JP2006080228A - Thermoelectric converter and its manufacturing process - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To realize a thermoelectric converter whose assemblability is enhanced without lowering heat-exchange efficiency by arranging an electrode portion for connecting a thermoelectric element and an electrode member on the side intersecting the arranging direction of a thermoelectric element group perpendicularly, and to provide its manufacturing process. <P>SOLUTION: The thermoelectric converter comprises a thermoelectric element substrate 10 composed by arranging a thermoelectric element group consisting of a plurality of P-type thermoelectric elements 12 and N-type thermoelectric elements 13 arranged alternately on an insulating substrate 11, and an electrode member 20 having an electrode portion 21 formed planarly in order to electrically connecting the P-type thermoelectric elements 12 and N-type thermoelectric elements 13 arranged adjacently to each other, and a heat absorbing/dissipating portion 22 formed to transmit heat to the electrode portion 21 wherein the electrode member 20 joints the electrode portion 21, respectively, to the opposite ends of the P-type thermoelectric elements 12 and N-type thermoelectric elements 13 arranged adjacently to each other by soldering such that they are connected in series. Consequently, assembling performance can be enhanced without lowering heat-exchange efficiency. <P>COPYRIGHT: (C)2006,JPO&NCIPI

Description

  The present invention relates to a thermoelectric conversion device that can absorb heat and dissipate heat by flowing a direct current through a series circuit composed of an N-type thermoelectric element and a P-type thermoelectric element, and a method for manufacturing the thermoelectric conversion device. The present invention relates to a structure of a thermoelectric element to be connected, a configuration of an electrode member connected to the thermoelectric element, and a method of manufacturing the electrode member.

  Conventionally, as this type of thermoelectric conversion device, for example, as shown in Patent Document 1, a plurality of sets of N-type thermoelectric elements and P-type thermoelectric elements are connected in series in this order to form a thermoelectric element group. The heat absorbing electrode member and the heat radiating electrode member are sequentially connected in series, and one end of the thermoelectric element group is protruded to connect the endothermic heat exchange member to each of the endothermic electrode members, and the other end of the thermoelectric element group is protruded. The radiating heat exchange member is coupled to each of the radiating electrode members to constitute an endothermic heat exchange portion and a radiant heat exchange portion, respectively.

Each heat exchange member constituting each of the heat exchange portions includes a first bent piece that is bent along the direction in which the thermoelectric element groups are arranged and a second fold that is bent substantially at right angles to the direction in which the thermoelectric elements are arranged. A bent piece is provided, and the adjacent second bent pieces are electrically insulated and fixed to each other so as to have a wall that partitions the endothermic heat exchange portion and the radiant heat exchange portion. As a result, the heat from the heat absorbing electrode member and the heat radiating electrode member can be efficiently taken out to improve the heat exchange efficiency, and the partition wall is formed so that the heat absorbing portion and the heat radiating portion can be easily separated. (For example, refer to Patent Document 1).
Japanese Patent No. 3166228

  However, according to the above-mentioned Patent Document 1, this type of thermoelectric element is an extremely small component, and the thermoelectric element, the electrode member, and the thermoelectric element are alternately stacked in this order, and the thermoelectric element and the electrode member are joined in the stacked state. In particular, since the assembly work for laminating the components is difficult to perform, there is a problem that the assemblability is inferior. Moreover, if these component parts are to be made smaller, the assembling work becomes more difficult and there is a limit to downsizing.

  In view of the above, the object of the present invention is to provide heat exchange by arranging an electrode portion where the thermoelectric element and the electrode member are connected on the side orthogonal to the direction in which the thermoelectric element groups are arranged. An object of the present invention is to provide a thermoelectric conversion device and a method for manufacturing the thermoelectric conversion device that can improve the assembly without reducing efficiency.

