual electrode 17 to charge the individual electrode 17 positively, and the corresponding diaphragm 8 is connected to the droplet discharge device via the FPC internal wiring 31 (COM). A drive signal (pulse voltage) is supplied from a control unit (not shown) to be negatively charged. If it does so, the diaphragm 8 will be attracted | sucked by the individual electrode 17 side by an electrostatic force, and will be bent. Next, when this pulse voltage is turned off, the electrostatic force applied to the diaphragm 8 disappears and the diaphragm 11 is restored. At this time, the pressure inside the pressure chamber 7 rises rapidly, and the droplets in the pressure chamber 7 pass through the nozzle communication hole 6 and are discharged from the nozzle hole 5. Thereafter, the droplet is replenished from the reservoir 10 into the pressure chamber 7 through the supply hole 9 and returns to the initial state.

  The supply of droplets to the reservoir 10 of the droplet discharge head 100 is performed by, for example, a droplet supply tube (not shown) connected to the ink supply hole 11. The FPC 30 is connected to the driver IC 15 so that the longitudinal direction of the FPC 30 is parallel to the short side direction of the individual electrodes 17 forming the electrode array. For example, when the short side of the individual electrode 17 is inclined with respect to the long side and the individual electrode 17 has an elongated parallelogram shape, the FPC 30 is connected in a direction perpendicular to the long side of the individual electrode 17. That's fine. Thereby, the droplet discharge head 100 having a plurality of electrode rows and the FPC 30 can be connected in a compact manner.

  Here, the sealing (sealing) of the container 24, which is a characteristic part of the droplet discharge head 100 according to Embodiment 1, will be described. FIG. 3 is a longitudinal sectional view showing a B-B ′ section in a state where the droplet discharge head 100 is assembled. In FIG. 3, when the substrate assembly is completed, each droplet discharge head 100 is completed by being divided (cut) for each head chip. However, if the cutting water enters from between the FPC mounting part 21 and the IC input mounting part 20 (gap) when dividing each head chip, electrolytic corrosion or disconnection occurs when the head is driven (voltage application). This causes a problem that the possibility increases.

  In the droplet discharge head 100 assembled as described above, the individual electrode 17 provided between the FPC mounting portion 21 and the IC input mounting portion 20, that is, in the groove (that is, the recess 12) formed in the electrode substrate 4. A gap is formed between the cavity substrate 3 and the cavity substrate 3. For this reason, there is a possibility that cutting water may enter when the head chip is divided. Therefore, in the droplet discharge head 100 according to Embodiment 1, the FPC mounting part 21 and the IC input mounting part 20 are sealed (sealed) before the head chip is divided. Here, the case where the groove is 170 nm (0.17 μm), the thickness of the individual electrode 17 is 70 nm (0.07 μm), and the gap is 100 nm (0.1 μm) is shown as an example.

  FIG. 4 is an explanatory diagram for explaining the cavity substrate 3 in which the through holes 26 are formed. Based on FIG. 4, sealing between the FPC mounting part 21 and the IC input mounting part 20 will be described. A through hole 26 for injecting a sealing material (adhesive or the like) is formed in the partition wall 25 of the cavity substrate 3. The cavity substrate 3 and the reservoir substrate 2 are generally joined directly by an adhesive. By using this adhesive, the gap between the FPC mounting portion 21 and the IC input mounting portion 20 is sealed. I have to.

  That is, a through hole 26 is formed in the partition wall 25 of the cavity substrate 3, and an adhesive as a sealing material is injected into the through hole 26 at the same time as the cavity substrate 3 and the reservoir substrate 2 are bonded and bonded, thereby mounting the FPC. The space between the portion 21 and the IC input mounting portion 20 is sealed (sealed) (see FIG. 5). Here, the case where the sealing material injected into the through hole 26 is an adhesive is shown as an example, but the present invention is not limited to this (see Embodiment 2 and Embodiment 3).

  FIG. 8 shows an example of the manufacturing process of the droplet discharge head. With such a manufacturing process, the through hole 26 can be formed together with the formation of the first hole 22 of the cavity substrate 3. It becomes possible to produce with a simple manufacturing process. Further, since addition of new parts is not required, the structure itself is simplified without a complicated structure. Therefore, the size of the droplet discharge head 100 can be reduced, and failure (electric corrosion, disconnection) due to penetration of cutting water or the like into the IC input mounting unit 20 can be prevented.

