JP2006093040A - Manufacturing method for image display device - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a manufacturing method for an image display device capable of surely dividing a metal back layer, preventing destruction and deterioration of an electron emission element or a fluorescent screen by discharge, and of displaying an image of high luminance and high quality. <P>SOLUTION: A light shielding layer is patterned on a front face substrate disposed to face a back face substrate on which many electron emission elements are arranged. A phosphor layer is patterned in a part without the light shielding layer. A resin film layer is provided on the phosphor layer. A wire cutter provided with a plurality of wires substantially arranged in parallel is relatively aligned to the front face substrate so that each of the wires is disposed one to one to a plurality of dividing scheduled lines extended in a direction of a short side or a long side of the front face substrate. The wire cutter is relatively moved to the front face substrate to push each of the wires into a resin film layer along the dividing scheduled lines, and each of the wires is energized to generate heat by the resistance so that the resin film is heat press-divided along the dividing scheduled lines. Thus, the metal back layer functioning as an anode electrode is formed on the divided resin film. <P>COPYRIGHT: (C)2006,JPO&NCIPI

Description

  The present invention relates to a method for manufacturing a flat-type image display device using an electron-emitting device.

  Recently, as a next-generation image display device, development of a flat-type image display device in which a large number of electron-emitting devices are arranged so as to be opposed to a phosphor screen has been advanced. There are various types of electron-emitting devices, all of which basically use field emission, and display devices using these electron-emitting devices are generally called field emission displays (hereinafter referred to as FED). )is called. A display device using a surface conduction electron-emitting device among FEDs is also called a surface conduction electron-emission display (hereinafter referred to as SED). In this specification, the display device is generally called FED. Use terminology.

  In order to obtain practical display characteristics in the FED, it is necessary to use a phosphor similar to a normal cathode ray tube and a phosphor screen in which an aluminum thin film called a “metal back” is formed on the phosphor. It becomes. The purpose of the metal back is to increase the luminance by reflecting light traveling toward the electron source among the light emitted from the phosphor by the electrons emitted from the electron source to the front substrate side.

  However, the gap between the front substrate and the rear substrate of the FED cannot be so large from the viewpoint of the resolution and the characteristics of the support member, and needs to be set to about 1 to 2 mm. For this reason, in the FED, a strong electric field is formed in a narrow gap between the front substrate and the rear substrate, and when an image is formed over a long period of time, discharge (surface discharge between metal back films; vacuum arc discharge) is likely to occur between the two substrates. Become. When a discharge occurs, a large discharge current ranging from several amperes to several hundred amperes flows instantaneously, so that the electron-emitting device in the cathode part and the phosphor screen in the anode part may be destroyed or damaged. Such a discharge that leads to the occurrence of a defect is not allowed as a product. Therefore, in order to put the FED into practical use, it is necessary to prevent damage caused by discharge over a long period of time.

Patent Documents 1 and 2 each disclose a technique of dividing a metal back layer used as an anode electrode into a plurality of divided regions in order to alleviate damage when a discharge occurs.
Japanese Patent Laid-Open No. 10-326583 JP 2003-242911 A

  However, in the array of pixels on the FED phosphor screen, the interval between the planned dividing lines is very narrow, and it is difficult to reliably divide the metal back layer by that interval without being displaced.

  Further, although it is conceivable to divide the metal back layer using a laser cutting technique or a laser ablation technique, there are problems such as turning up (warping) at the edge of the divided metal back layer.

  The present invention has been made to solve the above-described problems, and can reliably divide the metal back layer, prevent destruction and deterioration of the electron-emitting device and the phosphor screen due to discharge, and has high luminance and high quality. An object of the present invention is to provide a method for manufacturing an image display device capable of displaying the above.

