JP2006080226A5 - - Google Patents

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Publication number
JP2006080226A5
JP2006080226A5 JP2004261405A JP2004261405A JP2006080226A5 JP 2006080226 A5 JP2006080226 A5 JP 2006080226A5 JP 2004261405 A JP2004261405 A JP 2004261405A JP 2004261405 A JP2004261405 A JP 2004261405A JP 2006080226 A5 JP2006080226 A5 JP 2006080226A5
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JP
Japan
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP2004261405A
Other languages
Japanese (ja)
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JP4410065B2 (ja
JP2006080226A (ja
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Publication date
Application filed filed Critical
Priority to JP2004261405A priority Critical patent/JP4410065B2/ja
Priority claimed from JP2004261405A external-priority patent/JP4410065B2/ja
Publication of JP2006080226A publication Critical patent/JP2006080226A/ja
Publication of JP2006080226A5 publication Critical patent/JP2006080226A5/ja
Application granted granted Critical
Publication of JP4410065B2 publication Critical patent/JP4410065B2/ja
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

JP2004261405A 2004-09-08 2004-09-08 電子部品放熱用のコールドプレート Expired - Lifetime JP4410065B2 (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2004261405A JP4410065B2 (ja) 2004-09-08 2004-09-08 電子部品放熱用のコールドプレート

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2004261405A JP4410065B2 (ja) 2004-09-08 2004-09-08 電子部品放熱用のコールドプレート

Publications (3)

Publication Number Publication Date
JP2006080226A JP2006080226A (ja) 2006-03-23
JP2006080226A5 true JP2006080226A5 (cg-RX-API-DMAC10.html) 2007-01-25
JP4410065B2 JP4410065B2 (ja) 2010-02-03

Family

ID=36159449

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2004261405A Expired - Lifetime JP4410065B2 (ja) 2004-09-08 2004-09-08 電子部品放熱用のコールドプレート

Country Status (1)

Country Link
JP (1) JP4410065B2 (cg-RX-API-DMAC10.html)

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4992808B2 (ja) 2008-04-16 2012-08-08 トヨタ自動車株式会社 熱交換器の製造方法
FI127831B (en) * 2015-01-15 2019-03-29 Lappeenrannan Teknillinen Yliopisto A method for fabricating a semiconductor module
WO2018055923A1 (ja) 2016-09-23 2018-03-29 住友精密工業株式会社 冷却装置
DE102021209504A1 (de) 2021-08-30 2023-03-02 Robert Bosch Gesellschaft mit beschränkter Haftung Kühlrippenanordnung eines fluiddurchströmbaren Kühlers zum Kühlen einer Leistungselektronik

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