JP2006093058A - Substrate reversing mechanism and device of manufacturing display device - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a substrate reversing mechanism capable of shortening the moving stroke of facing another substrate independent of the size of a substrate to be upturned and facilitating the handling of the substrate, and to provide the device of manufacturing a display device. <P>SOLUTION: The substrate reversing mechanism 20 has a dome-shaped vacuum chamber 21. A supporting part 22 supporting a back substrate 4, an electrostatic chuck 24 attracting and holding a front substrate 4, and a link arm 26 rotating the electrostatic chuck 24 are installed inside the vacuum chamber 21. The tip of the link arm 26 is connected to the center of the electrostatic chuck 24, and the base end of the link arm 26 and one end of the electrostatic chuck 24 are supported with slide shafts 25, 27 so as to be slidable in the lateral direction. <P>COPYRIGHT: (C)2006,JPO&NCIPI

Description

  The present invention relates to a substrate reversing mechanism for reversing a substrate held substantially horizontally, and in particular, a display device for reversing a front substrate having a phosphor screen to face a rear substrate having a large number of electron-emitting devices. It relates to a manufacturing apparatus.

  In recent years, a liquid crystal display, a field emission display (FED), a plasma display (PDP), etc. are known as a display device having a vacuum envelope having a flat flat panel structure. In addition, as a kind of FED, a display device (hereinafter referred to as SED) including a surface conduction electron-emitting device has been developed.

  The SED has a front substrate and a rear substrate that are opposed to each other with a predetermined gap. These substrates are joined to each other at peripheral edges via rectangular frame-shaped side walls, and the inside is evacuated to form a flat envelope having a flat panel structure.

  A phosphor screen having a phosphor layer of three colors is formed on the facing surface of the front substrate facing the back substrate, a metal back is formed on the phosphor screen, and the facing surface of the back substrate facing the front substrate is formed. Are arranged with a large number of electron-emitting devices corresponding to each pixel as electron emission sources for exciting and emitting phosphor layers. A large number of wirings for driving the electron-emitting devices are provided in a matrix on the opposite surface of the back substrate, and the end portions are drawn out of the vacuum envelope.

  A plate-like grid is disposed between the front substrate and the rear substrate. In this grid, a number of beam passage holes are formed in a positional relationship aligned with the electron-emitting devices, and a gap between the substrates is maintained by contacting the opposing surfaces of the front substrate and the rear substrate. A plurality of columnar spacers are provided.

  When operating this SED, a high voltage of about 10 [kV] is applied between the substrates, and a drive voltage is selectively applied to each electron-emitting device via a drive circuit connected to the wiring. Thereby, an electron beam is selectively emitted from each electron-emitting device, and these electron beams are irradiated to the corresponding phosphor layer through the corresponding beam passage hole of the grid, and the phosphor layer is excited and emitted. An image is displayed (for example, refer to Patent Document 1).

  When manufacturing the SED, first, a front substrate in which a phosphor screen and a metal back are formed on the opposing surface, a rear substrate in which a large number of electron-emitting devices and wirings are formed on the opposing surface, and a side wall is joined to the peripheral portion, and the above-mentioned Prepare the spacer grid. Then, a sealing material such as a low-melting-point metal is filled in the peripheral portion of the opposing surface of the front substrate and the upper end of the side wall joined to the rear substrate. When holding each substrate, it is not possible to contact the opposing surface, so it is necessary to handle the substrate with the opposing surface facing up.

  After that, the front substrate with the facing surface facing upward is placed in the vacuum chamber above the rear substrate with the spacer grid disposed on the facing surface, and the front substrate is placed on the back substrate at a predetermined timing. Invert the top and bottom. Then, the opposing surface of the back substrate is brought close to the opposing surface of the front substrate, the sealing material filled in the peripheral portions is melted, and the peripheral portions of the two substrates are sealed in a vacuum atmosphere.

  When the front substrate is turned upside down in the vacuum chamber as described above, for example, the rear substrate is retracted in a direction away from the front substrate (downward), and the front substrate is rotated 180 ° around the rotation axis at the center of the front substrate. Invert the front and back and raise the rear substrate toward the front substrate. When this method is adopted, the front substrate can be reversed in a relatively small space.