In the method for manufacturing an image display device of the present invention, (i) a light shielding layer is formed on a front substrate disposed opposite to a rear substrate on which a large number of electron-emitting devices are arranged, and (ii) the light shielding layer is substantially formed. (Iii) providing a resin film layer on the phosphor layer,
A wire cutter having a plurality of wires arranged substantially in parallel is arranged on a one-to-one basis with respect to a plurality of dividing lines extending in the short side or long side direction of the front substrate. And (iv) moving the wire cutter relative to the front substrate and aligning each of the wires on the resin film layer with the planned dividing line In addition, the resin film is energized to cause resistance heating by energizing each of the wires, and the resin film is hot-pressed along the planned dividing line, and (v) functions as an anode electrode on the divided resin film. A metal back layer is formed.

  In step (iv), it is desirable to hold the wire to a depth corresponding to the film thickness of the resin film for a predetermined time, and then pull the wire away from the resin film layer in a heated state. When the wire is pushed in this way, the resin film is heated and pressurized, and is divided over the entire thickness of the resin film by a so-called hot press effect by the synergistic action of heat and pressure. In this case, if the wire is held for a predetermined time in a state where the wire is pushed down to a depth corresponding to the thickness of the resin film layer, the resin film is more reliably divided. In addition, although the molten resin may adhere to the wire surface, the wire can always be kept in a clean state by performing a cleaning process on the wire surface every time when the maintenance unit is divided or periodically.

  The resistance heating wire used for the wire cutter is a round wire having a wire diameter of 17 to 120 μm (see FIG. 5) or a cross-sectional oval or elliptical different diameter wire having a wire major diameter of 40 to 120 μm (see FIG. 6). In step (iv), it is preferable to push the wire into the resin film layer with a pressing force of 5 to 100 N in a state where the wire is heated to a temperature range of 50 to 200 ° C.

  In the case of a round wire, when the diameter is less than 17 μm, not only is it difficult to reliably cut the resin film layer over the entire thickness, but breakage is likely to occur during resistance heating. On the other hand, if the wire diameter exceeds 120 μm, the dividing width of the resin film layer becomes excessive, and both shoulders of the phosphor layer corresponding to the lower layer are deformed exceeding the target width of the planned dividing line (usually 30 to 100 μm). This is because there is a risk of heat damage.

  The wire heating temperature is preferably 50 to 200 ° C, and most preferably 100 to 140 ° C. When the wire heat generation temperature is less than 50 ° C., even if the pressing force is increased, the heat press effect due to the synergistic action of heat and pressure is lost, and the metal back layer cannot be reliably divided. In addition, when the wire heating temperature is lower than 100 ° C., even if the pressing force is increased, the hot pressing effect is small, and it is difficult to completely divide the metal back layer. On the other hand, when the wire heating temperature exceeds 200 ° C., the thermal influence on the peripheral portion becomes large, the division width of the resin film layer exceeds the target width value, and a part of the phosphor layer is exposed. And the wire is easily broken. In addition, if the wire heat generation temperature exceeds 140 ° C., it becomes difficult not only to make the dividing width of the resin film layer equal to the target width value, but also to have a short life that cannot withstand repeated use.

  The wire pressing force is preferably in the range of 5 to 100N, and most preferably in the range of 40 to 80N. By adjusting the pressing force of the wire against the resin film layer with high accuracy, it is possible to effectively avoid the occurrence of damage to the light shielding layer and the substrate due to the excessive pressing force. When the wire pressing force is less than 5N, even if the heating temperature is increased, the heat pressing effect due to the synergistic action of heat and pressure is lost, and the metal back layer cannot be reliably divided. Moreover, when the wire pressing force is less than 40 N, even when the heating temperature is increased, the heat pressing effect is small, and it is difficult to completely cut the resin film layer. On the other hand, when the wire pressing force exceeds 100 N, the wire is excessively pushed to damage the underlying light shielding layer and the glass substrate, and the wire may be broken. Further, if the wire pressing force exceeds 80 N, the underlying light shielding layer and glass substrate may be damaged, and the wire will have a short life that cannot withstand repeated use.