In order to achieve the above object, the technical means described in claims 1 to 8 are employed. That is, in the invention described in claim 1, a thermoelectric element group in which a plurality of P-type thermoelectric elements (12) and N-type thermoelectric elements (13) are alternately arranged on an insulating substrate (11) made of an insulating material is provided. The thermoelectric element substrate (10) arranged in a row and the P-type thermoelectric element (12) and the N-type thermoelectric element (13) arranged adjacent to the thermoelectric element substrate (10) are electrically connected. An electrode member (20) having a flat electrode portion (21) and an endothermic / heat dissipating portion (22) formed to be capable of transferring heat to the electrode portion (21),
The electrode member (20) is joined by soldering so that the electrode portions (21) are connected in series to both ends of the P-type thermoelectric element (12) and the N-type thermoelectric element (13) arranged adjacent to each other. It is characterized by that.

  According to the invention described in claim 1, the thermoelectric elements (12, 13) that are minimal parts and the electrode members (20) connected to the adjacent thermoelectric elements (12, 13) are arranged so as to overlap each other. As a result, the assembly work can be made easier than the conventional method of laminating the thermoelectric elements (12, 13) and the electrode member (20) in series.

  Moreover, the heat which generate | occur | produces in a connection part is efficiently taken out by joining the thermoelectric element (12, 13) and electrode member (20) which adjoined by soldering in the electrode part (21) formed planarly. It becomes possible. Thereby, since the thermal resistance in a connection part can be made small, the heat exchange efficiency of an apparatus is not reduced.

  In the invention according to claim 2, the electrode member (20) is directed vertically to the back side of the electrode portion (21) joined to both ends of the P-type thermoelectric element (12) and the N-type thermoelectric element (13). The heat absorption / heat radiation part (22) is formed so as to have a space.

  According to the second aspect of the present invention, the mounter device, which is a device for assembling electronic components such as a semiconductor and a control board, is used because the back side of the electrode portion (21) has a space in the vertical direction. Is possible. Thereby, the assembly property can be improved by easily assembling the thermoelectric elements (12, 13) and the electrode members (20) which are extremely small parts and large in quantity.

  In the invention according to claim 3, the endothermic / heat dissipating part (22) has any one of a louver shape, a slit shape, an offset shape, a flat shape, and a pin shape on the plane extending outward from the electrode portion (21). The shape is formed by molding.

  According to invention of Claim 3, the shape of these heat absorption / radiation part (22) does not reduce the space formed toward the perpendicular direction of the back side of the electrode part (21) mentioned above. Therefore, it will not interfere with the use of the mounter device. Further, by forming the heat absorption / heat radiation part (22) in these shapes, the heat exchange efficiency of the heat absorption / heat radiation part (22) is improved, and the heat exchange efficiency of the apparatus is not lowered.

In the invention according to claim 4, the planar electrode portion that electrically connects the P-type thermoelectric element (12) and the N-type thermoelectric element (13) arranged adjacent to each other in a flat conductive material. (21), and a molding process for integrally forming an electrode member (20) having an endothermic / heat dissipating part (22) that absorbs or dissipates heat transferred by the electrode part (21);
A P-type thermoelectric element (12) and an N-type thermoelectric element (13) are picked up, and the P-type thermoelectric element ( 12) an assembly process of a thermoelectric element substrate (10) in which a plurality of N-type thermoelectric elements (13) are alternately arranged and a thermoelectric element group is arranged;
A P-type thermoelectric element (12) and an N-type thermoelectric element arranged adjacent to the thermoelectric element substrate (10) by pinching the back side of the electrode part (21) of the electrode member (20) formed in the molding process. And (13) having respective electrode portions (21) installed at both ends, and thereafter joining both ends of the N-type thermoelectric element (13) and the electrode portion (21) by soldering. It is a feature.

  According to the invention described in claim 4, the assembly process can be improved by facilitating the assembly of the thermoelectric elements (12, 13) and electrode members (20) which are extremely small parts and large quantities by the manufacturing process. And it can manufacture with sufficient precision.

  The invention according to claim 5 is characterized in that the assembly step and the joining step of the thermoelectric element substrate (10) are manufactured using a mounter device. According to the invention described in claim 5, specifically, the mountability can be improved by using a mounter device for assembling the electronic component.

  The invention according to claim 6 is characterized in that the forming step forms the electrode member (20) from a coil-shaped conductive material by shearing, bending, and outline drawing. According to invention of Claim 6, since manufacture of an electrode member (20) can be continuously formed, for example by press work etc., it can reduce manufacturing cost.