However, as described above, in order to move the back substrate up and down with respect to the front substrate, it is necessary to interpose the slide rod of the lifting mechanism arranged below the vacuum chamber in the vacuum chamber, usually through the bellows. Insert the rod into the vacuum chamber. For this reason, if the size of the front substrate to be reversed is different, the stroke of the arm for retracting and raising the rear substrate changes, and it is necessary to prepare a device having bellows having different lengths according to the size of the substrate. Further, when the above reversing method is employed, the arm stroke of the elevating mechanism becomes relatively long, which can be said to be inappropriate for work in a vacuum atmosphere.
JP 2003-051255 A

  SUMMARY OF THE INVENTION An object of the present invention is to provide a substrate reversing mechanism and a display device manufacturing apparatus that can shorten the moving stroke of another substrate facing each other regardless of the size of the substrate to be reversed, and can easily handle the substrate.

  In order to achieve the above object, a substrate reversing mechanism according to the present invention includes a holding member that holds a substrate substantially horizontally, and a first member that supports the holding member so as to be rotatable and slidable in a lateral direction near one end of the substrate. A slide arm, a link arm having a distal end pivotally connected to the holding member via a pivot at a position spaced from the first slide shaft, and a base end of the link arm pivotable and in the lateral direction And a second slide shaft supported so as to be slidable.

  According to the above invention, the holding member holding the substrate using the link arm is rotated while being lifted to turn the substrate upside down. Therefore, the range of movement of the substrate when the substrate is turned over can be extremely narrowed.

  The display device manufacturing apparatus of the present invention includes a front substrate, a rear substrate that is disposed opposite to the front substrate, and whose peripheral portions are sealed to each other, and a plurality of image display elements. An apparatus for manufacturing a display device, wherein the front substrate is held substantially horizontally with the inner surface facing upward, and the holding member is rotatable and laterally close to one end of the front substrate. A first slide shaft supported so as to be slidable in a direction, a link arm having a distal end connected to the holding member via a pivot at a position spaced from the first slide shaft, and a base of the link arm And a second slide shaft that supports the end so as to be rotatable and slidable in the lateral direction.

  According to the above invention, the holding member holding the front substrate is rotated using the link arm while rotating the front substrate so that the front substrate is reversed. Therefore, when the front substrate is reversed, the moving range of the front substrate can be extremely narrowed.

  Since the substrate reversing mechanism and the display device manufacturing apparatus of the present invention have the above-described configuration and operation, the movement stroke of another opposing substrate can be shortened regardless of the size of the substrate to be reversed. Can be handled easily.

Hereinafter, embodiments of the present invention will be described in detail with reference to the drawings.
First, an SED (Surface-conduction Electron-emitter Display) will be described as an example of a display device according to an embodiment of the present invention with reference to FIGS. FIG. 1 is a perspective view showing an SED vacuum envelope 10 (hereinafter also referred to as a display panel 10) in a state where a front substrate 2 is partially cut away. FIG. FIG. 3 is a cross-sectional view of the envelope 10 taken along line II-II, and FIG. 3 is a partially enlarged cross-sectional view in which the cross section of FIG. 2 is partially enlarged.

  As shown in FIGS. 1 to 3, the display panel 10 includes a front substrate 2 (substrate) and a rear substrate 4 (another substrate) each made of a rectangular glass plate, and these substrates are about 1.0-2. They are arranged opposite to each other in parallel with a gap of 0 mm. The back substrate 4 has a size one size larger than the front substrate 2. Further, the front substrate 2 and the rear substrate 4 are joined together via a rectangular frame-shaped side wall 6 made of glass, and constitute a vacuum envelope having a flat flat panel structure in which the inside is a vacuum.

  A phosphor screen 12 that functions as an image display surface is formed on the inner surface of the front substrate 2. The phosphor screen 12 is configured by arranging red, blue, and green phosphor layers R, G, and B and a light shielding layer 11, and these phosphor layers are formed in stripes or dots. A metal back 14 made of aluminum or the like is formed on the phosphor screen 12.

  On the inner surface of the back substrate 4, a number of surface conduction electron-emitting devices 16 that emit electron beams for exciting and emitting the phosphor layers R, G, and B of the phosphor screen 12 are provided. These electron-emitting devices 16 are arranged in a plurality of columns and a plurality of rows corresponding to each pixel, that is, for each of the phosphor layers R, G, and B. Each electron-emitting device 16 includes an electron emitting portion (not shown) and a pair of device electrodes for applying a voltage to the electron emitting portion. Further, on the inner surface of the back substrate 4, a large number of wirings 18 for applying a driving voltage to the respective electron-emitting devices 16 are provided in a matrix shape, and end portions thereof are drawn out of the vacuum envelope 10. Yes.