  FIG. 5 is a longitudinal sectional view showing a B-B ′ section of the droplet discharge head 100 assembled by injecting a sealing material into the through hole 26. As shown in the figure, an adhesive for bonding the cavity substrate 3 and the reservoir substrate 2 is bonded to the FPC mounting portion 21 and the IC input mounting portion 20 from the through hole 26 formed in the partition wall 25 of the cavity substrate 3. It is supposed to flow in between. That is, this adhesive serves as a sealing material so that cutting water does not enter the IC input mounting portion 20.

  FIG. 6 is a schematic block diagram showing a control system of a droplet discharge device on which the droplet discharge head 100 is mounted. In the following description, it is assumed that the droplet discharge device is a general ink jet printer. Hereinafter, a control system of a droplet discharge device on which the droplet discharge head 100 is mounted will be described with reference to the drawings. However, the control system of the droplet discharge device on which the droplet discharge head 100 is mounted is not limited to the case shown here.

  The ink jet printer includes a control device 50 for driving and controlling the droplet discharge head 100. The control device 50 is configured around a CPU (central processing unit) 51. The CPU 51 receives print information from an external device 60 such as a personal computer or a remote control device (remote control). This print information is input via the bus 52 or input by a wireless signal such as an infrared signal. The CPU 51 is connected to a ROM 54, a RAM 55, and a character generator 56 via an internal bus 53.

  The control device 50 uses the storage area in the RAM 55 as a work area, executes a control program stored in the ROM 54, and drives the droplet discharge head 100 based on character information generated from the character generator 56. Control signal is generated. The control signal becomes a drive control signal corresponding to the print information via the logic gate array 57 and the drive pulse generation circuit 58, and is supplied to the driver IC 15 built in the droplet discharge head 100 via the connector 65. In addition, it is supplied to the COM generation circuit 59. The driver IC 15 is also supplied with a drive pulse signal V3 for printing, a control signal LP, a polarity inversion control signal REV, and the like (see FIG. 4). Note that the COM generation circuit 59 may be configured by a common electrode IC (not shown) for generating a drive pulse, for example.

  The COM generation circuit 59 outputs a drive signal to be applied to the common electrode 16 of the droplet discharge head 100, that is, each diaphragm 8, from a common output terminal COM (not shown) based on the supplied signals. ing. In the driver IC 15, a drive signal to be applied to each individual electrode 17 is applied to each individual electrode 17 based on each supplied signal and the drive voltage Vp supplied from the power supply circuit 70. To output. A potential difference between the output of the common output terminal COM and the output of the individual output terminal SEG is applied between each diaphragm 8 and the individual electrode 17 facing it. When the diaphragm 8 is driven (when droplets are ejected), a drive potential difference waveform in the designated direction is given, and when the diaphragm 8 is not driven, no drive potential difference is given.

  FIG. 7 is a schematic block diagram showing an example of the internal configuration of the driver IC 15 and the COM generation circuit 59. The driver IC 15 and the COM generation circuit 59 supply driving signals to the 64 individual electrodes 17 and the diaphragm 8 in one set. Further, an example is shown in which the driver IC 15 is a CMOS 64-bit output high voltage driver that operates by being supplied with the high voltage drive voltage Vp and the logic circuit drive voltage Vcc from the power supply circuit 70.

  The driver IC 15 applies one of the drive voltage pulse and the GND potential to the individual electrode 17 in accordance with the supplied drive control signal. The driver IC 15 has a 64-bit shift register 81. The shift register 81 is an XSCL pulse that is a basic clock pulse that synchronizes the DI signal input of 64-bit length transmitted from the logic gate array 57 as serial data with the DI signal. It is a static shift register that shifts up data by a signal input and stores it in a register in the shift register 81. The DI signal is a control signal indicating selection information for selecting each of the 64 individual electrodes 17 by ON / OFF, and this signal is transmitted as serial data.

