JP2006093710A - Substrate-processing equipment - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To facilitate maintenance of a substrate transfer mechanism, by moving the substrate transfer mechanism below a grating floor surface. <P>SOLUTION: Substrate processing equipment 610 is mounted on a grating 605 and arranged at a second-floor section 602 in the space above the grating 605. The substrate-processing equipment 610 comprises a plurality of processing units and a main transfer robot MTR. The plurality of processing units are provided so as to enclose the main transfer robot MTR. An elevator mechanism 615 lifts and lowers the main transfer robot MTR, between the second-floor section 602 above the grating 605 and a first-floor section 601 therebelow. The main transfer robot MTR can be sujected to maintenance from every direction, by lowering the main transfer robot MTR to the first-floor section 601 using the elevator mechanism 615. <P>COPYRIGHT: (C)2006,JPO&NCIPI

Description

  The present invention relates to a substrate processing apparatus for processing various types of substrates such as semiconductor wafers, glass substrates for liquid crystal display devices, and glass substrates for PDP (plasma display panels).

  In a semiconductor device manufacturing process, a series of processes including a plurality of processes is performed on a semiconductor wafer. For this purpose, a substrate processing apparatus that automates processing of semiconductor wafers is provided with a plurality of processing chambers, and a series of processing is performed on the wafers as they move across the processing chambers in a predetermined order. Go. In order to carry wafers into a plurality of processing chambers in order, this type of apparatus is provided with a transfer robot for carrying wafers into and out of the processing chambers.

  A typical prior art of such a substrate processing apparatus is disclosed in Patent Document 1, for example. The substrate processing apparatus described in this patent publication includes a transfer robot that reciprocates linearly along a straight transfer path, a plurality of processing units that are arranged on both sides of the transfer path, and an unprocessed portion. A loading / unloading robot is provided for taking out the wafer from the cassette and delivering it to the transfer robot, and receiving the processed wafer from the transfer robot and storing it in the cassette.

The loading / unloading robot is disposed at one end of the conveyance path, and travels in a direction parallel to and perpendicular to the conveyance path. A plurality of cassettes are arranged at a position accessible by the carry-in / carry-out robot, and the carry-in / carry-out robot can access any cassette by reciprocating linearly traveling along the sub-transport path.
Each of the transfer robot and the loading / unloading robot includes a hand for holding the wafer. The hand is attached to a housing capable of rotating around a vertical axis and moving up and down in the vertical direction so that it can slide along the horizontal direction. It is configured as follows.

  When processing wafers, the loading / unloading robot travels along the sub-transport path to take out an unprocessed wafer from an arbitrary cassette and travels to a standby position near one end of the transport path. At this standby position, the wafer is transferred between the loading / unloading robot and the transfer robot. Next, the transfer robot travels on the transfer path to the front of one processing unit, and loads an unprocessed wafer into the processing unit. When the processing of the wafer in this processing unit is completed, the transfer robot takes out the wafer from the processing unit, travels along the transfer path, moves to another processing unit, and loads the wafer into the other processing unit. .

  Similarly, a plurality of processing units are loaded with wafers in a predetermined order, and a series of processing is performed. The wafer that has undergone this series of processing is transferred to the vicinity of one end of the transfer path by the transfer robot, and is transferred to the loading / unloading robot. The loading / unloading robot travels along the sub-transport path in a direction parallel to and perpendicular to the transport path, and stores the received wafer in an arbitrary cassette.

On the opposite side of the transfer path from the carry-in / carry-out robot, an interface unit for connecting other processing apparatuses is provided as necessary. The interface unit has a mounting table on which a wafer is temporarily mounted for delivery of wafers between processing apparatuses.
The first problem of this prior art is that the linear conveyance path occupies a large area in plan view, which increases the footprint of the apparatus. In addition, since the transfer robot itself moves on the transfer path, a processing unit or the like cannot be arranged on the transfer path.

  The second problem is that the transfer robot and the carry-in / carry-out robot each travel in a straight line, and therefore sliding on a guide rail for guiding this straight travel is inevitable. Particles generated by this sliding cause a reduction in wafer processing quality. Moreover, there is no method for effectively sealing the linear sliding mechanism at a low cost, and it is extremely difficult to take measures against the generation of particles.

A third problem is that, when another processing apparatus is connected via the interface unit, it is necessary to provide a mounting table for transferring wafers outside the transfer path, which increases the footprint of the entire apparatus. It is.
Furthermore, the fourth problem is that both sides of the transport path are surrounded by a plurality of processing units, a loading / unloading robot is disposed at one end of the transport path, and an interface unit is disposed at the other end of the transport path. Therefore, the worker cannot access the transfer robot arranged on the transfer path. That is, the maintenance of the transfer robot is extremely difficult. In addition, since guide rails for guiding the linear reciprocating travel of the transfer robot are arranged in the transfer path, the worker needs to pay sufficient attention to the guide rails during maintenance. This also contributes to the difficulty of maintenance work.

  Patent Document 2 discloses another prior art of a substrate processing apparatus for processing a wafer. This substrate processing apparatus includes a main transfer robot disposed in the center in plan view. The main transfer robot includes a hand for holding a wafer, a transfer base for holding the hand slidably along a horizontal direction, and an elevating mechanism for raising and lowering the transfer base along a vertical axis. And a rotation mechanism for rotating the transport base around the vertical axis.

In order to allow the main transfer path robot to move up and down, a main transfer chamber extending in the vertical direction is provided. Around the main transfer chamber, a plurality of processing unit groups are arranged in a cluster shape in plan view, and each processing unit group includes a plurality of processing units stacked in multiple stages in the vertical direction.
A cassette station is provided at a position facing the main transfer robot across one processing unit group among the plurality of processing unit groups. The cassette station is provided with a carry-in / carry-out robot that travels linearly on a straight conveyance path, and a cassette placement unit that can place a plurality of cassettes along the conveyance path. The loading / unloading robot includes a hand for holding the wafer, a transfer base for holding the hand so that the slide movement along the horizontal direction is possible, an elevating mechanism for raising and lowering the transfer base, and the transfer A rotation mechanism that rotates the base around a vertical axis.

On the other hand, on the side opposite to the cassette station with respect to the main transfer robot, an interface unit for connecting other devices is provided. This interface unit is provided with a robot having substantially the same configuration as the cassette station loading / unloading robot.
With this configuration, the loading / unloading robot takes out an unprocessed wafer from an arbitrary cassette, and passes through the wafer transfer unit provided in the processing unit group disposed between the main transfer robot and the main transfer robot. Deliver the wafer. The main transfer robot carries the received wafer into one processing unit. When the processing of the wafer in this processing unit is completed, the main transfer robot takes out the wafer and carries it into another processing unit. Similarly, the wafer is processed in a plurality of processing units, and the wafer after the series of processing is performed in this manner is transferred to the loading / unloading robot of the cassette station via the wafer transfer unit. The loading / unloading robot stores the received wafer in an arbitrary cassette.

When further processing in another substrate processing apparatus is required, the main transfer robot passes through the wafer transfer unit provided in one processing unit group disposed between the interface unit and the interface unit. Deliver the board.
In this substrate processing apparatus, in order to facilitate maintenance of the main transfer robot, one of a plurality of processing unit groups arranged around the main transfer chamber is configured to be slidable. That is, the worker can access the main transfer robot in the main transfer chamber by sliding one processing unit group.

However, in this prior art, in order to ensure the maintainability of the main transfer robot, one processing unit group can be slid, and the configuration of the apparatus is complicated. That is, when sliding a processing unit group, pipes such as chemicals and compressed air connected to the processing unit group, and wirings such as a power supply line and a signal line are disconnected or guided by a cable bear or the like. It is necessary to do. Moreover, even if the processing unit group is slid, maintenance can only be performed from one direction, and it cannot always be said that maintenance work is easy.
Japanese Patent No. 2519096 JP-A-8-46010

  SUMMARY OF THE INVENTION An object of the present invention is to provide a substrate processing apparatus that can facilitate maintenance of a substrate transport mechanism.

  The invention described in claim 1 for achieving the above object is a substrate processing apparatus placed on a grating floor, a plurality of processing units for performing a series of processing on the substrate, and a bottom surface of the substrate processing apparatus A substrate carrying mechanism fixed to the unit, surrounded by the plurality of processing units, and disposed below the grating floor, and a substrate conveyance mechanism for conveying the substrate to the plurality of processing units. The substrate processing apparatus includes a moving means for moving the substrate transport mechanism, and is capable of maintaining the substrate transport mechanism in a space below the grating floor (see FIG. 26).

According to this configuration, the substrate transport mechanism is maintained with good workability by moving the substrate transport mechanism below the grating floor surface even though the substrate transport mechanism is surrounded by the processing unit. be able to. Further, since it is not necessary to provide a maintenance area in the apparatus, space saving of the apparatus is realized.
In addition, since the transfer platform of the substrate processing apparatus is fixed to the bottom surface of the substrate processing apparatus, the footprint of the apparatus can be reduced and particle countermeasures can be achieved compared to the prior art configuration in which the substrate transfer mechanism travels. Easy.

The invention according to claim 2 is a substrate processing apparatus placed on the grating floor surface,
A processing unit for processing a substrate; a cassette mounting unit for mounting a cassette capable of storing a plurality of substrates; and a transport table fixed to a bottom surface of the substrate processing apparatus. A grating floor including a substrate transport mechanism for transporting the substrate to the processing unit and a moving means for moving the substrate transport mechanism below the grating floor surface. A substrate processing apparatus characterized in that the substrate transport mechanism can be maintained in a space below the surface.

According to this configuration, although the substrate transport mechanism is surrounded by the processing unit and the cassette mounting unit, the substrate transport mechanism is moved downward from the grating floor surface, so that the maintenance of the substrate transport mechanism is good. It can be done with good workability. Further, since it is not necessary to provide a maintenance area in the apparatus, space saving of the apparatus is realized.
Further, as in the case of the first aspect of the invention, since the carrier table of the substrate processing apparatus is fixed to the bottom surface of the substrate processing apparatus, the footprint of the apparatus can be reduced and particle countermeasures are easy.

According to a third aspect of the present invention, the substrate transport mechanism may further contain or take out a substrate from the cassette.
According to this configuration, since the substrate transfer mechanism also transfers the substrate to the cassette, a space for the dedicated robot transfer path for loading / unloading the substrate from / to the cassette becomes unnecessary, and the space of the apparatus can be saved. realizable. In addition, since the substrate can be carried out or carried into the cassette without using a dedicated robot that travels in a straight line, generation of particles can be further suppressed.

Furthermore, since a single substrate transport mechanism transports the substrate between the cassette and the processing unit, a transfer table and a substrate alignment mechanism are not required as compared with the case where this is performed by two robots. Therefore, the conveyance tact can be improved.
It is preferable that a partition wall having an opening through which the substrate passes is provided between the cassette mounting portion and the substrate transport mechanism, and a shutter mechanism for opening and closing the partition wall opening is provided. (Refer to FIG. 21. However, it can also be applied to the configurations of FIGS. 19, 20, 22 to 25).

  According to this configuration, by closing the opening of the partition wall with the shutter mechanism except when the substrate passes, the particles from the substrate transport mechanism, the processing liquid and processing gas from the processing unit reach the cassette mounting unit. Can be prevented. Thereby, it can prevent that a particle, a processing liquid, etc. adhere to the cassette in a cassette, or the bad influence by processing gas is given.

Preferably, the moving means includes a driving means for moving means for generating a driving force for raising and lowering the substrate transport mechanism. As a result, the substrate transport mechanism can be easily moved to a space below the grating, so that maintenance is facilitated.
The air pressure in the space below the grating is preferably adjusted to be lower than the air pressure in the space above the grating. Thereby, a favorable downflow can be formed in the space above the grating, and this space can be kept clean.

  According to a fourth aspect of the present invention, the substrate transport mechanism includes the transport table, and a first rotating member coupled to the transport table so as to be rotatable about a first rotation drive shaft substantially along the vertical direction. A first driving source for rotationally driving the first rotating member, and a second rotating member coupled to the first rotating member so as to be rotatable about a second rotating drive shaft substantially along the vertical direction. And a second drive source for rotationally driving the second rotary member, and the second rotary member connected to the second rotary member so as to be rotatable about a third rotary drive shaft substantially along the vertical direction, and holding the substrate The substrate processing apparatus according to claim 1, further comprising a substrate holding unit capable of performing rotation and a third drive source for rotationally driving the substrate holding unit. (See FIG. 1 to FIG. 10, FIG. 12, FIG. 17 to FIG. 25, etc.)

  According to the above configuration, the substrate transport mechanism can transport the substrate in the horizontal direction without accompanying linear sliding. That is, the substrate transfer in the horizontal direction is realized only by the rotation operation. In the pivoting operation, the pivoting / sliding distance is shorter than that in the case of linear sliding, so that the particles generated during the sliding are reduced, and the seal in the pivoting part is generally inexpensive. Therefore, it is easy to take measures against the generation of particles from the rotating part.

  Further, since the substrate transport mechanism can transport the substrate in the horizontal direction by the rotation of the rotating member or the substrate holding means, even if the substrate transport mechanism itself does not travel in a straight line, even within the region where the substrate is transported by the substrate transport mechanism. If the height does not interfere with the operation of the rotating member of the substrate transport mechanism and the substrate holding means, the space becomes usable. That is, in this space, for example, a delivery table for delivering a substrate, an electrical component, a chemical solution cabinet, or another processing unit can be arranged. Thereby, since the space in the apparatus can be used effectively, the space of the apparatus can be saved.

  Further, the substrate transport mechanism independently attaches the first rotation member, the second rotation member, and the substrate holding means around the three axes of the first rotation drive shaft, the second rotation drive shaft, and the third rotation drive shaft. Since it is configured to be able to rotate freely, the substrate can be transported to an arbitrary position at an arbitrary angle within a certain range. Further, even within the range outside the certain range, the substrate can be transported as long as the substrate holding means can be reached. Therefore, the processing unit can be laid out much more freely as compared with the second prior art main transfer robot that can transfer the substrate only in the radial direction, thereby saving the space of the apparatus. Realized.

In addition, since the substrate transport mechanism itself does not need to run horizontally, wiring such as a power supply line and a signal line to the substrate transport mechanism and piping for supplying gas and liquid need to move together with the substrate transport mechanism. There is no. Therefore, the wiring and piping are not damaged, and the generation of particles due to the wear can be suppressed.
Furthermore, since it is not necessary for the substrate transport mechanism itself to travel, there is no fear that the air current in the transport area will be disturbed due to the large movement of the structure. Therefore, it is possible to prevent the particles from being rolled up, and there is no possibility that the downflow normally applied in the clean room is hindered.

At least one of the first rotating member, the second rotating member, and the substrate holding means has a plurality of arm portions that are rotatably connected to each other, and the arm extends and contracts using the connecting portions between the arm portions as joints. A mechanism may be provided (see FIGS. 8 and 9).
According to this configuration, by using the arm extension / contraction mechanism, at least one of the first rotation member, the second rotation member, and the substrate holding unit can be extended / contracted. Therefore, the rotation radius can be reduced by rotating the arm expansion / contraction mechanism in a contracted state. Therefore, the empty space can be increased in the transfer area, so that further space saving can be realized.

  Further, if it is not necessary to reduce the rotation radius, the substrate can be transported to a larger distance by extending the arm expansion / contraction mechanism, so that the substrate can be transported to more processing units. Thereby, when a substrate processing apparatus is comprised with many process parts, the conveyance of the board | substrate with respect to each process part can be achieved with a small number of substrate conveyance mechanisms. As a result, the cost of the apparatus can be suppressed. Furthermore, since the number of steps for transferring the substrate between the plurality of substrate transport mechanisms is reduced, the transport tact of the apparatus can be shortened.

