JP2006080561A - Circuit board and its manufacturing method - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To obtain a circuit board having an even distance between electrodes which prevents shortening between a first electrode and a second electrode and improves reliability by ensuring an operating time, and to obtain its manufacturing method and electronic equipment using the same. <P>SOLUTION: The circuit board 1 is provided with a first conductive part forming substrate 104 having a first substrate 102 and the first electrode 103, a second conductive part forming substrate 107 having a second substrate 105 and the second electrode 106, and a dielectric part 2 interposed between the substrate 104 and the substrate 107. The dielectric part 2 is provided with a dielectric film 3 which does not melt in thermocompression bonding and a bonded insulator 4 which melts in the thermocompression bonding. The surface of the film 3 is treated to improve wettability, whereby the insulator 4 that has melted in the thermocompression bonding is liable to adhere to the film 3. The distance between the electrode 103 and the electrode 106 can be made even by allowing the film 3 to interpose therebetween. <P>COPYRIGHT: (C)2006,JPO&NCIPI

Description

  The present invention relates to a wiring board having a function of a capacitor, an inductor, or both, and a manufacturing method thereof.

  FIG. 11 is a cross-sectional view showing a configuration of a conventional wiring board. In FIG. 11, a conventional wiring substrate 101 includes a first substrate 102 that is, for example, a glass epoxy base material, and a conductive first electrode 103 that is a plurality of first conductive portions formed on the plane of the first substrate 102. The first conductive portion forming substrate 104 is provided. In addition, the wiring substrate 101 includes, for example, a second conductive portion having a second substrate 105 that is a glass epoxy base material and a conductive second electrode 106 that is a plurality of second conductive portions formed on the second substrate 105. A formation substrate 107 is provided. The first conductive portion forming substrate 104 and the second conductive portion forming substrate 107 are arranged with the first electrode 103 and the second electrode 106 facing each other. In addition, the wiring substrate 101 includes a dielectric portion 108 that is interposed between the first conductive portion forming substrate 104 and the second conductive portion forming substrate 107.

  The wiring board 101 configured as described above has a configuration as a parallel plate capacitor in which the first electrode 103 and the second electrode 106 are arranged to face each other via the dielectric portion 108 inside the wiring board 101. Therefore, there is no need to place a capacitor on the wiring board 101, and there is an advantage that the wiring board 101 can be downsized.

  Japanese Patent Application Laid-Open No. 2001-077539 discloses that an inductor is formed inside a wiring board by mixing a powder material having a high magnetic permeability into a dielectric portion of the wiring board. That is, the wiring board 101 can form not only a capacitor but also an inductor inside the wiring board 101 by mixing the dielectric material 108 with a powder material having a high magnetic permeability, and the wiring board 101 can be further downsized.

  Next, a method for manufacturing the wiring substrate 101 will be described. 12 to 14 are schematic views showing a procedure for manufacturing the wiring board 101. FIG. First, a plurality of first electrodes 103 are formed on the first substrate 102 to form a first conductive portion formation substrate 104. Next, after the dielectric sheet 109 is overlaid on the first electrode 103 side of the first conductive portion forming substrate 104, the metal foil 110 is overlaid thereon (FIG. 12). The dielectric sheet 109 is a thermosetting epoxy resin, and is cured when it melts at a predetermined temperature and further rises in temperature. Thereafter, while gradually raising the temperature to melt the dielectric sheet 109, the laminated first conductive part forming substrate 104, dielectric sheet 109 and metal foil 110 are sandwiched between stainless plates and pressed in the laminating direction. Then, the pressing force is adjusted so that a predetermined interval is formed between the metal foil 110 and the first electrode 103. This adjustment is continued until the dielectric sheet 109 is cured. In this way, the dielectric sheet 109 is formed as the dielectric part 108 in close contact with the first conductive part forming substrate 104 and the metal foil 110 (FIG. 13). Thereafter, the metal foil 110 is etched to form the second electrode 106 (FIG. 14). Finally, for example, a glass epoxy base material is heated and melted to form the second substrate 106 on the second electrode 105 side of the dielectric portion 108, and the wiring substrate 101 shown in FIG. 11 is manufactured.

In this way, the wiring substrate 101 is manufactured. In such a manufacturing method, the first conductive portion forming substrate 104 and the metal foil 110 are brought closer to each other in a state where the entire dielectric sheet 109 is melted. Since it is pressed, the dielectric sheet 109 tends to flow out to the outside on the outer peripheral side of the first conductive part forming substrate 104 and the metal foil 110, and the escape place decreases as it approaches the inner side, and it becomes difficult to flow out. Therefore, in the completed wiring board 101, the thickness of the dielectric portion 108 between the first electrode 103 and the second electrode 106 tends to be smaller on the outer peripheral side of the wiring board 101 and larger on the inner side. For this reason, even if the areas of the first electrode 103 and the second electrode 106 facing each other are the same, the thickness of the dielectric portion 108 interposed between the outer peripheral side and the inner side of the wiring substrate 101 is different. The capacitance values of these capacitors are also different. In particular, if the distance between the first electrode 103 and the second electrode 106 (hereinafter referred to as the interelectrode distance) is reduced in order to increase the capacity of the capacitor, the difference in the interelectrode distance is the corresponding difference in the capacity of the capacitor. Therefore, there is a problem in that the capacitance of the wiring board 101 is greatly different between the outer peripheral side and the inner side of the wiring board 101, and the variation of the capacitance value is increased at each location in the wiring board 101.
Further, for example, foreign matter is present between the first electrode 103 and the metal foil 110, or the first electrode 103 and the metal foil 110 are in direct contact with each other, so that the first electrode 103 and the second foil are connected to the wiring board 101. There has also been a problem that the electrode 106 may be short-circuited and may not function as a capacitor.
Further, even when the distance between the first electrode 103 and the second electrode 106 varies or the first electrode 103 and the second electrode 106 are short-circuited, an inductor is formed inside. Similarly, there is a problem that the inductance is greatly different between the outer peripheral side and the inner side of the wiring board 101.

  Further, in actual use, the life of the wiring board is often determined by internal peeling, and there is a problem that it is necessary to ensure the life of the wiring board by suppressing the occurrence of this peeling.

  Therefore, the present invention aims to solve the above-described problems. The distance between the internal electrodes is constant, and a short circuit between the first electrode and the second electrode is prevented. It is an object of the present invention to obtain a wiring board and a method for manufacturing the same that suppress generation and secure life and improve reliability.