  In the invention according to claim 7, in the molding process, the heat absorption / heat radiation portion (22) is formed by etching in the flat conductive material, and then the electrode member (20) is formed by bending and removing the outer shape. It is characterized by forming. According to the seventh aspect of the present invention, it is possible to reduce the manufacturing cost by forming by an etching process in addition to the press process described above.

  In the invention described in claim 8, the forming step is characterized in that a cross-sectional portion is formed by extruding a flat conductive material, and then the electrode member (20) is formed by extracting the outer shape. . According to the invention described in claim 8, it is possible to reduce the manufacturing cost by forming by extrusion processing in addition to the press processing described above.

  In addition, the code | symbol in the bracket | parenthesis of each said means shows a corresponding relationship with the specific means of embodiment mentioned later.

(First embodiment)
Hereinafter, a thermoelectric conversion device according to a first embodiment of the present invention will be described with reference to FIGS. 1 to 3. Fig.1 (a) is a schematic diagram which shows the whole structure of the thermoelectric conversion apparatus in this embodiment, (b) is AA sectional drawing shown to (a), (c) is BB shown to (a). It is sectional drawing. FIG. 2 is an exploded schematic view showing the configuration of the main part of the thermoelectric converter. Moreover, FIG. 3 is process explanatory drawing which shows the flow of the manufacturing process in the manufacturing method of a thermoelectric conversion apparatus.

  In the thermoelectric conversion device of this embodiment, as shown in FIGS. 1A to 3C and FIG. 2, a plurality of P-type thermoelectric elements 12 and N-type thermoelectric elements 13 are alternately arranged on an insulating substrate 11. A thermoelectric element substrate 10 configured by arranging the thermoelectric element groups arranged in parallel, and an electrode member 20 that electrically connects the P-type thermoelectric element 12 and the N-type thermoelectric element 13 arranged adjacent to each other. ing.

  The thermoelectric element substrate 10 is a thermoelectric element in which a plurality of P-type thermoelectric elements 12 and N-type thermoelectric elements 13 are alternately arranged on an insulating substrate 11 made of a flat insulating material (for example, PPS resin or LCP resin). Groups are arranged in a row to form an integrated structure. The P-type thermoelectric element 12 is composed of a P-type semiconductor made of a Bi—Te based compound, and the N-type thermoelectric element 13 is an extremely small part composed of an N-type semiconductor composed of a Bi—Te based compound.

  The thermoelectric element substrate 10 is formed by integrally molding substrate holes so that the P-type thermoelectric elements 12 and the N-type thermoelectric elements 13 are arranged on the insulating substrate 11 in a substantially grid pattern. At this time, the P-type thermoelectric element 12 and the N-type thermoelectric element 13 are formed such that the upper end surface and the lower end surface protrude outward from the insulating substrate 11.

  The electrode member 20 is an electrode for electrically connecting the P-type thermoelectric element 12 and the N-type thermoelectric element 13 arranged adjacent to the thermoelectric element substrate 10, and is made of a conductive material such as a copper material and has a planar shape. The electrode part 21 formed on the upper side of the thermoelectric elements 12 and 13 is connected so that a current flows from the P type to the N type, and on the lower side of the thermoelectric elements 12 and 13, the current flows from the N type to the P type. Connected.

  Thereby, the P-type thermoelectric element 12 and the N-type thermoelectric element 13 are connected in series. The thermoelectric elements 12 and 13 and the electrode member 20 are joined by joining the end faces of the thermoelectric elements 12 and 13 and the electrode portion 20 by soldering.

  Further, as shown in FIG. 1A and FIG. 1B, the electrode member 20 of the present embodiment is formed from the electrode portion 21 on a plane extending outward from the electrode portion 21 formed in a planar shape. An endothermic / heat dissipating part 22 for absorbing or dissipating heat to be transferred is integrally formed. Furthermore, as this shape, while forming so that it may become a pin shape, it forms so that it may have a space toward the orthogonal | vertical direction at the back side of the electrode part 20. As shown in FIG.

  In other words, by forming a space on the back side of the electrode unit 20, when the electrode member 20 is assembled to the end surfaces of the thermoelectric elements 12 and 13, the back side of the electrode unit 20 can be easily pinched with a mounter device (described later). Is formed. In addition, although it is not illustrated in the heat absorption / radiation part 22 formed in the pin shape, it is comprised so that the heat transmitted from the electrode part 21 may be heat-exchanged.