  According to a fifth aspect of the present invention, the substrate transfer mechanism includes a pair of arm portions that are rotatably connected to the transfer stand, and the connection portions between the arm portions along the first horizontal direction. A first arm expansion / contraction mechanism attached to the transport table so as to be expandable / contractable as a joint, and a first arm that applies rotational force to the first arm expansion / contraction mechanism to expand / contract the first arm expansion / contraction mechanism. Arm extension / contraction drive source and a pair of arms connected to each other in a rotatable manner, and can extend / contract as a joint between the arms along the second horizontal direction perpendicular to the first horizontal direction. And a second arm telescopic mechanism connected to the first arm telescopic mechanism, and a second arm telescopic mechanism for extending and contracting the second arm telescopic mechanism to apply a rotational force to the second arm telescopic mechanism. Arm telescopic drive source and the second arm Provided compression mechanism, a substrate processing apparatus according to any one of claims 1 to 3, characterized in that it comprises a substrate holding means for holding a substrate (see FIG. 9).

  According to this configuration, the substrate holding means is transported along the second horizontal direction by the expansion and contraction of the second arm expansion / contraction mechanism. Further, the substrate holding means is transported along the first horizontal direction together with the second arm expansion / contraction mechanism by the expansion / contraction of the first arm expansion / contraction mechanism. Since the first horizontal direction and the second horizontal direction are orthogonal to each other, the substrate can be freely transported within a certain range after all.

In addition, if both the first arm extension mechanism and the second arm extension mechanism are contracted, the space for arranging the transfer mechanism itself becomes very small, so that the space in the apparatus can be afforded and the substrate processing apparatus can be saved. Space can be achieved.
Further, linear sliding in the horizontal direction is unnecessary, and movement of wiring and piping is also unnecessary. Therefore, the generation and winding of particles can be effectively prevented, and high-quality substrate processing can be achieved. Also, since the layout of the apparatus is not restricted more than necessary, it is possible to save the apparatus space.

It is preferable that the first arm extension / contraction mechanism is connected to the transport table so as to be rotatable about a rotation drive shaft substantially along the vertical direction. In this case, it is preferable that the substrate transport mechanism further includes a rotational drive source for rotationally driving the first arm extendable mechanism around the rotational drive shaft (see FIG. 9).
According to this configuration, since the first arm extending / contracting mechanism can be rotated, the substrate can be carried out or carried in an arbitrary direction with respect to the processing unit as long as the substrate holding means can be reached. As a result, the degree of freedom in the layout of the device is further increased, so that space saving can be further advantageously achieved. Further, since the range in which the substrate can be transported by the substrate holding means is widened, the substrate can be transported to more processing units. Thereby, since the ratio of the number of substrate transport mechanisms to the number of processing units can be reduced, it is possible to contribute to cost reduction of the substrate processing apparatus. The substrate transport mechanism is further interposed at any position between the transport platform and the substrate holding means, and is coupled to be rotatable about a rotational drive shaft extending substantially in the horizontal direction at the position. And a lifting drive source for rotationally driving the lifting rotary member. (See FIG. 10).

  According to this configuration, the substrate holding means can be raised and lowered by rotating the lifting rotary member. Accordingly, the linear sliding is eliminated even when the substrate holding means is raised and lowered. As a result, the generation of particles can be more effectively suppressed. In addition, since there is no straight sliding portion that is difficult to seal, the problem of corrosion due to the processing liquid is reduced, so that the durability of the substrate transport mechanism can be improved.

It is preferable to provide a magnetic fluid seal in association with the rotatably connected portion of the substrate transport mechanism.
According to this configuration, the generation of particles is prevented by axially sealing the rotation shaft of the portion of the substrate transport mechanism that is rotatably connected by the magnetic fluid seal. Furthermore, since it is possible to prevent the processing liquid and its atmosphere from entering the rotating portion, the durability of the substrate transport mechanism can be improved.

The substrate transport mechanism may include a plurality of the substrate holding means (see FIGS. 6 to 8, 12, and 18 to 25).
According to this configuration, by providing the plurality of substrate holding means, it is possible to quickly carry the substrate to the processing unit and carry out or carry the substrate into the processing unit. Thereby, the conveyance tact of an apparatus can be shortened.

The plurality of substrate holding means may operate independently of each other and transport the substrate to different processing units among the plurality of processing units (FIGS. 6, 7, and 12). (Applicable in the configuration of FIGS. 13 to 25).
According to this configuration, the plurality of substrate holding units can transport the substrate to different processing units, and thus can efficiently transport the substrate. Thereby, the conveyance tact of the apparatus can be further shortened.

The plurality of substrate holding means includes a substrate carrying-in hand for carrying a substrate into a specific processing unit among the plurality of processing units, and a substrate carrying-out hand for carrying out the substrate from the specific processing unit. Is preferable (see FIGS. 19 to 22).
According to this configuration, since the substrate can be held by different hands before and after the processing in the processing unit, the substrate before processing and the substrate after processing are physically (heated) to each other. , Moisture, particles, etc.) or chemical (chemicals, processing gas, etc.) can be prevented from affecting each other. This configuration is particularly effective in an apparatus for cleaning a substrate, and since a hand having a history of holding an uncleaned substrate does not hold a cleaned substrate after cleaning, the substrate after cleaning is recontaminated. Can be prevented.

The substrate holding means may be capable of holding a rectangular substrate (applicable in the configurations of FIGS. 12, 17 to 25).
According to this configuration, the square substrate is held by the substrate holding means, and the square substrate is transported to the processing unit and processed. In this case, the processing unit is configured to accommodate the rectangular substrate, but it is more space efficient to align the direction of the substrate and the direction of the processing unit. That is, when a square substrate is to be accommodated obliquely in the same rectangular processing unit, the processing unit has a substantially triangular space at the corner in plan view, and has a processing chamber much larger than the size of the substrate. Need to be. If a transfer robot capable of horizontal transfer only in the radial direction is used as in the second prior art, a situation may arise in which the rectangular substrate must be carried obliquely with respect to the processing unit. On the other hand, since the substrate transport mechanism provided in the substrate processing apparatus of the present invention can carry the substrate into the processing unit at any angle, the direction of the processing unit and the square substrate can be reliably matched. This can contribute to space saving of the device.

At least some of the processing units among the plurality of processing units may include a plurality of processing units arranged in a straight line substantially along the horizontal direction (FIGS. 12, 17 to 21, (See FIGS. 23 to 25).
By having a substrate transport mechanism that can carry out or carry in the substrate in any direction with respect to the processing unit, in the present invention, a plurality of processing units can be laid out freely. Therefore, since there is no restriction that a plurality of processing units must be arranged in a cluster shape, space saving of the apparatus can be realized by connecting a plurality of processing units linearly along the horizontal direction.

A plurality of the substrate transfer mechanisms may be provided. In this case, the substrate transfer mechanism further includes a substrate transfer table for transferring the substrates to each other between at least one pair of the substrate transfer mechanisms. It is preferable. (See FIG. 18, FIG. 22 to FIG. 25).
According to this configuration, since a plurality of substrate transport mechanisms are provided, the transport load per substrate transport mechanism is reduced, so that the transport tact can be improved. Further, since the substrate transfer mechanism does not need to travel in the horizontal direction, the substrate transfer table can be arranged in the transfer area. Therefore, since no special space is required for transferring the substrate, it is possible to realize a space saving of the apparatus.

At least one of the plurality of processing units may be a processing agent supply processing unit that supplies a processing agent to the substrate and performs processing on the substrate. (See FIGS. 12, 17 to 25).
Treatment agents include pure water, cleaning solution, etching solution, developing solution, resist solution, other acid / alkali solution, treatment solution such as ozone water and ion water, and treatment gas such as ozone gas, treatment solution mist and vapor. Is included.

  If the processing agent enters the inside of the substrate transport mechanism, rust may occur on the bearing of the rotating shaft. Therefore, by using the above-described substrate transport mechanism configured to be able to transport the substrate in the horizontal direction only by rotation, the rotary shaft can be easily sealed. Intrusion into the inside of the transport mechanism can be effectively prevented. Thereby, even if it is a case where the process part using a processing agent is provided, a board | substrate conveyance mechanism can have sufficient durability.

The processing agent supply processing unit may be a cleaning processing unit that supplies a cleaning liquid to the substrate to clean the substrate (see FIGS. 17 and 19 to 22).
In the cleaning processing unit, a large amount of cleaning liquid is used for processing, and a large amount of the cleaning liquid may enter the substrate transport mechanism, which may reduce the durability of the substrate transport mechanism. Therefore, by using the above-described substrate transport mechanism configured to be able to transport the substrate in the horizontal direction only by rotation, the rotation shaft can be easily sealed, and the durability of the substrate transport mechanism can be improved. Reduction can be effectively prevented. Furthermore, in particular, if the configuration is such that the hand is distinguished between the uncleaned substrate and the cleaned substrate, the cleaned substrate can be reliably prevented from being recontaminated.

The processing agent supply processing unit may be a post-CMP cleaning processing unit that supplies a cleaning liquid to a substrate that has been subjected to a CMP process and performs a cleaning process on the substrate (see FIG. 22).
In the post-CMP cleaning processing section, it is necessary to clean the substrate to which the abrasive (slurry) used in the CMP processing step is attached. Therefore, since the rotating shaft can be easily sealed by using the above-described substrate transport mechanism configured to transport the substrate in the horizontal direction only by rotation, the abrasive (slurry) is used. It is possible to effectively prevent the durability of the substrate transfer mechanism from being lowered by entering the substrate transfer mechanism.

Shower means for supplying pure water to the substrate held by the substrate holding means may be further provided (see FIG. 22).
According to this configuration, since the pure water can be supplied toward the substrate during the transport of the substrate, the substrate can be transported without drying. As a result, it is possible to prevent dirt on the surface of the substrate, such as slurry, from being dried and difficult to fall off, so that the cleaning effect can be enhanced.

Further, the above-described substrate transport mechanism configured to transport the substrate in the horizontal direction only by rotation can easily perform sealing near the rotation axis. , Can have sufficient waterproofness.
At least one of the plurality of processing units may be a chemical amplification type resist processing unit that performs chemical amplification type resist processing on the substrate (see FIGS. 18, 24, and 25).

  In this substrate processing apparatus, the apparatus space can be reduced and the processing section can be laid out freely, so that the installation area of the chemical adsorption filter necessary for the chemically amplified resist processing can be reduced, and the chemical processing It is also possible to concentrate the installation area of the adsorption filter on a part. Thereby, apparatus cost and running cost can be held down.

It is preferable that a transfer area, which is a range in which the substrate transfer mechanism moves, is provided with a maintenance area for maintaining at least one of the plurality of processing units or the substrate transfer mechanism (for example, FIG. 17). FIG. 27).
According to this configuration, it is possible to improve the maintainability of the substrate transfer mechanism and the processing unit by setting a part of the transfer area as a maintenance area. In the first prior art in which the transport robot travels in the transport path, it is difficult to provide a maintenance area because guide rails and the like exist in the transport path, but the substrate transport mechanism itself travels. In the configuration of the present invention that does not need to be performed, the maintenance area can be easily provided. Moreover, since there are no guide rails or the like in this maintenance area, maintenance can be performed with good workability.

Hereinafter, embodiments of the present invention will be described in detail with reference to the accompanying drawings.
Prior to the description of the substrate processing apparatus according to the embodiments of the present invention, the configuration of the substrate transfer robot that can be commonly applied to the apparatuses of the embodiments will be described.
FIG. 1A is a conceptual cross-sectional view for explaining the basic configuration of the substrate transfer robot, and FIG. 1B is a conceptual plan view of the substrate transfer robot. The substrate transfer robot is connected to a transfer table 1 to be fixed to a frame on the bottom surface of the substrate processing apparatus, and to the transfer table 1 so as to be rotatable around a first rotation drive axis θ1 along the vertical direction. A first arm 11 as a first rotation member, a first motor 21 as a first drive source for rotating the first arm 11 about the first rotation drive axis θ 1, and the first arm 11. The second arm 12 as a second rotating member rotatably connected around the second rotation drive axis θ2 along the vertical direction, and the second arm 12 for rotating around the second rotation drive axis θ2. A second motor 22 as a second drive source, a third arm 13 serving also as a substrate holding means connected to the second arm 12 so as to be rotatable about a third drive axis θ3 along the vertical direction, Third arm 13 is third And a third motor 23 as a third drive source for rotationally driving around the rotational drive shaft θ3. The tip of the third arm 13 is a hand 20 for holding the substrate W.

  The carriage 1 is provided with a screw shaft 2 along the Z direction which is the vertical direction, and a rotational force from the motor 3 is applied to the screw shaft 2 via a timing belt. . The screw shaft 2 is screwed with a ball nut provided in a lifting block 7 that moves up and down while supporting the first motor 21 and the like. The elevating block 7 supports the first motor 21, and the first motor 21 is connected so as to be able to rotate the first rotating member 11 via the first rotation drive shaft θ1 as described above. Has been.

The elevating block 7 is guided to be movable in the Z direction by a guide means such as a guide rail (not shown).
The motor 3 and the first to third motors 21, 22, and 23 are independently driven and controlled by the control unit 100.
FIG. 2 is a cross-sectional view for explaining a more specific configuration of the above-described substrate transfer robot, and FIG. 3 is a plan view thereof. The carriage 1 is generally formed in a rectangular cylinder shape, and a screw shaft 2 is disposed along the Z direction therein. A lifting block 7 having a built-in ball nut that is screwed onto the screw shaft 2 is attached to the middle portion of the screw shaft 2. The elevating block 7 can slide on the linear guide 8 provided on the inner side wall (a pair of inner side walls provided at the front and rear in FIG. 2) of the carrier 1 along the Z direction. .

A pulley 15 is fixed to the screw shaft 2. As shown in FIG. 4, the rotational force of the motor 3 is transmitted to the pulley 15 from a pulley 16 fixed to the drive shaft via a timing belt 17. Therefore, if the motor 3 is driven forward / reversely, the elevating block 7 moves up and down while sliding on the linear guide 8.
A lower end of the rotary shaft 31 is rotatably supported by the elevating block 7. In the vicinity of the lower end of the rotating shaft 31, a gear 25 is attached at a position above the lifting block 7. A first motor 21 is attached to the lifting block 7, and a gear 26 fixed to the drive shaft of the first motor 21 meshes with the gear 25 attached to the rotary shaft 31. . Therefore, the rotation shaft 31 can be rotated around the first rotation drive shaft θ1 by driving the first motor 21 forward / reversely.

Therefore, by driving and controlling the motor 3 and the first motor 21, the rotary shaft 31 can be moved up and down or rotated about the first rotary drive shaft θ1.
Here, the upper plate 9 closes the upper surface of the transfer table 1 in order to isolate the drive mechanism and the like inside the transfer table 1 and the space around the substrate transfer robot. The rotary shaft 31 penetrates through.

  A first arm 11 extending in the horizontal direction is fixed to the upper end of the rotating shaft 31. The first arm 11 is formed in a hollow flat plate shape, and the second motor 22 is fixed to the back cover portion 35 near the tip of the first arm 11 in a state where the drive shaft is accommodated in the internal space of the first arm 11. ing. The main body portion of the second motor 22 is accommodated in the internal space of the motor cover 36 fixed to the back cover portion 35 of the first arm 11. A gear 38 fixed to the drive shaft of the second motor 22 is accommodated in the internal space of the first arm 11.

  The second arm 12 extends in the horizontal direction to the tip of the first arm 11 so as to be rotatable about the second rotation drive shaft θ2. More specifically, the second arm 12 is formed in a hollow flat plate shape like the first arm 11, and a boss 45 is fixed downward near the base end portion thereof. A gear 46 accommodated in an internal space near the tip of the first arm 11 is fixed to the lower surface of the boss 45, and the gear 46 meshes with a gear 38 fixed to the drive shaft of the second motor 22. is doing. A bearing 47 fixed to the first arm 11 is fitted on the connecting portion between the boss 45 and the gear 46. With this configuration, when the second motor 22 is driven to rotate forward / reversely, the second arm 12 rotates about the second rotational drive shaft θ2.