  The driver IC 15 has a 64-bit latch circuit 82. The latch circuit 82 latches the 64-bit data stored in the shift register 81 with a control signal (latch pulse) LP to store the data. This is a static clutch that outputs the data to the 64-bit inversion circuit 83 as a signal. In the latch circuit 82, the DI signal of the serial data is converted into a 64-bit parallel signal for outputting 64 segments for driving each diaphragm 11.

  The inverting circuit 83 outputs an exclusive OR of the signal input from the latch circuit 82 and the REV signal to the level shifter 84. The level shifter 84 is a level interface circuit that converts the voltage level of the signal from the inverting circuit 83 from the logic system voltage level (5 V level or 3.3 V level) to the head drive system voltage level (0 to 45 V level). The SEG driver 85 is a 64 channel transmission gate output, and outputs either a drive voltage pulse input or a GND input to the segment outputs SEG1 to SEG64 by the input of the level shifter 84. A COM driver 86 built in the COM generation circuit 59 outputs either a drive voltage pulse or a GND input to the COM in response to the REV input.

  The XSCL, DI, LP, and REV signals are logic system voltage level signals that are transmitted from the logic gate array 57 to the driver IC 15. In this way, by configuring the driver IC 15 and the COM generation circuit 59, even when the number of segments to be driven (the number of diaphragms 8) increases, the driving voltage for driving the diaphragm 8 of the droplet discharge head 100 can be easily achieved. It is possible to switch between pulse and GND.

  8 and 9 are longitudinal sectional views showing an example of manufacturing steps of the droplet discharge head 100 according to the first embodiment. An example of a method for manufacturing the droplet discharge head 100 is shown here, but the present invention is not limited to this. First, the cavity substrate 3 having a thickness of, for example, 525 μm is anodically bonded to the electrode substrate 4 on which the individual electrodes 17 and the ink supply holes 11 are formed (a). The droplet discharge head 100 is manufactured by forming the electrode substrate 4 of borosilicate glass and forming two electrode rows on the electrode substrate 4.

  Here, an example of the manufacturing method of the electrode substrate 4 will be briefly described. First, a resist is applied to the entire surface of the glass substrate and patterned into a predetermined shape, and then etched with a hydrofluoric acid aqueous solution or the like to form a recess 12 to peel off the resist. Then, ITO is formed on the entire surface where the recess 12 is formed by sputtering or the like, a resist is applied to the surface of the ITO and patterned, and after the individual electrodes 17 are formed by etching, the resist is peeled off. The ink supply hole 11 can be formed by a drill or the like.

  Next, the cavity substrate 3 is thinned by mechanical grinding so that the thickness of the cavity substrate 3 is 140 μm (b). In addition, it is desirable to remove the work-affected layer generated on the surface of the cavity substrate 3 with a potassium hydroxide aqueous solution or the like after mechanical grinding. Then, an oxide film is formed on the surface of the cavity substrate 3 by plasma CVD using a TEOS film (Tetra Ethyl Ortho Silicate) or the like (c), and then a resist is applied to the oxide film surface to apply the pressure chamber 7, the first hole 22, and ink supply. The shape of the hole 11 and the through hole 26 (not shown) which is a characteristic part of the first embodiment is patterned (d).

  Then, the cavity substrate 3 is etched with, for example, an aqueous potassium hydroxide solution to form the pressure chamber 7, the first hole 22, the ink supply hole 11, and the through hole 26, and the oxide film is peeled off (e). If the boron doped layer is formed on the cavity substrate 3 as described above, the boron doped layer remains as a thin film such as the diaphragm 8. Thereafter, the silicon thin film remaining in the first hole 22, the ink supply hole 11 and the through hole 26 is removed by RIE (Reactive Ion Etching) or the like, and the first hole 22, the ink supply hole 11 and the through hole 26 are removed. (F).

  Then, the driver IC 15 is prepared, and the driver IC 15 is mounted on the electrode substrate 4 so as to be connected to the individual electrodes 17 constituting the two electrode rows in the first hole portion 22 (g). The driver IC 15 may be mounted by attaching an anisotropic conductive ACF (Anisotropic Conductive Film) or ACP (Anisotropic Conductive Paste) to a connection terminal formed below the driver IC 15.