  By the way, in the electrode part 21 connecting the thermoelectric elements 12 and 13, the upper electrode member 20 constituting the PN junction part becomes a high temperature state due to the Peltier effect, so that this high temperature heat is absorbed / heat radiation part. 22 to exchange heat with a cooling fluid (for example, air) to obtain hot air. On the other hand, when the lower electrode member 20 constituting the NP junction is in a low temperature state due to the Peltier effect, this low temperature heat is transmitted to the heat absorption / radiation unit 22 to be cooled fluid (for example, air) and heat. It is exchanged and cold air is obtained.

  That is, the temperature of the electrode member 20 at one end increases and the temperature of the electrode member 20 at the other end decreases according to the amount of current flowing between the thermoelectric elements 12 and 13, and when the current direction is reversed, these heats are generated. The phenomenon is reversed. Incidentally, this type of thermoelectric conversion device is used for cooling heat-generating components such as semiconductors and electrical components and for heating such as a heating device.

  Next, the manufacturing method of the thermoelectric conversion apparatus by the above structure is demonstrated. As shown in FIG. 3, the electrode member 20 is manufactured by first uncoiling the coiled conductive material and integrally forming the electrode portion 21 and the heat absorption / heat dissipation portion 22 by shearing in the pressing step shown in A. And in the bending process shown to B, it is bent so that it may become a desired cross-sectional shape. Then, in the cutting step shown in C, cutting is performed to a predetermined dimension by removing the outer shape. That is, it is formed by a molding process ranging from A to C.

  On the other hand, the thermoelectric conversion device is manufactured by the assembly process and the joining process of the thermoelectric element substrate 10 in which the manufacturing process of assembling the thermoelectric element substrate 10 and the electrode member 20 to the thermoelectric element substrate 10 extends from D to F. The process from D to F is performed using a mounter device that is a device for assembling electronic components such as semiconductors and control boards.

  This is an improvement in assembly of the thermoelectric elements 12 and 13 and the electrode member 20 that are extremely small parts and a large quantity, and is formed in a shape that allows the thermoelectric elements 12 and 13 and the electrode member 20 to be easily picked up. This makes it easy to assemble them. Specifically, in the assembly step 1 shown in D, a jig provided in the apparatus is picked up by suction at one end of the thermoelectric elements 12 and 13 and formed in a substantially grid pattern of the insulating substrate 11 previously installed in the apparatus. A plurality of P-type thermoelectric elements 12 and N-type thermoelectric elements 13 are alternately arranged in the formed substrate hole, and thermoelectric element groups are arranged in a row to form an integrated structure. This is an assembling process of the thermoelectric element substrate 10 in the claims.

  Then, in the assembly process 2 shown in E, the jig provided in the apparatus is picked up by suction at one end of the electrode member 20 formed in the molding process, and the electrode part 21 is adjacent to the adjacent P-type thermoelectric elements 12 and N. It is installed on the end face of the mold thermoelectric element 13. And in the joining process shown to F, the joining surface of the end surface of the thermoelectric elements 12 and 13 and the electrode part 20 is joined by soldering.

  Of the above steps, the E and F steps are performed on each side, and the other side is subjected to the E and F steps after the thermoelectric element substrate 10 is inverted. Soldering can be facilitated by carrying out a joining process after applying paste solder or the like thinly and uniformly to the joining surfaces of the end faces of the thermoelectric elements 12 and 13 in advance by screen printing.

  According to the thermoelectric conversion device according to the first embodiment described above, the thermoelectric elements 12 and 13 which are extremely small parts and the electrode members 20 connected to the adjacent thermoelectric elements 12 and 13 are joined so as to overlap each other. The assembly work can be made easier than the method of laminating the thermoelectric elements 12, 13 and the electrode member 20 in series.

  Moreover, it becomes possible to take out efficiently the heat which generate | occur | produces in a connection part by joining the thermoelectric elements 12 and 13 and the electrode member 20 which adjoin by soldering in the electrode part 21 formed in planar shape. Thereby, since the thermal resistance in a connection part can be made small, the heat exchange efficiency of an apparatus is not reduced.