  The side wall 6 that functions as a bonding member is sealed to the peripheral edge of the front substrate 2 and the peripheral edge of the back substrate 4 by, for example, a sealing material 19 such as low-melting glass or low-melting metal, and bonds these substrates together. is doing. In the present embodiment, the back substrate 4 and the side wall 6 are bonded using frit glass 19a, and the front substrate 2 and the side wall 6 are bonded using indium 19b. If the back substrate 4 with the wiring 18 and the side wall 6 are sealed with a low melting point metal, it is necessary to provide an insulating layer as an intermediate layer in order to avoid an electrical short between the wiring 18 and the sealing material 19.

  The display panel 10 includes a plurality of elongated plate-like spacers 8 made of glass between the front substrate 2 and the rear substrate 4. In the present embodiment, the spacer 8 is a plurality of elongated glass plates, but a grid (not shown) made of a rectangular plate-like metal plate, and a large number of columnar pillars integrally provided on both sides of the grid. You may comprise with a spacer (not shown).

  Each spacer 8 is placed on the metal back 14 and the upper end 8 a that contacts the inner surface of the front substrate 2 through the light shielding layer 11 of the phosphor screen 12 and the wiring 18 provided on the inner surface of the rear substrate 4. It has a lower end 8b in contact therewith. Thus, the plurality of spacers 8 support the atmospheric pressure load acting from the outside of the front substrate 2 and the back substrate 4 and maintain the distance between the substrates at a predetermined value.

  Further, the SED includes a voltage supply unit (not shown) that applies an anode voltage between the metal back 14 of the front substrate 2 and the rear substrate 4. For example, the voltage supply unit applies an anode voltage between the two so that the potential of the back substrate 4 is set to 0 V and the potential of the metal back 14 is set to about 10 kV.

  In the SED, when an image is displayed, a voltage is applied between the element electrodes of the electron-emitting device 16 via a drive circuit (not shown) connected to the wiring 18, and an electron beam is emitted from the electron-emitting portion of any electron-emitting device 16 And an anode voltage is applied to the metal back 14. The electron beam emitted from the electron emitting portion is accelerated by the anode voltage and collides with the phosphor screen 12. Thereby, the phosphor layers R, G, and B of the phosphor screen 12 are excited to emit light, and a color image is displayed.

  When the display panel 10 having the above structure is manufactured, the front substrate 2 provided with the phosphor screen 12 and the metal back 14 is prepared in advance, the electron-emitting devices 16 and the wiring 18 are provided, the side walls 6 and The back substrate 4 to which the spacer 8 is bonded is prepared. Then, the upper end of the side wall 6 joined to the peripheral portion of the back substrate 4 is filled with molten indium 19b, and the peripheral portion of the front substrate 2 is also filled with molten indium 19b.

  Then, these prepared structures (in the following description, these structures are simply referred to as a front substrate 2 and a back substrate 4) are provided with an inner surface inside a dome-shaped vacuum chamber 21 of a substrate reversing mechanism 20 as shown in FIG. In this state, the front substrate 2 is turned upside down by 180 ° so as to face the back substrate 4, the indium 19b is melted, and the peripheral portions of the two substrates 2 and 4 are sealed together. The display panel 10 is manufactured.

  Since the front substrate 2 and the back substrates 2 and 4 are pre-baked and degassed at a high temperature before being put into the substrate reversing mechanism 20, the indium 19b filled in the peripheral portion melts. For this reason, it is necessary to handle the substrates 2 and 4 with their inner surfaces facing up so that the substrates 2 and 4 do not sag when transferred to the substrate reversing mechanism 20 even if the indium 19b is not completely solidified. is there.

Here, the structure of the substrate reversing mechanism 20 described above will be described in more detail with reference to FIG. FIG. 4 shows a schematic front view of the substrate reversing mechanism 20 as viewed from the front.
As shown in FIG. 4, in the vacuum chamber 21, a support portion 22 that supports the back surface of the rear substrate 4 to be introduced later, an electrostatic chuck 24 (holding member) that holds the back surface of the front substrate 2 by suction, and electrostatic A link arm 26 for rotating the chuck 24 by 180 ° and a splitter 28 for peeling the front substrate 2 after being reversed from the attracting surface of the electrostatic chuck 24 are provided.