  The sealing member 14 is formed in the first hole 22 to seal the IC output mounting portion 18 where the individual electrode 17 and the driver IC 15 are connected and the gap 13 between the diaphragm 8 and the individual electrode 17 (h ). At this time, a portion of the individual electrode 17 that is not sealed with the sealing member 14 is covered with the sealing member 14. In the case where a resin such as polyparaxylene is used as a material, the sealing member 14 can be formed by applying a sealing material at a predetermined position with a needle. Further, when a metal material such as silicon oxide, aluminum oxide, silicon oxynitride, or silicon nitride is used as the material of the sealing member 14, it can be formed by CVD using a mask made of silicon or the like. In consideration of damage to the driver IC 15 and the like, the driver IC mounting step (g) and the vibration chamber sealing step (h) may be interchanged.

  Next, the reservoir substrate 2 is bonded to the surface of the cavity substrate 3 where the pressure chambers 7 are formed (i). At this time, the first hole portion 22 and the second hole portion 23 communicate with each other to form the accommodating portion 24. When the reservoir substrate 2 is joined, an adhesive is injected into the through hole 26, and the adhesive functions as a sealing material, whereby the IC input mounting portion 20 is sealed (sealed). ing. That is, the gap between the IC input mounting portion 20 and the FPC mounting portion 21 is blocked by the adhesive so that cutting water or the like does not enter (see FIG. 5).

  In the reservoir substrate 2, a reservoir 10 for supplying droplets to the pressure chamber 7 in advance, a supply hole 9 for transferring droplets from the reservoir 10 to the pressure chamber 7, and droplets from the pressure chamber 7 to the nozzle hole 5 are provided. The nozzle communication hole 6 to be transferred and the second hole portion 23 are preferably formed. The reservoir substrate 2 is formed by forming a silicon oxide film on the silicon substrate, patterning a resist on the surface of the silicon oxide film to etch a predetermined portion of the silicon oxide film, and then etching the silicon substrate with a potassium hydroxide aqueous solution or the like. Can be formed.

  Then, the nozzle substrate 1 in which the nozzle holes 5 are formed by ICP (Inductively Coupled Plasma) discharge or etching or the like is bonded to the reservoir substrate 2 using an adhesive or the like (j). Finally, the bonded substrate to which the electrode substrate 4, the cavity substrate 3, the reservoir substrate 2, and the nozzle substrate 1 are bonded is diced (cut) to complete each droplet discharge head 100. During this dicing, cutting water is generated. If this cutting water enters the IC input mounting portion 20, it will lead to a failure (electric corrosion, disconnection) of the droplet discharge head 100. Therefore, the gap between the IC input mounting portion 20 and the FPC mounting portion 21 is sealed to prevent the intrusion of cutting water.

  As described above, the first hole portion 22 is provided in the cavity substrate 3, the second hole portion 23 is provided in the reservoir substrate 2, and the accommodating portion 24 is formed by the first hole portion 22 and the second hole portion 23. In addition, since the driver IC 15 is accommodated in the accommodating portion 24, the size of the droplet discharge head 100 can be reduced. Therefore, the distance between the printing paper and the nozzle hole 5 can be reduced, and high-definition printing is possible. Further, since the surface on which the nozzle holes 5 are formed can be flattened, wiping (a step of removing unnecessary droplets) can be easily performed.

Embodiment 2. FIG.
In the second embodiment, the sealing material injected into the through-hole 26 is not an adhesive for adhesively bonding the cavity substrate 3 and the reservoir substrate 2 but a sealing member 14 for sealing the gap 13. Explain the case. Other basic configurations are the same as or equivalent to those of the droplet discharge head 100 according to the first embodiment, and thus the same reference numerals are given and description thereof is omitted.

  In the second embodiment, as shown in the manufacturing process of the droplet discharge head 100 according to the first embodiment, when the gap 13 is sealed (see FIG. 9H), the FPC mounting portion 21 and the IC input are input. The mounting part 20 is also sealed together. That is, the sealing member 14 for sealing the gap 13 is injected into the through hole 26 to seal the IC input mounting portion 20 so that the cutting water does not enter.