  Further, a mounter device that is a device for assembling electronic components such as a semiconductor and a control board by forming a pin-like heat absorption / heat dissipation portion 22 so as to have a space in the vertical direction on the back side of the electrode portion 21 Can be used. As a result, it is possible to easily assemble the thermoelectric elements 12 and 13 and the electrode member 20 that are extremely small parts and large in quantity, thereby improving the assemblability.

  In addition, the forming process is manufactured because the electrode member 20 can be continuously formed by, for example, pressing, by forming the electrode member 20 by shearing, bending, and extracting the outer shape from the coiled conductive material. Cost can be reduced.

(Second Embodiment)
In the first embodiment described above, the shape of the endothermic / heat radiating portion 22 is formed in a pin shape. However, the shape is not limited to this, and as shown in FIGS. The shape may be formed in a flat shape. In addition, as shown in FIGS. 5A to 5C, a plane extending outward from the electrode portion 21 may be cut up to form the heat absorption / heat radiation portion 22 in a louver shape.

  Further, as shown in FIGS. 6A to 6C, a slit hole 23 may be formed in a plane extending outward from the electrode portion 21 so that the heat absorbing / dissipating portion 22 has a slit shape. good. Further, as shown in FIGS. 7A to 7C, the shape of the heat absorption / heat radiation portion 22 may be formed in an offset shape by alternately projecting from a plane extending outward from the electrode portion 21. .

  According to these shapes, the shape of any of the heat absorption / radiation portions 22 does not reduce the space formed in the vertical direction on the back side of the electrode portion 21, so that the use of the mounter device is hindered. Absent. Further, by forming the endothermic / heat dissipating part 22 in these shapes, the heat exchanging efficiency of the endothermic / heat dissipating part 22 is improved and the heat exchanging efficiency of the apparatus is not lowered.

(Third embodiment)
In the above embodiment, in the molding process of the electrode member 20, the electrode portion 21 and the heat absorption / heat radiation portion 22 are integrally formed by press molding (see FIG. 3) shown in A. However, the present invention is not limited to this, and FIG. ), The heat absorbing / dissipating part 22 may be formed in a flat conductive material by etching, and then the electrode member 20 may be formed by bending and removing the outer shape.

  Further, as shown in FIG. 8B, a cross-sectional portion may be formed by extruding a flat conductive material, and then the electrode member 20 may be formed by removing the outer shape. According to this, it is possible to make a manufacturing cost cheaper than the press work mentioned above.

(Other embodiments)
In the above embodiment, the electrode member 20 is formed by separate processes for press molding and bending, but the cross-sectional shape of the electrode member 20 may be formed by roller molding.

  Further, in the above embodiment, the heat absorption / heat radiation portion 22 is formed on a plane extending outward from the electrode portion 21, but as shown in FIGS. 9A and 9B, the electrode portion 21 is formed. May be cut and raised to form the endothermic / heat dissipating part 22. However, at this time, as shown in FIG. 9A, a necessary amount of space in the vertical direction is provided on the back surface side of the electrode portion 21, and a necessary amount of current passing cross-sectional area of the electrode portion 21 is ensured. It is desirable that

(A) is a schematic diagram which shows the whole structure of the thermoelectric conversion apparatus in 1st Embodiment of this invention, (b) is AA sectional drawing shown to (a), (c) is BB shown to (a). It is sectional drawing. It is an exploded schematic diagram which shows the structure of the principal part of the thermoelectric conversion apparatus in 1st Embodiment of this invention. It is explanatory drawing which shows the flow of the manufacturing process of the thermoelectric conversion apparatus in 1st Embodiment of this invention. (A) is a schematic diagram which shows the whole structure of the thermoelectric conversion apparatus in 2nd Embodiment of this invention, (b) is AA sectional drawing shown to (a). (A) is a schematic diagram which shows the whole structure of the thermoelectric conversion apparatus in the modification of 2nd Embodiment of this invention, (b) is a side view, (c) is AA sectional drawing shown to (a). (A) is a schematic diagram which shows the whole structure of the thermoelectric conversion apparatus in the modification of 2nd Embodiment of this invention, (b) is a side view, (c) is AA sectional drawing shown to (a). (A) is a schematic diagram which shows the whole structure of the thermoelectric conversion apparatus in the modification of 2nd Embodiment of this invention, (b) is a side view, (c) is AA sectional drawing shown to (a). (A) And (b) is an arrow line view which shows one process of the electrode member 20 in 3rd Embodiment of this invention. (A) is a schematic diagram which shows the whole structure of the thermoelectric conversion apparatus in other embodiment, (b) is AA sectional drawing shown to (a).