  In the wire cutter, a desired tension is applied in advance to each wire. This tension cannot be determined unconditionally because it is affected by various complex parameters such as wire diameter, wire length, wire indentation depth, wire heating temperature, wire pressing force, and film thickness of the metal back layer. However, when the wire tension is small, the wire is bent and misaligned, and the wire does not bite into the resin film. On the other hand, if the wire tension is too large, disconnection is likely to occur, and the wire life is shortened. The wire tension can be adjusted individually or divided into several groups by a screw-type tension adjusting device (not shown) attached to the frame of the wire cutter.

  The planned dividing line may be set corresponding to each of the vertical dividing lines that divide the phosphor layer for each unit of RGB pixels, or a plurality of RGB pixel intervals (for example, two pixel pitch intervals or three pixels). You may make it set corresponding to the vertical division line of (pitch space | interval). In this case, it is most preferable that the planned dividing line is set corresponding to each of the vertical dividing lines that divide the phosphor layer into pixels. The dividing width of the metal back layer is 20 to 100 μm, preferably 30 to 50 μm for the vertical dividing line (Y direction dividing line), and 150 to 300 μm, preferably 150 to 200 μm for the horizontal dividing line (X direction dividing line). And

  The mounting table not only attracts and holds the mounted panel so as not to be displaced, but can also function as a relative moving means, and is mainly a relative position between the panel and the wire cutter in the XY plane. Used as a matching means. Such a mounting table includes an XYZθ table that includes a plurality of linear drive mechanisms that move the table in the X, Y, and Z directions, and further includes a θ rotation drive mechanism that rotates the table about the Z axis. It is preferable. When dividing the metal back layer, only the wire cutter may be moved in the Y-axis direction (the short side direction of the substrate to be processed), only the XYZθ table may be moved in the Y-axis direction, or the wire cutter And the XYZθ table may be moved in the Y-axis direction.

  According to the present invention, since the metal back layer can be reliably cut by the wire cutter, in a flat image display device such as an FED, the occurrence of discharge is suppressed and the peak value of the discharge current when the discharge occurs is suppressed. It is possible to prevent destruction, damage and deterioration of the electron-emitting device and the phosphor screen.

  The best mode for carrying out the present invention will be described below with reference to the accompanying drawings.

  As shown in FIG. 1, the thin film cutting apparatus used for manufacturing the image display device of the present invention includes an XYZθ table 31, a standby unit 32, a maintenance unit 33, a wire cutter 40, a transport unit 50, a power supply unit 60, a controller 70, A position sensor 72 and other peripheral devices not shown are provided. This apparatus is controlled by the controller 70 as a whole.

  The XYZθ table 31 has a role as a mounting table on which the front substrate 2 as a substrate to be processed is mounted. The XYZθ table 31 has a rectangular upper surface slightly larger than the rectangular substrate 2, and the substrate 2 is disposed on the upper surface. A plurality of vacuum suction holes for adsorbing and holding are opened. The substrate 2 is sucked and held by the XYZθ table 31 so that the long side is in the X-axis direction and the short side is in the Y-axis direction. A plurality of position sensors 72 are provided above the XYZθ table 31, and the alignment marks 2 a formed at the corners of the substrate 2 are optically detected by the respective sensors 72. The sensors 72 are fixed at predetermined positions so as not to be displaced with respect to the drive system of the wire cutter 40.

  The XYZθ table 31 is moved in each of the X, Y, and Z directions by three linear drive mechanisms (not shown), and is further rotated about the Z axis by a θ rotation drive mechanism (not shown). Each operation of these driving mechanisms is controlled by the controller 70 controlling the power supply unit 60 based on the alignment mark detection signal from the position sensor 72.

  The XYZθ table 31 is provided in the standby unit 32. The standby unit 32 is the home position of the wire cutter 40 and is a place where the wire cutter 40 immediately before use is made to wait.