  Near the tip of the second arm 12, a third arm 13 comprising a hand 20 for holding the substrate and a hand holding portion 19 for holding the hand 20 is rotatable about the third rotation drive axis θ3. It is connected as there is. Specifically, the hand holding part 19 has a long plate-like arm, and a third motor 23 is fixed on the upper surface of the base end part with the drive shaft facing downward. The third motor 23 is accommodated in a space in a motor cover 54 fixed to the upper surface side of the hand holding unit 19. The distal end of the drive shaft of the third motor 23 passes through a hole formed in the proximal end portion of the hand holding portion 19 and reaches the internal space near the distal end of the second arm portion 12, and is fixed to the distal end of the drive shaft. The gear (not shown) is engaged with a harmonic gear portion 56 accommodated therein and fixed to the second arm portion 12. Above the harmonic gear portion 56, a bearing 57 is provided at a connection portion between the hand holding portion 19 and the second arm portion 12. Therefore, when the third motor 23 is driven to rotate forward / reversely, the hand holding portion 19 fixed to the main body side of the third motor 23 rotates relative to the second arm 12. Become.

  The hand holding part 19 has a step part 58 that receives the base end part of the hand 20 on the upper surface at a position closer to the tip than the third motor 23. The base end portion of the hand 20 is fixed to the step portion 58 of the hand holding portion 19 with a bolt 59. The hand 20 has five substrate holding members 60 at substantially equal intervals at the periphery of the substrate S. The hand 20 is configured to hold the substrate S by making point contact with the lower surface of the substrate S. Yes.

  In order to supply power to the second motor 22 and the third motor 23, a cable outlet 61 for pulling out the cables 62 and 63 is formed near the upper end of the rotary shaft 31 near the attachment position of the first arm 11. ing. The cables 62 and 63 are wired through the space inside the first arm 11, and one of the cables 62 is connected to the second motor 22.

  A hole 65 is formed in the center of the gear 46 and the boss 45 provided near the tip of the first arm 11 for supplying power to the third motor 23. The cable 63 is guided to the internal space of the second arm 12 through the hole 65, and once pulled out to the outside through the cable fixing bracket 66 provided on the side surface of the second arm 12, Guided to a third motor 23 fixed to the portion 19.

  With the configuration as described above, the first motor 21, the second motor 22, and the third motor 23 are independently driven, whereby the first arm 11, the second arm 12, and the third arm 13 (the hand holding unit 19 and the hand). 20) can be freely rotated around the first rotation drive shaft θ1, the second rotation drive shaft θ2, and the third rotation drive shaft θ3, respectively. Further, by driving the motor 3, the entire first arm 11, second arm 12, and third arm 13 can be moved up and down in the Z direction. Thereby, the substrate S held by the third arm 13 can be transported to an arbitrary place at an arbitrary angle within a certain range.

  Specifically, the distance between the first rotation drive shaft θ1 and the second rotation drive shaft θ2 is L1, the distance between the second rotation drive shaft θ2 and the third rotation drive shaft θ3 is L2, and the first Assuming that the distance between the three rotation drive shaft θ3 and the center of the substrate S is L3, as shown in FIG. 5, in a region 101 in a circle having a radius of (L1 + L2−L3) with the first rotation drive shaft θ1 as the center. The substrate S can be transferred to an arbitrary place at an arbitrary angle. Even outside the region 101, the substrate S can be transported to an arbitrary position in the region 102 within a circle having a radius (L1 + L2 + L3), although the angle of the substrate S is limited to some extent.

  The above-described substrate transfer robot includes the first to third arms 11, 12, and 13 that can be independently rotated around the first to third rotation drive shafts θ 1, θ 2, and θ 3. Such a robot is called a “3θ robot”. In order to carry in / out a substrate to / from a processing unit for processing a substrate, it is preferable that the substrate transport robot includes a pair of hands that can access the processing unit independently. This is because a substrate that has been processed with one hand can be carried out of the processing unit, and an unprocessed substrate can be carried into the processing unit with the other hand, so that the substrate can be replaced at high speed. Hereinafter, a configuration including a pair of hands will be referred to as a “double hand”.

  FIG. 6 shows one configuration example of a double-handed 3θ robot. FIG. 6 (a) is a simplified side view, and FIG. 6 (b) is a simplified plan view. This robot is provided with a pair of robots configured as shown in FIGS. That is, the first robot unit 51 and the second robot unit 52 having substantially the same configuration as that shown in FIGS. 1 to 5 are provided. Each of the third arms 13 of the first robot unit 51 and the second robot unit 52 is configured to be able to hold the substrates S1 and S2 at positions that overlap each other. That is, the third arm 13 of the second robot unit 52 that holds the substrate S2 above rises in the middle, bends horizontally toward the first robot unit 51, and further bends forward. A hand holding unit 53 is provided.

  If the first robot unit 51 and the second robot unit 52 operate completely freely, the two robot units 51 and 52 may interfere with each other. Therefore, when the configuration shown in FIG. 6 is adopted, the control unit 100 (see FIG. 1) controls the operations of the robot units 51 and 52 so that the robot units 51 and 52 do not interfere with each other. It is necessary to add software restrictions.

  FIG. 7 shows another configuration example of the double-handed 3θ robot. FIG. 7 (a) shows a simplified side view, and FIG. 7 (b) shows a simplified plan view. Similar to the robot shown in FIG. 6, this robot also includes a first robot unit 71 and a second robot unit 72 having a configuration substantially similar to the configuration shown in FIGS. 1 to 5. However, as clearly shown in FIG. 7 (a), the first robot part 71 and the second robot part 72 are connected in the manner of connecting the first arm 11, the second arm 12 and the third arm 13. Is different. That is, the first robot unit 71 is configured by connecting the second arm 12 to the upper surface side of the tip of the first arm 11 and connecting the third arm 13 to the upper surface side of the tip of the second arm 12. On the other hand, in the second robot part 72, the second arm 12 is connected to the lower surface side of the tip of the first arm 11, and the third arm 13 is connected to the lower surface side of the tip of the second arm 12. Therefore, if the range of the first robot unit 71 and the second robot unit 72 in the Z direction is restricted, the first to third arms 11 to 13 of the first robot unit 71 and the second robot unit 72 are limited. Even if the first to third arms 11 to 13 rotate completely freely, there is no possibility of interference between the robot parts 71 and 72.

  In general, since a processed substrate is unloaded and a non-processed substrate is unloaded into a certain processing unit, there is little requirement that the pair of hands should be raised and lowered independently. The second robot unit 72 may be moved up and down in synchronization. Therefore, the 1st robot part 71 and the 2nd robot part 72 can also share the raising / lowering drive mechanism of a Z direction. The same applies to the robot having the configuration shown in FIG.

  In the configuration shown in FIG. 7, for example, the rotary shaft 31 of the first robot unit 71 arranged on the lower side is configured by a hollow shaft having a large inner diameter, and the rotary shaft 31 of the second robot unit 72 is small. The rotary shaft 31 on the second robot 72 side may be inserted into the rotary shaft 31 on the first robot 71 side by configuring the shaft with a solid diameter. Can be reduced.

  FIG. 8 shows still another configuration example of the double arm 3θ robot. FIG. 8 (a) shows a simplified side view, and FIG. 8 (b) shows a simplified plan view. The main difference between the robot shown in FIGS. 1 to 5 and the robot shown in FIG. 8 is that a pair of third arms 13A and 13B are connected to the tip of the second arm 12. And this pair of 3rd arms 13A and 13B has comprised what is called a scalar arm mechanism as an arm expansion-contraction mechanism, respectively. This scalar arm mechanism is, for example, as shown in Japanese Utility Model Publication No. 62-144186. By bending and extending the third arm 13A or 13B using a belt and a pulley, the posture of the substrate holding hand 83 can be changed. The substrate held while being held can be moved back and forth linearly.

  In other words, the third arms 13A and 13B are respectively attached to the first arm portion 81 rotatably attached to the tip of the second arm 12 around the third rotation drive shafts θ3A and θ3B and the tip of the first arm portion 81. An arm telescopic mechanism provided with a second arm portion 82 attached so as to be able to turn around the vertical axis, and attached to the tip of the second arm portion 82 so as to be able to turn around the vertical axis. A substrate holding hand 83 is provided.

  In relation to the first arm portion 81, an advancing / retreating motor 85 is provided as a third drive source for rotating the first arm portion 81 about the third rotation drive shafts θ3A, θ3B. By rotating the forward / backward motor 85 forward / reversely, the substrate holding hand 83 can be advanced / retreated in a direction approaching / separating from the third rotational drive shafts θ3A, θ3B. That is, when the forward / backward motor 85 is driven to rotate forward / reversely, the substrate holding hand 83 maintains its posture and the first arm portion 81 and the second arm portion 82 bend and extend with the connecting portion as a joint. As a result, the substrate holding hand 83 advances and retreats in a direction approaching / separating from the third rotation drive shafts θ3A and θ3B. The advancing / retracting motor 85 on the third arm 13A side and the advancing / retreating motor 85 on the third arm portion 13B side are driven and controlled independently, whereby the third arms 13A, 13B independently advance / retreat the substrate holding hand 83. Can be made.

  The third arm 13B holds the substrate S2 at a position overlapping the substrate S1 held by the third arm 13A, and thus has a different shape from the substrate holding hand 83 of the third arm 13A. 83. That is, the substrate holding hand 83 of the third arm 13B rises upward at the connecting portion with the second arm portion 82, bends at a right angle in the horizontal direction at the upper end of the rising portion, and further moves forward (third) in the horizontal plane. It has a shape bent at a right angle toward the direction away from the rotational drive shaft θ3.

With the above configuration, the third arms 13A and 13B can be advanced and retracted at the distal end of the second arm 12, so that the substrate can be carried in and out of the processing unit, and the above-described FIG. Compared with the configuration of FIG. 7, the configuration can be simplified.
In the configuration of FIG. 8, in addition to the advance / retreat motor 85, a rotation motor for rotating the entire third arms 13A and 13B around the third rotation drive shaft θ3 is provided for each of the third arms 13A and 13B. May be provided. In this way, the third arms 13 </ b> A and 13 </ b> B can advance and retract at an arbitrary angle with respect to the second arm 12.

  FIG. 9 is a simplified plan view showing another configuration example of the 3θ robot. The 3θ robot is attached to the carriage 1 and can rotate around a vertical axis. The column 90 is a first rotating member provided so as to be movable up and down, and a second rotating member connected to the column 91. And a second scalar arm mechanism 92 as a substrate holding means connected to the first scalar arm mechanism 91. The column 90 is rotated around the first rotation drive shaft θ11 by a motor M1 as a first drive source. The first scalar arm mechanism 91 includes a first arm portion 91a that is rotatably connected to the column 90, a second arm portion 91b that is rotatably connected to the tip of the first arm portion 91a, and a first arm portion. A motor M2 is provided as a second drive source for rotationally driving the 91a around the second rotation drive shaft θ12 common to the first rotation drive shaft θ11. Then, by driving the motor M2, the first arm portion 91a and the second arm portion 91b are configured to bend and stretch using the connecting portion as a joint. Specifically, the first arm portion 91a and the second arm portion 91b form a scalar arm type mechanism as an arm extension / contraction mechanism by a driving force transmission mechanism configured using a belt and a pulley.

  The second scalar arm mechanism 92 includes a first arm portion 92a coupled to the tip of the second arm portion 91b of the first scalar arm mechanism 91 so as to be rotatable around the third rotation drive axis θ13, and the first arm portion 92a. A second arm part 92b coupled to the tip of the arm part 92a so as to be rotatable about the vertical axis, and a tip of the second arm part 92b so as to be rotatable about the vertical axis. The coupled substrate holding hand 92c and a motor M3 as a third drive source for rotationally driving the first arm portion 92a around the second rotational drive shaft θ13 are provided. The first arm portion 92a, the second arm portion 92b, and the substrate holding hand 92c form a scalar arm type mechanism as an arm expansion / contraction mechanism, for example, by a driving force transmission mechanism constituted by a belt and a pulley. Thus, by rotating the motor M3 forward / reversely, the substrate holding hand 92c moves forward / backward so as to approach / separate from the third rotation drive shaft θ13 while maintaining the posture.

  With this configuration, for example, the first scalar arm mechanism 91 is advanced and retracted along the first horizontal direction y corresponding to the vertical direction in FIG. 9, and the second scalar arm mechanism 92 is moved to the second horizontal direction orthogonal to the first horizontal direction y. If the second scalar arm mechanism 92 is advanced / retreated along the direction x, the second scalar arm mechanism 92 can take an arbitrary y-direction position within the advance / retreat range RY of the first scalar arm mechanism 91. Further, the substrate holding hand 92 c at the tip of the second scalar arm mechanism 92 can take an arbitrary x-direction position within the advance / retreat range RX of the second scalar arm mechanism 92. Therefore, as a result, the substrate can be transported to an arbitrary position within the rectangular area defined by the ranges RY and RX. Moreover, by rotating the column 90, the rectangular area can be rotated. As a result, the substrate can be transported to any position within a circle whose diameter is the diagonal line of the rectangular area. It is.

Although FIG. 9 shows a configuration with only one substrate holding hand, the substrate transfer robot shown in FIGS. 1 to 5 is transformed into a double-handed robot as shown in FIGS. As in the case of the robot, the robot having the configuration shown in FIG. 9 can be double-handed.
Further, the entire second scalar arm mechanism 92 may be configured to be rotatable about the third rotational drive shaft θ13 with respect to the first scalar arm mechanism 91, and the degree of freedom of substrate conveyance may be further increased. .

  FIG. 10 is a simplified side view showing still another example of a 3θ robot applicable as a substrate transfer robot. This substrate transfer robot has a main feature in that the vertical movement in the Z direction is realized by the above-described scalar arm type scalar lifting mechanism 98 composed of, for example, a belt and a pulley. That is, the scalar elevating mechanism 98 includes a first arm portion 98a connected to the transport base portion 105 to be fixed to the frame of the substrate processing apparatus so as to be able to rotate around the horizontal rotation drive axis θ0, and the first arm portion 98a. The first arm portion 98a has a second arm portion 98b connected at the tip of the first arm portion 98a so as to be rotatable around a horizontal axis parallel to the rotational drive shaft θ0. The first to third arms 11, 12, and 13 are connected to the second arm portion 98 b as in the case of the robot shown in FIGS. 1 to 5, and the first arm 11 is the second arm. It is connected to a mounting base 99 fixed to the tip of the portion 98b so that it can rotate around the first rotational drive shaft θ1 along the vertical direction. The mounting base 99 is interlocked with the scalar elevating mechanism 98 so that the posture thereof remains unchanged even when the scalar elevating mechanism 98 bends and stretches.

  In order to drive the first arm portion 98a and the second arm portion 92b to bend and extend using the connecting portion as a joint, a motor M0 is provided as an elevating drive source for driving the first arm portion 98a around the rotation drive axis θ0. It has been. By driving the motor M0 forward / reversely, the first arm portion 98a and the second arm portion 98b are bent and extended, and the tip end portion of the second arm portion 92b moves up and down along the Z direction. In addition, when there is a weight of a part held on the mounting base 99 such as the first to third arms 11, 12, 13 and the like, it is better to provide another scalar lifting mechanism 98 to have a two-leg structure. good.

  The advantage of adopting this configuration is that the linear sliding portion can be eliminated even in the Z direction. That is, if there are few linear sliding parts, the part countermeasure will become easy. This is because the seal of the rotating part can be performed relatively inexpensively and effectively compared to the seal of the linear sliding part. For example, in the configuration shown in FIG. 2, the linear sliding portion is covered by the cylindrical carrier 1. However, when the configuration of FIG. 10 is adopted, this is not necessary, and only the rotating portion of the joint portion is used. Should be sealed.