  The wiring board according to the present invention includes a first substrate, a first conductive portion forming substrate having a spiral first conductive portion formed on a plane of the first substrate, a second substrate, and the second substrate. A second conductive part forming substrate having a spiral second conductive part formed, the second conductive part being disposed opposite to the first conductive part, the first conductive part forming substrate, and the second conductive part A wiring board having at least the dielectric part formed by thermocompression bonding, the dielectric part comprising an adhesive insulating part that melts during the thermocompression bonding, and the heat insulating part. A dielectric film whose thickness is maintained during crimping, and the adhesive insulating portion is provided on either the first conductive portion forming substrate side or the second conductive portion forming substrate side of the dielectric film. The dielectric film is provided between the first conductive portion and the second conductive portion. Between the electrodes, and a flexible crossover provided between the electrodes, and the first conductive portion, the second conductive portion, and the dielectric portion. An internal inductor is configured by an electrical connection portion that is provided in the formed through hole and electrically connects the first conductive portion and the second conductive portion so that the winding direction is the same.

  In addition, the through hole is formed by a laser, and the first conductive portion is subjected to a process for reducing the reflectance of the laser on the surface on the dielectric portion side.

  Further, the surface of the dielectric film is subjected to a treatment for improving wettability with the melted adhesive insulating portion.

  The dielectric film includes at least a dielectric base material and a powder having a higher magnetic permeability than the base material mixed in the base material.

  The wiring board manufacturing method according to the present invention includes a first conductive part forming substrate step of forming the first conductive part forming substrate by providing the first conductive part on the first substrate, and the first conductive part. A first conductive part processing step for reducing the reflectance of the laser on the surface of the part, and a first insulating film laminating step for superimposing an adhesive insulating film on the first conductive part side of the first conductive part forming substrate A dielectric film processing step for performing a process for improving the wettability of the dielectric film, a dielectric film stacking step for stacking the dielectric film on the adhesive insulating film, and a step after the dielectric film stacking step A second insulating film laminating step of overlaying an adhesive insulating film on the dielectric film; and a conductor film laminating step of providing a planar conductor film on the adhesive insulating film stacked in the second insulating film laminating step And melting the adhesive insulating film by the thermocompression bonding. A thermocompression bonding step of pressing the first conductive portion and the conductive film in a direction approaching to a second conductive portion forming step of forming the conductive film on the dielectric film as a plurality of the second conductive portions; A through hole forming step of forming the through hole by irradiating the surface of the first conductive portion with the laser before the second conductive portion forming substrate step; and the first conductive portion through the through hole. And an electrical connection step of electrically connecting the first conductive part and the second conductive part by forming the electrical connection part between the second conductive part, and the second conductive part as the second substrate. And a second conductive part forming substrate step of forming the second conductive part forming substrate, and in the thermocompression bonding step, the bonding insulating film is between the first conductive part and the dielectric film, respectively. , Between the conductor film and the dielectric film facing the first conductive part Et the dielectric film is formed as the adhesive insulating portion extruded and while bending, so that the dielectric portion is formed by the dielectric film and the adhesive dielectric portion.

  A first conductive part forming substrate having a first substrate and a spiral first conductive part formed on the plane of the first substrate at an interval, a second substrate, and a vortex formed on the second substrate A second conductive part forming substrate, the second conductive part forming substrate being disposed so as to face the first conductive part, the first conductive part forming substrate, and the second conductive part forming substrate. Between the adhesive insulating portion that is formed by at least thermocompression bonding and melts at the time of the thermocompression bonding, and between the first conductive portion and the second conductive portion, and on the surface, the molten A dielectric part having a dielectric film that is treated to improve wettability with the adhesive insulating part and has a thickness that is maintained during the thermocompression bonding; and the first conductive part, the second conductive part, , Provided in the through-hole formed in the dielectric part, and the winding direction is the same A wiring board manufacturing method for manufacturing a wiring board in which an internal inductor is configured from an electrical connection part for electrically connecting the first conductive part and the second conductive part, wherein the first conductive part A first conductive part forming substrate step of providing a part on the first substrate to form the first conductive part forming substrate, and a first process of reducing the reflectance of the laser on the surface of the first conductive part A conductive portion processing step, a first insulating film laminating step of stacking an adhesive insulating film on the first conductive portion side of the first conductive portion forming substrate, and a treatment for improving the wettability on one surface of the dielectric film. And a dielectric film processing step for performing a process for improving adhesion to the second conductive portion on the other surface, and the dielectric film is overlaid on the adhesive insulating film with the one surface facing the insulating film for bonding. A dielectric film stacking step, and a conductive film as the other of the dielectric film. A conductive film laminating step, a thermocompression bonding step of melting the adhesive insulating film by the thermocompression bonding and pressing the first conductive portion and the conductive film toward each other; and on the dielectric film Before the second conductive part forming step of forming the conductive film as the second conductive part and the second conductive part forming substrate step, the laser is irradiated toward the surface of the first conductive part, and A through hole forming step of forming a through hole; and forming the electrical connection portion between the first conductive portion and the second conductive portion through the through hole to electrically connect the first conductive portion and the second conductive portion. An electrical connection step of connecting the second conductive portion and a second conductive portion formation substrate step of covering the second conductive portion with the second substrate to form the second conductive portion formation substrate, and in the thermocompression bonding step, The bonding insulating film includes the first conductive portion and the dielectric film. The dielectric part is formed by the dielectric film and the adhesive insulating part.

  As is clear from the above description, the wiring board according to the present invention includes a first substrate, a first conductive portion formation substrate having a spiral first conductive portion formed on a plane of the first substrate, A second conductive portion forming substrate having two substrates and a spiral second conductive portion formed on the second substrate, the second conductive portion being disposed so as to face the first conductive portion; And a dielectric part interposed between the first conductive part forming substrate and the second conductive part forming substrate, wherein at least the dielectric part is formed by thermocompression bonding. An adhesive insulating portion that melts; and a dielectric film that maintains a thickness during the thermocompression bonding. The adhesive insulating portion includes the first conductive portion forming substrate side of the dielectric film and the second conductive film. The dielectric film is provided on either side of the conductive part forming substrate side, and the dielectric film is connected to the first conductive part. A plurality of interelectrode portions interposed between the second conductive portions, and a flexible crossover portion provided to bend across each of the interelectrode portions, the first conductive portion; From the second conductive portion and an electrical connection portion that is provided in a through hole formed in the dielectric portion and electrically connects the first conductive portion and the second conductive portion so that the winding direction is the same. Since the internal inductor is configured, the difference due to the location of the distance between the first conductive portion and the second conductive portion is reduced, and a space for arranging the inductor on the wiring board becomes unnecessary, and the wiring The board can be miniaturized.

  Further, the through hole is formed by a laser, and the first conductive portion is subjected to a process for reducing the reflectance of the laser on the surface on the dielectric portion side. At the time of formation, the first conductive part can easily absorb the energy of the laser, and the through hole can be easily formed by a temperature rise due to the absorption.

  Further, since the surface of the dielectric film has been subjected to a treatment for improving the wettability with the melted adhesive insulating portion, the adhesion force between the dielectric film and the adhesive insulating portion is increased. It becomes difficult to peel between the dielectric film and the adhesive insulating portion.

  Further, since the dielectric film is composed of at least a dielectric base material and a powder having a higher magnetic permeability than the base material mixed in the base material, when the internal inductor is formed, The inductance can be increased.