  The transport unit 50 includes two pairs of left and right linear guides 56 and a ball screw 52. As shown in FIG. 2, each of the linear guide 56 and the ball screw 52 extends in the Z-axis direction, a nut 54 is screwed into the ball screw 52, and the wire cutter 40 is held by the nut 54 together with the frame 41. One end of the holder 39 is connected. The four corners of the holder 39 are slidably supported by two pairs of left and right linear guides 56. The transport unit 50 is backed up by the controller 70 and controls the transport start timing, transport stop timing, pressing force on the metal back layer, and the like of the wire cutter 40. A limit switch (not shown) is provided at the end of the linear guide 56 together with the stopper 58, and the lifting stroke of the wire cutter 40 by the transport unit 50 (relative movement means) is limited.

  A maintenance unit 33 is provided in the vicinity of the standby unit 32. The maintenance unit 33 is located at the position of the wire cutter 40 and is a drain for discharging waste liquid together with a cleaning nozzle (not shown) or a cleaning tank (not shown) for injecting the cleaning liquid onto the wire cutter 40 immediately after use, and foreign matter. A tube (not shown) is provided.

  As shown in FIGS. 1 and 3, the wire cutter 40 includes a number of wires 42 stretched in a rectangular frame 41. These wires 42 are stretched in parallel to the short side (Y-axis direction) of the frame 41 by fastening both ends to the long side of the frame 41. The rectangular frame 41 is one size larger than the substrate 2 to be processed on the mounting table 31, and when the wire cutter 40 is lowered as shown in FIG. 3, the rectangular frame 41 is mutually attached to the mounting table 31 and the substrate 2 to be processed. Only the wire 42 can come into contact with the metal back layer 7 of the substrate 2 to be processed without interference. In this embodiment, an example of the longitudinally cutting wire cutter 40 that divides the metal back layer in the Y-axis direction is shown, but the present invention is also applied to a laterally cutting wire cutter that divides the metal back layer in the X-axis direction. Of course, can be applied.

  A predetermined tension is applied to each wire 42 of the wire cutter in advance. The wire tension is adjusted within a predetermined optimum range confirmed in advance by experiments in accordance with the thickness and hardness of the resin film layer 7p and the wire pressing force. Specifically, the wire tension is individually adjusted or divided into several groups by a screw-type tension adjusting device (not shown) attached to the wire cutter frame 41.

  As shown in FIG. 5, the wire 42 is a round line having a diameter d <b> 1 (the cross section is almost a perfect circle). The wire diameter d1 is appropriately selected within a range of 17 μm to 120 μm according to the film thickness of the resin film layer 7p and the size of the pixel pattern. The dividing width of the resin film layer 7p tends to be equal to or slightly wider than the wire diameter d1. The wire 42 is made of a metal material such as a nickel chromium alloy that generates resistance when energized. The material of the frame 41 and the holder 39 is preferably a hard resin material or a hard metal material that is not easily deformed and hardly generates particles.

Next, a case where the metal back layer is cut using the above-described thin film cutting apparatus will be described.
The substrate 2 to be processed is placed on the XYZθ table 31 by a transfer robot (not shown). Since the upper surface of the XYZθ table 31 has a self-alignment structure, the target substrate 2 is automatically roughly aligned with the XYZθ table 31. The substrate 2 to be processed is a front substrate for FED, and one surface is covered with a resin film layer 7p. The substrate 2 is placed on the XYZθ table 31 so that the resin film layer 7p is on the upper surface, and is vacuum-sucked and held by a vacuum chuck.

  Next, the position sensor 72 optically detects the alignment marks 2 a formed at the corners of the substrate 2, and the controller 70 controls the power supply unit 60 based on the detection signal, so that the XYZθ table 31 is within the XY plane. Are finely adjusted, and the height position in the Z direction is also finely adjusted. As a result, the substrate to be processed 2 is precisely aligned with respect to the wire cutter 40, and as a result, the planned dividing line of the substrate-side metal back layer is aligned with the wire 42 so as to correspond one-to-one.