  It is preferable to apply a magnetic fluid seal to the joint portion. The magnetic fluid seal is filled with a magnetic fluid between the fixed part and the rotating part, and prevents the flow of the magnetic fluid by forming a magnetic circuit passing through the fixed part and the magnetic fluid. The magnetic fluid achieves a seal. Such a magnetic fluid seal is preferably applied for shaft sealing of the first rotation drive shaft, the second rotation drive shaft, and the third rotation drive shaft in any of the above-described substrate transfer robots. Of course, it is preferable to provide a shaft seal with a magnetic fluid seal also on an arbitrary rotating part such as another joint part, thereby preventing dust generation from the rotating part.

FIG. 11 is a plan view for illustrating an applicable substrate holding hand.
The hand shown in FIG. 11 (a) has a fork shape, and a vacuum suction hole 110 is provided at a proper position. That is, this hand holds the back surface of the substrate W by vacuum suction. This hand can hold a circular substrate such as a semiconductor wafer or a square substrate such as a glass substrate for a liquid crystal display device.

  The hand shown in FIG. 11 (b) is a hand for holding a circular substrate W such as a semiconductor wafer. This hand includes a plate-shaped beam 111, an arc-shaped rear end guide portion 112 provided on the base end side of the beam 111, and an arc-shaped tip guide portion 113 provided on the tip end portion of the beam 111. Have. Then, substrate holding members 114 protrude from the both ends of the rear end guide portion 112 inward of the arc, and each substrate holding member 114 holds the back surface of the circular substrate W in a point contact manner upward. The pin 115 is erected. Furthermore, the back surface of the circular substrate W is point-contacted at the apex at the top of the beam 111 at a position slightly closer to the base end than the front end guide part 113 and a position slightly closer to the front end than the rear end guide part 112. The pin 116 is held up.

The upper surfaces of the rear end guide part 112 and the front end guide part 113 are formed higher than the front end of the pin 116. This prevents the circular substrate W from being displaced in the horizontal direction on the substrate holding hand.
The hand shown in FIG. 11C is also a hand for holding a circular substrate W such as a semiconductor wafer. The hand includes an arc-shaped substrate guide portion 120 that covers about 2/3 of the circumference of the circular substrate W, and a substrate holding member that protrudes inward of the arc at five locations of the substrate guide portion 120. 121. In each substrate holding member 121, five pins 122 for holding the lower surface of the circular substrate W by point contact are erected upward at substantially equal intervals along the substrate guide portion 120.

  11B, the upper surface of the substrate guide unit 120 is formed higher than the tip of the pin 122. As shown in FIG. This prevents the circular substrate W from being displaced in the horizontal direction on the substrate holding hand. When the circular substrate W has notches such as an orientation flat and a notch having a predetermined length, all the intervals of the five pins 122 are substantially equal to each other with an interval longer than the length of the notches. Therefore, even if the circular substrate W is held in any direction, it is in point contact with at least four points on the lower surface of the circular substrate W, and the inside of the quadrilateral formed by connecting the four points. Includes the center of gravity of the circular substrate W (substantially located at the center of the circular substrate W), the circular substrate W can be accurately held horizontally.

  The hand shown in FIG. 11 (d) is a hand for holding a rectangular substrate S such as a glass substrate for liquid crystal. This hand is formed inward at six locations: a rectangular substrate guide portion 130 covering a region around 3/4 around the rectangular substrate S, and peripheral portions corresponding to the four corners and the central portion of the rectangular substrate S of the substrate guide portion 130. And a substrate holding member 131 protruding toward the surface. On each substrate holding member 131, a pin 132 for holding the lower surface of the square substrate S in a point contact is erected upward.

11C, the upper surface of the substrate guide portion 130 is formed higher than the tip of the pin 132. This prevents the rectangular substrate S from shifting in the horizontal direction on the substrate holding hand.
Next, the form of the substrate processing apparatus to which the above substrate transfer robot is applied will be described.

  FIG. 12 is a simplified plan view showing the overall configuration of the substrate processing apparatus according to the first embodiment of the present invention. This substrate processing apparatus mainly has a function of forming a resist film on a substrate such as a semiconductor wafer and a function of developing a resist film exposed by an exposure machine with a developer. The substrate processing module 201 provided with a plurality of processing units is provided. An indexer module IND is connected to one end of the substrate processing module 201, and an exposure unit EXP is coupled to the other end via an interface module IFB. The indexer module IND takes out unprocessed substrates from a plurality of cassettes C1 to C4 and applies them to the substrate processing module 201, and receives processed substrates from the substrate processing module 201 and stores them in the cassettes C1 to C4. It is. In order to realize this function, the indexer module IND arranges an indexer robot IDR capable of reciprocating linear movement along the straight conveyance path 221 and a plurality of cassettes C1 to C4 in parallel along one side of the straight conveyance path 221. And a cassette mounting portion 222 that can be used.

  The indexer robot IDR is a scalar arm robot having one hand 231. That is, the indexer robot IDR has a base portion 232 that travels on a rail (not shown) arranged along the straight conveyance path 221, and the base portion 232 rotates and moves up and down around the vertical axis. And a hand 231 for holding the substrate described with reference to FIG. 11 at the tip of the scalar arm mechanism 233 (however, in FIG. 12). In order to simplify the drawing, the hand 231 is represented by a bar-like symbol, and similarly in the reference drawings of all the embodiments described later, the substrate of a substrate transfer mechanism such as an indexer robot or a main transfer robot. The hand that holds the substrate is represented by a bar symbol, but all four types of hands that hold the substrate described with reference to FIG. 11 can be applied. . The scalar arm mechanism 233 is formed by connecting a pair of arm portions 235 and 236, and the pair of arm portions 235 and 236 bends and stretches using the connecting portion as a joint, thereby holding the posture of the hand 231. Can be advanced and retracted in the state.

  Therefore, the hand 231 accesses an arbitrary cassette C1 to C4 by rotating and raising / lowering the entire scalar arm mechanism 233 and moving the hand 231 by the bending and extending of the scalar arm mechanism 233, and one substrate in the cassette. Or a single substrate can be stored in the cassette. Similarly, an unprocessed substrate can be delivered to the substrate processing module 201, and a processed substrate can be received from the substrate processing module 201.

The substrate processing module 201 includes a main transfer robot MTR at the center. The main transfer robot MTR is a double-handed 3θ robot, and any of the double-handed substrate transfer robots described with reference to FIGS. 1 to 11 can be applied as the main transfer robot MTR.
The main transfer robot MTR is arranged in the center of a transfer chamber 240 provided extending in the direction orthogonal to the middle part of the straight transfer path 221 of the indexer module IND. In the transfer chamber 240, a mounting table PO as a transfer table for transferring substrates between the indexer robot IDR and the main transfer robot MTR is provided between the main transfer robot MTR and the indexer module IND. ing. When the substrate is transferred from the indexer robot IDR to the main transfer robot MTR, the indexer robot IDR temporarily places the substrate on the mounting table PO, and the main transfer robot MTR receives the mounted substrate. Similarly, when the substrate is transferred from the main transport robot MTR to the indexer robot IDR, the main transport robot MTR places the substrate on the mounting table PO, and the indexer robot IDR receives the placed substrate.

  A first processing unit group 251 and a second processing unit group 252 are disposed on both sides of the transfer chamber 240, respectively. The first processing unit group 251 is configured by arranging a spin coater SC and a spin developer SD along the longitudinal direction of the transfer chamber 240. The second processing unit group 252 is configured by arranging three groups G1, G2, and G3 each having a plurality of processing units stacked in multiple stages along the longitudinal direction of the transfer chamber 240. Among them, the first group G1 is configured by laminating the cool plate CP1, the adhesion strengthening unit AH, and the soft bake portions SB2 and SB1 from the bottom in this order. The second group G2 is configured by laminating a cool plate CP2 and hard bake portions HB3, HB2, and HB1 from the bottom in this order. The third group G3 is configured by laminating cool plates CP4 and CP3 from the bottom in this order. Above the cool plate CP3, there is an empty space for two units, and other processing units can be arranged as necessary.

The function of each processing unit is as follows.
The spin developer (SD) supplies a developer to the surface of the substrate while rotating the substrate, and develops the exposed resist film formed on the surface of the substrate.
The spin coater (SC) supplies a resist solution to the surface of the substrate while rotating the substrate, applies the resist to the substrate, and forms a resist film on the substrate surface.

The cool plate (CP) is a unit for cooling the substrate so as not to affect the next process.
The adhesion strengthening unit (AH) is a unit for improving the adhesion strengthening property of the photoresist to the substrate by chemical vapor such as HMDS (hexamethyldisilazane) before applying the photoresist.

The soft bake unit (SB) is a unit for evaporating the solvent in the photoresist by heating the substrate that has been processed by the spin coater.
The hard bake part (HB) is a unit for processing the remaining photoresist film after development at a high temperature to bake the pattern and improve the etching resistance.
In the transfer chamber 240, the main transfer robot MTR can rotate the first to third arms to access any processing unit in any order. In the transfer chamber 240, an empty space 242 is formed on the side opposite to the mounting table PO with respect to the main transfer robot MTR. In this empty space 242, if the height is such that it does not hinder access of the main transfer robot MTR to the cool plates CP4, CP3, the spin developer SD, the interface module IFB, etc., other processing units are arranged, Etc. can be arranged.

  The interface module IFB includes a robot 247 that reciprocates linearly on a straight conveyance path 245 that is orthogonal to the longitudinal direction of the conveyance chamber 240. The robot 247 receives the substrate at the transfer position 250 from the main transfer robot MTR. Near the one end of the linear transport path 245, a first buffer unit 246 for temporarily storing the substrate is provided. In the vicinity of the other end of the linear transport path 245, the exposure processing by the exposure apparatus EXP fails. A second buffer unit 248 is provided for accommodating the processed substrate. The substrate placed at the delivery position 250 is temporarily accommodated in the first buffer unit 246, or directly delivered to the delivery unit 255, and a robot (not shown) on the exposure apparatus EXP side. And is subjected to an exposure process. The substrate after the exposure processing is transferred to the transfer unit 255, taken out by the robot 247, temporarily stored in the first buffer unit 246, or directly at the substrate transfer position 250, at the main transfer robot. Passed to MTR.

An example of the processing flow in this substrate processing apparatus is as follows.
That is, first, an unprocessed substrate is taken out of any one of the cassettes C1 to C4 by the indexer robot IDR and placed on the placement table PO. This substrate is received by the main transfer robot MTR, and is first carried into the adhesion enhancing unit AH.
The substrate after the processing in the adhesion strengthening unit AH is carried out by the main transfer robot MTR and then carried into the cool plate CP1 or CP2. When the processing in the cool plate CP1 or CP2 is completed, the main transfer robot MTR next carries the substrate into the spin coater SC. The substrate on which the resist is applied by the spin coater SC is unloaded by the main transfer robot MTR, and is further transferred to the cool plate CP3 and cooled. The cooled substrate is unloaded by the main transfer robot MTR, and then transferred to the exposure apparatus EXP via the interface module IFB.

  The substrate processed by the exposure machine EXP is transferred to the main transfer robot MTR via the interface module IFB and transferred to the spin developer SD. The substrate after the development processing by the spin developer SD is carried out by the main transport robot MTR, and then carried into one of the hot bake units HB1, HB2, and HB3, and subjected to heat treatment. The substrate after the heat treatment is unloaded by the main transfer robot MTR, and further loaded into the cool plate CP4 and cooled. Then, the cooled substrate is unloaded by the main transfer robot MTR and mounted on the mounting table PO. The placed substrate is received by the indexer robot IDR and stored in one of the cassettes C1 to C4.

In each processing unit, the main transfer robot MTR performs an operation of taking out a processed substrate with one hand and loading an unprocessed substrate with the other hand. By performing such a substrate replacement operation in a circulating manner for each processing unit, a series of processing according to the above-described processing flow is performed on one substrate.
FIG. 13 is a plan view showing a simplified configuration example of the mounting table PO. The mounting table PO has, for example, three pins 262 arranged at positions substantially corresponding to the three apexes of the equilateral triangle in plan view. The heights of the three pins 262 are adjusted so that the substrate W is point-contacted from the lower surface and supported horizontally. Further, if necessary, an elevating mechanism for elevating and lowering the three pins 262 at the same time is provided so that the substrate W is transferred to and from the main transfer robot MTR when the substrate W is transferred to and from the indexer robot IDR. Depending on the time, the substrate support height of the three pins 262 may be changed.

  An alignment mechanism 263 is provided in association with the substrate support position by the three pins 262. This alignment mechanism 263 is for assisting the delivery of the substrate W between the main transport robot MTR or the indexer robot IDR by guiding the substrate W supported horizontally by the pins 262 to a predetermined position. The alignment mechanism 263 has four guide pins 264 erected along the vertical direction. Two of them are driven forward / backward by the cylinder 265 so as to approach / separate the substrate W supported by the three pins 262. Then, the remaining two guide pins 264 are driven back and forth by the cylinder 266 so as to be moved toward and away from the substrate W. The four guide pins 264 are respectively arranged at positions corresponding to the four vertices of the rectangle in plan view, and the alignment of the substrate W is performed by bringing these guide pins 264 into contact with the end portions of the substrate W. Is achieved. However, actually, even when the guide pin 264 is moved by the cylinders 265 and 266 so as to be close to the substrate W, the substrate W is not completely sandwiched by the guide pins 264, leaving a slight gap. So that it is wrapped.

When the substrate W has notches such as an orientation flat and a notch having a predetermined length, all the intervals of the guide pins 264 are arranged at intervals longer than the length of the notches. Then, since the substrate W can be wrapped with at least three guide pins 264, the alignment of the substrate W can be accurately performed.
FIG. 14 is a simplified plan view showing another configuration example of the mounting table PO. In FIG. 14, parts equivalent to those shown in FIG. 13 are given the same reference numerals. In the mounting table PO shown in FIG. 14, the alignment of the substrate W is achieved by providing four guide rollers 267 configured as shown in FIG. 15 at positions corresponding to the edges of the substrate W. That is, the guide roller 267 has a cylindrical shape that can rotate around a horizontal rotation axis, and is formed of, for example, fluororesin or UPE (ultra poly-ethylene). Therefore, when the substrate W is dropped from above and the substrate W is lowered to the substrate support height by the three pins 262, the substrate is displaced and comes into contact with one of the four guide rollers 267. However, since the guide roller 267 rotates, the substrate W is placed on the three pins 262 and the alignment is achieved. For this reason, there is almost no generation of particles due to rubbing at the edge of the substrate when the substrate is dropped, compared to the case where the guide roller 262 is a fixed guide with a taper. Further, this configuration is advantageous in that a driving mechanism such as a cylinder is not required as compared with the configuration shown in FIG.

The reason why the four guide rollers 267 are provided also in this configuration example is to deal with a substrate having a notch, as described in the configuration example of FIG. In this configuration example, the hand shown in FIG. 11B is used as the hand structure for transferring the substrate W to the mounting table PO.
FIG. 16 is a simplified perspective view showing still another configuration example of the mounting table PO. This mounting table PO can simultaneously support two substrates W1 and W2 stacked one above the other. That is, a U-shaped support arm 272 in a plan view is attached to the upper end of one support column 271 provided along the vertical direction, and support pins are provided upward at both ends of the support arm 272. 273 is erected. Similarly, a U-shaped support arm 274 is also fixed to the middle portion of the support column 271, and support pins 275 are erected upward at both ends of the support arm 274. Further, another support column 276 is provided along the vertical direction at a position facing the support arms 272 and 274, and a support arm 277 extending horizontally toward the support column 271 is provided at the upper end of the support column 276. A support pin 278 is erected upward at the tip of the support arm 277. Similarly, a support arm 279 is also fixed to the middle of the support column 276 so as to extend horizontally toward the support column 271, and a support pin 280 is erected upward at the tip of the support arm 279. Has been.

  A total of three support pins 273 and 278 arranged in the upper stage are arranged at positions corresponding to the three apexes of the equilateral triangle in plan view, and the tips of the pins exist on substantially the same horizontal plane. Similarly, a total of three support pins 275 and 280 arranged in the lower stage are arranged at positions corresponding to the three apexes of the equilateral triangle in plan view, and the tips of the pins exist on the same horizontal plane. Yes.