  The wiring board manufacturing method according to the present invention includes a first conductive part forming substrate step of forming the first conductive part forming substrate by providing the first conductive part on the first substrate, and the first conductive part. A first conductive part processing step for reducing the reflectance of the laser on the surface of the part, and a first insulating film laminating step for superimposing an adhesive insulating film on the first conductive part side of the first conductive part forming substrate A dielectric film processing step for performing a process for improving the wettability of the dielectric film, a dielectric film stacking step for stacking the dielectric film on the adhesive insulating film, and a step after the dielectric film stacking step A second insulating film laminating step of overlaying an adhesive insulating film on the dielectric film; and a conductor film laminating step of providing a planar conductor film on the adhesive insulating film stacked in the second insulating film laminating step And melting the adhesive insulating film by the thermocompression bonding. A thermocompression bonding step of pressing the first conductive portion and the conductive film in a direction approaching to a second conductive portion forming step of forming the conductive film on the dielectric film as a plurality of the second conductive portions; A through hole forming step of forming the through hole by irradiating the surface of the first conductive portion with the laser before the second conductive portion forming substrate step; and the first conductive portion through the through hole. And an electrical connection step of electrically connecting the first conductive part and the second conductive part by forming the electrical connection part between the second conductive part, and the second conductive part as the second substrate. And a second conductive part forming substrate step of forming the second conductive part forming substrate, and in the thermocompression bonding step, the bonding insulating film is between the first conductive part and the dielectric film, respectively. , Between the conductor film and the dielectric film facing the first conductive part The dielectric film is pushed out while being bent and formed as the adhesive insulating part, and the dielectric part is formed by the dielectric film and the adhesive dielectric part. A wiring board is manufactured. Moreover, the formation of the through hole by the laser can be easily performed in a short time, and the manufacturing time of the wiring board can be shortened.

  A first conductive part forming substrate having a first substrate and a spiral first conductive part formed on the plane of the first substrate at an interval, a second substrate, and a vortex formed on the second substrate A second conductive part forming substrate, the second conductive part forming substrate being disposed so as to face the first conductive part, the first conductive part forming substrate, and the second conductive part forming substrate. Between the adhesive insulating portion that is formed by at least thermocompression bonding and melts at the time of the thermocompression bonding, and between the first conductive portion and the second conductive portion, and on the surface, the molten A dielectric part having a dielectric film that is treated to improve wettability with the adhesive insulating part and has a thickness that is maintained during the thermocompression bonding; and the first conductive part, the second conductive part, , Provided in the through-hole formed in the dielectric part, and the winding direction is the same A wiring board manufacturing method for manufacturing a wiring board in which an internal inductor is configured from an electrical connection part for electrically connecting the first conductive part and the second conductive part, wherein the first conductive part A first conductive part forming substrate step of providing a part on the first substrate to form the first conductive part forming substrate, and a first process of reducing the reflectance of the laser on the surface of the first conductive part A conductive portion processing step, a first insulating film laminating step of stacking an adhesive insulating film on the first conductive portion side of the first conductive portion forming substrate, and a treatment for improving the wettability on one surface of the dielectric film. And a dielectric film processing step for performing a process for improving adhesion to the second conductive portion on the other surface, and the dielectric film is overlaid on the adhesive insulating film with the one surface facing the insulating film for bonding. A dielectric film stacking step, and a conductive film as the other of the dielectric film. A conductive film laminating step, a thermocompression bonding step of melting the adhesive insulating film by the thermocompression bonding and pressing the first conductive portion and the conductive film toward each other; and on the dielectric film Before the second conductive part forming step of forming the conductive film as the second conductive part and the second conductive part forming substrate step, the laser is irradiated toward the surface of the first conductive part, and A through hole forming step of forming a through hole; and forming the electrical connection portion between the first conductive portion and the second conductive portion through the through hole to electrically connect the first conductive portion and the second conductive portion. An electrical connection step of connecting the second conductive portion and a second conductive portion formation substrate step of covering the second conductive portion with the second substrate to form the second conductive portion formation substrate, and in the thermocompression bonding step, The bonding insulating film includes the first conductive portion and the dielectric film. Since the dielectric part is formed by the dielectric film and the adhesive insulating part, the wiring board is manufactured easily in a short time. The In addition, the through hole can be easily formed in a short time by the laser, and the manufacturing time of the wiring board can be shortened.

Embodiments of the present invention will be described below, but the same or equivalent members and parts as those of the conventional example will be described with the same reference numerals.
Embodiment 1 FIG.
1 is a cross-sectional view showing a configuration of a wiring board according to Embodiment 1 of the present invention. In FIG. 1, a wiring board 1 includes a first substrate 102 that is, for example, a glass epoxy base material, and a plate-like first electrode 103 that is a first conductive portion formed on the plane of the first substrate 102. A first conductive portion forming substrate 104 is provided. Further, the wiring board 1 includes a second conductive part having a second substrate 105 that is, for example, a glass epoxy base material and a plate-like second electrode 106 that is a plurality of second conductive parts formed on the second substrate 105. A formation substrate 107 is provided. The first conductive portion forming substrate 104 and the second conductive portion forming substrate 107 are arranged with the first electrode 103 and the second electrode 106 facing each other. In addition, the wiring substrate 1 includes a dielectric portion 2 made of a dielectric material interposed between the first conductive portion forming substrate 104 and the second conductive portion forming substrate 107. The dielectric part 2 has a dielectric film 3 and an adhesive insulating part 4 having different melting points.

  In the first conductive portion formation substrate 104, the first electrode 103 has a thickness of 18 μm, for example, and is formed on the plane of the first substrate 102 so as to protrude by the thickness. A plurality of first electrodes 103 are formed at intervals, and a recess 5 is formed between each first electrode 103.

  In the second conductive portion formation substrate 107, the second electrode 106 is, for example, 18 μm thick and is embedded in the second substrate 105 with the surface on the first conductive portion formation substrate 104 side exposed.

  The dielectric film 3 is, for example, a polyphenylene sulfide film having a dielectric constant of 3 formed with a constant thickness of 6 μm, for example, and includes an interelectrode portion 6 interposed between the first electrode 103 and the second electrode 106, It is comprised from the transition part 7 provided across the part 6 between electrodes. The dielectric film 3 is flexible, and the transition portion 7 is provided to be bent toward the concave portion 5. The surface of the dielectric film 3 that is in contact with the adhesive insulating portion 4 is subjected to, for example, corona discharge treatment.