Explanation of symbols

DESCRIPTION OF SYMBOLS 10 ... Thermoelectric element substrate 11 ... Insulating substrate 12 ... P-type thermoelectric element 13 ... N-type thermoelectric element 20 ... Electrode member 21 ... Electrode part 22 ... Heat absorption / radiation part

Claims (8)

A thermoelectric element substrate (11) configured by arranging a plurality of thermoelectric element groups in which a plurality of P-type thermoelectric elements (12) and N-type thermoelectric elements (13) are alternately arranged on an insulating substrate (11) made of an insulating material. 10) and
An electrode portion (21) formed in a planar shape for electrically connecting the P-type thermoelectric element (12) and the N-type thermoelectric element (13) arranged adjacent to the thermoelectric element substrate (10). ), And an electrode member (20) having an endothermic / heat radiating portion (22) formed so as to be capable of transferring heat to the electrode portion (21),
The electrode member (20) connects the electrode portions (21) in series to both ends of the P-type thermoelectric element (12) and the N-type thermoelectric element (13) arranged adjacent to each other. A thermoelectric conversion device characterized by being joined by soldering.   The electrode member (20) has a space in the vertical direction on the back side of the electrode part (21) joined to both ends of the P-type thermoelectric element (12) and the N-type thermoelectric element (13). The thermoelectric conversion device according to claim 1, wherein the endothermic / heat dissipating part (22) is formed on the thermoelectric converter.   The endothermic / heat dissipating part (22) may be formed into a louver shape, slit shape, offset shape, flat shape, or pin shape on a plane extending outward from the electrode portion (21). The thermoelectric conversion device according to claim 2, wherein the thermoelectric conversion device is formed. A planar electrode part (21) for electrically connecting a P-type thermoelectric element (12) and an N-type thermoelectric element (13) arranged adjacent to each other in a flat conductive material, and its electrode part ( 21) a molding process for integrally forming an electrode member (20) having a heat absorbing / dissipating part (22) that absorbs or dissipates heat transferred by heat;
The P-type thermoelectric element (12) and the N-type thermoelectric element (13) are picked up, and the P-type is inserted into a substrate hole formed in a substantially grid pattern in an insulating substrate (11) made of an insulating material that has been installed in advance. An assembly step of a thermoelectric element substrate (10) in which a plurality of thermoelectric elements (12) and N-type thermoelectric elements (13) are alternately arranged to arrange a thermoelectric element group;
The P-type thermoelectric element (12) arranged adjacent to the thermoelectric element substrate (10) by pinching the back side of the electrode part (21) of the electrode member (20) formed in the molding process. And the N-type thermoelectric element (13), the electrode portions (21) are installed at both ends, and then both ends of the N-type thermoelectric element (13) and the electrode portion (21) are soldered. The manufacturing method of the thermoelectric conversion apparatus characterized by including the joining process to join.   The method of manufacturing a thermoelectric conversion device according to claim 4, wherein the assembly step and the joining step of the thermoelectric element substrate (10) are manufactured using a mounter device.   5. The method of manufacturing a thermoelectric conversion device according to claim 4, wherein in the forming step, the electrode member (20) is formed from a coil-shaped conductive material by shearing, bending, or extracting an outer shape.   The molding step is characterized in that the heat absorbing / dissipating part (22) is formed by etching on a flat conductive material, and then the electrode member (20) is formed by bending and removing the outer shape. The manufacturing method of the thermoelectric conversion apparatus of Claim 4.   5. The thermoelectric device according to claim 4, wherein in the forming step, a cross-sectional portion is formed by extruding a flat conductive material, and then the electrode member (20) is formed by removing an outer shape thereof. 6. A method for manufacturing a conversion device.

Images