  In order to align the substrate, an alignment mechanism 263 having a guide pin 264 and cylinders 265 and 266 for advancing and retracting the guide pin 264 with respect to the substrate is provided, as in the configuration shown in FIG. It has been. When aligning the alignment mechanism 263, the columns 271 and 276 are moved up and down by the lifting mechanism 281 so as to guide the substrate W1 or W2 to the height of the guide pins 264.

  With this configuration, one substrate W1 can be supported substantially horizontally by the upper three support pins 273 and 278, and another one substrate W2 by the lower three support pins 275 and 280. Can be supported almost horizontally. Since two substrates can be simultaneously supported in this way, another substrate can be placed even when one substrate is placed on the placement table PO. Therefore, since the buffer function can be added to the mounting table PO, the transport tact can be shortened and the substrate can be processed at high speed.

  FIG. 17 is a simplified plan view showing the overall configuration of the substrate processing apparatus according to the second embodiment of the present invention. In FIG. 17, parts corresponding to the parts shown in FIG. 12 are given the same reference numerals. In the substrate processing apparatus of this embodiment, a main transfer robot MTR composed of a 3θ robot having one hand is used for transferring a substrate. On both sides of the transfer chamber 300 in which the main transfer robot MTR is accommodated, a first processing track 301 and a second processing track 302 are arranged separately. The first processing track 301 and the second processing track 302 are for performing substantially the same processing on the substrate. In this embodiment, the chemical cleaning processing, the water cleaning processing, and the substrate drying processing are performed, The substrate can be cleaned and dried.

  Specifically, the first processing track 301 is configured by arranging the chemical cleaning unit MTC1 and the water washing / drying processing unit DTC1 along the longitudinal direction of the transfer chamber 300 in order from the side far from the indexer module IND. Yes. Similarly, the second processing unit 302 is configured by arranging the chemical solution cleaning processing unit MTC2 and the water washing / drying processing unit DTC2 in order from the side far from the indexer module IND along the longitudinal direction of the transfer chamber 300.

  The chemical cleaning units MTC1 and MTC2 are units for rotating at a high speed while horizontally supporting the substrate and removing foreign substances on the surface of the substrate using a chemical such as hydrofluoric acid. The water washing / drying processing units DTC1 and DTC2 rotate at a high speed while the substrate is supported horizontally, supply pure water or pure water to which ultrasonic waves are applied, and the surface of the substrate with a brush. For example, the surface of the substrate is washed with water by scrubbing, and the substrate is rotated at a high speed to shake off moisture and dry.

  The chemical cleaning units MTC1, MTC2 and the water washing / drying processing units DTC1, DTC2 are carried in order to carry the substrates on which the chemicals after the chemical cleaning process by the chemical cleaning units MTC1, MTC2 are attached to the water washing / drying processing units DTC1, DTC2. Sub-transport robots STR1 and STR2 are respectively disposed between the two. The sub-transport robots STR1 and STR2 are each composed of a scalar type robot, and a horizontal path substantially along a straight line is obtained by bending and stretching a pair of arms that are connected to each other so as to be rotatable. The substrate can be transported along the line. With this configuration, the sub-transport robots STR1 and STR2 receive the substrates from the chemical cleaning units MTC1 and MTC2, and carry the substrates into the water washing / drying processing units DTC1 and DTC2.

In this embodiment, the main transfer robot MTR receives the substrate placed on the mounting table PO by the indexer robot IDR and is formed on the side wall adjacent to the transfer chamber 300 in one of the chemical solution cleaning units MTC1 and MTC2. It is carried in from the carry-in entrances 305 and 306.
The substrates that have been processed by the water washing / drying processing units DTC1 and DTC2 are unloaded from the carry-out ports 309 and 310 formed on the side wall adjacent to the indexer module IND. In this case, it is the indexer robot IDR that carries out the processed substrate.

  In this embodiment, the indexer robot IDR has a double-hand configuration including two hands. However, the indexer robot IDR is not a 3θ robot, but merely includes a pair of scalar arm mechanisms similar to the scalar arm mechanism of the indexer robot IDR of the first embodiment. The indexer robot IDR uses one hand exclusively to remove an unprocessed substrate from the cassette and place it on the mounting table PO. The other hand exclusively uses the treated substrate to wash and dry the processing unit DTC1. , Used to carry out from DTC2 and accommodate in any cassette. That is, since the hand is used properly for the unprocessed substrate and the processed substrate, the substrate subjected to the cleaning process is not held by the contaminated hand having a history of holding the uncleaned substrate, Recontamination of the substrate after cleaning is prevented.

  A space 320 opposite to the mounting table PO with respect to the main transfer robot MTR is an empty space, and this space 320 can be used as a maintenance area. That is, if the door for accessing the inside of the transfer chamber 300 is provided at the end of the transfer chamber 300 opposite to the mounting table PO, the main transfer robot MTR and the processing unit can be easily maintained. In addition, since there is no guide rail or the like in the transfer chamber 300, maintenance of the main transfer robot MTR and the like can be performed with good workability.

FIG. 18 is a simplified plan view showing the overall configuration of the substrate processing apparatus according to the third embodiment of the present invention. In FIG. 18, parts that are the same as the parts shown in FIG. 12 are given the same reference numerals.
This substrate processing apparatus has a function of forming a resist film on a substrate and a function of developing a resist film after exposure processing, and is for performing chemical amplification type resist processing. Chemically amplified resist processing means that the substrate after the resist film exposure process is heated, and the resist film is baked to reduce the line width and form an extremely fine resist pattern. Is a process for It is necessary to remove ammonia in the area where the processing unit for performing this chemically amplified resist processing is disposed, and it is necessary to dispose a chemical adsorption filter for this purpose.

  The processing module 330 having a plurality of processing units is provided with a long transfer chamber 331 extending in an orthogonal direction from an intermediate portion of the straight transfer path 221 on which the indexer robot IDR of the indexer module IND runs. In the transfer chamber 331, a first main transfer robot MTR1 and a second main transfer robot MTR2 are provided. The first and second main transfer robots MTR1 and MTR2 are both double-handed 3θ robots and have the same configuration as the main transfer robot MTR in the first embodiment.

  At the end of the transfer chamber 331 on the indexer module IND side, a first mounting table PO1 is provided between the first main transfer robot MTR1 and the indexer module IND. A second mounting table PO2 is provided between the first main transfer robot MTR1 and the second main transfer robot MTR2. The first and second mounting tables PO1, PO2 have the same configuration as the mounting table PO in the first embodiment, and can temporarily mount the substrate when the substrate is delivered. .

  On both sides of the transfer chamber 331, a first processing unit group 341 and a second processing unit group 342 are arranged separately. Each processing unit group has a plurality of processing units. That is, the first processing unit group 341 is configured by arranging the spin developer SD1, the spin developer SD2, the spin coater SC1, and the spin coater SC2 in this order along the longitudinal direction of the transfer chamber 331 from the indexer module IND side. . Among these, the spin developers SD1 and SD2 are arranged in the vicinity of the first main transfer robot MTR1, and are arranged so as to be accessible for loading / unloading of substrates by the first main transfer robot MTR1. Yes. Further, the spin coaters SC1 and SC2 are arranged in the vicinity of the second main transfer robot MTR2, and are arranged so as to be accessible for loading / unloading of substrates by the second main transfer robot MTR2.

On the other hand, the second processing unit group 342 includes a first unit group UG1 arranged in the vicinity of the first main transfer robot MTR1 and a second unit group UG2 arranged in the vicinity of the second main transfer robot MTR2. An empty space ES1 is generated between the first and second unit groups UG1 and UG2.
The first unit group UG1 includes a plurality of processing units that can be accessed by the first main transfer robot MTR1. Specifically, the first unit group UG1 is configured by arranging a group G11 and a group G12, each of which is configured by stacking a plurality of processing units in multiple stages in the vertical direction, along the longitudinal direction of the transfer chamber 331. Has been. The group G11 is configured by stacking a cool plate CP1, a hot bake unit HB1, and a pressure-reducing adhesion strengthening unit AHL1 in order from the bottom. Similarly, the group G12 is configured by laminating the cool plate CP2, the hot bake part HB2, and the reduced pressure adhesion enhancing unit AHL2 in order from the bottom. The reduced pressure adhesion enhancing units AHL1 and AHL2 are units for improving the adhesion enhancement property of the resist film to the substrate by treating the substrate with chemical vapor such as HMDS under reduced pressure.

  The second unit group UG2 includes, in order from the indexer module IND side, an edge exposure unit EEW and a pair of groups G21 and G22 formed by stacking a plurality of processing units in the vertical direction along the longitudinal direction of the transfer chamber 331. Arranged. The group G21 is configured by laminating a cool plate CP3, an empty unit portion (indicated by a symbol “-” in FIG. 18), and soft bake portions SB1 and SB2 in this order from the bottom. The group G22 is configured by laminating a cool plate CP4, an empty unit portion, and post exposure bake portions PEB1 and PEB2 in this order from the bottom. Note that the edge exposure unit EEW is a unit that performs processing for enabling removal of the resist at the edge portion in a later development step by exposing the resist film at the peripheral portion of the substrate. Further, the post-exposure baking portions PEB1 and PEB2 are units for baking the resist film after the exposure processing.

Each processing unit of the second unit group UG2 is a unit for performing chemically amplified resist processing. For this reason, a chemical adsorption filter that adsorbs ammonia, for example, is disposed in the region 345 where these units are disposed. Yes.
Since the empty space ES1 between the first unit group UG1 and the second processing unit group UG2 is in a position accessible by the first main transfer robot MTR1, other additional processing units are arranged as necessary. You can also Similarly, in the transfer chamber 331, an empty space ES2 is generated between the second main transfer robot MTR2 and the interface module IFB. This empty space ES2 is a space that does not have any guide rails or the like, and if it is of a height that does not hinder the substrate transfer by the second main transfer robot MTR2, an electrical component or other unit is additionally arranged. Can do. Of course, it is possible to equip an empty unit part in the second processing unit group UG2 with an additional unit.

An example of a processing flow by the substrate processing apparatus will be described.
First, the indexer robot IDR takes one unprocessed substrate from one of the cassettes C1 to C4 and places it on the first mounting table PO1. The placed substrate is received by the first main transfer robot MTR1 and is carried into the pressure-reducing adhesion enhancing unit AHL1 or AHL2. The substrate after the processing by the decompression type adhesion strengthening unit AHL1 or AHL2 is completed is unloaded by the first main transfer robot MTR1, and then transferred to the cool plate CP1. When the cooling process by the cool plate CP1 is completed, the first main transfer robot MTR1 carries out the substrate and then places it on the second mounting table PO2. The placed substrate is received by the second main transfer robot MTR2, and is loaded into the spin coater SC1 or SC2, where a resist coating process is performed.

  The substrate after the resist coating is unloaded by the second main transfer robot MTR2, loaded into the soft bake unit SB1 or SB2, and the coated resist is dried. The substrate after the drying process is unloaded by the second main transfer robot MTR2, loaded into the cool plate CP3, and cooled to room temperature. The cooled substrate is unloaded by the second main transfer robot MTR2, and is then given to the exposure machine EXP via the interface module IFB.

  The substrate after the exposure processing is transferred to the second main transport robot MTR2 via the interface module IFB, and further carried into the edge exposure unit EEW. The substrate after the edge exposure processing is unloaded by the second main transfer robot MTR2, and is loaded into the post exposure bake unit PEB1 or PEB2. The substrate subjected to the processing by the post exposure bake unit PEB or PEB2 is unloaded by the second main transfer robot MTR2, loaded into the cool plate CP4, and cooled. The cooled substrate is unloaded by the second main transfer robot MTR2 and mounted on the second mounting table PO2.

  The substrate placed on the second placement table PO2 is received by the first main transport robot MTR1, and is carried into either the spin developer SD1 or SD2, and subjected to development processing. The substrate after the development processing is unloaded by the first main transfer robot MTR1, and is loaded into the hot bake unit HB1 or HB2, and is subjected to heat treatment. The substrate after the heat treatment is carried out by the first main transfer robot MTR1, and further carried into the cool plate CP2 to be cooled. The cooled substrate is unloaded by the first main transfer robot MTR1 and mounted on the first mounting table PO1. The indexer robot IDR receives this substrate and carries it into one of the cassettes C1 to C4.

The first and second main transfer robots MTR1 and MTR2 perform an operation of taking out a processed substrate with one hand and loading an unprocessed substrate with the other hand in each processing unit. By performing such a substrate replacement operation in a circulating manner for each processing unit, a series of processing according to the above-described processing flow is performed on one substrate.
In the substrate processing apparatus of this embodiment, the first main transfer robot MTR1 is arranged in the vicinity of the processing unit related to the development processing, and the second main transfer robot is set in the vicinity of the processing unit related to the chemically amplified resist processing. The transfer robot MTR2 is arranged, and the transfer of the substrate between the two main transfer robots MTR1 and MTR2 is performed via the second mounting table PO2. Therefore, the region 345 where the chemical adsorption filter is to be disposed is relatively small. If a transfer robot that travels on a transfer path that passes through the processing module is applied as in the first prior art, a chemisorption filter must be disposed throughout the transfer chamber in which the transfer robot travels. .

  FIG. 19 is a simplified plan view showing the overall configuration of the substrate processing apparatus according to the fourth embodiment of the present invention. This substrate processing apparatus is an apparatus for cleaning the surface of a substrate. A double-sided brush unit BR and a spin scrubber SS are arranged side by side, in the vicinity of the double-sided brush unit BR, an ultraviolet cleaning unit UV. Is provided. The double-sided brush unit BR is a unit for brush cleaning both sides of the substrate. The spin scrubber SS scrubs the surface of the substrate by rubbing a scrub member such as a sponge brush against the substrate while rotating the substrate. Is a unit. In addition, the ultraviolet irradiation unit UV irradiates the substrate surface with ultraviolet rays to decompose and remove organic substances present on the surface, thereby reducing the contact angle of the substrate surface and making the substrate surface hydrophilic. Process. By this process, the effect of wet cleaning in the chemical cleaning unit can be enhanced.

The main transfer robot MTR is provided so as to be surrounded by a bowl shape formed by the double-sided brush unit BR, the spin scrubber SS, and the ultraviolet irradiation unit UV. The main transfer robot MTR is a double-handed 3θ robot, which is the same as the main transfer robot MTR shown in FIG. 12, and is fixed to the bottom frame of the substrate processing apparatus.
At a position close to the main transfer robot MTR, a cassette placement unit 370 is provided that can place a plurality of cassettes C1 to C3 arranged in series. The main transfer robot MTR rotates the first to third arms around the first to third rotational drive shafts, respectively, so that the cassettes C1 to C3, the ultraviolet cleaning unit UV, the double-sided brush unit BR, and the spin scrubber SS are rotated. And can be accessed for loading / unloading the substrate. When accessing each part, the main transport robot MTR holds an uncleaned substrate with one hand A, and holds the substrate after the cleaning process with the other hand B.

An example of the processing flow is as follows.
That is, the main transport robot MTR takes out an uncleaned substrate from one of the cassettes C1 to C3 with one hand A and carries it into the ultraviolet cleaning unit UV. The substrate that has been processed by the ultraviolet cleaning unit is taken out by the hand A of the main transfer robot MTR and carried into the double-sided brush unit BR. The substrate that has been processed by the double-sided brush unit BR is unloaded with the hand A and loaded into the spin scrubber SS. When the cleaning process in the spin scrubber SS is completed, the main transport robot MTR takes out the cleaned substrate with the hand B and carries it into one of the cassettes C1 to C3.

  This fourth embodiment is different from the first to third embodiments described above in that the main transfer robot MTR loads / unloads substrates to / from both the cassettes C1 to C3 and the plurality of processing units. . For this reason, in the fourth embodiment, since there is no indexer robot unit as in the first to third embodiments, further space saving of the device can be realized, and the cost of the device can be reduced. .