  The adhesive insulating part 4 includes a first adhesive insulating part 4 a provided on the first conductive part forming substrate 104 side of the dielectric film 3 and a second adhesive part provided on the second conductive part forming substrate 107 side of the dielectric film 3. It is comprised from the adhesive insulation part 4b. The material of the adhesive insulating portion 4 is a thermosetting epoxy resin that is cured at about 180 ° C., and adheres the dielectric film 3 and the first conductive portion forming substrate 104, and the dielectric film 3 and the second conductive portion. The formation substrate 107 is bonded. The first adhesive insulating portion 4a fills the space surrounded by the crossover portion 7 and the concave portion 5, and is thinly interposed between the first electrode 103 and the interelectrode portion 6 so as not to affect the interelectrode distance. Thus, the dielectric film 3 is bonded to the first conductive part forming substrate 104. The second adhesive insulating portion 4b fills the space formed between the bent transition portion 7 and the second substrate 105, and does not affect the inter-electrode distance. The dielectric film 3 is bonded to the second conductive portion forming substrate 107 with a thin intervening space therebetween.

  In the wiring substrate 1 having such a configuration, the inter-electrode portion 6 having a constant thickness is interposed between the first electrode 103 and the second electrode 106, and the adhesive insulating portion 4 is connected to the first electrode 103 and the second electrode 106. The distance between the electrodes is determined by the thickness of the inter-electrode portion 6 because the inter-electrode distance is so thin as not to affect the inter-electrode distance. Therefore, variation in the capacitance of the capacitors formed inside is suppressed.

  In addition, the dielectric film 3 and the adhesive insulating portion 4 which are different materials are usually difficult to adhere to each other. However, since the surface of the dielectric film 3 is subjected to, for example, corona discharge treatment, the adhesion is improved. Peeling is less likely to occur.

Next, a method for manufacturing such a wiring board 1 will be described. 2 to 5 are schematic views showing respective states in the manufacturing process of the wiring board 1. As shown in FIGS. 2 to 5, first, for example, a first electrode 103 having a thickness of 18 μm, for example, is formed on a plane of 340 mm in length and width of the first substrate 102, for example, every 10 mm except for a peripheral portion 30 mm on the plane of the first substrate 102. The first conductive part forming substrate 104 is formed in a matrix in the same manner as in the conventional case (first conductive part forming substrate step, FIG. 2). Next, for example, the first adhesive insulating film 10, which is a thermosetting epoxy resin adhesive insulating film that cures at about 150 ° C. at a melt viscosity of 10 ⁵ P and about 180 ° C., is formed on the first conductive portion forming substrate 104. The dielectric film 3 is overlaid on the first bonding insulating film 10 (dielectric film laminating process). The dielectric film 3 has been subjected to a treatment for improving the wettability with the fused insulating film by the corona discharge treatment on the surface until the dielectric film laminating step. The treatment for improving the wettability may be ozone treatment or oxygen plasma treatment (dielectric film treatment step). Further, a second adhesive insulating film 11 which is an adhesive insulating film made of the same material as the first adhesive insulating film 10 is further stacked thereon (second insulating film laminating step). Here, the thickness of the first bonding insulating film 10 is, for example, 10 μm, which is smaller than the thickness of the first electrode 103, and the thickness of the second bonding insulating film 11 is, for example, 5 μm. Further, the thickness of the dielectric film 3 is, for example, 6 μm as described above.
Thereafter, a conductive conductor film 12 made of, for example, 18 μm thick copper foil is overlaid on the second adhesive insulating film 11 (conductor film lamination step) to obtain the state shown in FIG.

  Thereafter, the first conductive part forming substrate 104, the first bonding insulating film 10, the dielectric film 3, the second bonding insulating film 11 and the conductive film 12 are connected to the first conductive part forming substrate 104 side and the conductive film 12. It is pressed from the side in a direction approaching each other with a stainless steel plate as a crimping plate. At this time, it is pressed and heated to a temperature of about 180 ° C., that is, a temperature at which the thermosetting epoxy resin is cured at a temperature rising rate of 6 ° C./min (thermocompression bonding step). Here, the material of the dielectric film 3 is a flexible material that does not melt even at the highest temperature in the thermocompression bonding process, and is, for example, polyphenylene sulfide that does not melt even at about 180 ° C. where the adhesive insulating film is cured. On the other hand, the material of the first bonding insulating film 10 and the second bonding insulating film is a thermosetting epoxy resin that melts and cures in this thermocompression bonding step. Therefore, when the temperature is increased in the thermocompression bonding process, only the first bonding insulating film 10 and the second bonding insulating film 11 are melted.

  Further, since the first electrode 103 is formed on the first substrate 102 so as to protrude by the thickness, the pressing force sandwiched by the stainless steel plate exists between the first electrode 103 and the conductor film 12. It acts directly on the first bonding insulating film 10, the dielectric film 3, and the second bonding insulating film 11. Therefore, when the first bonding insulating film 10 and the second bonding insulating film 11 are melted by the temperature rise, they are pushed out from between the first electrode 103 and the conductor film 12 by this pressing force. At this time, the first bonding insulating film 10 flows into the recess 5, and the second bonding insulating film 11 flows into the space formed by the dielectric film 3 being bent by the pressure to be pushed out. Then, the temperature is raised to about 180 ° C. and cured, and the first adhesive insulating film 10 is formed as the first adhesive insulating portion 4a, and the second adhesive insulating film 11 is formed as the second adhesive insulating portion 4b. In order to secure this space for flowing in, the total thickness of the first adhesive insulating film 10 and the second adhesive insulating film 11 is made smaller than the thickness of the first electrode 103, that is, the depth of the recess 5. ing. That is, the first adhesive insulating film 10 and the second adhesive insulating film 11 flow into the recess 5 from between the first electrode 103 and the conductor film 12, respectively, and are formed in the space formed by bending the dielectric film 3. The sum of the thicknesses of the first adhesive insulating film 10 and the second adhesive insulating film 11 is smaller than the thickness of the first electrode 103 by an amount corresponding to the thickness that increases by flowing. Accordingly, when the area ratio of the first electrode 103 to the plane of the first substrate 102 is large, the total thickness of the first bonding insulating film 10 and the second bonding insulating film 11 is larger than the thickness of the first electrode 103. However, if the area ratio is small, it is necessary to reduce the difference. Further, as the thickness of the second adhesive insulating film 11 is increased, the dielectric film 3 is greatly deflected, and there is a possibility that the dielectric film 3 is burdened and the life and the like are affected. The body film 3 is set to an appropriate thickness that does not greatly bend. Conductive film 12 The first bonding insulating film 10 and the second bonding insulating film 11 are not all extruded from between the first electrode 103 and the conductive film 12, but are extremely thin necessary for bonding. Only the layer remains.

  Since the dielectric film 3 is not melted in this thermocompression bonding step, it remains as the inter-electrode portion 6 while keeping the thickness constant between the first electrode 103 and the conductor film 12, and the melted second adhesion The insulating film 11 is bent by the pressure of the insulating film 11 and is formed as a crossing portion 7 between the inter-electrode portions 6 to be in the state shown in FIG.