  The distal end 26a of the link arm 26 is located at the approximate center of the electrostatic chuck 24, in other words, at a position close to the center of the front substrate 2 attracted and held by the electrostatic chuck 24 with respect to the electrostatic chuck 24 via the pivot 23. And are connected so as to be rotatable. The base end 26b of the link arm 26 is supported so as to be rotatable with respect to a slide mechanism (not shown) via a slide shaft 25 (second slide shaft). This slide mechanism slides the slide shaft 25 in the horizontal direction along the slide surface S indicated by the broken line in the drawing, that is, in the horizontal direction in the drawing.

  Further, one end 24a of the electrostatic chuck 24, in other words, the electrostatic chuck 24 near one end of the front substrate 2 attracted and held by the electrostatic chuck 24 is not shown via the slide shaft 27 (first slide shaft). The slide mechanism is supported so as to be rotatable. This sliding mechanism also slides the slide shaft 27 in the horizontal direction along the slide surface S indicated by the broken line in the drawing, that is, in the horizontal direction in the drawing. In the present embodiment, the distance from the pivot 23 to the slide shaft 25 and the distance from the pivot 23 to the slide shaft 27 are set to the same distance.

  The slide mechanism that slides the slide shaft 25 and the slide mechanism that slides the slide shaft 27 slide the slide shafts 25 and 27 so as to nest and cross each other, and as shown in FIG. By exchanging the position 27, the electrostatic chuck 24 is inverted by 180 ° and the front substrate 2 is inverted. The front / back reversing operation will be described in detail later. At this time, the electrostatic chuck 24 is turned upside down above the slide surface S.

  The support portion 22 is disposed below the slide surface S described above, and supports the back substrate 4 so that the inner surface of the front substrate 2 that is turned upside down faces the inner surface of the back substrate 4 in an aligned state. The support portion 22 includes a plurality of support rods 22a having tips that contact the back surface of the back substrate 4, and the back substrate 4 supported by the plurality of support rods 22a can be moved up and down. The description of the lifting mechanism of the support portion 22 is omitted here.

  The splitter 28 has a plurality of peeling rods 28 a extending through the electrostatic chuck 24. The splitter 28 is disposed through the peeling rod 28 a from the back side away from the attracting surface of the electrostatic chuck 24 and is usually rotated together with the electrostatic chuck 24. As will be described later, the splitter 28 is operated by being partially pressed by the pressing rod 29.

  The dome shape of the vacuum chamber 21 is formed along the rotation locus of the electrostatic chuck 24. Thus, the strength can be increased by forming the vacuum chamber 21 into a dome shape. The electrostatic chuck 24 attracts the back surface of the front substrate 2 using static electricity, and therefore attracts the front substrate 2 in a vacuum atmosphere even after power supply is cut.

Next, the operation of the substrate reversing mechanism 20 having the above structure will be described with reference to FIGS.
First, the front substrate 2 with the inner surface facing up is put into the vacuum chamber 21, and the back surface of the front substrate 2 is attracted and held on the attracting surface of the electrostatic chuck 24. This state is shown in FIG. Thereafter, as shown in FIG. 5, after the support portion 22 is slightly lowered, the slide shaft 27 provided at one end of the electrostatic chuck 24 and the slide shaft 25 provided at the base end of the link arm 26 are moved. Then, the electrostatic chuck 24 is rotated in the direction in which the pivot 23 is lifted by sliding the slide surface S along the slide surface S toward each other. At this time, the support portion 22 is retracted downward to such an extent that the rotating electrostatic chuck 24 and the splitter 28 do not interfere with each other.

  Further, the slide shafts 25 and 27 are crossed by a slide mechanism (not shown), and the electrostatic chuck 24 is further rotated. This state is shown in FIG. Then, as shown in FIG. 7, by rotating the electrostatic chuck 24 until the slide shaft 25 and the slide shaft 27 are completely replaced, the front substrate 2 attracted and held by the electrostatic chuck 24 is turned upside down by 180 °. . In the state shown in FIG. 7, the portion of the splitter 28 faces the tip of the pressing rod 29.