  FIG. 20 is a conceptual plan view showing the overall configuration of the substrate processing apparatus according to the fifth embodiment of the present invention. This substrate processing apparatus has a pair of spin scrubbers SS1 and SS2 arranged side by side, and is an apparatus for performing a substrate cleaning process. A main transfer robot MTR is disposed adjacent to the pair of spin scrubbers SS1 and SS2. The main transfer robot MTR is a double arm 3θ robot and has the same configuration as the main transfer robot MTR in FIG. Then, similarly to the main transfer robot MTR provided in the apparatus of the fourth embodiment shown in FIG. 19, the substrate before cleaning is held by one hand A, and the substrate after cleaning is held by the other hand B. To work.

  Around the main transfer robot MTR, a plurality of processing units including the spin scrubbers SS1 and SS2 are arranged so as to form a U shape surrounding the main transfer robot MTR. That is, the cool plate CP and the dehiberbake portion DB1 are stacked in two stages in order from the bottom at a position near the spin scrubber SS1. In addition, dehydrated bake portions DB2 and DB3 are stacked in order from the bottom at a position near the spin scrubber SS2. A cassette mounting portion 380 is provided so as to surround the main transfer robot MTR together with the plurality of processing units arranged in the U shape. A plurality of cassettes C1 to C4 can be arranged and placed in series on the cassette placement unit 380.

The main transfer robot MTR can access the cassettes C1 to C4, the spin scrubbers SS1 and SS2, the cool plate CP, and the dehydrated bake units DB1, DB2, and DB3 for loading / unloading substrates.
An example of the processing flow is as follows.
First, the main transfer robot MTR carries out an uncleaned substrate from one of the cassettes C1 to C4 with one hand A, and carries the substrate into either the spin scrubber SS1 or SS2. The substrate after the cleaning process in the spin scrubbers SS1 and SS2 is completed is unloaded by the other hand B of the main transfer robot MTR, loaded into the dehydrated bake unit DB1, DB2, or DB3, and subjected to a heating process for dehydration. . The substrate after the heat dehydration process in the dehydrated bake units DB1, DB2, and DB3 is carried out by the hand B of the main transfer robot MTR, is carried into the cool plate CP, and is cooled. The substrate after the cooling process on the cool plate CP is carried out by the hand B of the main transfer robot MTR and stored in any of the cassettes C1 to C4.

  Here, the dehydration bake units DB1, DB2, DB3 and the cool plate CP cause the main transfer robot MTR to interfere when the main transfer robot MTR loads / unloads the substrates into / from the cassettes C1 to C4 and the spin scrubbers SS1, SS2. It is arranged so that there is no. That is, for example, the heights of the upper surfaces of the dehydrated bake parts DB1, DB2, DB3 and the cool plate CP are set lower than the heights for accommodating the substrates of the cassettes C1 to C4.

FIG. 21 is a simplified plan view showing the overall configuration of the substrate processing apparatus according to the sixth embodiment of the present invention. As in the second embodiment, this substrate processing apparatus is a substrate cleaning apparatus that performs a chemical cleaning process using a chemical liquid such as hydrofluoric acid on a substrate, then rinses the substrate, and spin-drys the substrate.
Adjacent to one side wall 391 of the transfer chamber 390 in which the main transfer robot MTR is disposed, a pair of chemical cleaning units MTC1 and MTC2 are arranged in parallel. A cassette mounting unit 400 is disposed at a position close to the side wall 392 facing the chemical cleaning units MTC1 and MTC2 with the main transfer robot MTR interposed therebetween. A plurality of cassettes C <b> 1 to C <b> 3 can be arranged on the cassette placement unit 400.

  Water washing / drying processing units DTC1 and DTC2 are arranged at positions close to the pair of side walls 393 and 394 adjacent to the side wall 391, respectively. Then, at the corner of the apparatus between the water washing / drying processing unit DTC1 and the chemical liquid cleaning processing unit MTC1, the substrate after the chemical liquid cleaning processing by the chemical liquid cleaning processing unit MTC1 is carried into the water washing / drying processing unit DTC1. A sub-transport robot STR1 is provided. Similarly, at the corner of the apparatus between the water washing / drying processing unit DTC2 and the chemical liquid cleaning processing unit MTC2, the substrate after the chemical liquid cleaning processing by the chemical liquid cleaning processing unit MTC2 is carried into the water washing / drying processing unit DTC2. A sub-transport robot STR2 is provided for this purpose.

  The sub-transport robots STR1 and STR2 have a scalar arm mechanism 396 for moving a single hand 395 forward and backward, and a rotation drive mechanism (not shown) for rotating the entire scalar arm mechanism 396 around a vertical axis. And. With this configuration, the sub-transport robot STR1 can selectively direct the hand 395 to the chemical cleaning units MTC1 and MTC2 and the water washing / drying units DTC1 and DTC2, and can move the hand 395 forward and backward. .

  Openings 401 and 402 for allowing the main transfer robot MTR to carry in the substrate are formed in the partition wall at the boundary between the chemical cleaning units MTC1 and MTC2 and the transfer chamber 390, and the chemical cleaning unit MTC1. , MTC2 and openings 403 and 404 for allowing the sub-transport robots STR1 and STR2 to carry out the substrate are formed in the partition walls at the boundaries between the chambers in which the sub-transport robots STR1 and STR2 are housed. In addition, openings 405 and 406 for allowing the main transfer robot MTR to carry out the substrate are formed in the partition wall at the boundary between the washing / drying processing units DTC1 and DTC2 and the transfer chamber 390. Openings 407 and 408 for allowing the sub-transport robots STR1 and STR2 to carry in the substrate are formed in the partition wall at the boundary between the drying processing units DTC1 and DTC2 and the chambers in which the sub-transport robots STR1 and STR2 are housed. ing.

  In relation to each of the openings 401 to 408, shutters 401a, 402a, 403a, 404a, 405a, 406a, 407a, and 408a for opening and closing them are provided. These shutters 401a to 408a are opened and closed only when the substrate passes through the corresponding openings and are closed during the remaining period. Thereby, in particular, the chemical atmosphere generated in the chemical cleaning units MTC1 and MTC2 is prevented from flowing out into the transfer chamber 390 as much as possible. Corrosion of the main transfer robot MTR and the substrates accommodated in the cassettes C1 to C3. The influence of the chemical atmosphere on is suppressed.

  In order to further reduce the influence of the chemical solution on the cassettes C1 to C3, the openings 411 and 412 in which shutters 411a, 412a, and 413a are further attached to the partition wall 392 at the boundary between the transfer chamber 390 and the cassette placement unit 400. , 413 may be formed. The shutters 411a to 413a are opened / closed only when the main transfer robot MTR accesses the corresponding openings 411 to 413 and are closed during the remaining period.

The main transfer robot MTR is a double-handed 3θ robot similar to the main transfer robot MTR in the first embodiment shown in FIG. As in the case of the main transfer robot MTR of the fourth and fifth embodiments, the main transfer robot MTR holds an uncleaned substrate with one hand A and holds the substrate after the cleaning process with the other hand B. To do.
The uncleaned substrate is unloaded from any of the cassettes C1 to C3 by the hand A of the main transfer robot MTR, and is loaded into the chemical cleaning unit MTC1 or MTC2 from the opening 405 or the opening 406, respectively.

The substrate on which the chemical cleaning process by the chemical cleaning process unit MTC1 is completed is carried out by the sub-transport robot STR1 and carried into the water washing / drying processing unit DTC1. The substrate after the water washing / drying processing by the water washing / drying processing unit DTC1 is carried out from the opening 405 by the hand B of the main transfer robot MTR and carried into any of the cassettes C1 to C3.
The substrate carried into the chemical cleaning unit MTC2 undergoes a chemical cleaning process by the chemical cleaning unit MTC2, and then is carried out by the sub-transport robot STR2 and carried into the water washing / drying processing unit DTC2. The substrate after the water washing / drying processing by the water washing / drying processing unit DTC2 is carried out from the opening 406 by the hand B of the main transfer robot MTR and accommodated in any of the cassettes C1 to C3.

  FIG. 22 is a simplified plan view showing the overall configuration of the substrate processing apparatus according to the seventh embodiment of the present invention. This substrate processing apparatus is a cleaning apparatus for removing slurry remaining on the surface of a substrate after so-called CMP (Chemical Mechanical Polishing) processing. That is, in the CMP process, a polishing agent is used to polish the surface of the substrate itself or a thin film formed on the substrate surface. After this polishing process, the abrasive remains as a slurry on the substrate. ing.

This substrate processing apparatus includes a cleaning module 420 having a plurality of processing units, a loader unit 421 for supplying a substrate to be processed to the cleaning module 420, and an unloader from which a substrate after the cleaning processing by the cleaning processing module 420 is dispensed. The parts 422 are arranged in series.
The loader unit 421 is configured as an underwater loader that waits for the substrate in water in order to prevent drying of the slurry remaining on the surface of the substrate after the CMP process. That is, the loader unit 421 has a function of immersing the cassettes C1 and C2 containing a plurality of substrates in pure water stored in a water tank and floating the substrate to be processed contained in the cassette only when necessary. .

  The processing module 420 is provided with a first main transfer robot MTR1 for taking out substrates one by one from the loader unit 421. The transfer chamber 425 in which the first main transfer robot MTR1 is accommodated is provided with a shower nozzle 426. The shower nozzle 426 sprays pure water throughout the substrate held by the first main transport robot MTR1. Thereby, drying of the slurry on the substrate surface is prevented.

  In the center of the processing module 420, a pair of chemical cleaning units MTC <b> 1 and MTC <b> 2 are juxtaposed adjacent to the transfer chamber 425. A double-sided brush unit BR1 is disposed between the chemical cleaning unit MTC1 and the loader unit 421 in the vicinity of the transfer chamber 425. Similarly, a double-sided brush unit BR2 is disposed between the chemical cleaning unit MTC2 and the loader unit 421 in the vicinity of the transfer chamber 425.

  The first main transfer robot MTR1 accommodated in the transfer chamber 425 is a double-handed 3θ robot and is similar to the main transfer robot MTR provided in the substrate processing apparatus of the first embodiment shown in FIG. It has a configuration. The first main transfer robot MTR1 can access the loader unit 421, the chemical cleaning units MTC1 and MTC2, and the double-sided brush units BR1 and BR2. At that time, the first main transport robot MTR1 holds the substrate before brush cleaning by the double-sided brush units BR1 and BR2 with one hand A, and the substrate after brush cleaning with the double-sided brush units BR1 and BR2 is the other hand. Hold with B.

  A transfer chamber 427 containing the second main transfer robot MTR2 is disposed on the opposite side of the pair of chemical cleaning units MTC1 and MTC2 from the first main transfer robot MTR1. The transfer chamber 427 is provided between the chemical cleaning units MTC1 and MTC2 and the unloader unit 421 in the vicinity thereof. The second main transfer robot MTR2 accommodated in the transfer chamber 427 is a double-handed 3θ robot having the same configuration as the first main transfer robot MTR1.

  Between the chemical cleaning unit MTC1 and the unloader unit 421, a water washing / drying processing unit DTC1 is provided adjacent to the transfer chamber 427. Similarly, a water washing / drying processing unit DTC2 is provided adjacent to the transfer chamber 427 between the chemical cleaning unit MTC2 and the unloader unit 421. On the unloader unit 421, cassettes C3 and C4 for storing the substrate after the cleaning process can be placed.

The second main transfer robot MTR2 holds the substrate before the water washing / drying processing by the water washing / drying processing units DTC1, DTC2 with one hand A, and holds the clean substrate after the water washing / drying processing with the other hand B. To do.
An example of the processing flow is shown below.
The first main transport robot MTR1 receives an unprocessed substrate from one of the cassettes C1 and C2 of the loader unit 421 with the hand A and carries the substrate into the double-sided brush unit BR1 or BR2. The substrate after the processing by the double-sided brush units BR1 and BR2 is completed is unloaded by the hand B of the first main transfer robot MTR1 and is loaded into the chemical cleaning unit MTC1 or MTC2. Thus, since the hands A and B are properly used before and after the processing in the double-sided brush units BR1 and BR2, the substrate after the double-sided brush cleaning processing is contaminated by the hand A having a history of holding the substrate to which the slurry is adhered. It will never be done.

  The substrate after the chemical cleaning process by the chemical cleaning units MTC1 and MTC2 is carried out by the hand A of the second main transfer robot MTR2, and is carried into the water washing / drying processing unit DTC1 or DTC2. The substrate after the processing by the water washing / drying processing units DTC1, DTC2 is carried out by the hand B of the second main transport robot MTR2, and is carried into the cassette C3 or C4. As described above, since the hands A and B are selectively used before and after the processing in the water washing / drying processing units DTC1, DTC2, the water A is washed / dried by the hand A having a history of holding the substrate to which the chemical solution is adhered during the chemical solution washing process. The substrate after processing is not contaminated.

Between the double-sided brush units BR1 and BR2 and the water washing / drying processing units DTC1 and DTC2, empty spaces 431 and 432 are generated outside the chemical solution cleaning processing units MTC1 and MTC2 arranged in the center. In these empty spaces 431 and 432, chemical cabinets or electrical components can be arranged as necessary.
In the seventh embodiment, in particular, the first main transfer robot MTR1 needs to have a waterproof structure. In order to achieve a waterproof structure, for example, a seal member (for example, made of a fluororesin) is provided around the joint of the arm of the first main transfer robot MTR1 that is rotatably connected, and each component is joined. A seal member is also provided in the part, and the inside of the cover covering the first main transfer robot MTR1 is kept at a higher pressure than the outside. Furthermore, it is desirable that the second main transport robot MTR2 is also waterproofed in the same manner as described above. It is desirable to improve the chemical resistance by applying a fluororesin coating to the arm of the second main transfer robot MTR2.

FIG. 23 is a simplified plan view showing the configuration of the substrate processing apparatus according to the eighth embodiment of the present invention. This substrate processing apparatus has a function of forming a resist film on the surface of the substrate and a function of developing the resist film after exposure, as in the first embodiment.
This substrate processing apparatus is connected to a processing module 440 having a plurality of processing units, a cassette mounting portion 441 coupled to one end of the processing module 440, and the other end of the processing module 440, and connects the exposure apparatus EXP. And an interface module IFB for installation. The configuration of the interface module IFB is the same as that of the interface module IFB shown in FIG. The cassette mounting portion 441 is configured so that a plurality of cassettes C1 to C4 can be arranged and placed in series.

  The processing module 440 includes a transfer chamber 444 that extends from the vicinity of the center of the cassette mounting portion 441 toward the interface module IFB. In the transfer chamber 444, the first main transfer robot MTR1 is arranged at the end on the cassette mounting portion 441 side, and the second main transfer robot MTR2 is arranged at the end on the interface module IFB side. Yes. The first and second main transfer robots MTR1 and MTR2 are double-handed 3θ robots and have the same configuration as the main transfer robot MTR provided in the apparatus of the first embodiment shown in FIG. .

  On both sides of the transfer chamber 444, a first processing unit group 451 and a second processing unit group 452 are distributed and arranged along the longitudinal direction. The first processing unit group 451 is configured by arranging a spin coater SC for applying a resist on a substrate and a spin developer SD for developing a resist film after exposure processing along the longitudinal direction of the transfer chamber 444. Has been. The second processing unit group 452 is configured by arranging a plurality of unit groups 461, 462, and 463, which are configured by stacking a plurality of processing units vertically and vertically, along the longitudinal direction of the transfer chamber 444. Has been.

  The unit group 461 is configured by stacking a cool plate CP1, an adhesion strengthening unit AH, and soft bake portions SB2 and SB1 in order from the bottom. The unit group 462 is configured by stacking three cool plates CP2, CP3, CP4 in order from the bottom. The unit group 463 is configured by stacking three hard bake portions HB1, HB2, and HB3 in order from the bottom.

