JP2006080550A5 - - Google Patents
Download PDFInfo
- Publication number
- JP2006080550A5 JP2006080550A5 JP2005303795A JP2005303795A JP2006080550A5 JP 2006080550 A5 JP2006080550 A5 JP 2006080550A5 JP 2005303795 A JP2005303795 A JP 2005303795A JP 2005303795 A JP2005303795 A JP 2005303795A JP 2006080550 A5 JP2006080550 A5 JP 2006080550A5
- Authority
- JP
- Japan
- Prior art keywords
- processing chamber
- vacuum processing
- shower plate
- region
- gas supply
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000000758 substrate Substances 0.000 claims 28
- 230000005855 radiation Effects 0.000 claims 4
- 238000000034 method Methods 0.000 claims 3
- 238000001020 plasma etching Methods 0.000 claims 2
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2005303795A JP2006080550A (ja) | 2005-10-19 | 2005-10-19 | プラズマ処理装置 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2005303795A JP2006080550A (ja) | 2005-10-19 | 2005-10-19 | プラズマ処理装置 |
Related Parent Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2001361897A Division JP3757159B2 (ja) | 2001-11-28 | 2001-11-28 | プラズマ処理装置 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JP2006080550A JP2006080550A (ja) | 2006-03-23 |
| JP2006080550A5 true JP2006080550A5 (https=) | 2006-06-15 |
Family
ID=36159697
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2005303795A Pending JP2006080550A (ja) | 2005-10-19 | 2005-10-19 | プラズマ処理装置 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP2006080550A (https=) |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP7450475B2 (ja) * | 2020-06-30 | 2024-03-15 | 東京エレクトロン株式会社 | プラズマ処理装置 |
-
2005
- 2005-10-19 JP JP2005303795A patent/JP2006080550A/ja active Pending
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| TWI542259B (zh) | Plasma processing device | |
| JP6689020B2 (ja) | プラズマ処理装置 | |
| TWI646614B (zh) | Heater power supply mechanism | |
| US20090165722A1 (en) | Apparatus for treating substrate | |
| CN108091535B (zh) | 载置台和等离子体处理装置 | |
| JP2022046598A (ja) | 局所的なローレンツ力を用いるモジュール式マイクロ波源 | |
| WO2006123524A1 (ja) | プラズマ発生装置及びプラズマ処理装置 | |
| JP2009231439A (ja) | プラズマ処理装置 | |
| TW201003771A (en) | Plasma processing apparatus | |
| TW201429323A (zh) | 電漿腔室及基板處理設備 | |
| JP2013084653A5 (https=) | ||
| EP1988565A3 (en) | Methods to eliminate m-shape etch rate profile in inductively coupled plasma reactor | |
| CN100390957C (zh) | 基板保持部件及基板处理装置 | |
| JP2011009249A5 (https=) | ||
| KR101562192B1 (ko) | 플라즈마 반응기 | |
| JP2019061849A5 (https=) | ||
| WO2020116252A1 (ja) | プラズマ処理装置、及び、プラズマ処理方法 | |
| WO2008140012A1 (ja) | ドライエッチング装置及びドライエッチング方法 | |
| JP2000357683A5 (https=) | ||
| US20130052830A1 (en) | Plasma reactor having dual inductively coupled plasma source | |
| KR20140004129A (ko) | 플라즈마 프로세싱 챔버들 내로 가스를 전달하기 위한 방법들 및 장치 | |
| JP2006080550A5 (https=) | ||
| JP2000200698A5 (https=) | ||
| JPH11204297A5 (https=) | ||
| JP2012109377A (ja) | 電極構造及びプラズマ処理装置 |