  Thereafter, the conductor film 12 is left as a second electrode 106 by etching or the like so as to face the first electrode 103 (second conductive part forming step), and the state shown in FIG. 5 is obtained. Finally, the second substrate 105 is formed on the second electrode 106 side of the dielectric film 3 in the same manner as the conventional example, and the second conductive portion forming substrate 107 is formed (second conductive portion forming substrate step). 1 is manufactured.

  Therefore, the wiring substrate 1 having the above-described configuration can be easily manufactured. Further, for example, even if foreign matter is mixed between the first electrode 103 and the second electrode 106, the first electrode 103 and the second electrode 106 are used. The possibility of short-circuiting and becomes extremely small.

  In the first conductive part forming substrate process and the conductor film stacking process, the first electrode 103 and the conductor film 12 are naturally made of a metal other than copper, such as zinc, nickel, gold, silver, aluminum, or the like. Any material may be used as long as it has conductivity, such as an alloy of the above, or a conductive polymer represented by polythiophene. The first electrode 103 and the conductor film 12 may be formed by any method such as a vapor phase method or a method of applying and baking a conductive paste.

The material of the dielectric film 3 does not need to be polyphenylene sulfide, and may be any material that does not melt or decompose in the thermocompression bonding process. Therefore, polyphenylsulfone, polyimide, polyetherimide, polyphenyl oxide, polyamide, polycarbonate Polyester, polyvinyl chloride, polysilane, polyethyl ether ketone, acetate, polypropylene and the like may be used.
Furthermore, since the dielectric film 3 is easily deformed by the pressing force when the Young's modulus becomes low at the temperature in the thermocompression bonding process and directly affects the variation in the distance between the electrodes, the dielectric film 3 has a temperature in the thermocompression bonding process. However, it is desirable that the Young's modulus, such as 1 GPa or more, that does not easily change the thickness by this pressing force can be secured.

  In addition, the dielectric film 3 is configured by mixing, for example, 20% of a powder such as barium titanate having a dielectric constant higher than that of the base material such as polyphenylene sulfide into the base material. If so, the dielectric constant of the dielectric portion 2 of the completed wiring board 1 is further increased, and the capacity of the internal capacitor can be increased. In addition, it is possible to adjust the size of the capacitance density of the internal capacitor by changing the mixing ratio of such powder into the dielectric film 3. The powder to be kneaded is not limited to barium titanate, and may be an inorganic crystal having a perovskite structure.

  The first substrate 102 need not be limited to a glass epoxy base material, and may be glass bismaleimide triazine, glass polyphenylene oxide, polyimide, paper phenol, alumina, or the like.

  In the second conductive portion forming step, the first electrode 103 and the second electrode 106 function as an internal capacitor only in a portion where the first electrode 103 and the second electrode 106 face each other. The opposing conductor film 12 may be left as it is or removed.

  In the thermocompression bonding process, the first bonding insulating film 10 and the second bonding insulating film 11 may be melted and the first conductive portion forming substrate 104, the dielectric film 3, and the conductive film 12 may be pressure bonded. Any method such as a vacuum heat press or a laminator may be used.

  The order of each process may be changed as long as the wiring substrate 1 can be formed. For example, the first insulating film stacking process is performed after the dielectric film stacking process and the second insulating film stacking process. Also good.

The internal capacitor of the wiring board 1 in this embodiment had an average capacitance density at 1 kHz of 4.3 pF / mm ² close to the theoretical value, and the standard deviation of this capacitance density was 0.2 pF / mm ² . As a comparative example, the wiring board 101 in which the dielectric portion 109 is formed by melting the dielectric sheet 109 by the method of the conventional example, 21 of the 784 first electrodes 103 are short-circuited to the second electrode 106 and the capacitor The capacity density at 1 kHz of the remaining internal capacitors was 4.0 pF / mm ² on average, and the standard deviation of this capacity density was 2.3 pF / mm ² . Therefore, it was confirmed that the wiring board 1 can reliably form the internal capacitor, and its capacitance value can be closer to a desired value than the conventional example. Moreover, it was confirmed that the wiring board 1 has a smaller variation in the capacitance density of the internal capacitor than in the conventional example.

In addition, the wiring substrate 1 in the first embodiment was left in an environment of an ambient temperature of 30 ° C. and a relative humidity of 70% for 500 hours or 1000 hours, respectively. Then, assuming the soldering state, it was immersed in a solder bath at 280 ° C. for 10 seconds, and the influence of the adhesive insulating portion 4 formed by melting the insulating film on the wiring board 1 was examined. As a comparative example, the configuration is the same as that of the wiring substrate 1 of the first embodiment, but a wiring substrate in which the surface treatment of the dielectric film 3 is not performed is used.
As a result, no peeling site was found on either wiring board when left for 500 hours, but when left for 1000 hours, wiring board 1 of the first embodiment, that is, wiring board 1 obtained by subjecting dielectric film 3 to surface treatment. No peeling occurred at any location, but peeling occurred between the dielectric film 3 and the adhesive insulating portion 4 in the comparative board. Accordingly, in the dielectric film processing step, it is confirmed that the adhesion between the dielectric film 3 and the adhesive insulating portion 4 is improved by performing surface treatment such as corona discharge treatment, ozone treatment or oxygen plasma treatment. It was confirmed that the reliability of the printed wiring board was improved.

Embodiment 2. FIG.
FIG. 6 is a cross-sectional view showing a configuration of a wiring board according to Embodiment 2 of the present invention. In FIG. 6, the wiring substrate 21 includes a dielectric portion 22 interposed between the first conductive portion forming substrate 104 and the second conductive portion forming substrate 107. The dielectric part 22 exists only between the dielectric film 23 interposed between the first conductive part formation substrate 104 and the second conductive part formation substrate 107 and between the dielectric film 23 and the first conductive part formation substrate 104. It is comprised from the adhesive insulation part 24. FIG. The adhesive insulating part 24 is made of the same material as the adhesive insulating part 4 of the first embodiment. In addition, the adhesive insulating portion 24 fills the space formed between the dielectric film 23 and the recess 5, and between the first electrode 103 and the dielectric film 23 to the extent that the distance between the electrodes is not affected. The dielectric film 23 is bonded to the first conductive portion forming substrate 104 with a thin interposition. That is, the wiring board 21 is configured such that the dielectric portion 22 does not include the second adhesive insulating portion 4b of the wiring board 1 in the first embodiment. In addition, the dielectric film 23 is subjected to, for example, corona discharge treatment on the surface on the adhesive insulating portion 24 side, and similarly subjected to, for example, corona discharge treatment on the surface on the second electrode 106 side.
Other configurations are the same as those in the first embodiment.

  The wiring board 21 having such a configuration has the same effects as those of the first embodiment, and since the dielectric film 23 is not bent, the burden due to the bending of the dielectric film 23 is reduced, and the life and the like are increased.

  In addition, since the surface of the dielectric film 23 is subjected to, for example, corona discharge treatment, the adhesion between the dielectric film 23 and the adhesive insulating portion 24 and the adhesion between the dielectric film 23 and the second electrode 106 are improved. The reliability of the wiring board 21 is improved.