  The first main transfer robot MTR1 can access the cassettes C1 to C4, the spin coater SC, and the processing units of the unit groups 461 and 462 to carry in / out the substrates. The second main transport robot MTR2 can access the spin developer SD, each unit of the unit groups 462 and 463, and the interface unit IFB to carry in / out the substrate. That is, among the three unit groups of the second processing unit group 452, the central unit group 462 can be accessed in common by the first and second main transfer robots MTR1 and MTR2. Therefore, the transfer of the substrate between the first main transfer robot MTR1 and the second main transfer robot MTR2 is performed via any one of the cool plates CP2, CP3, CP4 of the unit group 462.

An example of the processing flow is as follows.
First, the first main transport robot MTR1 unloads an unprocessed substrate from any of the cassettes C1 to C4, and loads the substrate into the adhesion strengthening unit AH. The substrate subjected to the processing in the adhesion strengthening unit AH is unloaded by the first main transfer robot MTR1, and is loaded into the cool plate CP1 and cooled. The cooled substrate is unloaded from the cool plate CP1 by the first main transfer robot MTR1, loaded into the spin coater SC, and subjected to a resist coating process. The substrate on which the resist has been applied is unloaded from the spin coater SC by the first main transfer robot MTR1, loaded into the soft bake unit SB1 or SB2, and dried. The substrate after the drying process is unloaded from the soft bake units SB1 and SB2 by the first main transfer robot MTR1, and is loaded into the cool plate CP2 or CP3 and cooled.

  The substrate after being cooled by the cool plates CP2 and CP3 is then unloaded by the second main transfer robot MTR2 and given to the exposure machine EXP via the interface module IFB. The substrate after the exposure processing by the exposure machine EXP is received by the second main transport robot MTR2 via the interface module IFB. The second main transfer robot MTR2 carries the substrate into the spin developer SD.

  The substrate that has been developed by the spin developer SD is unloaded by the second main transfer robot MTR2, and is loaded into one of the hard bake units HB1, HB2, or HB3 and subjected to heat treatment for pattern baking. Applied. The substrate after this heat treatment is unloaded from the HB1, HB2, and HB3 by the second main transfer robot MTR2, and is loaded into the cool plate CP4 and cooled.

  The substrate after the cooling process by the cool plate CP4 is carried out by the first main transfer robot MTR1 and accommodated in one of the cassettes C1 to C4. The first and second main transfer robots MTR1 and MTR2 perform an operation of taking out a processed substrate with one hand and loading an unprocessed substrate with the other hand in each processing unit. By performing such a substrate replacement operation in a circulating manner for each processing unit, a series of processing according to the above-described processing flow is performed on one substrate.

As shown in FIG. 23, an empty space 470 is generated between the first and second main transfer robots MTR1 and MTR2. In this vacant space 470, processing units can be additionally arranged as necessary as long as the first and second main transfer robots MTR1 and MTR2 can move the substrate.
Further, in the eighth embodiment, there is no indexer unit as compared with the first embodiment described above. For this reason, it can be seen that space saving of the apparatus is realized. FIG. 24 is a simplified plan view showing a basic configuration of a substrate processing apparatus according to the ninth embodiment of the present invention. As in the third embodiment, this substrate processing apparatus has a function of forming a resist film on the surface of the substrate by chemical amplification resist processing and a function of developing the exposed resist film.

  This substrate processing apparatus includes a processing module 480 in which a plurality of processing units are accommodated. One end of the processing module 480 is coupled to a cassette mounting portion 481 that can mount and mount a plurality of cassettes C1 to C4 in series. An exposure unit EXP is connected to the other end of the processing module 480 via an interface module IFB.

  The processing module 480 includes a transfer chamber 483 that is elongated from the vicinity of the intermediate portion of the cassette mounting portion 481 toward the interface module IFB in plan view. In the transfer chamber 483, a first main transfer robot MTR1 is arranged at the end on the cassette mounting portion 481 side, a second main transfer robot MTR2 is arranged near the middle portion, and an interface A third main transfer robot MTR3 is arranged at the end on the module IFB side. Between the first main transfer robot MTR1 and the second main transfer robot MTR2, a substrate to be transferred when the substrate is transferred between the two main transfer robots MTR1 and MTR2 is placed. A first mounting table PO1 is provided. Further, between the second main transfer robot MTR2 and the third main transfer robot MTR3, a second mounting table PO2 for transferring a substrate between them is arranged.

  The first, second and third main transfer robots MTR1, MTR2 and MTR3 are double-handed 3θ robots, which are the same as the main transfer robot MTR in the substrate processing apparatus of the first embodiment shown in FIG. Each has a configuration. The first and second mounting tables PO1 and PO2 have the same configuration as the mounting table PO in the first embodiment shown in FIG.

  A first processing unit group 501 and a second processing unit group 502 are arranged separately on both sides of the transfer chamber 483. The first processing unit group 501 is configured by arranging a stacking unit unit 503, a spin developer SD1, a spin coater SC1, an empty space 504, and a stacking unit unit 505 in order from the cassette mounting unit 481 side. . In addition, the second processing unit group 502 includes a stacking unit unit 506, a spin developer SD2, a spin coater SC2, an edge exposure unit EEW, and a stacking unit unit 507 arranged in this order from the cassette mounting unit 481 side. Has been.

  Each of the stacked unit units 503, 505, 506, and 507 is configured by stacking a plurality of processing units in multiple stages along the vertical direction. Specifically, the laminated unit portions 503 and 506 are configured by laminating cool plates CP1 and CP2, hard bake portions HB1 and HB2, and reduced-pressure adhesion reinforcing units AHL1 and AHL2 in order from the bottom. The stacked unit portion 505 is configured by stacking a cool plate CP4, an empty unit portion, and post exposure bake portions PEB2 and PEB1 in order from the bottom. Further, the laminated unit portion 507 is configured by laminating the cool plate CP3, the empty unit portion, and the soft bake portions SB2 and SB1 in this order from the bottom.

  The first main transfer robot MTR1 accesses the processing units of the cassettes C1 to C4 mounted on the cassette mounting unit 481, the stacking unit units 503 and 506, and the mounting table PO1 to load / unload substrates. Do. The second main transfer robot MTR2 accesses the spin developers SD1 and SD2, the spin coaters SC1 and SC2, and the mounting tables PO1 and PO2 to carry in / out the substrate. Further, the third main transport robot MTR3 accesses the edge exposure unit EEW, each unit of the stacking unit units 505 and 507, the interface module IBF, and the mounting table PO2 to carry in / out the substrate.

An example of the processing flow is as follows.
That is, first, the first main transport robot MTR1 unloads one substrate from any of the cassettes C1 to C4, and loads the substrate into the reduced pressure adhesion enhancing unit AHL1 or AHL2. The substrate after the processing by the reduced pressure adhesion strengthening units AHL1 and AHL2 is carried out by the first main transport robot MTR1 and carried into the cool plate CP1. The substrate after being cooled by the cool plate CP1 is unloaded by the first main transfer robot MTR1 and mounted on the first mounting table PO1. The substrate placed on the first placement table PO1 is received by the second main transfer robot MTR2 and carried into the spin coater SC1 or SC2. The substrate on which the resist is applied by the spin coaters SC1 and SC2 is unloaded by the second main transfer robot MTR2 and mounted on the second mounting table PO2. This substrate is received by the third main transport robot MTR3, and is carried into the soft bake unit SB1 or SB2, and the applied resist is dried. The substrate after processing in the soft bake units SB1 and SB2 is unloaded by the third main transfer robot MTR3 and loaded into the cool plate CP3. The substrate cooled by the cool plate CP3 is again carried out by the third main transfer robot MTR3 and given to the exposure machine EXP via the interface module IFB.

  The substrate subjected to the exposure processing by the exposure machine EXP is received by the third main transport robot MTR3 from the interface module IFB. The third main transport robot MTR3 carries the received substrate into the edge exposure unit EEW. The substrate after the edge exposure processing is unloaded from the edge exposure unit EEW by the third main transfer robot MTR3 and loaded into the post exposure bake unit PEB1 or PEB2. The substrate after being processed by the post exposure bake units PEB1 and PEB2 is unloaded by the third main transfer robot MTR3 and is loaded into the cool plate CP4. The substrate cooled in the cool plate CP4 is unloaded by the third main transfer robot MTR3 and mounted on the second mounting table PO2.

This substrate is received by the second main transport robot MTR2, and is carried into either the spin developer SD1 or SD2, where development processing is performed. The substrate after the development processing is unloaded from the spin developers SD1 and SD2 by the second main transport robot MTR2 and placed on the first placement table PO1.
This substrate is received by the first main transfer robot MTR1 and is carried into the hot bake unit HB1 or HB2, where heat treatment for baking the resist pattern is performed. The substrate after the heat treatment is unloaded from the hot bake units HB1 and HB2 by the first main transfer robot MTR1 and transferred to the cool plate CP2. The substrate after the cooling process on the cool plate CP2 is carried out by the first main transfer robot MTR1 and stored in one of the cassettes C1 to C4. The first, second, and third main transfer robots MTR1, MTR2, and MTR3 perform operations of taking out a processed substrate with one hand and loading an unprocessed substrate with the other hand in each processing unit. By performing such a substrate replacement operation in a circulating manner for each processing unit, a series of processing according to the above-described processing flow is performed on one substrate.

A chemical adsorption filter is arranged in an area 510 where a processing unit for performing chemical amplification resist processing is arranged. The third embodiment shown in FIG. 18 described above is that the area where the chemisorption filter 510 is disposed is much smaller than when a transfer robot that reciprocates on a straight transfer path is used. It is the same as the case of.
An additional unit can be arranged in the empty space 504 between the spin coater SC1 and the stacked unit unit 505 as necessary. Further, this empty space 504 may be used as an area for maintenance of the third main transfer robot MTR3 and its surrounding processing units.

FIG. 25 is a simplified plan view showing the overall configuration of the substrate processing apparatus according to the tenth embodiment of the present invention. As in the third and ninth embodiments, this substrate processing apparatus has a function of forming a resist film on the surface of the substrate by chemical amplification resist processing and a function of developing the exposed resist film. Yes.
The substrate processing apparatus includes a processing module 520 having a plurality of processing units, a cassette mounting unit 521 coupled to one end of the processing module 520, and an exposure apparatus EXP connected to the other end of the processing module 520. And an interface module IFB.

The cassette mounting portion 521 can mount a plurality of cassettes C1 to C4 arranged in series.
In the processing module 520, a first main transfer robot MTR1 is disposed at an end portion on the cassette mounting portion 521 side. In the vicinity of the first main transfer robot MTR1, a pair of spin scrubbers SS1 and SS2 are arranged so as to sandwich the first main transfer robot MTR1 along the cassette arrangement direction in the cassette mounting portion 521. .

  A stacking processing unit group 531 is provided on the side opposite to the cassette mounting portion 520 with respect to the first main transfer robot MTR1. A second main transfer robot MTR2 is disposed on the opposite side of the stacked unit group 531 from the first main transfer robot MTR1. A pair of spin developers SD1 and SD2 are arranged so as to sandwich the second main transport robot MTR2 along the cassette arrangement direction in the cassette mounting portion 521.

  Another layer processing unit group 532 is provided on the side opposite to the layer processing unit group 531 with respect to the second main transfer robot MTR2. A third main transfer robot MTR3 is disposed adjacent to the interface module IFB on the opposite side of the stacked processing unit group 532 from the second main transfer robot MTR2. A pair of spin coaters SC1 and SC2 are provided so as to sandwich the third main transport robot MTR3 along the cassette arrangement direction in the cassette mounting portion 521.

  The stacked processing unit group 531 has three stacked unit portions 541, 542, and 543. The laminating unit portion 541 on the spin scrubber SS1 and the spin developer SD1 side is configured by laminating a cool plate CP1, a hot bake portion HB1, and a reduced pressure adhesion enhancing unit AHL1 in order from the bottom. The central laminated unit portion 542 disposed between the first and second main transfer robots MTR1 and MTR2 is configured by laminating cool plates CP3 and CP2 and dehydrated bake portions DB2 and DB1 in order from the bottom. Among these, the cool plates CP2 and CP3 are also used as a substrate transfer place between the first and second main transfer robots MTR1 and MTR2. Furthermore, the laminated unit portion 543 is configured by laminating a cool plate CP4, a hot bake portion HB2, and a reduced pressure adhesion reinforcing unit AHL2 in order from the bottom. The cool plate CP4 may be used as a place for transferring a substrate between the first and second main transfer robots MTR1 and MTR2.

  The stacked unit group 532 includes a stacked unit unit 551 disposed on the spin coater SC1 and spin developer SD1, a stacked unit unit 552 disposed on the center, and an edge exposure unit EEW disposed on the spin developer SD2 and spin coater SC2 side. And. The stacked unit portion 551 is configured by stacking a cool plate CP5, an empty unit portion, and soft bake portions SB2 and SB1 in order from the bottom. The stacked unit unit 552 is configured by stacking a cool plate CP6, a mounting table PO, and post exposure bake units PEB1 and PEB2 in order from the bottom. The transfer of the substrate between the second and third main transfer robots MTR2 and MTR3 is performed via the mounting table portion PO or the cool plate CP6.

  The first, second, and third main transfer robots MTR1, MTR2, and MTR3 are double-handed 3θ robots, respectively, and are the same as the main transfer robot MTR in the substrate processing apparatus of the first embodiment shown in FIG. It has a configuration. Then, the first main transfer robot MTR1 accesses any processing unit provided in the cassettes C1 to C4, the spin scrubbers SS1 and SS2, and the stacking unit group 531 mounted on the cassette mounting unit 521, and Can be carried in / out. The second main transport robot MTR2 accesses the spin developers SD1 and SD2, any processing unit provided in the stacking unit group 531 and any processing unit provided in the stacking unit group 532. Carry in / out. Furthermore, the third main transport robot MTR3 can access the processing units provided in the spin coaters SC1 and SC2, the stacking unit group 532, and the interface module IBF to carry in / out the substrate.

  Between the spin scrubbers SS1 and SS2 and the spin developers SD1 and SD2, empty spaces 561 and 562 are generated outside the stacked unit group 531 respectively. In addition, empty spaces 563 and 564 are generated outside the stacked unit group 532 between the spin developers SD1 and SD2 and the spin coaters SC1 and SC2, respectively. In these empty spaces 561 to 564, a chemical cabinet or electrical equipment can be arranged.

An example of the processing flow is shown below.
First, the first main transport robot MTR1 takes out an unprocessed substrate from one of the cassettes C1 to C4 and carries it into the spin scrubber SS1 or SS2. The substrate after the processing in the spin scrubbers SS1 and SS2 is completed is unloaded by the first main transfer robot MTR1, and is loaded into either the dehydrated bake unit DB1 or DB2. The substrate that has been processed here is unloaded by the first main transfer robot MTR1 and loaded into the cool plate CP1. The substrate cooled by the cool plate CP1 is carried out by the first main transfer robot MTR1, and then carried into the reduced pressure adhesion strengthening unit AHL1 or AHL2. The substrate that has been processed here is unloaded by the first main transfer robot MTR1 and loaded into the cool plate CP2 or CP3.

The substrates cooled by the cool plates CP2 and CP3 are then unloaded by the second main transport robot MTR2 and further placed on the mounting table portion PO of the stacked unit group 532, and then placed on the third main transport robot MTR3. Delivered.
The third main transfer robot MTR3 receives the substrate placed on the placement table PO, and carries the substrate into the spin coater SC1 or SC2. The substrate after the resist coating process is performed by the spin coaters SC1 and SC2 is unloaded by the third main transfer robot MTR3 and is loaded into the soft bake unit SB1 or SB2. The substrate that has been subjected to the processing in the soft bake units SB1 and SB2 is unloaded by the third main transfer robot MTR3 and loaded into the cool plate CP5. The substrate cooled by the cool plate CP5 is carried out by the third main transfer robot MTR3 and given to the exposure machine EXP via the interface module IFB.