  Thereafter, the rear substrate 4 (not shown) is positioned and placed on the plurality of support rods 22a of the support portion 22 with the inner surface facing up. Then, the support portion 22 is raised by a certain distance to raise the rear substrate 4, and the inner surface of the rear substrate 4 and the inner surface of the front substrate 2 held by the electrostatic chuck 24 are brought close to each other. At this time, indium 19b filled in the inner peripheral edge of the front substrate 2 and indium 19b filled in the upper end of the side wall 6 in the peripheral edge of the rear substrate 4 come into contact. Then, the indium 19b is melted to seal the peripheral portions of the front substrate 2 and the back substrate 4.

  Thereafter, the support portion 22 is lowered and the portion of the splitter 28 is pressed by the pressing rod 29 to operate the splitter 28. At this time, the tips of the plurality of peeling rods 28 a press the back surface of the front substrate 2 and peel off the attracting surface of the electrostatic chuck 24 and the back surface of the front substrate 2. Since the electrostatic chuck 24 attracts the front substrate 2 by the action of static electricity, the suction force is not lost for a while in the vacuum chamber 21 even after the electrostatic chuck 24 is deenergized. For this reason, it is necessary to forcibly peel them off by the splitter 28.

  As described above, according to the present embodiment, since the front substrate 2 is turned upside down using the link arm 26, there is no need to retract the back substrate 4 from the rotation area (interference area) of the front substrate 2, The raising / lowering stroke of the back substrate 4 can be minimized. Thereby, for example, the length of the bellows inserted through the slide rod 22b penetrating the vacuum chamber 21 can be shortened. Further, even when the size of the front substrate 2 to be reversed is changed, it is not necessary to change the lifting stroke of the back substrate 4, and substrates of different sizes can be processed.

  On the other hand, when the substrate is rotated around the rotation axis at the center of the front substrate 2 as in the prior art, the front substrate 2 is reversed so that the front substrate 2 faces the rear substrate 4 after being inverted. It is necessary to retract the back substrate 4 largely downward from the rotation area. Thus, when the back and forth stroke of the back substrate 4 becomes large, it is necessary to lengthen the bellows for inserting the slide rod 22b, which is disadvantageous in maintaining a vacuum atmosphere.

  In addition, when such a conventional inversion method is employed, when the front substrate 2 is to be replaced with a larger size, it is necessary to increase the stroke for retracting the rear substrate 4, so that the size of the vacuum chamber 21 is increased. It is necessary to spread not only down. As a matter of course, the size of the electrostatic chuck 24 that holds the front substrate 2 also needs to be increased.

  On the other hand, by adopting a structure in which the front substrate 2 is rotated in the region above the slide surface S using the link mechanism and the rear substrate 4 is not retracted as in the present embodiment, the apparatus configuration is greatly increased. It is possible to deal with a large front substrate 2 without changing to. That is, in the apparatus of the present embodiment, when the size of the front substrate 2 is increased, the table size of the electrostatic chuck 24 is extended in the direction away from the slide shaft 27 and the rotation space of the front substrate 2 is expanded. Further, it is sufficient to enlarge only the upper region of the vacuum chamber 21.

  Further, as in the present embodiment, the electrostatic chuck 24 and the link arm 26 are connected via the pivot 23 near the center of the front substrate 2, and the base end of the link arm 26 and one end of the electrostatic chuck 24 are connected to the slide surface. The front substrate 2 can be reversed in a chamber having a width substantially the same as the width of the front substrate 2 to be reversed by rotating the front substrate 2 by sliding in the horizontal direction along S. That is, according to the present embodiment, the volume of the vacuum chamber 21 can be made extremely small, and various benefits can be obtained, such as shortening the time required for evacuation.

  Note that the present invention is not limited to the above-described embodiment as it is, and can be embodied by modifying the constituent elements without departing from the scope of the invention in the implementation stage. Various inventions can be formed by appropriately combining a plurality of constituent elements disclosed in the above-described embodiments. For example, you may delete some components from all the components shown by embodiment mentioned above. Furthermore, you may combine the component covering different embodiment suitably.

  For example, in the above-described embodiment, the case where the front substrate 2 is reversed above the rear substrate 4 has been described. However, the present invention is not limited thereto, and the rear substrate 4 may be reversed. In the above-described embodiment, the case where the electrostatic chuck 24 for attracting and holding the front substrate 2 is described. However, the present invention is not limited to this, and other substrate holding mechanisms can be used.