  When the relative alignment between the substrate and the wire cutter is completed, the controller 70 sends a signal to each of the transport unit 50 and the power supply unit 60 to start feeding the wire 42 and lower the wire cutter 40. As a result, the wire 42 generates heat to a predetermined temperature in the range of 50 to 200 ° C., and the wire cutter 40 comes into contact with the resin film layer 7p on the substrate 2 held on the mounting table 31 while being guided by the two pairs of left and right linear guides 56. The resin film 7p is cut in the vertical direction (Y-axis direction) along the planned cutting line. By pressing the heated wire 42, the resin film layer 7p is heated and pressurized, and the aluminum constituting the resin film 7p is plastically deformed or partially melted by the synergistic action of heat and pressure, so-called hot press effect. Therefore, it is easily divided over the entire thickness of the resin film 7p.

  In this embodiment, after holding the wire 42 for a predetermined time in a state where the wire 42 is pushed down to a depth corresponding to the film thickness of the resin film layer 7p, the wire 42 is pulled away from the resin film layer 7p in a state where heat is generated. When the wire 42 is pushed in this way, the adhesion of foreign matter to the wire surface is effectively prevented.

  Although the partially melted resin may adhere to the wire surface, the wire 42 can always be kept clean by washing the wire surface at the maintenance unit 33 at every break or periodically. The wire cutter 40 is moved from the standby unit 32 to the maintenance unit 33, and in the maintenance unit 33, the cleaning liquid is sprayed onto the wire 42 to remove the solidified matter adhering to the distal end portion 42 a of the heater wire 42. The removed coagulum is received together with the cleaning liquid in a cup container (not shown), and is discharged to the outside through a drain pipe (not shown). Next, the wire 40 is energized and heated to dry, and after drying, the wire 42 is returned from the maintenance unit 33 to the standby unit 32. During the cleaning and drying of the wire 42, the front substrate 2 is picked up from the table 31 by the transfer robot and carried out to the next process. In this way, the substrate 2 to be processed successively carried into the apparatus 30 is processed, and the resin film 7p is divided by using the wire 42 that is always kept in a clean state.

  Next, a method for manufacturing the FED as the image display apparatus of the present embodiment will be described with reference to FIG.

  The glass substrate 2 which is the front substrate of the FED is cleaned using a predetermined chemical solution to obtain a desired clean surface. A light shielding layer forming solution containing a light absorbing material such as a black pigment is applied to the inner surface of the cleaned front substrate 2. After the coating film is heated and dried, it is exposed using a screen mask having openings at positions corresponding to the matrix pattern, and is developed to form matrix pattern light-shielding layers 5b1 and 5b2 shown in FIG. did.

  Next, phosphor layers 6a of three colors of red (R), green (G), and blue (B) were formed by patterning in a conventional manner in areas where the matrix pattern light shielding layers 5b1 and 5b2 were not present. As shown in FIG. 4B, a phosphor screen was obtained in which phosphor layers 6a having a rectangular or strip-shaped three-color pattern were regularly arranged vertically and horizontally. For example, in the case of a square pixel with a pitch of 600 μm, the X direction width of the vertical division line of the phosphor layer 6a is set to a range of 20 to 50 μm, for example. In addition, the Y direction width | variety of the horizontal division line (stripe) of the fluorescent substance layer 6a shall be the range of 50-250 micrometers, for example. A matrix pattern light shielding layer 5 exists in these vertical and horizontal division lines, and is shielded so that light does not leak toward the front substrate 2.

  Next, the resistance adjusting material 11 was selectively laminated on the pattern light shielding layer 5b2 having the narrower spacing among the matrix pattern light shielding layers on which the phosphor layer 6a was not stacked, by a CVD film forming method using photolithography. The resistance adjusting material 11 was stacked so as to be substantially flush with the phosphor layer 6a as shown in FIG.

  Next, the resin film was transferred onto the phosphor layer 6a by a printing method to form a resin film layer 7p having a predetermined thickness. The resin film layer 7p is made of a thin film of about several μm to several tens of μm made of an organic resin such as nitrocellulose, and is made of an Al film to be a metal back layer by smoothing the irregularities on the surface of the phosphor layer 6a. It has a role of flattening the shape. The resin film layer 7p can also be formed by using a spray method or a photolithography method in addition to the printing method. The resin film layer 7p can be decomposed and removed by heating and firing together with the front substrate 2 in a later step.