  The substrate that has been subjected to the exposure processing by the exposure machine EXP is transferred to the third main transport robot MTR3 via the interface module IFB and is carried into the edge exposure unit EEW. The substrate after the edge exposure processing is carried out from the edge exposure unit EEW by the third main transport robot MTR3 and further carried into the post exposure bake unit PEB1 or PEB2. The substrate that has been processed here is unloaded by the third main transfer robot MTR3 and loaded into the cool plate CP6.

  The substrate cooled by the cool plate CP6 is then unloaded by the second main transfer robot MTR2, loaded into the spin developer SD1 or SD2, and subjected to development processing. The substrate processed by the spin developers SD1 and SD2 is unloaded by the second main transfer robot MTR2 and loaded into the hot bake unit HB1 or HB2. The substrate after the heat treatment for baking the resist pattern in the hot bake units HB1 and HB2 is carried out by the second main transfer robot MTR2 and carried into the cool plate CP4.

The substrate after being cooled by the cool plate CP4 is unloaded by the first main transfer robot MTR1 and is accommodated in any of the cassettes C1 to C4 of the cassette mounting portion 521.
The first, second, and third main transfer robots MTR1, MTR2, and MTR3 perform operations of taking out a processed substrate with one hand and loading an unprocessed substrate with the other hand in each processing unit. By performing such a substrate replacement operation in a circulating manner for each processing unit, a series of processing according to the above-described processing flow is performed on one substrate.

A chemisorption filter is disposed in a region 570 indicated by a two-dot chain line. Compared to the case of a substrate processing apparatus using a transfer robot that reciprocates on a straight transfer path, the area where the chemical adsorption filter is disposed is much reduced in the third and ninth embodiments described above. Same as the case.
FIG. 26 is a configuration example for maintenance of the main transfer robot MTR (here, the main transfer robots MTR, MTR1, and MTR2 are collectively referred to) provided in the substrate processing apparatus of each of the embodiments described above. FIG.

  When any trouble occurs in the above-described substrate processing apparatus, in particular, the main transfer robot MTR and the processing unit, workability when performing maintenance is very important. This is because it is necessary to stop the substrate processing apparatus when the trouble occurs, and as a result, the longer the maintenance time for recovering the trouble, the lower the production capacity of the entire apparatus. That is, in order to improve the production capacity of the apparatus, it is necessary to improve workability during maintenance and to shorten this maintenance time as much as possible.

  An apparatus for processing a semiconductor wafer or a glass substrate for a liquid crystal display device is usually used by being placed in a clean room in which a clean airflow, that is, a downflow, is blown downward from the ceiling. In order to prevent the above-described downflow from rolling up, as shown in FIG. 26, the clean room is usually composed of a grating-like grating 605 through which the downflow can pass. The air pressure in the first floor portion 601 is adjusted to be lower than the air pressure in the second floor portion 602. Therefore, the substrate processing apparatus 610 is disposed on the grating 605 that is the floor of the clean second floor portion 602.

  Therefore, an elevator mechanism 615 for raising and lowering the main transfer robot MTR is provided between the floor 604 of the first floor portion 601 and the grating 605 constituting the floor of the second floor portion. An opening for lowering the main transfer robot MTR to the first floor portion 601 is formed in the floor surface of the substrate processing apparatus 610 and the grating 605, and the main transfer robot MTR is moved to the floor of the first floor portion 601 through this opening. It can be lowered to 604. The elevator mechanism 615 may be manually lifted and lowered by a human hand, or may be lifted and lowered by a lifting drive source (moving drive source) such as a motor.

According to this configuration, the main transfer robot MTR can be pulled down to the first floor portion 601 and maintenance can be performed from all directions around the main transfer robot MTR, so that the maintenance work can be performed with extremely good workability.
Such maintenance is possible because all the main transfer robots MTR used in the above-described embodiments do not reciprocate along the straight transfer path. That is, in a transport robot configured to travel on a straight transport path, the guide rail provided on the transport path and the transport robot are engaged. Therefore, it is practical to employ the maintenance method shown in FIG. Have difficulty.

  FIG. 27 is a diagram for explaining another maintenance method. In FIG. 27, parts corresponding to those shown in FIG. 26 are given the same reference numerals. In the configuration shown in FIG. 27, between the grating 605 constituting the floor of the second floor portion 602 and the floor 604 of the first floor portion 601, there is a transfer chamber 630 in which the main transfer robot MTR is accommodated. A maintenance staircase or ladder 620 is provided at a position corresponding to the inside. An operator can climb the stairs or ladder 620 and enter the transfer chamber 630 to perform maintenance of the main transfer robot MTR and other processing units.

In order to facilitate the maintenance work, for example, the mounting table PO arranged on the side of the main transfer robot MTR is configured to be slidable or openable, and the mounting table PO is slid or opened and closed. A sufficient space for maintenance may be secured.
Although several embodiments of the present invention have been described, the present invention is not limited to the above-described embodiments. For example, in the above embodiment, the main transfer robot MTR is fixed to the frame on the bottom surface of the substrate processing apparatus, but the frame of the substrate processing apparatus is horizontally movable with respect to the substrate processing apparatus by a minute distance. Alternatively, the main transfer robot MTR may be attached. If it is horizontal movement of a minute distance, sealing is not so difficult, so there is no big problem.

Further, in the configuration shown in FIGS. 7 to 10, the scalar arm mechanism has been described as an example of the arm expansion / contraction mechanism. However, instead of the scalar arm mechanism, a pantograph mechanism using a link mechanism as described below is used as an arm. It can also be employed as a telescopic mechanism.
As shown in FIG. 28, the pantograph mechanism 700 connects the drive unit 702 including the drive source 701 and the driven unit 703, and drives the driven unit 703 while maintaining the posture of the driven unit 703. The part 702 can be moved toward or away from the part 702.
More specifically, the pantograph mechanism 700 includes a first arm portion 704 having a pair of arms 704a and 704b that are rotatably connected to each other at the end portions thereof, and is configured similarly to the first arm portion 704. The second arm portion 705 has a pair of arms 705a and 705b facing each other. Further, a driven part 703 is rotatably connected to the front end sides of the first arm part 704 and the second arm part 705, and a driving part 702 is connected to the rear end side thereof so as to be drivable. Further, the connection on the rear end side will be described in detail. A first gear 711 fixed to the rear end side of the first arm portion 704 and a second gear 712 fixed to the rear end side of the second arm portion 705 are provided. The first gear 111 is engaged with a third gear 713 connected to the drive source 701.

  Accordingly, in FIG. 28, for example, when the drive source 701 rotates the third gear 713 in the clockwise direction, the arm 704b and the arm 705b rotate in the opening direction, and the arm 704a and the arm 705a close in the closing direction. As a result, the driven unit 703 moves linearly in the direction of the driving unit 702 and approaches. Here, when the third gear 713 is rotated counterclockwise, the driven portion 703 is separated from the driving portion 702. Further, since the lengths of these arms and the gear ratios of the first gear 711 and the second gear 712 are the same, even if the arm is moved, the posture of the driven unit 703 is maintained.

  Here, the driving unit 702 and the driven unit 703 represent any two parts that are close to or separated from each other among the parts constituting the substrate transport mechanism of FIGS. 7 to 10. In other words, like the scalar arm mechanism, the pantograph mechanism 700 can be applied to any of the substrate transport mechanisms of FIGS. 7 to 10 and provided at any position from the transport platform to the substrate holding means. Can do.

Compared with the scalar arm mechanism, the pantograph mechanism 700 can be transported even when the weight of the substrate to be transported is large, and does not require a belt or a pulley unlike the scalar arm mechanism. A small and durable structure can be obtained.
Further, in the arm extension / contraction mechanism shown in FIGS. 7 to 10 and 28, the rotation shaft of the rotatable connecting portion is provided substantially along the vertical direction. For example, the rotation shaft is substantially horizontal. Even if it provides along, it can implement this invention. In this case, since the arm expands and contracts along a substantially vertical plane, the installation space for the substrate transport mechanism itself is reduced, which can contribute to space saving of the apparatus. In addition, the direction in which the rotation shaft of the arm expansion / contraction mechanism is provided may be any direction. In short, the arm expansion / contraction mechanism only needs to extend / contract with a joint between a plurality of arms connected to each other as a joint. .

  Furthermore, in the configuration shown in FIG. 9, a transfer robot having a configuration in which the column 90 only moves up and down and does not rotate around the rotation drive axis θ11 can be used. However, in this case, since the substrate can be loaded / unloaded only in the x direction of FIG. 9, a plurality of processing units are arranged substantially linearly on one side (right side of FIG. 9) of the transfer robot. A one-sided layout needs to be adopted.

Furthermore, the robot having the configuration shown in FIG. 10 is modified so that the lifting / lowering scalar arm mechanism is, for example, between the first arm 11 and the second arm 12 or between the second arm 12 and the third arm 13. Even if it is such a structure, a board | substrate can be raised / lowered without using a linear sliding mechanism.
Note that it is desirable to apply the waterproof main transfer robots MTR1 and MTR2 described in the seventh embodiment shown in FIG. 22 to the main transfer robots MTR in the second, fourth, and sixth embodiments. .

  In addition, various design changes can be made within the scope of technical matters described in the claims.

It is a conceptual diagram which shows the basic composition of a substrate transfer robot, (a) is a conceptual sectional drawing, (b) is a conceptual top view. It is sectional drawing for demonstrating the more concrete structure of the above-mentioned board | substrate conveyance robot. FIG. 3 is a plan view of the configuration shown in FIG. 2. It is sectional drawing which shows the raising / lowering drive mechanism of a board | substrate conveyance robot. It is a figure for demonstrating the range which can convey a board | substrate. It is a figure which shows one structural example of the 3theta robot of a double hand, (a) is the simplified side view, (b) is the simplified top view. It is a figure which shows the other structural example of a 3 hand robot of a double hand, (a) is the simplified side view, (b) is the simplified top view. It is a figure which shows the further another structural example of the 3 (theta) robot of a double arm, (a) is the simplified side view, (b) is the simplified top view. It is the simplified top view which shows the other structural example of a 3 (theta) robot. It is the simplified side view which shows the further another example of the applicable board | substrate conveyance robot. It is a top view for illustrating an applicable substrate holding hand. It is the simplified top view which shows the whole structure of the substrate processing apparatus concerning 1st Embodiment of this invention. It is a top view which simplifies and shows the structural example of the mounting base for delivery of a board | substrate. It is the simplified top view which shows the other structural example of a mounting base. It is a perspective view of the guide roller for positioning of the board | substrate in the other structural example of a mounting base. It is the simplified perspective view which shows the other structural example of a mounting base. It is the simplified top view which shows the whole structure of the substrate processing apparatus which concerns on 2nd Embodiment of this invention. It is the simplified top view which shows the whole structure of the substrate processing apparatus which concerns on the 3rd Embodiment of this invention. It is the simplified top view which shows the whole structure of the substrate processing apparatus which concerns on 4th Embodiment of this invention. It is the simplified top view which shows the whole structure of the substrate processing apparatus which concerns on 5th Embodiment of this invention. It is the simplified top view which shows the whole structure of the substrate processing apparatus which concerns on 6th Embodiment of this invention. It is the simplified top view which shows the whole structure of the substrate processing apparatus which concerns on 7th Embodiment of this invention. It is the simplified top view which shows the whole structure of the substrate processing apparatus which concerns on 8th Embodiment of this invention. It is the simplified top view which shows the structure of the whole substrate processing apparatus which concerns on 9th Embodiment of this invention. It is the simplified top view which shows the whole structure of the substrate processing apparatus which concerns on 10th Embodiment of this invention. It is a conceptual diagram which shows the structural example for the maintenance of the main transfer robot with which the substrate processing apparatus of each embodiment was equipped. It is a figure for demonstrating the other maintenance method. It is a conceptual diagram for demonstrating the structure of the pantograph mechanism applicable as an arm expansion-contraction mechanism.

Explanation of symbols

DESCRIPTION OF SYMBOLS 11 1st arm 12 2nd arm 13 3rd arm 13A, 13B Scalar arm mechanism 21 1st motor 22 2nd motor 23 3rd motor 91,92 Scalar arm mechanism 98 Scalar raising / lowering mechanism M0 Motor MTR Main transport robot MTR1 1st Main transfer robot MTR2 Second main transfer robot MTR3 Third main transfer robot PO mounting table PO1 first mounting table PO2 second mounting table 201 Substrate processing module IND indexer module IDR indexer robot C1 to C4 cassette 222 cassette mounting Section 330 Processing module 370 Cassette mounting section 380 Cassette mounting section 400 Cassette mounting section 401-408, 411-413 Opening 401a-408a, 411a-413a Shutter 420 Processing module 421 Low Part 440 processing module 441 cassette mounting part 480 processing module 481 cassette mounting part 520 processing module 521 cassette mounting part 601 first floor 602 second floor 605 grating 615 elevator mechanism 700 pantograph mechanism 701 drive source

Claims (8)

A substrate processing apparatus placed on a grating floor,
A plurality of processing units for performing a series of processing on the substrate;
A substrate transport mechanism that includes a transport base fixed to the bottom surface portion of the substrate processing apparatus, is disposed surrounded by the plurality of processing units, and transports a substrate to the plurality of processing units;
Moving means for moving the substrate transport mechanism below the grating floor,
A substrate processing apparatus, wherein the substrate transport mechanism can be maintained in a space below the grating floor. A substrate processing apparatus placed on a grating floor,
A processing unit for processing the substrate;
A cassette placement section for placing a cassette capable of accommodating a plurality of substrates;
A substrate carrying mechanism fixed to the bottom surface of the substrate processing apparatus, surrounded by the processing unit and the cassette mounting unit, and a substrate carrying mechanism for carrying the substrate to the processing unit;
Moving means for moving the substrate transport mechanism below the grating floor,
A substrate processing apparatus, wherein the substrate transport mechanism can be maintained in a space below the grating floor.   The substrate processing apparatus according to claim 2, wherein the substrate transport mechanism further accommodates or takes out the substrate from the cassette. The substrate transport mechanism is
The transfer table;
A first rotating member coupled to the transport table so as to be rotatable about a first rotation drive shaft substantially along the vertical direction;
A first drive source for rotationally driving the first rotating member;
A second rotating member coupled to the first rotating member so as to be rotatable about a second rotation drive shaft substantially along the vertical direction;
A second drive source for rotationally driving the second rotating member;
A substrate holding means capable of holding the substrate, connected to the second rotating member so as to be rotatable about a third rotation drive shaft substantially along the vertical direction;
4. A substrate processing apparatus according to claim 1, further comprising a third drive source for rotationally driving the substrate holding means. The substrate transport mechanism is
The transfer table;
A first arm having a pair of arm portions rotatably connected to each other and attached to the transport table so as to extend and contract along the first horizontal direction with the connecting portion between the arm portions as a joint. Telescopic mechanism,
A first arm expansion / contraction drive source for applying a rotational force to the first arm expansion / contraction mechanism in order to expand / contract the first arm expansion / contraction mechanism;
A pair of arm portions that are rotatably connected to each other, and the second portion is perpendicular to the first horizontal direction and extends and retracts with the connecting portion between the arm portions as a joint. A second arm telescopic mechanism coupled to one arm telescopic mechanism;
A second arm expansion / contraction drive source for applying a rotational force to the second arm expansion / contraction mechanism in order to expand / contract the second arm expansion / contraction mechanism;
The substrate processing apparatus according to claim 1, further comprising a substrate holding unit that is provided in the second arm expansion / contraction mechanism and holds the substrate. The substrate transport mechanism further includes:
An ascending / descending rotary member that is interposed at any position between the transport table and the substrate holding means and that is rotatably connected around the rotational drive shaft substantially along the horizontal direction at the position; 6. The substrate processing apparatus according to claim 4, further comprising an elevating drive source for rotationally driving the elevating rotary member.   The substrate processing apparatus according to claim 1, wherein the moving means includes a driving means for moving means for generating a driving force for moving the substrate transport mechanism up and down.   8. The substrate processing apparatus according to claim 1, wherein a pressure in a space below the grating is adjusted to be lower than a pressure in a space above the grating.

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