Next, a method for manufacturing such a wiring board 21 will be described. First, in the same manner as in the first embodiment, an adhesive insulating film similar to the first adhesive insulating film 10 is formed on the first conductive part forming substrate 104 through the first conductive part forming substrate step and the first insulating film laminating step. Are overlaid. The thickness of the bonding insulating film is smaller than the thickness of the first electrode 103 by the amount that flows into the recess 5 in the subsequent thermocompression bonding step. On the other hand, for example, corona discharge treatment is performed on both surfaces of a dielectric film 23 having a thickness of 6 μm, for example, which is the same material as that of the dielectric film 3 (dielectric film processing step), and the conductor shown in FIG. A conductor film having a thickness of 18 μm similar to that of the film 12 is formed by vapor deposition. At this time, the conductor film may be formed by electroplating after vapor deposition in order to adjust the thickness of the conductor film (conductor film lamination step). The dielectric film 23 obtained by laminating this conductive film is superposed on the adhesive insulating film superposed on the first conductive portion forming substrate 104 with the other surface facing (dielectric film laminating step), and the first embodiment In the same thermocompression bonding step, an adhesive insulating film is extruded from between the first electrode 103 and the conductor film to form an adhesive insulating portion 24, and the dielectric insulating portion 24 and the dielectric film 23 form the dielectric portion 22. Is formed.
Thereafter, similarly to the first embodiment, the wiring substrate 21 is manufactured through the second conductive portion forming step and the second conductive portion forming substrate step.

  In the dielectric film treatment process, both surfaces of the dielectric film 23 are subjected to corona discharge treatment, but may be ozone treatment or oxygen plasma treatment as in the first embodiment. The surface treatment may be different from the other surface. For example, corona discharge treatment may be performed on one surface and ozone treatment may be performed on the other surface.

  In the conductor film laminating step, the conductor film may be formed by vapor deposition using nickel, zinc or chromium other than copper, and a conductive polymer or conductive paste represented by polythiophene dissolved in a solvent. It may be formed by printing. The conductor film is preferably made of a material that is easily etched in the second conductive portion forming step, for example, a material mainly composed of copper, nickel, zinc, or the like.

Here, in order to confirm that the adhesion between the dielectric film 23 and the conductive film and the adhesive insulating portion 24 is improved by the surface treatment in the dielectric film processing step, the same as in the first embodiment. The wiring substrate 21 is left for 500 hours or 1000 hours in an environment of an ambient temperature of 30 ° C. and a relative humidity of 70%, respectively, and the soldering state is virtually immersed in a solder bath at 280 ° C. for 10 seconds to peel off the wiring substrate 21. I checked the condition.
As a result, the wiring substrate 21 was not peeled off at any position when left for 500 hours or 1000 hours. Therefore, in the dielectric film processing step, by performing surface treatment such as corona discharge treatment, ozone treatment, or oxygen plasma treatment, not only the adhesion between the dielectric film 23 and the adhesive insulating portion 24 but also the dielectric film 23 and It was confirmed that the adhesion with the conductor film was also improved, and it was confirmed that the reliability of the wiring board 21 was improved.

Embodiment 3 FIG.
7 is a cross-sectional view showing a configuration of a wiring board according to Embodiment 3 of the present invention, FIG. 8 is a cross-sectional view taken along line VIII-VIII in FIG. 7, and FIG. It is arrow sectional drawing along the IX line. 7 is a cross-sectional view taken along the line VII-VII in FIG. 8 or FIG. 7 to 9, the wiring board 31 includes a first conductive line 32 that is a first conductive part and a second conductive line 33 that is a second conductive part, which are partially opposed to each other via the dielectric part 2. Yes. The material of the first conductive line 32 and the second conductive line 33 is the same as the material of the first electrode 103 and the second electrode 106 of the first embodiment. As shown in FIGS. 8 and 9, the first conductive line 32 and the second conductive line 33 are opposite to each other from the inner end portions 32 a and 33 a toward the outer end portions 32 b and 33 b, respectively. It is formed in a spiral. In addition, the dielectric portion 2 is provided with a through hole 34 leading from the inner end portion 32a of the first conductive wire 32 to the inner end portion 33a of the second conductive wire 33, and the inner end portion 32a in the through hole 34. The inner end portion 33 a is, for example, plated with copper to form an electrical connection portion 35, and the first conductive wire 32 and the second conductive wire 33 are electrically connected. 8 and 9, a portion where the first conductive line 32 and the second conductive line 33 face each other with the dielectric portion 2 interposed therebetween is shown by a stitch pattern.
Other configurations are the same as those in the first embodiment.

  The wiring board 31 having such a configuration has the same effect as that of the first embodiment, and is electrically connected by the electric connecting portion 35 so that the first conductive wire 32 and the second conductive wire 33 have the same winding direction inside. Therefore, the spiral inductor can be formed inside by the first conductive line 32, the second conductive line 33, and the electrical connecting portion 35, and the inductor arrangement space on the wiring board 31 is reduced accordingly. be able to. In addition, since the distance between the first conductive line 32 and the second conductive line 33 is determined by the thickness of the dielectric film 3, the inductance of the internal inductor is greatly different everywhere in the wiring board 31. Can be suppressed.

Next, a method for manufacturing such a wiring board 31 will be described. The manufacturing method of this wiring substrate 31 is almost the same as that of the first embodiment until the second conductive portion forming substrate step, but the first conductive portion is not the first electrode 103 but the first conductive portion forming step in the first conductive portion forming substrate step. The first conductive line 32 is different from the first embodiment in that the second conductive part is formed as the second conductive line 33 instead of the second electrode 106 by etching or the like in the second conductive part forming step. In this manner, the manufacturing process substantially similar to that of the first embodiment is followed to obtain a state as shown in FIG. 10 before the second conductive portion forming substrate process. Thereafter, for example, a carbon dioxide laser is irradiated from the second conductive line 33 side of the dielectric part 2 toward the first conductive line 32, that is, in the direction of the arrow 40, thereby forming the through hole 34 in the dielectric part 2. At this time, the carbon dioxide laser is irradiated through a path that contacts the inner end portion 33a of the second conductive wire 33 and hits the inner end portion 32a of the first conductive wire 32 via the dielectric portion 2 (through hole forming step). ). Then, the electrical connection portion 35 is formed by performing chemical copper plating on the inner end portion 32a and the inner end portion 33a in the through hole 34 formed in the through hole forming step, and the first conductive line 32 and the second conductive line 33 are formed. Is electrically connected (electrical connection step).
Thereafter, the wiring substrate 31 is completed through the second conductive portion formation substrate step similar to that of the first embodiment.