  FIG. 10 is an explanatory diagram showing that a TEOS film is formed in the through hole 26 to seal between the FPC mounting portion 21 and the IC input mounting portion 20. A case where a TEOS film is formed in the through hole 26 will be described with reference to the drawings. The manufacturing process before the gap 13 is sealed is the same as the manufacturing process shown in the first embodiment. When the gap 13 is sealed, a TEOS film as the sealing member 14 is also formed in the through hole 26. When the TEOS film is formed, a mask 27 is prepared to protect a portion where the TEOS film is not desired to be formed. The mask 27 is set on the cavity substrate 3, and a TEOS film is formed in the through hole 26. Thereafter, the mask 27 is peeled off, and the reservoir substrate 2 is adhesively bonded.

  That is, a through hole 26 is formed in the partition wall 25 of the cavity substrate 3, and a TEOS film as the sealing member 14 is formed in the through hole 26, thereby sealing between the FPC mounting unit 21 and the IC input mounting unit 20. It is stopped (sealed). In this way, the through hole 26 can be formed together with the formation of the first hole portion 22 of the cavity substrate 3, and can be manufactured by a simple work process (see FIG. 8). In order to set the mask 27, the manufacturing process of the mask 27 is required separately. However, since the mask 27 is peeled off, the structure itself is not complicated and the structure itself is simple.

  Therefore, the size of the droplet discharge head 100 can be reduced, and failure (electric corrosion, disconnection) due to penetration of cutting water or the like into the IC input mounting unit 20 can be prevented. Here, the case where the sealing member 14 is a TEOS film is shown as an example, but the present invention is not limited to this. For example, the sealing member 14 can be made of a resin such as polyparaxylene, or a metal system such as silicon oxide, aluminum oxide, silicon oxynitride, or silicon nitride.

Embodiment 3 FIG.
In the third embodiment, a case where the space between the FPC mounting part 21 and the IC input mounting part 20 is sealed with an anisotropic conductive adhesive (ACF, ACP) for mounting the driver IC 15 will be described. Since the other basic configuration is the same as or equivalent to that of the droplet discharge head 100 according to the first and second embodiments, the same reference numeral is given and the description thereof is omitted. Moreover, in order to seal between the FPC mounting part 21 and the IC input mounting part 20 with an anisotropic conductive adhesive, the through hole 26 may not be formed.

  FIG. 11 is an explanatory diagram showing sealing between the FPC mounting part 21 and the IC input mounting part 20 with an anisotropic conductive adhesive. In the third embodiment, as shown in the manufacturing process of the droplet discharge head 100 according to the first embodiment, the driver IC 15 is mounted with an anisotropic conductive adhesive (see FIG. 9G). ), The anisotropic conductive adhesive also seals between the FPC mounting portion 21 and the IC input mounting portion 20 together. That is, the anisotropic conductive adhesive is applied not only to the IC input mounting portion 20 and the IC output mounting portion 18 but also to the entire first hole portion 22 to mount the driver IC 15, and the IC input mounting portion 20 is sealed. The cutting water is prevented from entering.

  A case where an anisotropic conductive adhesive is applied to the first hole 22 will be described with reference to the drawings. The manufacturing process before mounting the driver IC 15 is the same as the manufacturing process shown in the first embodiment. Then, when mounting the driver IC 15, an anisotropic conductive adhesive is applied to the entire first hole 22. Note that the anisotropic conductive adhesive is applied in an amount necessary to seal between the FPC mounting portion 21 and the IC input mounting portion 20.

  That is, the mounting of the driver IC 15 and the sealing (sealing) between the FPC mounting unit 21 and the IC input mounting unit 20 are performed at the same time. By doing so, the IC input mounting portion 20 can be sealed together with the mounting of the driver IC 15 and the through hole 26 is not formed, so that it can be manufactured by a simple manufacturing process ( (See FIG. 9). Furthermore, since addition of new parts or the like is not required, the structure itself is simplified without a complicated structure.

  Therefore, the size of the droplet discharge head 100 can be reduced, and failure (electric corrosion, disconnection) due to penetration of cutting water or the like into the IC input mounting unit 20 can be prevented.