  Next, using the wire cutter 40 described above, the wire 42 is heated to a predetermined temperature in the range of 100 to 140 ° C. and held for a predetermined time in a state where the wire 42 is pushed down to a depth corresponding to the film thickness of the resin film layer 7p. 42 was pulled away from the resin film layer 7p in a state where heat was generated, and the resin film layer 7p was subjected to hot press cutting along a planned cutting line. Thereby, the resin film layer 7p was divided for each RGB pixel unit, and the resin film layer 7p divided at the dividing portion 12 as shown in FIG. 4D was obtained.

  Next, as shown in FIG. 4 (e), an Al metal back layer 7 was formed on the divided resin film layer 7p over the entire surface by vacuum deposition. The thickness of the Al metal back layer 7 was set to a predetermined thickness in the range of 15 to 50 μm.

  Subsequently, the resistance adjusting material 13 was laminated | stacked on the pattern light shielding layer 5b1 with the larger space | interval exposed to the parting part 12. FIG. The resistance adjusting member 13 was stacked so as to be substantially flush with the phosphor layer 6a as shown in FIG.

  Next, the phosphor screen 6 thus formed is placed in a vacuum envelope together with the electron-emitting device. For this, a method is adopted in which the front substrate 2 having the phosphor screen 6 and the rear substrate 1 having the plurality of electron-emitting devices 8 are vacuum-sealed with frit glass or the like to form a vacuum container. Further, a predetermined getter material is deposited from above the pattern in the vacuum envelope, and a getter material deposition film is formed in the region of the Al metal back layer 7.

  In the FED manufactured in this way, since the gap between the front substrate 2 and the rear substrate 1 is extremely narrow, discharge (dielectric breakdown) easily occurs between the two substrates. However, in the FED formed in this embodiment, the pattern is Since the formed phosphor layer 6a is divided for each pixel segment in a state in which the metal back layer 7 is formed, the peak value of the discharge current when the discharge occurs is suppressed, and the instantaneous energy is reduced. Concentration is avoided. As a result of the reduction of the maximum value of the discharge energy, destruction, damage and deterioration of the electron-emitting device and the phosphor screen are prevented.

Next, examples will be described.
Example 1
A resin film having a film thickness t1 (= 3 to 20 μm) was divided using a wire 42 having a circular cross section (substantially perfect circle) shown in FIG. The wire diameter d1 was 30 μm, the wire heating temperature was 140 ° C., the downward wire protrusion length C1 was 3 to 10 μm, and the distance L1 from the lower end of the wire to the glass substrate 2 was 10 to 100 μm with a margin.

  According to this example, the resin film layer could be vertically divided to an average dividing width of 18 μm without turning over at the end of the dividing region. Further, the relative alignment between the wire cutter and the substrate could be made with high accuracy, and the position of each wire could be suppressed within only a few μm from the planned cutting line.

(Example 2)
As the wire cutter of Example 2, a wire 42A having an oval cross section shown in FIG. 6 was used to cut a resin film having a film thickness t1 (= 3 to 20 μm). The wire short diameter d1 is 30 μm, the wire long diameter d2 is 60 μm, the wire heating temperature is 140 ° C., the downward wire protrusion length C2 is 5 to 20 μm, and the distance L2 from the lower end of the wire to the glass substrate 2 is 10 with a margin. ˜100 μm. If the resin film 7p is hot-press divided with the wire long axis as the thickness direction (Z direction) of the resin film 7p, the wire penetration length C2 becomes longer, and the resin film 7p can be more reliably divided.

  According to this example, the resin film 7p could be longitudinally divided to 21 μm with an average division width without turning up at the end of the division region. Further, the relative alignment between the wire cutter and the substrate could be made with high accuracy, and the position of each wire could be suppressed within only a few μm from the planned cutting line.