  The internal inductor of the wiring board 31 in this embodiment has an average inductance at 1 kHz of 6.3 nH, and the standard deviation of this inductance is 0.17 nH. As a comparative example, when a wiring board manufactured in the same manner as in the third embodiment is used except that the dielectric portion 108 is formed by melting the dielectric sheet 109 by the conventional method, The inductor had an average inductance of 2.1 nH at 1 kHz, and the standard deviation of the inductance was 1.9 nH. Therefore, it was confirmed that the wiring board 31 was formed more reliably than the conventional example, as was the case with the internal capacitor, and that the variation in inductance was smaller than that of the comparative example.

  In the through hole forming step, the formation of the through hole 34 is not limited to the carbon dioxide laser, and it is sufficient that the through hole 34 can be formed. For example, an excimer laser, a YAG laser, or a drill may be used.

  In the electrical connection step, the formation of the electrical connection portion 35 is not limited to chemical copper plating in the through hole 34. For example, the conductive polymer as described above is filled in the through hole 34. Alternatively, plating with zinc, nickel or the like may be used. Further, after chemical plating, electroplating may be performed to increase the thickness of the plating layer.

  The dielectric film 3 is made of, for example, a Ni-Zn ferrite powder having a higher magnetic permeability than that of a base material such as polyphenylene sulfide as in the first embodiment, for example, 20% into the base material. If it is rarely configured, the permeability of the dielectric portion 2 is further increased, and the inductance of the internal inductor is increased. Further, by arranging this powder close to the first conductive line 32 and the second conductive line 33 in the dielectric portion 2, the inductance of the internal inductor can be further increased. Further, the inductance of the internal inductor can be adjusted by changing the ratio or arrangement position of the powder of the material having high magnetic permeability mixed in the dielectric film 3. The powder to be kneaded is not limited to Ni—Zn ferrite, but may be permalloy, Mn—Zn ferrite, carbonyl iron or the like.

  Here, the mechanism of forming the through hole 34 in the through hole forming step will be described. When a carbon dioxide laser or the like is applied to the dielectric part 2, a part of the energy is absorbed by the dielectric part 2, but most of the energy passes through the dielectric part 2 and reaches the inner end part 32 a of the first conductive line 32. To reach. The inner end portion 32a rises in temperature by absorbing the energy of the reached carbon dioxide laser. Due to this temperature rise, the dielectric portion 2 in close contact with the inner end portion 32a is melted and vaporized to form the through hole 34. Therefore, the through hole 34 is formed faster as the temperature increase rate of the inner end portion 32a is larger. Therefore, if the inner end portion 32a can efficiently absorb the energy of the carbon dioxide laser, the through hole 34 can be formed quickly.

  Therefore, after the first conductive part forming substrate step, the surface of the first conductive line 32 is treated with an organic acid such as acetic anhydride, for example, so that the surface of the first conductive line 32 efficiently absorbs energy such as a carbon dioxide laser. By performing the organic acid treatment soaking the substrate (first conductive part treatment step), the reflectance of the surface of the first conductive wire 32 is lowered, and the energy absorption rate of the carbon dioxide laser can be improved. For example, the reflectance of the surface of the first conductive wire 32 can be similarly lowered by performing an alkali treatment in which the surface of the first conductive wire 32 is immersed in a sodium hydroxide aqueous solution or a potassium hydroxide aqueous solution. Actually, the reflectance of the surface of the first conductive wire 32 with respect to the carbon dioxide laser can be reduced to 20% or less by both the organic acid treatment and the alkali treatment.

Actually, since the through hole 34 is formed by applying the pulse of the carbon dioxide laser to the dielectric portion 2, the surface using the first conductive wire 32 that has not been subjected to any surface treatment and the organic acid treatment on the surface are used. Alternatively, the formation speed of the through hole 34 was compared by examining the number of pulses until the through hole 34 was formed using the first conductive wire 32 subjected to the alkali treatment. As a result, in the case of using the first conductive wire 32 that has not been subjected to surface treatment at all, the number of pulses until the through-hole 34 is formed is seven, whereas the surface is treated with organic acid. Or in the thing using the 1st conductive wire 32 which performed the alkali treatment, the through-hole 34 was formed at once.
Therefore, by inserting the first conductive portion processing step during the manufacturing process of the wiring substrate 31, the through hole 34 can be easily formed in the dielectric portion 2, and the manufacturing time of the wiring substrate 31 is shortened. . In addition, the burden on the laser processing machine that generates the carbon dioxide laser is reduced, and the life of the processing machine is extended.

  As a matter of course, the organic acid treatment or alkali treatment can also efficiently reduce the reflectivity with respect to an excimer laser, a YAG laser, or the like. Further, the surface treatment of the first conductive wire 32 may be any treatment that lowers the reflectivity with respect to the laser irradiated to form the through-hole 34, and is not limited to organic acid treatment or alkali treatment. You may perform the process which apply | coats the ink which mixed the filler on the surface of the 1st conductive wire 32. FIG.

  In the third embodiment, the wiring board 31 having the internal inductor is manufactured based on the manufacturing method of the wiring board 1 of the first embodiment having the second adhesive insulating portion 4b. As a matter of course, a wiring board having an internal inductor may be manufactured based on the manufacturing method of the wiring board 21 of the second embodiment that does not have the second adhesive insulating portion 4b.

Further, it may be a wiring board in which an internal capacitor and an internal inductor are simultaneously formed in the same layer. In this case, if both the high magnetic permeability powder and the high dielectric constant powder are kneaded into the base material of the dielectric film 3, the capacitance density is increased by the high dielectric constant powder in the portion where the internal capacitor is formed. Thus, in the portion where the internal inductor is formed, the inductance density is increased by the powder having high magnetic permeability.
As described above, since the internal capacitor and the internal inductor are formed in one wiring board, for example, a circuit that functions as an LC filter and a bypass capacitor can be formed by electrically connecting the internal inductor to the internal capacitor. Therefore, it is not necessary to dispose a chip capacitor or a filter element on the surface of the wiring board, and a wiring board that is further downsized than the wiring board 101 of the conventional example can be obtained. As a result, application to an electronic device such as a mobile phone or a digital camera becomes easy.

It is sectional drawing which shows the structure of the wiring board which concerns on Embodiment 1 of this invention. It is a schematic diagram which shows the state after a 1st electroconductive part formation board | substrate process. It is a schematic diagram which shows the state after a 1st insulating film lamination process, a dielectric film processing process, a dielectric film lamination process, a 2nd insulating film lamination process, and a conductor film lamination process. It is a schematic diagram which shows the state after a thermocompression bonding process. It is a schematic diagram which shows the state after a 2nd electroconductive part formation process. It is sectional drawing which shows the structure of the wiring board which concerns on Embodiment 2 of this invention. It is sectional drawing which shows the structure of the wiring board which concerns on Embodiment 3 of this invention. FIG. 8 is a cross-sectional view taken along the line VIII-VIII in FIG. 7. It is arrow sectional drawing along the IX-IX line of FIG. It is a schematic diagram which shows the state before a through-hole formation process. It is sectional drawing which shows the structure of the conventional wiring board. It is a schematic diagram which shows the state which accumulated the dielectric sheet and metal foil on the 1st electroconductive part formation board | substrate. It is a schematic diagram which shows the state after carrying out the thermocompression bonding of the thing of the state of FIG. It is a schematic diagram which shows the state after forming the metal foil of the state of FIG. 13 as a 2nd electrode.