Embodiment 4 FIG.
FIG. 12 is a perspective view showing an example of a droplet discharge device 150 on which the droplet discharge head 100 obtained by the manufacturing method of any one of Embodiments 1 to 3 is mounted. A droplet discharge device 150 shown in FIG. 10 is a general inkjet printer. The droplet discharge device 150 can be manufactured by a known manufacturing method. In the droplet discharge head 100 obtained in any one of the first to third embodiments, the cutting water does not enter the IC input mounting unit 20 as described above.

  In addition, the droplet discharge head 100 obtained by the manufacturing method of Embodiment 1 can manufacture a color filter for a liquid crystal display by changing the droplets in addition to the droplet discharge device 150 shown in FIG. The present invention can also be applied to formation of a light emitting portion of an organic EL display device, discharge of a biological liquid, and the like. Further, the droplet discharge head 100 obtained by the manufacturing method of Embodiment 1 can be used for a piezoelectric drive type droplet discharge device and a bubble jet (registered trademark) type droplet discharge device. In addition, the manufacturing method of the droplet discharge head and the manufacturing method of the droplet discharge device of the present invention are not limited to the contents described in the embodiment of the present invention, and are changed within the scope of the idea of the present invention. be able to.

2 is an exploded perspective view of a droplet discharge head according to Embodiment 1. FIG. It is A-A 'longitudinal cross-sectional view in the state where a droplet discharge head was assembled. It is a B-B 'vertical sectional view of a state where a droplet discharge head is assembled. It is explanatory drawing for demonstrating the cavity board | substrate which formed the through-hole. It is a B-B 'longitudinal sectional view of a droplet discharge head assembled by injecting a sealing material into a through hole. It is a schematic block diagram which shows the control system of a droplet discharge apparatus. It is a schematic block diagram which shows an example of an internal structure of a driver IC and a COM generation circuit. It is a longitudinal cross-sectional view which shows an example of the manufacturing process of a droplet discharge head. It is a longitudinal cross-sectional view which shows an example of a manufacturing process of a droplet discharge head. It is explanatory drawing which shows forming a TEOS film | membrane in a through-hole and sealing an IC input mounting part. It is explanatory drawing which shows sealing between an FPC mounting part and an IC input mounting part with an anisotropic conductive adhesive. It is the perspective view which showed an example of the droplet discharge apparatus carrying a droplet discharge head.

Explanation of symbols

  1 nozzle substrate, 2 reservoir substrate, 3 cavity substrate, 4 electrode substrate, 5 nozzle hole, 6 nozzle communication hole, 7 pressure chamber, 8 diaphragm, 9 supply hole, 10 reservoir, 11 ink supply hole, 12 recess (groove) , 13 Gap, 14 Sealing member, 15 Driver IC, 16 Common electrode, 17 Individual electrode, 18 IC output mounting portion, 20 IC input mounting portion 20, 21 FPC mounting portion, 22 First hole portion, 23 Second Hole, 24 Housing, 25 Bulkhead, 26 Through-hole, 27 Mask, 30 FPC, 31 FPC internal wiring (COM), 32 FPC internal wiring (IC input), 50 Control device, 51 CPU, 52 bus, 53 Internal bus 54 ROM, 55 RAM, 56 Character generator, 57 Theoretical gate array, 58 Drive pulse generation circuit, 59 COM generation times , 60 external device, 65 a connector, 70 power supply circuit, 100 a droplet discharge head, 150 droplet discharge device.

Claims (11)