  In the above-described embodiment, the case where the tip of the link arm 26 is connected to the substantially center of the electrostatic chuck 24 has been described. However, the present invention is not limited to this, and one end of the electrostatic chuck 24 is slidably and rotatably supported. The pivot 23 may be provided at a position separated from the slide shaft 27.

1 is an external perspective view showing a display panel of an SED according to an embodiment of the present invention. FIG. 2 is a cross-sectional perspective view of the display panel of FIG. 1 cut along line II-II. The partial expanded sectional view which expands and shows the cross section of FIG. 2 partially. Schematic which shows the board | substrate inversion mechanism as a manufacturing apparatus which manufactures the display panel of FIG. Operation | movement explanatory drawing for demonstrating operation | movement of a board | substrate inversion mechanism with FIG. Operation | movement explanatory drawing for demonstrating operation | movement of a board | substrate inversion mechanism. Operation | movement explanatory drawing for demonstrating operation | movement of a board | substrate inversion mechanism.

Explanation of symbols

  DESCRIPTION OF SYMBOLS 1 ... SED, 2 ... Front substrate, 4 ... Back substrate, 6 ... Side wall, 8 ... Spacer, 10 ... Vacuum envelope (display panel), 12 ... Phosphor screen, 14 ... Metal back, 16 ... Electron emission element, DESCRIPTION OF SYMBOLS 18 ... Wiring, 20 ... Substrate inversion mechanism, 21 ... Vacuum chamber, 22 ... Support part, 23 ... Pivot, 24 ... Electrostatic chuck, 26 ... Link arm, 28 ... Splitter.

Claims (12)

A holding member for holding the substrate substantially horizontally;
A first slide shaft that supports the holding member so as to be rotatable and slidable in the lateral direction near one end of the substrate;
A link arm having a tip pivotably connected to the holding member via a pivot at a position spaced from the first slide shaft;
A second slide shaft that rotatably supports the base end of the link arm and is slidable in the lateral direction;
A substrate reversing mechanism comprising:   The first and second slide shafts are arranged so as to be movable in a direction intersecting each other along a slide surface extending in a substantially horizontal direction, and by nesting each other, the substrate is placed above and below the slide surface. The substrate reversing mechanism according to claim 1, wherein the substrate reversing mechanism is reversed.   The substrate reversing mechanism according to claim 2, wherein the pivot is provided close to a center of the substrate.   4. The substrate reversing mechanism according to claim 3, wherein a distance from the pivot to the first slide shaft is substantially equal to a distance from the pivot to the second slide shaft.   It further has a support part for supporting another substrate facing the substrate below the slide surface, and the support part is configured to bring the another substrate close to the substrate after the substrate is turned upside down. 5. The substrate reversing mechanism according to claim 1, wherein the other substrate is raised.   6. The substrate reversing mechanism according to claim 5, wherein the supporting portion retreats the another substrate downward when the substrate is reversed upside down. A manufacturing apparatus for a display device comprising a front substrate, a rear substrate that is disposed opposite to the front substrate, and whose peripheral portions are sealed together, and a plurality of image display elements,
A holding member that holds the front substrate in a posture in which the inner surface faces upward, and is held substantially horizontally;
A first slide shaft that supports the holding member so as to be rotatable and slidable in the lateral direction near one end of the front substrate;
A link arm having a tip pivotably connected to the holding member via a pivot at a position spaced from the first slide shaft;
A second slide shaft that rotatably supports the base end of the link arm and is slidable in the lateral direction;
An apparatus for manufacturing a display device, comprising:   The first and second slide shafts are arranged so as to be movable in a direction intersecting each other along a slide surface extending substantially horizontally, and by nesting each other, the front substrate is placed above and below the slide surface. The display device manufacturing apparatus according to claim 7, wherein the display device is inverted.   The display device manufacturing apparatus according to claim 8, wherein the pivot is provided in the vicinity of a center of the front substrate.   The display device manufacturing apparatus according to claim 9, wherein a distance from the pivot to the first slide shaft is substantially equal to a distance from the pivot to the second slide shaft.   Further comprising a support part for supporting the rear substrate so that the inner surface thereof faces upward so as to face the front substrate below the slide surface, and the support part is provided after the front substrate is turned upside down. 11. The display device manufacturing apparatus according to claim 7, wherein the back substrate is raised so that the back substrate is brought close to the front substrate.   12. The display device manufacturing apparatus according to claim 11, wherein the support part retracts the back substrate downward when the front substrate is turned upside down.

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