Explanation of symbols

  1,21,31 Wiring substrate, 2,22 Dielectric part, 3,23 Dielectric film, 4,24 Adhesive insulating part, 4a First adhesive insulating part, 4b Second adhesive insulating part, 10 First adhesive insulating film, 11 Second Insulating Film, 12 Conductor Film, 32 First Conductive Line (First Conductive Part), 33 Second Conductive Line (Second Conductive Part), 34 Through-hole, 35 Electrical Connection Part, 102 First Substrate , 103 First electrode (first conductive part), 104 First conductive part forming substrate, 105 Second substrate, 106 Second electrode (second conductive part), 107 Second conductive part forming substrate.

Claims (6)

A first conductive part forming substrate having a first substrate and a spiral first conductive part formed on a plane of the first substrate;
A second conductive part forming substrate having a second substrate and a spiral second conductive part formed on the second substrate, the second conductive part being disposed to face the first conductive part;
A dielectric part interposed between the first conductive part forming substrate and the second conductive part forming substrate,
A wiring board on which at least the dielectric part is formed by thermocompression bonding,
The dielectric part has an adhesive insulating part that melts during the thermocompression bonding, and a dielectric film that maintains a thickness during the thermocompression bonding,
The adhesive insulating part is provided on both the first conductive part forming substrate side and the second conductive part forming substrate side of the dielectric film,
The dielectric film includes a plurality of interelectrode portions interposed between the first conductive portion and the second conductive portion, and a flexible crossover provided between each of the interelectrode portions. And
The first conductive portion and the second conductive portion are provided in through holes formed in the first conductive portion, the second conductive portion, and the dielectric portion, and the first conductive portion and the second conductive portion are electrically connected so that the winding directions are the same. An internal inductor is constituted by an electrical connection portion to be connected. The through hole is formed by a laser,
The wiring board according to claim 1, wherein the first conductive portion is subjected to a process of reducing the reflectance of the laser on a surface on the dielectric portion side.   The wiring board according to claim 1, wherein the surface of the dielectric film is subjected to a treatment for improving wettability with the melted adhesive insulating portion.   4. The dielectric film according to claim 1, wherein the dielectric film includes at least a dielectric base material and a powder having a higher magnetic permeability than the base material mixed in the base material. A wiring board according to the above. It is a manufacturing method of the wiring board according to claim 2,
A first conductive portion forming substrate step of forming the first conductive portion forming substrate by providing the first conductive portion on the first substrate;
A first conductive part treatment step for treating the surface of the first conductive part to reduce the reflectance of the laser;
A first insulating film laminating step of overlapping an adhesive insulating film on the first conductive portion side of the first conductive portion forming substrate;
A dielectric film treatment process for treating the dielectric film to improve the wettability;
A dielectric film laminating step of overlapping the dielectric film on the adhesive insulating film;
A second insulating film laminating step of superposing an adhesive insulating film on the dielectric film after the dielectric film laminating step;
A conductor film laminating step of providing a planar conductor film on the adhesive insulating film stacked in the second insulating film laminating step;
A thermocompression bonding step of melting the adhesive insulating film by the thermocompression bonding and pressing the first conductive portion and the conductor film in a direction approaching each other;
A second conductive part forming step of forming the conductive film as the plurality of second conductive parts on the dielectric film;
A through hole forming step of forming the through hole by irradiating the surface of the first conductive portion with the laser before the second conductive portion forming substrate step;
An electrical connection step of electrically connecting the first conductive part and the second conductive part by forming the electrical connection part between the first conductive part and the second conductive part through the through hole;
A second conductive part forming substrate step of covering the second conductive part with the second substrate and forming the second conductive part forming substrate;
In the thermocompression bonding step, the bonding insulating film is formed between the first conductive portion and the dielectric film, and between the conductive film and the dielectric film facing the first conductive portion, respectively. A method of manufacturing a wiring board, wherein a film is extruded while being bent to form the adhesive insulating portion, and the dielectric portion is formed by the dielectric film and the adhesive dielectric portion. A first conductive portion forming substrate having a first substrate and a spiral first conductive portion formed on the plane of the first substrate at an interval;
A second conductive part forming substrate having a second substrate and a spiral second conductive part formed on the second substrate, the second conductive part being disposed to face the first conductive part;
An adhesive insulating portion that is interposed between the first conductive portion forming substrate and the second conductive portion forming substrate, is formed by at least thermocompression bonding, and melts during the thermocompression bonding, the first conductive portion, and the second conductive portion. And a dielectric part having a dielectric film that has a surface that is treated to improve wettability with the melted adhesive insulating part and that maintains a thickness during the thermocompression bonding. And the first conductive portion and the second conductive portion are provided in through holes formed in the first conductive portion, the second conductive portion, and the dielectric portion, and the first conductive portion and the second conductive portion are electrically connected so as to have the same winding direction. A wiring board manufacturing method for manufacturing a wiring board in which an internal inductor is configured from an electrical connection portion to be connected electrically,
A first conductive portion forming substrate step of forming the first conductive portion forming substrate by providing the first conductive portion on the first substrate;
A first conductive part treatment step for treating the surface of the first conductive part to reduce the reflectance of the laser;
A first insulating film laminating step of overlapping an adhesive insulating film on the first conductive portion side of the first conductive portion forming substrate;
A dielectric film processing step of performing a process of improving the wettability on one surface of the dielectric film and performing a process of improving adhesion to the second conductive portion on the other surface;
A dielectric film laminating step of superposing the dielectric film on the adhesive insulating film with the one surface facing the adhesive insulating film;
A conductor film laminating step of providing a conductor film on the other surface of the dielectric film;
A thermocompression bonding step of melting the adhesive insulating film by the thermocompression bonding and pressing the first conductive portion and the conductor film in a direction approaching each other;
A second conductive part forming step of forming the conductive film as the second conductive part on the dielectric film;
A through hole forming step of forming the through hole by irradiating the surface of the first conductive portion with the laser before the second conductive portion forming substrate step;
An electrical connection step of electrically connecting the first conductive part and the second conductive part by forming the electrical connection part between the first conductive part and the second conductive part through the through hole;
A second conductive part forming substrate step of covering the second conductive part with the second substrate and forming the second conductive part forming substrate;
In the thermocompression bonding step, the adhesive insulating film is extruded from between the first conductive portion and the dielectric film to form the adhesive insulating portion, and the dielectric portion is formed by the dielectric film and the adhesive insulating portion. A method of manufacturing a wiring board, wherein the wiring board is formed.

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