A nozzle substrate on which nozzle holes for discharging droplets are formed;
A cavity substrate in which a bottom wall forms a vibration plate and a recess serving as a pressure chamber for storing the droplets is formed;
An electrode substrate on which an individual electrode that faces the diaphragm and drives the diaphragm is formed;
A recess serving as a reservoir for supplying droplets to the pressure chamber; a supply hole for supplying droplets from the reservoir to the pressure chamber; and a nozzle communication hole for transferring droplets from the pressure chamber to the nozzle holes; A reservoir substrate having
The electrode substrate is provided with a groove for mounting a driver IC for supplying a drive signal to the individual electrode and a flexible printed circuit for supplying an input signal for driving the driver IC.
The cavity substrate is provided with a hole for accommodating the driver IC,
Between the hole portion of the cavity substrate and the side on which the flexible printed circuit board is mounted, the gap is formed between the groove substrate and the cavity substrate by joining the electrode substrate and the cavity substrate. Through hole formed
A droplet discharge head characterized by that. The droplet discharge head according to claim 1, wherein the gap is sealed with a sealing material. The droplet discharge head according to claim 2, wherein the gap is sealed with an adhesive that joins the cavity substrate and the reservoir substrate. The droplet discharge head according to claim 2, wherein the gap is sealed with a sealing member that seals a connection portion between the individual electrode and the driver IC. A nozzle substrate on which nozzle holes for discharging droplets are formed;
A cavity substrate in which a bottom wall forms a vibration plate and a recess serving as a pressure chamber for storing the droplets is formed;
An electrode substrate on which an individual electrode that faces the diaphragm and drives the diaphragm is formed;
A recess serving as a reservoir for supplying droplets to the pressure chamber; a supply hole for supplying droplets from the reservoir to the pressure chamber; and a nozzle communication hole for transferring droplets from the pressure chamber to the nozzle holes; A reservoir substrate having
The electrode substrate is provided with a groove for mounting a driver IC for supplying a drive signal to the individual electrode and a flexible printed circuit for supplying an input signal for driving the driver IC.
A liquid produced by sealing the gap formed between the groove and the cavity substrate by joining the electrode substrate and the cavity substrate with an anisotropic conductive adhesive that mounts the driver IC in the groove. Drop ejection head. A droplet discharge apparatus comprising the droplet discharge head according to claim 1. An electrode substrate in which individual electrodes are formed and provided with grooves for mounting a driver IC that supplies a drive signal to the individual electrodes and a flexible printed circuit board that supplies an input signal for driving the driver IC, Bonding the cavity substrate forming the liquid flow path;
The cavity substrate has a diaphragm whose bottom wall forms a vibration plate and serves as a pressure chamber for storing droplets, and a gap formed between the groove and the cavity substrate by joining the electrode substrate and the cavity substrate. Forming a through-hole communicated with,
Injecting an adhesive into the through-hole, applying the adhesive to the cavity substrate, and supplying a droplet from the reservoir to the pressure chamber, a recess serving as a reservoir for supplying the droplet to the pressure chamber And a step of joining a reservoir substrate having a nozzle communication hole for transferring droplets from the pressure chamber to the nozzle hole to the cavity substrate. . An electrode substrate in which individual electrodes are formed and provided with grooves for mounting a driver IC that supplies a drive signal to the individual electrodes and a flexible printed circuit board that supplies an input signal for driving the driver IC, Bonding the cavity substrate forming the liquid flow path;
The cavity substrate has a diaphragm whose bottom wall forms a vibration plate and serves as a pressure chamber for storing droplets, and a gap formed between the groove and the cavity substrate by joining the electrode substrate and the cavity substrate. Forming a through-hole communicated with,
Mounting a driver IC for supplying a driving signal to the individual electrodes on the electrode substrate;
A step of injecting the sealing member into the through-hole when the gap formed between the individual electrode and the pressure chamber is sealed with a sealing member. Manufacturing method of the head. The method for manufacturing a droplet discharge head according to claim 7 or 8, wherein the through hole is formed by wet etching or dry etching. An electrode substrate in which individual electrodes are formed and provided with grooves for mounting a driver IC that supplies a drive signal to the individual electrodes and a flexible printed circuit board that supplies an input signal for driving the driver IC, Bonding the cavity substrate forming the liquid flow path;
Forming a recess in the cavity substrate, the bottom wall of which forms a diaphragm and serves as a pressure chamber for storing droplets;
An anisotropic conductive adhesive is injected into a gap formed between the groove and the cavity substrate by joining the electrode substrate and the cavity substrate, and a drive signal is applied to the individual electrodes with the anisotropic conductive adhesive. And a step of mounting a driver IC for supplying a liquid crystal. A method for manufacturing a droplet discharge device, wherein the method for manufacturing a droplet discharge head according to any one of claims 7 to 10 is applied to manufacture a droplet discharge device.

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