  In this embodiment, the cross section of the wire has an oval shape, but it may have an elliptical shape or a pseudo-elliptical shape.

  Next, FIGS. 9 and 10 show the structure of the FED common to this embodiment. The FED has a front substrate 2 and a rear substrate 1 each made of rectangular glass, and the substrates 1 and 2 are arranged to face each other with an interval of 1 to 2 mm. The front substrate 2 and the back substrate 1 constitute a flat rectangular vacuum envelope 4 whose peripheral portions are joined to each other via a rectangular frame-shaped side wall 3 and the inside is maintained at a high vacuum.

  A phosphor screen 6 is formed on the inner surface of the front substrate 2. The phosphor screen 6 includes a phosphor layer 6a that emits light of three colors of red (R), green (G), and blue (B) and a matrix-shaped light shielding layer 22b. On the phosphor screen 6, a metal back layer 7 is formed which functions as an anode electrode and functions as a light reflecting film for reflecting the light of the phosphor layer 6a. During the display operation, a predetermined anode voltage is applied to the metal back layer 7 by a circuit (not shown).

  On the inner surface of the back substrate 1, a large number of electron-emitting devices 8 that emit an electron beam for exciting the phosphor layer 6 a and the metal back layer 7 are provided. These electron-emitting devices 8 are arranged in a plurality of columns and a plurality of rows corresponding to each pixel. The electron-emitting devices 8 are driven by wiring (not shown) arranged in a matrix. In addition, a large number of plate-like or columnar spacers 10 are provided between the rear substrate 1 and the front substrate 2 as reinforcement in order to withstand the atmospheric pressure acting on the substrates 1 and 2. .

  An anode voltage is applied to the phosphor screen 6 through the metal back layer 7, and the electron beam emitted from the electron emitter 8 is accelerated by the anode voltage and collides with the phosphor screen 6. As a result, the corresponding phosphor layer 6a emits light and an image is displayed.

  FIG. 7 shows the structure of the front substrate 2, particularly the phosphor screen 6, common to the embodiments of the present invention. The phosphor screen 6 has a number of rectangular phosphor layers that emit red (R), green (G), and blue (B). When the longitudinal direction of the front substrate 2 is the X axis and the width direction perpendicular to the X axis is the Y axis, the phosphor layers R, G, B are repeatedly arranged at a predetermined gap interval in the X axis direction, and the Y axis direction Are arranged repeatedly at predetermined gap intervals. Note that the gap distance between the phosphor layers 6a in the XY plane is allowed because the gap distance is allowed to vary within a manufacturing error range or within a design tolerance range. Although it cannot be said that is a constant value, it is assumed here that it is a substantially constant value for convenience.

  The phosphor screen 6 includes a light shielding layer 5. As shown in FIG. 7, the light shielding layer 5 includes a rectangular frame light shielding layer 5a extending along the peripheral edge of the front substrate 2, and a phosphor frame R, G, B between the rectangular frame light shielding layer 5a. And a matrix pattern light shielding layer 5b extending in a matrix.

  On the matrix pattern light shielding layer 5b, as shown in FIG. 8, a resistance adjusting material is provided in a space divided along a vertical division line 13V extending in the Y direction, and a horizontal division line extending in the X direction. A chemical cut (an aluminum oxide region partially oxidized in a band shape) is provided along 13H. The segment phosphors RGB are also divided by a resistance adjusting material 11 extending in the Y direction. The vertical division line 13V is formed by a conventional photolithography method using a material having metal oxide fine particles having a predetermined resistance as a base material. For the horizontal dividing line 13H, the metal back layer is divided along the horizontal dividing line 13H in the same manner as described above by using a wire cutter for horizontal dividing instead of chemical cut, and resists the dividing space. You may make it provide an adjustment material, respectively.

  According to the dividing method of this example, the metal back layer could be divided to a predetermined dividing width with high accuracy without causing the end portion to be turned up. In addition, by using a mounting table (XYZθ table) whose operation is controlled by the controller, the front substrate can be aligned with respect to the wire cutter with high accuracy, and the position of each wire is within a few μm from the planned cutting line. I was able to suppress it.

  When the pressure resistance characteristics of the FED having a phosphor screen thus obtained were measured and evaluated by a conventional method, good results were obtained.

The block top view which shows the outline | summary of the thin film cutting device used for manufacture of the image display apparatus of this invention, and a to-be-processed substrate. The side view which shows the outline | summary of a thin film cutting device and a to-be-processed substrate. The perspective view which shows the outline | summary of a wire cutter and a to-be-processed substrate. (A)-(f) is process drawing which shows the manufacturing method of the image display apparatus which concerns on embodiment of this invention. Sectional drawing which expands and shows the wire of the wire cutter at the time of metal back layer parting | segmenting. Sectional drawing which expands and shows the wire of the wire cutter at the time of metal back layer parting | segmenting. The top view which shows a fluorescent screen and a metal back layer of a front substrate by cutting out a part of an image display device (FED). 1 is a partially enlarged plan view showing an image display device according to an embodiment of the present invention. The perspective view which shows the outline | summary of an image display apparatus (FED). Sectional drawing cut | disconnected along the AA line of FIG.

Explanation of symbols

DESCRIPTION OF SYMBOLS 1 ... Back substrate, 2 ... Front substrate, 2a ... Alignment mark, 3 ... Side wall,
5a, 5b, 5b1, 5b2 ... light-shielding layer, 6 ... phosphor screen, 6a ... phosphor layer,
7 ... Metal back layer,
7a: a divided metal back layer (metal back pattern),
7p ... Resin film layer,
8 ... electron-emitting device,
11, 13V ... resistance adjusting material,
12: Dividing part,
13V ... Vertical section line (partition planned line)
13H: Horizontal section line (scheduled dividing line, stripe)
31 ... XYZθ table (mounting table, relative moving means)
32 ... standby unit,
33. Maintenance department,
39 ... Holder,
40 ... wire cutter, 41 ... frame, 42 ... resistance heating wire,
50... Transport unit (relative movement means),
52 ... Ball screw, 54 ... Nut, 56 ... Linear guide,
58 ... stopper,
60 ... power supply unit,
70: Controller, 72: Position sensor.

Claims (5)

A light shielding layer is formed on the front substrate arranged opposite to the rear substrate on which a large number of electron-emitting devices are arranged,
Patterning a phosphor layer in a portion substantially free of the light shielding layer;
A resin film layer is provided on the phosphor layer,
A wire cutter having a plurality of wires arranged substantially in parallel is arranged on a one-to-one basis with respect to a plurality of dividing lines extending in the short side or long side direction of the front substrate. So as to align relative to the front substrate,
The wire cutter is moved relative to the front substrate, and each of the wires is pushed into the resin film layer along the planned cutting line, and each of the wires is energized to generate resistance heat, and the cutting is performed. The resin film is hot-pressed along the planned line,
A method of manufacturing an image display device, comprising forming a metal back layer functioning as an anode electrode on the divided resin film. The wire is pulled away from the resin film layer in a state where the wire is heated after being held for a predetermined time in a state where the wire is pushed down to a depth corresponding to the film thickness of the resin film layer. the method of. The wire is a round wire having a diameter of 17 to 120 µm, and is pressed into the metal back layer with a pressing force of 5 to 100 N in a state where the wire is heated to a temperature range of 50 to 200 ° C. The method according to any one of 1 or 2. The wire is a different diameter wire having an elliptical or elliptical cross section having a major axis of 17 to 120 μm, and the metal back layer is pressed with a pressing force of 5 to 100 N in a state where the wire is heated to a temperature range of 50 to 200 ° C. 4. A method as claimed in any one of claims 1 to 3, characterized in that it is pushed into the chamber. 5. The method according to claim 1, wherein the planned dividing line is set so as to correspond to a vertical dividing line that divides the phosphor layer into pixel units. 6.

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